A package shell, a package shell housing, a package structure, and a package method.

By designing a receiving groove and a light-blocking plate in the encapsulation shell, and using the same injection mold mandrel to form the vent hole, the problems of lens contamination and low processing efficiency are solved, achieving effective lens protection and efficient processing of the encapsulation shell.

CN119542257BActive Publication Date: 2025-10-31SHUNYUN TECH (ZHONG SHAN) LTD
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Patent Information

Application Number
CN202411559114.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-11-04
Publication Date
2025-10-31
Estimated Expiration
2044-11-04

AI Technical Summary

Technical Problem

In existing packaging structures, lenses are easily contaminated, and the venting grooves located at the light-transmitting holes are not convenient for mass production.

Method used

Design a package shell including a receiving groove and a light-blocking plate. The vent is formed by the same injection mold mandrel and is not located at the light-transmitting hole. There is a space between the light-blocking plate and the substrate for adhesive bonding. The lens mounting hole and the vent are set separately.

Benefits of technology

This avoids lens contamination, improves the processing efficiency and connection strength of the packaging shell, and achieves effective protection for the lens.

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Abstract

This invention relates to the field of optical sensor technology, and in particular to a package shell, a package shell housing, a package structure, and a package method. The package shell has a receiving groove, the groove opening of which is used to connect to a substrate. A light-blocking plate is located in the middle of the receiving groove, dividing the receiving groove into a first receiving groove for accommodating a light-projecting chip and a second receiving groove for accommodating a light-receiving chip. A first vent hole is provided on the groove wall of the first receiving groove on the side opposite to the light-blocking plate, and a second vent hole is provided on the groove wall of the second receiving groove on the side opposite to the light-blocking plate. Both the first and second vent holes are formed by the same injection mold mandrel. A first space is provided between the light-blocking plate and the substrate for the injection mold mandrel to pass through. The first space is also used to provide an adhesive to bond the light-blocking plate to the substrate, thus avoiding contamination of the lens and facilitating mass production of the package shell.
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Description

Technical Field

[0001] This invention relates to the field of optical sensor technology, and in particular to a packaging shell, a packaging shell matrix, a packaging structure, and a packaging method. Background Technology

[0002] Optical sensors, such as ambient light sensors, spectral light sensors, proximity sensors, and time-of-flight sensors, are widely used in consumer electronics, industrial automation, automotive electronics, and medical electronics. Optical sensors mainly consist of working components such as a light-emitting chip and a light-receiving chip mounted on a substrate, as well as a package attached to the substrate to encapsulate these components. The package has two receiving slots. When the package is attached to the substrate, the substrate closes the openings of the two receiving slots, creating two cavities between the substrate and the package. The light-emitting chip and the light-receiving chip are located in one of these cavities. Each cavity has a light-transmitting hole on its opposite side from the substrate, and a lens is installed in each of these holes. If the two cavities are completely sealed, the heat generated by the light-emitting and light-receiving chips during operation will cause the gas inside the cavities to expand, leading to cracking of the package structure. Therefore, the package structure needs to include a venting structure to connect the two cavities to the outside environment.

[0003] Existing encapsulation structures often incorporate venting grooves on one side of the light-transmitting hole. This is because placing the venting groove on one side of the light-transmitting hole facilitates its fabrication. Specifically, the encapsulation shell is mostly injection molded. During injection molding, a mandrel for forming the light-transmitting hole needs to be incorporated into the mold. A rib parallel to the mandrel is then machined on the outside of the mandrel to form the venting groove. However, placing the venting groove at the light-transmitting hole can easily lead to contamination of the lens installed within it, making it impossible to maintain the lens's cleanliness for an extended period. Summary of the Invention

[0004] The technical problem to be solved by the present invention is: In order to solve the above-mentioned technical problem, the purpose of the present invention is to provide a package shell, the package shell having a receiving groove, the groove opening end of the receiving groove being used to connect to a substrate, the middle part of the receiving groove having a light-blocking plate, the light-blocking plate dividing the receiving groove into a first receiving groove and a second receiving groove, the first receiving groove and the second receiving groove being used to accommodate a light-emitting chip and a light-receiving chip connected to the substrate, respectively.

[0005] The first receiving groove has a first vent hole on the side of its wall opposite to the light-blocking plate, and the second receiving groove has a second vent hole on the side of its wall opposite to the light-blocking plate. The encapsulation shell is formed by injection molding. The first vent hole and the second vent hole are both formed by the same injection mold mandrel, and the first vent hole and the second vent hole are arranged close to the substrate. There is a first space between the end of the light-blocking plate close to the substrate and the substrate. The first space is used for the injection mold mandrel to pass through. The first space is also used to provide adhesive so that the light-blocking plate is bonded to the substrate.

[0006] As a preferred embodiment, the diameters of the first vent and the second vent are arranged coaxially.

[0007] As a preferred embodiment, the first vent and the second vent have the same diameter.

[0008] As a preferred embodiment, the first space includes a clearance groove disposed at one end of the light-blocking plate near the substrate, the clearance groove being used for the injection mold mandrel to pass through;

[0009] The distance between the central axis of the first vent and the second vent and the substrate is defined as the first distance. The sum of the radius of the first vent and the first distance, and the sum of the radius of the second vent and the first distance are both less than the distance between the bottom wall of the clearance groove and the substrate.

[0010] As a preferred embodiment, the diameters of both the first vent and the second vent are greater than or equal to 0.1 mm and less than or equal to 0.2 mm.

[0011] As a preferred embodiment, the bottom of the first receiving groove has a first lens mounting hole opposite to the light-projecting chip; the bottom of the second receiving groove has a second lens mounting hole opposite to the light-receiving chip.

[0012] A packaging shell mother body includes multiple packaging shells as described above. Each packaging shell is connected sequentially along the direction from a first vent hole to a second vent hole via a connecting section. The first vent hole and the second vent hole of each packaging shell are formed using the same injection mold mandrel.

[0013] An encapsulation structure includes the aforementioned encapsulation shell, and further includes a substrate connected to the slot end of the encapsulation shell, a light-emitting chip and a light-receiving chip fixed on the substrate; an adhesive layer is provided in a first space between the light-blocking plate and the substrate.

[0014] An encapsulation method includes the following steps:

[0015] Multiple sets of optical units are connected at intervals along a first direction on a substrate mother plate, and each optical unit includes a light-emitting chip and a light-receiving chip arranged at intervals along the first direction.

[0016] Lenses are installed at the first lens mounting holes and the second lens mounting holes of the encapsulation shell to form the encapsulation shell.

[0017] Adhesive is filled into each first space of the encapsulation shell mother body to connect the encapsulation shell mother body to the substrate mother plate, and each light-emitting chip and each light-receiving chip enter each first receiving groove and each second receiving groove of the encapsulation shell mother body respectively to form the encapsulation shell mother body;

[0018] The main body of the package is divided into multiple packages along the connecting segments of each package shell.

[0019] As a preferred embodiment, before installing the lens at each of the first lens mounting holes and the second lens mounting holes of the encapsulation housing, the following is further included:

[0020] The packaging shell body is formed by injection molding. The injection molding mold includes a mold body and a mandrel. The mandrel passes from one side of the mold body to the other side of the mold body to form each first vent hole and second vent hole.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0022] The encapsulation shell of the present invention has a receiving groove, the groove opening of which is used to connect to a substrate. A light-blocking plate is located in the middle of the receiving groove, dividing the receiving groove into a first receiving groove and a second receiving groove. The first receiving groove and the second receiving groove are respectively used to accommodate a light-emitting chip and a light-receiving chip connected to the substrate. A first vent hole is provided on the groove wall of the first receiving groove opposite to the light-blocking plate, and a second vent hole is provided on the groove wall of the second receiving groove opposite to the light-blocking plate. The encapsulation shell is injection molded, and both the first vent hole and the second vent hole are formed by the same injection mold mandrel. A first space is provided between the end of the light-blocking plate near the substrate and the substrate, the first space being used for the injection mold mandrel to pass through. The first space is also used to provide an adhesive to bond the light-blocking plate to the substrate. The first vent hole and the second vent hole are not located at the light-transmitting hole, avoiding contamination of the lens. Moreover, the first vent hole and the second vent hole can be formed by the same injection mold mandrel, facilitating mass production of the encapsulation shell. Attached Figure Description

[0023] Figure 1 This is a first isometric view of the packaging shell of the present invention;

[0024] Figure 2 This is a second isometric view of the packaging shell of the present invention;

[0025] Figure 3This is a top view of the packaging shell of the present invention;

[0026] Figure 4 for Figure 3 Cross-sectional view along the AA direction;

[0027] Figure 5 This is a schematic diagram of the packaging shell of the present invention;

[0028] Figure 6 This is a schematic diagram of the injection mold used to mold the packaging shell.

[0029] Figure 7 This is a schematic diagram of the packaging structure of the present invention;

[0030] Figure 8 This is a schematic diagram of the structure for mounting the lens onto the packaging housing.

[0031] Figure 9 A schematic diagram of crystal deposition and wire bonding on a substrate motherboard;

[0032] Figure 10 This is a schematic diagram of the structure of the package mother body;

[0033] Figure 11 This is a schematic diagram of a structure where the parent package is styled as multiple packages;

[0034] In the figure, 1. Encapsulation shell, 11. Light blocking plate, 111. Clearance groove, 12. First receiving groove, 13. Second receiving groove, 14. First vent hole, 15. Second vent hole, 16. First lens mounting hole, 17. Second lens mounting hole, 2. Substrate, 21. Mounting base, 3. Light projection chip, 4. Light receiving chip, 5. Connecting section, 61. Injection mold mandrel, 62. Upper mold, 63. Lower mold, 7. Adhesive layer, 8. Lens. Detailed Implementation

[0035] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0036] In the description of this invention, it should be understood that the terms "upper," "lower," "left," "right," "top," "bottom," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be understood that the terms "first," "second," etc., are used in this invention to describe various information, but this information should not be limited to these terms; these terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this invention, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information.

[0037] like Figures 1 to 4 As shown, in a preferred embodiment of the encapsulation shell of the present invention, the encapsulation shell 1 has a receiving groove, the groove opening of which is used to connect to the substrate 2. A light-blocking plate 11 is provided in the middle of the receiving groove, and the light-blocking plate 11 divides the receiving groove into a first receiving groove 12 and a second receiving groove 13. The first receiving groove 12 and the second receiving groove 13 are respectively used to accommodate the light-emitting chip 3 and the light-receiving chip 4 connected to the substrate 2. A first vent hole 14 is provided on the groove wall of the first receiving groove 12 opposite to the light-blocking plate 11, and a second vent hole 15 is provided on the groove wall of the second receiving groove 13 opposite to the light-blocking plate 11. The encapsulation shell 1 is formed by injection molding. The first vent hole 14 and the second vent hole 15 are both formed by the same injection molding mandrel 61, and the first vent hole 14 and the second vent hole 15 are both arranged close to the substrate 2. A first space is provided between the end of the light-blocking plate 11 close to the substrate 2 and the substrate 2. The first space is used for the injection molding mandrel 61 to pass through. The first space is also used to provide an adhesive so that the light-blocking plate 11 is bonded to the substrate 2.

[0038] Specifically, when injection molding the encapsulation shell 1, the first space allows the injection mold mandrel 61 to pass through, thereby enabling the injection mold mandrel 61 to simultaneously form the first vent hole 14 and the second vent hole 15. When encapsulating the encapsulation shell 1 on the substrate 2, an adhesive is applied to the first space. The adhesive can seal the first space, thereby preventing light in the first receiving groove 12 from entering the second receiving groove 13. Moreover, the adhesive also improves the connection strength between the encapsulation shell 1 and the substrate 2.

[0039] In this embodiment, to facilitate the smooth removal of the injection mold mandrel 61 from the molded packaging shell 1, the diameters of the first vent hole 14 and the second vent hole 15 are arranged coaxially. Furthermore, the diameters of the first vent hole 14 and the second vent hole 15 are the same.

[0040] In this embodiment, the first space includes a clearance groove 111 disposed at one end of the light-blocking plate 11 near the substrate 2. The clearance groove 111 is used for the injection molding mandrel 61 to pass through. The distance between the central axis of the first vent hole 14 and the second vent hole 15 and the substrate 2 is defined as the first distance. The sum of the radius of the first vent hole 14 and the first distance, and the sum of the radius of the second vent hole 15 and the first distance are both less than the distance between the bottom wall of the clearance groove 111 and the substrate 2. A clearance groove 111 with an opening facing the substrate 2 is provided at the end of the light-blocking plate 11. The clearance groove 111 is opposite to the first vent hole 14 and the second vent hole 15. When applying adhesive, the adhesive can enter the clearance groove 111 to seal the clearance groove 111.

[0041] Specifically, the diameters of the first vent 14 and the second vent 15 are relatively small. Generally, setting the diameter of the first vent 14 and the second vent 15 to 0.1 mm is sufficient to meet the ventilation requirements. In this embodiment, the diameters of the first vent 14 and the second vent 15 are both greater than or equal to 0.1 mm and less than or equal to 0.2 mm. The distance between the bottom wall of the clearance groove 111 and the substrate 2 is 0.3 mm to 0.5 mm. The gap between the light-blocking plate 11 and the substrate 2 allows the injection molding mandrel 61 to pass through smoothly, ensuring both ventilation and the application requirements of the adhesive.

[0042] In other embodiments of the present invention, the light-blocking plate 11 and the substrate 2 can be arranged at intervals to form a first space. The sum of the radius of the first vent 14 and the first distance and the sum of the radius of the second vent 15 and the first distance are both smaller than the distance between the end of the light-blocking plate 11 and the substrate 2.

[0043] In this embodiment, the bottom of the first receiving groove 12 has a first lens mounting hole 16 opposite to the light-projecting chip 3, and the bottom of the second receiving groove 13 has a second lens mounting hole 17 opposite to the light-receiving chip 4.

[0044] One embodiment of the encapsulation housing, such as Figure 5 As shown, the device includes multiple encapsulation shells 1 as described above. Each encapsulation shell 1 is sequentially connected via a connecting section 5 along the direction from the first vent 14 to the second vent 15. The first vent 14 and the second vent 15 of each encapsulation shell 1 are formed using the same injection mold mandrel 61. The mold structure used to form the encapsulation shell mother body is as follows... Figure 6As shown, the system includes an upper mold 62, a lower mold 63, and an injection mold mandrel 61. The upper mold 62 and lower mold 63 are joined to form a mold cavity, and the injection mold mandrel 61 passes through the upper mold 62. Specifically, the packaging shell mother body can be strip-shaped or plate-shaped. When the packaging shell mother body is set as a strip, a row of packaging shells 1 is arranged along the length direction of the packaging shell mother body; when the packaging shell mother body is set as a plate, multiple rows and columns of packaging shells 1 are arranged in a rectangular pattern on the packaging shell mother body. By cutting the packaging shell mother body, multiple packaging shells 1 can be obtained, improving the processing efficiency of the packaging shells 1.

[0045] An embodiment of a packaging structure, such as Figure 7 As shown, the package includes the aforementioned encapsulation shell 1, a substrate 2 connected to the slot end of the encapsulation shell 1, a light-emitting chip 3 fixed on the substrate 2, and a light-receiving chip 4; an adhesive is provided in the first space between the light-blocking plate 11 and the substrate 2. Specifically, the light-emitting chip 3 can be directly connected to the substrate 2, and a mounting base 21 can be provided on the substrate 2, with the light-emitting chip 3 connected to the mounting base 21. In this embodiment, the substrate 2 is provided with a mounting base 21, the light-emitting chip 3 is connected to the mounting base 21, the mounting base 21 passes through the first space, and the end of the light-blocking plate 11 facing the substrate 2 is bonded to the mounting base 21.

[0046] An embodiment of a packaging method, such as Figures 8 to 11 As shown, it includes the following steps:

[0047] Multiple optical units are connected at intervals along a first direction on the substrate 2. Each optical unit includes a light-emitting chip 3 and a light-receiving chip 4 arranged at intervals along the first direction.

[0048] Lenses 8 are installed at each of the first lens mounting holes 16 and the second lens mounting holes 17 of the encapsulation shell to form the encapsulation shell.

[0049] Adhesive is filled into each first space of the encapsulation shell mother body to connect the encapsulation shell mother body to the substrate 2, and each light-emitting chip 3 and each light-receiving chip 4 are respectively inserted into each first receiving groove 12 and each second receiving groove 13 of the encapsulation shell mother body to form the encapsulation shell mother body.

[0050] The main body of the package is divided into multiple packages along the connecting segments 5 of each package body.

[0051] Before mounting the lens 8 at each of the first lens mounting holes 16 and the second lens mounting holes 17 on the encapsulation housing, the following is also included:

[0052] The packaging shell is formed by injection molding. The injection mold includes a mold body and a mandrel. The mandrel passes from one side of the mold body to the other side of the mold body to form the first vent hole 14 and the second vent hole 15.

[0053] The plurality of optical units spaced apart along the first direction on the substrate 2 include:

[0054] The light-emitting chip 3 and the light-receiving chip 4 are connected to the substrate 2 by crystallization.

[0055] Wire bonding is performed on the substrate 2 and the pads of the light-emitting chip 3 to make the light-emitting chip and the light-receiving chip conductive with the substrate 2.

[0056] In summary, the encapsulation shell 1 of the present invention has a receiving groove, the groove opening of which is used to connect to the substrate 2. A light-blocking plate 11 is provided in the middle of the receiving groove, dividing the receiving groove into a first receiving groove 12 and a second receiving groove 13. The first receiving groove 12 and the second receiving groove 13 are respectively used to accommodate the light-emitting chip 3 and the light-receiving chip 4 connected to the substrate 2. A first vent hole 14 is provided on the groove wall of the first receiving groove 12 opposite to the light-blocking plate 11, and a second vent hole 15 is provided on the groove wall of the second receiving groove 13 opposite to the light-blocking plate 11. The encapsulation shell 1 is composed of... It is injection molded, and the first vent 14 and the second vent 15 are both formed by the same injection mold mandrel 61; the light-blocking plate 11 has a first space between the end near the substrate 2 and the substrate 2, and the first space is used for the injection mold mandrel 61 to pass through; the first space is also used to place adhesive so that the light-blocking plate 11 is bonded to the substrate 2; the first vent 14 and the second vent 15 are not located at the light-transmitting hole to avoid contamination of the lens 8; moreover, the first vent 14 and the second vent 15 can be formed by the same injection mold mandrel 61, which is convenient for mass production of the packaging shell 1.

[0057] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A packaging shell, characterized in that, Includes a package shell (1), the package shell (1) has a receiving groove, the groove opening end of the receiving groove is used to connect to the substrate (2), the middle part of the receiving groove has a light blocking plate (11), the light blocking plate (11) divides the receiving groove into a first receiving groove (12) and a second receiving groove (13), the first receiving groove (12) and the second receiving groove (13) are respectively used to accommodate the light-emitting chip (3) and the light-receiving chip (4) connected to the substrate (2); The first receiving groove (12) has a first vent hole (14) on the side of the groove wall opposite to the light blocking plate (11), and the second receiving groove (13) has a second vent hole (15) on the side of the groove wall opposite to the light blocking plate (11). The encapsulation shell (1) is formed by injection molding. The first vent (14) and the second vent (15) are both formed by the same injection mold mandrel (61). The first vent (14) and the second vent (15) are both arranged close to the substrate (2). There is a first space between the light-blocking plate (11) and the substrate (2). The first space is used for the injection mold mandrel (61) to pass through. The first space is also used to provide adhesive so that the light-blocking plate (11) is bonded to the substrate (2).

2. The packaging shell according to claim 1, characterized in that, The first vent (14) and the second vent (15) are arranged coaxially.

3. The packaging shell according to claim 1, characterized in that, The first vent (14) and the second vent (15) have the same diameter.

4. The packaging shell according to claim 1, characterized in that, The first space includes a clearance groove (111) disposed at one end of the light-blocking plate (11) near the substrate (2), the clearance groove (111) being for the injection mold mandrel (61) to pass through; The distance between the central axis of the first vent (14) and the second vent (15) and the substrate (2) is defined as the first distance. The sum of the radius of the first vent (14) and the first distance and the sum of the radius of the second vent (15) and the first distance are both less than the distance between the bottom wall of the clearance groove (111) and the substrate (2).

5. The packaging shell according to claim 4, characterized in that, The diameters of the first vent (14) and the second vent (15) are both greater than or equal to 0.1 mm and less than or equal to 0.2 mm.

6. The packaging shell according to claim 1, characterized in that, The bottom of the first receiving groove (12) has a first lens mounting hole (16) opposite to the light-emitting chip (3); the bottom of the second receiving groove (13) has a second lens mounting hole (17) opposite to the light-receiving chip (4).

7. A packaging shell mother body, characterized in that, The package includes multiple encapsulation shells (1) as described in any one of claims 1 to 6, each of the encapsulation shells (1) being connected sequentially along the direction from the first vent (14) to the second vent (15) via a connecting segment (5), and the first vent (14) and the second vent (15) of each of the encapsulation shells (1) are formed using the same injection mold mandrel (61).

8. A packaging structure, characterized in that, The package includes the encapsulation shell (1) as described in any one of claims 1 to 6, and further includes a substrate (2) connected to the slot end of the encapsulation shell (1), a light-emitting chip (3) and a light-receiving chip (4) fixed on the substrate (2); an adhesive layer (7) is provided in the first space between the light-blocking plate (11) and the substrate (2).

9. A packaging method based on the packaging shell of claim 1, characterized in that, Includes the following steps: Multiple optical units are connected at intervals along a first direction on the substrate mother plate. Each optical unit includes a light-emitting chip (3) and a light-receiving chip (4) arranged at intervals along the first direction. Lenses (8) are installed at the first lens mounting holes (16) and the second lens mounting holes (17) of the encapsulation shell mother body to form the encapsulation shell mother body; Adhesive is filled into each first space of the encapsulation shell mother body to connect the encapsulation shell mother body to the substrate mother plate, and each light-emitting chip (3) and each light-receiving chip (4) enter each first receiving groove (12) and each second receiving groove (13) of the encapsulation shell mother body to form the encapsulation shell mother body; The packaging body is divided into multiple packaging bodies along each connecting segment (5) of the packaging shell mother body.

10. The packaging method according to claim 9, characterized in that, Before mounting the lens (8) at each of the first lens mounting holes (16) and the second lens mounting holes (17) on the packaging shell, the following is also included: The packaging shell is formed by injection molding. The injection molding mold includes a mold body and a mandrel. The mandrel passes from one side of the mold body to the other side of the mold body to form each first vent hole (14) and second vent hole (15).

Citation Information

Patent Citations

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    CN207184653U

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    CN220895513U