Laminated through capacitor

Abstract

A stacked through capacitor includes an element body, a pair of first external electrodes, a second external electrode, and a plurality of internal electrodes. The plurality of internal electrodes includes at least one first internal electrode connected to the pair of first external electrodes, at least one second internal electrode connected to the pair of first external electrodes, and at least one third internal electrode connected to the second external electrode. The element body includes a first region in which at least one first internal electrode and at least one third internal electrode are disposed facing each other, and a second region in which at least one second internal electrode is disposed. The at least one first internal electrode is connected to the pair of first external electrodes at a first connection width, respectively, and the at least one second internal electrode is connected to the pair of first external electrodes at a second connection width, respectively, which is larger than the first connection width.

Description

Technical Field

[0001] The present disclosure relates to a stacked feedthrough capacitor. Background Art

[0002] A known multilayer feedthrough capacitor includes an element body, a pair of first external electrodes disposed on the element body in a manner separated from each other, a second external electrode disposed on the element body in a manner separated from the pair of first external electrodes, and a plurality of internal electrodes disposed in the element body (for example, see Japanese Patent Application Publication No. 2018-67562). The plurality of internal electrodes include an internal electrode connected to the pair of first external electrodes and an internal electrode opposed to the internal electrode and connected to the second external electrode. Summary of the invention

[0003] An object of one aspect of the present disclosure is to provide a multilayer feedthrough capacitor having reduced direct current resistance and suppressed reliability degradation.

[0004] A stacked feedthrough capacitor of one embodiment of the present disclosure includes: a body; a pair of first external electrodes, which are arranged on the body separately from each other; a second external electrode, which is arranged on the body separately from the pair of first external electrodes; and a plurality of internal electrodes, which are arranged in the body. The plurality of internal electrodes include at least one first internal electrode connected to the pair of first external electrodes, at least one second internal electrode connected to the pair of first external electrodes, and at least one third internal electrode connected to the second external electrode. The body includes: a first region, in which at least one first internal electrode and at least one third internal electrode are arranged opposite to each other; and a second region, in which at least one second internal electrode is arranged. At least one first internal electrode is connected to the pair of first external electrodes with a first connection width, respectively. At least one second internal electrode is connected to the pair of first external electrodes with a second connection width, respectively, which is larger than the first connection width.

[0005] In the above embodiment, the at least one second internal electrode is connected to a pair of first external electrodes separately from the at least one first internal electrode. The at least one second internal electrode is arranged in a second region different from a first region in which the at least one first internal electrode and the at least one third internal electrode are arranged opposite to each other. Therefore, the at least one second internal electrode contributes to a reduction in DC resistance.

[0006] In the above-mentioned embodiment, the second connection width is greater than the first connection width. That is, the connection length between each of the first external electrodes and the at least one second internal electrode is greater than the connection length between each of the first external electrodes and the at least one first internal electrode. Therefore, current easily flows to the at least one second internal electrode. The at least one second internal electrode further contributes to the reduction of DC resistance.

[0007] As a result, the above-mentioned method reduces the DC resistance.

[0008] In electronic parts, not limited to stacked feedthrough capacitors, there is a tendency that the external electrode includes a plating layer and a base layer for forming the plating layer in order to improve the mounting performance. The plating layer is formed, for example, by an electrolytic plating method. In the case where the plating layer is formed by an electrolytic plating method, the plating solution reaches the interface between the base layer and the element body, and then may penetrate into the element body. The penetration of the plating solution into the element body may reduce the reliability of the electronic parts. The penetration path of the plating solution into the element body includes, for example, the connection end of the internal electrode with the external electrode and the interface with the element body.

[0009] In the above-mentioned embodiment, the second connection width is larger than the first connection width, that is, the first connection width is smaller than the second connection width. The length of the connection end of the at least one first internal electrode with each of the pair of first external electrodes is smaller than the length of the connection end of the at least one second internal electrode with each of the pair of first external electrodes. Therefore, it is difficult for the plating liquid to penetrate into the element body from the interface between the connection end of the at least one first internal electrode and the element body. As a result, the above-mentioned embodiment suppresses the reduction of reliability.

[0010] In one embodiment, the plurality of internal electrodes may include at least one fourth internal electrode connected to a pair of first external electrodes, and at least one fifth internal electrode connected to a second external electrode. The element body may include a third region in which at least one fourth internal electrode and at least one fifth internal electrode are arranged opposite to each other. The at least one fourth internal electrode may also be connected to a pair of first external electrodes with a third connection width smaller than the second connection width. The second region may also be located between the first region and the third region.

[0011] In a structure in which the third connection width is smaller than the second connection width, that is, the second connection width is larger than the third connection width, the connection length between each of the first external electrodes and the at least one second internal electrode is larger than the connection length between each of the first external electrodes and the at least one fourth internal electrode. Therefore, current easily flows to the at least one second internal electrode. The at least one second internal electrode further contributes to the reduction of DC resistance. As a result, this structure further reduces DC resistance.

[0012] In the structure in which the third connection width is smaller than the second connection width, the length of the connection end of the at least one fourth internal electrode to each of the pair of first external electrodes is smaller than the length of the connection end of the at least one second internal electrode to each of the pair of first external electrodes. Therefore, it is difficult for the plating liquid to penetrate into the element body from the interface between the connection end of the at least one fourth internal electrode and the element body. As a result, this structure suppresses the reduction of reliability.

[0013] The element body may have a curved shape or a chamfered shape at the edge of the element body. In this case, the thickness of the base layer tends to be smaller at the edge of the element body. In a structure with a small thickness of the base layer, the plating solution easily passes through the base layer and reaches the interface between the base layer and the element body. Therefore, the interface between the connection end of the internal electrode with the external electrode and the element body near the edge of the element body tends to be more easily penetrated by the plating solution than the interface between the connection end of the internal electrode with the external electrode and the element body far from the edge of the element body.

[0014] In the structure where the second region is located between the first region and the third region, the first region and the third region tend to be closer to the edge of the element body than the second region. That is, the plating liquid may easily penetrate into the first region and the third region than the second region. However, in the structure where the first connection width is smaller than the second connection width, and the third connection width is smaller than the second connection width, as described above, it is difficult for the plating liquid to penetrate into the element body. Therefore, even in the structure where the second region is located between the first region and the third region, the reduction in reliability can be suppressed.

[0015] In the above aspect, the at least one fourth inner electrode may include an electrode region which is opposed to the at least one fifth inner electrode and has a width larger than the third connection width.

[0016] The structure in which the at least one fourth internal electrode includes the electrode region tends to increase the facing area of ​​the at least one fourth internal electrode and the at least one fifth internal electrode, and thus, this structure can increase the electrostatic capacitance.

[0017] In the above aspect, the at least one second inner electrode may include a plurality of second inner electrodes opposed to each other at a spacing smaller than a spacing between the at least one fourth inner electrode and the at least one fifth inner electrode.

[0018] The structure in which the plurality of second inner electrodes are opposed to each other at intervals smaller than the intervals between the at least one fourth inner electrode and the at least one fifth inner electrode can increase the number of second inner electrodes arranged in the second region. Therefore, this structure can further reduce the DC resistance.

[0019] The structure in which the plurality of second internal electrodes are opposed to each other at a smaller interval than the interval between the at least one fourth internal electrode and the at least one fifth internal electrode can increase the interval between the at least one fourth internal electrode and the at least one fifth internal electrode. Therefore, the structure suppresses short circuit between the at least one fourth internal electrode and the at least one fifth internal electrode.

[0020] In the above aspect, the at least one first internal electrode may include an electrode region which is opposed to the at least one third internal electrode and has a width larger than the first connection width.

[0021] The structure in which the at least one first internal electrode includes the electrode region tends to increase the facing area of ​​the at least one first internal electrode and the at least one third internal electrode. Therefore, this structure can increase the electrostatic capacitance.

[0022] In the above aspect, the at least one second internal electrode may include a plurality of second internal electrodes opposed to each other at a smaller interval than the interval between the at least one first internal electrode and the at least one third internal electrode.

[0023] The structure in which the plurality of second internal electrodes are opposed to each other at intervals smaller than the intervals between the at least one first internal electrode and the at least one third internal electrode can increase the number of second internal electrodes arranged in the second region. Therefore, this structure can further reduce the DC resistance.

[0024] The structure in which the plurality of second internal electrodes are opposed to each other at a smaller interval than the interval between the at least one first internal electrode and the at least one third internal electrode can increase the interval between the at least one first internal electrode and the at least one third internal electrode. Therefore, the structure suppresses short circuit between the at least one first internal electrode and the at least one third internal electrode.

[0025] In one embodiment, the plurality of internal electrodes may include at least one sixth internal electrode connected to the pair of first external electrodes. The element body may include a fourth region in which the at least one sixth internal electrode is disposed. The at least one sixth internal electrode may also be connected to the pair of first external electrodes with a fourth connection width greater than the first connection width. The first region may also be located between the second region and the fourth region.

[0026] In a structure in which a plurality of internal electrodes include the at least one sixth internal electrode, the at least one sixth internal electrode is connected to a pair of first external electrodes separately from the at least one first internal electrode. The at least one sixth internal electrode is arranged in a fourth region different from the first region in which the at least one first internal electrode and the at least one third internal electrode are arranged opposite to each other. Therefore, the at least one sixth internal electrode contributes to the reduction of the DC resistance. In a structure in which the fourth connection width is greater than the first connection width, the connection length between each of the first external electrodes and the at least one sixth internal electrode is greater than the connection length between each of the first external electrodes and the at least one first internal electrode. Therefore, the current easily flows to the at least one sixth internal electrode. The at least one sixth internal electrode further contributes to the reduction of the DC resistance. As a result, these structures further reduce the DC resistance.

[0027] In a structure where the fourth connection width is larger than the first connection width, that is, the first connection width is smaller than the fourth connection width, the length of the connection end of the at least one first internal electrode to each of the pair of first external electrodes is smaller than the length of the connection end of the at least one sixth internal electrode to each of the pair of first external electrodes. Therefore, it is difficult for the plating liquid to penetrate into the element body from the interface between the connection end of the at least one first internal electrode and the element body. As a result, this structure suppresses a decrease in reliability.

[0028] In the above aspect, the at least one first internal electrode may include a plurality of first internal electrodes having different first connection widths.

[0029] In the structure in which the at least one first internal electrode includes a plurality of first internal electrodes having different first connection widths, the first connection width of each of the plurality of first internal electrodes is smaller than the second connection width. Therefore, it is difficult for the plating liquid to penetrate into the element body from the interface between the connection end of each of the plurality of first internal electrodes and the element body. As a result, this structure still suppresses the reduction of reliability.

[0030] The present disclosure will be more fully understood from the following detailed description and accompanying drawings, which are given by way of illustration only and should not be construed as limiting the present disclosure.

[0031] The further scope of applicability of the present disclosure will become apparent through the following detailed description. However, it should be understood that the detailed description and specific examples, while indicating examples of the present disclosure, are given by way of illustration only, because, based on the detailed description, various variations and modifications within the spirit and scope of the present disclosure will become apparent to those skilled in the art. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 It is a perspective view showing a multilayer feedthrough capacitor according to an embodiment.

[0033] Figure 2 This is an exploded perspective view showing the element body and multiple internal electrodes.

[0034] Figure 3 It is a diagram showing a cross-sectional structure of a multilayer feedthrough capacitor according to the present embodiment.

[0035] Figure 4 It is a diagram showing a cross-sectional structure of a multilayer feedthrough capacitor according to the present embodiment.

[0036] Figure 5 It is a top view showing the internal electrodes.

[0037] Figure 6 It is a top view showing the internal electrodes.

[0038] Figure 7It is a top view showing the internal electrodes.

[0039] Figure 8 It is a top view showing the internal electrodes.

[0040] Fig. 9 It is a top view showing the internal electrodes.

[0041] Fig.10 This is an exploded perspective view showing the element body and multiple internal electrodes.

[0042] Fig.11 It is a top view showing the internal electrodes.

[0043] Fig.12 This is an exploded perspective view showing the element body and multiple internal electrodes.

[0044] Fig.13 This is an exploded perspective view showing the element body and multiple internal electrodes.

[0045] Fig.14 It is a top view showing the internal electrodes.

[0046] Fig.15 It is a top view showing the internal electrodes. DETAILED DESCRIPTION

[0047] Hereinafter, the embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In the following description, the same reference numerals are used for the same elements or elements having the same functions, and repeated descriptions are omitted.

[0048] Reference Figures 1 to 9 , the structure of the multilayer feedthrough capacitor CD1 according to the present embodiment will be described. Figure 1 It is a perspective view showing a multilayer feedthrough capacitor according to the present embodiment. Figure 2 This is an exploded perspective view showing the element body and multiple internal electrodes. Figure 3 and Figure 4 It is a diagram showing a cross-sectional structure of a multilayer feedthrough capacitor according to the present embodiment. Figures 5 to 9 Each of them is a top view showing an internal electrode.

[0049] like Figure 1 to Figure 4 As shown, the multilayer feedthrough capacitor CD1 includes an element body 1, a pair of external electrodes 10, an external electrode 20, and a plurality of internal electrodes 30. The pair of external electrodes 10 are disposed on the element body 1 to be separated from each other. The external electrode 20 is disposed on the element body 1 to be separated from the pair of external electrodes 10. The plurality of internal electrodes 30 are disposed inside the element body 1.

[0050] The element body 1 is in the shape of a rectangular parallelepiped. In the present specification, the rectangular parallelepiped shape includes the shape of a rectangular parallelepiped with chamfered corners and edges, or the shape of a rectangular parallelepiped with rounded corners and edges. The element body 1 includes a pair of end faces 1a facing each other and four side faces 1c connecting the pair of end faces 1a. The outer surface of the element body 1 includes a pair of end faces 1a and four side faces 1c. The pair of end faces 1a and the four side faces 1c are respectively rectangular. In the present specification, the rectangular shape includes, for example, a shape in which each corner is chamfered, or a shape in which each corner is rounded. Figure 1 In the figure, illustration of the plurality of internal electrodes 30 is omitted.

[0051] The element body 1 includes a plurality of dielectric layers 5. Each dielectric layer 5 is stacked along a third direction D3. Each dielectric layer 5 includes a sintered body of a ceramic green sheet containing a dielectric material. The dielectric material includes, for example, a dielectric ceramic containing a BaTiO3 system, a Ba(Ti, Zr)O3 system, or a (Ba, Ca)TiO3 system. Each dielectric layer 5 is integrated to such an extent that the boundaries between the dielectric layers 5 cannot be identified.

[0052] A pair of end faces 1a are opposed to each other in a first direction D1. A pair of side faces 1c among the four side faces 1c are opposed to each other in a second direction D2. Another pair of side faces 1c are opposed to each other in a third direction D3. The four side faces 1c extend along the first direction D1 in a manner connecting the pair of end faces 1a. The first direction D1 intersects with the second direction D2 and intersects with the third direction D3. The second direction D2 intersects with the third direction D3. In the present embodiment, the first direction D1, the second direction D2, and the third direction D3 are orthogonal to each other.

[0053] The length of the element body 1 in the first direction D1 is, for example, 0.8 to 3.4 mm. The length of the element body 1 in the second direction D2 is, for example, 0.3 to 1.8 mm. The length of the element body 1 in the third direction D3 is, for example, 0.3 to 1.8 mm. In the element body 1, for example, the first direction D1 is the long side direction.

[0054] A pair of external electrodes 10 are respectively arranged on the corresponding end face 1a of the pair of end faces 1a and on the four side faces 1c. Each external electrode 10 includes a first electrode portion located on the corresponding end face 1a and a second electrode portion located on a portion of each of the four side faces 1c. The first electrode portion is continuous with the second electrode portion. The second electrode portion covers an area on the side face 1c close to the corresponding end face 1a. The pair of external electrodes 10 includes a signal external electrode.

[0055] The external electrodes 20 are disposed on the pair of side surfaces 1 c. The multilayer feedthrough capacitor CD1 may include a pair of external electrodes 20 . Figure 1The example in which the stacked feedthrough capacitor CD1 includes a pair of external electrodes 20 is shown. The pair of external electrodes 20 are respectively arranged on the corresponding side surfaces 1c of the pair of side surfaces 1c. The pair of external electrodes 20 are, for example, separated from each other and face each other in the second direction D2. The stacked feedthrough capacitor CD1 may also include only one external electrode 20. In this case, the one external electrode 20 is, for example, arranged on any one of the pair of side surfaces 1c. The external electrode 20 includes a grounding external electrode. For example, when the external electrode 10 includes a first external electrode, the external electrode 20 includes a second external electrode.

[0056] like Figure 3 and Figure 4 As shown, the external electrodes 10 and 20 include base layers 10a and 20a. The base layers 10a and 20a include sintered metal layers. The sintered metal layers are formed by applying a conductive paste to the outer surface of the element body 1 and sintering it. The conductive paste contains metal powder, a glass component, an organic binder, and an organic solvent. The metal powder contained in the conductive paste contains, for example, Cu powder or Ni powder. The base layers 10a and 20a include a layer formed by sintering the metal powder contained in the conductive paste. The external electrodes 10 and 20 include at least one plating layer on the base layers 10a and 20a. In the present embodiment, the external electrode 10 includes two plating layers 10b and 10c on the base layer 10a, and the external electrode 20 includes two plating layers 20b and 20c on the base layer 20a. The base layers 10a and 20a include a base layer for forming the plating layers 10b and 20b. The plating layer 10b is located between the base layer 10a and the plating layer 10c. The plating layer 20b is located between the base layer 20a and the plating layer 20c. The plating layers 10b and 20b include, for example, a Ni plating layer. The plating layers 10b and 20b may also include a Sn plating layer, a Cu plating layer, or an Au plating layer instead of the Ni plating layer. The plating layers 10c and 20c include a solder plating layer. The solder plating layer includes a Sn plating layer, a Sn-Ag alloy plating layer, a Sn-Bi alloy plating layer, or a Sn-Cu alloy plating layer. These plating layers are formed by a plating method. The plating method includes, for example, an electrolytic plating method.

[0057] like Figure 2 to Figure 4 As shown, the element body 1 includes a region R1, a region R2, and a region R3. The region R1 and the region R3 include internal electrodes for signals and internal electrodes for grounding, which mainly contribute to the formation of the electrostatic capacitance of the stacked feedthrough capacitor CD1. The region R2 includes an internal electrode for power supply, which mainly contributes to the reduction of the DC resistance (Rdc) of the stacked feedthrough capacitor CD1. The region R2 is arranged between the region R1 and the region R3. In the present embodiment, the region R2 is arranged between the region R1 and the region R3 in the third direction D3. For example, when the region R1 includes the first region, the region R2 includes the second region, and the region R3 includes the third region.

[0058] A plurality of internal electrodes 31 and a plurality of internal electrodes 33 are arranged in the region R1. That is, at least one internal electrode 31 and at least one internal electrode 33 are arranged in the region R1. The plurality of internal electrodes 30 include the internal electrodes 31 and the internal electrodes 33. That is, the plurality of internal electrodes 30 include the plurality of internal electrodes 31 and the plurality of internal electrodes 33. The plurality of internal electrodes 30 include at least one internal electrode 31 and at least one internal electrode 33. The internal electrode 31 includes a signal internal electrode. The internal electrode 33 includes a grounding internal electrode. Figure 2 to Figure 4 As shown, each internal electrode 31 and each internal electrode 33 are opposed to each other via the dielectric layer 5. Each internal electrode 31 and each internal electrode 33 are opposed to each other at an interval L1. Each internal electrode 31 and each internal electrode 33 are alternately arranged. For example, when the internal electrode 31 includes a first internal electrode, the internal electrode 33 includes a third internal electrode.

[0059] like Figure 5 As shown, the internal electrode 31 extends along the first direction D1 and is exposed on a pair of end faces 1a. The internal electrode 31 is connected to a pair of external electrodes 10 respectively. The internal electrode 31 is electrically connected to a pair of external electrodes 10. The internal electrode 31 is not exposed on the side surface 1c, but is separated from the side surface 1c. The internal electrode 31 is not connected to the external electrode 20.

[0060] The internal electrode 31 includes a connection region 31a and an electrode region 31b. The internal electrode 31 includes two connection regions 31a and one electrode region 31b. One electrode region 31b is located between the two connection regions 31a in the first direction D1. The two connection regions 31a and one electrode region 31b are continuous with each other. When viewed from the third direction D3, the connection region 31a and the electrode region 31b are, for example, rectangular. For example, when the connection region 31a includes the first connection region, the electrode region 31b includes the first electrode region.

[0061] The two connection regions 31a are respectively connected to the corresponding external electrodes 10 in a pair of external electrodes 10. Each of the connection regions 31a and the corresponding external electrodes 10 are connected to each other. The connection regions 31a are respectively connected to the corresponding external electrodes 10 with a connection width W31a. The connection width W31a is the length of the connection end of at least one internal electrode 31 with each of the pair of external electrodes 10. The connection width W31a has, for example, the same length as the width of the connection region 31a in the second direction D2. The electrode region 31b has a width W31b in the second direction D2. The connection width W31a is, for example, smaller than the width W31b. The connection width W31a may also be less than the width W31b. The connection width W31a may also be the same as the width W31b. The width of the connection region 31a in the second direction D2 may also be the same as the width of the electrode region 31b in the second direction D2. Figure 2 and Figure 5 This shows an example in which the connection width W31a is smaller than the width W31b. The at least one internal electrode 31 includes a plurality of internal electrodes 31 having different connection widths W31a. For example, the plurality of internal electrodes 31 have mutually different connection widths W31a.

[0062] In this specification, the width "same" includes not only the case where the widths are equal to each other, but also the case where the widths are equal to each other including a slight difference or manufacturing error within a predetermined range. For example, when the average value of the connection width W31a is limited to a range of ±10% of the average value of the width W31b, the connection width W31a is assumed to be the same as the width W31b.

[0063] like Figure 6 As shown, the internal electrode 33 extends along the second direction D2 and is exposed at least on at least one of the pair of side surfaces 1c. The internal electrode 33 is connected to the external electrode 20. The internal electrode 33 is exposed on a pair of side surfaces 1c, respectively, and is connected to a pair of external electrodes 20, respectively. The internal electrode 33 is electrically connected to the external electrode 20. The internal electrode 33 is not exposed on the end surface 1a and is separated from the end surface 1a. The internal electrode 33 is not connected to the external electrode 10. At least one internal electrode 33 is opposite to the electrode region 31b.

[0064] The internal electrode 33 includes a connection region 33a and an electrode region 33b. The internal electrode 33 includes two connection regions 33a and one electrode region 33b. One electrode region 33b is located between the two connection regions 33a in the second direction D2. The two connection regions 33a and one electrode region 33b are continuous with each other. When viewed from the third direction D3, the connection region 33a and the electrode region 33b are, for example, rectangular. For example, when the connection region 33a includes the third connection region, the electrode region 33b includes the third electrode region.

[0065] The two connection regions 33a are respectively connected to the corresponding external electrodes 20 in the pair of external electrodes 20. The connection region 33a is electrically connected to the corresponding external electrode 20. The width of the connection region 33a in the first direction D1 is smaller than the width of the electrode region 33b in the first direction D1. The electrode region 33b has a width W33b in the second direction D2. The width W33b is, for example, the same as the width W31b. The width W33b may also be greater than the connection width W31a. The width W33b may also be greater than the connection width W31a.

[0066] A plurality of internal electrodes 32 are arranged in the region R2. That is, at least one internal electrode 32 is arranged in the region R2. The plurality of internal electrodes 30 include the internal electrode 32. At least one internal electrode 32 is arranged in the region R2. The at least one internal electrode 32 includes a plurality of internal electrodes 32. The internal electrode 32 includes an internal electrode for conducting electricity. Figure 2 to Figure 4 As shown, the plurality of internal electrodes 32 are opposed to each other via the dielectric layer 5. The plurality of internal electrodes 32 are opposed to each other at an interval L2. The internal electrodes 34 and the internal electrodes 35 are alternately arranged. The interval L2 is, for example, smaller than the interval L1. Therefore, at least one internal electrode 32 is opposed to each other at an interval L2 that is smaller than the interval L1 between at least one internal electrode 31 and at least one internal electrode 33. The plurality of internal electrodes 32 may also include an internal electrode 32 that is opposed to the internal electrode 33. In this case, the plurality of internal electrodes 32 must include an internal electrode 32 that is not opposed to the internal electrode 33. For example, when the internal electrode 31 includes a first internal electrode, the internal electrode 32 includes a second internal electrode.

[0067] like Figure 7 As shown, the internal electrode 32 extends along the first direction D1 and is exposed on a pair of end faces 1a. The internal electrode 32 is connected to a pair of external electrodes 10 respectively. The internal electrode 32 is electrically connected to a pair of external electrodes 10. The internal electrode 32 is not exposed on the side surface 1c and is separated from the side surface 1c. The internal electrode 32 is not connected to the external electrode 20. When viewed from the third direction D3, the internal electrode 32 is, for example, rectangular.

[0068] The internal electrode 32 is connected to the pair of external electrodes 10 with a connection width W32a. The connection width W32a is the length of the connection end of at least one internal electrode 32 with each of the pair of external electrodes 10. The internal electrode 32 has a width W32b in the second direction D2. The connection width W32a is, for example, the same as the width W32b. The width W32b is, for example, the same as the width W31b. The width W32b is greater than the width W31b. For example, in the case where the connection width W31a includes the first connection width, the connection width W32a includes the second connection width.

[0069] In this embodiment, width W32b is the same as connection width W32a, width W31b, and width W33b, and is larger than connection width W31a. Width W32b is the same as connection width W32a, and is larger than width W31b and width W33b, and width W31b and width W33b may be larger than connection width W31a.

[0070] In the region R3, a plurality of internal electrodes 34 and a plurality of internal electrodes 35 are arranged. That is, in the region R3, at least one internal electrode 34 and at least one internal electrode 35 are arranged. The plurality of internal electrodes 30 include the internal electrodes 34 and the internal electrodes 35. The internal electrodes 34 include the signal internal electrodes. The internal electrodes 35 include the grounding internal electrodes. Figure 2 to Figure 4 As shown, each internal electrode 34 and each internal electrode 35 are opposed to each other via the dielectric layer 5. Each internal electrode 34 and each internal electrode 35 are opposed to each other at an interval L3. Each internal electrode 34 and each internal electrode 35 are alternately arranged. The interval L2 is, for example, smaller than the interval L3. Therefore, at least one internal electrode 32 is opposed to each other at an interval L2 that is smaller than the interval L3 between at least one internal electrode 34 and at least one internal electrode 35. The plurality of internal electrodes 32 may also include an internal electrode 32 that is opposed to the internal electrode 35. In this case, the plurality of internal electrodes 32 must include an internal electrode 32 that is not opposed to the internal electrode 35. For example, when the internal electrode 31 includes the first internal electrode, the internal electrode 34 includes the fourth internal electrode, and the internal electrode 35 includes the fifth internal electrode.

[0071] like Figure 8 As shown, the internal electrode 34 extends along the first direction D1 and is exposed on a pair of end faces 1a. The internal electrode 34 is connected to a pair of external electrodes 10 respectively. The internal electrode 34 is electrically connected to a pair of external electrodes 10. The internal electrode 34 is not exposed on the side surface 1c and is separated from the side surface 1c. The internal electrode 34 is not connected to the external electrode 20.

[0072] The internal electrode 34 includes a connection region 34a and an electrode region 34b. The internal electrode 34 includes two connection regions 34a and one electrode region 34b. One electrode region 34b is located between the two connection regions 34a in the first direction D1. The two connection regions 34a and one electrode region 34b are continuous with each other. When viewed from the third direction D3, the connection region 34a and the electrode region 34b are, for example, rectangular. For example, when the connection region 34a includes the fourth connection region, the electrode region 34b includes the fourth electrode region.

[0073] The two connection regions 34a are respectively connected to the corresponding external electrodes 10 in a pair of external electrodes 10. Each of the connection regions 34a is connected to the corresponding external electrodes 10. The connection regions 34a are respectively connected to the corresponding external electrodes 10 with a connection width W34a. The connection width W34a has the length of the connection end of at least one internal electrode 34 with each of the pair of external electrodes 10. The connection width W34a is, for example, the same as the width of the connection region 34a in the second direction D2. The electrode region 34b has a width W34b in the second direction D2. The connection width W34a is, for example, smaller than the width W34b. The connection width W34a may also be less than the width W34b. The connection width W34a may also be the same as the width W34b. The width of the connection region 34a in the second direction D2 may also be the same as the width of the electrode region 34b in the second direction D2. Figure 2 and Figure 8 This shows an example in which the connection width W34a is smaller than the width W34b. For example, when the connection width W31a includes the first connection width, the connection width W34a includes the third connection width.

[0074] like Fig. 9 As shown, the internal electrode 35 extends along the second direction D2 and is exposed on at least one of the pair of side surfaces 1c. The internal electrode 35 is connected to the external electrode 20. The internal electrode 35 is exposed on a pair of side surfaces 1c, respectively, and is connected to a pair of external electrodes 20, respectively. The internal electrode 35 is electrically connected to the external electrode 20. The internal electrode 35 is not exposed on the end surface 1a and is separated from the end surface 1a. The internal electrode 35 is not connected to the external electrode 10. At least one internal electrode 35 is opposite to the electrode region 34b.

[0075] The internal electrode 35 includes a connection region 35a and an electrode region 35b. The internal electrode 35 includes two connection regions 35a and one electrode region 35b. One electrode region 35b is located between the two connection regions 35a in the second direction D2. The two connection regions 35a and one electrode region 35b are continuous with each other. When viewed from the third direction D3, the connection region 35a and the electrode region 35b are, for example, rectangular. For example, when the connection region 35a includes the fifth connection region, the electrode region 35b includes the fifth electrode region.

[0076] The two connection regions 35a are respectively connected to corresponding external electrodes 20 in the pair of external electrodes 20. The connection region 35a is electrically connected to the corresponding external electrodes 20. The width of the connection region 35a in the first direction D1 is smaller than the width of the electrode region 35b in the first direction D1.

[0077] The electrode region 35b has a width W35b in the second direction D2. The width W35b is, for example, the same as the width W31b. The width W35b may be greater than the connection width W31a. The width W35b may be greater than the connection width W31a. The width W35b is, for example, the same as the width W34b. The width W35b may be greater than the connection width W34a. The width W35b may be greater than the connection width W34a.

[0078] The two connection regions 35a are respectively connected to corresponding external electrodes 20 in the pair of external electrodes 20. The connection region 35a is electrically connected to the corresponding external electrodes 20. The width of the connection region 35a in the first direction D1 is smaller than the width of the electrode region 35b in the first direction D1.

[0079] The plurality of internal electrodes 30 include a conductive material generally used as an internal electrode of a laminated electric component. The conductive material included in the plurality of internal electrodes 30 includes Ni or Cu. The plurality of internal electrodes 30 are formed as a sintered body of a conductive paste including the conductive material.

[0080] exist Figure 3 and Figure 4 In the example shown, region R1 includes two internal electrodes 31 and two internal electrodes 33, and the total number of internal electrodes included in region R1 is four. Region R2 includes four internal electrodes 32, and the total number of internal electrodes included in region R2 is four. The total number of internal electrodes included in region R2 is the same as the total number of internal electrodes included in region R1. In this embodiment, the total number of internal electrodes included in region R2 is not limited to the case where the total number of internal electrodes included in region R1 is the same. That is, the number of dielectric layers 5 included in region R2 is not limited to the case where the number of dielectric layers 5 included in region R1 is the same.

[0081] As described above, the interval L2 is, for example, smaller than the interval L1. When the interval L2 is smaller than the interval L1, the thickness of each dielectric layer 5 included in the region R2 is smaller than the thickness of each dielectric layer 5 included in the region R1. The thickness of each dielectric layer 5 included in the region R2 is, for example, about 1 / 10 to 1 / 2 of the thickness of each dielectric layer 5 included in the region R1. Therefore, the number of dielectric layers 5 included in the region R2 may be greater than the number of dielectric layers 5 included in the region R1. That is, the total number of internal electrodes included in the region R2 may be greater than the total number of internal electrodes included in the region R1.

[0082] In the present embodiment, the number of dielectric layers 5 included in the region R2 may be 10 to 500. The number of dielectric layers 5 included in the region R1 may be 3 to 300.

[0083] exist Figure 3 and Figure 4In the example shown, the region R3 includes two internal electrodes 34 and two internal electrodes 35, and the total number of internal electrodes included in the region R3 is four. The total number of internal electrodes included in the region R2 is the same as the total number of internal electrodes included in the region R3. In this embodiment, the total number of internal electrodes included in the region R2 is not limited to the case where the total number of internal electrodes included in the region R3 is the same. In other words, the number of dielectric layers 5 included in the region R2 is not limited to the case where the number of dielectric layers 5 included in the region R3 is the same.

[0084] As described above, the interval L2 is, for example, smaller than the interval L3. When the interval L2 is smaller than the interval L3, the thickness of each dielectric layer 5 included in the region R2 is smaller than the thickness of each dielectric layer 5 included in the region R3. The thickness of each dielectric layer 5 included in the region R2 is, for example, about 1 / 10 to 1 / 2 of the thickness of each dielectric layer 5 included in the region R3. Therefore, the number of dielectric layers 5 included in the region R2 may be greater than the number of dielectric layers 5 included in the region R3. That is, the total number of internal electrodes included in the region R2 may be greater than the total number of internal electrodes included in the region R3.

[0085] In the present embodiment, the number of dielectric layers 5 included in the region R3 may be 3 to 300.

[0086] The multilayer feedthrough capacitor CD1 is mounted on an electronic device. The electronic device includes a circuit board or an electronic component. For example, the multilayer feedthrough capacitor CD1 is mounted on the electronic device by soldering. In the multilayer feedthrough capacitor CD1, any of the side surfaces 1c includes a mounting surface facing the electronic device.

[0087] Reference Fig.10 and Fig.11 , a multilayer feedthrough capacitor CD2 according to a first modified example of the present embodiment will be described. Fig.10 This is an exploded perspective view showing the element body and multiple internal electrodes. Fig.11 3 is a top view showing the internal electrodes. The multilayer feedthrough capacitor CD2 is substantially similar to or the same as the multilayer feedthrough capacitor CD1 described above, but the multilayer feedthrough capacitor CD2 is different from the multilayer feedthrough capacitor CD1 in terms of the structure of the element body 1 and the plurality of internal electrodes 30. The following mainly describes the differences between the multilayer feedthrough capacitor CD1 and the multilayer feedthrough capacitor CD2.

[0088] like Fig.10 As shown, in the first variant, the element body 1 includes a region R1, a region R2, and a region R4. The region R1 is located between the region R2 and the region R4. In this embodiment, the region R1 is located between the region R2 and the region R4 in the third direction D3. For example, when the region R1 includes the first region, the region R4 includes the fourth region.

[0089] In the region R4, a plurality of internal electrodes 36 are arranged. That is, in the region R4, at least one internal electrode 36 is arranged. The plurality of internal electrodes 30 include the internal electrode 36. In the region R4, at least one internal electrode 36 is arranged. The internal electrode 36 includes an internal electrode for conducting electricity. For example, when the internal electrode 31 includes the first internal electrode, the internal electrode 36 includes the sixth internal electrode.

[0090] like Fig.11 As shown, the internal electrode 36 extends along the first direction D1 and is exposed on a pair of end faces 1a. The internal electrode 36 is connected to a pair of external electrodes 10 respectively. The internal electrode 36 is electrically connected to a pair of external electrodes 10. The internal electrode 36 is not exposed on the side surface 1c and is separated from the side surface 1c. The internal electrode 36 is not connected to the external electrode 20. When viewed from the third direction D3, the internal electrode 36 is, for example, rectangular.

[0091] The internal electrode 36 is connected to a pair of external electrodes 10 with a connection width W36a. The connection width W36a is the length of the connection end of at least one internal electrode 36 with each of the pair of external electrodes 10. The internal electrode 36 has a width W36b in the second direction D2. The connection width W36a is, for example, the same as the width W36b. The width W36b is, for example, the same as the width W31b. The width W36b may also be greater than the width W31b. For example, when the connection width W31a includes the first connection width, the connection width W36a includes the fourth connection width.

[0092] Reference Fig.12 , a multilayer feedthrough capacitor CD3 according to a second modification example of the present embodiment will be described. Fig.12 : is an exploded perspective view showing an element body and a plurality of internal electrodes. The multilayer feedthrough capacitor CD3 is substantially similar to or the same as the multilayer feedthrough capacitor CD1 described above, but the multilayer feedthrough capacitor CD3 is different from the multilayer feedthrough capacitor CD1 in terms of the structure of the element body 1 and the plurality of internal electrodes 30. The following mainly describes the differences between the multilayer feedthrough capacitor CD1 and the multilayer feedthrough capacitor CD3.

[0093] In the second modification, the element body 1 includes a region R1, a region R2, a region R3, a region R4, and a region R5. In the region R5, a plurality of internal electrodes 31 and a plurality of internal electrodes 33 are arranged. That is, in the region R5, at least one internal electrode 31 and at least one internal electrode 33 are arranged. The internal electrodes 31 and the internal electrodes 33 are opposed to each other via the dielectric layer 5. The internal electrodes 31 and the internal electrodes 33 are arranged alternately. In the second modification, the region R1, the region R2, the region R3, the region R4, and the region R5 are arranged in the order of the region R1, the region R2, the region R3, the region R4, and the region R5 in the third direction D3. In the second modification, the connection width W31a is smaller than the width W31b, and the connection width W34a is smaller than the width W34b.

[0094] Reference Figure 13 to Figure 15 , a multilayer feedthrough capacitor CD4 according to a third modified example of the present embodiment will be described. Fig.13 This is an exploded perspective view showing the element body and multiple internal electrodes. Fig.14 and Fig.15 3 is a top view showing each internal electrode. The multilayer feedthrough capacitor CD4 is substantially similar to or the same as the multilayer feedthrough capacitor CD1 described above, but the multilayer feedthrough capacitor CD4 is different from the multilayer feedthrough capacitor CD1 in terms of the structure of the element body 1 and the plurality of internal electrodes 30. The following mainly describes the differences between the multilayer feedthrough capacitor CD1 and the multilayer feedthrough capacitor CD4.

[0095] In the third modification, the element body 1 includes a region R2, a region R6, and a region R7. The region R2, the region R6, and the region R7 are arranged in the order of the region R6, the region R2, and the region R7 in the third direction D3. The region R2 includes at least one internal electrode 32. At least one internal electrode 32 is arranged in the region R2.

[0096] In the region R6, a plurality of internal electrodes 31, a plurality of internal electrodes 33, a plurality of internal electrodes 37, and a plurality of internal electrodes 38 are arranged. That is, in the region R6, at least one internal electrode 31, at least one internal electrode 33, at least one internal electrode 37, and at least one internal electrode 38 are arranged. The plurality of internal electrodes 30 include internal electrodes 31, 33, 37, and 38. The internal electrodes 37 and 38 include signal internal electrodes. The internal electrodes 37 and 38 and the internal electrodes 33 are opposed to each other via the dielectric layer 5. The internal electrodes 37 and 38 and the internal electrodes 33 are arranged alternately. In the region R6, the internal electrode 37 is arranged closer to the region R2 than the internal electrode 31, and the internal electrode 38 is arranged closer to the region R2 than the internal electrode 37.

[0097] like Fig.14As shown, the internal electrode 37 is connected to a pair of external electrodes 10 respectively. The internal electrode 37 includes two connection areas 37a and one electrode area 37b. One electrode area 37b is located between the two connection areas 37a in the first direction D1. When viewed from the third direction D3, the connection area 37a and the electrode area 37b are, for example, rectangular.

[0098] The two connection regions 37a are respectively connected to the corresponding external electrodes 10 in the pair of external electrodes 10. The connection regions 37a are respectively connected to the corresponding external electrodes 10 with a connection width W37a. The connection width W37a is, for example, the same as the width of the connection region 37a in the second direction D2. The connection width W37a is larger than the connection width W31a and smaller than the width W37b. The width W37b is, for example, the same as the width W31b.

[0099] like Fig.15 As shown, the internal electrode 38 is connected to a pair of external electrodes 10. The internal electrode 38 is connected to the pair of external electrodes 10 with a connection width W38a. The internal electrode 38 has a width W38b in the second direction D2. The connection width W38a is, for example, the same as the width W38b. The connection width W38a is greater than the connection width W37a. The width W38b is, for example, the same as the width W31b.

[0100] In the region R7, a plurality of internal electrodes 31, a plurality of internal electrodes 33, a plurality of internal electrodes 37, and a plurality of internal electrodes 38 are arranged. That is, in the region R7, at least one internal electrode 31, at least one internal electrode 33, at least one internal electrode 37, and at least one internal electrode 38 are arranged. The internal electrodes 37, 38 and the internal electrodes 33 are opposed to each other via the dielectric layer 5. The internal electrodes 37, 38 and the internal electrodes 33 are arranged alternately. In the region R7, the internal electrode 37 is arranged closer to the region R2 than the internal electrode 31, and the internal electrode 38 is arranged closer to the region R2 than the internal electrode 37.

[0101] As described above, in the multilayer feedthrough capacitors CD1, CD2, CD3, and CD4, at least one internal electrode 32 is connected to a pair of external electrodes 10 separately from at least one internal electrode 31. The at least one internal electrode 32 is arranged in a region R2 different from the region R1 where the at least one internal electrode 31 and the at least one internal electrode 33 are arranged opposite to each other. Therefore, the at least one internal electrode 32 contributes to the reduction of the DC resistance.

[0102] In the stacked feedthrough capacitors CD1, CD2, CD3, and CD4, the connection width W32a is greater than the connection width W31a. That is, the connection length between each of the external electrodes 10 and at least one internal electrode 32 is greater than the connection length between each of the external electrodes 10 and at least one internal electrode 31. Therefore, current easily flows to at least one internal electrode 32. At least one internal electrode 32 further contributes to the reduction of DC resistance.

[0103] As a result, the stacked feedthrough capacitors CD1, CD2, CD3, and CD4 have reduced DC resistance.

[0104] In the multilayer feedthrough capacitors CD1, CD2, CD3, and CD4, the connection width W32a is larger than the connection width W31a, that is, the connection width W31a is smaller than the connection width W32a. The length of the connection end of at least one internal electrode 31 with each of the pair of external electrodes 10 is smaller than the length of the connection end of at least one internal electrode 32 with each of the pair of external electrodes 10. Therefore, it is difficult for the plating liquid to penetrate into the element body 1 from the interface between the above-mentioned connection end of at least one internal electrode 31 and the element body 1. As a result, the multilayer feedthrough capacitors CD1, CD2, CD3, and CD4 suppress the reduction of reliability.

[0105] In the multilayer feedthrough capacitor CD1, the plurality of internal electrodes 30 include at least one internal electrode 34 connected to a pair of external electrodes 10, and at least one internal electrode 35 connected to an external electrode 20. The element body 1 includes a region R3 in which the at least one internal electrode 34 and the at least one internal electrode 35 are arranged opposite to each other. The at least one internal electrode 34 is connected to the pair of external electrodes 10 with a connection width W34a smaller than the connection width W32a. The region R2 is located between the region R1 and the region R3.

[0106] In the multilayer feedthrough capacitor CD1, the connection length between each of the external electrodes 10 and at least one internal electrode 32 is greater than the connection length between each of the external electrodes 10 and at least one internal electrode 34. Therefore, current easily flows to the at least one internal electrode 32. The at least one internal electrode 32 further contributes to the reduction of the DC resistance. As a result, the multilayer feedthrough capacitor CD1 further reduces the DC resistance.

[0107] In the multilayer feedthrough capacitor CD1, the length of the connection end of at least one internal electrode 34 to each of the pair of external electrodes 10 is shorter than the length of the connection end of at least one internal electrode 32 to each of the pair of external electrodes 10. Therefore, it is difficult for the plating solution to penetrate into the element body 1 from the interface between the connection end of the at least one internal electrode 34 and the element body 1. As a result, the multilayer feedthrough capacitor CD1 suppresses a decrease in reliability.

[0108] In the multilayer feedthrough capacitor CD1, the regions R1 and R3 tend to be closer to the ridges of the element body 1 than the region R2. That is, the plating liquid may easily penetrate into the regions R1 and R3 than the region R2. However, in the multilayer feedthrough capacitor CD1, the connection width W31a is smaller than the connection width W32a, and the connection width W34a is smaller than the connection width W32a, and as described above, the plating liquid is difficult to penetrate into the element body 1. Therefore, even in the structure where the region R2 is located between the region R1 and the region R3, the reduction in reliability can be suppressed.

[0109] In the multilayer feedthrough capacitor CD1 , at least one internal electrode 34 includes an electrode region 34 b that faces at least one internal electrode 35 and has a width greater than the connection width W34 a .

[0110] The multilayer feedthrough capacitor CD1 tends to increase the facing area of ​​the at least one internal electrode 34 and the at least one internal electrode 35. Therefore, the multilayer feedthrough capacitor CD1 can increase the electrostatic capacitance.

[0111] In the multilayer feedthrough capacitor CD1 , at least one internal electrode 32 includes a plurality of internal electrodes 32 facing each other at an interval L2 smaller than the interval L3 .

[0112] The multilayer feedthrough capacitor CD1 can increase the number of internal electrodes 32 arranged in the region R2. Therefore, the multilayer feedthrough capacitor CD1 can further reduce the DC resistance.

[0113] The stacked through capacitor CD1 can increase the interval between the at least one internal electrode 34 and the at least one internal electrode 35. Therefore, the stacked through capacitor CD1 suppresses short circuit between the at least one internal electrode 34 and the at least one internal electrode 35.

[0114] In the multilayer feedthrough capacitor CD1 , the internal electrode 31 includes an electrode region 31 b which faces the internal electrode 33 and has a width larger than the connection width W31 a .

[0115] In the multilayer feedthrough capacitor CD1, there is a tendency to increase the facing area of ​​the at least one internal electrode 31 and the at least one internal electrode 33. Therefore, the multilayer feedthrough capacitor CD1 can increase the electrostatic capacitance.

[0116] In the multilayer feedthrough capacitor CD1 , at least one internal electrode 32 includes a plurality of internal electrodes 32 facing each other at an interval L2 smaller than the interval L1 .

[0117] The multilayer feedthrough capacitor CD1 can increase the number of internal electrodes 32 arranged in the region R2. Therefore, the multilayer feedthrough capacitor CD1 can further reduce the DC resistance.

[0118] The stacked through capacitor CD1 can increase the interval between the at least one internal electrode 31 and the at least one internal electrode 33. Therefore, the stacked through capacitor CD1 suppresses the short circuit between the at least one internal electrode 31 and the at least one internal electrode 33.

[0119] In the multilayer feedthrough capacitor CD2, the plurality of internal electrodes 30 include at least one internal electrode 36 connected to a pair of external electrodes 10. The element body 1 includes a region R4 where the at least one internal electrode 36 is arranged. The connection width W31a is smaller than the connection width W36a between each of the pair of external electrodes 10 and the at least one internal electrode 36. That is, the at least one internal electrode 36 is connected to the pair of external electrodes 10 with a connection width W36a larger than the connection width W31a. The region R1 is located between the region R2 and the region R4.

[0120] In the stacked feedthrough capacitor CD2, at least one internal electrode 36 is connected to a pair of external electrodes 10 separately from at least one internal electrode 31. At least one internal electrode 36 is arranged in a region R4 different from the region R1 where at least one internal electrode 31 and at least one internal electrode 33 are arranged opposite to each other. Therefore, at least one internal electrode 36 contributes to the reduction of DC resistance. In the stacked feedthrough capacitor CD2, the connection width W31a is smaller than the connection width W36a, and the connection length between each of the external electrodes 10 and at least one internal electrode 36 is larger than the connection length between each of the external electrodes 10 and at least one internal electrode 31. Therefore, current easily flows to at least one internal electrode 36. At least one internal electrode 36 further contributes to the reduction of DC resistance. As a result, the stacked feedthrough capacitor CD2 further reduces the DC resistance.

[0121] In the multilayer feedthrough capacitor CD2, the length of the connection end of at least one internal electrode 31 to each of the pair of external electrodes 10 is shorter than the length of the connection end of at least one internal electrode 36 to each of the pair of external electrodes 10. Therefore, it is difficult for the plating solution to penetrate into the element body 1 from the interface between the connection end of the at least one internal electrode 31 and the element body 1. As a result, the multilayer feedthrough capacitor CD2 suppresses a decrease in reliability.

[0122] In the multilayer feedthrough capacitor CD1 , at least one internal electrode 31 includes a plurality of internal electrodes 31 having different connection widths W31 a .

[0123] In the multilayer feedthrough capacitor CD1, in a structure where the plurality of internal electrodes 31 have mutually different connection widths W31a, the connection width W31a of each of the plurality of internal electrodes 31 is smaller than the connection width W32a. Therefore, it is difficult for the plating liquid to penetrate into the element body 1 from the interface between the connection ends of each of the plurality of internal electrodes 31 and the element body 1. As a result, the multilayer feedthrough capacitor CD1 still suppresses a decrease in reliability.

[0124] As mentioned above, although embodiment and modification of this disclosure were described, this disclosure is not necessarily limited to the said embodiment and modification, Various changes are possible within the range which does not deviate from the summary.

[0125] The at least one internal electrode 34 may not include the electrode region 34b that is opposed to the at least one internal electrode 35 and has a width greater than the connection width W34a. As described above, the structure in which the at least one internal electrode 34 includes the electrode region 34b that is opposed to the at least one internal electrode 35 and has a width greater than the connection width W34a tends to increase the opposing area of ​​the at least one internal electrode 34 and the at least one internal electrode 35. Therefore, the stacked feedthrough capacitor CD1 can increase the electrostatic capacitance.

[0126] The at least one internal electrode 31 may not include the electrode region 31b that is opposed to the at least one internal electrode 33 and has a width greater than the connection width W31a. As described above, the structure in which the at least one internal electrode 31 includes the electrode region 31b that is opposed to the at least one internal electrode 33 and has a width greater than the connection width W31a tends to increase the opposing area of ​​the at least one internal electrode 31 and the at least one internal electrode 33. Therefore, the stacked feedthrough capacitor CD1 can increase the electrostatic capacitance.

[0127] The at least one internal electrode 32 of the stacked feedthrough capacitor CD1 may not include a plurality of internal electrodes 32 that are opposed to each other at an interval L2 that is smaller than the interval L3. As described above, the structure in which the at least one internal electrode 32 includes a plurality of internal electrodes 32 that are opposed to each other at an interval L2 that is smaller than the interval L3 can increase the number of internal electrodes 32 arranged in the region R2. Therefore, the stacked feedthrough capacitor CD1 can further reduce the DC resistance. The stacked feedthrough capacitor CD1 can increase the interval between the at least one internal electrode 34 and the at least one internal electrode 35. Therefore, the stacked feedthrough capacitor CD1 suppresses the short circuit between the at least one internal electrode 34 and the at least one internal electrode 35.

[0128] The at least one internal electrode 32 may not include a plurality of internal electrodes 32 that are opposed to each other at an interval L2 that is smaller than the interval L1. As described above, the structure in which the at least one internal electrode 32 includes a plurality of internal electrodes 32 that are opposed to each other at an interval L2 that is smaller than the interval L1 can increase the number of internal electrodes 32 arranged in the region R2. Therefore, the stacked feedthrough capacitor CD1 can further reduce the DC resistance. The stacked feedthrough capacitor CD1 can increase the interval between the at least one internal electrode 31 and the at least one internal electrode 33. Therefore, the stacked feedthrough capacitor CD1 suppresses the short circuit between the at least one internal electrode 31 and the at least one internal electrode 33.

Claims

1. A stacked feedthrough capacitor comprising: body; a pair of first external electrodes, which are disposed on the element body separately from each other; a second external electrode, which is disposed on the element body separately from the pair of first external electrodes; A plurality of internal electrodes are arranged in the element body, The plurality of internal electrodes include at least one first internal electrode connected to the pair of first external electrodes, at least one second internal electrode connected to the pair of first external electrodes, and at least one third internal electrode connected to the second external electrode, The element body comprises: a first region, wherein the at least one first internal electrode and the at least one third internal electrode are arranged opposite to each other; a second region, in which the at least one second internal electrode is arranged, The at least one first internal electrode is connected to the pair of first external electrodes at a first connection width, respectively. The at least one second internal electrode is connected to the pair of first external electrodes with a second connection width greater than the first connection width, respectively.

2. The multilayer feedthrough capacitor according to claim 1, wherein: The plurality of internal electrodes further include at least one fourth internal electrode connected to the pair of first external electrodes and at least one fifth internal electrode connected to the second external electrode, The element body further includes a third region in which the at least one fourth internal electrode and the at least one fifth internal electrode are arranged opposite to each other. The at least one fourth internal electrode is connected to the pair of first external electrodes respectively with a third connection width smaller than the second connection width, The second region is located between the first region and the third region.

3. The multilayer feedthrough capacitor according to claim 2, wherein: The at least one fourth internal electrode includes an electrode region which is opposed to the at least one fifth internal electrode and has a width greater than the third connection width.

4. The multilayer feedthrough capacitor according to claim 2 or 3, wherein: The at least one second internal electrode includes a plurality of second internal electrodes opposed to each other at intervals smaller than intervals between the at least one fourth internal electrode and the at least one fifth internal electrode.

5. The multilayer feedthrough capacitor according to any one of claims 1 to 4, wherein The at least one first internal electrode includes an electrode region that is opposed to the at least one third internal electrode and has a width greater than the first connection width.

6. The multilayer feedthrough capacitor according to any one of claims 1 to 5, The at least one second internal electrode includes a plurality of second internal electrodes opposed to each other at a smaller interval than an interval between the at least one first internal electrode and the at least one third internal electrode.

7. The multilayer feedthrough capacitor according to any one of claims 1 to 6, wherein: The plurality of internal electrodes further include at least one sixth internal electrode connected to the pair of first external electrodes, The element body further includes a fourth region provided with the at least one sixth internal electrode, The at least one sixth internal electrode is connected to the pair of first external electrodes respectively with a fourth connection width greater than the first connection width, The first region is located between the second region and the fourth region.

8. The multilayer feedthrough capacitor according to any one of claims 1 to 7, wherein The at least one first internal electrode includes a plurality of first internal electrodes having different first connection widths.

9. The stacked feedthrough capacitor according to claim 2, wherein: The element body comprises a pair of side surfaces facing each other, The first region is located at the outermost position on one side of the pair of side surfaces in the direction in which the pair of side surfaces are opposed to each other. The third region is located at the outermost position on the other side surface of the pair of side surfaces in the direction in which the pair of side surfaces oppose each other.

10. The stacked feedthrough capacitor according to claim 7, wherein: The element body comprises a pair of side surfaces facing each other, The second region is located at the outermost position on one side of the pair of side surfaces in the direction in which the pair of side surfaces are opposed to each other. The fourth region is located at the outermost position on the other side surface of the pair of side surfaces in the direction in which the pair of side surfaces oppose each other.

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