Reaction chamber

Abstract

The invention provides a reaction chamber. The reaction chamber comprises a chamber substrate; the rotating tray is positioned in the chamber base body; the rotating tray is provided with a plurality of first grooves, the first grooves are distributed in the circumferential direction of the rotating tray, and notches of the first grooves are located in the lower surface, away from the semiconductor workpiece, of the rotating tray; the section of the first groove along a preset sectioning plane is in an isosceles triangle shape; the preset sectioning plane is parallel to the vertical direction and is perpendicular to the length direction of the central axis, facing the cavity base body, of the first groove; the vertical air floatation assembly is provided with a vertical air inlet pipeline and a plurality of vertical air floatation blocks; the vertical air floating block is located below the rotary tray, and the axial direction of an air outlet hole of the vertical air floating block is parallel to the vertical direction; the rotary air flotation assembly is provided with a rotary air flotation block and a rotary air inlet pipeline; the rotary air floating block is positioned below the rotary tray; the axial direction of the air outlet hole of the rotary air floating block is inclined relative to the vertical direction; the angle between the axial direction and the horizontal direction of the air outlet hole of the rotary air floating block is equal to the base angle corresponding to the section of the isosceles triangle.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor manufacturing technology, and in particular to a reaction chamber. Background Art

[0002] Wafer thermal treatment is a key step in the semiconductor wafer manufacturing process, and the wafer is usually heated or cooled in a closed chamber. During the process of processing the wafer, it is usually necessary to control the movement state of the wafer. Summary of the invention

[0003] The present disclosure provides a reaction chamber, comprising: a chamber base; a rotating tray, located in the chamber base, for supporting a semiconductor workpiece; the rotating tray is provided with a plurality of first grooves, the plurality of first grooves are distributed along the circumference of the rotating tray, and the notches of the first grooves are located on the lower surface of the rotating tray away from the semiconductor workpiece; the cross section of the first groove along a preset cutting plane is an isosceles triangle; the preset cutting plane is parallel to the vertical direction and perpendicular to the length direction of the first groove toward the central axis of the chamber base; a vertical air flotation component, for adjusting the suspension height of the rotating tray, having a vertical air inlet pipeline and a plurality of A vertical air flotation block; the vertical air flotation block is located below the rotating tray, and the axial direction of the air outlet of the vertical air flotation block is parallel to the vertical direction; a rotating air flotation assembly, comprising a rotating air flotation block and a rotating air inlet pipeline; the rotating air flotation block is located below the rotating tray; the axial direction of the air outlet of the rotating air flotation block is inclined relative to the vertical direction, so that the gas flowing out of the air outlet of the rotating air flotation block can act on the side wall of the first groove, thereby controlling the rotation direction or rotation speed of the rotating tray; wherein the angle between the axial direction and the horizontal direction of the air outlet of the rotating air flotation block is equal to the base angle corresponding to the cross-section of an isosceles triangle.

[0004] In some embodiments, the first groove has a first side wall and a second side wall, and one of the first side wall and the second side wall is used to contact the gas flowing out of the gas outlet hole of the rotating air floating block.

[0005] In some embodiments, along the width center line of the first groove, there is a first distance between the first sidewall and the second sidewall, there is a second distance between two adjacent first grooves, and the ratio of the second distance to the first distance is less than or equal to a threshold.

[0006] In some embodiments, the orthographic projection of the vertical air flotation block on the lower surface of the rotating tray is staggered with the notch of the first groove.

[0007] In some embodiments, the rotating air floating block includes: a first sub-air floating block and a second sub-air floating block, the gas flowing out of the air outlet of the first sub-air floating block can drive the rotating tray to rotate along a first direction, and the gas flowing out of the air outlet of the second sub-air floating block can drive the rotating tray to rotate along a second direction, and the second direction is opposite to the first direction; the air outlet of the first sub-air floating block and the air outlet of the second sub-air floating block are distributed along a first circumference, and the air outlet of the first sub-air floating block and the air outlet of the second sub-air floating block are symmetrically distributed about a preset symmetry line, and the preset symmetry line passes through the central axis of the rotating tray.

[0008] In some embodiments, the air outlet holes of the plurality of vertical air floating blocks are evenly distributed along a second circumference, and a diameter of the second circumference is smaller than a diameter of the first circumference.

[0009] In some embodiments, the rotating air inlet pipeline includes: a first branch and a second branch, the first branch is connected to the first sub-air floating block, the second branch is connected to the second sub-air floating block, and the first branch and the second branch are equal in length.

[0010] In some embodiments, an orthographic projection of a center line of the first groove along the width direction on a preset horizontal plane is tangent to an orthographic projection of the first circumference on the preset horizontal plane.

[0011] In some embodiments, the orthographic projection of the central axis of the air outlet of the rotating air floating block on a preset horizontal plane is tangent to the orthographic projection of the first circle on the preset horizontal plane.

[0012] In some embodiments, the outlet port of the air outlet hole of the vertical air floating block is flush with the outlet port of the air outlet hole of the rotating air floating block.

[0013] In some embodiments, the rotating tray is provided with a plurality of second grooves, the plurality of second grooves are distributed along the circumference of the rotating tray, the notches of the second grooves are located on the sides of the rotating tray, and the second grooves vertically penetrate the rotating tray; the reaction chamber further comprises a first detection unit, the first detection unit comprises a corresponding first part and a second part, the first part is located above the rotating tray, and the second part is located below the rotating tray; when the rotating tray rotates until the second groove is located between the first part and the second part, the first detection unit is used to generate a detection signal and send it to the control device.

[0014] It should be understood that the content described in this section is not intended to identify the key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The accompanying drawings are used to better understand the present solution and do not constitute a limitation of the present disclosure.

[0016] Figure 1 is a schematic diagram of a three-dimensional structure of a reaction chamber according to an embodiment of the present disclosure;

[0017] Figure 2 is a schematic diagram of the side structure of a reaction chamber according to an embodiment of the present disclosure;

[0018] Figure 3 The reaction chamber according to the embodiment of the present disclosure is Figure 2 Schematic diagram of the cross section at AA in the middle;

[0019] Figure 4 The reaction chamber according to the embodiment of the present disclosure is Figure 2 Schematic diagram of the cross section at the middle BB;

[0020] Figure 5 It is a schematic diagram of the top structure of a rotating tray, a vertical air flotation assembly, a rotating air flotation assembly and a bottom plate in a reaction chamber according to an embodiment of the present disclosure;

[0021] Figure 6 yes Figure 5 Schematic diagram of the cross section at CC;

[0022] Figure 7 yes Figure 5 Schematic diagram of the cross section at EE;

[0023] Figure 8 yes Figure 6 The enlarged schematic diagram of part F in the middle;

[0024] Fig. 9 yes Figure 7 A magnified schematic diagram of part G in the middle;

[0025] Fig.10 yes Figure 5 A magnified schematic diagram of the middle H section;

[0026] Fig.11 yes Figure 5 An enlarged schematic diagram of part I;

[0027] Fig.12 It is a schematic diagram of the three-dimensional structure of a rotating tray, a vertical air flotation assembly, a rotating air flotation assembly and a bottom plate in a reaction chamber according to an embodiment of the present disclosure;

[0028] Fig.13 is a gas circuit principle diagram according to an embodiment of the present disclosure;

[0029] Fig.14 is a control principle diagram according to an embodiment of the present disclosure.

[0030] Explanation of the reference numerals: 100 - chamber base; 110 - top plate; 120 - bottom plate; 130 - quartz plate; 200 - rotating tray; 210 - first groove; 211 - first side wall; 212 - second side wall; 220 - second groove; 300 - vertical air flotation assembly; 310 - vertical air inlet pipeline; 320 - vertical air flotation block; 321 - air outlet of vertical air flotation block; 400 - rotating air flotation assembly; 410 - rotating air inlet pipeline; 420 - rotating air flotation block; 421 - first sub-air flotation block; 422 - second sub-air flotation block; 420a - air outlet of rotating air flotation block; 500 - first detection unit; 510 - through-beam sensor; 511 - first part; 512 - second part. DETAILED DESCRIPTION

[0031] The following is a description of exemplary embodiments of the present disclosure in conjunction with the accompanying drawings, including various details of the embodiments of the present disclosure to facilitate understanding, which should be considered as merely exemplary. Therefore, it should be recognized by those of ordinary skill in the art that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0032] Please refer to Figures 1 to 12 The present embodiment provides a reaction chamber, comprising: a chamber base 100, a rotating tray 200, a vertical air flotation assembly 300 and a rotating air flotation assembly 400. For ease of description, the following description will be made by taking the axial direction of the chamber base 100 as the vertical direction, the gravity direction as the downward direction, and the direction toward the central axis of the chamber base 100 as the inward direction as an example.

[0033] like Figures 1 to 3 As shown, the chamber base 100 may be cylindrical or prism-shaped, for example, the chamber base 100 is in the shape of a quadrangular prism. The chamber base 100 is the main bearing member of the reverse chamber, used to accommodate semiconductor workpieces (such as wafers), and used to install the rotating tray 200, the heating device, the vertical air flotation assembly 300 and the rotating air flotation assembly 400, etc. Exemplarily, the chamber base 100 has a top plate 110 and a bottom plate 120 that are arranged opposite to each other, and the top plate 110 and the bottom plate 120 are connected by side plates; the top plate 110 and the bottom plate 120 can be respectively installed with heating devices, and the heating devices can include multiple lamp tubes arranged side by side, the relatively upper heating device is used to heat the upper surface of the semiconductor workpiece, and the relatively lower heating device is used to heat the lower surface of the semiconductor workpiece; a quartz plate 130 can be arranged on the side of the heating device facing the semiconductor workpiece, the relatively upper quartz plate 130 cooperates with the top plate 110, and the relatively lower quartz plate 130 cooperates with the bottom plate 120, so as to separate the space where the heating device is located from the space where the semiconductor workpiece is located.

[0034] like Figure 4 As shown, the rotating tray 200 is generally in the shape of a circular plate and is mainly used to support semiconductor workpieces. The rotating tray 200 is rotatably connected to the chamber base 100 through a bearing. Exemplarily, a mounting shaft is provided in the chamber base 100, and a bearing is installed on the mounting shaft. The rotating tray 200 is provided with a bearing hole, and the bearing hole cooperates with the bearing. The upper surface of the rotating tray 200 faces the semiconductor workpiece. Among them, the rotating tray 200 can be made of quartz material so that the heat energy radiated by the heating device can pass through.

[0035] like Figure 5 , Figure 6 , Figure 8 and Fig.10 As shown, the rotating tray 200 is provided with a plurality of first grooves 210, and the plurality of first grooves 210 are distributed along the circumference of the rotating tray 200, and the notches of the first grooves 210 are located on the lower surface of the rotating tray 200; the first grooves 210 can correspond to the rotating air flotation block 420 in the rotating air flotation assembly 400, so as to utilize the gas flowing out from the air outlet 420a of the rotating air flotation block to realize the control of the rotation direction and the rotation speed.

[0036] The depth direction of the first groove 210 is parallel to the vertical direction, the first groove 210 has a length direction along the inner and outer directions, and the first groove 210 has a width direction perpendicular to the vertical direction and the length direction. Fig.10 For the first groove 210 located at the bottom, its length direction is the up-down direction in the figure, its width direction is the left-right direction in the figure, and its depth direction is the direction perpendicular to the paper.

[0037] The cross section of the first groove 210 along the preset cutting plane is an isosceles triangle; the preset cutting plane is parallel to the vertical direction and perpendicular to the length direction of the first groove 210. In this way, during the rotation of the rotating tray 200, the gas blown out from the rotating air flotation block 420 is blown to one of the side walls of the first groove 210, and will not be blown to the other side wall of the first groove 210, thereby improving the utilization rate of the gas blown out from the rotating air flotation block 420. Moreover, when any of the two side walls of the first groove 210 is used as a force-bearing surface, the force-bearing area is equal. Among them, the base angle corresponding to the cross section of the isosceles triangle is θ1.

[0038] like Figure 5 , Figure 7 and Fig. 9 As shown, the vertical air flotation assembly 300 is used to adjust the suspension height of the rotating tray 200 and can keep the rotating tray 200 at the target height. The part of the vertical air flotation assembly 300 located in the chamber base 100 is made of quartz material so that the heat energy radiated by the heating device can pass through.

[0039] The vertical air flotation assembly 300 has a vertical air inlet pipeline 310 and a plurality of vertical air flotation blocks 320. The vertical air flotation blocks 320 are located below the rotating tray 200. The vertical air flotation blocks 320 can be fixedly mounted on the upper surface of the quartz plate 130 located below. The plurality of vertical air flotation blocks 320 can be distributed at intervals along the circumference of the rotating tray 200. Each vertical air flotation block 320 is respectively provided with an air outlet 321, and the axial direction of the air outlet 321 of the vertical air flotation block is parallel to the vertical direction, so that the gas flowing out of the air outlet 321 of the vertical air flotation block can provide a greater force on the rotating tray 200. The air outlet 321 of the vertical air flotation block adopts a throttling hole.

[0040] Optionally, in order to improve the stability of the rotating tray 200, at least three vertical air floating blocks 320 may be spaced and evenly distributed along the second circumference, and the center of the second circumference is located on the central axis of the rotating tray 200. In some examples, each vertical air floating block 320 may be spaced and evenly distributed along the second circumference. In other examples, a portion of the vertical air floating blocks 320 may be spaced and evenly distributed along the second circumference, and another portion of the vertical air floating blocks 320 may be spaced and evenly distributed along a third circumference, the center of the third circumference is located on the central axis of the rotating tray 200, and the diameter of the third circumference is smaller than the diameter of the second circumference.

[0041] Optionally, the orthographic projections of the vertical air floating blocks 320 on the lower surface of the rotating tray 200 are staggered with the notches of the first grooves 210 to prevent the gas flowing out of the gas outlets 321 of the vertical air floating blocks from interfering with the rotating motion of the rotating tray 200. In other examples, for the sake of structural compactness, the orthographic projections of the vertical air floating blocks 320 on the lower surface of the rotating tray 200 may also overlap with the area near the edge of the notches of the first grooves 210.

[0042] The vertical air inlet pipeline 310 has multiple third branches. In some examples, in order to simplify the vertical and its pipeline 310, one of the vertical air floating blocks 320 is connected to the total air inlet pipeline, and two adjacent vertical air floating blocks 320 are connected through the third branch, so that each third branch is arranged in series. A pressure regulating valve can be arranged in the total air inlet pipeline, and the pressure regulating valve is electrically connected to the control device, and the control device can control the magnitude of the force applied by the vertical air floating assembly 300 to the rotating tray 200 through the pressure regulating valve. In other examples, multiple third branches are respectively connected to corresponding vertical air floating blocks 320, and multiple third branches are respectively connected to the total air inlet pipeline, and multiple third branches are arranged in parallel, so that it is convenient for the control device to independently control the gas flow in multiple third branches.

[0043] like Figure 5 , Figure 6 and Figure 8As shown, the rotating air flotation assembly 400 is used to control the rotating direction or rotating speed of the rotating tray 200. The portion of the rotating air flotation assembly 400 located in the chamber base 100 is made of quartz material so that the heat energy radiated by the heating device can pass through.

[0044] The rotating air flotation assembly 400 includes a rotating air flotation block 420 and a rotating air inlet pipeline 410. The rotating air flotation block 420 is located below the rotating tray 200. The rotating air flotation block 420 is fixedly mounted on the upper surface of the quartz plate 130 located below. The rotating air flotation block 420 is provided with an air outlet hole 420a, and the axial direction of the air outlet hole 420a of the rotating air flotation block is inclined relative to the vertical direction, so that the gas flowing out of the air outlet hole 420a of the rotating air flotation block can act on the side wall of the first groove 210. The air outlet hole 420a of the rotating air flotation block adopts a throttling hole.

[0045] Among them, the angle θ2 between the axial direction and the horizontal direction of the air outlet 420a of the rotating air flotation block is an acute angle, so that the horizontal component of the force provided by the gas flowing out of the air outlet 420a of the rotating air flotation block can account for a larger part, thereby facilitating the improvement of the utilization rate of the gas flowing out of the air outlet 420a of the rotating air flotation block.

[0046] The angle θ2 between the axial direction and the horizontal direction of the air outlet 420a of the rotating air flotation block is equal to the base angle θ1 corresponding to the cross section of the isosceles triangle, that is, θ2=θ1, so that the gas flowing out of the air outlet 420a of the rotating air flotation block can be vertical to the force-bearing surface of the first groove 210, which is convenient for accurately controlling the rotation of the rotating tray 200 and the semiconductor workpiece, and improving the stability of the rotation of the rotating tray 200 and the semiconductor workpiece. Among them, the first groove 210 has a first side wall 211 and a second side wall 212, and one of the first side wall 211 and the second side wall 212 is used as a force-bearing surface.

[0047] Optionally, in order to allow the gas flowing out of the outlet hole 420a of the rotating air flotation block to act on one of the side walls of the first groove 210 and provide more horizontal force components, the angle θ2 between the axial direction and the horizontal direction of the outlet hole 420a of the rotating air flotation block can be less than or equal to 45° and greater than or equal to 15°. For example, the angle θ2 between the axial direction and the horizontal direction of the outlet hole of the air flotation block can be 45°, 40°, 38°, 35°, 32°, 30°, 28°, 25°, 20°, or 15°, or an angle between any two of the above.

[0048] In some examples, the rotating air float block 420 includes: a first sub-air float block 421 and a second sub-air float block 422, the gas flowing out of the air outlet of the first sub-air float block 421 can drive the rotating tray 200 to rotate in a first direction, and the gas flowing out of the air outlet of the second sub-air float block 422 can drive the rotating tray 200 to rotate in a second direction, and the second direction is opposite to the first direction. The rotating air inlet pipeline 410 includes: a first branch and a second branch, the first branch is connected to the first sub-air float block 421, and the second branch is connected to the second sub-air float block 422. The first branch and the second branch are respectively provided with pressure regulating valves, and the pressure regulating valves are respectively electrically connected to the control device, so that the control device adjusts the gas flow in the first branch or the second branch through the pressure regulating valve, thereby adjusting the rotation direction or rotation speed of the rotating tray 200.

[0049] For example, the first direction is counterclockwise, and the second direction is clockwise. The control device can control the gas flow in the first branch by controlling the pressure regulating valve in the first branch, thereby controlling the rotating tray 200 to rotate in the counterclockwise direction, such as accelerating the rotation; when uniform rotation or decelerated rotation is required, the control device can also control the pressure regulating valve in the second branch to control the gas flow in the second branch. The control device can control the gas flow in the second branch by controlling the pressure regulating valve in the second branch, thereby controlling the rotating tray 200 to rotate in the clockwise direction, such as accelerating the rotation; when uniform rotation or decelerated rotation is required, the control device can also control the pressure regulating valve in the first branch to control the gas flow in the first branch. Among them, the specific control process of the control device can be set according to actual needs.

[0050] Optionally, the lengths of the first branch and the second branch are equal to ensure that the energy loss of the gas in the first branch and the second branch is consistent, so that the force exerted by the gas flowing out of the first sub-air floating block 421 and the second sub-air floating block 422 on the rotating tray 200 is consistent, thereby facilitating improving the control accuracy of the rotational motion of the rotating tray 200.

[0051] In other examples, the rotating air flotation block 420 may be provided with two air outlets, and the force exerted by the gas flowing out of the two air outlets on the rotating tray 200 can drive the rotating tray 200 to rotate in opposite directions. For example, the gas flowing out of one of the air outlets can drive the rotating tray 200 to rotate in a first direction, and the gas flowing out of the other air outlet can drive the rotating tray 200 to rotate in a second direction, which is opposite to the first direction. The two air outlets are respectively provided with pressure regulating valves; wherein, when the pressure regulating valve adjusts the gas flow of the corresponding air outlet to 0, the air outlet is in a closed state.

[0052] The reaction chamber provided in the present embodiment can control the vertical movement of the rotating tray 200 and the semiconductor workpiece by providing a vertical air flotation component 300, a rotating air flotation component 400, and providing a first groove 210 on the lower surface of the rotating tray 200 that cooperates with the rotating air flotation component 400, and can also control the rotational movement of the rotating tray 200 and the semiconductor workpiece, and is conducive to the heat energy radiated by the heating device to pass through the vertical air flotation component 300 and the rotating air flotation component 400, which is conducive to ensuring that the semiconductor workpiece is heated uniformly; by providing the first groove 210 with a cross-section along a preset cutting plane in the shape of an isosceles triangle; the preset cutting plane is parallel to the vertical direction and perpendicular to the length direction of the first groove 210 toward the central axis of the chamber base 100, the utilization rate of the gas blown out from the rotating air flotation block 420 can be improved, which is conducive to saving energy.

[0053] In some embodiments, in order to improve the utilization rate of the gas flowing out of the gas outlet hole 420a of the rotating air floating block, the first groove 210 has a first side wall 211 and a second side wall 212, one of the first side wall 211 and the second side wall 212 is used to contact the gas flowing out of the gas outlet hole 420a of the rotating air floating block, and the other of the first side wall 211 and the second side wall 212 is parallel to the axial direction of the gas outlet hole 420a of the rotating air floating block, so that the angle θ2 between the axial direction of the gas outlet hole 420a of the rotating air floating block and the horizontal direction is equal to the base angle θ1 of the isosceles triangle.

[0054] Taking the case where the gas flowing out of the gas outlet 420a of the rotating air floating block acts on the first side wall 211 as an example, the second side wall 212 is parallel to the axial direction of the gas outlet 420a of the rotating air floating block, and the angle between the axial direction of the gas outlet 420a of the rotating air floating block and the horizontal direction is equal to the angle between the second side wall 212 and the horizontal direction. In this way, it is possible to effectively reduce or even avoid the gas flowing out of the gas outlet 420a of the rotating air floating block from blowing toward the second side wall 212, so that more gas can act on the first side wall 211, thereby improving the utilization rate of the gas flowing out of the gas outlet 420a of the rotating air floating block.

[0055] In other embodiments, the angle between the axial direction of the air outlet 420a of the rotating air flotation block and the horizontal direction may be smaller than the angle between the second side wall 212 and the horizontal direction, so as to reduce the gas flowing from the air outlet 420a of the rotating air flotation block to the second side wall 212, so that more gas can act on the first side wall 211.

[0056] In some embodiments, along the width centerline of the first groove 210, there is a first distance L1 between the edge of the first side wall 211 close to the notch and the edge of the second side wall 212 close to the notch, and there is a second distance L2 between two adjacent first grooves 210, and the ratio of the second distance L2 to the first distance L1 is less than or equal to a threshold value. The second distance L2 is the distance between the corresponding edges of the notches of two adjacent first grooves 210.

[0057] Exemplarily, the threshold value may be less than or equal to 0.22. For example, the ratio between the second distance L2 and the first distance L1 may be 0.22 or 0.21 or 0.20 or 0.19 or 0.18 or 0.17 or 0.16 or 0.15 or 0.14, or a ratio between any two of the above. In this way, when the rotating tray 200 rotates with the semiconductor workpiece, the transition force between the two adjacent first grooves 210 can be relatively smooth and there will be no setbacks, thereby ensuring the stability of the semiconductor workpiece.

[0058] It can be understood that: within the processable range, the smaller the second distance between two adjacent first grooves 210 is, the more conducive it is to the stability of the semiconductor workpiece.

[0059] In some embodiments, the air outlet holes of the first sub-air floating block 421 and the air outlet holes of the second sub-air floating block 422 are arranged along a first circumference (ie, Figure 5 The first sub-air float block 421 and the second sub-air float block 422 are symmetrically distributed about a preset symmetry line, and the preset symmetry line passes through the central axis of the rotating tray 200, so as to improve the control accuracy of the rotational motion and facilitate the layout of the first branch corresponding to the first sub-air float block 421 and the second branch corresponding to the second sub-air float block 422. The distribution of the air outlets of the first sub-air float block 421 and the second sub-air float block 422 along the first circumference means that the first circumference passes through the center of the outlet port of the air outlet of the first sub-air float block 421 and the center of the outlet port of the air outlet of the second sub-air float block 422.

[0060] In some examples, the outlet holes of the first sub-air floating block 421 and the outlet holes of the second sub-air floating block 422 are distributed along the first circumference, and the outlet holes 321 of the plurality of vertical air floating blocks are evenly distributed along the second circumference, and the diameter of the second circumference is smaller than the diameter D1 of the first circumference, that is, the outlet holes of the first sub-air floating block 421 (or the outlet holes of the second sub-air floating block 422) are located outside the outlet holes 321 of the vertical air floating block, thereby facilitating the avoidance of mutual interference between the vertical air floating assembly 300 and the rotating air floating assembly 400. The outlet holes 321 of the plurality of vertical air floating blocks are distributed along the second circumference, which means that the second circumference passes through the center of the outlet ports of the outlet holes 321 of the plurality of vertical air floating blocks.

[0061] In order to improve the compactness of the structure and the stability of the semiconductor workpiece, the ratio of the diameter of the second circumference to the diameter D1 of the first circumference can be greater than or equal to 0.92 and less than or equal to 0.96. For example, the ratio of the diameter of the second circumference to the diameter of the first circumference can be 0.92 or 0.93 or 0.94 or 0.95 or 0.96, or a ratio between any two of the above.

[0062] When there are three vertical air floating blocks 320, one of the vertical air floating blocks 320 is located on the preset symmetry line, and the other two vertical air floating blocks 320 are symmetrically distributed about the preset symmetry line. The first sub-air floating block 421 and the second sub-air floating block 422 are relatively close to the vertical air floating block 320 symmetrically distributed about the preset symmetry line. The first sub-air floating block 421 and the second sub-air floating block 422 each have one, and the connecting line of the first sub-air floating block 421 and the second sub-air floating block 422 can pass through the central axis of the rotating tray 200.

[0063] In other examples, the diameter of the second circle may be larger than that of the first circle, that is, the outlet hole of the first sub-air floating block 421 (or the outlet hole of the second sub-air floating block 422 ) is located inside the outlet hole 321 of the vertical air floating block.

[0064] In other examples, there may be a plurality of first sub-air floating blocks 421 and a plurality of second sub-air floating blocks 422 , wherein each first sub-air floating block 421 is located on the same side of a preset symmetry line, and each second sub-air floating block 422 is located on the other side of the preset symmetry line, so as to simplify the rotating air intake pipeline 410 .

[0065] In some examples, the orthographic projection of the center line of the first groove 210 along the width direction on the preset horizontal plane is tangent to the orthographic projection of the first circumference on the preset horizontal plane, so that the air outlet 420a of the rotating air flotation block is closer to the center of the first groove 210, which is conducive to allowing the gas blown out by the rotating air flotation block 420 to blow toward one of the side walls of the first groove 210.

[0066] In some examples, the orthographic projection of the central axis of the air outlet 420a of the rotating air flotation block on the preset horizontal plane is tangent to the orthographic projection of the first circle on the preset horizontal plane, so that a larger component of the force of the gas flowing out of the air outlet 420a of the rotating air flotation block can drive the rotating tray 200 to rotate, thereby improving the utilization rate of the gas flowing out of the air outlet 420a of the rotating air flotation block.

[0067] In some examples, the outlet port of the air outlet hole 321 of the vertical air floating block is flush with the outlet port of the air outlet hole 420a of the rotating air floating block. There is a gap between the outlet port of the air outlet hole 321 of the vertical air floating block and the lower surface of the rotating tray 200 to prevent the vertical air floating block 320 from interfering with the rotating motion of the rotating tray 200; the gap between the outlet port of the air outlet hole 321 of the vertical air floating block and the lower surface of the rotating tray 200 can be set to be smaller, so that the gas flowing out of the air outlet hole 321 of the vertical air floating block can contact the rotating tray 200, which is conducive to improving the utilization rate of the gas flowing out of the air outlet hole 321 of the vertical air floating block.

[0068] There is a distance between the outlet port of the air outlet hole 420a of the rotating air floating block and the lower surface of the rotating tray 200 to prevent the rotating air floating block 420 from interfering with the rotating motion of the rotating tray 200; the distance between the outlet port of the air outlet hole 420a of the rotating air floating block and the lower surface of the rotating tray 200 can be set to be smaller, so that the gas flowing out of the air outlet hole 420a of the rotating air floating block can contact one of the side walls of the first groove 210, which is beneficial to improve the utilization rate of the gas flowing out of the air outlet hole 321 of the vertical air floating block.

[0069] like Fig.12 As shown, in some embodiments, the reaction chamber further includes at least one first detection unit 500, and the first detection unit 500 is electrically connected to the control device. The control device is used to determine the rotation speed of the rotating tray 200 according to the detection signal of the first detection unit 500, and to determine whether the rotation speed of the rotating tray 200 needs to be adjusted. If adjustment is required, it is achieved by controlling the rotating air flotation assembly 400. Exemplarily, the first detection unit 500 may include a photoelectric sensor.

[0070] like Fig.11 As shown, the rotating tray 200 is provided with a plurality of second grooves 220, which are spaced apart along the circumference of the rotating tray 200, and the second grooves 220 are arranged vertically through the rotating tray 200. The notches of the second grooves 220 are located on the side of the rotating tray 200, so that the side of the rotating tray 200 is serrated.

[0071] The first detection unit 500 may include at least one through-beam sensor 510, wherein a first portion 511 of the through-beam sensor 510 may be located above the rotating tray 200, and a second portion 512 of the through-beam sensor 510 may be located below the rotating tray 200; when one of the second grooves 220 is located between the first portion 511 and the second portion 512, a signal emitted by the first portion 511 can pass through the first groove 210 to reach the second portion 512, and the second portion 512 will generate a detection signal and send it to the control device; wherein the first portion 511 may be connected to the side wall of the chamber base 100 or the quartz plate 130 located above, and the second portion 512 may be connected to the side wall of the chamber base 100 or the quartz plate 130 located below. In other examples, the second portion 512 may also be located in the second groove 220 of the rotating tray 200.

[0072] In order to improve the accuracy of the detection result, the through-beam sensor 510 may include a plurality of through-beam sensors 510, wherein two through-beam sensors 510 are symmetrically distributed along a preset symmetry line passing through the central axis of the rotating tray 200. The preset symmetry line of the two through-beam sensors 510 and the preset symmetry line of the air outlet of the first sub-air floating block 421 and the air outlet of the second sub-air floating block 422 may overlap or may not overlap, and may be specifically set according to actual needs.

[0073] Optionally, the controller in the control device is electrically connected to the first detection unit 500 to form a PID control loop, thereby facilitating ensuring the stability of the rotating tray 200 during the rotation process.

[0074] In other embodiments, the first part 511 of the first detection unit 500 can be located above or below the rotating tray 200, and the second part 512 of the first detection unit 500 can be located on the surface of the rotating tray 200 facing the first part 511. When the second part 512 rotates with the rotating tray 200 to correspond to the first part 511, the first detection unit 500 will generate a detection signal and send it to the control device.

[0075] In some embodiments, the reaction chamber may further include a second detection unit, which is used to detect the pressure of the vertical air flotation block 320 acting on the rotating tray 200. The second detection unit is electrically connected to the control device. The second detection unit may include a pressure sensitive element fixed to the lower surface of the rotating tray 200, or the second detection unit may include a vertical air flotation pressure gauge disposed in the vertical air inlet pipeline 310 and disposed close to the rotating tray 200.

[0076] Optionally, the controller in the control device is electrically connected to the second detection unit to form a PID control loop, thereby facilitating ensuring the stability of the air floating height of the rotating tray 200 .

[0077] Please refer to Figures 5 to 12 As shown, one of the reaction chambers provided in this embodiment is illustrated below. The vertical air flotation assembly 300 includes three vertical air flotation blocks 320, which are evenly distributed on the second circumference to achieve relatively balanced vertical force of three-point support; the rotating air flotation block 420 in the rotating air flotation assembly 400 includes a first sub-air flotation block 421 and a second sub-air flotation block 422, which are evenly distributed on the first circumference to ensure that the length of the air intake path is consistent; the diameter of the first circumference is greater than the diameter of the second circumference. The air outlet holes of the vertical air flotation block 320, the first sub-air flotation block 421 and the second sub-air flotation block 422 all use throttling holes. The air outlet hole 420a of the rotating air flotation block is an oblique hole, and the orthographic projection of the central axis of the air outlet hole 420a of the rotating air flotation block on the horizontal plane is tangent to the orthographic projection of the first circumference on the horizontal plane.

[0078] The entire annular area where the lower surface of the rotating tray 200 contacts the vertical air flotation block 320 is a plane. The annular area corresponding to the rotating tray 200 and the air outlet 420a of the rotating air flotation block is provided with a first groove 210 which is symmetrical along the radial center and the cross section of the radial section is an isosceles triangle. The first grooves 210 are evenly distributed along the first circumference. The center line of the first groove 210 along its width direction is tangent to the first circumference. Taking the example that the gas blown out of the rotating air flotation block 420 can act on the first side wall 211 of the first groove 210, the axial direction of the air outlet 420a of the rotating air flotation block is parallel to the second side wall 212 of the first groove 210, thereby ensuring that during the rotation of the rotating tray 200, the air flow can be unidirectionally and stably blown to the first side wall 211 subjected to force but not to the second side wall 212, and the angle is as acute as possible, so that the rotating tray 200 is mainly subjected to the horizontal component force.

[0079] The smaller the distance between two adjacent first grooves 210 is within the processing range, the better. In this way, when the two first grooves 210 are subjected to excessive force during the rotation and blowing, the two grooves 210 can be ensured to be stable and without setbacks. The center of the rotating tray 200 and the quartz plate 130 located below are provided with a rotating pair to realize the rotation function through a ball bearing. In order to ensure that the forward and reverse rotation detection can be realized, the two opposing sensors 510 are symmetrically distributed along the preset symmetry line and can correspond to the second grooves 220 in the sawtooth structure around the rotating tray 200. When the rotating tray 200 is in a rotating state, the vertical force applied to the rotating tray 200 by the three vertical air flotation blocks 320 is balanced with the gravity of the rotating tray 200.

[0080] The horizontal torque of the rotating tray 200 is equal to the force-bearing area because the force-bearing surface of the first groove 210 is a symmetrical structure. Figure 5As shown, after the rotating tray 200 floats, the very small flow rates in the first sub-air float block 421 and the second sub-air float block 422 can be used to control the magnitudes of the torques M1 and M2 respectively. Since M1 and M2 are in opposite directions, when M1=M2, the rotating tray 200 is in a stationary state or a uniformly rotating state, and the specific rotation direction and motion state depend on the initial conditions; when M1 and M2 are not equal, the rotating tray 200 is in an accelerating or decelerating state, and the specific rotation direction and motion state depend on the initial conditions.

[0081] Please refer to Fig.13 and Fig.14 As shown, the airflow of the first sub-air floating block 421 is mainly regulated by air path a, the airflow in the vertical air floating block 320 is mainly regulated by air path b, and the airflow of the second sub-air floating block 422 is mainly regulated by air path c.

[0082] Gas circuit a includes: a switch, a pressure regulating valve, a second pressure gauge, a filter, a mass flow controller (MFC), a normally closed diaphragm valve and other components. The structure of gas circuit b is similar to that of gas circuit a; in gas circuit b, a second pressure gauge is also provided at the output end of the normally closed diaphragm valve to detect the pressure applied to the rotating tray 200 by the vertical air flotation block 320. Gas circuit c has the same structure as gas circuit a. Among them, the mass flow controller in gas circuit a is a rotation acceleration intake flow controller, the mass flow controller in gas circuit b is a vertical air flotation flow controller, and the mass flow controller in gas circuit c is a rotation deceleration intake flow controller.

[0083] The control device includes: a main controller, a rotation acceleration intake flow controller, a vertical air flotation flow controller and a rotation deceleration intake flow controller; the vertical air flotation pressure gauge, the rotation acceleration intake flow controller, the opposite shooting sensor, the vertical air flotation flow controller and the rotation deceleration intake flow controller are electrically connected to the main controller respectively.

[0084] When there is a requirement for air flotation, the master controller issues an air flotation instruction. At this time, the vertical air flotation flow controller controls the air intake flow of the vertical air flotation block 320. The target air intake flow of the vertical air flotation block 320, the pressure detection result of the second vertical air flotation pressure gauge, and the air intake flow to the air flotation flow controller constitute a PID control loop to achieve precise control of the air flotation height of the rotating tray 200 (i.e., the air flotation height of the semiconductor workpiece). After the air flotation is successful, the master controller issues a rotation instruction according to the set speed. The rotation speed of the rotating tray 200 detected by the corresponding sensor 510 (i.e., the detected rotation speed of the semiconductor workpiece), the target rotation speed of the semiconductor workpiece (i.e., the target rotation speed of the semiconductor workpiece), the air intake flow of the rotation acceleration air intake flow controller, and the air intake flow of the rotation deceleration air intake flow controller constitute a PID control loop to achieve precise control of the rotation speed of the semiconductor workpiece.

[0085] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0086] In the description of the present disclosure, it is necessary to understand that the terms "up", "down", "left", "right", "top", "bottom", "inside", "outside", "axial", "longitudinal", "lateral", "vertical", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0087] In addition, the terms "first", "second", etc. used in the embodiments of the present disclosure are only used for descriptive purposes and should not be understood as indicating or implying relative importance, or implicitly indicating the number of technical features indicated in the embodiments. Therefore, the features defined by the terms "first", "second", etc. in the embodiments of the present disclosure may explicitly or implicitly indicate that at least one of the features is included in the embodiment. In the description of the present disclosure, the word "multiple" means at least two or two or more, such as two, three, four, etc., unless otherwise clearly and specifically defined in the embodiments.

[0088] In the present disclosure, unless otherwise clearly specified or limited in the embodiments, the terms "installed", "connected", "connected" and "fixed" etc. appearing in the embodiments should be understood in a broad sense. For example, the connection can be a fixed connection, a detachable connection, or an integrated connection. It can be understood that it can also be a mechanical connection, an electrical connection, etc.; of course, it can also be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal connection of two elements, or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific implementation situation.

[0089] In the present disclosure, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0090] Although the embodiments of the present disclosure have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present disclosure. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present disclosure.

Claims

1. A reaction chamber, comprising: a chamber base; A rotating tray is located in the chamber base and is used to support a semiconductor workpiece; the rotating tray is provided with a plurality of first grooves, the plurality of first grooves are distributed along the circumference of the rotating tray, and the notches of the first grooves are located on the lower surface of the rotating tray away from the semiconductor workpiece; the cross section of the first groove along a preset cutting plane is an isosceles triangle; the preset cutting plane is parallel to the vertical direction and perpendicular to the length direction of the first groove toward the central axis of the chamber base; A vertical air flotation component, used to adjust the suspension height of the rotating tray, has a vertical air inlet pipeline and a plurality of vertical air flotation blocks; the vertical air flotation blocks are located below the rotating tray, and the axial direction of the air outlet holes of the vertical air flotation blocks is parallel to the vertical direction; A rotating air flotation assembly, comprising a rotating air flotation block and a rotating air inlet pipeline; the rotating air flotation block is located below the rotating tray; the axial direction of the air outlet of the rotating air flotation block is inclined relative to the vertical direction, so that the gas flowing out of the air outlet of the rotating air flotation block can act on the side wall of the first groove, thereby controlling the rotation direction or rotation speed of the rotating tray; Wherein, the angle between the axial direction and the horizontal direction of the air outlet of the rotating air flotation block is equal to the base angle corresponding to the cross section of the isosceles triangle.

2. The reaction chamber according to claim 1, wherein: The first groove has a first side wall and a second side wall, and one of the first side wall and the second side wall is used to contact the gas flowing out of the gas outlet hole of the rotating air floating block; Along the width center line of the first groove, there is a first distance between the edge of the first side wall close to the notch and the edge of the second side wall close to the notch, and there is a second distance between two adjacent first grooves, and the ratio of the second distance to the first distance is less than or equal to a threshold.

3. The reaction chamber according to claim 1, wherein: The orthographic projection of the vertical air flotation block on the lower surface of the rotating tray is staggered with the notch of the first groove.

4. The reaction chamber according to claim 1, wherein: The rotating air floating block comprises: a first sub-air floating block and a second sub-air floating block, the gas flowing out of the gas outlet of the first sub-air floating block can drive the rotating tray to rotate in a first direction, and the gas flowing out of the gas outlet of the second sub-air floating block can drive the rotating tray to rotate in a second direction, and the second direction is opposite to the first direction; The air outlet holes of the first sub-air floating block and the air outlet holes of the second sub-air floating block are distributed along a first circumference and symmetrically distributed about a preset symmetry line, and the preset symmetry line passes through the central axis of the rotating tray.

5. The reaction chamber according to claim 4, wherein: The air outlet holes of the plurality of vertical air floating blocks are evenly distributed along a second circumference, and the diameter of the second circumference is smaller than the diameter of the first circumference.

6. The reaction chamber according to claim 4, wherein: The rotating air inlet pipeline includes: a first branch and a second branch, the first branch is communicated with the first sub-air floating block, the second branch is communicated with the second sub-air floating block, and the first branch and the second branch are equal in length.

7. The reaction chamber according to claim 4, wherein: The orthographic projection of the center line of the first groove along the width direction on a preset horizontal plane is tangent to the orthographic projection of the first circumference on the preset horizontal plane.

8. The reaction chamber according to claim 4, wherein: The orthographic projection of the central axis of the air outlet of the rotating air floating block on a preset horizontal plane is tangent to the orthographic projection of the first circle on the preset horizontal plane.

9. The reaction chamber according to claim 1, wherein: The air outlet port of the air outlet hole of the vertical air floating block is flush with the air outlet port of the air outlet hole of the rotating air floating block.

10. The reaction chamber according to claim 1, wherein: The rotating tray is provided with a plurality of second grooves, the plurality of second grooves are distributed along the circumference of the rotating tray, the notches of the second grooves are located on the side of the rotating tray, and the second grooves vertically penetrate the rotating tray; The reaction chamber also includes a first detection unit, which includes a first part and a second part corresponding to each other, wherein the first part is located above the rotating tray, and the second part is located below the rotating tray; when the rotating tray rotates until the second groove is located between the first part and the second part, the first detection unit is used to generate a detection signal and send it to the control device.

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