A Method and System for Automatically Checking the Network of Electroplated Gold Data in CAM

Abstract

The present invention provides a method and system for automatically checking the electroplated gold data network. Through the functions of "coordinate point selection" and "graphic overlap comparison", it can automatically and accurately identify and process multi-layer network overlap and touch, improve the accuracy of inspection, and reduce errors and defects. Compared with manual inspection, the present invention realizes automation and greatly shortens the inspection time. The system includes an inspection execution unit, a record display unit, a graphic viewing and modification unit, and an error linking unit, which simplifies the process, provides detailed records, intuitively displays the error location and supports instant modification, quickly locates problems through error linking, reduces rework, and improves the user experience. Overall, the system integrates multiple functional units, realizes the automation and intelligence of the inspection process, reduces manual intervention, ensures the accuracy and consistency of inspection, and provides an efficient and reliable solution for the inspection of electroplated gold data network.

Description

Technical Field

[0001] The present invention relates to the field of circuit board data optimization, and specifically relates to a method and system for automatically checking the network of electroplated gold data in CAM. Background Art

[0002] In the electronic manufacturing industry, the production process of printed circuit boards (PCBs) is inseparable from the processing of CAM (Computer-Aided Manufacturing) data.

[0003] Chinese Patent Publication No. CN106529070B discloses a method and system for automatically processing circuit board CAM data, which realizes a series of processes such as preprocessing, uploading, automatic processing, packaging and output of CAM data, and importing and displaying of the working space; this method automatically completes the processing of CAM data according to the configuration file by the server, and provides the packaging and output of processing logs and processing results, greatly improving the efficiency and accuracy of circuit board production. However, when processing the network of electroplated gold data, the above method may not comprehensively and accurately check the complex relationship between the electroplated gold layer network, the solder mask opening layer network and the circuit layer network, which may lead to errors and defects in production.

[0004] In addition, the existing automatic processing systems for circuit board CAM data also have certain limitations in terms of user interface and interactivity. For example, when users need to check and process errors, they may need to manually search for and locate the error positions, which not only increases the workload and time cost, but also may reduce the accuracy and efficiency of processing.

[0005] Therefore, in order to overcome the deficiencies of the prior art, the present invention proposes a new method and system for automatically checking the network of electroplated gold data in CAM, aiming to more comprehensively and accurately check and process the complex relationship in the electroplated gold data network, and provide a more intuitive and convenient user interface and interaction experience. Summary of the Invention

[0006] The present invention overcomes the above-mentioned deficiencies in the art and provides a method and system for automatically checking the network of electroplated gold data in CAM.

[0007] To achieve the above object, the present invention adopts the following technical solutions:

[0008] The first aspect of the embodiment of the present invention discloses a method for automatically checking the network of electroplated gold data in CAM, including the following steps:

[0009] S1. Design the circuit pattern of the substrate according to customer requirements, and this circuit pattern is divided into a solder mask opening layer network, an electroplated gold layer network and a circuit layer network;

[0010] S2. Pull leads from the substrate circuit pattern to a pre-set copper foil pattern at the board edge to achieve electrical conduction;

[0011] S3. After conductivity, select any coordinate point in the substrate circuit pattern, and use the "Coordinate Point Selection of Objects in the Same Network" function to select and determine the large copper foil object pattern in the circuit layer network that contains this coordinate point and belongs to the same network.

[0012] S4. Use the "Graphic Overlap Comparison Command touch" function to identify and select the electroplated gold layer object patterns where the solder mask opening layer network touches the electroplated gold layer network.

[0013] S5. Again use the "Graphic Overlap Comparison Command touch" function to overlap and compare the large copper foil object pattern of the circuit layer network selected in step S3 with the electroplated gold layer object pattern selected in step S4.

[0014] S6. Use the inverse selection function to filter out the graphic objects in the circuit layer network that are not touched by the object patterns of the electroplated gold layer network.

[0015] S7. Determine the number of the filtered graphic objects that are not touched. If the selected number is greater than 0, an error is prompted, and the graphic objects are picked out to the error layer; if the selected number is 0, it is prompted that the inspection is passed.

[0016] Preferably, in step S3, "After conductivity, select any coordinate point in the substrate circuit pattern, and use the 'Coordinate Point Selection of Objects in the Same Network' function to select and determine the large copper foil object pattern of the circuit layer network to which this coordinate point belongs in the same network" includes:

[0017] S31. After selecting any coordinate point in the substrate circuit pattern after conductivity, use the "Coordinate Point Selection of Objects in the Same Network" function to select and determine the circuit layer network to which this coordinate point belongs in the same network.

[0018] S32. Select all the object patterns of the circuit layer network to which this coordinate point belongs in the same network.

[0019] S33. Determine whether the number of the selected object patterns is greater than or equal to the preset value M. If the number of the selected object patterns is less than the preset value M, repeat step S31; if the number of the selected object patterns is greater than or equal to the preset value M, it is determined that the selected is the large copper foil object pattern, and proceed to the next step.

[0020] Preferably, the preset value M is 150.

[0021] Preferably, in step S7, "Determine the number of the filtered graphic objects that are not touched. If the selected number is greater than 0, an error is prompted;" includes:

[0022] S71. Determine the number of un-touched graphic objects selected. If the selected number is greater than 0, pick out the selected graphic objects to the error layer; and use a prompt window to display the error quantity and link to report the error layer address.

[0023] S72. Click on the reported error layer address to jump to the error location and modify the position of the wrong circuit pattern.

[0024] S73. Re-execute the steps of S2 - S7 until there is no error.

[0025] Preferably, the implementation method of the function of "coordinate point selection of the same network object" in step S3 is as follows:

[0026] Taking the lower left corner of the circuit pattern on the substrate as the scanning starting point and the lower right corner as the scanning end point, scan according to the linear relationship y = kx + b, where the slope k changes cyclically with a preset step size to traverse and select all object patterns of the circuit layer network to which any given coordinate point belongs.

[0027] Preferably, the preset step size value is the increment of the slope k, and the increment of the slope k is set to 0.1.

[0028] The second aspect of the embodiment of the present invention discloses a CAM automatic inspection system for electroplated gold data network, including:

[0029] Applying the CAM automatic inspection method for electroplated gold data network described in the first aspect, it includes:

[0030] An inspection execution unit 1, configured to execute corresponding inspection operations according to the function buttons selected by the user's click.

[0031] An inspection record display unit 2, configured to provide the user with the records after inspection.

[0032] A graphic viewing and modification unit 3, configured to visually view the graphic error location and modify the error.

[0033] An error link unit 4, configured to automatically jump to the corresponding error location in the graphic viewing and modification unit 3.

[0034] Preferably, the inspection record display unit 2 includes: an inspection item display subunit 21, an inspection result display subunit 22, and an inspection time-consuming display subunit 23. The inspection result display subunit 22 includes a quantity parameter for displaying errors and a link address corresponding to the errors.

[0035] Preferably, the graphic viewing and modification unit 3 includes: an all-layers subunit 31 for viewing and modifying the circuit patterns of the entire substrate, and an error layer subunit 32 for viewing and modifying the circuit patterns of the error layer.

[0036] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0037] 1. In the first embodiment of the present invention, through the functions of "coordinate point selection of the same network object" and "graphic overlap comparison command touch", the overlapping and touching relationships between the solder mask opening layer network, the electroplated gold layer network, and the circuit layer network can be automatically and accurately identified and processed, greatly improving the accuracy of inspection and reducing errors and defects in the production process, such as missing lines and broken lines. Moreover, compared with the traditional manual inspection method, the present invention realizes automated inspection, greatly shortening the inspection time. In addition, through the error prompt and link function, users can quickly locate and correct errors, improving work efficiency and user satisfaction.

[0038] 2. In the second embodiment of the present invention as described above, through the inspection execution unit, users can select corresponding function buttons according to their needs to perform inspection operations, which greatly simplifies the inspection process and improves work efficiency. Through the settings of the inspection record display unit and its various sub-units, detailed inspection records are provided, including inspection items, inspection results, and inspection time consumption, enabling users to understand the inspection situation more comprehensively. Through the graphic viewing and modification unit, users are allowed to visually view the graphic error location and directly modify it, which helps to quickly locate and correct errors and reduce rework time. Through the error link unit, it can automatically jump to the corresponding error location in the graphic viewing and modification unit 3, which simplifies the error handling process and enhances the user experience. In summary, the entire system realizes the automation and intelligence of the inspection process by integrating multiple functional units, reduces manual intervention, and improves the accuracy and consistency of inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0040] Figure 1 It is a schematic logical flow diagram of a method for automatically inspecting the electroplated gold data network in the first embodiment of the present invention;

[0041] Figure 2 It is a schematic structural block diagram disclosed in the second embodiment of the present invention. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0042] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0043] It should be noted that the terms "first", "second", "third", "fourth", etc. in the description and claims of the present invention are used to distinguish different objects, rather than to describe a specific order. The terms "including" and "having" in the embodiments of the present invention and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that includes a series of steps or units does not necessarily limit to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0044] The embodiments of the present invention disclose a method for automatically inspecting the network of electroplated gold data in CAM, which can simplify the construction process of identification and improve the identification efficiency, and is also conducive to the precise optimization of the identification method in the later stage.

[0045] Embodiment 1

[0046] Please refer to Figure 1 , Figure 1 which is a method for automatically inspecting the network of electroplated gold data in CAM disclosed in Embodiment 1 of the present invention, and includes the following steps:

[0047] S1. Design the circuit pattern of the substrate according to customer requirements. The circuit pattern is divided into a solder mask opening layer network, an electroplated gold layer network, and a circuit layer network;

[0048] S2. Pull a lead from the substrate circuit pattern to a pre-set copper pattern at the board edge to achieve conductivity;

[0049] S3. After conductivity, select any coordinate point in the substrate circuit pattern, and use the "function of selecting the same network object by coordinate point" to select and determine the large copper object pattern in the circuit layer network that contains this coordinate point and belongs to the same network;

[0050] S4. Use the "function of graphic overlap comparison command touch" to identify and select the electroplated gold object pattern where the solder mask opening layer network touches the electroplated gold layer network;

[0051] S5. Use the "function of graphic overlap comparison command touch" again to perform an overlap comparison between the large copper object pattern of the circuit layer network selected in step S3 and the electroplated gold object pattern selected in step S4;

[0052] S6. Use the inverse selection function to filter out the graphic objects in the line layer network that are not touched by the graphic objects in the electroplated gold layer network;

[0053] S7. Determine the number of the filtered graphic objects that are not touched. If the selected number is greater than 0, an error is prompted; if the selected number is 0, it is prompted that the inspection passes.

[0054] As described above, through the functions of "selecting objects of the same network by coordinate points" and "graphic overlap comparison command touch", the present invention can automatically and accurately identify and process the overlap and touch relationships among the solder mask opening layer network, the electroplated gold layer network, and the line layer network, greatly improving the accuracy of inspection and reducing errors and defects such as missing lines and broken lines in the production process. Moreover, compared with the traditional manual inspection method, the present invention realizes automatic inspection, greatly shortening the inspection time. In addition, through the error prompt and link function, users can quickly locate and modify errors, improving work efficiency and user satisfaction.

[0055] As a preferred implementation manner, in step S3, "after conducting electricity, select any coordinate point in the substrate line pattern, and use the function of'selecting objects of the same network by coordinate points' to select and determine the large copper foil object pattern of the line layer network to which the coordinate point belongs" includes:

[0056] S31. After selecting any coordinate point in the substrate line pattern after conducting electricity, use the function of "selecting objects of the same network by coordinate points" to select and determine the line layer network to which the coordinate point belongs;

[0057] S32. Select all the object patterns of the line layer network to which the coordinate point belongs;

[0058] S33. Determine whether the number of the selected object patterns is greater than or equal to the preset value M. If the number of the selected object patterns is less than the preset value M, repeat step S31; if the number of the selected object patterns is greater than or equal to the preset value M, it is determined that the selected one is the large copper foil object pattern, and proceed to the next step. Specifically, in implementation, the large copper foil object pattern refers to the copper part that occupies a large area or has a significant size in the printed circuit board (PCB) design.

[0059] As described above, through the function of "selecting the same network object by coordinate points", the line layer network of the same network can be automatically and accurately selected and determined, avoiding the errors of manual selection. By determining whether the number of object graphics is greater than or equal to the preset value M, it can be ensured that the selected object graphics are large copper clad object graphics, improving the recognition accuracy. In addition, when the number of selected object graphics does not meet the preset value, step S31 can be automatically repeated until a large copper clad object graphic that meets the conditions is found, improving the overall processing efficiency. Moreover, the method of the present invention can be applied to different types of substrate circuit patterns, and only the preset value M needs to be adjusted according to specific situations, having strong adaptability and flexibility.

[0060] As a preferred embodiment, the preset value M is 150. In this way, the preset value M is set to 150, which is obtained based on the experience of most data graphics or industry standards. In the inspection of the electroplated gold data network, by setting 150 as a reasonable threshold, it can be ensured that the inspection process can accurately reflect the actual situation and meet the needs of customers.

[0061] As a preferred embodiment, in step S7, "judging the number of un-touched graphic objects screened out, if the selected number is greater than 0, then prompting an error;" includes:

[0062] S71. Judging the number of un-touched graphic objects screened out, if the selected number is greater than 0, picking out the selected graphic objects to the error reporting layer; and using a prompt window to display the error number and link to report the error reporting layer address;

[0063] S72. Clicking on the error reporting layer address linked to jump to the error location and modifying the position of the incorrect circuit graphic;

[0064] S73. Re-executing steps S2 - S7 until there is no error.

[0065] As described above, in this case, by automatically detecting un-touched or non-overlapping graphic objects, it can comprehensively check that all graphic objects are correctly processed, thereby reducing the possibility of human errors. Specifically, through the settings of S71 and step S72, users can directly jump to the error location through the link for modification, without manual searching or scrolling, greatly saving time and effort; and the clear prompt window and link function make the error detection and correction process more intuitive and easy to understand, improving the user experience. In addition, by directly picking out the un-touched graphic objects and placing them on the error reporting layer, the inspection personnel can quickly locate the potential problem areas without checking one by one in the complex circuit graphics, greatly shortening the error identification time and improving the overall inspection efficiency.

[0066] As a preferred embodiment, the function of "selecting the same network object for coordinate points" in step S3 is as follows: taking the lower left corner of the circuit pattern on the substrate as the starting point of scanning and the lower right corner point as the ending point of scanning, scanning is performed according to the linear relationship of y = kx + b, where the slope k cyclically changes with a preset step value, so as to traverse and select all object patterns of the circuit layer network to which any given coordinate point belongs.

[0067] As described above, in this case, by setting the starting point and ending point of scanning, with the lower left corner of the circuit pattern on the substrate as the starting point and the lower right corner as the ending point, the effective coverage of the entire specified area, that is, the entire substrate strip, is ensured. By scanning according to the linear relationship of y = kx + b and combining the way that the slope k cyclically changes with a preset step value, it is convenient to traverse the entire scanning area, so as to accurately select all object patterns of the circuit layer network to which any given coordinate point belongs, greatly improving the efficiency. The cyclic change of the slope k enables the method in this case to flexibly adapt to circuit patterns of different sizes, ensuring that all relevant graphic objects are selected without omission. The setting of the preset step value also provides control over the scanning accuracy, and the user can adjust the step value according to actual needs to achieve the best scanning effect. In addition, through the combination of linear scanning and slope change, this function can accurately locate any given coordinate point and accurately select all object patterns of the circuit layer network to which this point belongs, thereby ensuring the quality and reliability of the product.

[0068] Among them, the preset step value is the increment of the slope k, and the increment of the slope k is set to 0.1; in specific implementation, taking the lower left corner of the strip of the circuit pattern on the substrate as the starting point and the lower right corner point as the ending point of scanning, according to the linear relationship of y = kx + b, k cyclically obtains coordinates in the way of 0.1, so as to select the same network object for any coordinate point. In this way, the setting that the increment of the slope k is set to 0.1 makes the slope k change with a smaller step, which helps to traverse the scanning area more carefully, so as to more accurately select the object patterns belonging to the same network as the given coordinate point, and can improve the scanning accuracy.

[0069] As a preferred embodiment, all object patterns of the solder mask opening layer network and all objects of the electroplated gold layer network in step S4 are data patterns of the original materials provided by the customer. In this way, during the use and maintenance of the circuit board, it may be necessary to replace or repair some of the objects. Using the original material data patterns provided by the customer for design and manufacturing can ensure that these objects can be accurately identified and located during subsequent maintenance. This helps to reduce the maintenance cost and time, and improve the reliability and service life of the circuit board.

[0070] Embodiment 2

[0071] As shown in Figure 2 the figure, a system for automatically checking the network of electroplated gold data in CAM applies the method for automatically checking the network of electroplated gold data in CAM described in Embodiment 1, and includes:

[0072] An inspection execution unit 1, configured to execute a corresponding inspection operation according to a function button selected by a user click;

[0073] An inspection record display unit 2, configured to provide the user with the record after inspection;

[0074] A graphic viewing and modification unit 3, configured to visually view the position of a graphic error and modify the error;

[0075] An error link unit 4, configured to automatically jump to the corresponding error position in the graphic viewing and modification unit 3.

[0076] As a preferred implementation manner, the inspection record display unit 2 includes: an inspection item display subunit 21, an inspection result display subunit 22, and an inspection time consumption display subunit 23. The inspection result display subunit 22 includes a quantity parameter of displayed errors and a link address corresponding to the errors.

[0077] As described above, through the inspection execution unit 1, the user can select a corresponding function button according to requirements to execute the inspection operation, which greatly simplifies the inspection process and improves work efficiency. Through the setting of the inspection record display unit 2 and its respective subunits, detailed inspection records are provided, including inspection items, inspection results, and inspection time consumption, enabling the user to more comprehensively understand the inspection situation. Through the graphic viewing and modification unit 3, the user is allowed to visually view the position of the graphic error and directly modify it, which helps to quickly locate and correct errors and reduce rework time. Through the error link unit 4, it is possible to automatically jump to the corresponding error position in the graphic viewing and modification unit 3, and this function simplifies the error handling process and improves the user experience. In summary, the entire system realizes the automation and intelligence of the inspection process by integrating multiple functional units, reduces manual intervention, and improves the accuracy and consistency of the inspection.

[0078] As a preferred implementation, the graphic viewing and modification unit 3 includes: all layer sub-units 31 for viewing and modifying the circuit patterns of the entire substrate, and an error layer sub-unit 32 for viewing and modifying the circuit patterns of the error layer. In this way, through the setting of all layer sub-units 21, the user is allowed to comprehensively view and modify the circuit patterns of the substrate. Whether it is the solder mask opening layer, the electroplated gold layer or the circuit layer, operations can be performed on the same interface without frequent switching between different layers, improving work efficiency. Through the setting of the error layer sub-unit 22, the error graphic objects are clearly isolated and displayed, and only the graphics of the error layer can be viewed and modified, enabling the user to quickly locate and solve the error, avoiding getting lost in the complex multi-layer circuit patterns, reducing the operation difficulty, and further improving work efficiency.

[0079] The above has introduced in detail a method and system for automatically checking the electroplated gold data network in a CAM of the present invention. Specific examples are used in this article to elaborate on the principle and implementation of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A method for automatically checking the network of electroplated gold data in CAM, characterized in that It includes the following steps: S1. Design the circuit pattern of the substrate according to customer requirements. The circuit pattern is divided into a solder mask opening layer network, an electroplated gold layer network, and a circuit layer network; S2. Pull leads from the substrate circuit pattern to a pre-set copper pad pattern on the board edge to achieve electrical conduction; S3. After electrical conduction, select any coordinate point in the substrate circuit pattern, and use the "coordinate point selection of objects in the same network" function to select and determine the large copper pad object pattern in the circuit layer network that contains this coordinate point and belongs to the same network; S4. Use the "graphic overlap comparison command touch" function to identify and select the electroplated gold layer object patterns where the solder mask opening layer network touches the electroplated gold layer network; S5. Use the "graphic overlap comparison command touch" function again to perform an overlap comparison between the large copper pad object pattern of the circuit layer network selected in step S3 and the electroplated gold layer object pattern selected in step S4; S6. Use the inverse selection function to filter out the graphic objects in the circuit layer network that are not touched by the object patterns of the electroplated gold layer network; S7. Judge the number of the filtered graphic objects that are not touched. If the selected number is greater than 0, prompt an error and pick out the graphic objects to the error layer; if the selected number is 0, prompt that the inspection is passed; Among them, "After electrical conduction, select any coordinate point in the substrate circuit pattern, and use the 'coordinate point selection of objects in the same network' function to select and determine the large copper pad object pattern of the circuit layer network to which this coordinate point belongs" in step S3 includes: S31. After selecting any coordinate point in the substrate circuit pattern after electrical conduction, use the "coordinate point selection of objects in the same network" function to select and determine the circuit layer network to which this coordinate point belongs; S32. Select all the object patterns of the circuit layer network to which this coordinate point belongs; S33. Determine whether the number of the selected object patterns is greater than or equal to the preset value M. If the number of the selected object patterns is less than the preset value M, repeat step S31; if the number of the selected object patterns is greater than or equal to the preset value M, determine that the selected one is the large copper pad object pattern and proceed to the next step; The implementation method of the "coordinate point selection of objects in the same network" function in step S3 is: Taking the lower left corner of the circuit pattern of the substrate as the scanning starting point and the lower right corner as the scanning end point, perform scanning according to the linear relationship y = kx + b, where the slope k changes cyclically with a preset step size to traverse and select all the object patterns of the circuit layer network to which any given coordinate point belongs.

2. The method for CAM automated inspection of electroplated gold data network according to claim 1, wherein The preset value M is 150.

3. The method for CAM automated inspection of electroplated gold data network according to claim 1, characterized in that "Judge the number of the filtered graphic objects that are not touched. If the selected number is greater than 0, prompt an error;" in step S7 includes: S71. Judge the number of the filtered graphic objects that are not touched. If the selected number is greater than 0, pick out the selected graphic objects to the error layer; and use a prompt window to display the error number and link to the error layer address; S72. Click on the linked error layer address to jump to the error location and modify the position of the incorrect circuit pattern; S73. Re-execute steps S2 - S7 until there is no error.

4. The method for CAM automated inspection of electroplated gold data network according to claim 1, wherein The preset step size value is the increment of the slope k, and the increment of the slope k is set to 0.

1.

5. A system for automatically checking the network of electroplated gold data in CAM, characterized in that, Applying the method of the CAM automated inspection electroplated gold data network according to any one of claims 1-4, which includes: An inspection execution unit (1) for performing a corresponding inspection operation according to the function button selected by the user's click; An inspection record display unit (2) for providing the user with the record after inspection; A graphic viewing and modification unit (3) for visually viewing the graphic error location and modifying the error; An error link unit (4) for automatically jumping to the corresponding error location in the graphic viewing and modification unit (3).

6. The CAM automated inspection system for the electroplated gold data network according to claim 5, wherein The inspection record display unit (2) includes: an inspection item display subunit (21), an inspection result display subunit (22), and an inspection time consumption display subunit (23). The inspection result display subunit (22) includes a quantity parameter for displaying the number of errors and a link address corresponding to the error.

7. The system for CAM automated inspection of the electroplated with gold data network according to claim 5, wherein The graphic viewing and modification unit (3) includes: an all-layers subunit (31) for viewing and modifying the circuit pattern of the entire substrate, and an error layer subunit (32) for viewing and modifying the circuit pattern of the error-reported layer.

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