Photovoltaic integrated machine

Abstract

The present application relates to a photovoltaic integrated machine, and relates to the technical field of photovoltaic integrated machines, which includes a circuit board, a wiring terminal for connecting a power source is provided on the circuit board, a wiring positive pole and a wiring negative pole are provided on the wiring terminal, a positive electrode plate electrically connected to the wiring positive pole is provided on the circuit board, a negative electrode plate is provided on the side of the circuit board opposite to the positive electrode plate, and a plurality of independent shunt components for current shunting are provided on the circuit board, and the shunt components are electrically connected to the positive electrode plate, the shunt components are used to electrically connect the negative electrode plate and the positive electrode plate, and the negative electrode plate is electrically connected to the wiring negative pole. The present application shunts the current flowing into the positive electrode plate, which can help reduce the workload of the positive electrode plate, reduce the temperature generated when the positive electrode plate is working, and circulate the current through the plate, which is conducive to reducing the loss of current and increasing the efficiency of current transmission.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic integrated machines, and in particular to a photovoltaic integrated machine. Background Art

[0002] In the prior art, the photovoltaic integrated machine circuit board is connected to the battery through PCB / MOS. When in use, the current flowing through the battery is 100A-250A, which makes the circuit board easily generate a lot of heat, which is not conducive to long-term use and has room for improvement. Summary of the invention

[0003] In order to increase the heat dissipation performance of a photovoltaic integrated machine circuit board, the present application provides a photovoltaic integrated machine.

[0004] The photovoltaic integrated machine provided in this application adopts the following technical solution:

[0005] A photovoltaic integrated machine includes a circuit board, a wiring terminal for connecting a power source is arranged on the circuit board, a wiring positive electrode and a wiring negative electrode are arranged on the wiring terminal, a positive electrode plate electrically connected to the wiring positive electrode is arranged on the circuit board, a negative electrode plate is arranged on the side of the circuit board opposite to the positive electrode plate, a plurality of mutually independent shunt components for current shunting are arranged on the circuit board, and the shunt components are electrically connected to the positive electrode plate, the shunt components are used to electrically connect the negative electrode plate to the positive electrode plate, and the negative electrode plate is electrically connected to the wiring negative electrode.

[0006] By adopting the above technical solution, multiple shunt components shunt the large current flowing into the positive electrode plate, which is beneficial to reducing the workload of the positive electrode plate and increasing the heat dissipation of the positive electrode plate. Moreover, the current flows through the plate, which is beneficial to reducing the current loss and increasing the current transmission efficiency.

[0007] In addition, by dissipating the heat for the shunt components, it is beneficial to increase the service life of the photovoltaic integrated machine, and at the same time it can improve the circuit integration and facilitate maintenance.

[0008] Optionally, the shunt component includes a shunt conductive plate arranged on the circuit board, an insulating cover plate for separating the shunt conductive plate and the positive electrode plate is arranged between the shunt conductive plate and the positive electrode plate, and the insulating cover plate is covered on the shunt conductive plate.

[0009] By adopting the above technical solution, part of the current on the positive electrode plate is transmitted through the shunt conductive plate. At the same time, an insulating cover plate is arranged between the shunt conductive plate and the positive electrode plate to prevent the positive electrode plate from directly contacting the shunt conductive plate, resulting in uneven shunt current.

[0010] Optionally, the shunt conductive plate includes an inflow part and an outflow part, the inflow part is arranged under the insulating cover plate, and a plurality of MOS tubes are arranged on the inflow part and the outflow part, the MOS tube located at the inflow part is electrically connected to the positive electrode plate, and the MOS tube located at the outflow part is electrically connected to the negative electrode plate.

[0011] By adopting the above technical solution, the MOS tube controls part of the current on the positive electrode plate to be transmitted to the shunt conductive plate, and transmits the current in the shunt conductive plate to the negative electrode plate to form a loop. At the same time, the MOS tube can form a switch in the positive electrode plate to control the internal current transmission.

[0012] Optionally, a gap is provided between the connection of the MOS tube and the connection of the positive electrode plate, the shunt conductive plate and the negative electrode plate, and the MOS tube is electrically connected to the positive electrode plate, the shunt conductive plate and the negative electrode plate by welding.

[0013] By adopting the above technical solution, the connection of the MOS tube is connected to the positive electrode plate and the negative electrode plate by brazing, and a circuit is formed by the flow of brazing, which is beneficial to improving the current transmission efficiency.

[0014] Optionally, a connecting frame is provided on the circuit board, and the positive electrode of the wiring is electrically connected to the positive electrode plate through the connecting frame, and a plurality of transfer output electrodes are provided on the connecting frame, and the output electrodes are electrically connected to the positive electrode plate.

[0015] By adopting the above technical solution, the output electrode is kept away from the output through the connecting frame, which is helpful to avoid circuit short circuit caused by wrong connection between the positive electrode and the output electrode during welding connection, and can facilitate installation by workers.

[0016] Optionally, a heat sink is provided on both the positive electrode plate and the shunt conductive plate, and the heat sink is electrically connected to the connected positive electrode plate or shunt conductive plate.

[0017] By adopting the above technical solution, the heat sink is diametrically connected to the connected positive electrode plate or shunt conductive plate, and the heat sink is a metal structure, which is beneficial to improving the current passing efficiency of the positive electrode plate and the shunt conductive plate, while increasing the heat dissipation performance of the two.

[0018] Optionally, a fastener is provided on the circuit board, the fastener extends into and fixes the corresponding heat sink, and the MOS tube abuts against the corresponding heat sink.

[0019] By adopting the above technical solution, the heat sink is fixed to the circuit board by fasteners to prevent the heat sink from falling off during use. At the same time, the abutment between the MOS pipe and the heat sink can prevent the MOS tube from being accidentally touched during maintenance, which is beneficial to increasing the service life of the MOS tube.

[0020] Optionally, a connection assembly for fastening the MOS tube is provided between the heat sink and the MOS tube, the connection assembly comprising a mounting plate slidably connected to the heat sink, and the MOS tube is clamped on the mounting plate.

[0021] By adopting the above technical solution, it is helpful for workers to install the heat sink and the MOS tube on the circuit board at the same time, thereby improving the assembly efficiency of the present application.

[0022] In summary, the present application includes at least one of the following beneficial technical effects:

[0023] 1. Diverting the current flowing into the positive electrode plate can help reduce the workload of the positive electrode plate and the temperature generated when the positive electrode plate is working. The current flows through the plate, which helps reduce the current loss and increase the current transmission efficiency.

[0024] 2. The heat sink is diametrically connected to the connected positive electrode plate or shunt conductive plate, and the heat sink is a metal structure, which is beneficial to improve the current passing efficiency of the positive electrode plate and the shunt conductive plate, while increasing the heat dissipation performance of the two. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic diagram of the explosion structure of Example 1 of the present application, which mainly embodies the shunt conductive plate;

[0026] Figure 2 It is a schematic diagram of the structure of Example 1 of the present application, mainly showing the negative electrode plate;

[0027] Figure 3 yes Figure 1 A schematic diagram of the enlarged local structure at center A;

[0028] Figure 4 yes Figure 2 A magnified schematic diagram of the local structure at B in the middle;

[0029] Figure 5 It is a schematic diagram of the overall structure of Example 1 of the present application, mainly showing a heat sink;

[0030] Figure 6 It is a partial structural diagram of Embodiment 2 of the present application, mainly showing a heat sink;

[0031] Figure 7 yes Figure 6 The schematic diagram of the partial cross-section structure along the AA plane in the middle mainly shows the connection between the MOS tube and the fixed plate.

[0032] Description of the drawings: 1. Circuit board; 2. Wiring terminal; 131. Wiring positive electrode; 132. Wiring negative electrode; 3. Positive electrode plate; 301. Positive input electrode; 302. Positive output electrode; 4. Negative electrode plate; 401. Negative input electrode; 402. Connecting bump; 5. Shunt assembly; 501. MOS tube; 502. Shunt conductive plate; 5012. Shunt input electrode; 5011. Shunt output electrode; 6. Connecting frame; 601. First connecting block; 602. Second connecting block; 60 3. Transmission plate; 604. Connecting plate; 7. Insulating cover plate; 8. Heat sink; 9. Connecting assembly; 901. Snap-fit ​​block; 902. Snap-fit ​​protrusion; 903. Snap-fit ​​spring; 904. Mounting plate; 905. Fixing plate; 906. Adjusting plate; 907. Fastening spring; 908. Adjusting block; 10. Connecting rod; 11. Fixing nut; 12. Adjusting rod; 13. Tooth groove; 14. Mounting groove; 15. Sliding groove; 16. Snap-fit ​​groove; 17. Threaded rod; 18. Adjusting nut; 19. Adjusting groove. DETAILED DESCRIPTION

[0033] The following is combined with Figure 1 -Attached Figure 7 , further details of this application are given. Example 1

[0034] A photovoltaic integrated machine, referring to Figure 1 , Figure 2 , including a circuit board 1, a terminal 2 for connecting to a power source is fixedly connected to the front of the circuit board 1, and a through-connection positive electrode 131 and a negative electrode 132 are integrally arranged at the bottom of the terminal 2. A positive electrode plate 3 electrically connected to the positive electrode 131 is fixedly connected to the circuit board 1, and the positive electrode plate 3 and the terminal 2 are arranged on the same side of the circuit board 1, and a negative electrode plate 4 is fixedly connected to the back of the circuit board 1, and the negative electrode 132 is electrically connected to the negative electrode plate 4. Two independent shunt components 5 for electrically connecting the negative electrode plate 4 and the positive electrode plate 3 are fixedly connected to the circuit board 1.

[0035] Reference Figure 2 , Figure 3 , Figure 4, the circuit board 1 is fixedly connected with a connection frame 6 arranged on the same side as the wiring terminal 2, and the connection frame 6 includes a first connection block 601 and a second connection block 602, and the bottom of the first connection block 601 and the second connection block 602 are both provided with a plurality of transmission pieces 603 penetrating the circuit board 1. A gap is provided between the transmission piece 603 on the first connection block 601 at one end on the back of the circuit board 1 and the positive connection electrode 131, and the two are connected by wave soldering. In addition, one end of a connection plate 604 is fixed with bolts on the upper end face of the first connection block 601, and the other end of the connection plate 604 is fixed with bolts on the upper end face of the second connection block 602, so as to electrically connect the first connection block 601 with the second connection block 602.

[0036] Reference Figure 1 , Figure 3 , Figure 4 The positive electrode plate 3 is integrally connected to a positive input electrode 301 on one side close to the second connection block 602, and the positive input electrode 301 penetrates the circuit board 1. A gap is provided between one end of the positive input electrode 301 on the back of the circuit board 1 and the transmission sheet 603 on the second connection block 602, and the two are connected by wave soldering, thereby transmitting current to the positive electrode plate 3.

[0037] Reference Figure 1 The positive electrode plate 3 is covered on two oppositely arranged shunt components 5, an insulating cover plate 7 is installed between the shunt component 5 and the positive electrode plate 3, and the insulating cover plate 7 is covered on the two shunt components 5, and the positive electrode plate 3 is abutted against the insulating cover plate 7.

[0038] The current shunt component 5 includes two transmission groups, namely an input transmission group and an output transmission group. Each transmission group is provided with four MOS transistors 501, wherein the MOS transistors 501 are provided with three electrodes penetrating the circuit board 1, including a gate in the middle and drains on both sides.

[0039] Reference Figure 1 , Figure 4 The positive electrode plate 3 is integrally connected to the side of the transmission group close to the positive electrode output electrode 302 corresponding to the number of MOS tubes 501 in the input transmission group, and the positive electrode output electrode 302 passes through the circuit board 1. In addition, the positive electrode output electrode 302 is arranged close to the gate of the MOS tube 501, and a gap is arranged between the positive electrode output electrode 302 and the gate of the MOS tube 501 in the input transmission group. The positive electrode output electrode 302 is wave-welded with the gate of the MOS tube 501 in the input transmission group.

[0040] The shunt component 5 also includes a shunt conductive plate 502 fixedly connected to the circuit board 1, and the shunt conductive plate 502 is arranged between the circuit board 1 and the insulating cover plate 7. The shunt conductive plate 502 is integrally connected to one end of the input transfer group close to the input transfer group with a shunt input electrode 5012 penetrating the circuit board 1, and a gap is arranged between the shunt input electrode 5012 and the two drains of the MOS tube 501 in the input transfer group, and is wave-welded with one of the drains.

[0041] One end of the shunt conductive plate 502 away from the input transmission group is integrally connected with a transformer electrode, and the transformer electrode is bent toward the circuit board 1 and penetrates the circuit board 1 .

[0042] One end of the shunt conductive plate 502 close to the output transfer group is integrally connected with a shunt output electrode 5011 penetrating the circuit board 1, and a gap is provided between the shunt output electrode 5011 and the two drains of the MOS tube 501 in the output transfer group, and is wave-welded with one of the drains.

[0043] A number of negative input electrodes 401 corresponding to the number of MOS tubes 501 in the output transfer group are integrally connected to the negative electrode plate 4. The negative input electrode 401 is arranged close to the gate of the MOS tube 501, and a gap is arranged between the gate of the corresponding MOS tube 501. The negative input electrode 401 is wave-welded to the gate of the adjacent MOS tube 501.

[0044] Reference Figure 4 The negative electrode plate 4 is integrally connected to one end of the negative electrode 132 in the terminal 2 with a connecting protrusion 402, and a gap is provided between the side wall of the connecting protrusion 402 and the negative electrode 132. In addition, the connecting protrusion 402 and the negative electrode 132 are wave-welded.

[0045] Reference Figure 1 , Figure 2 , Figure 5 , the positive electrode plate 3 and the shunt conductive plates 502 of the two shunt components 5 are all provided with heat sinks 8, and the three heat sinks 8 are not mutually conductive, and the MOS tubes 501 in the output transmission group and the input transmission group are all in contact with one side of the corresponding heat sink 8. A mounting hole is provided at the bottom of the heat sink 8, and the positive electrode plate 3, the negative electrode plate 4, the shunt conductive plate 502, and the insulating cover plate 7 are all provided with clearance holes at the positions corresponding to the mounting holes, and the circuit board 1 is provided with fixing holes at the positions corresponding to the mounting holes.

[0046] A fastener is arranged in the fixing hole, and the fastener passes through the fixing hole and the clearance hole and then extends into the mounting hole to fix the heat sink and the circuit board. At the same time, the insulating cover plate 7 is fixed between the two shunt conductive plates 502 and the positive electrode plate 3 by fasteners, wherein the fasteners are bolts or pins.

[0047] The implementation principle of the embodiment 1 of the present application is as follows: after the current is transmitted from the positive electrode of the connection terminal 2 to the positive electrode plate 3, the current flowing into the positive electrode plate 3 is between 100A and 250A. Then, the output current is shunted by the shunting conductive plate 502 to reduce the magnitude of the current transmitted to the MOS tube 501, thereby reducing the heat energy generated by the MOS tube 501 when working.

[0048] The electrodes for transmitting current between the positive electrode plate 3 and the MOS tube 501, between the negative electrode plate 4 and the MOS tube 501, and between the shunt conductive plate 502 and the MOS tube 501 are all provided with gaps, and are connected by wave soldering after assembly, so that the current flows from the soldering electrode to increase the cross-sectional area of ​​the conductor, thereby increasing the efficiency of the MOS tube 501 in transmitting current. The heat sink 8 is directly connected to the positive electrode plate 3 and the two shunt conductive plates 502, so that the current can flow into the heat sink 8, thereby increasing the conductive area. Example 2

[0049] A photovoltaic integrated machine, referring to Figure 6 , Figure 7 , which is different from the first embodiment in that a connection assembly 9 is provided between the MOS tube 501 and the heat sink 8, and the connection assembly 9 includes two clamping blocks 901 fixedly connected on the side of the MOS tube 501 close to the heat sink 8, and a clamping groove 16 is provided in the clamping block 901. A bullet-shaped clamping protrusion 902 is slidably connected in the clamping groove 16, and a clamping spring 903 is fixedly connected to one end of the clamping protrusion 902 in the clamping groove 16, and the other end of the clamping spring 903 is fixedly connected to the bottom of the clamping groove 16.

[0050] A mounting groove 14 is provided on the side of the heat sink 8 close to the MOS tube 501, a mounting plate 904 is installed in the mounting groove 14, a fixing plate 905 is slidably connected in the mounting plate 904, wherein a sliding groove 15 corresponding to the number of the clamping blocks 901 is provided on the side of the fixing plate 905 close to the MOS tube 501, and grooves corresponding to the number of the MOS tubes 501 are provided on the two opposite inner walls of the sliding groove 15, and the positions of the grooves correspond to the positions on the circuit board 1 for inserting and installing the MOS tube 501. The clamping block 901 can slide along the sliding groove 15, and after being installed in place, the clamping protrusion 902 extends into the groove, thereby fixing the MOS tube 501 and the fixing plate 905.

[0051] The mounting plate 904 is fixedly connected with an adjustment plate 906 above the fixing plate 905, and a threaded rod 17 extending into the fixing plate 905 is fixedly connected to the adjustment plate 906. An adjustment nut 18 is rotatably connected above the fixing plate 905, and the adjustment nut 18 is sleeved outside the threaded rod 17 and threadedly connected to the threaded rod 17. Rotating the adjustment nut 18 allows the fixing plate 905 to slide along the threaded rod 17.

[0052] Four fastening springs 907 are fixedly connected to the side of the mounting plate 904 away from the fixed plate 905, and the fastening springs 907 are used to fix the mounting plate 904 to the bottom of the mounting groove 14. An adjustment groove 19 is provided at the bottom of the mounting groove 14, and two adjustment blocks 908 are fixedly connected to the side of the mounting plate 904 away from the fixed plate 905, and one of the adjustment blocks 908 is provided with a tooth groove 13. The adjustment block 908 extends into the adjustment groove 19, and the inclined surface of the adjustment block 908 is arranged opposite to the bottom of the adjustment groove 19.

[0053] An adjusting rod 12 made of insulating material is provided on one side of the mounting plate 904 away from the fixing plate 905 among the three heat sinks 8, and the adjusting rod is provided between two adjusting blocks 908. A gear meshing with the tooth groove 13 is sleeved on the adjusting rod 12, so that when the adjusting rod 12 rotates in a certain direction, the gear drives the adjusting rod 12 to move closer to the circuit, and contacts the adjusting block 908, so that the adjusting block 908 slides away from the bottom of the adjusting groove 19.

[0054] One end of the adjusting rod 12 is sleeved with a fixing nut 11 , which is threadedly connected to the adjusting rod 12 . After being installed in place, the fixing nut 11 abuts against the outer heat sink 8 , thereby fixing the adjusting rod 12 .

[0055] A connecting rod 10 is disposed above the three heat sinks 8 and the adjusting rod 12 , and the connecting rod 10 passes through the three heat sinks 8 . The connecting rod 10 is made of insulating material.

[0056] The implementation principle of the second embodiment of the present application is as follows: during installation, the heat sink 8 and the MOS tube 501 can be assembled first, and then the heat sink 8 to be installed can be assembled by sleeves of the insulating connecting rod 10 and the adjusting rod 12. After the assembly is completed, the heat sink 8 is installed in the reserved position so that the MOS tube 501 can be inserted into the remaining hole of the circuit board 1. If the installation position of the heat sink 8 is offset, the MOS tube 501 can be adjusted to a suitable position by the adjusting rod 12 and the adjusting nut 18, and the MOS tube 501 can be inserted, so as to reduce the damage to the MOS tube 501 during installation.

[0057] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A photovoltaic integrated machine, comprising a circuit board (1), wherein the circuit board (1) is provided with a connection terminal (2) for connecting to a power source, wherein the connection terminal (2) is provided with a positive connection electrode (131) and a negative connection electrode (132), wherein: The circuit board (1) is provided with a positive electrode plate (3) electrically connected to the wiring positive electrode (131); the circuit board (1) is provided with a negative electrode plate (4) on a side opposite to the positive electrode plate (3); the circuit board (1) is provided with a plurality of mutually independent shunt components (5) for current shunt, and the shunt components (5) are electrically connected to the positive electrode plate (3); the shunt components (5) are used to electrically connect the negative electrode plate (4) and the positive electrode plate (3); and the negative electrode plate (4) is electrically connected to the wiring negative electrode (132); The shunt component (5) comprises a shunt conductive plate (502) arranged on the circuit board (1), an insulating cover plate (7) for separating the shunt conductive plate (502) and the positive electrode plate (3) being arranged between the shunt conductive plate (502) and the positive electrode plate (3), and the insulating cover plate (7) is arranged on the shunt conductive plate (502); The shunt conductive plate (502) comprises an inlet portion and an outlet portion, the inlet portion is arranged below the insulating cover plate (7), and a plurality of MOS tubes (501) are arranged on the inlet portion and the outlet portion, the MOS tubes (501) located at the inlet portion are electrically connected to the positive electrode plate (3), and the MOS tubes (501) located at the outlet portion are electrically connected to the negative electrode plate (4).

2. The photovoltaic integrated machine according to claim 1, characterized in that: A gap is provided between the connection point of the MOS tube (501) and the connection points of the positive electrode plate (3), the shunt conductive plate (502) and the negative electrode plate (4), and the MOS tube (501) is electrically connected to the positive electrode plate (3), the shunt conductive plate (502) and the negative electrode plate (4) by welding.

3. The photovoltaic integrated machine according to claim 1, characterized in that: The circuit board (1) is provided with a connecting frame (6), the positive connection electrode (131) is electrically connected to the positive electrode plate (3) via the connecting frame (6), and a plurality of transfer output electrodes are provided on the connecting frame (6), and the output electrodes are electrically connected to the positive electrode plate (3).

4. The photovoltaic integrated machine according to claim 1, characterized in that: A heat sink (8) is provided on both the positive electrode plate (3) and the shunt conductive plate (502), and the heat sink (8) is electrically connected to the connected positive electrode plate (3) or the shunt conductive plate (502).

5. The photovoltaic integrated machine according to claim 4, characterized in that: The circuit board (1) is provided with a fastener, the fastener extends into and fixes the corresponding heat sink (8), and the MOS tube (501) abuts against the corresponding heat sink (8).

6. The photovoltaic integrated machine according to claim 5, characterized in that: A connection assembly (9) for fastening the MOS tube (501) is provided between the heat sink (8) and the MOS tube (501), the connection assembly (9) comprising a mounting plate (904) slidably connected to the heat sink (8), and the MOS tube (501) is clamped on the mounting plate (904).

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