An adapter board, a CPU adapter method and a computer device

Abstract

The present application provides an adapter board, a CPU adapter method, and a computer device. The adapter board is used to connect a desktop motherboard and a mobile CPU. The adapter board has a multi-layer structure, and the multi-layer structure includes a top plate layer and a bottom plate layer that are arranged away from each other. The adapter board is plugged and adapted to the desktop motherboard, and when the adapter board is plugged into the desktop motherboard, the top plate layer is arranged on a side of the bottom plate layer that faces away from the desktop motherboard, and the bottom plate layer is electrically connected to the desktop motherboard. A welding portion is provided on the side of the top plate layer that faces away from the bottom plate layer, and the welding portion is used to weld the mobile CPU. The adapter board in the present application can transfer the mobile CPU to the desktop motherboard, which is beneficial to improving the flexibility and applicability of the mobile CPU.

Description

Technical Field

[0001] The present application belongs to the field of switching technology, and in particular relates to a switching board, a CPU switching method and a computer device. Background Art

[0002] With the rapid development of information technology, computer hardware upgrades are accelerating. The performance of the central processing unit (CPU), the core component of computer systems, is directly related to improvements in overall computing power. In the current computer market, laptops and desktops each occupy a significant position, serving different user groups and application scenarios. However, there are significant differences in hardware configuration, particularly in CPU compatibility and interchangeability.

[0003] However, the CPU of a traditional notebook cannot be directly installed on the motherboard of a desktop computer, which results in low flexibility and applicability of the notebook CPU. Summary of the Invention

[0004] The purpose of this application is to provide an adapter board, a CPU adapter method and a computer device, aiming to solve the problem of low flexibility and applicability of notebook CPUs in traditional technologies.

[0005] A first aspect of an embodiment of the present application provides an adapter board for connecting a desktop motherboard and a mobile CPU, wherein the adapter board has a multi-layer structure, and the multi-layer structure includes a top plate layer and a bottom plate layer that are arranged away from each other;

[0006] The adapter board is plugged and adapted to the desktop motherboard, and when the adapter board is plugged into the desktop motherboard, the top plate layer is arranged on a side of the bottom plate layer facing away from the desktop motherboard, and the bottom plate layer is electrically connected to the desktop motherboard;

[0007] Wherein, a welding portion is provided on a side of the top plate layer facing away from the bottom plate layer, and the welding portion is used for welding the mobile CPU.

[0008] In some embodiments of the present application, the bottom board layer is used to form a contact array packaging structure with the desktop motherboard.

[0009] In some embodiments of the present application, a contact is provided on the side of the bottom plate layer facing away from the top plate layer, and an electroplating layer for electrically connecting to the desktop motherboard is provided on the contact, and the electroplating layer is a water-gold electroplating layer.

[0010] In some embodiments of the present application, the top plate layer is used to form a ball grid array packaging structure with the mobile CPU.

[0011] In some embodiments of the present application, the welding portion includes a welding pad, on which a soldering film layer for welding to the mobile CPU is provided, and the soldering film layer is an organic soldering film layer.

[0012] In some embodiments of the present application, the multi-layer structure includes a plurality of routing layers, and the plurality of routing layers are sequentially stacked between the top plate layer and the bottom plate layer;

[0013] A first signal routing area and a first power supply routing area are provided on the top plate layer. The first signal routing area is used for data interaction with the mobile CPU, and the first power supply routing area is used for powering the mobile CPU. The first signal routing area and the first power supply routing area are routed through the routing layer to electrically connect to the bottom plate layer.

[0014] In some embodiments of the present application, a second signal routing area and a second power routing area are provided on the bottom board layer, wherein the second signal routing area is used for data exchange with the desktop motherboard, and the second power routing area is used for obtaining a power supply signal from the desktop motherboard;

[0015] The first signal routing area is electrically connected to the second signal routing area through the routing layer, and the first power supply routing area is electrically connected to the second power supply routing area through the routing layer.

[0016] In some embodiments of the present application, multiple signal routings are arranged in the routing layer, and the signal routings are connected to the first signal routing area and the second signal routing area. The signal routings include control signal routings, display signal routings, parameter configuration signal routings, and communication signal routings.

[0017] A second aspect of the present application further provides a CPU switching method, the switching method comprising:

[0018] Obtaining a desktop motherboard and reading a BIOS file of the desktop motherboard;

[0019] Reading the bottom layer of the BIOS file and disabling the inventory unit identification function in the management engine in the bottom layer;

[0020] The adapter plate as described above is mounted on the desktop motherboard, and a mobile CPU is mounted on a side of the adapter plate facing away from the desktop motherboard.

[0021] A third aspect of the present application further provides a computer device, comprising a desktop motherboard, a mobile CPU, and an adapter board as described above, wherein the adapter board is connected to the desktop motherboard and the mobile CPU respectively.

[0022] The beneficial effects of the present application are as follows: in the adapter board, CPU adapter method and computer equipment of the present application, the adapter board is used to connect the desktop motherboard and the mobile CPU, the adapter board is a multi-layer structure, and the multi-layer structure includes a top plate layer and a bottom plate layer that are arranged far away from each other; the adapter board is plugged and adapted to the desktop motherboard, and when the adapter board is plugged into the desktop motherboard, the top plate layer is arranged on the side of the bottom plate layer facing away from the desktop motherboard, and the bottom plate layer is electrically connected to the desktop motherboard; wherein, a welding portion is provided on the side of the top plate layer facing away from the bottom plate layer, and the welding portion is used to weld the mobile CPU; the adapter board in the present application can transfer the mobile CPU to the desktop motherboard, which is beneficial to improving the flexibility and applicability of the mobile CPU. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic diagram of the application framework structure of the adapter board provided in one embodiment of the present application;

[0024] Figure 2 A schematic structural diagram of an adapter board provided in one embodiment of the present application;

[0025] Figure 3 Another structural schematic diagram of the adapter plate provided in one embodiment of the present application;

[0026] Figure 4 A schematic diagram of the steps of a switching method provided in one embodiment of the present application.

[0027] Specific element symbol description: 100-desktop motherboard, 200-adapter board, 210-top layer, 220-bottom layer, 300-mobile CPU. DETAILED DESCRIPTION

[0028] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0029] It should be noted that when an element is referred to as being “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0031] It's important to note that with the rapid development of information technology, computer hardware updates and iterations are accelerating. The performance of the central processing unit (CPU), the core component of a computer system, is directly related to improvements in overall computing power. In the current computer market, laptops and desktops each occupy a significant position, serving different user groups and application scenarios. However, there are significant differences in hardware configuration, particularly in CPU compatibility and interchangeability.

[0032] Traditionally, laptop CPU designs, driven by portability and energy efficiency, often utilize low-power, highly integrated packages, such as the BGA (Ball Grid Array) package. This allows the CPU to be soldered directly to the motherboard, reducing size and weight while effectively managing heat dissipation and power consumption. Desktop CPUs, by contrast, are more focused on high-performance computing and typically utilize a socket-type mounting system, such as the LGA (Land Grid Array) or PGA (Pin Grid Array), allowing for easy upgrades and replacements based on user needs.

[0033] It's precisely because of these packaging and design differences that current laptop CPUs cannot be directly installed on desktop motherboards. This limitation not only restricts the application of laptop CPUs in a wider range of scenarios, such as high-performance computing and graphics rendering, but also limits users' ability to flexibly configure and upgrade computer hardware according to their actual needs. Furthermore, with the continuous advancement of mobile computing technology, some high-performance, low-power laptop CPUs have gradually approached or even surpassed the energy efficiency of some desktop CPUs. However, their application potential has not been fully realized due to compatibility issues.

[0034] Based on this, the present application improves the traditional adapter board, CPU adapter method and computer equipment.

[0035] See also Figures 1 to 3 , Figure 1 A schematic diagram of the application framework structure of the adapter board 200 provided in this embodiment; Figure 2 This is a schematic diagram of the structure of the adapter board provided in this embodiment. Figure 3Another structural schematic diagram of the adapter board provided in this embodiment; the adapter board 200 of this embodiment is used to connect the desktop motherboard 100 and the mobile CPU 300, and the adapter board 200 has a multi-layer structure, and the multi-layer structure includes a top plate layer 210 and a bottom plate layer 220 that are arranged away from each other; the adapter board 200 is plugged and adapted to the desktop motherboard 100, and when the adapter board 200 is plugged into the desktop motherboard 100, the top plate layer 210 is arranged on the side of the bottom plate layer 220 facing away from the desktop motherboard 100, and the bottom plate layer 220 is electrically connected to the desktop motherboard 100; wherein, a welding portion is provided on the side of the top plate layer 210 facing away from the bottom plate layer 220, and the welding portion is used for welding the mobile CPU 300.

[0036] It should be noted that the multi-layer structure of the adapter board 200 facilitates complex electrical connections and signal transmission. The desktop motherboard 100 refers to the motherboard of a desktop computer, and the mobile CPU 300 refers to the CPU of a laptop. It is understood that one side of the adapter board 200 (the bottom layer 220) is mounted and adapted for the desktop motherboard 100, while the other side (the top layer 210) is mounted and adapted for the mobile CPU 300. Therefore, the adapter board 200 in this application can transfer the mobile CPU 300 to the desktop motherboard 100, thereby improving the flexibility and applicability of the mobile CPU 300.

[0037] Specifically, under normal circumstances, if a desktop CPU and a laptop CPU have the same process and performance, the desktop CPU is more expensive than the laptop CPU, but the laptop CPU is soldered to the motherboard and cannot be replaced. In this embodiment, the laptop CPU is soldered to the adapter board 200, and then the adapter board 200 is installed on the desktop, which is conducive to reducing the price of the CPU used in the desktop.

[0038] In this embodiment, an adapter board 200 is provided to connect the mobile CPU 300 to the desktop motherboard 100, and can transfer the power supply and signal traces of the mobile CPU 300 to the pins with the same function on the bottom layer 220, thereby realizing the connection between the circuits and electrical devices of the two different packaging forms. The adapter board 200 is mainly used to enable the use of mobile chips on the desktop motherboard and facilitate the replacement of CPUs, perfectly combining the low power consumption and low cost of mobile CPUs with the detachable advantages of desktop CPUs.

[0039] In some embodiments, the adapter board 200 has the same shape and size as a desktop CPU, which is a CPU for a desktop computer.

[0040] In some embodiments of the present application, the baseboard layer 220 is used to form a contact array package structure with the desktop motherboard 100. It is understood that a Land Grid Array (LGA) package is a package with an array of flat electrode contacts on the bottom surface. These metal contacts are arranged in a grid pattern on the bottom of the package and directly contact corresponding pads on the desktop motherboard 100.

[0041] In some embodiments of the present application, contacts are provided on the side of the bottom plate layer 220 facing away from the top plate layer 210 , and an electroplating layer for electrically connecting to the desktop motherboard 100 is provided on the contacts, and the electroplating layer is a water-gold electroplating layer.

[0042] As you can understand, the electroplating layer is a thin metal film formed on the surface of the contact through an electroplating process. This film not only improves the electrical conductivity of the contact, but also enhances its corrosion resistance, oxidation resistance, and wear resistance. Specifically, water-gold electroplating is a specific type of electroplating layer, which generally refers to the process of electroplating and depositing metallic gold in an aqueous solution. Gold has excellent conductivity, corrosion resistance, and oxidation resistance, so water-gold electroplating can significantly improve the electrical performance and long-term stability of the contact.

[0043] In some embodiments of the present application, the top plate layer 210 is used to form a ball grid array packaging structure with the mobile CPU 300 .

[0044] As you can understand, a ball grid array (BGA) package is a surface mount technology used in integrated circuits. BGA packaging provides a higher pin count and smaller pin pitch through an array of solder balls, enabling high-density interconnects. BGA packages have very short pins and short signal paths, reducing lead inductance and capacitance. This helps reduce signal transmission delay and distortion, improving signal integrity. Furthermore, BGA packaging offers low impedance and excellent matching characteristics, further enhancing electrical performance. The top plate layer 210 is in direct contact with the mobile CPU 300 and conducts heat to the adapter board 200 through the packaging structure, improving heat dissipation.

[0045] In some embodiments of the present application, the welding portion includes a welding pad, on which a soldering film layer for welding to the mobile CPU 300 is provided, and the soldering film layer is an organic soldering film layer.

[0046] It is understandable that the solder film layer is a thin film coated on the surface of the pad, and its main function is to protect the pad from oxidation, contamination and mechanical damage during the soldering process, thereby ensuring the reliability and quality of the soldering. The solder film layer can also provide the necessary wettability and fluidity during soldering, which helps to evenly distribute and contact the solder. In this embodiment, the solder film layer is an organic solder film layer. The organic solder film layer is usually made of organic compounds (such as resins, polymers, etc.), which have good insulation, heat resistance and chemical stability. Compared with inorganic solder film layers (such as tin plating, nickel plating, etc.), the organic solder film layer has lower cost and better processing performance, and therefore has more advantages in certain applications.

[0047] In some embodiments of the present application, the multi-layer structure includes multiple routing layers, and the multiple routing layers are stacked in sequence between the top plate layer 210 and the bottom plate layer 220; a first signal routing area and a first power supply routing area are provided on the top plate layer 210, the first signal routing area is used for data interaction with the mobile CPU 300, and the first power supply routing area is used to supply power to the mobile CPU 300; the first signal routing area and the first power supply routing area are routed through the routing layer to electrically connect to the bottom plate layer 220.

[0048] It should be explained that the multi-layer structure is a highly integrated packaging design that achieves high-density, high-performance electrical connections by stacking multiple routing layers in sequence between the top plate layer 210 and the bottom plate layer 220. This design not only improves the pin density of the package, but also optimizes the signal transmission path, reducing signal delay and distortion. The first signal routing area is used for data exchange with the mobile CPU 300. It contains the signal lines required for communication with the mobile CPU 300. These signal lines are connected to the bottom plate layer 220 or other components through the routing layer, realizing data transmission and exchange.

[0049] The first power routing area is used to power the mobile CPU 300. It contains power lines, which connect to the power management module or external power source via a routing layer, providing stable voltage and current for the mobile CPU 300. Routing layers run between the first signal routing area and the first power routing area, providing electrical connections to the backplane layer 220 or other components. This design ensures that signal and power lines are routed along predetermined paths, preventing mutual interference and signal loss.

[0050] In some embodiments of the present application, a second signal routing area and a second power routing area are provided on the bottom board layer 220. The second signal routing area is used for data exchange with the desktop motherboard 100, and the second power routing area is used for obtaining the power supply signal of the desktop motherboard 100. The first signal routing area is electrically connected to the second signal routing area through a routing layer, and the first power routing area is electrically connected to the second power routing area through a routing layer.

[0051] It will be appreciated that the second signal routing area is used for data exchange with the desktop motherboard 100. It contains the signal lines required for communication with the desktop motherboard 100. These signal lines are connected to the top board layer 210 or other routing layers via routing layers, enabling data transmission and exchange. The second power routing area is used to obtain power signals from the desktop motherboard 100. It contains power lines, which are connected to the desktop motherboard 100's power management module or an external power supply via routing layers to provide stable voltage and current to the mobile device.

[0052] In some embodiments, the number of routing layers is 8.

[0053] In some embodiments of the present application, multiple signal routings are arranged in the routing layer, the signal routings are connected to the first signal routing area and the second signal routing area, and the signal routings include control signal routings, display signal routings, parameter configuration signal routings and communication signal routings.

[0054] In some embodiments, the routing layer includes DDR (Double Data Rate) signal routing, PCIE (Peripheral Component Interconnect Express) signal routing, Control signal routing, Misc (miscellaneous or auxiliary) signal routing, CFG (parameter configuration) signal routing, and Audio signal routing.

[0055] Specifically, DDR signals are a crucial channel for data transmission between the CPU and memory. They include the address bus, data bus, and control bus, enabling the CPU to read and write data to memory. During the connection process, ensuring the integrity and timing accuracy of the DDR signals is crucial to ensure stable and fast data transmission.

[0056] PCIE signals are a high-speed serial computer expansion bus standard used to connect CPUs and external devices (such as graphics cards and network cards). They support hot plugging, high data rates, and point-to-point transmission. During the connection process, PCIE signal synchronization and transmission speed must be ensured to meet the data transmission requirements of external devices.

[0057] Control signals are used by the CPU to control external devices and internal components. They include various control instructions and status signals, enabling the CPU to precisely control these devices and internal components. During the connection process, ensuring the accuracy and reliability of control signals is crucial to ensure proper system operation and stability.

[0058] Misc signals generally refer to miscellaneous or auxiliary signals, which may include clock signals, reset signals, and interrupt signals. These signals play a vital role in CPU operation, implementing system synchronization, reset signals, and interrupt handling. During the connection process, the integrity and timing accuracy of Misc signals must be ensured to ensure system stability and reliability. CFG signals generally refer to configuration signals, which are used to set the operating modes and parameters of the CPU and other components. These signals may include various configuration registers, control bits, and status bits. During the connection process, the accuracy and consistency of CFG signals must be ensured to ensure correct system configuration and stable operation.

[0059] Audio signals are used by the CPU to process audio data. They may include audio input / output signals, audio control signals, and more. During the connection process, the clarity and fidelity of the audio signals must be ensured to meet audio processing requirements. Power and ground signals are essential for the proper functioning of the CPU. The power signal provides the necessary electrical energy to the CPU, while the ground signal serves as a reference point for current flow. During the connection process, the stability of the power signal and the reliability of the ground signal must be ensured to ensure proper functioning and stability of the CPU.

[0060] Further, in order to better implement the adapter plate 200 in any of the above embodiments, based on the adapter plate 200 in the above embodiments, please refer to Figure 2 , Figure 2 The present application also provides a CPU transfer method, which includes:

[0061] S100: Obtaining a desktop motherboard 100 and reading the BIOS file of the desktop motherboard 100. Specifically, for the target desktop motherboard 100 to be transferred, the BIOS (Basic Input Output System) file of the target desktop motherboard 100 is read. The BIOS file generally contains important data such as the motherboard's hardware configuration information, boot sequence, and hardware self-test program. Reading the BIOS file is for subsequent modification or configuration.

[0062] S200: Read the bottom layer of the BIOS file and disable the stock keeping unit (SKU) identification function within the management engine (ME). Specifically, the BIOS file is read deep into the bottom layer and the SKU (Stock Keeping Unit) identification function within the management engine (ME) is located. The ME is a technology on the Intel platform that handles low-level hardware management and security-related tasks. Disabling the SKU identification function may be to prevent conflicts between the mobile CPU 300 and certain configurations or security mechanisms of the desktop motherboard 100 after it is installed on the adapter board 200.

[0063] S300: Install the adapter board 200 described above onto the desktop motherboard 100, and install the mobile CPU 300 on the side of the adapter board 200 facing away from the desktop motherboard 100. Specifically, the adapter board 200 mentioned above needs to be installed onto the desktop motherboard 100. The adapter board 200 is designed to allow the mobile CPU 300 to adapt to the desktop motherboard 100. After the adapter board 200 is installed, the mobile CPU 300 needs to be installed on the side of the adapter board 200 facing away from the desktop motherboard 100 (i.e., the other side of the adapter board 200). This allows the mobile CPU 300 to communicate and interact with the desktop motherboard 100 through the adapter board 200.

[0064] In some embodiments, after step S200, the process further includes replacing the management engine with a specified COR-specific version of the management engine and adding any missing microcode from desktop motherboard 100. Specifically, microcode is a small section of program code within a processor that implements specific instruction sets and operations. It is typically embedded in the processor's firmware. In some cases, desktop motherboard 100 may lack some necessary microcode for various reasons. This missing microcode may cause the processor to fail to correctly execute certain instructions or operations, thereby impacting system stability and performance.

[0065] It should be explained that not all motherboards need to use the above-mentioned CPU switching method to disable SKU identification. Some motherboards can be switched directly without modification.

[0066] Furthermore, in order to better implement the adapter board 200 in any of the above embodiments, based on the adapter board 200 in the above embodiments, the present application also provides a computer device, including a desktop motherboard 100, a mobile CPU 300 and the adapter board 200 as described above, and the adapter board 200 is connected to the desktop motherboard 100 and the mobile CPU 300 respectively.

[0067] In the above embodiments, the description of each embodiment has its own focus. For parts that are not described or recorded in detail in a certain embodiment, reference can be made to the relevant description of other embodiments.

[0068] The basic concepts have been described above. It will be apparent to those skilled in the art that the detailed disclosure above is merely illustrative and does not limit the present application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and amendments to the present application. Such modifications, improvements, and amendments are suggested in the present application and remain within the spirit and scope of the exemplary embodiments of the present application.

[0069] At the same time, this application uses specific terms to describe the embodiments of this application. For example, "one embodiment," "an embodiment," and / or "some embodiments" refer to a certain feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "one embodiment," "an embodiment," or "an alternative embodiment" mentioned twice or multiple times in different locations in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application may be appropriately combined.

[0070] Similarly, it should be noted that, in order to simplify the presentation of this application and thus facilitate understanding of one or more embodiments of the invention, the foregoing descriptions of the embodiments of this application sometimes combine multiple features into a single embodiment, figure, or description thereof. However, this disclosure method does not mean that the subject matter of this application requires more features than those recited in the claims. In fact, an embodiment may have fewer features than all of the features of a single embodiment disclosed above.

[0071] The above-described embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A transfer plate, characterized in that: The adapter board is used to connect the desktop motherboard and the mobile CPU. The adapter board has a multi-layer structure, and the multi-layer structure includes a top plate layer and a bottom plate layer that are arranged away from each other; The adapter board is plugged and adapted to the desktop motherboard, and when the adapter board is plugged into the desktop motherboard, the top plate layer is arranged on a side of the bottom plate layer facing away from the desktop motherboard, and the bottom plate layer is electrically connected to the desktop motherboard; Wherein, a welding portion is provided on a side of the top plate layer facing away from the bottom plate layer, and the welding portion is used for welding the mobile CPU; The adapter board has the same shape and size as the desktop CPU. The desktop CPU refers to the CPU of a desktop computer; the desktop motherboard refers to the motherboard of a desktop computer, and the mobile CPU refers to the CPU of a laptop. The bottom plate layer is used to form a contact array packaging structure with the desktop motherboard; the top plate layer is used to form a ball grid array packaging structure with the mobile CPU; The multi-layer structure includes a plurality of routing layers, and the plurality of routing layers are sequentially stacked between the top plate layer and the bottom plate layer; The top plate layer is provided with a first signal routing area and a first power supply routing area, wherein the first signal routing area is used for data exchange with the mobile CPU, and the first power supply routing area is used for powering the mobile CPU; the first signal routing area and the first power supply routing area are routed through the routing layer to be electrically connected to the bottom plate layer; The bottom plate layer is provided with a second signal routing area and a second power routing area, the second signal routing area is used for data exchange with the desktop motherboard, and the second power routing area is used for obtaining a power supply signal from the desktop motherboard; Wherein, the first signal routing area is electrically connected to the second signal routing area through the routing layer, and the first power supply routing area is electrically connected to the second power supply routing area through the routing layer; A plurality of signal routings are provided in the routing layer, the signal routings are connected to the first signal routing area and the second signal routing area, and the signal routings include control signal routings, display signal routings, parameter configuration signal routings, and communication signal routings.

2. The adapter plate according to claim 1, wherein: A contact is provided on the side of the bottom plate layer facing away from the top plate layer. An electroplating layer for electrically connecting to the desktop motherboard is provided on the contact. The electroplating layer is a water-gold electroplating layer.

3. The adapter plate according to claim 1, wherein: The welding portion includes a welding pad, on which a soldering film layer for welding with the mobile CPU is provided, and the soldering film layer is an organic soldering film layer.

4. A CPU switching method, characterized in that: The transfer method comprises: Obtaining a desktop motherboard and reading a BIOS file of the desktop motherboard; Reading the bottom layer of the BIOS file and disabling the inventory unit identification function in the management engine in the bottom layer; The adapter plate according to any one of claims 1 to 3 is mounted on the desktop motherboard, and a mobile CPU is mounted on a side of the adapter plate facing away from the desktop motherboard.

5. A computer device, characterized in that: The device comprises a desktop motherboard, a mobile CPU and an adapter board as claimed in any one of claims 1 to 3, wherein the adapter board is connected to the desktop motherboard and the mobile CPU respectively.

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