Substrate transfer device

Abstract

The invention discloses a substrate transfer device, which comprises a turnover device, a pushing device, a support frame and a lifting mechanism, and is characterized in that the turnover device comprises a slide holder, and the slide holder is used for holding a substrate; the pushing device comprises a bearing part, and the bearing part is used for carrying out substrate handover with the slide holder; the first end of the supporting frame is connected with the pushing device, the second end of the supporting frame is connected with the lifting mechanism, and an avoiding groove used for avoiding the overturning device is formed between the first end and the second end of the supporting frame. Wherein the initial height of the bearing part is lower than that of the slide glass frame, when the bearing part and the slide glass frame carry out substrate handover, the lifting mechanism drives the pushing device to move towards the turnover device in the vertical direction through the supporting frame, the bearing part obtains the substrate from the slide glass frame, and an avoiding groove of the supporting frame allows the supporting frame to move in the vertical direction all the time; the height of the bearing part located at the first end of the supporting frame exceeds the height of the slide holder. The substrate transfer device can improve the transfer efficiency of the substrate.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to a substrate transfer device. Background Art

[0002] In a substrate processing device in which a tank cleaning module and a single-wafer substrate cleaning module are combined into one wet cleaning system, a substrate transfer device is one of the important components. Fig.14 A substrate transfer device is shown. Fig.14 In the figure, the flipping device 100' is at the handover position, and the pushing device 200' drops to the initial position after obtaining the substrate 500'. The substrate transfer device includes a front-end module robot, a flipping device 100', a pushing device 200', a support frame 300', a lifting mechanism 400' and a substrate transfer robot. Among them, the flipping device 100' includes two oppositely arranged first carriers 111' and second carriers 112', which are used to hold the substrate 500', wherein the first carrier 111' includes a first horizontal holding portion 1101' and a first vertical holding portion 1102', and the second carrier 112' includes a second horizontal protection portion 1201' and a second vertical holding portion 1202'. One end of the support frame 300' is fixedly connected to the pushing device 200', and the other end is assembled on the lifting mechanism 400'.

[0003] The front-end module robot takes out one or more substrates 500' from the storage box in the loading area and transfers them to the flipping device 100'. The flipping device 100' rotates 90° around the horizontal rotation axis extending in the horizontal direction to flip the substrate 500' from a horizontal position to a vertical position. After that, the lifting mechanism 400' drives the support frame 300' to rise in the vertical direction, and the support frame 300' drives the pushing device 200' to rise. After the pushing device 200' rises and obtains the substrate 500' from the flipping device 100', it drives the first vertical holding part 1102' and the second vertical holding part 1202' to move away from each other so that the distance between the first vertical holding part 1102' and the second vertical holding part 1202' is greater than the diameter of the substrate 500'. Then the lifting mechanism 400' drives the support frame 300' to descend, and the pushing device 200' carries the substrate 500' and descends with the support frame 300'. Fig.14 The pusher 200' is moved to the position shown in the figure, and the pusher 200' rotates 90° around the vertical rotation axis extending in the vertical direction, so that the surface of the substrate 500' faces the lifting mechanism 400'. After the flip device 100' rotates 90° to avoid the pusher 200', the lifting mechanism 400' drives the support frame 300' to rise again in the vertical direction, so that the pusher 200' and the substrate 500' rise to the sheet removal height, and finally the substrate transfer robot takes one or more substrates 500' from the pusher 200' and transfers them to the process tank for process treatment.

[0004] As can be seen from the above, the pushing device has many operating steps in the process of avoiding each other with the flipping device, which increases the complexity of the substrate transfer process and makes the transfer efficiency of the substrate low. Summary of the invention

[0005] The purpose of the present invention is to solve the problem of low substrate transfer efficiency of a substrate transfer device in the prior art.

[0006] In order to solve the above problems, an embodiment of the present invention provides a substrate transfer device, comprising:

[0007] The turning device comprises a wafer carrier, and the wafer carrier is used for holding the substrate;

[0008] The pushing device comprises a bearing part, and the bearing part is used for connecting the substrate with the wafer carrier;

[0009] A support frame and a lifting mechanism, wherein the first end of the support frame is connected to the pushing device, the second end of the support frame is connected to the lifting mechanism, and an avoidance groove for avoiding the slide rack is provided between the first end and the second end of the support frame;

[0010] Among them, the initial height of the bearing part is lower than the carrier rack. When the bearing part and the carrier rack are connecting the substrate, the lifting mechanism drives the pushing device to move in the vertical direction toward the flipping device through the support frame, so that the bearing part obtains the substrate from the carrier rack, and the avoidance groove of the support frame allows the support frame to move in the vertical direction until the height of the bearing part located at the first end of the support frame exceeds the carrier rack.

[0011] The present invention provides an avoidance groove on the support frame, so that the push device keeps rising after obtaining the substrate from the carrier until the height of the bearing portion exceeds the carrier, and then the substrate can be processed to the next process, so as to facilitate the next handover of the substrate. In this process, the push device does not need to wait for the avoidance of the flip device, which saves the movement stroke of the push device and improves the transportation efficiency of the substrate.

[0012] Other features and corresponding beneficial effects of the present invention are described in the latter part of the specification, and it should be understood that at least part of the beneficial effects become obvious from the description in the specification of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional schematic diagram of a substrate transfer device according to an embodiment of the present invention in which a turning device and a pushing device are at their respective initial positions and the turning device is fully loaded with substrates;

[0014] Figure 2 It is a three-dimensional schematic diagram of a substrate transfer device according to an embodiment of the present invention when the flip device is at a handover position and the pushing device is at an initial position;

[0015] Figure 3 It is a three-dimensional schematic diagram of a substrate transfer device in accordance with an embodiment of the present invention when a flipping device and a pushing device transfer a substrate in a vertical state;

[0016] Figure 4 It is a three-dimensional schematic diagram of a case where the height of the bearing portion of the pushing device of the substrate transfer device according to one embodiment of the present invention exceeds the first wafer carrier and the second wafer carrier of the flipping device;

[0017] Figure 5 It is a three-dimensional schematic diagram of a substrate transfer device according to an embodiment of the present invention when the supporting portion and the substrate are rotated 90° around the Z axis;

[0018] Figure 6 It is a three-dimensional schematic diagram of a flipping device according to an embodiment of the present invention;

[0019] Figure 7 is a three-dimensional schematic diagram of a first rotating mechanism according to an embodiment of the present invention;

[0020] Figure 8 It is a three-dimensional schematic diagram of the slide holder of the flipping device according to one embodiment of the present invention after being rotated 90° in the ZY plane;

[0021] Fig. 9 for Figure 8 A magnified schematic diagram of part A;

[0022] Fig.10 A three-dimensional schematic diagram of a pushing device according to an embodiment of the present invention;

[0023] Fig.11 is a three-dimensional schematic diagram of a second rotating mechanism according to an embodiment of the present invention;

[0024] Fig.12 It is a three-dimensional schematic diagram of the flip device returning to the initial position after the pushing device of one embodiment of the present invention obtains the substrate;

[0025] Fig.13 A three-dimensional schematic diagram of a substrate transfer device according to an embodiment of the present invention when the flipping device and the pushing device return to their respective initial positions; and

[0026] Fig.14 The utility model relates to a substrate transfer device. DETAILED DESCRIPTION

[0027] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may extend based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0028] It should be noted that in this specification, similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0029] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0031] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0033] See also Figure 1 The substrate transfer device provided by the present invention comprises a flipping device 100, a pushing device 200, a support frame 300 and a lifting mechanism 400. The flipping device 100 comprises a wafer carrier 110 for holding a substrate 500.

[0034] The pushing device 200 includes a carrying portion 210 , and the carrying portion 210 is used to transfer the substrate 500 with the wafer carrier 110 .

[0035] Figure 1 FIG. 2 is a three-dimensional schematic diagram showing the turning device 100 and the pushing device 200 in their respective initial positions during the substrate operation, and the turning device 100 is fully loaded with substrates 500. Figure 1 In the initial position, the initial height of the flipping device 100 is higher than the initial heights of the pushing device 200 and the supporting frame 300 .

[0036] The first end 301 of the support frame 300 is connected to the pushing device 200, and the second end 302 of the support frame 300 is connected to the lifting mechanism 400. A evasion groove 330 for evading the wafer carrier 110 is provided between the first end 301 and the second end 302 of the support frame 300. When the supporting portion 210 and the wafer carrier 110 are interfacing with the substrate 500, the lifting mechanism 400 drives the pushing device 200 to move toward the flipping device 100 along the vertical direction through the support frame 300, so that the supporting portion 210 obtains the substrate 500 from the wafer carrier 110, and the evasion groove 330 of the support frame 300 allows the support frame 300 to move along the vertical direction all the time, thereby allowing the pushing device 200 to continue to move upward until the height of the supporting portion 210 exceeds the wafer carrier 110, so that the supporting portion 210 drives the substrate 500 to proceed to the next process.

[0037] Specifically, the avoidance groove 330 is formed by the first end 301 and the second end 302 of the support frame 300. In the vertical direction, the first end 301 of the support frame 300 is higher than the second end 302, and the vertical distance between the first end 301 and the second end 302 of the support frame 300 is the height of the avoidance groove 330.

[0038] Figure 2 It is a three-dimensional schematic diagram showing the substrate transfer process, when the flipping device 100 is at the handover position and the pushing device 200 is at the initial position; Figure 3 It is a three-dimensional schematic diagram showing the flip device 100 and the push device 200 handing over a substrate 500 in a vertical state during the substrate transfer process; Figure 4It is a three-dimensional schematic diagram showing that after the flipping device 100 and the pushing device 200 receive the substrate 500 during the substrate transfer process, the height of the carrying portion 210 of the pushing device 200 exceeds the first wafer carrier 111 and the second wafer carrier 112 of the flipping device 100; Figure 5 It is a three-dimensional schematic diagram showing that the carrying portion 210 of the pushing device 200 and the substrate 500 rotate 90° around the Z axis during the substrate transfer process.

[0039] Combination Figures 1 to 5 The slide rack 110 includes a first slide rack 111 and a second slide rack 112 which are arranged opposite to each other and are used to hold the substrate 500 on both radial sides of the substrate 500. The avoidance groove 330 of the support frame 300 is used to avoid the first slide rack 111 of the slide rack 110. The lifting mechanism 400 is located on one side of the first slide rack 111, and the second end 302 of the support frame 300 is assembled on the vertical guide rail of the lifting mechanism 400, and is used to be lifted and lowered on the vertical guide rail in the vertical direction.

[0040] Combine the following Figures 1 to 5 The process of the avoidance groove 330 avoiding the first wafer carrier 111 is described. The lifting mechanism 400 drives the support frame 300 to rise in the vertical direction, and the first end 301 of the support frame 300 drives the pushing device 200 to rise, so that the pushing device 200 is close to the substrate 500 between the first wafer carrier 111 and the second wafer carrier 112. Figure 3 As shown. Since the avoidance groove 330 is formed by the first end 301 and the second end 302 of the support frame 300, and the first end 301 of the support frame 300 is higher than the second end 302, the support frame 300 can rise all the way until the first end 301 of the support frame 300 rises to the area between the first wafer carrier 111 and the second wafer carrier 112, and the second end 302 of the support frame 300 rises to a position close to the first wafer carrier 111. At this time, the height of the bearing portion 210 located at the first end 301 of the support frame 300 exceeds the height of the first wafer carrier 111 and the second wafer carrier 112, so that the avoidance groove 330 avoids the first wafer carrier 111. Figure 4 In this embodiment, the height of the avoidance groove 330 should satisfy the requirement that the height of the bearing portion 210 exceeds the height of the first carrier 111 and the second carrier 112. In some embodiments, when the pushing device 200 rises vertically toward the flipping device 100, the flipping device 100 should be in a state where the substrate 500 is to be transferred, for example, the substrate 500 is kept vertically, such as Figure 2 shown.

[0041] By setting the avoidance groove 330 on the support frame 300, the avoidance space provided by the avoidance groove 330 can allow the pushing device 200 to directly rise to the film picking position cooperating with the substrate transfer robot. At this film picking position, the height of the carrying part 210 of the pushing device 200 exceeds the carrier 110 of the flipping device 100, and the carrying part 210 can drive the substrate 500 to the next process. The next process is, for example, the carrying part 210 drives the substrate 500 to rotate 90° around the Z-axis direction, so that the surface of the substrate 500 faces the lifting mechanism 400. Figure 5 As shown, the substrate transfer robot takes away the substrate 500 and delivers the substrate 500 to the process tank. Therefore, the movement stroke of the push device 200 is saved, and the transfer efficiency of the substrate 500 is improved.

[0042] In this embodiment, the first carrier 111 and the second carrier 112 only need to hold the substrate 500 when the substrate 500 is in a horizontal state or a vertical state, and there is no need to add a driving component for driving the first carrier 111 and the second carrier 112 to move relative to each other, which significantly simplifies the structure of the flipping device 100.

[0043] It should be noted that the drawings of the present application are not used to limit the specific structures of the flipping device 100 and the pushing device 200, and are not used to limit the number of substrates 500. Figures 1 to 5 , Figures 8 to 13 The Z-axis direction is the vertical direction, the X-axis and the Y-axis are located in a horizontal plane perpendicular to the Z-axis, and the X-axis direction is perpendicular to the Y-axis direction.

[0044] Figure 6 A three-dimensional schematic diagram of the flipping device 100 is shown; Figure 7 A three-dimensional schematic diagram of the first rotating mechanism 120 is shown.

[0045] refer to Figure 6 In some embodiments, the flipping device 100 further includes a first rotating mechanism 120 and a mounting base 130. The mounting base 130 is mounted on the first rotating mechanism 120, and the first carrier 111 and the second carrier 112 are fixedly mounted on the mounting base 130. The extension direction of the horizontal rotation axis of the first rotating mechanism 120 is the X-axis direction. The first rotating mechanism 120 is used to drive the mounting base 130 to rotate around the horizontal rotation axis extending along the X-axis direction, so that the first carrier 111 and the second carrier 112 rotate between the Z-axis direction and the Y-axis direction. In other words, the first carrier 111 and the second carrier 112 can rotate 90° in the ZY plane, thereby switching the substrate 500 between a horizontal state and a vertical state. The first carrier 111 and the second carrier 112 are both in the shape of long strips, such as Figure 1 As shown, the first wafer carrier 111 and the second wafer carrier 112 extend along the Z-axis direction, and the substrate 500 is in a horizontal state. Figure 2 As shown, the first wafer carrier 111 and the second wafer carrier 112 extend along the Y-axis direction, and the substrate 500 is in a vertical state.

[0046] In some embodiments, a first substrate detector 1116 is provided on the first wafer carrier 111 to detect whether there is a substrate 500 on the wafer carrier 110. A second substrate detector 1126 is provided on the second wafer carrier 112 to detect whether the substrate 500 on the wafer carrier 110 has been transferred to the position by the front-end module robot. The first substrate detector 1116 and the second substrate detector 1126 are laser beam sensors respectively.

[0047] Combination Figure 6 and Figure 7 In some embodiments, the first rotating mechanism 120 of the flipping device 100 includes a base 121, a first driving motor 122, a first reducer and a first rotating base 124. The first driving motor 122 and the first reducer are installed on the shaft support seat 1211 of the base 121, the input end of the first reducer is connected to the output end of the first driving motor 122, the output end of the first reducer is connected to the first rotating base 124, and the first rotating base 124 is fixedly connected to the mounting base 130. The first driving motor 122 drives the first reducer to rotate, the first reducer drives the first rotating base 124 to rotate, the first rotating base 124 drives the mounting base 130 to rotate, the first carrier 111 and the second carrier 112 rotate together with the mounting base 130, so that the substrate between the first carrier 111 and the second carrier 112 is switched between a horizontal state and a vertical state. Preferably, the first reducer can be a hollow harmonic reducer. The hollow harmonic reducer is small in size and can adapt to a smaller installation space. It has a large reduction ratio, can output high torque, and can be precisely positioned.

[0048] Figure 8 The figure shows a three-dimensional schematic diagram of the slide holder of the flipping device 100 after rotating 90° in the ZY plane; Fig. 9 for Figure 8 Enlarged schematic diagram of part A.

[0049] Combination Figures 7 to 9 In some embodiments, the first rotating mechanism 120 of the flipping device 100 further includes a first detection element for detecting whether the first rotating base 124 is rotated to the process position. Fig. 9As shown, the first detection element includes a first position sensor 1261, a second position sensor 1262, a third position sensor 127, a fourth position sensor 1281 and a fifth position sensor 1282. The first position sensor 1261 and the second position sensor 1262 are arranged side by side in the positive Y-axis direction of the shaft support seat 1211, the third position sensor 127 is arranged in the Z-axis direction of the shaft support seat 1211, and the fourth position sensor 1281 and the fifth position sensor 1282 are arranged side by side in the negative Y-axis direction of the shaft support seat 1211. The first rotating base 124 is provided with a first trigger plate 1243 and a second trigger plate 1244. The mounting base 130 is provided with a third trigger plate 1245 and a fourth trigger plate 1246.

[0050] In some embodiments, the first position sensor 1261 , the second position sensor 1262 , the third position sensor 127 , the fourth position sensor 1281 , and the fifth position sensor 1282 are all photoelectric sensors.

[0051] Combined with reference Figure 6 When the first wafer carrier 111 and the second wafer carrier 112 rotate 90° to the Z-axis direction to reload the horizontal substrate, the control logic of the first rotating base 124 is that it rotates to the limit position first and then returns to the process position. Based on this control logic, the working process of the first detection element is: Figure 7 , the second triggering piece 1244 first passes through the second position sensor 1262 and then the first triggering piece 1243 triggers the first position sensor 1261. After the first position sensor 1261 is triggered, its signal light goes out. After that, the second triggering piece 1244 rotates back to the second position sensor 1262 and triggers the second position sensor 1262. After the second position sensor 1262 is triggered, its signal light goes out. At this time, the first rotating base 124 stops rotating. The first position sensor 1261 is the limit position, and the second position sensor 1262 is the process position.

[0052] Combined with reference Figure 8 When the first wafer carrier 111 and the second wafer carrier 112 rotate 90° from the Z-axis direction to the Y-axis direction to be in the state of the substrate to be transferred, the control logic of the first rotating base 124 is that it rotates to the limit position first and then returns to the process position. Based on this control logic, refer to Fig. 9The working process of the first detection element is as follows: the third triggering piece 1245 first passes through the fourth position sensor 1281 and then the fourth triggering piece 1246 triggers the fifth position sensor 1282. After the fifth position sensor 1282 is triggered, its signal light goes out. After that, the third triggering piece 1245 rotates back to the fourth position sensor 1281 and triggers the fourth position sensor 1281. After the fourth position sensor 1281 is triggered, its signal light goes out. At the same time, the first triggering piece 1243 triggers the third position sensor 127. After the third position sensor 127 is triggered, its signal light goes out. At this time, the first rotating base 124 stops rotating. The fourth position sensor 1281 is the process position, and the fifth position sensor 1282 is the limit position.

[0053] Combination Figure 6 and Figure 7 The first rotating mechanism 120 also includes a first stopper 119 (refer to Figure 7 ) and the second stopper 129 (reference Figure 6 ), the first stopper 119 and the second stopper 129 are both mounted on the base 121 and are respectively located on opposite sides of the first rotating base 124. The first rotating base 124 is provided with a first abutting portion 1241 matched with the first stopper 119, and a second abutting portion 1242 matched with the second stopper 129.

[0054] refer to Figure 7 The first rotating mechanism 120 further includes a fixing seat 159, which is mounted on the base 121. The first end of the first stopper 119 is fixed to the fixing seat 159, and the second end of the first stopper 119 is used to abut against the first abutting portion 1241 of the first rotating base 124. Figure 1 When the first position sensor 1261 and the second position sensor 1262 fail to operate, causing a problem in the running program, or the first rotating mechanism 120 is powered off, the first rotating base 124 may continue to rotate from the Y axis to the Z axis, causing an abnormality. Figure 7 By providing the first stopper 119, when an abnormality occurs, the first stopper 119 abuts against the first abutting portion 1241 to prevent the first rotating base 124 from over-rotating, thus playing a role of mechanical stopper. The first stopper 119 is, for example, a bolt with a buffer material on the surface.

[0055] refer to Figure 6 The function of the second stopper 129 is the same as that of the first stopper 119. Figure 2 When the position shown is Fig. 9If the third position sensor 127, the fourth position sensor 1281 and the fifth position sensor 1282 shown fail and cause problems in the running program, or the first rotating mechanism 120 is powered off, the first rotating base 124 may continue to rotate in the direction from the Z axis to the Y axis, and an abnormality occurs. Therefore, by setting the second limiter 129, the second limiter 129 can abut against the second abutting portion 1242 when an abnormality occurs, preventing the first rotating base 124 from over-rotating, and playing a role of mechanical limit. The second limiter 129 is, for example, a bolt with a buffer material on the surface.

[0056] Combination Figure 8 and Fig. 9 In some embodiments, the first rotating mechanism 120 further includes a driving unit 1391 and a telescopic member 1392, and the first rotating base 124 is provided with a limiting hole 1249 that matches the telescopic member 1392. The driving unit 1391 is installed on the base 121 through the fixing seat 159, and the driving unit 1391 is used to drive the telescopic member 1392 to extend toward the first rotating base 124, so that the telescopic member 1392 extends into the limiting hole 1249, forming a mechanical interlock, preventing the first rotating base 124 from rotating abnormally, and playing a role of secondary protection. The driving unit 1391 is, for example, a cylinder.

[0057] Fig.10 Shown is a perspective schematic diagram of the pushing device 200; Fig.11 FIG. 2 is a perspective schematic diagram of the second rotating mechanism 220 .

[0058] Combination Fig.10 and Fig.11 The pushing device 200 also includes a second rotating mechanism 220. The first end of the supporting frame 300 is connected to the second rotating mechanism 220. The second rotating mechanism 220 is connected to the bearing part 210. When the height of the bearing part 210 exceeds the wafer carrier 110, the second rotating mechanism 220 is used to drive the bearing part 210 to rotate around the vertical rotation axis extending along the Z-axis direction.

[0059] In some embodiments, a third substrate detector 2106 is disposed on the carrier 210 to detect whether there is a substrate 500 on the carrier 210. The third substrate detector 2106 is a laser beam sensor.

[0060] In some embodiments, the second rotating mechanism 220 includes a second driving motor 221, a second reducer, a mounting plate 225, a second reducer mounting base 224, and a second rotating base 223. The second driving motor 221 is fixed to the mounting plate 225, and the second reducer is fixed to the mounting plate 225 through the second reducer mounting base 224. Figure 1The mounting plate 225 is used to be connected to the first end 301 of the support frame 300. The output end of the second driving motor 221 is connected to the input end of the second reducer, and the output end of the second reducer is connected to the second rotating base 223, and the second rotating base 223 is fixedly connected to the bearing part 210. The second driving motor 221 drives the second reducer to rotate, and the second reducer drives the second rotating base 223 to rotate, and the second rotating base 223 drives the bearing part 210 to rotate, and the bearing part 210 and the substrate 500 rotate together, for example, by 90°. Preferably, the second reducer can be a planetary reducer.

[0061] The second rotating mechanism 220 of the pushing device 200 further includes a second detection element for detecting whether the second rotating base 223 rotates to the process position. Fig.10 and Fig.11 , the second detection element may include a sixth position sensor 2261, a seventh position sensor 2262, an eighth position sensor 2271, and a ninth position sensor 2272. The sixth position sensor 2261 and the seventh position sensor 2262 are arranged in the X-axis direction of the second reducer mounting base 224, and are arranged along the circumference of the second reducer mounting base 224. The eighth position sensor 2271 and the ninth position sensor 2272 are arranged in the Y-axis direction of the second reducer mounting base 224, and are arranged along the circumference of the second reducer mounting base 224. A fifth trigger piece 2243 is arranged on the second rotating base 223. In this embodiment, the second rotating base 223 is in the shape of a rectangle, and the fifth trigger piece 2243 is located on one of the short sides of the rectangle.

[0062] Combined with reference Figure 5 When the second rotating base 223 and the carrying part 210 rotate 90° around the Z-axis direction so that the substrate transfer robot can grab the substrate 500, the control logic of the second rotating base 223 is that it rotates to the limit position first and then returns to the process position. Based on this control logic, combined with Fig.10 and Fig.11 The working process of the second detection element is as follows: the fifth triggering piece 2243 first passes through the seventh position sensor 2262 and then triggers the sixth position sensor 2261. After the sixth position sensor 2261 is triggered, its signal light goes out. After that, the fifth triggering piece 2243 rotates back to the seventh position sensor 2262 and triggers the seventh position sensor 2262. After the seventh position sensor 2262 is triggered, its signal light goes out. At this time, the second rotating base 223 stops rotating. The sixth position sensor 2261 is the extreme position, and the seventh position sensor 2262 is the process position. Fig.10 As shown, the shape of the carrying portion 210 is substantially rectangular, and its short side extends along the direction L. When the second rotating base 223 and the carrying portion 210 rotate to Figure 5In the position shown, the short side of the supporting portion 210 is parallel to the X-axis direction.

[0063] Combination Figure 1 , Fig.10 and Fig.11 When the second rotating base 223 and the carrying part 210 rotate 90° around the Z axis direction, so that the carrying part 210 is in Figure 1 In the initial state shown, the control logic of the second rotating base 223 is that it rotates to the limit position first and then returns to the process position. Based on this control logic, refer to Fig.11 The working process of the second detection element is as follows: the fifth triggering piece 2243 first passes through the eighth position sensor 2271 and then triggers the ninth position sensor 2272. After the ninth position sensor 2272 is triggered, its signal light goes out. After that, the fifth triggering piece 2243 rotates back to the eighth position sensor 2271 and triggers the eighth position sensor 2271. After the eighth position sensor 2271 is triggered, its signal light goes out. At this time, the second rotating base 223 stops rotating. The eighth position sensor 2271 is the process position, and the ninth position sensor 2272 is the limit position. When the bearing part 210 rotates to Figure 1 In the position shown, the short side of the supporting portion 210 is parallel to the Y-axis direction.

[0064] Combination Fig.10 and Fig.11 The second rotating mechanism 220 further includes a fixed stopper 228 and a movable stopper 229. The fixed stopper 228 includes a first fixed stopper block 2281 and a second fixed stopper block 2282, which are spaced apart along the outer periphery of the second reducer mounting base 224. The movable stopper 229 includes a first movable stopper block 2291 and a second movable stopper block 2292, which are symmetrically disposed on two long side walls of the second rotating base 223.

[0065] refer to Fig.11 The working principle of the first fixed limit block 2281 and the first movable limit block 2291 is: when the bearing part 210 rotates to Figure 1 When the position is shown, if the eighth position sensor 2271 and the ninth position sensor 2272 fail and cause problems in the running program, or when the second rotating mechanism 220 is powered off, the second rotating base 223 may continue to rotate in the direction from the X-axis to the Y-axis, and an abnormality will occur. Therefore, by setting the first fixed limit block 2281 and the first movable limit block 2291, the first fixed limit block 2281 can be abutted against the first movable limit block 2291 when an abnormality occurs, so as to prevent the second rotating base 223 from over-rotating, thereby playing a role of mechanical limit.

[0066] Similarly, the working principle of the second fixed limit block 2282 and the second movable limit block 2292 is: when the pushing device 200 turns to Figure 5 When the position shown is Fig.10 When the sixth position sensor 2261 and the seventh position sensor 2262 shown fail, causing problems in the running program, or when the second rotating mechanism 220 is powered off, the second rotating base 223 may continue to rotate in the direction from the Y-axis to the X-axis, causing an abnormality. Therefore, by setting a second fixed limit block 2282 and a second movable limit block 2292, the second fixed limit block 2282 can abut against the second movable limit block 2292 when an abnormality occurs, preventing the second rotating base 223 from over-rotating, thereby playing a role of mechanical limiting.

[0067] Combination Figures 1 to 5 , Fig.12 and Fig.13 By way of example, the following describes the transfer process when the pushing device 200 and the flipping device 100 receive the substrate 500 in a vertical state. The transfer process includes the following steps:

[0068] Step 1: Figure 1 , the front-end module robot takes out multiple substrates 500, for example, thirteen substrates 500 with a diameter of 300 mm, from the storage box in the loading area, and transfers the substrates 500 to the first wafer carrier 111 and the second wafer carrier 112 of the flipping device 100. At this time, the first wafer carrier 111 and the second wafer carrier 112 are located in the Z-axis direction, which is the initial position of the first wafer carrier 111 and the second wafer carrier 112. The multiple substrates 500 are in a horizontal state. The pushing device 200 is located below the flipping device 100, which is the initial position of the pushing device 200, and the short side of the bearing portion 210 of the pushing device 200 is parallel to the Y-axis direction.

[0069] Step 2: Figure 2 , the first wafer carrier 111 and the second wafer carrier 112 of the flipping device 100 are rotated 90° from the Z-axis direction to the Y-axis direction, and the multi-piece substrate 500 is in a vertical state.

[0070] Step 3: Figure 3 The lifting mechanism 400 drives the pushing device 200 to rise from the initial position through the supporting frame 300, and the bearing portion 210 of the pushing device 200 intersects the vertically-mounted multi-piece substrate 500 with the first wafer carrier 111 and the second wafer carrier 112.

[0071] Step 4: Figure 4After the carrying portion 210 is connected to the substrate 500, it continues to rise until the avoidance groove 330 of the support frame 300 is close to the first wafer carrier 111 of the flipping device 100, and the first end 301 of the support frame 300 rises to the area between the first wafer carrier 111 and the second wafer carrier 112, and the second end 302 of the support frame 300 is close to the first wafer carrier 111, so that the height of the carrying portion 210 exceeds the first wafer carrier 111 and the second wafer carrier 112.

[0072] Step 5: Figure 5 , the carrying portion 210 of the pushing device 200 and the substrate 500 are rotated 90° around the Z-axis direction, and the short side of the carrying portion 210 is parallel to the X-axis direction.

[0073] Step 6: Fig.12 , the first carrier 111 and the second carrier 112 of the flipping device 100 rotate 90° from the Y-axis direction to the Z-axis direction and return to the initial position;

[0074] The substrate transfer robot takes the plurality of substrates 500 from the carrying portion 210 of the pushing device 200 .

[0075] Step 7: Fig.13 The lifting mechanism 400 drives the pushing device 200 to descend through the supporting frame 300, so that the pushing device 200 returns to the initial position.

[0076] Step 8: The carrying portion 210 of the pushing device 200 is rotated 90° around the Z-axis direction so that the short side of the carrying portion 210 is parallel to the Y-axis direction.

[0077] Step nine: The first wafer carrier 111 and the second wafer carrier 112 of the flipping device 100 are reloaded with the substrate 500 .

[0078] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A substrate transfer device, characterized in that: include: The turning device comprises a wafer carrier, wherein the wafer carrier is used to hold the substrate; The pushing device comprises a bearing part, wherein the bearing part is used for connecting the substrate with the wafer carrier; A support frame and a lifting mechanism, wherein the first end of the support frame is connected to the pushing device, the second end of the support frame is connected to the lifting mechanism, and an avoidance groove for avoiding the slide rack is provided between the first end and the second end of the support frame; Among them, the initial height of the bearing part is lower than the carrier rack. When the bearing part and the carrier rack are connecting the substrate, the lifting mechanism drives the pushing device to move toward the flipping device in the vertical direction through the support frame, so that the bearing part obtains the substrate from the carrier rack, and the avoidance groove of the support frame allows the support frame to move along the vertical direction until the height of the bearing part located at the first end of the support frame exceeds the carrier rack.

2. The substrate transfer device according to claim 1, characterized in that: The flipping device also includes a first rotating mechanism and a mounting base; The wafer carrier comprises a first wafer carrier and a second wafer carrier, wherein the first wafer carrier and the second wafer carrier are arranged at two ends of the mounting base opposite to each other and are used to hold the substrate at two radial sides of the substrate; The first rotating mechanism is used to drive the mounting base to rotate around a horizontal rotating axis extending in the horizontal direction, so that the first slide rack and the second slide rack rotate between a vertical direction and a horizontal direction.

3. The substrate transfer device according to claim 2, characterized in that: The first wafer carrier is provided with a first substrate detector for detecting whether there is a substrate on the wafer carrier; The second wafer carrier is provided with a second substrate detector for detecting whether the substrate on the wafer carrier has been transferred to the right position.

4. The substrate transfer device according to claim 3, characterized in that: The first substrate detector and the second substrate detector are respectively laser beam sensors.

5. The substrate transfer device according to claim 1, characterized in that: The first end of the support frame is higher than the second end of the support frame.

6. The substrate transfer device according to claim 2, characterized in that: The first rotating mechanism includes a first driving motor, a first reducer and a first rotating base, the first driving motor drives the first reducer to rotate, and the first reducer drives the first rotating base to rotate; The first rotating base is fixedly connected to the mounting base.

7. The substrate transfer device according to claim 6, characterized in that: The first rotating mechanism further includes a first detecting element for detecting whether the first rotating base has rotated to a process position.

8. The substrate transfer device according to claim 6, characterized in that: The first rotating mechanism further includes a first limiting member and a second limiting member, wherein the first limiting member and the second limiting member are respectively fixed on two opposite sides of the first rotating base; The first rotating base is provided with a first abutting portion for cooperating with the first limiting member, and a second abutting portion for cooperating with the second limiting member.

9. The substrate transfer device according to claim 6, characterized in that: The first rotating mechanism further includes a driving part and a telescopic member, wherein the driving part is used to drive the telescopic member to telescope toward the first rotating base; The first rotating base is provided with a limiting hole for cooperating with the telescopic member.

10. The substrate transfer device according to claim 1, characterized in that: The carrying part is provided with a third substrate detector for detecting whether there is a substrate on the carrying part.

11. The substrate transfer device according to claim 10, characterized in that: The third substrate detector is a laser beam sensor.

12. The substrate transfer device according to claim 1, characterized in that: The pushing device further comprises a second rotating mechanism, and the first end of the supporting frame is connected to the second rotating mechanism; The second rotating mechanism is connected to the carrying part. When the height of the carrying part exceeds the wafer carrier, the second rotating mechanism is used to drive the carrying part to rotate around a vertical rotating axis extending in a vertical direction.

13. The substrate transfer device according to claim 12, characterized in that: The second rotating mechanism includes a second driving motor, a second reducer and a second rotating base, the second driving motor drives the second reducer to rotate, and the second reducer drives the second rotating base to rotate; The second rotating base is fixedly connected to the bearing portion.

14. The substrate transfer device according to claim 13, characterized in that: The second rotating mechanism further includes a second reducer mounting base and a mounting plate, the second reducer is mounted on the second reducer mounting base, the second reducer mounting base is fixedly connected to the mounting plate, and the second driving motor is mounted on the mounting plate; The first end of the support frame is connected to the mounting plate.

15. The substrate transfer device according to claim 13, characterized in that: The second rotating mechanism further includes a second detecting element for detecting whether the second rotating base rotates to a process position.

16. The substrate transfer device according to claim 14, characterized in that: The second rotating mechanism further includes a fixed limiting member and a movable limiting member, wherein the fixed limiting member is arranged on the second reducer mounting base, and the movable limiting member is arranged on the second rotating base for cooperating with the fixed limiting member.

Images