A wafer defect detection device for semiconductor processing

Abstract

The present invention belongs to the technical field of wafer detection equipment, and specifically discloses a wafer defect detection equipment for semiconductor processing, including a frame, a conveyor belt 1 is arranged on one side of the inner bottom end of the frame, a conveyor belt 2 is arranged on the other side of the inner bottom end of the frame, an electron microscope is fixedly connected to the top of the conveyor belt 2, and the electron microscope is used to detect wafers, an air filter mechanism is arranged inside the frame, and the air filter mechanism is used to filter air, and a cleaning mechanism is arranged on the adjacent side of the air filter mechanism inside the frame, and the cleaning mechanism is used to clean the wafer. Through the cleaning mechanism, the air filter mechanism and the drying mechanism, the wafer can be cleaned and dried before detection, which reduces the time of wafer transportation and improves the efficiency of wafer detection. At the same time, due to the reduction of the transportation distance, the probability of impurities adhering to the wafer surface is reduced, thereby improving the accuracy of wafer detection.

Description

Technical Field

[0001] The invention belongs to the technical field of wafer detection equipment, and specifically discloses a wafer defect detection equipment for semiconductor processing. Background Art

[0002] Wafers are the most basic material in the semiconductor manufacturing process and are usually made of high-purity silicon. They are the basis for manufacturing semiconductor devices such as integrated circuits, microprocessors, memory chips, etc. The wafer manufacturing process is very complicated and involves multiple steps, including silicon material purification, crystal growth, cutting, grinding, polishing, etc.

[0003] Wafers need to be inspected before use to screen out defective wafers to ensure the quality of semiconductors. Wafer defect detection equipment is needed when performing wafer defect detection. Wafer defect detection equipment in the prior art can only detect wafers and cannot clean them before detection, resulting in the need for other devices to clean the wafers before detection. This increases the time for wafer transportation and reduces the efficiency of wafer detection. At the same time, impurities are easily attached to the wafer surface during transportation, resulting in deviations in the detection results and reducing the accuracy of wafer detection. Summary of the invention

[0004] In view of this, the purpose of the present invention is to propose a wafer defect detection equipment for semiconductor processing, so as to solve the problem in the prior art that other devices are needed to clean the wafers during wafer detection, which increases the transportation time and reduces the detection efficiency. At the same time, impurities are easily attached to the surface of the wafer during the transportation process, reducing the accuracy of wafer detection.

[0005] To achieve the above objectives, the present invention provides a wafer defect detection device for semiconductor processing, comprising a frame, a conveyor belt 1 is provided on one side of the inner bottom end of the frame, a conveyor belt 2 is provided on the other side of the inner bottom end of the frame, an electron microscope is fixedly connected to the top of the conveyor belt 2, and the electron microscope is used to detect wafers, an air filtering mechanism is provided inside the frame, and the air filtering mechanism is used to filter air, a cleaning mechanism is provided on the adjacent side of the air filtering mechanism inside the frame, and the cleaning mechanism is used to clean wafers, a drying mechanism is provided on the top of the conveyor belt 1, and the drying mechanism is used to dry the wafers after cleaning, the conveyor belt 1 is used to transport wafers and can facilitate the cleaning mechanism and the drying mechanism to clean and dry the wafers, the tops of the air filtering mechanism and the cleaning mechanism are fixedly connected to fixed columns, and the tops of the fixed columns are fixedly connected to the inner top of the frame.

[0006] In the above technical solution, preferably, the air filtering mechanism includes an air pump, the bottom of the air pump is fixedly connected to the inner bottom end of the frame, the output end of the air pump is fixedly connected to an air outlet pipe, the input end of the air pump is fixedly connected to an air inlet pipe, the top of the air outlet pipe is fixedly connected to a purification tank, the tops of both ends of the purification tank are fixedly connected to exhaust pipes, the bottom of the exhaust pipe is fixedly connected to a solenoid valve, and the top of the purification tank is fixedly connected to a water injection pipe.

[0007] In the above technical solution, preferably, the cleaning mechanism includes a cleaning bucket, the top of the cleaning bucket is fixedly connected to the bottom of the fixed column, the outer bottom end of the cleaning bucket is fixedly connected to an air intake ring, the bottom of the cleaning bucket is fixedly connected to a valve, the inner bottom end of the frame is fixedly connected to a water bucket, the inner top end of the water bucket is fixedly connected to a fixed frame, the middle part of the fixed frame is fixedly connected to an air cylinder, the interior of the air cylinder is slidably connected to a limiting ring, the bottom of the limiting ring is fixedly connected to an inner rod, the interior of the inner rod and the interior of the air cylinder are fixedly connected with a tension spring, and the air cylinder A deflation valve is fixedly connected to one side of the top, a filter assembly is fixedly connected to the bottom of the water bucket, a water inlet pipe is rotatably connected to the side of the filter assembly away from the water bucket, a connecting air pipe is fixedly connected to the top of the air cylinder, an automatic valve is fixedly connected to the end of the connecting air pipe away from the air cylinder, a side of the automatic valve away from the connecting air pipe is fixedly connected to the outside of one of the exhaust pipes, a water pressure plate is fixedly connected to the bottom of the inner rod, a plurality of water leakage holes are opened inside the water pressure plate, a groove frame is fixedly connected to the bottom of the water pressure plate below the water leakage holes, and a sealing plug is slidably connected to the bottom of the groove frame.

[0008] In the above technical scheme, preferably, the drying mechanism includes a connecting pipe, a side of the connecting pipe close to the purification tank is fixedly connected to a side of another solenoid valve away from the purification tank, the outside of the connecting pipe is fixedly connected to a fixed disk, the side of the fixed disk away from the solenoid valve is fixedly connected to a clamping spring, the side of the clamping spring away from the fixed disk is fixedly connected to a plugging head 1, the top of the conveyor belt 1 is fixedly connected to an installation frame, the internal top of the installation frame is fixedly connected to an injection pipe, one end of the injection pipe is fixedly connected to a hard pipe, the side of the hard pipe close to the connecting pipe is fixedly connected to a plugging head 2, an air pipe is provided between the plugging head 2 and the plugging head 1, and the inside of the air pipe is fixedly connected to an electric heating wire.

[0009] In the above technical solution, preferably, the filter assembly includes a filter box, the filter box is slidably connected to a filter plug inside, a handle is fixedly connected to the filter plug on a side away from the water bucket, and a threaded cover is threadedly connected to the filter box on a side away from the water bucket.

[0010] In the above technical solution, preferably, the side of the threaded cover away from the water bucket is rotatably connected to the bottom of the water inlet pipe, and the side of the filter box away from the threaded cover is fixedly connected to the outside of the water bucket.

[0011] In the above technical solution, preferably, sealing gaskets are provided inside the plugging head 1 and the plugging head 2, the middle part of the plugging head 1 is slidably connected to the outside of the connecting pipe, and the tightening spring is sleeved on the outside of the connecting pipe.

[0012] In the above technical solution, preferably, the bottom of the inner rod passes through the bottom end of the air cylinder, and the diameter of the sealing plug is larger than the diameter of the water leakage hole.

[0013] In the above technical solution, preferably, a sealing cap is threadedly connected to the top of the water injection pipe, and a rubber pad is arranged inside the sealing cap.

[0014] In the above technical solution, preferably, the water pressure plate is slidably connected to the inside of the water filling bucket, and the top of the water inlet pipe is arranged on the top of the cleaning bucket.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The present invention can clean and dry the wafer before inspection through the cleaning mechanism, air filtering mechanism and drying mechanism, thereby reducing the time of wafer transportation and improving the efficiency of wafer inspection. At the same time, due to the reduction of the transportation distance, the probability of impurities adhering to the wafer surface is reduced, thereby improving the accuracy of wafer inspection.

[0017] 2. The present invention can reduce impurities in the air entering the frame through the air filtering mechanism, so the ambient air impurities for wafer detection are less, which can prevent the wafer from being attached with more impurities during detection, affecting the wafer detection, thereby further improving the accuracy of wafer detection. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A perspective view of the present invention;

[0019] Figure 2 It is a structural schematic diagram of the installation frame in the present invention;

[0020] Figure 3 It is a schematic diagram of the structure of the fixing frame in the present invention;

[0021] Figure 4 It is a schematic diagram of the structure of the inner rod in the present invention;

[0022] Figure 5 It is a structural schematic diagram of the water pressure plate in the present invention;

[0023] Figure 6 It is a schematic diagram of the structure of the slot frame in the present invention;

[0024] Figure 7 It is a schematic diagram of the structure of the air intake ring in the present invention;

[0025] Figure 8 It is a schematic diagram of the structure of the fixed disk in the present invention;

[0026] Fig. 9 It is a structural schematic diagram of the hard tube in the present invention;

[0027] Fig.10 It is a schematic diagram of the structure of the air passage in the present invention;

[0028] Fig.11 It is a schematic diagram of the structure of the filter plug in the present invention.

[0029] In the figure: 1, frame; 2, conveyor belt 1; 3, conveyor belt 2; 4, electron microscope; 5, air filtering mechanism; 501, air pump; 502, air outlet pipe; 503, air inlet pipe; 504, purification tank; 505, exhaust pipe; 506, solenoid valve; 507, water injection pipe; 6, cleaning mechanism; 601, cleaning bucket; 602, air inlet ring; 603, valve; 604, water bucket; 605, fixing frame; 606, air cylinder; 607, limiting ring; 608, inner rod; 609, tension spring; 610, air release valve; 611, water inlet Tube; 612, connecting air pipe; 613, automatic valve; 614, water pressure plate; 615, water leakage hole; 616, slot frame; 617, sealing plug; 7, drying mechanism; 701, connecting pipe; 702, fixing plate; 703, squeezing spring; 704, sealing head one; 705, air pipe; 706, heating wire; 707, jet pipe; 708, hard pipe; 709, sealing head two; 710, installation frame; 8, filter assembly; 801, filter box; 802, filter plug; 803, handle; 804, threaded cover; 9, fixing column. DETAILED DESCRIPTION

[0030] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.

[0031] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0032] like Figure 1-Figure 11A wafer defect detection device for semiconductor processing shown in the figure includes a frame 1, a conveyor belt 2 is arranged on one side of the inner bottom end of the frame 1, a conveyor belt 3 is arranged on the other side of the inner bottom end of the frame 1, an electron microscope 4 is fixedly connected to the top of the conveyor belt 3, and the electron microscope 4 is used to detect wafers, an air filtering mechanism 5 is arranged inside the frame 1, and the air filtering mechanism 5 is used to filter air, a cleaning mechanism 6 is arranged on the adjacent side of the air filtering mechanism 5 inside the frame 1, and the cleaning mechanism 6 is used to clean the wafers, a drying mechanism 7 is arranged on the top of the conveyor belt 2, and the drying mechanism 7 is used to dry the wafers after cleaning, the conveyor belt 2 is used to transport wafers, and can facilitate the cleaning mechanism 6 and the drying mechanism 7 to clean and dry the wafers, the tops of the air filtering mechanism 5 and the cleaning mechanism 6 are fixedly connected with fixed columns 9, and the tops of the fixed columns 9 are fixedly connected to the inner top of the frame 1.

[0033] The air filtering mechanism 5 includes an air pump 501, the bottom of which is fixedly connected to the inner bottom end of the frame 1, the output end of the air pump 501 is fixedly connected to an air outlet pipe 502, the input end of the air pump 501 is fixedly connected to an air inlet pipe 503, both the air outlet pipe 502 and the air inlet pipe 503 have a ventilation function, the top of the air outlet pipe 502 is fixedly connected to a purification tank 504, the purification tank 504 is filled with liquid for treating air impurities and can filter the air, the tops of both ends of the purification tank 504 are fixedly connected to exhaust pipes 505, the exhaust pipes 505 have a ventilation function, and the exhaust The bottom of the air pipe 505 is fixedly connected to a solenoid valve 506, which controls the on-and-off of the gas inside the exhaust pipe. The top of the purification tank 504 is fixedly connected to a water injection pipe 507, which is convenient for liquid replacement. The top of the water injection pipe 507 is threadedly connected to a sealing cap, and a rubber pad is arranged inside the sealing cap. When performing testing, the air pump 501 is started, and the air pump 501 sucks in the outside air through the air inlet pipe 503 and enters the interior of the purification tank 504 through the air outlet pipe 502. The air is filtered by the liquid inside the purification tank 504 and then discharged through the exhaust pipe 505.

[0034] The cleaning mechanism 6 includes a cleaning bucket 601, which provides a cleaning space and a liquid filling space. The top of the cleaning bucket 601 is fixedly connected to the bottom of the fixed column 9. The outer bottom end of the cleaning bucket 601 is fixedly connected to an air intake ring 602, which has a ventilation function. The bottom of the cleaning bucket 601 is fixedly connected to a valve 603, which can discharge liquid and wafers. The inner bottom end of the frame 1 is fixedly connected to a water filling bucket 604, which can receive the discharged liquid. The inner top of the water filling bucket 604 is fixedly connected to a fixed frame 605, and the middle part of the fixed frame 605 is fixedly connected to an air cylinder 606. The inner sliding connection of the air cylinder 606 is a limiting ring 607, which has a limiting function. The limiting ring 607 The bottom of the air cylinder 606 is fixedly connected with an inner rod 608, and a tension spring 609 is fixedly connected between the interior of the inner rod 608 and the interior of the air cylinder 606. The tension spring 609 can drive the inner rod 608 to reset when the air pressure in the air cylinder 606 drops to a normal value. The top side of the air cylinder 606 is fixedly connected with an air release valve 610, and the air release valve 610 has the function of exhausting air. The bottom of the water bucket 604 is fixedly connected with a filter assembly 8, and the side of the filter assembly 8 away from the water bucket 604 is rotatably connected to a water inlet pipe 611, and the top of the air cylinder 606 is fixedly connected with a connecting air pipe 612, and the end of the connecting air pipe 612 away from the air cylinder 606 is fixedly connected with an automatic valve 613, and the side of the automatic valve 613 away from the connecting air pipe 612 is fixedly connected to one of the exhaust pipes 505. Externally, the bottom of the inner rod 608 is fixedly connected to a water pressure plate 614, and a plurality of water leakage holes 615 are opened inside the water pressure plate 614. The bottom of the water pressure plate 614 is located below the water leakage hole 615 and is fixedly connected to a groove frame 616. The bottom of the groove frame 616 is slidably connected to a sealing plug 617. The bottom of the inner rod 608 passes through the bottom end of the air cylinder 606. The diameter of the sealing plug 617 is larger than the diameter of the water leakage hole 615. The water pressure plate 614 is slidably connected to the inside of the water bucket 604. The top of the water inlet pipe 611 is set at the top of the cleaning bucket 601. When cleaning the wafer, the wafer is placed inside the cleaning bucket 601, and the cleaning liquid is filled into the cleaning bucket 601. At this time, the solenoid valve 506 close to the side of the cleaning bucket 601 is opened. At this time, the purification tank The air inside 504 enters the interior of the air intake ring 602 through the exhaust pipe 505 close to the cleaning barrel 601. At this time, bubbles are generated inside the cleaning barrel 601, which can then lift the wafer, so that it can continuously change its position inside the cleaning barrel 601 and clean the wafer under the flow of cleaning liquid. After cleaning, open the valve 603, and the wafer and cleaning liquid inside the cleaning barrel 601 will fall on the conveyor belt 2. The conveyor belt 2 can keep the wafer on the conveyor belt 2, and the cleaning liquid will fall into the water bucket 604. At this time, the cleaning liquid will fall into the interior of the groove frame 616 through the leakage hole 615 and flow into the bottom of the water pressure plate 614. At this time, the solenoid valve 506 close to the cleaning barrel 601 is closed, and then the automatic valve 613 is opened.At this time, the gas will enter the inside of the gas cylinder 606 through the connecting gas pipe 612, and push the limit ring 607 and the inner rod 608 to move downward, so that the tension spring 609 can be stretched, and the water pressure plate 614 can be driven to move downward through the inner rod 608. When the sealing plug 617 contacts the liquid surface, it will float up and block the water leakage hole 615. At this time, when the water pressure plate 614 moves downward, it can press the liquid inside the water bucket 604 into the inside of the water inlet pipe 611, and enter the inside of the cleaning bucket 601 through the water inlet pipe 611.

[0035] The drying mechanism 7 includes a connecting pipe 701, a side of the connecting pipe 701 close to the purification tank 504 is fixedly connected to a side of another electromagnetic valve 506 away from the purification tank 504, the outside of the connecting pipe 701 is fixedly connected to a fixed disk 702, a side of the fixed disk 702 away from the electromagnetic valve 506 is fixedly connected to a clamping spring 703, the fixed disk 702 can be installed with the clamping spring 703, a side of the clamping spring 703 away from the fixed disk 702 is fixedly connected to a plugging head 704, the top of the conveyor belt 2 is fixedly connected to an installation frame 710, the installation frame 710 provides an installation position, and the top of the inner top of the installation frame 710 is fixedly connected to The jet pipe 707 can eject gas, one end of the jet pipe 707 is fixedly connected to a hard pipe 708, and the side of the hard pipe 708 close to the connecting pipe 701 is fixedly connected to a second plugging head 709, and the second plugging head 709 cooperates with the first plugging head 704 to install the gas pipe 705, and a gas pipe 705 is arranged between the second plugging head 709 and the first plugging head 704, and the inside of the gas pipe 705 is fixedly connected to an electric heating wire 706, and the electric heating wire 706 can heat the gas, and the insides of the plugging heads 1 704 and the second plugging heads 709 are both provided with sealing pads, and the middle part of the plugging head 1 704 is slidably connected to the outside of the connecting pipe 701, so as to squeeze the gas. The tightening spring 703 is sleeved on the outside of the connecting pipe 701. When the conveyor belt 2 transports the wafer into the interior of the installation frame 710, the solenoid valve 506 and the automatic valve 613 near the cleaning barrel 601 are closed, and the solenoid valve 506 away from the cleaning barrel 601 is opened. At this time, the gas inside the purification tank 504 will enter the interior of the gas pipe 705 through the connecting pipe 701, and the electric heating wire 706 will be turned on at the same time to heat the gas inside the gas pipe 705, and enter the interior of the injection pipe 707 through the sealing head 709 and the hard pipe 708. After being sprayed out through the injection pipe 707, the cleaned wafer can be dried, which is convenient for subsequent During the inspection, when disassembling the air pipe 705, move the plugging head 704 towards the direction close to the purification tank 504, and then the air pipe 705 can be removed from the plugging head 704, so that the air pipe 705 can be disassembled. When installing the air pipe 705, align the air pipe 705 with the inside of the plugging head 2 709, and then align the side of the air pipe 705 close to the purification tank 504 with the plugging head 704, and release the plugging head 704. Then, the plugging head 704 will be pushed to move to the side of the air pipe 705 close to the purification tank 504 under the action of the squeezing spring 703, thereby completing the installation of the air pipe 705.

[0036] The filter assembly 8 includes a filter box 801, which is slidably connected to a filter plug 802 inside the filter box 801. The filter plug 802 can filter liquid. The side of the filter plug 802 away from the water bucket 604 is fixedly connected to a handle 803. The handle 803 facilitates pulling the filter plug 802 out of the filter box 801. The side of the filter box 801 away from the water bucket 604 is threadedly connected to a threaded cover 804. The side of the threaded cover 804 away from the water bucket 604 is rotatably connected to the bottom of the water inlet pipe 611. The side of the filter box 801 away from the threaded cover 804 is fixedly connected to the outside of the water bucket 604. When replacing the filter plug 802, the threaded cover 804 is screwed off the filter box 801, and the handle 803 is pulled out of the filter box 801, which can then drive the filter plug 802 to move out of the filter box 801, thereby facilitating the replacement of the filter plug 802.

[0037] Working principle: When testing, the air pump 501 is started, and the air pump 501 sucks in the outside air through the air inlet pipe 503, and enters the inside of the purification tank 504 through the air outlet pipe 502. The air is filtered by the liquid inside the purification tank 504 and then discharged through the exhaust pipe 505;

[0038] When cleaning the wafer, the wafer is placed inside the cleaning barrel 601, and the cleaning liquid is filled into the cleaning barrel 601. At this time, the solenoid valve 506 close to the side of the cleaning barrel 601 is opened. At this time, the air inside the purification tank 504 enters the inside of the air intake ring 602 through the exhaust pipe 505 close to the cleaning barrel 601. At this time, bubbles are generated inside the cleaning barrel 601, which can then flush the wafer, so that the position can be continuously changed inside the cleaning barrel 601, and the wafer can be cleaned under the flow of the cleaning liquid. After cleaning, open the valve 603, and the wafer and the cleaning liquid inside the cleaning barrel 601 will fall on the conveyor belt 2. The conveyor belt 2 can keep the wafer on the conveyor belt 2, and the cleaning liquid will fall into the inside of the water bucket 604. At this time, the cleaning liquid will fall into the interior of the groove frame 616 through the leakage hole 615 and flow into the bottom of the water pressure plate 614. At this time, the solenoid valve 506 close to the cleaning bucket 601 is closed, and then the automatic valve 613 is opened. At this time, the gas will enter the interior of the gas cylinder 606 through the connecting air pipe 612, and push the limit ring 607 and the inner rod 608 to move downward, so that the tension spring 609 can be stretched, and the water pressure plate 614 is driven to move downward through the inner rod 608. When the sealing plug 617 contacts the liquid surface, it will float and block the leakage hole 615. At this time, when the water pressure plate 614 moves downward, it can press the liquid in the water bucket 604 into the interior of the water inlet pipe 611, and enter the interior of the cleaning bucket 601 through the water inlet pipe 611;

[0039] After the conveyor belt 2 conveys the wafer into the installation frame 710, the solenoid valve 506 and the automatic valve 613 near the cleaning barrel 601 are closed, and the solenoid valve 506 far from the cleaning barrel 601 is opened. At this time, the gas inside the purification tank 504 will enter the inside of the gas pipe 705 through the connecting pipe 701, and the electric heating wire 706 will be turned on to heat the gas inside the gas pipe 705, and enter the inside of the air injection pipe 707 through the plugging head 709 and the hard pipe 708. After being sprayed out through the air injection pipe 707, the cleaned wafer can be dried, which is convenient for subsequent detection and the gas pipe 705 can be carried out. When disassembling the gas pipe 705, the plugging head 704 is moved toward the direction close to the purification tank 504, and then the gas pipe 705 can be removed from the plugging head 704, so that the gas pipe 705 can be disassembled. When installing the gas pipe 705, the gas pipe 705 is aligned with the inside of the plugging head 2 709, and then the side of the gas pipe 705 close to the purification tank 504 is aligned with the plugging head 704, and the plugging head 704 is loosened. Then, the plugging head 704 is pushed to move to the side of the gas pipe 705 close to the purification tank 504 under the action of the squeezing spring 703, so that the installation of the gas pipe 705 can be completed.

[0040] When replacing the filter plug 802, screw the threaded cover 804 off the filter box 801 and pull the handle 803 out of the filter box 801, which can then drive the filter plug 802 to move out of the filter box 801, thereby facilitating the replacement of the filter plug 802.

[0041] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. A wafer defect detection device for semiconductor processing, comprising a frame (1), characterized in that: A conveyor belt 1 (2) is arranged on one side of the inner bottom end of the frame (1), a conveyor belt 2 (3) is arranged on the other side of the inner bottom end of the frame (1), an electron microscope (4) is fixedly connected to the top of the conveyor belt 2 (3), and the electron microscope (4) is used to detect wafers. An air filter mechanism (5) is arranged inside the frame (1), and the air filter mechanism (5) is used to filter air. A cleaning mechanism (6) is arranged inside the frame (1) and adjacent to the air filter mechanism (5), and the cleaning mechanism (6) is used to clean wafers. A drying mechanism (7) is arranged on the top of the conveyor belt 1 (2), and the drying mechanism (7) is used to dry the wafers after cleaning. The belt (2) is used to transport wafers and can facilitate the cleaning mechanism (6) and the drying mechanism (7) to clean and dry the wafers. The tops of the air filtering mechanism (5) and the cleaning mechanism (6) are fixedly connected to a fixing column (9). The top of the fixing column (9) is fixedly connected to the inner top of the frame (1). The cleaning mechanism (6) includes a cleaning bucket (601). The top of the cleaning bucket (601) is fixedly connected to the bottom of the fixing column (9). The outer bottom end of the cleaning bucket (601) is fixedly connected to an air intake ring (602). The bottom of the cleaning bucket (601) is fixedly connected to a valve (603). The inner bottom end of the frame (1) is fixedly connected to a water bucket (601). 04), the top of the water bucket (604) is fixedly connected to a fixing frame (605), the middle of the fixing frame (605) is fixedly connected to an air cylinder (606), the inside of the air cylinder (606) is slidably connected to a limiting ring (607), the bottom of the limiting ring (607) is fixedly connected to an inner rod (608), the inside of the inner rod (608) and the inside of the air cylinder (606) are fixedly connected to a tension spring (609), the top side of the air cylinder (606) is fixedly connected to an air release valve (610), the bottom of the water bucket (604) is fixedly connected to a filter assembly (8), and the filter assembly (8) is rotatably connected to a water inlet on a side away from the water bucket (604). The top of the air cylinder (606) is fixedly connected to a connecting air pipe (612), one end of the connecting air pipe (612) away from the air cylinder (606) is fixedly connected to an automatic valve (613), and the side of the automatic valve (613) away from the connecting air pipe (612) is fixedly connected to the outside of one of the exhaust pipes (505), the bottom of the inner rod (608) is fixedly connected to a water pressure plate (614), a plurality of water leakage holes (615) are provided inside the water pressure plate (614), the bottom of the water pressure plate (614) is located below the water leakage holes (615) and is fixedly connected to a groove frame (616), and the bottom of the groove frame (616) is slidably connected to a sealing plug (617).

2. A semiconductor processing wafer defect detection device according to claim 1, characterized in that: The air filtering mechanism (5) comprises an air pump (501), the bottom of the air pump (501) is fixedly connected to the inner bottom end of the frame (1), the output end of the air pump (501) is fixedly connected to an air outlet pipe (502), the input end of the air pump (501) is fixedly connected to an air inlet pipe (503), the top of the air outlet pipe (502) is fixedly connected to a purification tank (504), the tops of both ends of the purification tank (504) are fixedly connected to exhaust pipes (505), the bottom of the exhaust pipe (505) is fixedly connected to a solenoid valve (506), and the top of the purification tank (504) is fixedly connected to a water injection pipe (507).

3. The semiconductor processing wafer defect detection device according to claim 1, characterized in that: The drying mechanism (7) comprises a connecting pipe (701), wherein a side of the connecting pipe (701) close to the purification tank (504) is fixedly connected to a side of another solenoid valve (506) away from the purification tank (504), the outside of the connecting pipe (701) is fixedly connected to a fixing plate (702), a side of the fixing plate (702) away from the solenoid valve (506) is fixedly connected to a clamping spring (703), a side of the clamping spring (703) away from the fixing plate (702) is fixedly connected to a plugging head (704), and the The top of the conveyor belt 1 (2) is fixedly connected to a mounting frame (710), the top of the interior of the mounting frame (710) is fixedly connected to an air jet tube (707), one end of the air jet tube (707) is fixedly connected to a hard tube (708), a side of the hard tube (708) close to the connecting tube (701) is fixedly connected to a second plugging head (709), an air passage (705) is provided between the second plugging head (709) and the first plugging head (704), and an electric heating wire (706) is fixedly connected to the interior of the air passage tube (705).

4. The semiconductor processing wafer defect detection device according to claim 1, characterized in that: The filter assembly (8) comprises a filter box (801), a filter plug (802) being slidably connected inside the filter box (801), a handle (803) being fixedly connected to a side of the filter plug (802) away from the water bucket (604), and a threaded cover (804) being threadedly connected to a side of the filter box (801) away from the water bucket (604).

5. The semiconductor processing wafer defect detection device according to claim 4, characterized in that: The side of the threaded cover (804) away from the water bucket (604) is rotatably connected to the bottom of the water inlet pipe (611), and the side of the filter box (801) away from the threaded cover (804) is fixedly connected to the outside of the water bucket (604).

6. The semiconductor processing wafer defect detection device according to claim 3, characterized in that: The inside of the plugging head 1 (704) and the plugging head 2 (709) are both provided with sealing gaskets, the middle part of the plugging head 1 (704) is slidably connected to the outside of the connecting tube (701), and the clamping spring (703) is sleeved on the outside of the connecting tube (701).

7. The semiconductor processing wafer defect detection device according to claim 1, characterized in that: The bottom of the inner rod (608) penetrates the bottom end of the gas cylinder (606), and the diameter of the sealing plug (617) is greater than the diameter of the water leakage hole (615).

8. The semiconductor processing wafer defect detection device according to claim 2, characterized in that: The top of the water injection pipe (507) is threadedly connected to a sealing cap, and a rubber pad is arranged inside the sealing cap.

9. The semiconductor processing wafer defect detection device according to claim 1, characterized in that: The water pressure plate (614) is slidably connected to the inside of the water-filling bucket (604), and the top of the water inlet pipe (611) is arranged on the top of the cleaning bucket (601).

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