Laminated ultra-low-frequency high-voltage generator boost unit PCB structure

Abstract

The invention relates to the technical field of ultra-low-frequency high-voltage generators, in particular to a laminated ultra-low-frequency high-voltage generator boosting unit PCB structure which comprises a PCB. The circuit also comprises a negative power supply and a positive power supply which are arranged on the PCB, and the negative power supply and the positive power supply are reversely connected in series. The negative power supply and the positive power supply can respectively output positive and negative high voltages under the driving of the magnetic bar; through reasonable layout of the positions of all parts of the negative power supply and the positive power supply, the sizes of the negative power supply magnetic bar jacks, the positive power supply magnetic bar jacks and the middle ventilation holes are set as large as possible with the size of the PCB as small as possible, so that the creepage distance between wires is optimized on the premise of ensuring the heat dissipation effect; the boost unit PCBs are of a single board structure, and a plurality of boost unit PCBs are installed in a laminated mode so as to achieve higher voltage output. LED indicating lamps are arranged on the two sides of the boost unit PCB, the working state of the boost unit PCB can be rapidly judged, and replacement or maintenance is facilitated; the boost unit PCB all adopts patch elements, is suitable for automatic production, and has relatively low cost and very high reliability.

Description

Technical Field

[0001] The invention relates to the technical field of ultra-low frequency high voltage generators, and in particular to a laminated ultra-low frequency high voltage generator boost unit PCB structure. Background Art

[0002] The ultra-low frequency high-voltage generator can generate any high-voltage waveform. This device is mainly developed for the withstand voltage and dielectric loss tests of large-capacity power equipment such as power cables. Compared with traditional power frequency test equipment, it greatly reduces the weight and volume of the equipment.

[0003] Current ultra-low frequency high-voltage generators, such as an ultra-low frequency high-voltage generator disclosed in the invention patent with announcement number CN109142819B and a series ultra-low frequency high-voltage generator disclosed in the utility model patent with announcement number CN218244211U, still have problems such as being too heavy (on the order of 100 kg), large in size, and poor in heat dissipation. Therefore, a laminated ultra-low frequency high-voltage generator boost unit PCB structure is urgently needed to improve the above problems.

[0004] A laminated ultra-low frequency high-voltage generator can be installed by stacking several booster units, without the need for complex insulation structure and liquid cooling technology, and has a foreseeable small size, weight and high safety. However, if this working principle is adopted, an ultra-thin booster unit with optimized design is required, which can provide the best heat dissipation capacity while setting the required components, can use chip components to achieve an ultra-thin structure and is suitable for automated production, and has low cost and high reliability. Summary of the invention

[0005] In order to solve the above technical problems, the present invention provides a boost unit implemented by a single-board PCB. Each boost unit PCB can be installed in layers at intervals of several millimeters. Each boost unit can provide an output voltage of + / -2000V and an output current of more than 50mA. The stacking installation of several boost unit PCBs can achieve the required high voltage output.

[0006] A laminated ultra-low frequency high voltage generator boost unit PCB structure of the present invention comprises a PCB and a negative power supply and a positive power supply arranged on the PCB; Preferably, the PCB has a circular single plate, a ventilation hole is provided at the center of the PCB, a negative power supply magnetic rod jack and a positive power supply magnetic rod jack are symmetrically provided on the left and right sides of the ventilation hole, and a plurality of mounting holes are symmetrically provided on the top and bottom of the PCB; Preferably, the PCB layout structure includes a peripheral area of ​​the negative power supply magnetic rod jack for setting a negative power supply coil, an upper arc area for setting a negative power supply, a peripheral area of ​​the positive power supply magnetic rod jack for placing a positive power supply coil, and a lower arc area for setting a positive power supply, and the positive power supply coil and the positive power supply are symmetrically arranged with the negative power supply coil and the negative power supply in a 180-degree rotation; Preferably, the negative power supply and the positive power supply are in a reverse series relationship in the circuit structure, and are output to the outside through the negative power supply output contact on the PCB component surface and the positive power supply output contact arranged on the bottom surface of the PCB and coinciding with the position of the negative power supply output contact, wherein the negative power supply output contact is elastic and retractable; Preferably, an insulating gasket of a certain thickness is installed on the mounting hole of the PCB. When several PCBs are stacked and installed, the several PCBs are positioned and fixed by inserting insulating screws into the mounting holes, so that the output voltage of each PCB is connected in series through the negative power output contact and the positive power output contact. When driven by a magnetic rod inserted into the negative power magnetic rod jack, the negative high voltage can be output as a whole, and when driven by a magnetic rod inserted into the positive power magnetic rod jack, the positive high voltage can be output as a whole, so as to realize the function of a stacked ultra-low frequency high voltage generator. The ventilation holes in the center of the stacked PCBs form a heat dissipation duct to realize heat dissipation of the negative power supply and the positive power supply of each PCB.

[0007] Preferably, the negative power supply includes a negative power supply magnetic bar jack, a first blue LED lamp, a first coil plate pad, a first rectifier circuit, a first control circuit, a first MOS tube string, a second MOS tube string, a third MOS tube string, a first damping resistor, a second blue LED lamp and a negative contact; Preferably, the first blue LED light and the second blue LED light are respectively arranged on the outside of the negative power supply part close to the PCB, so as to observe whether the negative power supply works normally; The first rectifier circuit is arranged on the right side of the first coil plate pad, occupying a smaller PCB area; The first control circuit is arranged on the right side of the first rectifier circuit, occupying a smaller PCB area; The first MOS tube string, the second MOS tube string, and the third MOS tube string are arranged on the right side of the first control circuit, occupying a larger PCB area, wherein the first MOS tube string is arranged on the outside of the upper arc portion of the PCB, the second MOS tube string is arranged in the middle of the upper arc portion, and the third MOS tube string is arranged on the inside of the upper arc portion, the left side of the MOS tube string is a low voltage end, and the right side is a high voltage end; The first damping resistor is arranged on the right side of the MOS tube string, occupying a smaller PCB area; The negative contact is arranged on the right side of the first damping resistor; Each MOS tube in the MOS tube string has as large and equal copper foil as possible on the component side of the PCB. While retaining the spacing of the high-voltage traces on the bottom of the PCB, try to set a heat dissipation copper foil on the bottom of the PCB for each MOS tube. The copper foil on the front and back of the MOS tube is connected with as many vias as possible to increase the heat dissipation capacity. The positive power supply includes the same components as the negative power supply, except for the positive contact, the other layouts are arranged 180 degrees rotationally symmetrically with the negative power supply; The back of the PCB is provided with a connection line from the negative power rectifier high voltage end to the high voltage ends of the first, second and third MOS tube strings, a connection line from the positive power rectifier high voltage end to the high voltage ends of the fourth, fifth and sixth MOS tube strings, a connection line from the negative power low voltage end to the second damping resistor, a connection line from the second damping resistor to the positive power low voltage end, and a connection line from the positive power high voltage end to the positive contact. These connections make the negative power and the positive power present a reverse series relationship, and are finally output to the outside through the negative power output contact on the PCB component surface and the positive power output contact arranged on the bottom surface of the PCB (30); All PCB wiring spacing needs to consider the voltage between adjacent conductors to maximize the creepage distance, including: the voltage gradient of the first rectifier circuit is about 600V, the voltage gradient of the MOS tube string is about 200V, and the maximum output voltage of each power supply is about 2400V. The wiring should be arranged at a spacing of more than mm / 200V to optimize the component density and line spacing. The current of the high-voltage generator is generally not more than 100mA, and the line width of 1mm basically meets the requirements; Preferably, the PCB can adopt a two-layer circuit board process, the coil arranged outside the negative power supply magnetic rod jack is a PCB coil separately manufactured according to the PCB process, and is welded to the PCB through a first coil plate pad; another coil arranged outside the positive power supply magnetic rod jack is a PCB coil separately manufactured according to the PCB process, and is welded to the PCB through a second coil plate pad; Not preferred, if cost is not taken into account, the PCB can be a 4-layer or more circuit board, and the coil and the PCB can be made together to obtain a simpler structure; the connection line is set in the middle layer to obtain a better insulation effect; the heat dissipation copper sheet of the MOS tube is also set in the middle layer to obtain a better heat dissipation effect; Setting as many MOS tube strings as possible can increase the output current, increasing the number of MOS in each MOS string can increase the output voltage, and setting as many MOS tubes as possible is conducive to dispersing heat; Preferably, the PCB uses black solder mask to obtain better heat dissipation capability.

[0008] The beneficial effects of the present invention are: The boost unit PCB adopts a single-board structure with a very thin thickness. Through the installation holes and the addition of insulating washers, combined with insulating screws, it is easy to achieve stacking installation and realize high-voltage output through series connection.

[0009] The boost unit PCB uses a positive and negative power supply in series to provide positive and negative voltage outputs. Each power supply contains rectification, control and MOS tube series discharge circuits, which can achieve arbitrary voltage output for pure capacitive loads. Each power supply retains the position for installing the coil and the corresponding magnetic rod opening, which is used to insert the driving magnetic rod after the stacking installation, and uses the transformer principle to provide energy to the coil, and outputs the voltage after rectification.

[0010] MOS tubes are used to absorb the energy of pure capacitive loads, so the core issue of the boost unit is to solve the heat dissipation of the MOS tube. For this purpose, a central ventilation hole is set, and as many MOS tubes as possible are used to disperse the heat. Each MOS tube is set with as large a copper sheet as possible on the front and back of the PCB and connected through vias, achieving the best heat dissipation capacity under forced air cooling conditions.

[0011] The boost unit PCB uses SMD components, which is suitable for automated production, reducing costs and greatly improving reliability. The LED indicator light set on the edge of the boost unit PCB can easily observe the working status, greatly facilitates fault detection, and its maintenance is also very simple. Only the faulty boost unit PCB needs to be replaced in the PCB stack.

[0012] The boost unit PCB has a reserved space for the coil, and the coil can be made using a separate PCB, or the coil and PCB can be made together, which is very flexible.

[0013] The boost unit PCB is lightweight and does not require complex insulation structures and liquid cooling technology after stacking. Taking a 4kVA ultra-low frequency high-voltage generator as an example, the weight can be as low as 30kg, which has a disruptive advantage over traditional high-voltage generators. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a block diagram of the working principle of the laminated ultra-low frequency high voltage generator of the present invention; Figure 2 It is a circuit schematic diagram of a power supply in a boost unit PCB of the present invention; Figure 3 This is a schematic diagram of the front layout of the PCB of the present invention; Figure 4 It is a schematic diagram of the back side layout of the PCB of the present invention; Markings in the attached drawings: a1, negative power supply magnetic rod jack; a2, first blue LED lamp; a3, first coil plate pad; a4, first rectifier circuit; a5, first control circuit; a6, first MOS tube string; a7, a7, second MOS tube string; a8, third MOS tube string; a9, first damping resistor; a10, second blue LED lamp; a11, first negative contact; b1, positive power supply magnetic rod jack; b2, first red LED lamp; b3, second coil plate pad; b4, second rectifier circuit; b5, second control circuit; b6, fourth MOS tube string; b7, fifth MOS tube string; b8, sixth MOS tube string; b9, second damping resistor; b10, first red LED lamp; b11, second negative contact; c1, ventilation hole; c2, mounting hole; d1, first connection line; d2, second connection line; d3, third connection line; d4, fourth connection line; d5, fifth connection line; 30, PCB; Figure 2 In: 1. Coil; 2. Rectification circuit; 3. MOS tube discharge circuit; 4. Control circuit; R, damping resistor; LED, light-emitting diode; DETAILED DESCRIPTION

[0015] In order to facilitate understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0016] Figure 1 What is shown is a working principle block diagram of how the present invention is applied to a laminated ultra-low frequency high-voltage generator, wherein a1 / b1, a2 / b2...an / bn are n boost units, each of which comprises a power supply part a capable of outputting a negative voltage and a power supply part b capable of outputting a positive voltage. The n boost units are laminated and installed to form a series structure, and magnetic rods wound with coils are respectively inserted into the coils of the boost units. Based on the principle of high-frequency transformers, under the negative half-cycle high-frequency drive, the magnetic rod drives the negative power supply coil of each boost unit and generates a negative high-voltage output, and under the positive half-cycle high-frequency drive, the magnetic rod drives the positive power supply coil of each boost unit and generates a positive high-voltage output.

[0017] The discharge circuit is actually the core part to ensure the normal operation of the ultra-low frequency high voltage generator. The reason is that when the ultra-low frequency high voltage generator is used for the withstand voltage test of power equipment, it mainly drives the capacitive load. The characteristic of the capacitive load is that when the rectifier circuit increases the output voltage, it can only output energy to the capacitive load in one direction. When the rectifier circuit reduces the output voltage, the energy of the capacitive load can only be discharged through the discharge circuit to make the voltage at both ends of the capacitor decrease synchronously. Traditionally, there is a method of using resistors to achieve discharge, but the performance of resistor discharge is poor, resulting in low output efficiency and poor waveform. Using MOS tubes for discharge is a new solution with very high efficiency, such as Figure 2 As shown, when the output voltage of the rectifier circuit 2 increases, the diode of the control circuit 4 is turned on, so that the gate voltage of the MOS tube at the low voltage end of the MOS tube string is reduced and turned off, causing the entire MOS tube string to be turned off, and the external capacitive load is smoothly charged. When the output voltage of the rectifier circuit 2 decreases, the diode of the control circuit 4 is cut off, and the voltage across the voltage regulator tube of the control circuit 4 increases, so that the gate voltage of the MOS tube at the low voltage end of the MOS tube string is increased and turned on, causing the entire MOS tube string to be turned on, and the external capacitive load is discharged through the MOS tube string, so that the voltage of the capacitive load is synchronously reduced with the voltage of the rectifier circuit.

[0018] In fact, the core of the design of the boost unit is to solve the heat dissipation problem of the MOS tube discharge circuit. From the working principle, the output energy of the entire ultra-low frequency high-voltage generator is ultimately absorbed by the discharge circuit. To solve the heat dissipation problem, it is necessary to provide a large flow of air and use as many MOS tubes as possible to disperse the heat. How to improve the heat dissipation capacity, achieve high-density component layout and achieve a safe distance between traces in a small PCB area poses a challenge to the PCB layout.

[0019] Example 1

[0020] like Figures 1 to 4 As shown, a laminated ultra-low frequency high voltage generator boost unit PCB structure includes a PCB 30; it is characterized in that it also includes a negative power supply and a positive power supply, the negative power supply and the positive power supply are both installed on the PCB 30, and the negative power supply and the positive power supply are reversely connected in series; The negative power supply and the positive power supply output negative and positive high voltages respectively under the drive of the magnetic rod; The negative power supply and the positive power supply are 180 degrees rotationally symmetrically distributed on the PCB 30; The negative power supply includes a negative power supply magnetic rod jack a1, a first blue LED lamp a2, a first coil plate pad a3, a first rectifier circuit a4, a first control circuit a5, a first MOS tube string a6, a second MOS tube string a7, a third MOS tube string a8, a first damping resistor a9 and a negative power supply magnetic rod jack a10. The negative power supply magnetic rod jack a1, the first blue LED lamp a2, the first coil plate pad a3, the first rectifier circuit a4, the first control circuit a5, the first MOS tube string a6, the second MOS tube string a7, the third MOS tube string a8, the first damping resistor a9 and the second blue LED lamp a10 are all installed on the PCB 30, and a negative contact a11 is provided on the front side of the PCB 30. The positive power supply includes a positive power supply magnetic rod jack b1, a first red LED lamp b2, a second coil plate pad b3, a second rectifier circuit b3, a second control circuit b5, a fourth MOS tube string b6, a fifth MOS tube string b7, a sixth MOS tube string b8, a second damping resistor b9 and a second red LED lamp b10. The positive power supply magnetic rod jack b1, the first red LED lamp b2, the second coil plate pad b3, the second rectifier circuit b3, the second control circuit b5, the fourth MOS tube string b6, the fifth MOS tube string b7, the sixth MOS tube string b8, the second damping resistor b9 and the positive power supply magnetic rod jack b10 are all installed on the PCB 30, and a positive contact b11 is provided on the back of the PCB 30; The negative electrode contact a11 and the positive electrode contact b11 are at the same position; The first rectifier circuit a4 and the second rectifier circuit b3 include a plurality of ceramic chip capacitors and diodes, the first control circuit a5 and the second control circuit b5 are located at the low voltage end of the first MOS tube string a6, the second MOS tube string a7, the third MOS tube string a8, the fourth MOS tube string b6, the fifth MOS tube string b7 and the sixth MOS tube string b8, and the first MOS tube string a6, the second MOS tube string a7, the third MOS tube string a8, the fourth MOS tube string b6, the fifth MOS tube string b7 and the sixth MOS tube string b8 are distributed in an arc shape on the PCB 30, the first MOS tube string a6, the second MOS tube string a7, the third MOS tube string a8, the fourth MOS tube string b6, the fifth MOS tube string b7 and the sixth MOS tube string b8 are provided with copper foil on the front and back sides of the PCB 30, the first damping resistor a9 and the second damping resistor b9 are composed of a plurality of chip resistors connected in parallel, and heat dissipation copper foil is also provided on the pads at both ends of the first damping resistor a9 and the second damping resistor b9; The back of the PCB 30 is provided with a second connection line d2 for outputting the rectified high voltage of the negative power supply to the first MOS tube string a6, the second MOS tube string a7 and the third MOS tube string a8, a third connection line d3 for outputting the rectified high voltage of the positive power supply to the fourth MOS tube string b6, the fifth MOS tube string b7 and the sixth MOS tube string b8, a first connection line d1 from the low voltage end of the negative power supply to the second damping resistor b9, a fourth connection line d4 from the second damping resistor b9 to the low voltage end of the positive power supply, and a fifth connection line d5 from the high voltage end of the positive power supply to the second negative electrode contact b11; The first blue LED lamp a2 and the second blue LED lamp a10 are used to indicate a negative power supply, the first red LED lamp b2 and the second red LED lamp b10 are used to indicate a positive power supply, and the first blue LED lamp a2, the second blue LED lamp a10, the first red LED lamp b2 and the second red LED lamp b10 are all distributed outside the PCB 30; The PCB 30 is circular in shape, and a ventilation hole c1 is provided in the middle of the PCB 30, and multiple groups of mounting holes c2 are provided at the edge of the PCB 30; Coils are arranged around the negative power supply magnetic bar jack a1 and the positive power supply magnetic bar jack b1; The PCB 30 is a two-layer circuit board, and the coil is made separately using another four-layer circuit board and is soldered on the PCB 30 via the coil pad; When the PCB 30 is a 6-layer circuit board, the coils can be manufactured on the PCB 30 at the same time; The PCB 30 uses black solder resist to facilitate heat dissipation.

[0021] Example 2

[0022] The PCB thickness is 1.6 (default mm), the diameter is 280, the diameter of the magnetic rod insertion hole is 63.4, the middle air duct opening is 102*170, and the diameter of the six mounting holes is 10.2. The PCB contains a negative power supply and a positive power supply. Each power supply contains a rectifier circuit, a control circuit, three MOS tube discharge strings, a damping resistor, an LED indicator and an output terminal. The PCB uses black solder mask to facilitate heat dissipation. After welding, an insulating gasket with an inner diameter of 10.2, an outer diameter of 16 and a height of 6 is glued to each mounting hole of the PCB. After stacking, 6 insulating screws with a diameter of 10 are used to fix it. Each PCB is designed to output 2000V / 50mA. After 40 PCBs are stacked and installed, they can meet the requirements of an 80kV / 50mA ultra-low frequency high-voltage generator. The diameter of the driving magnetic rod column is 62; The PCB uses a two-layer circuit board, and the coil board is made of another 4-layer circuit board and installed on the PCB. The PCB contains a total of 6 MOS strings, each of which contains 12 MOS tubes and auxiliary circuits. The entire PCB is designed around the heat dissipation and routing spacing of the MOS tubes. The MOS tube strings are arranged in an arc shape, occupying the largest area of ​​the PCB. Each MOS tube is placed with as large a copper sheet as possible on the front and back of the PCB, and the copper sheets are connected with as many vias as possible to increase the heat dissipation capacity; The damping resistor is another hot spot. A total of 12 chip resistors are used and as much heat dissipation copper as possible is left to increase heat dissipation capacity and reliability. The negative output terminal is set on the front of the PCB, with a 6.8mm high spring contact pin welded on it. The positive output terminal pad is set on the back of the PCB at the same position. When multiple boost units are stacked, a series structure is formed by relying on the spring contact pin; On the front of the circuit board, the voltage between two adjacent MOS tube units of the same MOS tube string is considered to be 300V, and a spacing of 90MIL is retained. The potential between two adjacent strings is the same, and a spacing of 50MIL is retained. High voltage may appear at both ends of the damping resistor, and a spacing of 120MIL is retained between the pads. The high-voltage output of the rectifier circuit is 2000V, and a spacing of at least 300MIL is retained to the low-voltage part of the MOS tube string. The high-voltage output is connected to the high-voltage end of the MOS tube string, and the distance from the MOS tube unit of the high-voltage part can be appropriately reduced. The routing across the coil part maintains the maximum distance from the front coil board. In particular, the two low-voltage end connection lines d4 are inserted between the heat dissipation copper foil and d3 on the bottom surface of the MOS tube, and need to be arranged unevenly according to the voltage at each position. The 2000V position retains a spacing of 300MIL; The blue LED is used to indicate the negative power supply, and the red LED is used to indicate the positive power supply. They are arranged on the outside of the PCB. After the booster units are stacked and installed, they can conveniently indicate whether each booster unit is working normally, so as to facilitate the maintenance and replacement of faulty booster units. Due to the high density of component installation and high operating voltage, smaller packages can be selected while meeting the power consumption and voltage requirements. The diode is SMA, the filter capacitor is 2220, the MOS is TO252, the damping resistor is 2512, and other components are packaged in SOD123, SOD323, 0805 and 1210.

[0023] On the smallest PCB possible, with the largest possible middle air duct opening, the largest possible mounting hole and the largest possible magnetic rod jack, using the largest possible coil area, the largest possible creepage distance, and the smallest possible thickness including the patch components, under the constraints of the largest possible mechanical strength, a full compromise has been made between the maximum heat dissipation effect of the MOS tube. When driving a capacitive load, each boost unit works continuously for one hour under the operating conditions of 2000V / 50mA and forced air cooling, and the temperature rise is only 30°C, and the temperature no longer rises.

[0024] Example 3

[0025] Adjustments were made based on Example 1: only one MOS tube string was installed for each of the positive and negative power supplies, and 20 boost units were installed in a stacked manner, achieving an output capacity of 40kV / 35mA.

[0026] Those skilled in the art can complete relevant designs and improvements according to this specification without any creative work.

[0027] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A laminated ultra-low frequency high voltage generator boost unit PCB structure, comprising a PCB (30) and a negative power supply and a positive power supply arranged on the PCB, characterized in that: The PCB (30) has a circular shape, a ventilation hole (c1) is provided at the center of the PCB (30), a negative power supply magnetic rod plug hole (a1) and a positive power supply magnetic rod plug hole (b1) are symmetrically provided on the left and right sides of the ventilation hole (c1), and a plurality of mounting holes (c2) are symmetrically provided on the top and bottom of the PCB (30); The PCB (30) layout structure comprises a negative power supply magnetic rod plug hole (a1) peripheral area for arranging a negative power supply coil, an upper arc area for arranging a negative power supply, a positive power supply coil peripheral area for arranging a positive power supply, a lower arc area for arranging a positive power supply, and the positive power supply coil and the positive power supply are arranged symmetrically with the negative power supply coil and the negative power supply in a 180-degree rotation; The negative power supply and the positive power supply are connected in reverse series in the circuit structure, and are output to the outside through a negative power supply output contact (a11) on the component surface of the PCB (30) and a positive power supply output contact (b11) arranged on the bottom surface of the PCB (30) and coinciding with the position of the negative power supply output contact (a11), wherein the negative power supply output contact (a11) is elastic and retractable; An insulating gasket of a certain thickness is installed on the mounting hole (c2) of the PCB (30). When a plurality of PCBs (30) are stacked and installed, the plurality of PCBs (30) are positioned and fixed by means of insulating screws inserted into the mounting holes (c2), so that the output voltages of the respective PCBs (30) are in a series relationship through the negative power output contact (a11) and the positive power output contact (b11). When driven by a magnetic rod inserted into the negative power magnetic rod jack (a1), negative high voltage can be output as a whole. When driven by a magnetic rod inserted into the positive power magnetic rod jack (a1), positive high voltage can be output as a whole, so as to realize the function of a stacked ultra-low frequency high voltage generator. The ventilation hole (c1) at the center of the stacked PCBs (30) forms a heat dissipation duct, so as to realize heat dissipation of the negative power supply and the positive power supply of each PCB (30).

2. A laminated ultra-low frequency high voltage generator boost unit PCB structure as claimed in claim 1, characterized in that: The negative power supply comprises a negative power supply magnetic rod jack (a1), a first blue LED lamp (a2), a first coil plate pad (a3), a first rectifier circuit (a4), a first control circuit (a5), a first MOS tube string (a6), a second MOS tube string (a7), a third MOS tube string (a8), a first damping resistor (a9), a second blue LED lamp (a10) and a negative contact (a11); The first blue LED light (a2) and the second blue LED light (a10) are respectively arranged on the outside of the negative power supply part close to the PCB (30) and are used to observe whether the negative power supply is working normally; The first rectifier circuit (a4) is arranged on the right side of the first coil plate pad (a3), occupying a smaller PCB area; The first control circuit (a5) is arranged on the right side of the first rectifier circuit (a4) and occupies a smaller PCB area; The first MOS tube string (a6), the second MOS tube string (a7), and the third MOS tube string (a8) are arranged on the right side of the first control circuit (a5), occupying a relatively large PCB area, wherein the first MOS tube string (a6) is arranged on the outside of the upper circular arc portion of the PCB (30), the second MOS tube string (a7) is arranged in the middle of the upper circular arc portion, and the third MOS tube string (a7) is arranged on the inside of the upper circular arc portion, and the left side of the MOS tube string is a low-voltage end, and the right side is a high-voltage end; The first damping resistor (a9) is arranged on the right side of the MOS tube string (a6, a7, a8), occupying a smaller PCB area; The negative contact (a11) is arranged on the right side of the first damping resistor (a9).

3. A laminated ultra-low frequency high voltage generator boost unit PCB structure as claimed in claim 2, characterized in that: Each MOS tube in the MOS tube string (a6, a7, a8) has as large and equal copper foil as possible on the component side of the PCB. While retaining the high-voltage wiring spacing on the bottom surface of the PCB, heat dissipation copper foil is set on the bottom surface of the PCB of each MOS tube as much as possible. The copper foil on the front and back sides of the MOS tube is connected with as many vias as possible to increase the heat dissipation capacity.

4. A laminated ultra-low frequency high voltage generator boost unit PCB structure as claimed in claim 1, characterized in that: The positive power supply comprises a positive power supply magnetic rod jack (b1), a first red LED lamp (b2), a second coil plate pad (b3), a second rectifier circuit (b4), a second control circuit (b5), a fourth MOS tube string (b6), a fifth MOS tube string (b7), a sixth MOS tube string (b8), a second damping resistor (b9), a second red LED lamp (b10) and a positive contact (b11); Except for the positive contact (b11), the other layouts are arranged 180 degrees rotationally symmetrically with the negative power supply, which has similarities with claims 2-3 that can be understood by ordinary technicians.

5. A laminated ultra-low frequency high voltage generator boost unit PCB structure as described in claims 1-4, characterized in that: The back side of the PCB (30) is provided with a second connection line (d2) from the negative power rectifier high voltage end to the high voltage ends of the first MOS tube string (a6), the second MOS tube string (a7) and the third MOS tube string (a8), a third connection line (d3) from the positive power rectifier high voltage end to the high voltage ends of the fourth MOS tube string (b6), the fifth MOS tube string (b7) and the sixth MOS tube string (b8), a first connection line (d1) from the negative power low voltage end to the second damping resistor (b9), a fourth connection line (d4) from the second damping resistor (b9) to the positive power low voltage end, and a fifth connection line (d5) from the positive power high voltage end to the positive contact (b11). These connections make the negative power and the positive power present a reverse series relationship, and are finally output to the outside through the negative power output contact (a11) on the component surface of the PCB (30) and the positive power output contact (b11) arranged on the bottom surface of the PCB (30).

6. A laminated ultra-low frequency high voltage generator boost unit PCB structure as described in claims 1-5, characterized in that: All PCB wiring spacing needs to take into account the voltage between adjacent conductors to maximize the creepage distance, including: the voltage gradient of the first rectifier circuit (a4) is 600V, the voltage gradient of the MOS tube string (a6, a7, a8) is 200V, and the maximum output voltage of each power supply is 2400V. The wiring should be arranged at a spacing of more than mm / 200V to optimize the component density and line spacing. The current of the high-voltage generator is not more than 100mA, and the line width of 1mm basically meets the requirements.

7. A laminated ultra-low frequency high voltage generator boost unit PCB structure as claimed in claim 1, characterized in that: The PCB (30) adopts a two-layer circuit board process; the coil arranged outside the negative power supply magnetic rod plug hole (a1) is a PCB coil separately manufactured according to the PCB process, and is welded to the PCB (30) via a first coil plate welding pad (a3); another coil arranged outside the positive power supply magnetic rod plug hole (b1) is a PCB coil separately manufactured according to the PCB process, and is welded to the PCB (30) via a second coil plate welding pad (b3).

8. The laminated ultra-low frequency high voltage generator boost unit PCB structure as claimed in claim 1, characterized in that: The PCB (30) uses a circuit board with 4 or more layers, and the coil and the PCB (30) are manufactured together to obtain a simpler structure; the connecting wires d1, d2, d3, d4, and d5 are arranged in the middle layer to obtain a better insulation effect; and the heat dissipation copper foil of the MOS tube is also arranged in the middle layer to obtain a better heat dissipation effect.

9. A laminated ultra-low frequency high voltage generator boost unit PCB structure as described in claims 1-5, characterized in that: Setting as many MOS tube strings as possible can increase the output current, increasing the number of MOS in each MOS string can increase the output voltage, and setting as many MOS tubes as possible is conducive to dispersing heat.

10. The laminated ultra-low frequency high voltage generator boost unit PCB structure according to claim 1, characterized in that: The PCB (30) uses black solder resist to obtain better heat dissipation capability.

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