Thermal simulation processing method, device and equipment for printed circuit board and storage medium

Abstract

The invention provides a thermal simulation processing method, device and equipment for a printed circuit board and a storage medium, and relates to the technical field of simulation processing, and the method comprises the steps: building an electronic equipment geometric model, dividing the electronic equipment geometric model into a plurality of tetrahedron units, setting material parameters, and generating an electronic equipment grid model; rasterizing a pre-established geometric model of the printed circuit board to obtain a plurality of grid subunits, and calculating equivalent material parameters of each grid subunit according to actual circuit data of the printed circuit board; screening out a plurality of first tetrahedron units in the electronic equipment grid model; mapping the first tetrahedron units to corresponding positions in the rasterized model to obtain equivalent material parameters of each first tetrahedron unit; updating material parameters of a printed circuit board area in the electronic equipment grid model; and performing thermal simulation processing, and drawing a temperature distribution diagram of the printed circuit board. According to the invention, high-precision temperature distribution of the printed circuit board can be obtained.

Description

Technical Field

[0001] The present invention relates to the field of simulation processing technology, and in particular to a printed circuit board thermal simulation processing method, device, equipment and storage medium. Background Art

[0002] In the thermal simulation of electronic devices, especially in the thermal design process of portable devices such as mobile phones, it is usually necessary to simplify complex components to improve the success rate of meshing and reduce the number of mesh units. Simplification involves simplifying complex component models into common geometric models, such as cylinders or cuboids, to speed up simulation. For example, when performing thermal simulation on a mobile phone model, the printed circuit board is usually simplified into a cuboid, and the average specific heat capacity and thermal conductivity of the printed circuit board are used as equivalent parameters. Although simplification can effectively improve the simulation speed, it will lose a certain degree of simulation accuracy.

[0003] Especially in the densely populated areas of the printed circuit board, the content of metal materials is high and the thermal conductivity is significantly enhanced. Circuit designers usually reserve metal heat dissipation channels in the densely populated areas of the printed circuit board to optimize the heat dissipation performance. However, in the thermal simulation process, the simplified printed circuit board model usually uses the average thermal conductivity parameter, ignoring the difference in local thermal conductivity, resulting in the simulation results cannot accurately reflect the temperature distribution of each area of ​​the printed circuit board. Ignoring the difference in local thermal conductivity not only affects the accuracy of the thermal simulation results, but also leads designers to make wrong judgments when adjusting the heat dissipation structure, thereby affecting the optimization of the heat dissipation performance of the entire device. Summary of the invention

[0004] The problem solved by the present invention is how to improve the thermal simulation accuracy of a printed circuit board area and obtain a high-precision temperature distribution of the printed circuit board.

[0005] In order to solve the above problems, the present invention provides a printed circuit board thermal simulation processing method, device, equipment and storage medium.

[0006] In a first aspect, the present invention provides a method for thermal simulation of a printed circuit board, which is used for performing thermal simulation on a printed circuit board in an electronic device, and is characterized by comprising:

[0007] Building a geometric model of an electronic device, meshing the geometric model of the electronic device to obtain a plurality of tetrahedral units, setting material parameters of the mesh model of the electronic device to obtain a mesh model of the electronic device;

[0008] Performing rasterization processing on the pre-established geometric model of the printed circuit board to generate a rasterized model of the printed circuit board to obtain a plurality of raster sub-units, and calculating equivalent material parameters of each of the raster sub-units according to actual circuit data of the printed circuit board;

[0009] Screening out a plurality of first tetrahedral units in the electronic device mesh model, wherein the plurality of first tetrahedral units are tetrahedral units used to constitute a printed circuit board in the electronic device mesh model;

[0010] Mapping the first tetrahedral unit to a corresponding position in the gridded model, and obtaining an equivalent material parameter of each of the first tetrahedral units based on an equivalent material parameter of each of the grid subunits;

[0011] Updating material parameters of a printed circuit board region in the electronic device mesh model based on equivalent material parameters of the first tetrahedral unit;

[0012] The updated electronic device grid model is subjected to thermal simulation processing to obtain a thermal simulation result of the electronic device, and a temperature distribution diagram of the printed circuit board is drawn according to the thermal simulation result of the electronic device.

[0013] Optionally, the material parameters include thermal conductivity, specific heat capacity and density, and the equivalent material parameters include equivalent thermal conductivity, equivalent specific heat capacity and equivalent density.

[0014] Optionally, the calculating the equivalent material parameters of each grid subunit according to the actual circuit data of the printed circuit board includes:

[0015] Acquire actual circuit data of a printed circuit board, the actual circuit data of the printed circuit board including distribution data of metal materials and non-metal materials in the printed circuit board, and determine the metal content of each grid subunit according to the actual circuit data of the printed circuit board;

[0016] Determining the equivalent density of each of the grid subunits according to the density of the metal material, the density of the non-metal material and the metal content of each of the grid subunits;

[0017] Determining the equivalent specific heat capacity of each of the grid subunits according to the specific heat capacity of the metal material, the specific heat capacity of the non-metal material and the metal content of each of the grid subunits;

[0018] The equivalent thermal conductivity of each of the grid subunits is determined according to the thermal conductivity of the metal material, the thermal conductivity of the non-metal material and the metal content of each of the grid subunits.

[0019] Optionally, the screening out of a plurality of first tetrahedral units in the electronic device mesh model, wherein the plurality of first tetrahedral units are tetrahedral units used to constitute a printed circuit board in the electronic device mesh model:

[0020] Determining the geometric boundary of the printed circuit board area in the electronic device grid model according to the design information of the electronic device;

[0021] Traversing the tetrahedral units in the electronic device mesh model to determine whether the geometric center of the tetrahedral unit is located within the geometric boundary of the printed circuit board area;

[0022] The tetrahedral unit whose geometric center is located within the geometric boundary of the printed circuit board area is marked as the first tetrahedral unit.

[0023] Optionally, mapping the first tetrahedral unit to a corresponding position in the gridded model, and obtaining the equivalent material parameter of each of the first tetrahedral units based on the equivalent material parameter of each of the grid subunits comprises:

[0024] Discretize the first tetrahedral unit to obtain a plurality of first tetrahedral subunits;

[0025] Mapping the first tetrahedral subunit to a corresponding position in the grid model to determine an equivalent mapping pair, wherein the equivalent mapping pair is used to characterize a corresponding relationship between the first tetrahedral subunit and the grid subunit;

[0026] Based on the equivalent material parameters of each of the grid sub-units, determining the equivalent material parameters of each of the first tetrahedral sub-units according to the equivalent mapping pair;

[0027] The equivalent material parameter of the first tetrahedral unit is obtained based on the equivalent material parameters of the plurality of the first tetrahedral subunits.

[0028] Optionally, determining the equivalent material parameter of each of the first tetrahedral subunits according to the equivalent mapping pair comprises:

[0029] The corresponding grid subunit is found according to the position of the center point of the first tetrahedral subunit, and the equivalent material parameters of the corresponding grid subunit are used as the equivalent material parameters of the first tetrahedral subunit.

[0030] Optionally, the calculation formula for obtaining the equivalent material parameter of the first tetrahedral unit based on the equivalent material parameters of the plurality of the first tetrahedral subunits is:

[0031]

[0032] Wherein, p represents the density of the first tetrahedral unit, k represents the thermal conductivity of the first tetrahedral unit, c represents the specific heat capacity of the first tetrahedral subunit, V sum represents the volume of the first tetrahedral unit, p i represents the density of the ith tetrahedral subunit, k i represents the thermal conductivity of the ith tetrahedral subunit, c i represents the specific heat capacity of the thermal conductivity of the i-th tetrahedral subunit, V i represents the volume of the i-th first tetrahedral subunit, and n represents the number of tetrahedral subunits contained in the tetrahedral unit.

[0033] In a second aspect, the present invention provides a printed circuit board thermal simulation processing device, which is used in the above-mentioned printed circuit board thermal simulation processing method, comprising:

[0034] A mesh model building module is used to build a geometric model of an electronic device, and mesh the geometric model of the electronic device to obtain a plurality of tetrahedral units, set material parameters of the mesh model of the electronic device, and obtain the mesh model of the electronic device;

[0035] A rasterization model building module is used to perform rasterization processing on the pre-established geometric model of the printed circuit board, generate a rasterization model of the printed circuit board, obtain a plurality of raster sub-units, and calculate the equivalent material parameters of each of the raster sub-units according to the actual circuit data of the printed circuit board;

[0036] A screening module, used for screening out a plurality of first tetrahedral units in the electronic device mesh model, wherein the plurality of first tetrahedral units are tetrahedral units used for constituting a printed circuit board in the electronic device mesh model;

[0037] A mapping module, used for mapping the first tetrahedral unit to a corresponding position in the gridded model, and obtaining an equivalent material parameter of each of the first tetrahedral units based on an equivalent material parameter of each of the grid subunits;

[0038] An updating module, configured to update material parameters of a printed circuit board region in the electronic device mesh model based on equivalent material parameters of the first tetrahedral unit;

[0039] The thermal simulation module is used to perform thermal simulation processing on the updated electronic device grid model to obtain the electronic device thermal simulation result, and draw a temperature distribution diagram of the printed circuit board according to the electronic device thermal simulation result.

[0040] In a third aspect, the present invention provides an electronic device, including a memory and a processor;

[0041] The memory is used to store computer programs;

[0042] The processor is used to implement the printed circuit board thermal simulation processing method as described in the first aspect when executing the computer program.

[0043] In a fourth aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the printed circuit board thermal simulation processing method as described in the first aspect is implemented.

[0044] Compared with the prior art, the beneficial effects of the present invention are as follows: first, by building an electronic device geometric model and performing meshing, setting material parameters, a foundation is laid for subsequent thermal simulation processing; then, the pre-established geometric model of the printed circuit board is gridded, and the equivalent material parameters of each grid sub-unit are calculated according to the actual circuit data, so as to obtain more accurate printed circuit board material properties; then, by screening the tetrahedral units in the electronic device mesh model, the first tetrahedral unit in the printed circuit board area can be accurately separated, providing a basis for the subsequent update of the printed circuit board material properties. Subsequently, by mapping the first tetrahedral unit to the gridded model, and applying the material properties of different areas of the printed circuit board to these tetrahedral units, the material properties of the printed circuit board in the electronic device mesh model are updated using equivalent material parameters, ensuring that the material in the printed circuit board area can reflect the real thermal characteristics, thereby improving the accuracy of thermal simulation. Finally, by performing thermal simulation processing on the updated electronic device mesh model, an accurate printed circuit board temperature distribution map is obtained. The present invention updates the material parameters of the printed circuit board in the electronic device grid model by using equivalent material parameters obtained from actual circuit data of the printed circuit board, so as to avoid local thermal performance errors caused by circuit simplification of the printed circuit board in the electronic device grid model, improve the accuracy of thermal simulation of the printed circuit board, and obtain high-precision temperature distribution of the printed circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 A schematic diagram of a process flow of a printed circuit board thermal simulation processing method provided by an embodiment of the present invention;

[0046] Figure 2 A schematic flow chart of step S13 of a printed circuit board thermal simulation processing method provided by one embodiment of the present invention;

[0047] Figure 3 A schematic structural diagram of a printed circuit board thermal simulation processing device provided by an embodiment of the present invention;

[0048] Figure 4 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0049] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. Although certain embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be interpreted as being limited to the embodiments described herein. On the contrary, these embodiments are provided to provide a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are only for exemplary purposes and are not intended to limit the scope of protection of the present invention.

[0050] It should be understood that the various steps described in the method embodiments of the present invention may be performed in different orders and / or in parallel. In addition, the method embodiments may include additional steps and / or omit the steps shown. The scope of the present invention is not limited in this respect.

[0051] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to"; the term "based on" means "based at least in part on"; the term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments"; the term "optionally" means "optional embodiments". The relevant definitions of other terms will be given in the following description. It should be noted that the concepts of "first", "second", etc. mentioned in the present invention are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0052] It should be noted that the modifications of "one" and "plurality" mentioned in the present invention are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0053] The names of the messages or information exchanged between multiple devices in the embodiments of the present invention are only used for illustrative purposes, and are not used to limit the scope of these messages or information.

[0054] Reference Figure 1 The present invention provides a printed circuit board thermal simulation processing method for performing thermal simulation processing on a printed circuit board in an electronic device, comprising:

[0055] S11, constructing a geometric model of an electronic device, and meshing the geometric model of the electronic device to obtain a plurality of tetrahedral units, setting material parameters of the mesh model of the electronic device, and obtaining the mesh model of the electronic device.

[0056] First, build a geometric model of the electronic device through modeling software or simulation tools. The mesh model of the electronic device covers the geometric structure of the entire electronic device, including various parts such as printed circuit boards, housings, batteries and chips. The electronic device can be a mobile terminal, such as a mobile phone. After building the geometric model of the electronic device, meshing is performed to discretize the mesh model of the electronic device into multiple tetrahedral units, each of which represents a part of the electronic device. The purpose of meshing is to facilitate subsequent simulation calculations. After completing the meshing, further set material parameters (such as density, thermal conductivity, specific heat capacity) and boundary conditions (such as the temperature of the external environment, the location of the heat source, etc.) for each unit. The material parameters reflect the physical properties of each part of the electronic device.

[0057] S12, rasterizing the pre-established geometric model of the printed circuit board to generate a rasterized model of the printed circuit board, obtaining a plurality of raster sub-units, and calculating equivalent material parameters of each of the raster sub-units according to actual circuit data of the printed circuit board.

[0058] In order to improve the simulation accuracy, it is necessary to grid the printed circuit board area based on the original data of the printed circuit board area. The purpose of rasterization is to divide the printed circuit board area into multiple grid sub-units, each grid sub-unit represents a small area on the printed circuit board. After the rasterization is completed, the equivalent material parameters of each grid sub-unit are calculated according to the actual circuit design data of the printed circuit board (such as circuit layout, metal distribution and non-metal distribution). These material parameters include density, thermal conductivity and specific heat capacity, which are calculated by analyzing the ratio of metal to non-metal materials in each grid sub-unit, and can accurately reflect the thermal performance of different areas of the printed circuit board.

[0059] S13. Filter out a plurality of first tetrahedral units in the electronic device mesh model, wherein the plurality of first tetrahedral units are tetrahedral units used to constitute a printed circuit board in the electronic device mesh model.

[0060] Specifically, all tetrahedral units in the mesh model are traversed to screen out the units belonging to the printed circuit board area. The screened out tetrahedral units are multiple "first tetrahedral units" and are used for subsequent material parameter updates and simulation processing.

[0061] S14. Map the first tetrahedral unit to a corresponding position in the gridded model, and obtain the equivalent material parameters of each of the first tetrahedral units based on the equivalent material parameters of each of the grid subunits.

[0062] After the first tetrahedral unit is screened out, the first tetrahedral unit is mapped to the corresponding position in the grid model. Specifically, the geometric center of each first tetrahedral unit is calculated and matched with the grid sub-unit in the grid model to determine the grid sub-unit in which it is located. Based on the mapping relationship, the equivalent material parameters of each first tetrahedral unit are calculated using the equivalent material parameters of the grid sub-unit.

[0063] S15. Update material parameters of a printed circuit board region in the electronic device mesh model based on equivalent material parameters of the first tetrahedral unit.

[0064] It should be explained that the material parameters of all the first tetrahedral units are replaced or updated one by one, and the material parameters (such as a uniform average value) of the printed circuit board area in the sub-device mesh model are replaced with equivalent material parameters obtained by rasterizing the actual printed circuit board area. The material parameters reflect the thermal conductivity of different areas of the printed circuit board, so that the material properties of each tetrahedral unit are closer to the actual thermal conductivity, density and specific heat capacity. This embodiment can improve the accuracy of the material parameters of the printed circuit board area through the update operation, thereby providing more accurate input data for subsequent thermal simulation.

[0065] S16, performing thermal simulation processing on the updated electronic device grid model to obtain a thermal simulation result of the electronic device, and drawing a temperature distribution diagram of the printed circuit board according to the thermal simulation result of the electronic device.

[0066] This embodiment uses thermal simulation software to simulate the heat conduction and heat dissipation of the printed circuit board area of ​​the electronic device during operation to obtain the thermal simulation results of the electronic device. The simulation results include a temperature distribution diagram of the printed circuit board area, which can reflect the temperature difference of the printed circuit board in different areas, thereby optimizing the overall thermal design efficiency of the electronic device.

[0067] Compared with the prior art, the beneficial effects of the present invention are as follows: first, by building an electronic device geometric model and performing meshing, setting material parameters, a foundation is laid for subsequent thermal simulation processing; then, the pre-established geometric model of the printed circuit board is gridded, and the equivalent material parameters of each grid sub-unit are calculated according to the actual circuit data, so as to obtain more accurate printed circuit board material properties; then, by screening the tetrahedral units in the electronic device mesh model, the first tetrahedral unit in the printed circuit board area can be accurately separated, providing a basis for the subsequent update of the printed circuit board material properties. Subsequently, by mapping the first tetrahedral unit to the gridded model, and applying the material properties of different areas of the printed circuit board to these tetrahedral units, the material properties of the printed circuit board in the electronic device mesh model are updated using equivalent material parameters, ensuring that the material in the printed circuit board area can reflect the real thermal characteristics, thereby improving the accuracy of thermal simulation. Finally, by performing thermal simulation processing on the updated electronic device mesh model, an accurate printed circuit board temperature distribution map is obtained. The present invention updates the material parameters of the printed circuit board in the electronic device grid model by using equivalent material parameters obtained from actual circuit data of the printed circuit board, so as to avoid local thermal performance errors caused by circuit simplification of the printed circuit board in the electronic device grid model, improve the accuracy of thermal simulation of the printed circuit board, and obtain high-precision temperature distribution of the printed circuit board.

[0068] In one embodiment, the material parameters include thermal conductivity, specific heat capacity and density, and the equivalent material parameters include equivalent thermal conductivity, equivalent specific heat capacity and equivalent density.

[0069] Specifically, thermal conductivity is the ability of a material to transfer heat, which is used to describe the thermal conductivity of a material. Different areas of a printed circuit board (such as a metal layer and a dielectric layer) have different thermal conductivities. In the simulation process, the thermal conductivity values ​​of these areas need to be accurately set in order to simulate the process of heat conduction more realistically. Specific heat capacity represents the amount of heat required for a unit mass of material to rise by one degree, and is an important parameter that affects the temperature rise and heat dissipation performance of the material. For different materials in a printed circuit board, such as copper foil, dielectric layer, and solder joint, the corresponding specific heat capacities are different. Therefore, setting accurate specific heat capacity values ​​for each part in the simulation helps to accurately predict temperature changes and heat distribution. Density represents the ratio of the mass to the volume of a material. Density is another important parameter that affects the heat transfer and storage capacity. The density of different materials will directly affect the performance of their specific heat capacity. Therefore, in the thermal simulation of a printed circuit board, corresponding density values ​​need to be set for different areas to ensure that the simulation results are accurate. This embodiment further restricts material parameters and equivalent material parameters, which can ensure accurate simulation of the thermal behavior inside electronic equipment and improve the efficiency of thermal management during the design process.

[0070] In one embodiment, the calculating the equivalent material parameters of each grid subunit according to the actual circuit data of the printed circuit board includes:

[0071] Acquire actual circuit data of the printed circuit board, the actual circuit data of the printed circuit board including distribution data of metal materials and non-metal materials in the printed circuit board, and determine the metal content of each grid subunit according to the actual circuit data of the printed circuit board.

[0072] Specifically, the actual circuit data of the printed circuit board can be obtained through the printed circuit board design file or the printed circuit board circuit layout diagram. The actual circuit data of the printed circuit board may include the layout information of the metal traces, pads, vias, etc. of the conductive layer, as well as the distribution of non-metallic materials (such as insulating layers, dielectric materials). Through the actual circuit data of the printed circuit board, the ratio of metal to non-metal in each grid sub-unit on the printed circuit board can be accurately located, providing a basis for the subsequent calculation of equivalent material parameters.

[0073] The equivalent density of each of the grid sub-units is determined according to the density of the metal material, the density of the non-metal material and the metal content of each of the grid sub-units.

[0074] Determining the equivalent specific heat capacity of each of the grid subunits according to the specific heat capacity of the metal material, the specific heat capacity of the non-metal material and the metal content of each of the grid subunits;

[0075] The equivalent thermal conductivity of each of the grid subunits is determined according to the thermal conductivity of the metal material, the thermal conductivity of the non-metal material and the metal content of each of the grid subunits.

[0076] The equivalent density, the equivalent specific heat capacity and the equivalent thermal conductivity can be obtained by weighted summing of the material parameters (density, specific heat capacity and thermal conductivity) based on the metal content data of each grid subunit.

[0077] This embodiment describes in detail how to accurately calculate the equivalent material parameters of each grid subunit based on the actual circuit data of the printed circuit board to ensure that the thermal performance during the simulation can truly reflect the actual situation.

[0078] In one embodiment, the screening out of a plurality of first tetrahedral units in the electronic device mesh model, wherein the plurality of first tetrahedral units are tetrahedral units used to form a printed circuit board in the electronic device mesh model:

[0079] The geometric boundary of the printed circuit board area in the electronic device grid model is determined according to the design information of the electronic device.

[0080] The physical location and geometric boundaries of the printed circuit board in the entire electronic device are determined by the design information of the electronic device (such as CAD drawings or 3D model data). The design information usually includes key parameters such as the size, shape, location, and number of layers of the printed circuit board. The geometric boundary defines the spatial range of the printed circuit board in the entire electronic device model as a criterion for screening tetrahedral elements.

[0081] The tetrahedral units in the electronic device mesh model are traversed to determine whether the geometric center of the tetrahedral unit is located within the geometric boundary of the printed circuit board area.

[0082] The electronic device mesh model consists of multiple tetrahedral units, each of which corresponds to a small part of the device. In order to filter out the tetrahedral units belonging to the printed circuit board area, it is necessary to traverse all tetrahedral units in the entire electronic device mesh model and determine whether their geometric centers are within the geometric boundaries of the printed circuit board area.

[0083] The tetrahedral unit whose geometric center is located within the geometric boundary of the printed circuit board area is marked as the first tetrahedral unit.

[0084] For tetrahedral elements whose geometric centers are within the geometric boundary of the printed circuit board area, they are marked as "first tetrahedral elements". These marked tetrahedral elements constitute the printed circuit board area in the electronic device mesh model and are used for subsequent material parameter updates and thermal simulation processing.

[0085] This embodiment ensures that the screening process is concise and efficient by analyzing the geometric center of the tetrahedral unit and the geometric boundary of the printed circuit board area, which helps to improve the accuracy of the thermal simulation results of the printed circuit board.

[0086] Reference Figure 2 In one embodiment, mapping the first tetrahedral unit to a corresponding position in the gridded model and obtaining the equivalent material parameters of each of the first tetrahedral units based on the equivalent material parameters of each of the grid subunits comprises:

[0087] S131. Discretize the first tetrahedral unit to obtain a plurality of first tetrahedral sub-units.

[0088] The discretization goal in this embodiment is to subdivide each tetrahedral unit into multiple smaller tetrahedral subunits so as to more finely reflect the thermal performance distribution of different regions of the printed circuit board. The discretization process can be implemented by a mesh refinement algorithm, such as inserting new vertices in the tetrahedral unit, thereby dividing the original tetrahedron into multiple subunits of equal volume or nearly equal volume.

[0089] S132: Map the first tetrahedral subunit to a corresponding position in the grid model to determine an equivalent mapping pair, where the equivalent mapping pair is used to characterize the corresponding relationship between the first tetrahedral subunit and the grid subunit.

[0090] After the discretization of the first tetrahedral unit is completed, each first ground volume subunit is mapped to a corresponding position in the grid model, which specifically includes: calculating the geometric center of each tetrahedral subunit, and determining the corresponding grid subunit by comparing the geometric center coordinates of each tetrahedral subunit, thereby obtaining an equivalent mapping pair.

[0091] S133, based on the equivalent material parameters of each of the grid sub-units, determine the equivalent material parameters of each of the first tetrahedral sub-units according to the equivalent mapping pair;

[0092] S134. Obtain equivalent material parameters of the first tetrahedral unit based on equivalent material parameters of the plurality of the first tetrahedral subunits.

[0093] This embodiment describes in detail the process of discretizing tetrahedral units and mapping them to a gridded model, thereby providing accurate data support for subsequent thermal simulation processing.

[0094] In one embodiment, determining the equivalent material parameters of each of the first tetrahedral subunits according to the equivalent mapping pair comprises:

[0095] The corresponding grid subunit is found according to the position of the center point of the first tetrahedral subunit, and the equivalent material parameters of the corresponding grid subunit are used as the equivalent material parameters of the first tetrahedral subunit.

[0096] This embodiment can ensure that the thermal performance of each subunit can reflect its actual physical characteristics, providing an accurate data basis for subsequent thermal simulation.

[0097] In one embodiment, the calculation formula for obtaining the equivalent material parameters of the first tetrahedral unit based on the equivalent material parameters of the plurality of the first tetrahedral subunits is:

[0098]

[0099] Wherein, p represents the density of the first tetrahedral unit, k represents the thermal conductivity of the first tetrahedral unit, c represents the specific heat capacity of the first tetrahedral subunit, V sum represents the volume of the first tetrahedral unit, p i represents the density of the ith tetrahedral subunit, k i represents the thermal conductivity of the ith tetrahedral subunit, c irepresents the specific heat capacity of the thermal conductivity of the i-th tetrahedral subunit, V i represents the volume of the i-th first tetrahedral subunit, and n represents the number of tetrahedral subunits contained in the tetrahedral unit.

[0100] This embodiment can ensure the accuracy of the calculation of the equivalent material parameters of the first tetrahedral unit, truly reflect the thermal performance of complex areas in the electronic device, and thus improve the accuracy of thermal simulation of the electronic device.

[0101] Reference Figure 3 The present invention provides a printed circuit board thermal simulation processing device 30, which is used in the above-mentioned printed circuit board thermal simulation processing method, comprising:

[0102] A mesh model building module 31 is used to build a geometric model of an electronic device, and mesh the geometric model of the electronic device to obtain a plurality of tetrahedral units, set material parameters of the mesh model of the electronic device, and obtain the mesh model of the electronic device;

[0103] A rasterization model building module 32 is used to rasterize the pre-established geometric model of the printed circuit board, generate a rasterization model of the printed circuit board, obtain a plurality of raster sub-units, and calculate the equivalent material parameters of each of the raster sub-units according to the actual circuit data of the printed circuit board;

[0104] A screening module 33, used for screening out a plurality of first tetrahedral units in the electronic device mesh model, wherein the plurality of first tetrahedral units are tetrahedral units used to constitute a printed circuit board in the electronic device mesh model;

[0105] A mapping module 34, configured to map the first tetrahedral unit to a corresponding position in the gridded model, and obtain an equivalent material parameter of each of the first tetrahedral units based on an equivalent material parameter of each of the grid subunits;

[0106] An updating module 35, configured to update material parameters of a printed circuit board region in the electronic device mesh model based on equivalent material parameters of the first tetrahedral unit;

[0107] The thermal simulation module 36 is used to perform thermal simulation processing on the updated electronic device grid model to obtain a thermal simulation result of the electronic device, and to draw a temperature distribution diagram of the printed circuit board according to the thermal simulation result of the electronic device.

[0108] Compared with the prior art, the beneficial effects of the present invention are as follows: first, the grid model building module 31 builds the geometric model of the electronic device and performs grid division, sets the material parameters, and lays the foundation for the subsequent thermal simulation processing; then, the grid model building module 32 grids the geometric model of the printed circuit board established in advance, and calculates the equivalent material parameters of each grid sub-unit according to the actual circuit data, so as to obtain more accurate material properties of the printed circuit board; then, the screening module 33 can accurately separate the first tetrahedron unit in the printed circuit board area by screening the tetrahedron units in the electronic device grid model, and provide a basis for the subsequent update of the material properties of the printed circuit board. Subsequently, the mapping module 34 maps the first tetrahedron unit to the grid model, and applies the material properties of different areas of the printed circuit board to these tetrahedron units, and the update module 35 updates the material properties of the printed circuit board in the electronic device grid model using the equivalent material parameters, ensuring that the material in the printed circuit board area can reflect the real thermal characteristics, thereby improving the accuracy of the thermal simulation. Finally, the thermal simulation module 36 obtains an accurate temperature distribution map of the printed circuit board by performing thermal simulation on the updated electronic device grid model. The present invention updates the material parameters of the printed circuit board in the electronic device grid model by using equivalent material parameters obtained from actual circuit data of the printed circuit board, so as to avoid local thermal performance errors caused by circuit simplification of the printed circuit board in the electronic device grid model, improve the accuracy of thermal simulation of the printed circuit board, and obtain high-precision temperature distribution of the printed circuit board.

[0109] Reference Figure 4 , the present invention provides an electronic device 40, including a memory 41 and a processor 42;

[0110] The memory 41 is used to store computer programs;

[0111] The processor 42 is used to implement the above-mentioned printed circuit board thermal simulation processing method when executing the computer program.

[0112] In other words, an electronic device 40 includes a memory 41 and a processor 42 coupled to the memory 41; the memory 41 is configured to store a computer program; and the processor 42 is configured to perform the following operations when executing the computer program:

[0113] Building a geometric model of an electronic device, meshing the geometric model of the electronic device to obtain a plurality of tetrahedral units, setting material parameters of the mesh model of the electronic device to obtain a mesh model of the electronic device;

[0114] Performing rasterization processing on the pre-established geometric model of the printed circuit board to generate a rasterized model of the printed circuit board to obtain a plurality of raster sub-units, and calculating equivalent material parameters of each of the raster sub-units according to actual circuit data of the printed circuit board;

[0115] Screening out a plurality of first tetrahedral units in the electronic device mesh model, wherein the plurality of first tetrahedral units are tetrahedral units used to constitute a printed circuit board in the electronic device mesh model;

[0116] Mapping the first tetrahedral unit to a corresponding position in the gridded model, and obtaining an equivalent material parameter of each of the first tetrahedral units based on an equivalent material parameter of each of the grid subunits;

[0117] Updating material parameters of a printed circuit board region in the electronic device mesh model based on equivalent material parameters of the first tetrahedral unit;

[0118] The updated electronic device grid model is subjected to thermal simulation processing to obtain a thermal simulation result of the electronic device, and a temperature distribution diagram of the printed circuit board is drawn according to the thermal simulation result of the electronic device.

[0119] The present invention provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the above-mentioned printed circuit board thermal simulation processing method is implemented.

[0120] In other words, a non-volatile computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the processor performs the following operations:

[0121] In other words, an electronic device 40 includes a memory 41 and a processor 42 coupled to the memory 41; the memory 41 is configured to store a computer program; and the processor 42 is configured to perform the following operations when executing the computer program:

[0122] Building a geometric model of an electronic device, meshing the geometric model of the electronic device to obtain a plurality of tetrahedral units, setting material parameters of the mesh model of the electronic device to obtain a mesh model of the electronic device;

[0123] Performing rasterization processing on the pre-established geometric model of the printed circuit board to generate a rasterized model of the printed circuit board to obtain a plurality of raster sub-units, and calculating equivalent material parameters of each of the raster sub-units according to actual circuit data of the printed circuit board;

[0124] Screening out a plurality of first tetrahedral units in the electronic device mesh model, wherein the plurality of first tetrahedral units are tetrahedral units used to constitute a printed circuit board in the electronic device mesh model;

[0125] Mapping the first tetrahedral unit to a corresponding position in the gridded model, and obtaining an equivalent material parameter of each of the first tetrahedral units based on an equivalent material parameter of each of the grid subunits;

[0126] Updating material parameters of a printed circuit board region in the electronic device mesh model based on equivalent material parameters of the first tetrahedral unit;

[0127] The electronic device grid model after the update is subjected to thermal simulation processing to obtain the electronic device thermal simulation result, and the temperature distribution diagram of the printed circuit board is drawn according to the electronic device thermal simulation result. An electronic device 40 that can be used as a server or client of the present invention will now be described, which is an example of a hardware device that can be applied to various aspects of the present invention. The electronic device 40 is intended to represent various forms of digital electronic computer devices, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device 40 can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0128] The electronic device 40 includes a computing unit, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) or a computer program loaded from a storage unit into a random access memory (RAM). In the RAM, various programs and data required for the operation of the device can also be stored. The computing unit, ROM, and RAM are connected to each other via a bus. An input / output (I / O) interface is also connected to the bus.

[0129] A person of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment method can be completed by instructing the relevant hardware through a computer program, and the program can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, the storage medium can be a disk, an optical disk, a read-only memory (ROM) or a random access memory (RAM), etc. In the present application, the unit described as a separate component may or may not be physically separated, and the component displayed as a unit may or may not be a physical unit, that is, it may be located in one place, or it may be distributed on multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment of the present invention. In addition, each functional unit in each embodiment of the present invention can be integrated in a processing unit, or each unit can exist physically separately, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of a software functional unit.

[0130] Although the present invention is disclosed as above, the protection scope of the present invention is not limited thereto. Those skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications will fall within the protection scope of the present invention.

Claims

1. A method for thermal simulation of a printed circuit board, used for thermal simulation of a printed circuit board in an electronic device, characterized in that: include: Building an electronic device geometric model, dividing the electronic device geometric model into a plurality of tetrahedral units, obtaining an electronic device mesh model, and setting material parameters of the electronic device mesh model; Performing rasterization processing on the pre-established geometric model of the printed circuit board to generate a rasterized model of the printed circuit board to obtain a plurality of raster sub-units, and calculating equivalent material parameters of each of the raster sub-units according to actual circuit data of the printed circuit board; Screening out a plurality of first tetrahedral units in the electronic device mesh model, wherein the plurality of first tetrahedral units are tetrahedral units used to constitute a printed circuit board in the electronic device mesh model; Mapping the first tetrahedral unit to a corresponding position in the gridded model, and obtaining an equivalent material parameter of each of the first tetrahedral units based on an equivalent material parameter of each of the grid subunits; Updating material parameters of a printed circuit board in the electronic device mesh model based on equivalent material parameters of the first tetrahedral unit; The updated electronic device grid model is subjected to thermal simulation processing to obtain a thermal simulation result of the electronic device, and a temperature distribution diagram of the printed circuit board is drawn according to the thermal simulation result of the electronic device.

2. The printed circuit board thermal simulation processing method according to claim 1, characterized in that: The material parameters include thermal conductivity, specific heat capacity and density, and the equivalent material parameters include equivalent thermal conductivity, equivalent specific heat capacity and equivalent density.

3. The printed circuit board thermal simulation processing method according to claim 2, characterized in that: The step of calculating the equivalent material parameters of each grid subunit according to the actual circuit data of the printed circuit board comprises: Acquire actual circuit data of the printed circuit board, the actual circuit data including distribution data of metal materials and non-metal materials in the printed circuit board, and determine the metal content of each grid subunit according to the actual circuit data of the printed circuit board; Determining the equivalent density of each of the grid subunits according to the density of the metal material, the density of the non-metal material and the metal content of each of the grid subunits; Determining the equivalent specific heat capacity of each of the grid subunits according to the specific heat capacity of the metal material, the specific heat capacity of the non-metal material and the metal content of each of the grid subunits; The equivalent thermal conductivity of each of the grid subunits is determined according to the thermal conductivity of the metal material, the thermal conductivity of the non-metal material and the metal content of each of the grid subunits.

4. The printed circuit board thermal simulation processing method according to claim 1, characterized in that: The step of screening out a plurality of first tetrahedral units in the electronic device mesh model: Determining a geometric boundary of a printed circuit board in a mesh model of the electronic device according to design information of the electronic device; Traversing the tetrahedral units in the electronic device mesh model to determine whether the geometric center of the tetrahedral unit is located within the geometric boundary of the printed circuit board; The tetrahedral element whose geometric center is located within the geometric boundary of the printed circuit board is marked as the first tetrahedral element.

5. The printed circuit board thermal simulation processing method according to claim 1, characterized in that: Mapping the first tetrahedral unit to a corresponding position in the gridded model, and obtaining the equivalent material parameter of each of the first tetrahedral units based on the equivalent material parameter of each of the grid subunits includes: Discretize the first tetrahedral unit to obtain a plurality of first tetrahedral subunits; Mapping the first tetrahedral subunit to a corresponding position in the grid model to determine an equivalent mapping pair, wherein the equivalent mapping pair is used to characterize a corresponding relationship between the first tetrahedral subunit and the grid subunit; Based on the equivalent material parameters of each of the grid sub-units, determining the equivalent material parameters of each of the first tetrahedral sub-units according to the equivalent mapping pair; The equivalent material parameter of the first tetrahedral unit is obtained based on the equivalent material parameters of the plurality of the first tetrahedral subunits.

6. The printed circuit board thermal simulation processing method according to claim 5, characterized in that: Determining the equivalent material parameters of each of the first tetrahedral subunits according to the equivalent mapping pair comprises: The corresponding grid subunit is found according to the position of the center point of the first tetrahedral subunit, and the equivalent material parameters of the corresponding grid subunit are used as the equivalent material parameters of the first tetrahedral subunit.

7. The printed circuit board thermal simulation processing method according to claim 5, characterized in that: The calculation formula for obtaining the equivalent material parameters of the first tetrahedral unit based on the equivalent material parameters of the plurality of the first tetrahedral subunits is: Wherein, p represents the density of the first tetrahedral unit, k represents the thermal conductivity of the first tetrahedral unit, c represents the specific heat capacity of the first tetrahedral subunit, V sum represents the volume of the first tetrahedral unit, p i represents the density of the ith tetrahedral subunit, k i represents the thermal conductivity of the ith tetrahedral subunit, c i represents the specific heat capacity of the thermal conductivity of the i-th tetrahedral subunit, V i represents the volume of the i-th first tetrahedral subunit, and n represents the number of tetrahedral subunits contained in the tetrahedral unit.

8. A printed circuit board thermal simulation processing device, used to execute the printed circuit board thermal simulation processing method according to any one of claims 1 to 7, characterized in that: include: A mesh model building module is used to build a geometric model of an electronic device, divide the geometric model of the electronic device into a plurality of tetrahedral units, obtain a mesh model of the electronic device, and set material parameters of the mesh model of the electronic device; A grid model building module is used to grid the pre-established geometric model of the printed circuit board to obtain a plurality of grid sub-units, and calculate the equivalent material parameters of each of the grid sub-units according to the actual circuit data of the printed circuit board; A screening module, used for screening out a plurality of first tetrahedral units in the electronic device mesh model, wherein the plurality of first tetrahedral units are tetrahedral units used for constituting a printed circuit board in the electronic device mesh model; A mapping module, used for mapping the first tetrahedral unit to a corresponding position in the gridded model, and obtaining an equivalent material parameter of each of the first tetrahedral units based on an equivalent material parameter of each of the grid subunits; An updating module, configured to update material parameters of a printed circuit board region in the electronic device mesh model based on equivalent material parameters of the first tetrahedral unit; The thermal simulation module is used to perform thermal simulation processing on the updated electronic device grid model to obtain the electronic device thermal simulation result, and draw a temperature distribution diagram of the printed circuit board according to the electronic device thermal simulation result.

9. An electronic device, characterized in that: including memory and processor; The memory is used to store computer programs; The processor is used to implement the printed circuit board thermal simulation processing method according to any one of claims 1 to 7 when executing the computer program.

10. A computer-readable storage medium, characterized in that: The storage medium stores a computer program, and when the computer program is executed by the processor, the printed circuit board thermal simulation processing method according to any one of claims 1 to 7 is implemented.

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