Tray structure for carrying chips and chip carrying method

Abstract

The invention provides a tray structure for carrying chips and a chip carrying method. The tray structure is provided with a first surface and a second surface. The first surface is provided with a plurality of placing grooves for accommodating chips, the edge of the first surface is provided with a plurality of supporting structures protruding out of the first surface, and the upper surfaces of the supporting structures are higher than leads of the chips in the placing grooves; the second surface is provided with a plurality of receding grooves matched with the supporting structures, and the receding grooves are used for containing the supporting structures. When the upper tray structure is arranged above the lower tray structure, the tray structure provided by the invention can prevent the upper tray structure from contacting and pressing the gold thread of the chip in the lower tray structure, thereby preventing the gold thread of the chip from being bent in the carrying process, and further improving the subsequent packaging yield.

Description

Technical Field

[0001] The present invention relates to the field of chip packaging, and in particular to a tray structure for transporting chips and a chip transporting method. Background Art

[0002] In the field of COM chip (communication chip) packaging, in order to improve the handling efficiency, multiple COM chips are usually placed in the grooves on a tray, and then another tray is stacked on the tray full of COM chips. Through this stacked structure, a large number of COM chips can be transported at one time. However, since gold wires (bonding wires) are welded on the COM chips, the gold wires are used for subsequent welding on the package body. When the COM chips are transported, the gold wires extend out of the grooves; when stacking one tray on another, it is difficult to make the tray fall completely horizontally on the other tray. In practice, the edge of the upper tray often falls on the surface of the lower tray first, which may cause the upper tray to press on the gold wires of the COM chips. Since the gold wires are relatively thin and fragile, the gold wires are poorly bent, affecting the subsequent packaging effect.

[0003] Therefore, it is necessary to propose a tray structure that prevents damage to the gold wire of the COM chip. Summary of the invention

[0004] The purpose of the present invention is to provide a tray structure for transporting chips, which can prevent the upper tray from contacting the gold wires of the COM chip on the lower tray when falling on the lower tray, thereby improving the packaging quality.

[0005] To achieve the above object, the present invention provides a tray structure for transporting chips, wherein the tray structure has a first surface and a second surface;

[0006] The first surface is provided with a plurality of placement grooves for accommodating chips, and the edge of the first surface is provided with a plurality of support structures, the support structures protrude from the first surface, and the upper surfaces of the support structures are higher than the leads of the chips in the placement grooves;

[0007] The second surface is provided with a plurality of air-avoiding grooves matching the supporting structure, and the air-avoiding grooves are used to accommodate the supporting structure.

[0008] Optionally, the first surface is rectangular and has four edges, and the supporting structure is disposed on each edge.

[0009] Optionally, one of the supporting structures is provided at both ends of each edge.

[0010] Optionally, the plurality of placement slots are arranged in rows and columns, and a support structure is respectively arranged at the first placement slot and the last placement slot on each edge.

[0011] Optionally, the two support structures that are symmetrical about the center of the first surface have different lengths and / or widths.

[0012] Optionally, the support structure and the tray structure are integrally formed.

[0013] Optionally, the air avoidance groove is recessed in the second surface, and a depth of the air avoidance groove is the same as a height of the supporting structure.

[0014] Optionally, the chip is a COM chip.

[0015] The present invention also provides a chip transport method, comprising the following steps:

[0016] Placing a plurality of chips in placement grooves on a first surface of a first tray structure, and making leads of the chips located outside the placement grooves;

[0017] Place the second surface of the second tray structure downward and cover the first tray structure, so that each of the air-avoiding grooves of the second tray structure can accommodate the support structure of the first tray structure;

[0018] Wherein, the first tray structure and the second tray structure are both tray structures for transporting chips.

[0019] Optionally, multiple chips are placed in the placement grooves on the first surface of the second tray structure, and then a third tray structure is used to cover the second tray structure. The third tray structure is the tray structure for transporting chips; and so on, multiple tray structures for transporting chips are stacked.

[0020] Compared with the prior art, the technical solution of the present invention includes the following advantages and beneficial effects:

[0021] The tray structure for carrying chips disclosed in the present invention is provided with a plurality of supporting structures on the edge of a first surface provided with a placement groove, and the supporting structures are made to protrude from the first surface and the upper surfaces of the supporting structures are higher than the leads of the chips in the placement grooves, and a plurality of avoiding grooves for accommodating the supporting structures are correspondingly provided on the second surface, so that when the upper tray structure tilts and falls on the lower tray structure, the supporting structure of the lower tray structure first contacts the upper tray structure, thereby preventing the upper tray structure from contacting and pressing the gold wires of the chips in the lower tray structure, thereby preventing the gold wires of the chips from bending during the carrying process, thereby improving the subsequent packaging yield;

[0022] The present invention sets the two supporting structures that are symmetrical about the center of the first surface to different sizes, so that when the directions of the upper and lower pallet structures are different, the upper pallet structure cannot fall on the lower pallet structure, avoiding inconsistent directions of the stacked pallet structures and improving the handling quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of a first surface of a tray structure for carrying chips according to an embodiment of the present invention;

[0024] Figure 2 It is a partial schematic diagram of a first surface of a tray structure for carrying chips according to an embodiment of the present invention;

[0025] Figure 3 It is a schematic diagram of a second surface of a tray structure for carrying chips according to an embodiment of the present invention;

[0026] Figure 4 It is a partial schematic diagram of a second surface of a tray structure for carrying chips according to an embodiment of the present invention;

[0027] Figure 5 It is a partial schematic diagram of two tray structures when they are closed according to an embodiment of the present invention. DETAILED DESCRIPTION

[0028] The following will be combined with the embodiments of the present invention Figure 1 to Figure 5 , the technical solutions, structural features, objectives achieved and effects in the embodiments of the present invention are described in detail.

[0029] It should be noted that the drawings are in a very simplified form and use non-precise proportions. They are only used to conveniently and clearly assist in explaining the embodiments of the present invention, and are not used to limit the conditions for the implementation of the present invention. Therefore, they have no substantive technical significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.

[0030] It should be noted that, in the present invention, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only the elements explicitly listed, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0031] When using a tray to transport COM chips, an upper tray needs to be placed on the upper surface of a lower tray to stack multiple trays. In order to prevent the lower surface of the upper tray from contacting the gold wires of the COM chip in the lower tray and causing the gold wires to bend, the present invention proposes a tray structure for transporting chips, by providing a support structure at the edge of the surface of the tray structure, and correspondingly providing an airtight groove for accommodating the support structure on the other side surface of the tray structure. When one tray structure is stacked on the surface of another tray structure provided with the support structure, since the support structure is higher than the gold wires of the COM chip, if the upper tray structure is tilted relative to the lower tray structure, the surface of the upper tray structure will first contact the support structure of the lower tray structure, thereby preventing the lower surface of the upper tray from contacting the gold wires of the COM chip.

[0032] The technical solution of the embodiment of the present invention will be described in detail below with reference to the accompanying drawings.

[0033] like Figures 1 to 4 As shown, the tray structure for carrying chips in this embodiment has a first surface 110 and a second surface 120 facing each other. It can be understood that when carrying COM chips, multiple identical tray structures will be stacked, that is, the second surface of one tray structure is placed downward on the first surface of another tray structure, and so on, multiple tray structures are stacked. In this embodiment, one of the tray structures is taken as an example to illustrate its specific structure.

[0034] The first surface 110 is provided with a plurality of placement grooves 111 for accommodating COM chips, and the plurality of placement grooves 111 are arranged in rows and columns, so that the machine can place a plurality of COM chips in the corresponding placement grooves 111. The edge of the first surface 110 is provided with a plurality of support structures 112, and the support structures 112 protrude from the first surface 110. When a COM chip is placed in the placement groove 111, the upper surface of the support structure 112 is higher than the gold wire of the COM chip. The upper surface of the support structure 112 refers to the upper surface of the support structure 112 when the first surface 110 faces upward. The support structure 112 is integrally formed with the first surface 110, and its processing technology is simple and easy to operate.

[0035] When the COM chip is placed in the placement groove 111, since the gold wire of the COM chip will extend out of the placement groove 111, a support structure 112 higher than the gold wire of the COM chip is provided on the first surface 110 provided with the placement groove 111, so as to effectively protect the gold wire of the COM chip and prevent it from bending. Specifically, when the upper tray structure is placed on the lower tray structure, since the operation cannot be completely accurate, the positions of the upper tray structure and the lower tray structure are roughly aligned, but the directions of the two are not completely parallel, so that each position of the upper tray structure cannot contact the lower tray structure at the same time, but the edge position of the upper tray structure first contacts the edge position of the lower tray structure. If a support structure is provided on the lower surface (second surface 120) of the upper tray structure, the support structure of the upper tray structure is likely to press on the gold wire of the COM chip. Therefore, the present invention provides a protruding support structure 112 on the first surface 110 of the lower tray structure, so that when the upper tray structure is tilted, the support structure 112 of the lower tray structure first contacts the upper tray structure, thereby preventing the upper tray structure from contacting the gold wire of the COM chip, thereby protecting the gold wire of the COM chip.

[0036] Corresponding to the support structure 112, the second surface 120 is provided with a plurality of air-avoiding grooves 121 matching the support structure 112, and the air-avoiding grooves 121 correspond one-to-one with the support structure 112 and are used to accommodate the support structure 112. When carrying the COM chip, the second surface 120 of the upper tray structure is facing downward so that it falls on the first surface 110 of the lower tray structure, so that the plurality of air-avoiding grooves 121 of the upper tray structure accommodate the plurality of support structures 112 of the lower tray structure. The air-avoiding grooves 121 are recessed in the second surface 120, and the depth of the air-avoiding grooves 121 is the same as the height of the corresponding support structure 112, so that the stacking height of the tray structure of this embodiment is the same as the stacking height of the tray structure without the support structure 112 and the air-avoiding grooves 121.

[0037] The tray structure is rectangular, so that the first surface 110 and the second surface 120 are both rectangular, each having four edges, and the supporting structure 112 is provided on each edge of the first surface 110, that is, 8 supporting structures 112 are provided on the first surface 110, and correspondingly, the air avoidance groove 121 is provided on each edge of the second surface 120.

[0038] Figure 5A situation in which the upper tray structure is tilted is shown, in which the upper second tray structure 2 is tilted compared to the lower first tray structure 1. In the figure, the first surface 110' of the first tray structure 1 is facing upward, and a COM chip 3 is placed in the placement groove 111' of the first tray structure 1, and the gold wire 31 of the COM chip 3 extends out of the placement groove 111'. Since the second tray structure 2 is not completely horizontal when falling, its edge area is lower than the central area, so that the axis of the air-avoiding groove 121 of the second tray structure 2 is not in the same direction as the axis of the supporting structure 112' of the first tray structure 1. Therefore, the air-avoiding groove 121 of the second tray structure 2 cannot just accommodate the supporting structure 112' of the first tray structure 1, but is slightly offset. At this time, the top of the supporting structure 112' of the first tray structure 1 first contacts the second surface 120 of the second tray structure 2 compared to other parts of the first tray structure 1, thereby blocking the second tray structure 2 from continuing to fall. In actual use, if a robot is used, the robot can be set to stop operating when the second tray structure 2 encounters an obstruction. If manual operation is used, this obstruction will also remind the manual inspection, thereby preventing the gold wire 31 of the COM chip 3 from contacting the second tray structure 2 above.

[0039] Further, continue as Figures 1 to 4 As shown, a support structure 112 is respectively provided at both ends of each edge of the first surface 110 of the tray structure. This is because when the upper tray structure is tilted, the two ends of the edge of the first surface 110 are most susceptible to being affected, so only one support structure 112 is respectively provided at both ends of each edge of the first surface 110, which has a simple structure and can also simply and efficiently prevent the upper tray structure from contacting the COM chip gold wire.

[0040] In this embodiment, since the placement grooves 111 are arranged in rows and columns, a support structure 112 can also be set at the first placement groove 111 and the last placement groove 111 on each edge of the first surface 110, respectively, so as to prevent the gold wires of the COM chip in the placement grooves 111 at both ends of each edge from contacting the upper tray structure and bending.

[0041] Furthermore, in this embodiment, any two support structures 112 symmetrical about the center of the first surface 110 have different sizes, that is, different lengths and / or widths, and correspondingly, the air avoidance grooves 121 of the second surface 120 also have different sizes. The stacked tray structures need to have the same direction, and by setting support structures 112 and air avoidance grooves 121 of different sizes, when the upper tray structure and the lower tray structure have different directions (since the tray structure is rectangular, the different directions mean that the two differ by 180°), since the two support structures 112 symmetrical about the center and the corresponding air avoidance grooves 121 have different sizes, each support structure 112 cannot be accommodated in the corresponding air avoidance groove 121 at the same time, so that the placement errors of the upper and lower tray structures can be discovered in time, thereby avoiding inconsistent directions of the stacked tray structures.

[0042] It should be noted that, although the tray structure is described using a COM chip in this embodiment, this is not a limitation of the present invention. The tray structure of the present invention can also be used to transport other chips that are bent due to the leads extending out of the placement slots.

[0043] Based on the above tray structure for transporting chips, combined with Figure 5 This embodiment also provides a chip transport method, comprising the following steps:

[0044] Place a plurality of COM chips 3 in the placement grooves 111 ′ of the first surface 110 ′ of the first tray structure 1 , and make the gold wires 31 of the COM chips 3 located outside the placement grooves 111 ′;

[0045] The second surface 120 of the second tray structure 2 is facing downwards and covers the first tray structure 1 , so that each of the void-avoiding grooves 121 of the second tray structure 2 can accommodate the supporting structure 112 ′ of the first tray structure 1 in a one-to-one correspondence.

[0046] In the process of placing the second pallet structure 2 above the first pallet structure 1, if the second pallet structure 2 is blocked during the falling process, it may be because the second pallet structure 2 is tilted, and the axis of the air avoidance groove 121 of the second pallet structure 2 is not in the same direction as the axis of the supporting structure 112' of the first pallet structure 1, so that the supporting structure 112' of the first pallet structure 1 prevents the second pallet structure 2 from continuing to fall. At this time, it is necessary to check and adjust the horizontality of the second pallet structure 2.

[0047] When placing the second pallet structure 2 on top of the first pallet structure 1, if all the supporting structures 112' of the first pallet structure 1 cannot be accommodated by the air-avoiding grooves 121 of the second pallet structure 2, it means that the direction of the second pallet structure 2 is opposite to that of the first pallet structure 1, and the direction of the second pallet structure 2 needs to be adjusted.

[0048] In more embodiments, after the second tray structure is horizontally placed on the first surface of the first tray structure, in order to transport more COM chips, multiple COM chips are placed in the placement grooves on the first surface of the second tray structure, and then a third tray structure is used to cover the top of the second tray structure; and so on, multiple tray structures for transporting chips of the present invention are stacked.

[0049] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A tray structure for transporting chips, characterized in that: The tray structure has a first surface and a second surface; The first surface is provided with a plurality of placement grooves for accommodating chips, and the edge of the first surface is provided with a plurality of support structures, the support structures protrude from the first surface, and the upper surfaces of the support structures are higher than the leads of the chips in the placement grooves; The second surface is provided with a plurality of air-avoiding grooves matching the supporting structure, and the air-avoiding grooves are used to accommodate the supporting structure.

2. The tray structure for transporting chips according to claim 1, characterized in that: The first surface is rectangular and has four edges, and the supporting structure is disposed on each edge.

3. The tray structure for transporting chips according to claim 2, characterized in that: A supporting structure is respectively provided at both ends of each edge.

4. The tray structure for transporting chips according to claim 2, characterized in that: The plurality of placement slots are arranged in rows and columns, and a support structure is respectively arranged at the first placement slot and the last placement slot on each edge.

5. The tray structure for transporting chips according to claim 1, characterized in that: The two support structures that are symmetrical about the center of the first surface have different lengths and / or widths.

6. The tray structure for transporting chips according to claim 1, characterized in that: The support structure is integrally formed with the tray structure.

7. The tray structure for transporting chips according to claim 1, characterized in that: The air-avoiding groove is recessed in the second surface, and the depth of the air-avoiding groove is the same as the height of the supporting structure.

8. The tray structure for transporting chips according to claim 1, characterized in that: The chip is a COM chip.

9. A chip transport method, characterized in that: The following steps are involved: Placing a plurality of chips in placement grooves on a first surface of a first tray structure, and positioning the leads of the chips outside the placement grooves; Place the second surface of the second tray structure downward and cover the first tray structure, so that each of the air-avoiding grooves of the second tray structure can accommodate the support structure of the first tray structure; Wherein, the first tray structure and the second tray structure are both tray structures for transporting chips as described in any one of claims 1 to 8.

10. The chip transport method according to claim 9, characterized in that: Place multiple chips in the placement grooves on the first surface of the second tray structure, and then use a third tray structure to cover the top of the second tray structure. The third tray structure is a tray structure for transporting chips as described in any one of claims 1 to 8; and so on, stack multiple tray structures for transporting chips.

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