Workpiece stage assembly, semiconductor production equipment and method

Abstract

The present invention provides a workpiece stage assembly, semiconductor production equipment and method, the workpiece stage assembly includes a workpiece stage body and a pressing mechanism; the workpiece stage body includes a suction cup seat and a suction cup, the suction cup is arranged on the suction cup seat; a plurality of pressing mechanisms are arranged around the outer periphery of the suction cup; the pressing mechanism includes a horizontal driving member, a vertical driving member, and a pressing plate part, the horizontal driving member is connected to the suction cup seat, the vertical driving member is connected to the horizontal driving member, and the pressing plate part is connected to the vertical driving member; when the horizontal driving member and the vertical driving member are kept in the same state, the pressing plate part and the suction cup are relatively still. The workpiece stage assembly is used in semiconductor production equipment, and when the semiconductor production equipment is working, the following operations are performed: making the suction cup adsorb the substrate; detecting whether the state of the substrate meets the preset application conditions, if so, executing the preset operation, if not, using the pressing mechanism to press the edge online, and then executing the preset operation to ensure that the preset operation is carried out smoothly.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor production equipment, and in particular relates to a workpiece table component, semiconductor production equipment and method. Background Art

[0002] With the gradual growth of the substrate packaging market, the demand for exposure and packaging equipment in semiconductor production equipment is increasing. However, the process of making boards is complicated. Usually, a glass plate is used as the substrate for multiple additive processes, which increases the thickness of the substrate, and finally it is baked at high temperature to increase the hardness of the substrate. This type of substrate, especially large-size substrates, often warps and deforms after being made. Common types of warping include "crying face warping" with a convex center and concave surroundings, "smiling face warping" with a concave center and convex surroundings, and "M-shaped warping" with alternating concave and convex surfaces.

[0003] The adsorption of thick and hard warped substrates is an important test of the performance of the workpiece stage. In the prior art, the adsorption of warped substrates is usually supplemented by offline edge pressing, that is, after the suction cup of the workpiece stage adsorbs the substrate, if the substrate is warped, an offline edge pressing mechanism is used to press and shape the substrate so that the warped area becomes flat, and then the offline edge pressing mechanism is separated from the substrate. After the offline edge pressing mechanism is separated from the substrate, subsequent predetermined operations such as exposure operations can be performed on the shaped substrate.

[0004] When the offline edge pressing mechanism presses the warped area of ​​the substrate, stress accumulates on the substrate. For ultra-hard and ultra-thick substrates, the stress accumulated during the pressing process is greater than the suction force of the suction cup on the originally warped area, which results in that when the offline edge pressing mechanism is separated from the substrate, the shaped substrate will rebound under the action of stress and partially separate from the suction cup, and return to the warped state. Summary of the invention

[0005] The object of the present invention is to provide a workpiece stage assembly, semiconductor production equipment and method, aiming to ensure that when a predetermined operation is performed on a substrate, the state of the substrate meets the preset application conditions.

[0006] To achieve the above-mentioned purpose, the present invention provides a workpiece table assembly, including a workpiece table body and a plurality of edge pressing mechanisms; the workpiece table body includes a suction cup seat and a suction cup, and the suction cup is arranged on the suction cup seat; a plurality of the edge pressing mechanisms are arranged circumferentially on the periphery of the suction cup; each of the edge pressing mechanisms includes: a horizontal driving member, connected to the suction cup seat; a vertical driving member, connected to the horizontal driving member, and moved in a horizontal direction to approach or move away from the suction cup under the drive of the horizontal driving member; and a pressure plate part, connected to the vertical driving member, and moved in a vertical direction to approach or move away from the suction cup under the drive of the vertical driving member; the workpiece table assembly is configured to keep the suction cup and the pressure plate part relatively still when the horizontal driving member and the vertical driving member are maintaining a state.

[0007] Optionally, the workpiece stage body further includes a posture adjustment mechanism, and the suction cup seat is connected to the posture adjustment mechanism. Optionally, the horizontal driving member includes a first fixed portion and a first movable portion connected to each other, the first fixed portion is connected to the suction cup seat and remains relatively still with the suction cup seat; the vertical driving member includes a second fixed portion and a second movable portion connected to each other; the second fixed portion is connected to the first movable portion; and the pressure plate portion is arranged on the second movable portion.

[0008] Optionally, at least one of the edge clamping mechanisms includes a plurality of the horizontal driving members, and the plurality of the horizontal driving members of the same edge clamping mechanism are configured to run synchronously or stop running synchronously.

[0009] Optionally, at least one of the edge clamping mechanisms includes a plurality of the vertical driving members, and the plurality of vertical driving members of the same edge clamping mechanism are configured to run synchronously or stop running synchronously.

[0010] Optionally, at least one of the pressure plate portions includes a plurality of sub-pressure plate portions arranged at intervals along its own extension direction, and each of the sub-pressure plate portions is connected to at least one of the vertical driving members.

[0011] Optionally, the suction cup is used to absorb a substrate, and the substrate has multiple edge regions; the sum of the number of the pressing plate parts of all the edge pressing mechanisms is the same as the number of the edge regions, and each of the pressing plate parts is arranged corresponding to one of the edge regions.

[0012] Optionally, each of the edge pressing mechanisms includes one pressure plate portion; or, at least one of the edge pressing mechanisms includes two pressure plate portions connected at an angle.

[0013] Optionally, the pressure plate portion includes an adapter plate and a pressure strip, the adapter plate is connected to the vertical driving member, and the pressure strip is connected to a side of the adapter plate facing the horizontal driving member.

[0014] Optionally, the edge clamping mechanism also includes a blocking portion, which is connected to the adapter plate and is located on a side of the pressure strip away from the suction cup; the blocking portion includes a first side guard and a second side guard, the first side guard is connected to the side of the adapter plate facing the horizontal driving member, and the vertical dimension of the first side guard is larger than the vertical dimension of the pressure strip; the second side guard is a flexible structure, and is connected to the free end of the first side guard, and protrudes from the free end of the adapter plate; one end of the second side guard facing the horizontal driving member is aligned with one end of the first side guard facing the horizontal driving member; all the blocking portions of the edge clamping mechanism can be spliced ​​to form an annular structure.

[0015] Optionally, the edge pressing mechanism further comprises a force detection element, wherein the force detection element is disposed on the pressing plate portion and is configured to detect the vertical pressure exerted on the pressing plate portion.

[0016] To achieve the above-mentioned object, the present invention further provides a semiconductor production equipment, comprising a workpiece stage assembly as described in any of the preceding items.

[0017] To achieve the above-mentioned purpose, the present invention also provides a semiconductor production method, which is implemented based on the semiconductor production equipment as described above, and the semiconductor production method includes: making the suction cup adsorb the substrate; detecting the state of the substrate, if the state of the substrate meets the preset application conditions, executing the preset operation, if the state of the substrate does not meet the preset application conditions, first controlling the horizontal driving member and the vertical driving member of at least one of the edge pressing mechanisms to operate, so that the corresponding pressure plate part is pressed against the corresponding edge area of ​​the substrate and the substrate is shaped to the state of the substrate meets the preset application conditions, and then executing the preset operation while keeping the corresponding pressure plate part pressed against the corresponding edge area of ​​the substrate.

[0018] Optionally, a first alignment point is provided on the substrate, and a second alignment point is provided on the workpiece table body; after the edge pressing mechanism shapes the substrate and before performing the preset operation, the semiconductor production method further includes: detecting whether the first alignment point is aligned with the second alignment point, if so, performing the preset operation, if not, adjusting the position of the suction cup while keeping the corresponding pressure plate portion pressed against the corresponding edge area of ​​the substrate, so as to align the first alignment point with the second alignment point.

[0019] Optionally, the step of controlling the horizontal driving member and the vertical driving member of at least one of the edge clamping mechanisms to operate so that the corresponding pressure plate portion is pressed against the edge of the substrate includes: controlling the vertical driving member of the corresponding edge clamping mechanism to operate, and driving the pressure plate portion to move vertically to be higher than the substrate; controlling the horizontal driving member of the corresponding edge clamping mechanism to operate, and driving the vertical driving member to move in the horizontal direction to approach the substrate; controlling the vertical driving member of the corresponding edge clamping mechanism to operate, and driving the pressure plate portion to move vertically until it is pressed against the substrate.

[0020] Optionally, in the process of controlling the vertical driving member of the corresponding edge pressing mechanism to operate and driving the pressing plate portion to move vertically until it is pressed against the substrate, the vertical driving member is controlled according to the vertical pressure exerted on the pressing plate portion.

[0021] Compared with the prior art, the workpiece stage assembly, semiconductor production equipment and method of the present invention have the following advantages: the aforementioned workpiece stage assembly includes a workpiece stage body and a plurality of edge clamping mechanisms; the workpiece stage body includes a suction cup and a suction cup seat, and the suction cup is arranged on the suction cup seat; a plurality of the edge clamping mechanisms are arranged circumferentially around the outer periphery of the suction cup; each of the edge clamping mechanisms includes a horizontal driving member, a vertical driving member, and a pressure plate portion, the horizontal driving member is connected to the suction cup seat, the vertical driving member is connected to the movable portion of the horizontal driving member, and moves in a horizontal direction to approach or move away from the suction cup under the drive of the horizontal driving member, the pressure plate portion is connected to the vertical driving member, and moves in a vertical direction to approach or move away from the suction cup under the drive of the vertical driving member; the workpiece stage assembly is configured to keep the suction cup and the pressure plate portion relatively still when the horizontal driving member and the vertical driving member are maintaining a state. The workpiece stage assembly can be applied to semiconductor production equipment, so that the semiconductor production equipment can be used to perform a semiconductor production method on a substrate, the semiconductor production method comprising: allowing the suction cup to adsorb the substrate; detecting the state of the substrate, if the state of the substrate meets the preset application conditions, performing a preset operation, if the state of the substrate does not meet the preset application conditions, first controlling the horizontal driving member and the vertical driving member of at least one of the edge pressing mechanisms to operate, so that the corresponding edge pressing portion is pressed against the corresponding edge area of ​​the substrate, and the substrate is shaped to meet the preset application conditions, and then the preset operation is performed while maintaining the corresponding pressure plate portion pressed against the corresponding edge area of ​​the substrate. That is, when the state of the substrate does not meet the preset application conditions, at least one edge pressing mechanism is used to continuously press against the substrate during the entire process of the preset operation to keep the substrate in a state that meets the preset application conditions, thereby ensuring the smooth execution of the preset operation. In addition, the structure of the workpiece stage assembly enables the edge pressing mechanism to press the substrate adsorbed by the suction cup even if the workpiece stage body loses the servo state, so that the subsequent preset operation is smoothly executed. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The accompanying drawings are used to better understand the present invention and shall not constitute improper limitations of the present invention.

[0023] Figure 1 4 is a top view of a workpiece stage assembly provided according to an embodiment of the present invention.

[0024] Figure 2 It is a schematic diagram of an application scenario of a workpiece table assembly provided according to an embodiment of the present invention, in which the edge pressing mechanism is far away from the substrate.

[0025] Figure 3is a schematic diagram of an application scenario of a workpiece stage assembly provided according to an embodiment of the present invention, Figure 3 Observation direction and Figure 2 Different, and Figure 3 The horizontal driving member of the edge pressing mechanism drives the vertical driving member and the pressing plate portion to approach the substrate.

[0026] Figure 4 It is a schematic diagram of an application scenario of a workpiece table assembly provided according to an embodiment of the present invention, in which the edge pressing assembly presses the substrate.

[0027] Figure 5 It is a simplified schematic diagram of a workpiece table assembly provided according to an embodiment of the present invention. In the figure, each edge clamping mechanism includes a clamping plate portion and does not include a blocking portion.

[0028] Figure 6 1 is a simplified schematic diagram of a workpiece table assembly provided according to an embodiment of the present invention. In the figure, each edge clamping mechanism includes two pressing plate parts connected at an angle and does not include a blocking part.

[0029] Figure 7 It is a simplified schematic diagram of a workpiece table assembly provided according to an embodiment of the present invention. Each edge clamping mechanism in the figure includes a clamping plate portion and also includes a blocking portion.

[0030] Figure 8 yes Figure 7 A schematic diagram of the partial structure of the workpiece table assembly is shown.

[0031] Fig. 9 1 is a simplified schematic diagram of a workpiece table assembly provided according to an embodiment of the present invention. Each edge clamping mechanism in the figure includes two pressing plate parts connected at an angle and also includes a blocking part.

[0032] Fig.10 yes Fig. 9 A schematic diagram of the partial structure of the workpiece table assembly is shown.

[0033] Fig.11 It is a schematic diagram of an application scenario of a workpiece table assembly provided according to an embodiment of the present invention. The edge clamping mechanism in the figure includes a blocking portion, but the second blocking edge is not shown.

[0034] Fig.12 It is a workflow diagram of an exposure device provided according to one embodiment of the present invention.

[0035] Fig.13 This is another workflow diagram of an exposure device provided according to one embodiment of the present invention.

[0036] [The accompanying drawings are marked as follows]: 100-workpiece table body, 110-suction cup, 120-position adjustment mechanism, 121-long-stroke motion module, 122-micro-motion module, 130-suction cup seat, 200-edge clamping mechanism, 210-horizontal driving member, 220-vertical driving member, 230-pressure plate part, 231-second adapter plate, 232-pressure strip, 240-force detection element, 250-first adapter plate, 260-enclosing part, 261-first flange, 2611-flange body, 2512-flexible contact part, 262-second flange, 01-substrate. DETAILED DESCRIPTION

[0037] The following is an explanation of the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the illustrations provided in the present embodiment only illustrate the basic concept of the present invention in a schematic manner, and only the components related to the present invention are shown in the figure instead of being drawn according to the number, shape and size of the components in the actual implementation. The type, quantity and proportion of each component in the actual implementation can be a random change, and the component layout type may also be more complicated.

[0038] In addition, each embodiment of the following description has one or more technical features, but this does not mean that the user of the present invention must implement all the technical features in any embodiment at the same time, or can only implement part or all of the technical features in different embodiments separately. In other words, under the premise that implementation is possible, those skilled in the art can selectively implement part or all of the technical features in any embodiment according to the disclosure of the present invention and according to the design specifications or implementation requirements, or selectively implement a combination of part or all of the technical features in multiple embodiments, thereby increasing the flexibility of the implementation of the present invention.

[0039] As used in this specification, the singular forms "one", "an", and "the" include plural objects, and the plural form "a plurality" includes more than two objects, unless the content clearly indicates otherwise. As used in this specification, the term "or" is generally used in a sense that includes "and / or", unless the content clearly indicates otherwise, and the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediate medium, and it can be a connection between two elements or an interactive relationship between two elements. Relational terms such as the terms "first", "second", etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor do they indicate or imply relative importance or implicitly indicate the number of technical features indicated. It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] In order to make the purpose, advantages and features of the present invention more clear, the present invention is further described in detail below with reference to the accompanying drawings. It should be noted that the drawings are all in very simplified form and in non-precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention. The same or similar reference numerals in the drawings represent the same or similar components.

[0041] like Figures 1 to 4As shown, an embodiment of the present invention provides a workpiece stage assembly, which includes a workpiece stage body 100 and a plurality of edge pressing mechanisms 200. The workpiece stage body 100 includes a suction cup 110 and a suction cup seat 130, and the suction cup 110 is arranged on the suction cup seat 130. A plurality of edge pressing mechanisms 200 are arranged circumferentially on the periphery of the suction cup 110. Each of the edge pressing mechanisms 200 includes a horizontal driving member 210, a vertical driving member 220 and a pressure plate portion 230, wherein the horizontal driving member 210 is connected to the suction cup seat 130, the vertical driving member 220 is connected to the horizontal driving member 210, and the pressure plate portion 230 is connected to the vertical driving member 220. The horizontal driving member 210 is configured to drive the vertical driving member 220 and the pressure plate portion 230 connected to the vertical driving member 220 to move in a horizontal direction to approach or move away from the suction cup 110. The vertical driving member 220 is used to drive the pressing plate portion 230 to move vertically to approach or move away from the suction cup 110. The workpiece stage assembly is configured to keep the suction cup 110 and the pressing plate portion 230 relatively still when the horizontal driving member 210 and the vertical driving member 220 are in a state-maintaining state. The vertical direction refers to the vertical direction.

[0042] The workpiece stage assembly is used to carry a substrate 01 and can be applied to a semiconductor production equipment so that the semiconductor production equipment can perform a semiconductor production method on the substrate 01 .

[0043] When the semiconductor production method is performed on the substrate 01, the state of the substrate 01 adsorbed by the suction cup 110 needs to meet the preset application conditions, such as the state that the substrate 01 is flat and has no warping, or the vacuum adsorption threshold of the edge area of ​​the substrate 01 reaches the set threshold. However, in practice, the substrate 01 is often in a warped state after the plate making is completed, resulting in the state of the substrate 01 after being adsorbed by the suction cup 110 not meeting the preset application conditions. At this time, the edge pressing mechanism 200 can be used to press the edge area of ​​the substrate 01 to shape the substrate 01 so that the shaped substrate 01 meets the preset application conditions.

[0044] In an embodiment of the present invention, based on the structure of the workpiece stage assembly, a process of the semiconductor production method is as follows: Fig.12 As shown, the process includes the following steps S11, S12, S13 and S14.

[0045] The step S11 includes causing the suction cup 110 to absorb the substrate 01 .

[0046] The step S12 includes detecting the state of the substrate 01. If the state of the substrate 01 meets the preset application condition, step S14 is executed. If the state of the substrate 01 does not meet the preset application condition, step S13 is executed first, and then step S14 is executed.

[0047] The step S13 includes controlling the horizontal driving member 210 and the vertical driving member 220 of at least one of the edge pressing mechanisms 200 to operate so that the corresponding pressing plate portion 230 presses against the corresponding edge region of the substrate 01 to shape the substrate 01 .

[0048] The step S14 includes performing a preset operation on the substrate 01 .

[0049] It is worth noting that if step S13 is performed first and then step S14 is performed, then during the execution of step S14, the corresponding pressing plate portion 230 is always pressed against the corresponding edge area of ​​the substrate 01 to continuously shape the substrate 01. That is, the edge pressing mechanism 200 shapes the substrate 01 online in the preset operation. Compared with the offline edge pressing mechanism in the prior art, the problem of the shaped substrate 01 returning to a warped shape after being separated from the offline edge pressing mechanism will not occur, which effectively ensures that the substrate 01 performs the preset operation when it meets the preset application conditions, thereby ensuring the operation quality. Moreover, the online edge pressing working mode also cancels the offline edge pressing station originally arranged in the whole machine. On the one hand, this reduces the overall size of the semiconductor production equipment, thereby reducing the whole machine cost of the semiconductor production equipment. On the other hand, it also shortens the movement stroke of the workpiece stage assembly, thereby facilitating the improvement of the production capacity of the semiconductor production equipment.

[0050] Furthermore, during the process of online edge pressing by the edge pressing mechanism 200, if the servo state of the workpiece stage body 100 is destroyed, causing the vertical plane of the workpiece stage body 100 to change, the pressure plate portion 230 and the suction cup 110 can still cooperate with each other to keep the substrate 01 in a state that meets the preset application conditions. Conversely, when the substrate 01 is shaped by the edge pressing mechanism 200, the workpiece stage body 100 can be in a non-servo state. It can be understood that as long as the edge pressing mechanism 200 can complete the edge pressing normally, even if the workpiece stage body 100 is not in a servo state, it can complete the adsorption of the substrate 01, and then complete the subsequent exposure operation. For the offline edge pressing mechanism in the prior art, once the workpiece stage loses the servo state, the offline edge pressing mechanism cannot complete the edge pressing operation, resulting in the suction cup on the workpiece stage being unable to adsorb the substrate, and the subsequent exposure operation cannot be completed.

[0051] In addition, the arrangement of the horizontal driving member 210 and the vertical driving member 220, on the one hand, enables the edge pressing mechanism 200 to shape the substrates 01 of different areas and thicknesses, and on the other hand, can press a certain edge area on the substrate 01 separately as needed, or press several edge areas, instead of pressing all edge areas of the substrate 01, thereby reducing the risk of damage to the substrate 01.

[0052] It is easy to understand that the suction cup 110 and the suction cup seat 130 remain relatively still. The horizontal driving member 210 includes a first fixed portion and a first movable portion connected to each other, and the first movable portion can move relative to the first fixed portion, wherein the first fixed portion is connected to the suction cup seat 130. The vertical driving member 220 includes a second fixed portion and a second movable portion connected to each other, and the second movable portion can move relative to the second fixed portion. The second fixed portion is connected to the first movable portion, and the second movable portion is connected to the pressure plate portion 230. In this way, when the horizontal driving member 210 and the vertical driving member 220 are maintained in state so that the position of the first movable portion of the horizontal driving member 210 remains unchanged and the position of the second movable portion of the vertical driving member 220 also remains unchanged, the pressure plate portion 230 and the suction cup seat 130 remain relatively still, thereby achieving the effect of the pressure plate portion 230 and the suction cup 110 remaining relatively still.

[0053] In the embodiment of the present invention, the semiconductor production equipment is, for example, an exposure equipment, so the semiconductor production method is an exposure method, and the preset operation is an exposure operation. Of course, the semiconductor production equipment can also be other equipment, such as a defect detection equipment, and accordingly, the semiconductor production method is a defect detection method, and the preset operation is a defect detection operation.

[0054] Next, the structure of the workpiece stage assembly is further described in detail. For the convenience of description, the semiconductor production equipment is an exposure equipment as an example for description. Those skilled in the art may modify the following description to adapt to the situation where the semiconductor production equipment is other equipment.

[0055] Continue to refer Figures 1 to 4 The workpiece stage body 100 further includes a posture adjustment mechanism 120. The suction cup seat 130 is connected to the posture adjustment mechanism 120. The posture adjustment mechanism 120 is used to drive the suction cup 110 to move, thereby adjusting the posture of the substrate 01 adsorbed on the suction cup 110. It should be understood that "posture" includes position and posture.

[0056] More specifically, the posture adjustment mechanism 120 includes a long-stroke motion module 121 and a micro-motion module 122. The micro-motion module 122 is arranged on the long-stroke motion module 121, and the suction cup seat 130 is arranged on the micro-motion module 122. The long-stroke motion module 121 is configured to drive the suction cup 110 and the substrate 01 thereon to perform long-stroke motion in a horizontal plane, such as moving between an exposure termination position, a substrate handover position, each substrate alignment point, a mask space image position, and an exposure start position. The micro-motion module 122 is used to drive the suction cup 110 and the substrate 01 thereon to perform micro-motion adjustment of the four degrees of freedom of Rx / Ry / Rz / Z to complete the leveling and focusing operation of the workpiece stage body 100. The specific structures of the long-stroke motion module 121 and the micro-motion module 122 can refer to the prior art and will not be repeated here.

[0057] Those skilled in the art know that a first alignment point is provided on the substrate 01, and a second alignment point is provided on the workpiece stage body 100. The step S11 is performed at the substrate handover position. Before the step S11 is performed, the posture adjustment mechanism 120 positions the workpiece stage body 100 at the substrate handover position on the premise that the state of the substrate 01 adsorbed by the suction cup 110 meets the preset application condition. In this case, if the state of the substrate 01 adsorbed by the suction cup 110 meets the preset application condition, once the substrate 01 is adsorbed by the suction cup 110, the first alignment point is aligned with the second alignment point. However, if the state of the adsorbed substrate 01 does not meet the preset application conditions, then when the substrate 01 is shaped by the edge pressing mechanism 200 until the state of the substrate 01 meets the preset application conditions, the first alignment point and the second alignment point may be misaligned. At this time, since the suction cup 110 and the pressure plate part 230 remain relatively stationary, the position of the workpiece stage body 100 can be fine-tuned by the micro-motion module 122 to align the first alignment point with the second alignment point, thereby ensuring the exposure quality of the subsequent exposure operation.

[0058] Each of the edge clamping mechanisms 200 may include one or more horizontal driving members 210. When the edge clamping mechanism 200 includes multiple horizontal driving members 210, the first fixed parts of the multiple horizontal driving members 210 of the edge clamping mechanism 200 are all connected to the suction cup seat 130, the first movable parts of the multiple horizontal driving members 210 of the edge clamping mechanism 200 are all connected to the second fixed part of the vertical driving member 220 belonging to the same edge clamping mechanism 200, and the multiple horizontal driving members 210 of the same edge clamping mechanism 200 are configured to run synchronously or stop running synchronously. In addition, the number of the horizontal driving members 210 of different edge clamping mechanisms 200 may be the same or different.

[0059] In addition, the embodiment of the present invention does not specifically limit the specific form of the horizontal drive member 210, which may include any suitable linear motion mechanism. In some examples, the horizontal drive member 210 includes a pneumatic slide, so that the cylinder of the pneumatic slide constitutes the first fixed part, and the slider of the pneumatic slide constitutes the first movable part; in other examples, the horizontal drive member 210 includes a linear motor, the housing of the linear motor constitutes the first fixed part, and the output shaft of the linear motor constitutes at least a part of the first movable part; in some other examples, the horizontal drive member 210 includes a rotary motor and a lead screw nut pair, the housing of the rotary motor constitutes the first fixed part, and the nut of the lead screw nut pair constitutes at least a part of the first movable part. It can be understood that when the horizontal drive member 210 includes the pneumatic slide, the flow of the pneumatic slide can be adjusted by setting a throttle valve to control the movement speed of the first movable part, so as to avoid the first movable part from moving too fast and causing damage to the substrate 01. When the horizontal driving member 210 includes the linear motor or the rotary motor, a speed regulating valve may be provided to control the speed of the linear motor or the rotary motor, thereby controlling the movement speed of the first movable part.

[0060] The embodiment of the present invention does not particularly limit the specific form of the vertical drive member 220, which may include any suitable linear motion mechanism, such as a pneumatic slide, a linear motor, or a combination of a rotary motor and a lead screw nut pair. When the vertical drive member 220 includes the pneumatic slide, the flow of the pneumatic slide can be adjusted by setting a throttle valve to control the movement speed of the second movable part, so as to avoid the second movable part from moving too fast and causing the pressure plate part 230 to damage the substrate 01, and the air pressure of the pneumatic slide can be adjusted by setting a pressure regulating valve to adjust the pressure of the pressure plate part 230 on the substrate 01 to avoid crushing the substrate 01. When the vertical drive member 220 includes the linear motor or the rotary motor, the speed of the linear motor or the rotary motor can be controlled by setting a speed regulating valve to control the speed of the linear motor or the rotary motor, so as to control the movement speed of the second movable part, and the pressure applied by the pressure plate part 230 on the substrate 01 can be controlled by controlling the output torque of the linear motor or the rotary motor.

[0061] Preferably, the edge pressing mechanism 200 further includes a force detection element 240, which is disposed on the pressure plate portion 230 and is used to detect the vertical pressure on the pressure plate portion 230. It can be understood that when the pressure plate portion 230 presses against the substrate 01, the substrate 01 applies a reaction force to the pressure plate portion 230, so that the pressure plate portion 230 is subjected to vertical pressure. The vertical pressure is detected by the force detection element 240, and the pressure applied by the pressure plate portion 230 on the substrate 01 can be known. Then, the output torque of the vertical driving member 220 can be controlled according to the vertical pressure to adjust the pressure applied by the pressure plate portion 230 on the substrate 01, so as to avoid the problem that the pressure applied by the pressure plate portion 230 on the substrate 01 is too small, resulting in invalid edge pressing, and also avoid the problem that the pressure applied by the pressure plate portion 230 on the substrate 01 is too large, resulting in crushing the substrate 01.

[0062] Optionally, the edge pressing mechanism 200 further includes a first adapter plate 250, which extends vertically and is connected to the horizontal driving member 210. The vertical driving member 220 is connected to the first adapter plate 250, that is, the vertical driving member 220 is indirectly connected to the horizontal driving member 210 through the first adapter plate 250. In an alternative embodiment, the vertical driving member 220 is directly connected to the horizontal driving member 210.

[0063] Each of the edge pressing mechanisms 200 includes at least one of the pressing plate portions 230. The sum of the number of the pressing plate portions 230 of each of the edge pressing mechanisms 200 is equal to the number of edge regions on the substrate 01, and the pressing plate portions 230 correspond to the edge regions of the substrate 01 one by one, and each of the pressing plate portions 230 extends along the extension direction of the corresponding edge region.

[0064] Specifically, when the substrate 01 is a triangle, rectangle or polygon, each side of the substrate 01 can be regarded as an edge area, and the sum of the number of the pressing plate parts 230 of all the edge pressing mechanisms 200 is the number of sides of the substrate 01, and a pressing plate part 230 is provided at each side of the substrate 01. In one example, the substrate 01 is a rectangle, so all the edge pressing mechanisms 200 have a total of four pressing plate parts 230, and the four pressing plate parts 230 are distributed in a rectangular ring, so that each pressing plate part 230 corresponds to an edge of the substrate 01. When the substrate is circular (not shown in the figure), the circular edge line of the substrate can be divided into multiple edge areas according to a set unit angle, so the number of the edge areas is , α is a unit angle, and all the edge clamping mechanisms 200 have The pressing plate portion 230, and The pressing plate portions 230 are distributed in a circular shape.

[0065] In some examples, such as Figure 1 and Figure 5 As shown, each of the edge pressing mechanisms 200 includes a pressing plate portion 230. In other examples, such as Figure 6 As shown, at least one of the edge clamping mechanisms 200 includes two pressure plate portions 230. It can be understood that the two pressure plate portions 230 belonging to the same edge clamping mechanism 200 are connected at an angle so that each pressure plate portion 230 extends along the extension direction of the corresponding edge area. Figure 6 The embodiment shown is compared to Figure 1 For the embodiment shown, when all the edge pressing mechanisms 200 operate simultaneously to press the entire edge area of ​​the substrate 01, the number of gaps between the pressing plate parts 230 can be reduced to prevent excessive gaps from causing inadequate shaping and causing air leakage in the suction cup 110.

[0066] Optionally, each of the edge clamping mechanisms 200 may include one or more vertical driving members 220. When the edge clamping mechanism 200 includes multiple vertical driving members 220, the second fixed parts of the multiple vertical driving members 220 of the edge clamping mechanism 200 are all connected to the first movable part of the horizontal driving member 210 belonging to the same edge clamping mechanism 200.

[0067] When the edge clamping mechanism 200 including a plurality of the vertical driving members 220 includes a pressure plate portion 230, and the pressure plate portion 230 extends continuously along the extension of the corresponding edge area, or when the edge clamping mechanism 200 including a plurality of the vertical driving members 220 includes two pressure plate portions 230 connected at an angle, the second movable portions of the plurality of the vertical driving members 220 of the edge clamping mechanism 200 are all connected to the pressure plate portion 230. This arrangement can increase the pressure of the pressure plate portion 230 on the substrate 01 and improve the shaping effect on the substrate 01. It should be understood that the plurality of vertical driving members 220 of the same edge clamping mechanism 200 are configured to run synchronously or stop running synchronously. In addition, the number of the vertical driving members 220 of different edge clamping mechanisms 200 may be the same or different. When the edge pressing mechanism 200 including a plurality of the vertical driving members 220 includes a pressing plate portion 230, and the pressing plate portion 230 includes a plurality of sub-pressing plate portions (not shown in the figure) arranged at intervals along the extension direction of the corresponding edge region, each of the sub-pressing plate portions is connected to the second movable portion of at least one of the vertical driving members 220, so that each of the sub-pressing plate portions can be driven by the corresponding vertical driving member 220 to independently move vertically. It can be understood that when the same sub-pressing plate portion is connected to a plurality of the vertical driving members 220, the plurality of the vertical driving members 220 connected to the same sub-pressing plate portion are configured to operate synchronously or stop operating synchronously.

[0068] Optionally, the pressure plate portion 230 includes a second adapter plate 231 and a pressure strip 232. The second adapter plate 231 is connected to the vertical driving member 220, and the pressure strip 232 is connected to the side of the second adapter plate 231 facing the horizontal driving member 210. In this way, the pressure strip 232 is used to directly contact the substrate 01 and apply pressure to the substrate 01.

[0069] The second adapter plate 231 is configured to be elastic, for example, a spring sheet is used as the second adapter plate 231. Thus, when the pressing plate portion 230 applies pressure to the substrate 01, the pressing plate portion 230 is in a state of slowly pressing, and the pressing plate portion 230 is elastically deformed to prevent the pressing plate portion 230 from being too hard and causing damage to the substrate 01. The pressure strip 232 can be configured as a flexible mechanism, for example, it is made of soft materials such as silicone and rubber.

[0070] More preferably, if Figures 7 to 11As shown, the edge pressing mechanism 200 further includes a retaining portion 260, which is disposed on a side of the pressure strip 232 away from the suction cup 110 and includes a first retaining edge 261 and a second retaining edge 262. The first retaining edge 261 is connected to a side of the second adapter plate 231 facing the horizontal driving member 210, and the vertical dimension of the first retaining edge 261 is larger than the vertical dimension of the pressure strip 232. The second retaining edge 262 is a flexible structure, and the second retaining edge 262 is connected to the free end of the first retaining edge 261 and protrudes from the free end of the second adapter plate 231. The vertical dimension of the second retaining edge 262 is larger than the vertical dimension of the pressure strip 232, so that the end of the second retaining edge 262 close to the horizontal driving member 210 is aligned with the end of the first retaining edge 261 close to the horizontal driving member 210, and the meaning of alignment here is flat or approximately flat. It can be understood that the second rib 262 may also be connected to the free end of the second adapter plate 231 .

[0071] In actual operation, the area of ​​the substrate 01 is smaller than the area of ​​the suction cup 110, so that when all the edge pressing mechanisms 200 are working to press the entire edge area of ​​the substrate 01, the enclosure parts 260 of all the edge pressing mechanisms 200 are together enclosed on the periphery of the substrate 01, and spliced ​​to form an encirclement surrounding the substrate 01, and at the same time all the enclosure parts 260 are pressed against the suction cup 110, reducing the air leakage of the suction cup 110 and improving the suction capacity of the suction cup 110 to the substrate 01. Here, the purpose of setting the second retaining edge 262 as a flexible structure is to enable the second retaining edge 262 to fill the gap between the two adjacent pressure plate parts 230 to reduce the possibility of air leakage from the two adjacent pressure plate parts 230, and to overcome the interference problem between the two adjacent pressure plate parts 200 through its own deformation. In actual work, the smaller the distance between the enclosure 260 and the substrate 01 is, the better. When the enclosure 260 contacts the outer edge of the substrate 01 , the best effect is achieved.

[0072] Preferably, the first rib 261 includes a rib body 2611 and a flexible contact portion 2612, the rib body 2611 is connected to the second adapter plate 231, and the flexible contact portion 2612 is connected to a side of the rib body 2611 away from the second adapter plate 231. The rib body 2611 may also be flexible.

[0073] In addition, the workbench assembly may further include a positioning element for positioning the pressing plate portion 230 and the enclosure portion 260 to ensure that when all the pressing plate portions 230 are pressed against the substrate 01, all the enclosure portions 260 surround and surround the substrate 01 and press against the suction cup 110. The embodiment of the present invention does not particularly limit the structure and setting position of the positioning element, as long as it can achieve the above functions.

[0074] Furthermore, an embodiment of the present invention also provides a semiconductor production device, which includes the aforementioned workpiece stage assembly. The semiconductor production device includes but is not limited to any one of an exposure device and a defect detection device.

[0075] Furthermore, an embodiment of the present invention also provides a semiconductor production method, which is performed based on the aforementioned semiconductor production equipment.

[0076] In one example, the process of the semiconductor production method is as follows Fig.12 As shown, and includes the aforementioned steps S11 to S14.

[0077] In another example, the process of the semiconductor production method is as follows Fig.13 As shown, it includes the following steps S21 to S26.

[0078] Step S21 includes causing the suction cup 110 to absorb the substrate 01 .

[0079] Step S22 includes detecting the state of the substrate 01. If the state of the substrate 01 meets the preset application conditions, step S26 is executed. If the state of the substrate 01 does not meet the preset application conditions, at least step S23 and step S24 are executed.

[0080] Step S23 includes controlling the horizontal driving member 210 and the vertical driving member 220 of at least one of the edge pressing mechanisms 200 to operate so that the corresponding pressing plate portion 230 is pressed against the corresponding edge area of ​​the substrate 01 to shape the substrate 01 to a state that meets preset application conditions.

[0081] Step S24 includes detecting whether the first alignment point on the substrate 01 is aligned with the second alignment point on the workpiece stage body 100 . If so, step S26 is executed. If not, step S25 is executed first, and then step S26 is executed.

[0082] Step S25 includes adjusting the posture of the suction cup 110 so that the first alignment point and the second alignment point are aligned.

[0083] Step S26 includes executing the preset operation.

[0084] It can be understood that the step S11 and the step S21 are performed at the substrate handover position.

[0085] The step S12 and the step S21 are performed with reference to the prior art and are not described in detail here.

[0086] The specific operations of step S13 and step S23 may include: firstly controlling the corresponding vertical driving member 220 of the edge pressing mechanism 200 to operate, and driving the pressing plate portion 230 to move vertically to be higher than the substrate 01; then controlling the corresponding horizontal driving member 210 of the edge pressing mechanism 200 to operate, and driving the vertical driving member 220 and the pressing plate portion 230 to move horizontally to approach the substrate 01; finally controlling the corresponding vertical driving member 220 of the edge pressing mechanism 200 to operate, and driving the pressing plate portion 230 to move vertically until the pressing plate portion 230 presses against the corresponding edge region of the substrate 01. It can be understood that after the pressing plate portion 230 contacts the substrate 01, the vertical driving member 220 should be controlled to operate according to the pressure value detected by the force detection element 240, so that the pressure applied by the pressing plate portion 230 on the substrate 01 is appropriate, so as to ensure effective pressing of the substrate 01 and avoid crushing the substrate 01.

[0087] The step S24 can be performed with reference to the prior art and will not be described in detail here.

[0088] The step S25 is implemented by the operation of the micro-motion module 122 , which is well known to those skilled in the art and will not be described in detail here.

[0089] According to the specific type of the semiconductor manufacturing equipment, the preset operation is an exposure operation or a defect detection operation, or other operations.

[0090] After the preset operation is completed, the suction cup 110 and the substrate 01 are controlled to move to the substrate handover position through the posture adjustment mechanism 120, and then the substrate 01 is unloaded from the workpiece stage assembly through the following operations: the vertical driving member 220 of the corresponding edge pressing mechanism 200 is controlled to operate to drive the pressure plate portion 230 to move in a direction away from the substrate 01 until the pressure plate portion 230 is higher than the substrate 01, so as to release the pressure on the substrate 01. Then the horizontal driving member 210 of the corresponding edge pressing mechanism 200 is controlled to operate to drive the corresponding vertical driving member 220 to move in a direction away from the substrate 01. Then the vertical driving member 220 of the corresponding edge pressing mechanism 200 is controlled to operate to drive the pressure plate portion 230 to move below the substrate 01. Then the suction cup 110 is controlled to release the pressure, and a robot arm is used to take away the substrate 01.

[0091] Although the present invention is disclosed as above, it is not limited thereto. Those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A workpiece stage assembly, characterized in that: It includes a workpiece table body and a plurality of edge pressing mechanisms; the workpiece table body includes a suction cup seat and a suction cup, and the suction cup is arranged on the suction cup seat; a plurality of edge pressing mechanisms are arranged around the periphery of the suction cup; each of the edge pressing mechanisms includes: A horizontal driving member connected to the suction cup seat; A vertical driving member connected to the horizontal driving member and driven by the horizontal driving member to move in a horizontal direction to approach or move away from the suction cup; A pressure plate portion is connected to the vertical driving member and moves vertically under the drive of the vertical driving member to approach or move away from the suction cup; the pressure plate portion includes an adapter plate and a pressure strip, the adapter plate is connected to the vertical driving member, and the pressure strip is connected to a side of the adapter plate facing the horizontal driving member; and, The enclosure portion is connected to the adapter plate and is located on a side of the pressure strip away from the suction cup; the enclosure portion includes a first rib and a second rib, the first rib is connected to the side of the adapter plate facing the horizontal driving member, and the vertical dimension of the first rib is larger than the vertical dimension of the pressure strip; the second rib is a flexible structure, connected to the free end of the first rib, and protrudes from the free end of the adapter plate; one end of the second rib facing the horizontal driving member is aligned with one end of the first rib facing the horizontal driving member; the enclosure portions of all the edge pressing mechanisms can be spliced ​​to form an annular structure; The workpiece stage assembly is configured to keep the suction cup and the pressure plate portion relatively still when the horizontal driving member and the vertical driving member are maintaining a state.

2. The workpiece stage assembly according to claim 1, characterized in that: The workpiece platform body also includes a posture adjustment mechanism, and the suction cup seat is connected to the posture adjustment mechanism.

3. The workpiece stage assembly according to claim 1, characterized in that: The horizontal driving member comprises a first fixed portion and a first movable portion connected to each other, wherein the first fixed portion is connected to the suction cup seat and remains relatively still with the suction cup seat; The vertical driving member comprises a second fixed portion and a second movable portion connected to each other; the second fixed portion is connected to the first movable portion; The pressing plate portion is disposed on the second movable portion.

4. The workpiece stage assembly according to claim 1, characterized in that: At least one of the edge clamping mechanisms comprises a plurality of the horizontal driving members, and the plurality of the horizontal driving members of the same edge clamping mechanism are configured to run synchronously or stop running synchronously.

5. The workpiece stage assembly according to claim 1, characterized in that: At least one of the edge clamping mechanisms comprises a plurality of the vertical driving members, and the plurality of the vertical driving members of the same edge clamping mechanism are configured to operate synchronously or stop operating synchronously.

6. The workpiece stage assembly according to claim 1, characterized in that: At least one of the pressing plate parts includes a plurality of sub-pressing plate parts arranged at intervals along its own extending direction, and each of the sub-pressing plate parts is connected to at least one of the vertical driving members.

7. The workpiece stage assembly according to claim 1, characterized in that: The suction cup is used to absorb a substrate, and the substrate has a plurality of edge regions; The sum of the number of the pressing plate parts of all the edge pressing mechanisms is the same as the number of the edge regions, and each of the pressing plate parts is arranged corresponding to one of the edge regions.

8. The workpiece stage assembly according to claim 7, characterized in that: Each of the edge pressing mechanisms includes a pressing plate portion; or, At least one of the edge pressing mechanisms includes two pressing plate portions connected at an angle.

9. The workpiece stage assembly according to claim 1, characterized in that: The edge pressing mechanism further comprises a force detection element, which is arranged on the pressing plate portion and is configured to detect the vertical pressure exerted on the pressing plate portion.

10. A semiconductor production equipment, characterized in that: The utility model comprises a workpiece table assembly as claimed in any one of claims 1 to 9.

11. A semiconductor production method, performed based on the semiconductor production equipment according to claim 10, characterized in that: The semiconductor production method comprises: Allowing the suction cup to absorb the substrate; Detect the state of the substrate. If the state of the substrate meets the preset application conditions, perform the preset operation. If the state of the substrate does not meet the preset application conditions, first control the horizontal driving member and the vertical driving member of at least one of the edge pressing mechanisms to operate so that the corresponding pressing plate portion is pressed against the corresponding edge area of ​​the substrate and the substrate is shaped until the state of the substrate meets the preset application conditions. Then, perform the preset operation while keeping the corresponding pressing plate portion pressed against the corresponding edge area of ​​the substrate.

12. The semiconductor production method according to claim 11, characterized in that: The substrate is provided with a first alignment point, and the workpiece stage body is provided with a second alignment point; After the edge pressing mechanism shapes the substrate and before performing the preset operation, the semiconductor production method further includes: Detect whether the first alignment point is aligned with the second alignment point. If so, execute the preset operation. If not, adjust the position of the suction cup while keeping the corresponding pressure plate portion pressed against the corresponding edge area of ​​the substrate to align the first alignment point with the second alignment point.

13. The semiconductor production method according to claim 11, characterized in that: The step of controlling the horizontal driving member and the vertical driving member of at least one of the edge pressing mechanisms to operate so that the corresponding pressing plate portion is pressed against the edge of the substrate comprises: Controlling the corresponding vertical driving member of the edge pressing mechanism to operate, and driving the pressing plate portion to move vertically to a position higher than the base plate; Controlling the corresponding horizontal driving member of the edge pressing mechanism to operate, and driving the vertical driving member to move in the horizontal direction to approach the substrate; The vertical driving member of the corresponding edge pressing mechanism is controlled to operate, and the pressing plate portion is driven to move vertically until it is pressed against the substrate.

14. The semiconductor production method according to claim 13, characterized in that: In the process of controlling the vertical driving member of the corresponding edge pressing mechanism to operate and driving the pressing plate portion to move vertically until it is pressed against the substrate, the vertical driving member is controlled according to the vertical pressure exerted on the pressing plate portion.

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