Etching apparatus and etching method

Abstract

The invention provides an etching device and an etching method, the etching device comprises a first chamber and a second chamber which are adjacent, the first chamber comprises a first nozzle assembly and a second nozzle assembly, and the second chamber comprises a second nozzle assembly and a third nozzle assembly. The first nozzle assembly and the second nozzle assembly are used for spraying a first solution to a first surface and a second surface opposite to the first surface of the plate-shaped element in the process that the plate-shaped element is located in the first cavity; the second chamber comprises a third nozzle assembly and a fourth nozzle assembly, the third nozzle assembly and the fourth nozzle assembly are used for spraying a second solution to the first surface and the second surface of the plate-shaped element, the first solution is different from the second solution, and in a first use mode, the first solution is a first etching solution, and in a second use mode, the second solution is a second etching solution. The second solution is a clean solution; and in the second use mode, the first solution is a first etching solution, and the second solution is a second etching solution.

Description

Technical Field

[0001] The invention relates to the field of plate-like element manufacturing, and in particular to an etching device and an etching method used in the process of manufacturing the plate-like element. Background Art

[0002] At present, with the increasing use of display devices, manufacturers have higher and higher requirements for the yield rate in their production process, and users have higher and higher requirements for the thinness of some electronic products. In the manufacturing process of the display panel used in such electronic products, the display panel is usually etched and thinned to make it thinner, and at the same time, dirt and foreign matter on the outer surface of the substrate of the display panel can be removed. However, users have no special requirements for the thickness of other electronic products (such as some laptops or car display panels), and such display panels do not need to be etched and thinned during the manufacturing process. When the display panel is not etched and thinned, the dirt on the outer surface of the substrate of the display panel caused by the transmission mechanism (such as transmission rollers, adsorbents, etc.) during the production process cannot be effectively removed by conventional cleaning equipment, so that the finished display panel has appearance defects. The current cleaning method relies on the operator to hold a blade and manually scrape off the dirt with the assistance of a strong flashlight. This cleaning method is inefficient, and it is easy to cause fragments through manual cleaning, reducing the production yield.

[0003] Therefore, how to reduce the appearance defects of plate-like components such as display panels while improving the yield and increasing production efficiency is an urgent problem to be solved. Summary of the invention

[0004] The present invention provides an etching device and an etching method to solve the above technical problems.

[0005] In order to achieve the above-mentioned purpose, the present invention provides an etching device, which includes a first chamber and a second chamber adjacent to each other, wherein the first chamber and the second chamber include a continuously extending conveying track, wherein the conveying track is used to convey a plate-like element from the first chamber to the second chamber, wherein the second chamber is connected to the first chamber via the conveying track, wherein the first chamber includes a first nozzle assembly and a second nozzle assembly, wherein the first nozzle assembly is located at the top of the first chamber, wherein the second nozzle assembly is arranged opposite to the first nozzle assembly and is located at the bottom of the first chamber, wherein the first nozzle assembly and the second nozzle assembly are used to spray a first solution while the plate-like element is located in the first chamber. to the first surface of the plate-like element and the second surface opposite to the first surface; the second chamber includes a third nozzle assembly and a fourth nozzle assembly, the third nozzle assembly is located at the top of the second chamber, the fourth nozzle assembly is arranged opposite to the third nozzle assembly and is located at the bottom of the second chamber, the third nozzle assembly and the fourth nozzle assembly are used to spray a second solution to the first surface and the second surface of the plate-like element, the first solution is different from the second solution, wherein, in the first usage mode, the first solution is a first etching solution, and the second solution is a cleaning solution; in the second usage mode, the first solution is a first etching solution, and the second solution is a second etching solution.

[0006] As an optional technical solution, the first chamber further includes a first sensor and a second sensor, and the first sensor and the second sensor are arranged horizontally spaced apart from the conveying track and are located on the same side of the conveying track.

[0007] As an optional technical solution, it is characterized in that the first sensor and the second sensor are located on opposite sides of the first nozzle assembly, the first sensor is arranged adjacent to the inlet of the first chamber, and the second sensor is arranged adjacent to the outlet of the first chamber.

[0008] As an optional technical solution, there is a first angle between the first nozzle assembly and the plane where the conveying track is located, and the second nozzle assembly is perpendicular to the plane where the conveying track is located.

[0009] As an optional technical solution, there is a second angle between the third nozzle assembly and the plane where the conveying track is located, the fourth nozzle assembly is perpendicular to the plane where the conveying track is located, the first angle is the same as the second angle, or the first angle is different from the second angle.

[0010] As an optional technical solution, the first solution is a mixture of sulfuric acid and hydrofluoric acid, and the second solution is pure water.

[0011] As an optional technical solution, the first chamber has a first box body, the first nozzle assembly and the second nozzle assembly are connected to the first box body, and the first solution is placed in the first box body.

[0012] As an optional technical solution, the first box is also connected to a first replenishing pipeline. When the concentration of the first solution in the first box is lower than a preset value, the first replenishing pipeline provides a third solution and replenishes it into the first box.

[0013] The present invention also provides an etching method, wherein the etching device comprises a first chamber and a second chamber adjacent to each other, wherein the first chamber and the second chamber comprise a continuously extending conveying track, and the second chamber is connected to the first chamber via the conveying track; the first chamber comprises a first nozzle assembly and a second nozzle assembly, wherein the first nozzle assembly is located at the top of the first chamber, and the second nozzle assembly is arranged opposite to the first nozzle assembly and is located at the bottom of the first chamber; the second chamber comprises a third nozzle assembly and a fourth nozzle assembly, wherein the third nozzle assembly is located at the top of the second chamber, and the fourth nozzle assembly is arranged opposite to the third nozzle assembly and is located at the bottom of the second chamber; the etching method comprises: Step A: the plate-shaped element is placed on the conveying track and enters the first chamber, and the first nozzle assembly and the second nozzle assembly spray a first solution onto a first surface of the plate-shaped element and a second surface opposite to the first surface; Step B: the plate-shaped element moves from the first chamber to the second chamber via the conveying track, and the third nozzle assembly and the fourth nozzle assembly spray a second solution onto the first surface and the second surface of the plate-shaped element, wherein the first solution is different from the second solution; Wherein, in the first use mode, the first solution is a first etching solution, and the second solution is a cleaning solution; in the second use mode, the first solution is a first etching solution, and the second solution is a second etching solution.

[0014] As an optional technical solution, the first chamber further includes a first sensor and a second sensor. In step A, the first sensor detects a first thickness of the plate-like element when it enters the first chamber, and the second sensor detects a second thickness of the plate-like element when it leaves the first chamber.

[0015] The present invention provides an etching device and an etching method. In a first use mode, the etching device is provided with a first nozzle assembly and a second nozzle assembly in a first chamber, and a first solution (first etching solution) is uniformly sprayed on the upper and lower surfaces of a plate-like element through the nozzles to perform micro-etching on the plate-like element to remove dirt on the surface of the plate-like element. In a second chamber, a third nozzle assembly and a fourth nozzle assembly are provided, and a second solution (cleaning solution) different from the first solution is uniformly sprayed on the upper and lower surfaces of the plate-like element through the nozzles to remove the surface charge of the plate-like element and wet a transmission track to avoid collision and rupture of the plate-like element due to gear jumping in the transmission track, thereby achieving the plate-like element without appearance defects while improving the yield and production efficiency. In a second use mode, the etching device is provided with a second solution as a second etching solution to perform etching and thinning on the plate-like element to achieve a target thickness. By adjusting the type of the second solution, the etching device can be switched between different use modes to meet different manufacturing requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The specific implementation modes of the present invention are further described in detail below in conjunction with the accompanying drawings.

[0017] Figure 1 It is a schematic structural diagram of the etching device of the present invention; Figure 2 It is a schematic structural diagram of the plate-like element of the present invention; Figure 3 It is a flow chart of the etching method of the present invention. DETAILED DESCRIPTION

[0018] In order to more clearly illustrate the present invention, the present invention is further described below in conjunction with preferred embodiments and accompanying drawings. Similar components in the accompanying drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the content specifically described below is illustrative rather than restrictive, and should not be used to limit the scope of protection of the present invention.

[0019] Please refer to Figure 1 and Figure 2 , Figure 1 FIG. 1 is a schematic diagram showing the structure of the etching device of the present invention. Figure 2 FIG. 1 is a schematic diagram showing the structure of the plate-like element of the present invention. Figure 1 As shown, the present invention provides an etching device 100, which can be used to micro-etch the surface of a plate-like element 200 to remove dirt, foreign matter, etc. on the surface of the plate-like element 200 or to etch and thin the plate-like element 200. Figure 2As shown, in this embodiment, the plate-like element 200 is a display panel, which includes an upper glass substrate 210, a lower glass substrate 220, and a display molecular layer 230 sandwiched between the two glass substrates 210, 220. After the two glass substrates 210, 220 are assembled, the outer surface of the substrate of the plate-like element 200 can be micro-etched by the etching device 100 to remove dirt, foreign matter, etc. transferred from the plate-like element 200 by the previous process, thereby reducing or removing the appearance defects on the surface of the plate-like element 200; or, after the two glass substrates 210, 220 are assembled, the plate-like element 200 can be etched and thinned by the etching device 100 to make the plate-like element 200 reach the target thickness. In other embodiments, the plate-like element 200 is not limited to a display panel, and can also be a wafer, etc.

[0020] like Figure 1 As shown, the etching device 100 includes a first chamber 10 and a second chamber 20, and the first chamber 10 is adjacent to the second chamber 20. The first chamber 10 and the second chamber 20 include a continuously extending conveying track 30, and the conveying track 30 is used to convey the plate-like element 200 from the first chamber 10 to the second chamber 20. The second chamber 20 is connected to the first chamber 10 through the conveying track 30. The first chamber 10 includes a first nozzle assembly 11 and a second nozzle assembly 12. The first nozzle assembly 11 is located at the top of the first chamber 10, and the second nozzle assembly 12 is arranged opposite to the first nozzle assembly 11 and is located at the bottom of the first chamber 10. The first nozzle assembly 11 and the second nozzle assembly 12 are used to spray the first solution 13 onto the plate-like element 200 when the plate-like element 200 is located in the first chamber 10. The first surface 211 of the plate-shaped element 200 (i.e., the upper surface of the upper glass substrate 210) and the second surface 221 opposite to the first surface 211 (i.e., the lower surface of the lower glass substrate 220); the second chamber 20 includes a third nozzle assembly 21 and a fourth nozzle assembly 22, the third nozzle assembly 21 is located at the top of the second chamber 20, and the fourth nozzle assembly 22 is arranged opposite to the third nozzle assembly 21 and is located at the bottom of the second chamber 20, and the third nozzle assembly 21 and the fourth nozzle assembly 22 are used to spray the second solution 23 onto the first surface 211 and the second surface 221 of the plate-shaped element 200, and the first solution 13 is different from the second solution 23. In the first use mode, the first solution 13 is a first etching solution, and the second solution 23 is a cleaning solution; in the second use mode, the first solution 13 is a first etching solution, and the second solution 23 is a second etching solution.

[0021] In one embodiment, when the etching device 100 is in a first usage mode, the surface of the plate-like element 200 can be micro-etched to remove dirt, foreign matter, etc. on the surface of the plate-like element 200; when the etching device 100 is in a second usage mode, the plate-like element 200 can be etched and thinned to reach a target thickness.

[0022] In practical applications, the conveying track 30 includes a plurality of conveying wheels 31 arranged in parallel, and the plate-like element 200 is driven by the conveying wheels 31 to move between the first chamber 10 and the second chamber 20 .

[0023] In one embodiment, if Figure 1 As shown, the first chamber 10 further includes a first sensor 40 and a second sensor 50, which are arranged horizontally spaced apart from the conveying track 30 (conveying wheel 31) and are located on the same side of the conveying track 30, and the first sensor 40 and the second sensor 50 are located on opposite sides of the first nozzle assembly 11, and the first sensor 40 is farther away from the second chamber 20 than the second sensor 50. The first sensor 40 can be arranged near the entrance of the first chamber 10, and the second sensor 50 can be arranged near the exit of the first chamber 20. In practical applications, the first nozzle assembly 11 is, for example, disposed in the middle of the first cavity 10, and includes a plurality of nozzles. During the process of the plate-like element 200 moving from the first cavity 10 to the second cavity 20, the first solution 13 is continuously sprayed to the plate-like element 200 through the first nozzle assembly 11 (the plurality of nozzles) (the working principle of the second nozzle assembly 12 is similar to that of the first nozzle assembly 11, which will not be described in detail here). The first sensor 40 is, for example, disposed on the left side of the first nozzle assembly 11, and the second sensor 50 is, for example, disposed on the right side of the first nozzle assembly 11. That is to say, the first sensor 40 detects when the plate-like element 200 is placed on the conveying track 30 (or the conveying track 30). The first sensor 40 detects the first thickness of the plate-like element 200 when it enters the first chamber 20) (i.e., the initial thickness of the plate-like element 200 before etching), and the second sensor 50 detects the second thickness of the plate-like element 200 after being micro-etched by the first solution 13 (or when it leaves the first chamber 20), so as to judge whether the plate-like element 200 has been properly cleaned. The distance between the first sensor 40 and the second sensor 50 can be set according to actual needs to infer, and the concentration of the first solution 13 and / or the time the plate-like element 200 is in the first chamber 20 can be adjusted according to the distance between the two, so as to ensure that the plate-like element 200 is properly cleaned without significantly affecting the thickness of the plate-like element 200. Figure 1 Only one first sensor 40 and one second sensor 50 are shown in the figure, but in actual application, the first sensor 40 and the second sensor 50 can be set on both sides of the plate-like element 200, and multiple sensors can also be used to detect whether the plate-like element 200 is etched uniformly.

[0024] The etching device 100 of the present invention is provided with a first nozzle assembly 11 and a second nozzle assembly 12 in a first chamber 10, and a first solution 13 is uniformly sprayed on the upper and lower surfaces of the plate-like element 200 through the nozzles. In one embodiment, the first solution 13 may be an acid solution (etching solution), and the plate-like element 200 is micro-etched by the first solution 13 to remove dirt on the surface of the plate-like element 200, thereby avoiding appearance defects on the surface of the plate-like element 200 that lead to a reduction in yield. Furthermore, a third nozzle assembly 21 and a fourth nozzle assembly 22 are provided in the second chamber 20, and a second solution 23 different from the first solution 13 is uniformly sprayed on the upper and lower surfaces of the plate-like element 200 through the nozzles. In one embodiment, the second solution 23 may be pure water (cleaning solution), and the pure water is used to remove the surface charge of the plate-like element 200 and clear the first solution remaining on the surface of the plate-like element 200 when the plate-like element 200 leaves the first chamber 10. In addition, the second solution 23 can also wet the conveying track 30 to prevent the conveying wheel 31 in the conveying track 30 from jumping and causing the plate-like element 200 to jump, causing the plate-like element 200 to collide with the conveying wheel 31 and break, thereby improving the stability of the plate-like element 200 during the conveying process.

[0025] In one embodiment, if Figure 1 As shown, there is a first angle A1 between the first nozzle assembly 11 and the plane where the conveying track 30 is located, and the second nozzle assembly 12 is perpendicular to the plane where the conveying track 30 is located; there is a second angle A2 between the third nozzle assembly 21 and the plane where the conveying track 30 is located, and the fourth nozzle assembly 22 is perpendicular to the plane where the conveying track 30 is located, and the first angle A1 is the same as the second angle A2, or the first angle A1 is different from the second angle A2. In this embodiment, the first angle A1 is the same as the second angle A2, that is, the first nozzle assembly 11 and the third nozzle assembly 21 are arranged in parallel. For example, the first nozzle assembly 11 and the third nozzle assembly 21 both have a 45° angle with the plane where the conveying track 30 is located, that is, the first angle A1 and the second angle A2 are both 45°, but this is not limited to the actual application. The first nozzle assembly 11 and the second nozzle assembly 12 correspond one-to-one and the third nozzle assembly 21 and the fourth nozzle assembly 22 correspond one-to-one, or the first nozzle assembly 11 and the second nozzle assembly 12 are arranged at intervals and the third nozzle assembly 21 and the fourth nozzle assembly 22 are arranged at intervals. The positions of the first nozzle assembly 11, the second nozzle assembly 12, the third nozzle assembly 21 and the fourth nozzle assembly 22 can be set according to actual needs, without being limited to this.

[0026] In one embodiment, if Figure 1As shown, the first chamber 10 also has a first box (not shown in the figure), the first nozzle assembly 11 and the second nozzle assembly 12 are connected to the first box, and the first solution 13 is placed in the first box. The first box is also connected to a first replenishing pipeline (not shown in the figure). When the concentration of the first solution 13 in the first box is lower than a preset value, the first replenishing pipeline provides a third solution and replenishes it into the first box. The third solution can be, for example, concentrated sulfuric acid.

[0027] In one embodiment, the etching device 100 is in a first use mode, and the first chamber 10 is a pre-etching process. In the first chamber 10 (pre-etching process), the first solution 13 is uniformly sprayed on the first surface 210 and the second surface 220 of the plate-like element 200 through the first nozzle assembly 11 and the second nozzle assembly 12. The first solution 13 is a first etching solution, for example, a mixture of sulfuric acid and hydrofluoric acid (for example, a mixture of 75% sulfuric acid and 55% hydrofluoric acid, but not limited to this in practical applications), and the plate-like element 200 is micro-etched by the first solution 13 (for example, the upper glass substrate 210 and the lower glass substrate 220 are etched by 5um respectively, and the first solution 13 is used to etch the plate-like element 200). The temperature of a chamber 10 is maintained between 35°C and 45°C, and the plate-like element 200 is treated in the first chamber 10 for 4 minutes to 6 minutes, but this is not limited to the actual application. The etching temperature and etching time can be set according to actual needs). This micro-etching treatment does not have much effect on the overall thickness of the plate-like element 200, but can etch away dirt and foreign matter on the upper and lower surfaces of the plate-like element 200. If the concentration of the first solution 13 in the first box 60 is lower than the preset value during the micro-etching treatment, a third solution (for example, 98% concentration of sulfuric acid, but this is not limited to the actual application) is provided through the first replenishing pipeline and replenished into the first box to maintain the etching quality of the first solution 11. After the micro-etching process is completed, the plate-like element 200 moves to the second chamber 20. The second chamber 20 also has a second box (not shown in the figure). The second solution 23 is placed in the second box. In this embodiment, pure water is provided in the second box. The pure water is used to remove the surface charge of the plate-like element 200 and remove the first solution remaining on the surface of the plate-like element 200 when the plate-like element 200 leaves the first chamber 10. In addition, the conveying track 30 can be wetted to prevent the conveying wheel 31 in the conveying track 30 from jumping and causing the plate-like element 200 to jump.

[0028] In another embodiment, the etching device 100 is in the second usage mode, that is, when the etching device 100 is applied to a plate-like element 200 that needs to be thinned, the first chamber 10 is a pre-etching process, the second chamber 20 is a main etching process, and a second etching solution may be provided in the second box to etch and thin the plate-like element 200. The present invention uses the pipeline design of the etching device 100. In different usage modes, it is only necessary to set the second solution in the second box as a cleaning solution or a second etching solution, so that the acid solution can be used to remove dirt on the surface of the plate-like element 200, remove the surface charge of the plate-like element 200 and improve the stability of the plate-like element 200 during the transportation process; or, the etching device 100 is used to etch and thin the plate-like element 200 to achieve the target thickness. By adjusting and replacing the type of the second solution 23 used in the second chamber 20, one etching device 100 can be used in two different usage modes, thereby improving the application flexibility of the etching device 100. Figure 2 As shown, after the plate-like element 200 undergoes the micro-etching process, the overall thickness of the plate-like element 200 is slightly reduced, and the thinned plate-like element 200' is shown by the dotted line in the figure. However, in actual applications, the overall thickness of the plate-like element 200 etched away is only about 10 um (i.e., the upper glass substrate 210 and the lower glass substrate 220 are etched 5 um respectively). Figure 2 It is depicted in an exaggerated manner.

[0029] See also Figure 3 , Figure 3 The etching method flow chart of the present invention is shown in FIG. Figure 3 As shown, the etching device 100 includes a first chamber 10 and a second chamber 20 adjacent to each other, the first chamber 10 and the second chamber 20 include a continuously extending conveying track 30, the conveying track 30 is used to convey the plate-like element 200 from the first chamber 10 to the second chamber 20, and the second chamber 20 is connected to the first chamber 10 through the conveying track 30; the first chamber 10 includes a first nozzle assembly 11 and a second nozzle assembly 12, the first nozzle assembly 11 is located at the top of the first chamber 10, and the second nozzle assembly 12 is arranged opposite to the first nozzle assembly 11 and is located at the bottom of the first chamber 10; the second chamber 20 includes a third nozzle assembly 21 and a fourth nozzle assembly 22, the third nozzle assembly 21 is located at the top of the second chamber 20, and the fourth nozzle assembly 22 is arranged opposite to the third nozzle assembly 21 and is located at the bottom of the second chamber 20; the etching method includes: Step A ( S110 ): The plate-shaped element 200 is placed on the conveying track 30 and enters the first chamber 10 , and the first nozzle assembly 11 and the second nozzle assembly 12 spray the first solution 13 onto the first surface 211 of the plate-shaped element 200 and the second surface 221 opposite to the first surface 211 ; Step B ( S120 ): The plate-shaped element 200 moves from the first chamber 10 to the second chamber 20 via the conveying track 30 , and the third nozzle assembly 21 and the fourth nozzle assembly 22 spray the second solution 23 onto the first surface 211 and the second surface 221 of the plate-shaped element 200 . The first solution 13 is different from the second solution 23 .

[0030] In the first use mode of the etching device 100, the first solution 13 is a first etching solution, and the second solution 23 is a cleaning solution; in the second use mode, the first solution 13 is a first etching solution, and the second solution 23 is a second etching solution.

[0031] In one embodiment, the first chamber 10 further includes a first sensor 40 and a second sensor 50. In step A (S110), the first sensor 40 detects the first thickness of the plate-like element 200 when it is placed on the conveying track 30, and the second sensor 50 detects the second thickness of the plate-like element 200 after being etched by the first solution 13. By comparing the difference between the first thickness and the second thickness, it can be determined whether the plate-like element 200 is etched in place, thereby preventing the plate-like element 200 from flowing into subsequent processes even if it is not etched in place.

[0032] In summary, the present invention provides an etching device and an etching method. In a first use mode, the etching device is provided with a first nozzle assembly and a second nozzle assembly in a first chamber, and a first solution (first etching solution) is evenly sprayed on the upper and lower surfaces of a plate-like element through the nozzle, and the plate-like element is micro-etched to remove dirt on the surface of the plate-like element. A third nozzle assembly and a fourth nozzle assembly are provided in a second chamber, and a second solution (cleaning solution) different from the first solution is evenly sprayed on the upper and lower surfaces of the plate-like element through the nozzle, so as to remove the surface charge of the plate-like element and wet the transmission track at the same time, so as to avoid collision and rupture of the plate-like element due to gear jumping in the transmission track, thereby achieving the plate-like element without appearance defects while improving the yield and production efficiency. In a second use mode, the etching device is provided with a second solution as a second etching solution, and the plate-like element is etched and thinned to reach a target thickness. By adjusting the type of the second solution, the etching device can switch between different use modes to meet different manufacturing needs.

[0033] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the protection scope of the present invention.

Claims

1. An etching device, characterized in that: The etching device comprises a first chamber and a second chamber adjacent to each other, wherein the first chamber and the second chamber comprise a continuously extending conveying track, wherein the conveying track is used to convey the plate-like element from the first chamber to the second chamber, and the second chamber is connected to the first chamber via the conveying track. The first chamber comprises a first nozzle assembly and a second nozzle assembly, wherein the first nozzle assembly is located at the top of the first chamber, and the second nozzle assembly is arranged opposite to the first nozzle assembly and located at the bottom of the first chamber, and the first nozzle assembly and the second nozzle assembly are used to spray a first solution onto a first surface of the plate-like element and a second surface opposite to the first surface during the process of the plate-like element being located in the first chamber; The second chamber includes a third nozzle assembly and a fourth nozzle assembly, the third nozzle assembly is located at the top of the second chamber, the fourth nozzle assembly is arranged opposite to the third nozzle assembly and is located at the bottom of the second chamber, the third nozzle assembly and the fourth nozzle assembly are used to spray a second solution onto the first surface and the second surface of the plate-like element, the first solution is different from the second solution, wherein, in a first usage mode, the first solution is a first etching solution, and the second solution is a cleaning solution; in a second usage mode, the first solution is a first etching solution, and the second solution is a second etching solution.

2. The etching device according to claim 1, characterized in that: The first chamber further includes a first sensor and a second sensor, wherein the first sensor and the second sensor are horizontally spaced apart from the conveying track and are located on the same side of the conveying track.

3. The etching device according to claim 2, characterized in that: The first sensor and the second sensor are located at opposite sides of the first nozzle assembly. The first sensor is arranged adjacent to the inlet of the first chamber, and the second sensor is arranged adjacent to the outlet of the first chamber.

4. The etching device according to claim 1, characterized in that: A first angle is formed between the first nozzle assembly and the plane where the conveying track is located, and the second nozzle assembly is perpendicular to the plane where the conveying track is located.

5. The etching device according to claim 4, characterized in that: There is a second angle between the third nozzle assembly and the plane where the conveying track is located, the fourth nozzle assembly is perpendicular to the plane where the conveying track is located, the first angle is the same as the second angle, or the first angle is different from the second angle.

6. The etching device according to claim 1, characterized in that: The first solution is a mixture of sulfuric acid and hydrofluoric acid, and the second solution is pure water.

7. The etching device according to claim 1, characterized in that: The first chamber has a first box body. The first nozzle assembly and the second nozzle assembly are connected to the first box body. The first solution is placed in the first box body.

8. The etching device according to claim 7, characterized in that: The first box is also connected to a first supplementary pipeline. When the concentration of the first solution in the first box is lower than a preset value, the first supplementary pipeline provides a third solution and supplements it into the first box.

9. An etching method, characterized in that: The etching device comprises a first chamber and a second chamber adjacent to each other, wherein the first chamber and the second chamber comprise a continuously extending conveying track, and the second chamber is connected to the first chamber via the conveying track; the first chamber comprises a first nozzle assembly and a second nozzle assembly, wherein the first nozzle assembly is located at the top of the first chamber, and the second nozzle assembly is arranged opposite to the first nozzle assembly and is located at the bottom of the first chamber; the second chamber comprises a third nozzle assembly and a fourth nozzle assembly, wherein the third nozzle assembly is located at the top of the second chamber, and the fourth nozzle assembly is arranged opposite to the third nozzle assembly and is located at the bottom of the second chamber; the etching method comprises: Step A: the plate-shaped element is placed on the conveying track and enters the first chamber, and the first nozzle assembly and the second nozzle assembly spray a first solution onto a first surface of the plate-shaped element and a second surface opposite to the first surface; Step B: the plate-shaped element moves from the first chamber to the second chamber via the conveying track, and the third nozzle assembly and the fourth nozzle assembly spray a second solution onto the first surface and the second surface of the plate-shaped element, wherein the first solution is different from the second solution; Wherein, in the first use mode, the first solution is a first etching solution, and the second solution is a cleaning solution; In the second use mode, the first solution is a first etching solution, and the second solution is a second etching solution.

10. The etching method according to claim 9, characterized in that: The first chamber further includes a first sensor and a second sensor. In step A, the first sensor detects a first thickness of the plate-like element when it enters the first chamber, and the second sensor detects a second thickness of the plate-like element when it leaves the first chamber.

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