Heat dissipation structure based on flexible substrate packaging and manufacturing method thereof

Abstract

The invention provides a heat dissipation structure based on flexible substrate packaging and a manufacturing method thereof, and relates to the technical field of electronic packaging, the heat dissipation structure comprises a first flexible substrate, the inner surface of the first flexible substrate is provided with a plurality of chip sets, a heat conduction layer and a second flexible substrate A side, the second flexible substrate A side is arranged in the middle of the first flexible substrate, and the heat conduction layer is arranged on the inner surface of the first flexible substrate. A plurality of chip sets, heat conduction layers and a first flexible substrate A side are arranged in the second flexible substrate, the first flexible substrate A side is arranged in the middle of the second flexible substrate, cavities in the first flexible substrate and the second flexible substrate are filled with plastic package materials, and the first flexible substrate and the second flexible substrate fix and seal the plurality of chip sets and the plurality of heat conduction layers. The plurality of chip sets are contacted with the plurality of heat conduction layers to lead out heat of the plurality of chip sets from the plurality of heat conduction layers, and the structure not only protects the chips in a sealing manner, but also has efficient heat dissipation capability, prevents erosion of an external environment, and ensures stable performance of the flexible substrate in various application scenes.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic packaging, and in particular to a heat dissipation structure based on flexible substrate packaging and a manufacturing method thereof. Background Art

[0002] Flexible substrate is a flexible, thin, high-performance basic material, usually made of polyimide (PI), polyester (PET), polyamide (PA), polystyrene (PS), polytetrafluoroethylene (PTFE) and other materials. Flexible substrate has the characteristics of high elasticity, good bendability, corrosion resistance, good adhesion, ultra-thin and ultra-light, and is suitable for electronics, information, communications, aerospace, biomedicine, optoelectronics, robotics and other fields.

[0003] In order to prevent the flexible substrate and circuit from being corroded by water, oxygen and corrosive liquids in the external environment, the heat generated in the flexible substrate and circuit can be dissipated, ensuring that the flexible substrate maintains stable performance in various application scenarios, thereby extending its service life in the application.

[0004] Therefore, there is an urgent need to develop a heat dissipation structure based on flexible substrate packaging and a manufacturing method thereof, so as to overcome the shortcomings in current practical applications. Summary of the invention

[0005] The present invention provides a heat dissipation structure based on flexible substrate packaging and a manufacturing method thereof, so as to solve the defects in the prior art.

[0006] The present invention provides a heat dissipation structure based on flexible substrate packaging and a manufacturing method thereof, comprising: a first flexible substrate, a plurality of chip groups, a plurality of heat-conducting layers, and a second flexible substrate A side are arranged on the inner surface of the first flexible substrate, the second flexible substrate A side is arranged in the middle of the first flexible substrate, a plurality of the chip groups, the heat-conducting layers, and the first flexible substrate A side are arranged in the second flexible substrate, the first flexible substrate A side is arranged in the middle of the second flexible substrate, and the cavities in the first flexible substrate and the second flexible substrate are filled with plastic packaging material Preferably, the chip group includes a first core group, a first core group and a second core group are respectively arranged on the inner wall of the first flexible substrate A side and the inner wall of the first flexible substrate B side, and the second flexible substrate A side is arranged between the first core group and the second core group.

[0007] Preferably, a third core group and a fourth core group are respectively disposed on the inner wall of the second flexible substrate A side and the inner wall of the second flexible substrate B side, and the first flexible substrate B side is disposed between the third core group and the fourth core group.

[0008] Preferably, the first core group, the second core group, the third core group and the fourth core group have the same structure, the first core group and the second core group are connected via bonding wires, the second core group and the third core group are connected via bonding wires, and the third core group and the fourth core group are connected via bonding wires.

[0009] Preferably, the first core group includes a first chip, one side of the first chip is arranged on the inner wall of the first flexible substrate A side, the other side of the first chip is provided with a heat conducting layer, a second chip is provided on the side of the heat conducting layer facing away from the first chip, and the side of the second chip facing away from the heat conducting layer is fixed to the outer wall of the second flexible substrate A side.

[0010] Preferably, the first chip and the second chip are connected via bonding wires.

[0011] Preferably, the first chip is bonded to the inner wall of the first flexible substrate A side by thermosetting glue, and the first chip is bonded to the heat conducting layer by heat conducting glue.

[0012] Preferably, it also includes: Area detection module 1, used to measure the contact area between the thermosetting glue and the first chip; Area detection module 2, used to measure the contact area between the thermosetting glue and the first flexible substrate; Temperature detection module, used to measure the temperature of thermosetting glue; A calculation module 1, used for calculating a theoretical fatigue damage coefficient of the thermosetting glue based on a contact area between the thermosetting glue and the first chip; An alarm module, used for issuing an alarm; A processing module, used for comparing the theoretical fatigue damage coefficient of the thermosetting glue obtained by the calculation module 1 with the rated fatigue damage coefficient of the thermosetting glue; Control module, when the theoretical fatigue damage coefficient of the thermosetting glue is greater than the rated fatigue damage coefficient of the thermosetting glue, the heat dissipation structure of the flexible substrate package is unqualified, the control alarm module sounds an alarm, and at the same time detects the heat dissipation structure of the flexible substrate package. When the theoretical fatigue damage coefficient of the thermosetting glue is less than or equal to the rated fatigue damage coefficient of the thermosetting glue, the heat dissipation structure of the flexible substrate package is qualified.

[0013] Preferably, the calculation module 1 calculates based on the following formula 1: ; is the theoretical fatigue damage coefficient of thermosetting adhesive, is the stress intensification coefficient of thermosetting adhesive, is the hyperbolic sine function, is the contact area between the thermosetting glue and the first chip, The contact area between the thermosetting glue and the first flexible substrate, is the natural exponential function, is the stress tensor of the thermosetting adhesive, is the strain rate sensitivity coefficient of thermosetting adhesive, is the activation energy of thermosetting adhesive, is the temperature of the thermosetting glue, is a natural constant, is the material constant of thermosetting glue, is the specific heat capacity of thermosetting glue, It is the quality of thermosetting glue.

[0014] Preferably, a method for manufacturing a heat dissipation structure based on a flexible substrate package is applied to the heat dissipation structure based on a flexible substrate package, and is characterized in that the manufacturing method comprises the following steps: S1, bonding a plurality of first chips to be packaged to the inner wall of the first flexible substrate A side and the inner wall of the second flexible substrate B side by using thermosetting glue; S2, a heat-conducting layer is bonded on one side of the first chip away from the inner wall of the first flexible substrate A side and the inner wall of the second flexible substrate B side by a heat-conducting adhesive; S3, bonding a second chip to a side of the heat-conducting layer away from the first chip by means of heat-conducting adhesive; S4, bonding the second chip on the side facing away from the heat-conducting layer to the outer wall of the second flexible substrate A side and the inner wall of the first flexible substrate B side by using thermosetting glue; S5, bonding the first chip and the second chip to the inner wall of the second flexible substrate A side and the inner wall of the first flexible substrate B side respectively by using thermosetting glue; S6. A heat-conducting layer is bonded between the first chip and the second chip by heat-conducting adhesive; S7, connecting the first chips and the second chips in pairs through bonding wires; S8, filling the cavities in the first flexible substrate and the second flexible substrate of the package body with a molding material. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 It is a schematic diagram of the overall cross-sectional structure provided by an embodiment of the present invention; Figure 2 It is a schematic diagram of a flow chart provided by an embodiment of the present invention.

[0017] Reference numerals: 1. First flexible substrate; 11. First flexible substrate A side; 12. First flexible substrate B side; 2. Second flexible substrate; 21. Second flexible substrate A side; 22. Second flexible substrate B side; 3. First core group; 31. First chip; 32. Second chip; 33. Thermal conductive layer; 4. Second core group; 5. Third core group; 6. Fourth core group; 7. Bonding wire; 8. Thermosetting glue; 9. Thermal conductive glue; 10. Plastic encapsulation material. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions and technical features between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0020] The present invention provides the following embodiments Example 1 The embodiment of the present invention provides a heat dissipation structure based on flexible substrate packaging and a manufacturing method thereof, such as Figure 1 As shown, it includes: a first flexible substrate 1, on the inner surface of which a plurality of chipsets, a plurality of heat-conducting layers 33, and a second flexible substrate A side 21 are arranged, and the second flexible substrate A side 21 is arranged in the middle of the first flexible substrate 1, and the second flexible substrate 2 is provided with a plurality of the chipsets, the heat-conducting layers 33, and the first flexible substrate A side 11, and the first flexible substrate A side 11 is arranged in the middle of the second flexible substrate 2, and the cavities in the first flexible substrate 1 and the second flexible substrate 2 are filled with a plastic packaging material 10.

[0021] The working principle and beneficial effects of the above technical solution are as follows: the first flexible substrate and the second flexible substrate fix and seal multiple chipsets and multiple heat-conducting layers through a cross-insertion connection mode, the first flexible substrate and the second flexible substrate are inserted into each other's middle part, so that the inserted structure has stability, and the multiple chipsets conduct the heat of the multiple chipsets from the multiple heat-conducting layers through contact with the multiple heat-conducting layers. Due to the micro-elasticity of the plastic encapsulation material, the plastic encapsulation material fills the cavity space in the structure while elastically supporting the structure from the inside. The structure not only seals and protects the chip but also has efficient heat dissipation capability, avoids damage to the chip caused by high temperature, prevents water, oxygen and corrosive liquids in the external environment from eroding the flexible substrate and circuit, ensures the stable performance of the flexible substrate in various application scenarios, and thus extends its service life in the application.

[0022] Example 2 On the basis of Example 1, Figure 1 As shown, the chip group includes a first core group 3, and the first core group 3 and the second core group 4 are respectively arranged on the inner wall of the first flexible substrate A side and the inner wall of the first flexible substrate B side 12, and the second flexible substrate A side 21 is arranged between the first core group 3 and the second core group 4.

[0023] The working principle and beneficial effects of the above technical solution are as follows: the structures of the first core group and the second core group are the same, the inner wall of the first flexible substrate A side and the inner wall of the first flexible substrate B side fix the first core group, the second flexible substrate A side and the second core group respectively, the first core group, the second flexible substrate A side and the second core group support each other, so that the connection is tighter and more stable during use, the force on the first core group and the second core group is more balanced and stable, and more heat generated by friction is avoided.

[0024] Example 3 On the basis of Example 2, Figure 1 As shown, a third core group 5 and a fourth core group 6 are respectively disposed on the inner wall of the second flexible substrate A side and the inner wall of the second flexible substrate B side 22 , and the first flexible substrate B side 12 is disposed between the third core group 5 and the fourth core group 6 .

[0025] The working principle and beneficial effects of the above technical solution are as follows: the inner wall of the second flexible substrate A side and the inner wall of the second flexible substrate B side respectively fix the third core group, the first flexible substrate B side, and the fourth core group; the third core group, the first flexible substrate B side, and the fourth core group support each other, so that the connection is tighter and more stable during use, and the force on the third core group and the fourth core group is more balanced and stable, thus avoiding the generation of more heat caused by friction.

[0026] Example 4 On the basis of Example 3, Figure 1 As shown, the first core group 3, the second core group 4, the third core group 5, and the fourth core group 6 have the same structure, the first core group 3 and the second core group 4 are connected via a bonding wire 7, the second core group 4 and the third core group 5 are connected via a bonding wire 7, and the third core group 5 and the fourth core group 6 are connected via a bonding wire 7.

[0027] The working principle and beneficial effects of the above technical solution are as follows: the first core group, the second core group, the third core group and the fourth core group have the same structure, which makes the setting of this structure more balanced and stable, and not easy to be damaged due to deflection. The first core group, the second core group, the third core group and the fourth core group are connected by bonding wires to facilitate the transmission of electrical signals.

[0028] Example 5 On the basis of Example 4, Figure 1 As shown, the first core group 3 includes a first chip 31, one side of the first chip 31 is arranged on the inner wall of the first flexible substrate A side 11, the other side of the first chip 31 is provided with a heat conducting layer 33, the side of the heat conducting layer 33 facing away from the first chip 31 is provided with a second chip 32, and the side of the second chip 32 facing away from the heat conducting layer 33 is fixed to the outer wall of the second flexible substrate A side 21.

[0029] The working principle and beneficial effects of the above technical solution are as follows: the inner wall on the A side of the first flexible substrate supports and fixes the first chip, the first chip supports and fixes the heat-conducting layer, the heat-conducting layer supports and fixes the second chip, and the outer wall on the A side of the second flexible substrate supports and fixes the second chip, which stabilizes the structure of the first chip, the heat-conducting layer and the second chip. At the same time, the heat-conducting layer conducts away the heat generated by the first chip and the second chip, reducing the damage problem caused by the first chip and the second chip. The heat-conducting layer is made of metal, and metallic silver is added to the heat-conducting layer to increase the thermal conductivity of the heat-conducting layer.

[0030] Example 6 On the basis of Example 5, Figure 1 As shown, the first chip 31 and the second chip 32 are connected via bonding wires 7, the first chip 31 and the inner wall of the first flexible substrate A side 11 are bonded via thermosetting glue 8, and the first chip 31 and the heat-conducting layer 33 are bonded via heat-conducting glue 9.

[0031] The working principle and beneficial effects of the above technical solution are as follows: the bonding wire connects the first chip and the second chip to realize signal transmission, and also has a certain thermal conductivity, which helps the first chip and the second chip to dissipate heat, prevents the performance of the first chip and the second chip from being reduced or damaged due to overheating, and improves the reliability of the overall structure.

[0032] Example 7 On the basis of Example 6, the invention further comprises: Area detection module 1, used to measure the contact area between the thermosetting glue 8 and the first chip 31; Area detection module 2, used to measure the contact area between the thermosetting glue 8 and the first flexible substrate 1; A temperature detection module, used to measure the temperature of the thermosetting glue 8; A calculation module 1, used to calculate a theoretical fatigue damage coefficient of the thermosetting glue 8 based on a contact area between the thermosetting glue 8 and the first chip 31; An alarm module, used for issuing an alarm; A processing module, used for comparing the theoretical fatigue damage coefficient of the thermosetting glue 8 obtained by the calculation module 1 with the rated fatigue damage coefficient of the thermosetting glue 8; Control module, when the theoretical fatigue damage coefficient of the thermosetting glue 8 is greater than the rated fatigue damage coefficient of the thermosetting glue 8, the heat dissipation structure of the flexible substrate package is unqualified, the control alarm module sends out an alarm, and at the same time detects the heat dissipation structure of the flexible substrate package. When the theoretical fatigue damage coefficient of the thermosetting glue 8 is less than or equal to the rated fatigue damage coefficient of the thermosetting glue 8, the heat dissipation structure of the flexible substrate package is qualified.

[0033] The working principle and beneficial effects of the above technical solution are as follows: the area detection module 1 measures the contact area between the thermosetting glue and the first chip, the area detection module 2 measures the contact area between the thermosetting glue and the first flexible substrate 1, the temperature detection module measures the temperature of the thermosetting glue 8, the calculation module 1 calculates the theoretical fatigue damage coefficient of the thermosetting glue based on the contact area between the thermosetting glue and the first chip, the alarm module is used to issue an alarm, the processing module compares the theoretical fatigue damage coefficient of the thermosetting glue obtained by the calculation module 1 with the rated fatigue damage coefficient of the thermosetting glue, when the theoretical fatigue damage coefficient of the thermosetting glue is greater than the rated fatigue damage coefficient of the thermosetting glue, the heat dissipation structure of the flexible substrate package is unqualified, the control module controls the alarm module to issue an alarm, and at the same time detects the heat dissipation structure of the flexible substrate package, when the theoretical fatigue damage coefficient of the thermosetting glue is less than or equal to the rated fatigue damage coefficient of the thermosetting glue, the heat dissipation structure of the flexible substrate package is qualified.

[0034] Example 8 Based on Example 7, the calculation module 1 calculates based on the following formula 1: ; is the theoretical fatigue damage coefficient of thermosetting adhesive 8, is the stress intensification coefficient of thermosetting glue 8, is the hyperbolic sine function, is the contact area between the thermosetting glue 8 and the first chip 31, The contact area between the thermosetting glue 8 and the first flexible substrate 1, is the natural exponential function, is the stress tensor of the thermosetting glue 8, is the strain rate sensitivity coefficient of thermosetting glue 8, is the activation energy of thermosetting glue 8, is the temperature of thermosetting glue 8, is a natural constant, is the material constant of thermosetting glue 8, is the specific heat capacity of thermosetting glue 8, The quality of thermosetting glue is 8.

[0035] The working principle and beneficial effects of the above technical solution are: The theoretical fatigue damage coefficient of the thermosetting glue is calculated. When the theoretical fatigue damage coefficient of the thermosetting glue is greater than the rated fatigue damage coefficient of the thermosetting glue, the heat dissipation structure of the flexible substrate package is unqualified. The control module controls the alarm module to sound an alarm and at the same time detects the heat dissipation structure of the flexible substrate package. When the theoretical fatigue damage coefficient of the thermosetting glue is less than or equal to the rated fatigue damage coefficient of the thermosetting glue, the heat dissipation structure of the flexible substrate package is qualified.

[0036] Example 9 On the basis of Examples 1-8, Figure 2 As shown, a method for manufacturing a heat dissipation structure based on a flexible substrate package is applied to the heat dissipation structure based on a flexible substrate package as described above, and is characterized in that the manufacturing method includes the following steps: S1, bonding a plurality of first chips 31 to be packaged to the inner wall of the first flexible substrate A side 11 and the inner wall of the second flexible substrate B side 22 by using thermosetting glue 8; S2, a heat-conducting layer 33 is bonded on one side of the first chip away from the inner wall of the first flexible substrate A side 11 and the inner wall of the second flexible substrate B side 22 by means of a heat-conducting adhesive 9; S3, a second chip 32 is bonded to the side of the heat-conducting layer 33 facing away from the first chip by means of a heat-conducting adhesive 9; S4, bonding the second chip 32 on the side facing away from the heat-conducting layer 33 to the outer wall of the second flexible substrate A side and the inner wall of the first flexible substrate B side 12 by using thermosetting glue 8; S5, bonding the first chip and the second chip 32 to the inner wall of the second flexible substrate A side and the inner wall of the first flexible substrate B side 12 respectively by using thermosetting glue 8; S6, a heat-conducting layer 33 is bonded between the first chip and the second chip 32 by a heat-conducting adhesive 9; S7, connecting the first chips 31 and the second chips 32 in pairs through bonding wires 7; S8 , filling the cavities in the first flexible substrate 1 and the second flexible substrate 2 of the package body with a molding material 10 .

[0037] The working principle and beneficial effects of the above technical solution are as follows: a plurality of first chips 31 to be packaged are adhered to the inner wall of the first flexible substrate A side 11 and the inner wall of the second flexible substrate B side 22 by means of thermosetting glue, a heat-conducting layer 33 is adhered to the first chip side away from the inner wall of the first flexible substrate A side 11 and the inner wall of the second flexible substrate B side 22 by means of heat-conducting glue, a second chip 32 is adhered to the heat-conducting layer 33 by means of heat-conducting glue on the side away from the first chip 31, and a second chip 32 is adhered to the heat-conducting layer 33 by means of thermosetting glue on the side away from the second chip 32 by means of heat-conducting glue. The outer wall of the second flexible substrate A side 21 and the inner wall of the first flexible substrate B side 12 are adhered to the first chip 31 and the second chip 32 by thermosetting glue respectively on the inner wall of the second flexible substrate A side 21 and the inner wall of the first flexible substrate B side 12, a heat conductive layer 33 is adhered between the first chip 31 and the second chip 32 by heat conductive glue, multiple first chips 31 and second chips 32 are connected in pairs by bonding wires 7, and the cavities in the first flexible substrate 1 and the second flexible substrate 2 of the package body are filled with plastic packaging material.

[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A heat dissipation structure based on flexible substrate packaging, characterized in that: include: A first flexible substrate (1), wherein a plurality of chip groups, a plurality of heat-conducting layers (33), and a second flexible substrate A side (21) are arranged on an inner surface of the first flexible substrate (1), wherein the second flexible substrate A side (21) is arranged in the middle of the first flexible substrate (1), wherein a plurality of the chip groups, the heat-conducting layers (33), and the first flexible substrate A side (11) are arranged in the second flexible substrate (2), wherein the first flexible substrate A side (11) is arranged in the middle of the second flexible substrate (2), and wherein cavities in the first flexible substrate (1) and the second flexible substrate (2) are filled with a plastic encapsulation material (10).

2. The heat dissipation structure based on flexible substrate packaging according to claim 1, characterized in that: The chip group comprises a first core group (3), the first core group (3) and the second core group (4) are respectively arranged on the inner wall of the first flexible substrate A side (11) and the inner wall of the first flexible substrate B side (12), and the second flexible substrate A side (21) is arranged between the first core group (3) and the second core group (4).

3. The heat dissipation structure based on flexible substrate packaging according to claim 2, characterized in that: A third core group (5) and a fourth core group (6) are respectively arranged on the inner wall of the second flexible substrate A side (21) and the inner wall of the second flexible substrate B side (22), and a first flexible substrate B side (12) is arranged between the third core group (5) and the fourth core group (6).

4. The heat dissipation structure based on flexible substrate packaging according to claim 3, characterized in that: The first core group (3), the second core group (4), the third core group (5), and the fourth core group (6) have the same structure; the first core group (3) and the second core group (4) are connected via a bonding wire (7); the second core group (4) and the third core group (5) are connected via a bonding wire (7); and the third core group (5) and the fourth core group (6) are connected via a bonding wire (7).

5. The heat dissipation structure based on flexible substrate packaging according to claim 4, characterized in that: The first core group (3) comprises a first chip (31), one side of the first chip (31) is arranged on the inner wall of the first flexible substrate side A (11), the other side of the first chip (31) is provided with a heat conducting layer (33), a second chip (32) is arranged on the side of the heat conducting layer (33) facing away from the first chip (31), and a side of the second chip (32) facing away from the heat conducting layer (33) is fixed to the outer wall of the second flexible substrate side A (21).

6. The heat dissipation structure based on flexible substrate packaging according to claim 5, characterized in that: The first chip (31) and the second chip (32) are connected via bonding wires (7).

7. The heat dissipation structure based on flexible substrate packaging and the manufacturing method thereof according to claim 6, characterized in that: The first chip (31) is bonded to the inner wall of the first flexible substrate side A (11) via thermosetting glue (8), and the first chip (31) is bonded to the heat conducting layer (33) via heat conducting glue (9).

8. The heat dissipation structure based on flexible substrate packaging according to claim 7, characterized in that: Also includes: Area detection module 1, used to measure the contact area between the thermosetting glue (8) and the first chip (31); Area detection module 2, used to measure the contact area between the thermosetting glue (8) and the first flexible substrate (1); A temperature detection module, used to measure the temperature of the thermosetting glue (8); A calculation module 1, used for calculating a theoretical fatigue damage coefficient of the thermosetting glue (8) based on a contact area between the thermosetting glue (8) and the first chip (31); An alarm module, used for issuing an alarm; A processing module, used for comparing the theoretical fatigue damage coefficient of the thermosetting glue (8) obtained by the calculation module 1 with the rated fatigue damage coefficient of the thermosetting glue (8); The control module is configured to detect the heat dissipation structure of the flexible substrate package when the theoretical fatigue damage coefficient of the thermosetting glue (8) is greater than the rated fatigue damage coefficient of the thermosetting glue (8), and the heat dissipation structure of the flexible substrate package is unqualified. The control alarm module sends out an alarm and detects the heat dissipation structure of the flexible substrate package at the same time. When the theoretical fatigue damage coefficient of the thermosetting glue (8) is less than or equal to the rated fatigue damage coefficient of the thermosetting glue (8), the heat dissipation structure of the flexible substrate package is qualified.

9. The heat dissipation structure based on flexible substrate packaging and the manufacturing method thereof according to claim 9, characterized in that: The calculation module 1 calculates based on the following formula 1: ； is the theoretical fatigue damage coefficient of thermosetting adhesive (8), is the stress intensification factor of thermosetting adhesive (8), is the hyperbolic sine function, is the contact area between the thermosetting glue (8) and the first chip (31), The contact area between the thermosetting glue (8) and the first flexible substrate (1), is the natural exponential function, is the stress tensor of the thermosetting glue (8), is the strain rate sensitivity coefficient of thermosetting glue (8), is the activation energy of the thermosetting adhesive (8), is the temperature of the thermosetting glue (8), is a natural constant, is the material constant of thermosetting glue (8), is the specific heat capacity of the thermosetting glue (8), is the mass of thermosetting glue (8).

10. A method for manufacturing a heat dissipation structure based on a flexible substrate package, applied to a heat dissipation structure based on a flexible substrate package as described in claims 1 to 9 above, characterized in that: The preparation method comprises the following steps: S1, bonding a plurality of first chips (31) to be packaged to the inner wall of the first flexible substrate side A (11) and the inner wall of the second flexible substrate side B (22) by means of thermosetting glue (8); S2, a heat-conducting layer (33) is bonded to a side of the first chip (31) away from the inner wall of the first flexible substrate side A (11) and the inner wall of the second flexible substrate side B (22) by means of a heat-conducting adhesive (9); S3, bonding a second chip (32) to a side of the heat-conducting layer (33) facing away from the first chip (31) via a heat-conducting adhesive (9); S4, bonding the second chip (32) on the side facing away from the heat-conducting layer (33) to the outer wall of the second flexible substrate A side and the inner wall of the first flexible substrate B side (12) by means of thermosetting glue (8); S5, bonding the first chip (31) and the second chip (32) to the inner wall of the second flexible substrate A side and the inner wall of the first flexible substrate B side (12) respectively by using thermosetting glue (8); S6, a heat-conducting layer (33) is bonded between the first chip (31) and the second chip (32) via a heat-conducting adhesive (9); S7, connecting the plurality of first chips (31) and second chips (32) in pairs via bonding wires (7); S8. Filling the cavities in the first flexible substrate (1) and the second flexible substrate (2) of the package body with a plastic encapsulation material (10).

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