High-thermal-conductivity graphite heat dissipation film for middle frame of mobile phone

Abstract

The utility model relates to the technical field of mobile phone heat dissipation films, in particular to a high-heat-conduction mobile phone middle frame graphite heat dissipation film which comprises a heat dissipation film body, the heat dissipation film body sequentially comprises matte black single-faced adhesive tape, a high-heat-conduction graphite layer and double-faced adhesive tape from top to bottom, the high-heat-conduction graphite layer is formed by stacking low-temperature carbonization layers and is 0.2 mm in thickness, and the high-heat-conduction graphite layer is formed by stacking low-temperature carbonization layers. The low-temperature carbonization layer is formed by graphene through low-temperature carbonization treatment, the heat conductivity coefficient reaches 2000-2100 W / M.K, energy consumption is reduced through low-temperature treatment, the production cost is indirectly reduced due to the low temperature requirement, the graphene is subjected to low-temperature carbonization treatment, the lattice defect density is reduced, and the stability of the heat conductivity coefficient is ensured; and meanwhile, the 0.2 mm high-thermal-conductivity graphite layer is formed by stacking the low-temperature carbonization layers, so that the occupied space of the heat dissipation film body in the middle frame is reduced.

Description

Technical Field

[0001] This application relates to the field of mobile phone heat dissipation film technology, and in particular to a high thermal conductivity mobile phone mid-frame graphite heat dissipation film. Background Technology

[0002] With the rapid development of smartphone technology, its performance has continuously improved, processing speed has increased, and functions have become increasingly rich. This has also led to a significant increase in the heat generated during operation. Excessive temperature not only affects the phone's performance, such as causing processor throttling and lag, but may also shorten the phone's lifespan. Therefore, efficient heat dissipation technology has become a key aspect of smartphone design.

[0003] In related technologies, traditional graphite films need to be processed through high-temperature graphitization to form a layered hexagonal lattice structure of carbon atoms. Then, the graphite is laminated to a single layer thickness of 0.03-0.05mm through mechanical rolling. Finally, the total thickness of 0.3-0.5mm is achieved through stacking to meet the heat dissipation requirements of high-density chips in flagship phones.

[0004] However, this method has the following drawbacks: traditional graphite films need to be graphitized at high temperatures, usually at 2000-3000℃, which consumes a lot of energy and increases production costs. In addition, the current trend of mobile phone frames is towards thinner and lighter designs. When the thickness is compressed to less than 0.3mm, the effective heat conduction area decreases and the density of lattice defects increases, resulting in a decrease in thermal conductivity. If the thickness of the heat dissipation film is more than 0.3mm, it will occupy the space of the mobile phone frame. Utility Model Content

[0005] To address the aforementioned issues, this application provides a high thermal conductivity graphite heat dissipation film for a mobile phone mid-frame.

[0006] The high thermal conductivity graphite heat dissipation film for a mobile phone mid-frame provided in this application adopts the following technical solution:

[0007] A high thermal conductivity graphite heat dissipation film for a mobile phone frame includes a heat dissipation film body, the heat dissipation film body includes a high thermal conductivity graphite layer, the high thermal conductivity graphite layer is formed by stacking low temperature carbonization layers, the low temperature carbonization layers are formed by graphene through low temperature treatment, and the thickness of the high thermal conductivity graphite layer is 0.2 mm.

[0008] By adopting the above technical solution, graphene is carbonized at low temperatures, typically between 800-1000℃, which reduces energy consumption. Furthermore, the lower temperature requirement indirectly reduces production costs. Low-temperature carbonization can reduce the density of lattice defects in graphene, thereby increasing its thermal conductivity. At the same time, the thickness of the high thermal conductivity graphite layer formed by stacking low-temperature carbonized layers is only 0.2mm, which is in line with the current trend of thinner and lighter mobile phone shells and reduces the space occupied by the heat dissipation film in the mobile phone frame.

[0009] Preferably, the heat dissipation film body includes an adhesive layer, the adhesive layer includes a first adhesive layer and a second adhesive layer, the first adhesive layer is disposed on the upper side of the high thermal conductivity graphite layer, the first adhesive layer is matte black single-sided adhesive, and the thickness of the matte black single-sided adhesive is 10μm.

[0010] By adopting the above technical solution, the matte black single-sided adhesive is used to attach the high thermal conductivity graphite layer to the mobile phone frame. The matte black single-sided adhesive reduces the light transmittance by carbon black doping, thereby reducing light transmission and protecting the internal electronic components. At the same time, the 10μm adhesive thickness reduces the volume of the heat dissipation film body and lowers the thermal resistance.

[0011] Preferably, the second adhesive layer is disposed on the lower side of the high thermal conductivity graphite layer, and the second adhesive layer is a double-sided adhesive with a thickness of 10 μm.

[0012] By adopting the above technical solution, the 10μm ultra-thin double-sided adhesive can ensure the double-sided fixation of the high thermal conductivity graphite layer and the heating element, ensuring the bonding strength. At the same time, the 10μm ultra-thin double-sided adhesive further compresses the total thickness of the heat dissipation film body, adapting to the trend of thinner and lighter mobile phone shells.

[0013] Preferably, the density of the high thermal conductivity graphite layer is 1.85–2.2 g / cm³. 3 .

[0014] By adopting the above technical solution, the density is lower than 1.85 g / cm³. 3 When the filler is unevenly dispersed and the heat conduction path is discontinuous, the concentration exceeds 2.2 g / cm³. 3 This reduces the flexibility of the heat dissipation film itself. This range balances lightweight and mechanical strength, and can adapt to the bending requirements of curved frames.

[0015] Preferably, the thermal conductivity of the high thermal conductivity graphite layer is between 2000 W / Mk and 2100 W / Mk.

[0016] By adopting the above technical solution, the thermal conductivity of traditional graphite film is 500-1500W / M·K, and the thermal conductivity is between 2000W / Mk-2100W / Mk. The high thermal conductivity can reduce the peak temperature of electronic components inside the mobile phone, reducing the probability of performance throttling due to insufficient heat dissipation.

[0017] Preferably, the heat dissipation film body has an irregular shape, and a clearance space is provided on the upper side of the heat dissipation film body.

[0018] By adopting the above technical solution, the irregular structure can match the spatial layout of components such as cameras and batteries inside the mobile phone frame, reduce mechanical interference, and make room to allow the heat dissipation film to maximize coverage of the heat-generating area within a limited space.

[0019] Preferably, the clearance space is a continuous stepped shape.

[0020] By adopting the above technical solution, the stepped clearance space can better adapt to different component shapes and positions, ensuring the avoidance of critical components and reducing the impact on other electronic components during the installation of the heat dissipation film body.

[0021] Preferably, the heat dissipation film body has a chamfered edge structure.

[0022] By adopting the above technical solution, the chamfered structure is used to adapt to the curved transition of the mobile phone frame.

[0023] In summary, this application includes at least one of the following beneficial technical effects:

[0024] 1. By carbonizing graphene at a low temperature of 800-1000℃ to form stacked layers, a high thermal conductivity graphite layer with a thickness of only 0.2mm is prepared, which reduces energy consumption and production costs, meets the demand for thinner and lighter mobile phone frames and reduces space occupation. At the same time, low temperature carbonization can reduce the lattice defect density of graphene and increase the thermal conductivity.

[0025] 2. The high thermal conductivity graphite layer formed by low-temperature carbonization and graphene stacking has a thermal conductivity of 2000-2100W / M·K, which is significantly improved compared to the thermal conductivity of traditional graphite film of 500-1500W / M·K. This can effectively reduce the peak temperature of electronic components, reduce the risk of performance throttling due to insufficient heat dissipation, and adapt to the requirements of thin and light mobile phone design.

[0026] 3. By controlling the density of the high thermal conductivity graphite layer to 1.85–2.2 g / cm³ 3 Within this range, it reduces both the problem of discontinuous heat conduction paths caused by uneven filler dispersion and the decrease in flexibility caused by excessive density, thus achieving a balance between lightweight and mechanical strength, and adapting to the bending requirements of curved mobile phone frames. Attached Figure Description

[0027] Figure 1 This is a structural schematic diagram of an embodiment of this application.

[0028] Figure 2 This is a cross-sectional structural diagram of an embodiment of this application.

[0029] Explanation of reference numerals in the attached drawings: 1. Heat dissipation film body; 11. High thermal conductivity graphite layer; 12. Adhesive layer; 121. First adhesive layer; 122. Second adhesive layer; 2. Clearance space; 3. Chamfered structure. Detailed Implementation

[0030] The following is in conjunction with the appendix Figure 1-2 This application will be described in further detail.

[0031] This application discloses a high thermal conductivity graphite heat dissipation film for a mobile phone mid-frame. (Refer to...) Figure 1 A high thermal conductivity graphite heat dissipation film for a mobile phone frame includes a heat dissipation film body 1. The heat dissipation film body 1 has an irregular shape and a clearance space 2 on its upper side. The clearance space 2 is a continuous stepped shape. The irregular shape can match the spatial layout of components such as cameras and batteries inside the mobile phone frame, reducing mechanical interference. The stepped clearance space 2 allows the heat dissipation film body 1 to maximize the coverage of the heat-generating area within a limited space, which can better adapt to different component shapes and positions, ensuring the avoidance of key components and reducing the impact of the heat dissipation film body 1 on other electronic components during installation. At the same time, the heat dissipation film body 1 has a chamfered structure 3 on its edge, which is used to adapt to the curved transition of the mobile phone frame.

[0032] Reference Figure 2 On the other hand, the heat dissipation film body 1 includes a high thermal conductivity graphite layer 11, which is formed by stacking low temperature carbonization layers. The low temperature carbonization layers are formed by graphene through low temperature treatment, and the thickness of the high thermal conductivity graphite layer 11 is 0.2 mm.

[0033] Specifically, the low-temperature carbonization layer is formed by carbonizing graphene at 850°C for 3 hours in a nitrogen atmosphere to create a partially graphitized carbon-oxygen free base layer. Multiple layers of low-temperature carbonization are then stacked and mechanically rolled to form a 0.2 mm thick high thermal conductivity graphite layer 11. The density of the high thermal conductivity graphite layer 11 is 1.85–2.2 g / cm³. 3 .

[0034] This demonstrates that low-temperature carbonization of graphene, typically carried out at temperatures between 800-1000℃, reduces energy consumption and indirectly lowers production costs due to the lower temperature requirements. Furthermore, low-temperature carbonization reduces the density of lattice defects in graphene, increasing its thermal conductivity. Meanwhile, the high thermal conductivity graphite layer 11, formed by stacking low-temperature carbonized layers, is only 0.2mm thick, which aligns with the current trend of thinner and lighter mobile phone casings and reduces the space occupied by the heat dissipation film body 1 within the mobile phone frame.

[0035] Further explanation is provided by relevant data, which indicates that the density of the high thermal conductivity graphite layer 11 is less than 1.85 g / cm³. 3 When the filler is unevenly dispersed and the heat conduction path is discontinuous, the concentration exceeds 2.2 g / cm³. 3 This reduces the flexibility of the high thermal conductivity graphite layer 11, with a density ranging from 1.85 to 2.2 g / cm³. 3 It balances lightweight design with mechanical strength and can adapt to the bending requirements of curved frames.

[0036] Furthermore, in this embodiment, the high thermal conductivity graphite layer 11 formed by stacking low-temperature carbonized layers is tested for thermal diffusivity and thermal conductivity using a NETZSCHLFA467 laser flash analyzer. Thermal diffusivity is a physical quantity that reflects the rate of temperature homogenization in the high thermal conductivity graphite layer 11, while thermal conductivity reflects the thermal conductivity of the high thermal conductivity graphite layer 11.

[0037] Further explanation of the testing instrument: The core components of the NETZSCHLFA467 laser flash analyzer include an InSb detector, an LFA467 HyperFlash short-pulse laser as the heating source, a planar circular support with a diameter of 25mm and a spot diameter of 20mm, and an E-type thermocouple for temperature measurement. The test parameters are shown in the table below:

[0038] Thermal diffusivity - NETZSCH LFA analysis

[0039]

[0040] Correspondingly, the test conditions for the high thermal conductivity graphite layer 11 include a thickness of 0.270 mm, a temperature range of 25.4–25.8 °C, a voltage of 260.0 V, and a pulse width of 0.05 ms.

[0041] Furthermore, the test results included three groups. The first group, at a temperature of 25.8℃, showed a thermal diffusivity of 1159.814 mm. 2 / s, with a thermal conductivity of 2050.55 W / M·K; and at the second group's temperature of 25.6℃, the thermal diffusivity is 1181.399 mm. 2 / s, with a thermal conductivity of 2088.714 W / M·K; and at the third group's temperature of 25.4℃, the thermal diffusivity is 1139.277 mm. 2 / s, with a thermal conductivity of 2014.241 W / M·K.

[0042] Therefore, the average temperature is 25.6℃, and the average thermal diffusivity is 1160.163 mm. 2 The average thermal conductivity is 2051.169 W / m·K. The high thermal diffusivity and thermal conductivity indicate that the high thermal conductivity graphite film possesses excellent thermal conductivity, effectively transferring heat away from the phone's interior and reducing overheating. The average thermal diffusivity is 1160.163 mm². 2 The average thermal conductivity was 2051.169 W / M·K, and the standard deviation was 0.2, which is relatively small, indicating that the test results have good repeatability and the data are reliable.

[0043] On the other hand, the heat dissipation film body 1 also includes an adhesive layer 12, which includes a first adhesive layer 121 and a second adhesive layer 122. The first adhesive layer 121 is disposed on the upper side of the high thermal conductivity graphite layer 11, and a 10μm matte black single-sided adhesive is coated on the upper side. The matte black single-sided adhesive reduces the light transmittance by carbon black doping, thereby reducing light transmission and protecting the internal electronic components. At the same time, the 10μm adhesive thickness reduces the increase in the volume of the heat dissipation film body 1 and reduces the thermal resistance.

[0044] Furthermore, the second adhesive layer 122 is disposed on the lower side of the high thermal conductivity graphite layer 11, and a 10μm double-sided adhesive is coated on the lower side. The 10μm ultra-thin double-sided adhesive can ensure that the high thermal conductivity graphite layer 11 and the heat-generating element are fixed on both sides, ensuring the bonding strength. At the same time, the 10μm ultra-thin double-sided adhesive further compresses the total thickness of the heat dissipation film body 1, adapting to the current trend of gradually thinning mobile phone shells.

[0045] The implementation principle of the high thermal conductivity mobile phone mid-frame graphite heat dissipation film in this application embodiment is as follows:

[0046] This application provides a high thermal conductivity mobile phone frame graphite heat dissipation film, including a heat dissipation film body, which is composed of a high thermal conductivity graphite layer and an adhesive layer. The high thermal conductivity graphite layer is formed by stacking low-temperature carbonization layers, forming a thickness of 0.2 mm. The low-temperature carbonization layer is formed by graphene through low-temperature carbonization treatment.

[0047] Low-temperature carbonization is typically performed between 800-1000℃, reducing energy consumption and indirectly lowering production costs due to the lower temperature requirements. Furthermore, low-temperature carbonization reduces the lattice defect density of graphene, increasing its thermal conductivity. The high thermal conductivity graphite layer, formed by stacking low-temperature carbonized layers, is only 0.2mm thick, aligning with the current trend towards thinner and lighter phone casings and reducing the space occupied by the heat dissipation film within the phone's frame. The density of the high thermal conductivity graphite layer is controlled between 1.85 and 2.2 g / cm³. 3 Between these points, relevant data indicate that the density of the high thermal conductivity graphite layer is less than 1.85 g / cm³. 3 When the filler is unevenly dispersed and the heat conduction path is discontinuous, the concentration exceeds 2.2 g / cm³. 3 This reduces the flexibility of the high thermal conductivity graphite layer, with a density ranging from 1.85 to 2.2 g / cm³. 3 It balances lightweight design with mechanical strength and can adapt to the bending requirements of curved frames.

[0048] In this embodiment, the high thermal conductivity graphite layer, composed of stacked low-temperature carbonized layers, had its thermal diffusivity and thermal conductivity measured using a NETZSCHLFA467 laser flash analyzer. The test results showed that the high thermal conductivity graphite layer had an average thermal diffusivity of 1160.163 mm² at an average temperature of 25.6°C. 2 / s, with an average thermal conductivity as high as 2051.169W / M·K.

[0049] This indicates that the high thermal conductivity graphite film possesses excellent thermal conductivity, effectively transferring heat away from the inside of the phone and reducing overheating. Furthermore, the average thermal diffusivity is 1160.163 mm². 2 The average thermal conductivity was 2051.169 W / M·K, and the standard deviation was 0.2, which is relatively small, indicating that the test results have good repeatability and the data are reliable.

[0050] Meanwhile, the adhesive layer includes a first adhesive layer and a second adhesive layer. A 10μm thick matte black single-sided adhesive is provided on the upper side of the high thermal conductivity graphite layer as the first adhesive layer, which not only achieves a firm bond with the mobile phone frame, but also reduces the light transmittance through carbon black doping, playing a role in shielding and protecting the internal electronic components.

[0051] A 10μm ultrathin double-sided adhesive is placed on the underside of the high thermal conductivity graphite layer as a second adhesive layer to ensure stable double-sided bonding with the heating element. At the same time, the 10μm ultrathin double-sided adhesive adapts to the current trend of increasingly thinner and lighter mobile phone shells.

[0052] In addition, the heat dissipation film body adopts an irregular structure, with a continuous stepped clearance space on the upper side of the heat dissipation film body, which can accurately match the layout of internal components such as cameras and batteries, reducing installation interference. The edges of the heat dissipation film body are provided with a chamfer structure, which is used to adapt to the curved transition of the mobile phone frame.

[0053] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A high thermal conductivity graphite heat dissipation film for a mobile phone frame, characterized in that, The heat dissipation film body (1) includes a high thermal conductivity graphite layer (11), which is formed by stacking low temperature carbonized layers. The low temperature carbonized layers are formed by low temperature treatment of graphene, and the thickness of the high thermal conductivity graphite layer (11) is 0.2 mm.

2. The high-thermal-conductivity graphite heat-dissipation film for a mobile phone middle frame according to claim 1, characterized in that, The heat dissipation film body (1) includes an adhesive layer (12), which includes a first adhesive layer (121) and a second adhesive layer (122). The first adhesive layer (121) is disposed on the upper side of the high thermal conductivity graphite layer (11). The first adhesive layer (121) is a matte black single-sided adhesive with a thickness of 10 μm.

3. The high-thermal-conductivity graphite heat-dissipation film for a mobile phone middle frame according to claim 2, characterized in that, The second adhesive layer (122) is disposed on the lower side of the high thermal conductivity graphite layer (11), and the second adhesive layer (122) is a double-sided adhesive with a thickness of 10 μm.

4. The graphite heat dissipation film for a high-thermal-conductivity mobile phone middle frame according to claim 1, characterized in that, The density of the high thermal conductivity graphite layer (11) is 1.85 to 2.2 cm³. 5.The high-thermal-conductivity graphite heat-dissipation film for a mobile phone middle frame according to claim 1, characterized in that, The thermal conductivity of the high thermal conductivity graphite layer (11) is between 2000 W / Mk and 2100 W / Mk. 6.The high-thermal-conductivity graphite heat-dissipation film for a mobile phone middle frame according to claim 1, characterized in that, The heat dissipation film body (1) has an irregular shape, and a clearance space (2) is provided on the upper side of the heat dissipation film body (1).

7. The graphite heat dissipation film of claim 6, wherein, The yield space (2) is a continuous stepped shape. 8.The high-thermal-conductivity graphite heat-dissipation film for a mobile phone middle frame according to claim 6, characterized in that, The heat dissipation film body (1) has a chamfered structure (3) at its edge.

Images