Display module, manufacturing method thereof and display device

Abstract

The invention relates to a display module, a manufacturing method thereof and a display device. The display module comprises a substrate; the array layer comprises a display area and a bending area, the display area is located on one side of the substrate, and the bending area is bent towards the side wall of the substrate and located on the side wall of the substrate; the light-emitting layer is located on the side, away from the substrate, of the array layer; the packaging layer is located on the side, away from the array layer, of the light-emitting layer, the packaging layer wraps the light-emitting layer, and the orthographic projection, facing the substrate, of the packaging layer covers the orthographic projection, facing the substrate, of the array layer; thus, when the splicing sides of the two display modules are spliced, the frame area of the splicing area is greatly reduced, seamless splicing is basically formed, the impression is improved, meanwhile, due to the fact that the display area of the light-emitting layer is not bent at all, the visual angle of the splicing area of the display module can be prevented from being changed, and the display effect is improved. And therefore, the good impression is further ensured.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a manufacturing method thereof, and a display device. Background Art

[0002] With the rapid development of OLED (Organic Light Emitting Diode) display technology, OLED display devices have gradually become the mainstream of display technology with many advantages such as ultra-thin, light weight, no radiation, stable performance, etc. At present, large-size OLED display devices can already be hundreds of inches in size, but large-size OLED display devices are usually made by splicing multiple smaller-size display modules. However, display modules usually have frames. Therefore, in large-size OLED display devices, the splicing area of ​​two adjacent display modules will form a large-area frame, resulting in poor display perception of large-size OLED display devices for users. Summary of the invention

[0003] Based on this, it is necessary to provide a display module and a manufacturing method thereof, as well as a display device that can solve the problem of splicing borders and improve the viewing experience.

[0004] In a first aspect, a display module is provided, wherein the display module comprises:

[0005] substrate;

[0006] An array layer, the array layer comprising a display area and a bending area, wherein the display area is located at one side of the substrate, and the bending area is bent toward the side wall of the substrate and is located at the side wall of the substrate;

[0007] A light-emitting layer, located on a side of the array layer away from the substrate;

[0008] The encapsulation layer is located on a side of the light-emitting layer away from the array layer, the encapsulation layer covers the light-emitting layer, and the orthographic projection of the encapsulation layer toward the substrate covers the orthographic projection of the array layer toward the substrate.

[0009] In one embodiment, the array layer located on one side of the substrate and the array layer located on the sidewall of the substrate are perpendicular to each other.

[0010] In one of the embodiments, along the thickness direction of the display module, the surface of the side wall of the bending region away from the substrate is flush with the side wall of the opposite encapsulation layer;

[0011] Optionally, the display module further comprises a polarizer layer and an optical adhesive layer stacked in sequence on a side of the encapsulation layer away from the light-emitting layer, and along the thickness direction of the display module, a surface of a side wall of the bending region away from the substrate is flush with the opposite side walls of the polarizer layer and the optical adhesive layer;

[0012] Optionally, the display module further comprises a touch layer located between the encapsulation layer and the polarizer layer, and along the thickness direction of the display module, a surface of the side wall of the bending region away from the substrate is flush with a side wall of the touch layer opposite thereto;

[0013] Optionally, the substrate includes a polyimide layer and a back side protective film layer, and the polyimide layer is located between the back side protective film layer and the array layer.

[0014] In one of the embodiments, the display module further includes a blocking dam;

[0015] Along the direction of the plane where the display module is located, the blocking dam is located between the light-emitting layer and the encapsulation layer; or,

[0016] Along the direction of the plane where the display module is located, the light-emitting layer includes a plurality of light-emitting units arranged in an array, and the blocking dam is located between the side wall of the light-emitting layer and the light-emitting unit adjacent to the side wall of the light-emitting layer.

[0017] In one embodiment, the barrier dam comprises a bottom, a barrier portion and a top connected in sequence;

[0018] The bottom is located at the array layer, the top is located at the encapsulation layer, and the orthographic projections of the top and the blocking portion along the thickness direction of the display module are both located within the orthographic projection of the bottom along the thickness direction of the display module;

[0019] Optionally, along the thickness direction of the display module, the bottom portion overlaps with the bending area;

[0020] Optionally, the material of the barrier dam is a conductive material;

[0021] Optionally, the array layer includes an anode layer, the bottom portion is located in the same layer as the anode layer and is spaced apart from the anode layer, the light-emitting layer includes a cathode layer, and the top portion is connected to the cathode layer.

[0022] In one of the embodiments, the display module further includes a shielding structure, and the shielding structure is located in the array layer, and the shielding structure overlaps with the display area and the bending area.

[0023] In one of the embodiments, a portion of the shielding structure and the bending region are bent together to the side wall of the substrate, wherein the shielding structure and the array layer are both made of flexible materials.

[0024] In a second aspect, a display device is provided, comprising at least two display modules as described in the first aspect; the bending regions of at least two of the display modules are spliced ​​with each other, and along the thickness direction of the display module, the encapsulation layers of at least two of the display modules opposite to the bending regions are spliced ​​with each other.

[0025] In one of the embodiments, the display module further includes a touch layer, a polarizing layer, an optical adhesive layer and a cover layer which are sequentially stacked on a side of the encapsulation layer away from the light-emitting layer, and along the thickness direction of the display module, a surface of the side wall of the bending zone away from the substrate is flush with the side walls of the touch layer, the polarizing layer, the optical adhesive layer and the cover layer relative to each other.

[0026] In a third aspect, a method for manufacturing a display module is provided, wherein the method comprises:

[0027] An initial display module is provided, wherein the initial display module comprises a display area and a bending area, and the initial display module comprises a substrate, an array layer, a light-emitting layer and a packaging layer which are stacked in sequence, wherein the packaging layer covers the light-emitting layer;

[0028] removing the substrate and part of the packaging layer in the bending area;

[0029] The array layer in the bending area is bent toward the side wall of the substrate to be located on the side wall of the substrate, wherein after bending, the orthographic projection of the packaging layer toward the substrate covers the orthographic projection of the array layer toward the substrate.

[0030] The display module and its manufacturing method, and the display device, wherein the display module includes a substrate, an array layer, a light-emitting layer, and an encapsulation layer. Since the array layer includes a display area and a bending area, the display area is located on one side of the substrate, the bending area is bent toward the side wall of the substrate and is located on the side wall of the substrate, the light-emitting layer is located on the side of the array layer away from the substrate, the encapsulation layer is located on the side of the light-emitting layer away from the array layer, the encapsulation layer covers the light-emitting layer, and the orthographic projection of the encapsulation layer toward the substrate covers the orthographic projection of the array layer toward the substrate, so that the non-display area of ​​the substrate opposite to the bending area and the non-display area of ​​the light-emitting layer opposite to the bending area are basically completely removed, so as to facilitate the bending of the array layer, and at the same time, the bending area of ​​the array layer is bent to the side wall of the substrate, thereby greatly reducing the frame of the splicing side of the display module, so that when the splicing sides of the two display modules are spliced, the frame area of ​​the splicing area is greatly reduced, and basically seamless splicing is formed, thereby improving the viewing experience, and at the same time, since the display area of ​​the light-emitting layer does not have any bending, it is possible to avoid the visual angle of the splicing area of ​​the display module from changing, thereby further ensuring a good viewing experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 This is a schematic top view of a display module according to an embodiment;

[0033] Figure 2 for Figure 1 One of the cross-sectional diagrams along line SS';

[0034] Figure 3 for Figure 2 A schematic diagram of the structure when the middle array layer has not yet been bent to the side wall of the substrate;

[0035] Figure 4 The second cross-sectional schematic diagram of the display module along the line SS' of an embodiment;

[0036] Figure 5A The third cross-sectional schematic diagram of a display module along line SS' of an embodiment;

[0037] Figure 5B The fourth cross-sectional schematic diagram of the display module along the line SS' of an embodiment;

[0038] Figure 6 The second schematic top view of a display module according to an embodiment;

[0039] Figure 7for Figure 6 The fifth schematic cross-sectional view along the SS' line;

[0040] Figure 8 The sixth cross-sectional schematic diagram of the display module along the line SS' of an embodiment;

[0041] Fig. 9 The third schematic top view of a display module according to an embodiment;

[0042] Fig.10 for Fig. 9 Figure 7 of the cross-sectional view along line SS';

[0043] Fig.11 is one of the cross-sectional schematic diagrams of a display device according to an embodiment;

[0044] Fig.12 is a second cross-sectional schematic diagram of a display device according to an embodiment;

[0045] Fig.13 is a schematic flow chart of a method for manufacturing a display module according to an embodiment;

[0046] Fig.14 This is one of the structural schematic diagrams involved in a method for manufacturing a display module according to an embodiment;

[0047] Fig.15 The second structural schematic diagram involved in the manufacturing method of the display module of one embodiment;

[0048] Fig.16 This is a third structural schematic diagram involved in a method for manufacturing a display module according to an embodiment.

[0049] Fig.17 This is a fourth structural schematic diagram involved in a method for manufacturing a display module according to an embodiment.

[0050] Description of reference numerals:

[0051] 110 - substrate, 120 - array layer, 130 - light-emitting layer, 140 - packaging layer, 150 - polarizer layer, 160 - optical adhesive layer, 170 - touch layer, 180 - blocking dam, 181 - bottom, 182 - blocking part, 183 - top, 190 - shielding structure. DETAILED DESCRIPTION

[0052] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0053] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0054] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0055] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0056] It can be understood that “at least one” means one or more, “plurality” means two or more, and “at least part of an element” means part or all of an element.

[0057] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.

[0058] The display module provided in the embodiment of the present application may be an OLED display module, and the display module may be used to be spliced ​​with other display modules or display products to form a new display product.

[0059] In an exemplary embodiment, in combination Figure 1 and Figure 2 , a display module is provided, the display module includes a display area AA and a non-display area NAA, the display module includes a substrate 110, an array layer 120, a light-emitting layer 130 and an encapsulation layer 140 which are stacked in sequence.

[0060] The substrate 110 mainly plays a supporting role. The substrate 110 can be a hard substrate made of materials such as glass or plastic, or a flexible substrate made of materials such as polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyarylate, polyimide (PI), polycarbonate (PC) or cellulose acetate propionate (CAP).

[0061] The array layer 120 includes a display area AA and a bending area BB. The array layer 120 of the display area AA is located on one side of the substrate 110. The array layer 120 of the bending area BB is bent toward the side wall of the substrate 110 and is located on the side wall of the substrate 110. The array layer 120 may include a plurality of pixel circuits arranged in an array and a plurality of anodes arranged in an array. The pixel circuit is used to drive the organic light-emitting diode to emit light. The anode may be the anode of the organic light-emitting diode. The array layer 120 may also include a plurality of metal traces, etc. Exemplarily, the array layer 120 may include a plurality of buffer layers, a plurality of metal layers, a plurality of insulating layers, a planarization layer, and an anode layer stacked on the substrate 110, wherein the anode layer includes a plurality of anodes arranged in an array.

[0062] At least part of the peripheral side of the display module is used for splicing, that is, at least part of the peripheral side of the display module serves as a splicing side of the display module; Figure 1 The display module is exemplarily shown in the figure as being in the shape of a cuboid, so that the peripheral side of the display module may include four sides, and one of the sides is used for splicing, that is, one of the sides serves as the splicing side of the display module. Figure 3 , when the array layer 120 in the bending area BB has not yet bent to the side wall of the substrate 110, the bending area BB of the array layer 120 is located in the non-display area NAA on the splicing side of the display module; it can also be understood that only the array layer 120 on the splicing side of the display module includes the bending area BB, and the array layer 120 in the bending area BB is bent to the side wall of the substrate 110, while the array layer 120 on the non-splicing side of the display module does not need to be provided with a bending area BB, and does not need to be bent to the side wall of the substrate 110.

[0063] The light emitting layer 130 is located on a side of the array layer 120 away from the substrate 110. The light emitting layer 130 may include a plurality of organic light emitting diodes arranged in an array, and each organic light emitting diode is located in the display area AA.

[0064] The encapsulation layer 140 is located on the side of the light-emitting layer 130 away from the array layer 120, and the encapsulation layer 140 covers the light-emitting layer 130; on the splicing side of the display module, the orthographic projection of the encapsulation layer 140 toward the substrate 110 covers the orthographic projection of the array layer 120 toward the substrate 110 and covers the substrate 110. The encapsulation layer 140 may be a thin film encapsulation layer 140, and the encapsulation layer 140 covers the surface of the light-emitting layer 130 away from the array layer 120 and covers the sidewall of the light-emitting layer 130, so as to encapsulate the light-emitting layer 130.

[0065] In the embodiment of the present application, the thickness of the non-display area NAA on the splicing side of the display module is thinned, that is, the encapsulation layer 140 and the substrate 110 of the non-display area NAA on the splicing side are basically completely removed and only the array layer 120 is retained, and the bending area BB of the array layer 120 is bent to the side wall of the substrate 110, thereby greatly reducing the frame of the splicing side of the display module, so that when the splicing sides of two display modules are spliced, the frame area of ​​the splicing area is greatly reduced, and at the same time, in order to be able to further reduce the frame of the splicing side of the display module, the orthographic projection of the encapsulation layer 140 toward the substrate 110 is arranged to cover the orthographic projection of the array layer 120 toward the substrate 110 and cover the substrate 110, so that when the splicing sides of the two display modules are spliced, basically seamless splicing is formed, and the embodiment of the present application thereby improves the viewing experience, and at the same time, because the display area AA of the light-emitting layer 130 does not have any bending, it is possible to avoid changes in the visual angle of the splicing area of ​​the display module, thereby further ensuring a good viewing experience.

[0066] In an exemplary embodiment, continue to refer to Figure 2 The array layer 120 located on one side of the substrate 110 and the array layer 120 located on the sidewall of the substrate 110 are perpendicular to each other.

[0067] In the present embodiment, in the process of thinning the thickness of the non-display area NAA on the splicing side of the display module, since the encapsulation layer 140 and the substrate 110 of the non-display area NAA on the splicing side are basically completely removed and only the array layer 120 is retained, and in the direction pointing to the non-display area NAA along the display area AA, after thinning, the side wall of the encapsulation layer 140 is convex relative to the side wall of the substrate 110, which is beneficial to the bending of the array layer 120, and then the array layer 120 located on one side of the substrate 110 is perpendicular to the array layer 120 located on the side wall of the substrate 110, which is beneficial to greatly reduce the frame and gap of the splicing area when the splicing sides of the two display modules are spliced, and greatly improve the viewing experience without affecting any visual angle of the display area AA.

[0068] In an exemplary embodiment, continue to refer to Figure 2 Along the thickness direction of the display module, the surface of the bending region BB away from the side wall of the substrate 110 is flush with the opposite side wall of the encapsulation layer 140 .

[0069] In the present embodiment, on the splicing side of the display module, the surface of the side wall of the array layer 120 away from the substrate 110 is flush with the side wall of the encapsulation layer 140. This makes it possible for the array layers 120 on the side walls of the substrate 110 of the splicing sides of the two display modules to be in seamless contact when the splicing sides of the two display modules are spliced ​​together, and the side walls of the encapsulation layer 140 on the splicing sides of the two display modules are also in corresponding seamless contact. This further greatly reduces the borders and gaps in the splicing area, and further greatly improves the viewing experience without affecting any visual angle of the display area AA.

[0070] In an exemplary embodiment, referring to Figure 4 The display module further includes a polarizer layer 150 and an optical adhesive layer 160 which are sequentially stacked on the side of the encapsulation layer 140 away from the light-emitting layer 130. Along the thickness direction of the display module, the surface of the side wall of the bending area BB away from the substrate 110 is flush with the opposite side walls of the polarizer layer 150 and the optical adhesive layer 160.

[0071] In this embodiment, the display module also includes a polarizer layer 150 and an optical adhesive layer 160. In the process of thinning the thickness of the non-display area NAA on the splicing side of the display module, the polarizer layer 150 and the optical adhesive layer 160 of the non-display area NAA on the splicing side are also basically completely removed together with the encapsulation layer 140, and on the splicing side of the display module, the surface of the side wall of the array layer 120 away from the substrate 110 is flush with the side walls of the polarizer layer 150 and the optical adhesive layer 160. This makes it possible that when the splicing sides of the two display modules are spliced, the array layers 120 on the side walls of the substrate 110 on the splicing sides of the two display modules are in seamless contact, and the side walls of the polarizer layers 150 and the optical adhesive layer 160 on the splicing sides of the two display modules are also in corresponding seamless contact. In this way, the borders and gaps in the splicing area are further greatly reduced, and the viewing experience is greatly improved without affecting any visual angle of the display area AA.

[0072] In an exemplary embodiment, referring to Figure 5A The display module further includes a touch layer 170 located between the encapsulation layer 140 and the polarizer layer 150 . Along the thickness direction of the display module, the surface of the side wall of the bending area BB away from the substrate 110 is flush with the opposite side wall of the touch layer 170 .

[0073] In the present embodiment, the display module also includes a touch layer 170. In the process of thinning the thickness of the non-display area NAA on the splicing side of the display module, the touch layer 170 of the non-display area NAA on the splicing side is also basically completely removed together with the encapsulation layer 140, and on the splicing side of the display module, the surface of the side wall of the array layer 120 away from the substrate 110 is flush with the side wall of the touch layer 170. This makes it possible for the array layers 120 on the side walls of the substrate 110 of the splicing sides of the two display modules to be in seamless contact when the splicing sides of the two display modules are spliced, and the side walls of the touch layer 170 on the splicing sides of the two display modules are also in corresponding seamless contact. This further greatly reduces the borders and gaps in the splicing area, and further greatly improves the viewing experience without affecting any visual angle of the display area AA.

[0074] In an exemplary embodiment, referring to Figure 5B The display module further includes a back protection film layer, which is located on a side of the substrate 110 away from the array layer 120 . Along the thickness direction of the display module, the side wall of the back protection film layer is flush with the side wall of the substrate 110 .

[0075] In this embodiment, a back protective film layer (Back Protect Film, BPF) is attached to the side of the substrate 110 away from the array layer 120 to protect the substrate, especially when the substrate 110 is a flexible PI substrate, the back protective film layer can play a good protective role on the flexible PI substrate. When the substrate 110 of the non-display area NAA on the splicing side is basically completely removed along the thickness direction of the display module, the back protective film layer of the non-display area NAA on the splicing side is also basically completely removed, so that the side wall of the back protective film layer is flush with the side wall of the substrate 110, thereby ensuring that the bending area BB of the array layer 120 is completely bent to the side wall of the substrate 110 and the side wall of the back protective film layer, thereby greatly reducing the frame of the splicing side of the display module, so that when the splicing sides of two display modules are spliced, the frame area of ​​the splicing area is greatly reduced.

[0076] In an exemplary embodiment, referring to Figure 6 The display module further includes a barrier dam 180, which can be disposed on the peripheral side of the display module or only on the splicing side of the display module. Figure 6 The blocking dam 180 is exemplarily shown in the figure as being only provided on the splicing side of the display module; since the thickness of the non-display area NAA on the splicing side of the display module is thinned, the provision of the blocking dam 180 can improve the packaging reliability of the side wall of the light-emitting layer 130, ensuring that external water and oxygen are not easy to penetrate from the side wall of the light-emitting layer 130.

[0077] refer to Figure 7, along the direction of the plane where the display module is located, the blocking dam 180 is located between the light emitting layer 130 and the encapsulation layer 140 .

[0078] In this embodiment, since it is very likely that a large amount of the encapsulation layer 140 will be removed during the process of thinning the thickness of the non-display area NAA on the splicing side of the display module, a blocking dam 180 is provided between the light-emitting layer 130 and the encapsulation layer 140 to ensure the encapsulation reliability of the side wall of the light-emitting layer 130.

[0079] refer to Figure 8 Along the direction of the plane where the display module is located, the light-emitting layer 130 includes a plurality of light-emitting units arranged in an array, and the blocking dam 180 is located between the side wall of the light-emitting layer 130 and the light-emitting units adjacent to the side wall of the light-emitting layer 130 .

[0080] In this embodiment, the light-emitting unit may be an organic light-emitting diode. A pixel definition layer PDL is usually provided between the sidewall of the light-emitting layer 130 and the light-emitting unit adjacent to the sidewall of the light-emitting layer 130 to define the area of ​​the light-emitting unit. The barrier dam 180 may be located in the pixel definition layer PDL, thereby better preventing external water and oxygen from invading the light-emitting unit of the display area AA.

[0081] Combination Figure 7 and Figure 8 The blocking dam 180 includes a bottom 181, a blocking portion 182 and a top 183 which are connected in sequence; the bottom 181 is located at the array layer 120, the top 183 is located at the packaging layer 140, and the orthographic projections of the top 183 and the blocking portion 182 along the thickness direction of the display module are both located within the orthographic projection of the bottom 181 along the thickness direction of the display module.

[0082] In this embodiment, the blocking dam 180 can be manufactured synchronously with the array layer 120, that is, the blocking dam 180 is manufactured synchronously during the process of manufacturing the array layer 120; after the synchronous manufacturing of the array layer 120 and the blocking dam 180 is completed, the light-emitting layer 130 and the packaging layer 140 are manufactured in sequence; in this way, the bottom 181 of the blocking dam 180 can be located in the array layer 120 and the top 183 can be located in the packaging layer 140, so as to improve the packaging reliability of the side wall of the light-emitting layer 130. Since the substrate 110 of the non-display area NAA on the splicing side of the display module needs to be basically completely removed during the process of thinning the thickness of the non-display area NAA on the splicing side, and the process adopted in the removal process can generally be laser etching or plasma etching, the area of ​​the bottom 181 of the blocking dam 180 is set to be larger, and the orthographic projections of the top 183 and the blocking part 182 along the thickness direction of the display module are both located within the orthographic projection of the bottom 181 along the thickness direction of the display module, so that the blocking dam 180 can play a shielding role to prevent the light-emitting layer 130 from being damaged by laser etching or plasma etching during the process of removing the substrate 110 of the non-display area NAA on the splicing side.

[0083] In an exemplary embodiment, along the thickness direction of the display module, the bottom 181 overlaps with the bending area BB; in this way, the reliability of the shielding effect of the blocking dam 180 is further ensured, and the light-emitting layer 130 is better prevented from being damaged by laser etching or plasma etching during the process of removing the substrate 110 of the non-display area NAA on the splicing side.

[0084] In an exemplary embodiment, the material of the barrier dam 180 is a conductive material; thus, in addition to improving packaging reliability and shielding, the barrier dam 180 can also be used for other purposes, such as acting as a cathode connecting line of the cathode of an organic light-emitting diode, thereby saving the production of the original cathode connecting line in the display module, thereby saving the cost of the display module.

[0085] In an exemplary embodiment, the array layer 120 includes an anode layer, the bottom 181 of the barrier dam 180 is located in the same layer as the anode layer and is spaced apart from the anode layer, the light emitting layer 130 includes a cathode layer, and the top 183 is connected to the cathode layer.

[0086] In this embodiment, the barrier dam 180 can be manufactured simultaneously with the anode layer, that is, the barrier dam 180 is manufactured simultaneously during the process of manufacturing the anode layer. The bottom 181 of the barrier dam 180 is located in the same layer as the anode layer and is spaced apart from the anode layer. The barrier portion 182 of the barrier dam 180 is used to connect the bottom 181 and the top 183 of the barrier dam 180. The top 183 of the barrier dam 180 is connected to the cathode layer, so that the barrier dam 180 can serve as a cathode connection line of the cathode of the organic light emitting diode.

[0087] In an exemplary embodiment, in combination Fig. 9 and Fig.10 The display module further includes a shielding structure 190 , which is located in the array layer 120 , and the shielding structure 190 overlaps with the display area AA and the bending area BB.

[0088] In this embodiment, since the substrate 110 of the non-display area NAA on the splicing side of the display module needs to be substantially completely removed during the process of thinning the thickness of the non-display area NAA on the splicing side, and the process used in the removal process can generally be laser etching or plasma etching, a shielding structure 190 is made in the array layer 120, and the shielding structure 190 prevents the laser etching or plasma etching from damaging the light-emitting layer 130 during the process of removing the substrate 110 of the non-display area NAA on the splicing side. And the area of ​​the shielding structure 190 is set to be relatively large, and the shielding structure 190 overlaps with the display area AA and the bending area BB, so that reliable shielding can be achieved. In addition, illustratively, the shielding structure 190 can be located in a film layer in the array layer 120 that is closer to the substrate 110, for example, in a buffer layer, so as to better shield the light-emitting layer 130 from damage by laser etching or plasma etching.

[0089] In an exemplary embodiment, a portion of the shielding structure 190 and the bending region BB are bent together to the sidewall of the substrate 110 , wherein the shielding structure 190 and the array layer 120 are both made of flexible materials.

[0090] In this embodiment, the material of the shielding structure 190 is set to be a flexible material. When the area of ​​the shielding structure 190 is set to be larger, part of the shielding structure 190 and the bending area BB can be bent together to the side wall of the substrate 110. This can achieve reliable shielding without affecting the bending of the array layer 120.

[0091] In an exemplary embodiment, referring to Fig.11 , a display device is provided, which may include at least two display modules provided in any of the above embodiments, the bending regions BB of at least two display modules are spliced ​​with each other, and along the thickness direction of the display module, the packaging layers 140 of at least two display modules opposite to the bending regions BB are spliced ​​with each other.

[0092] In this embodiment, since the frame of the splicing side of a single display module is greatly reduced, when the splicing sides of two display modules are spliced ​​together, the frame area of ​​the splicing area is greatly reduced. At the same time, in order to further reduce the frame of the splicing side of the display module, the encapsulation layer 140 is arranged to have an orthographic projection toward the substrate 110 covering the orthographic projection of the array layer 120 toward the substrate 110 and covering the substrate 110. This allows a basically seamless splicing to be formed when the splicing sides of the two display modules are spliced ​​together. The embodiment of the present application thus improves the viewing experience. At the same time, since the display area AA of the light-emitting layer 130 does not have any bends, it is possible to avoid changes in the visual angle of the splicing area of ​​the display module, thereby further ensuring a good viewing experience.

[0093] In an exemplary embodiment, referring to Fig.12The display module further includes a touch layer 170, a polarizing layer, an optical adhesive layer 160 and a cover layer which are sequentially stacked on the side of the encapsulation layer 140 away from the light-emitting layer 130. Along the thickness direction of the display module, the surface of the side wall of the bending area BB away from the substrate 110 is flush with the side walls of the touch layer 170, the polarizing layer 150, the optical adhesive layer 160 and the cover layer opposite to each other.

[0094] The display device and display module provided in the embodiments of the present application belong to the same inventive concept, can solve the same technical problems, and achieve the same technical effects, and the repeated contents will not be repeated here.

[0095] In an exemplary embodiment, referring to Fig.13 , provides a method for manufacturing a display module, the method comprising:

[0096] S1302, providing an initial display module, wherein the initial display module includes a display area and a bending area, and the initial display module includes a substrate, an array layer, a light-emitting layer and a packaging layer stacked in sequence, wherein the packaging layer covers the light-emitting layer.

[0097] refer to Fig.14 , providing an initial display module.

[0098] S1304, removing the substrate and part of the packaging layer in the bending area.

[0099] refer to Fig.15 , remove the encapsulation layer 140 of the non-display area NAA of the splicing side of the initial display module, refer to Fig.16 , the substrate 110 of the non-display area NAA on the splicing side of the initial display module is removed.

[0100] S1306, bending the array layer in the bending area toward the side wall of the substrate to be located on the side wall of the substrate, wherein after bending, the orthographic projection of the packaging layer toward the substrate covers the orthographic projection of the array layer toward the substrate.

[0101] refer to Fig.17 , the bending region BB of the array layer 120 is bent to the side wall of the substrate 110 , thereby forming a display module.

[0102] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic description of the above terms does not necessarily refer to the same embodiment or example.

[0103] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0104] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A display module, characterized in that: The display module comprises: substrate; An array layer, the array layer comprising a display area and a bending area, wherein the display area is located at one side of the substrate, and the bending area is bent toward the side wall of the substrate and is located at the side wall of the substrate; A light-emitting layer, located on a side of the array layer away from the substrate; The encapsulation layer is located on a side of the light-emitting layer away from the array layer, the encapsulation layer covers the light-emitting layer, and the orthographic projection of the encapsulation layer toward the substrate covers the orthographic projection of the array layer toward the substrate.

2. The display module according to claim 1, characterized in that: The array layer located at one side of the substrate and the array layer located at the side wall of the substrate are perpendicular to each other.

3. The display module according to claim 2, characterized in that: Along the thickness direction of the display module, a surface of the side wall of the bending region away from the substrate is flush with the side wall of the opposite encapsulation layer; Optionally, the display module further comprises a polarizer layer and an optical adhesive layer stacked in sequence on a side of the encapsulation layer away from the light-emitting layer, and along the thickness direction of the display module, a surface of a side wall of the bending region away from the substrate is flush with the opposite side walls of the polarizer layer and the optical adhesive layer; Optionally, the display module further comprises a touch layer located between the encapsulation layer and the polarizer layer, and along the thickness direction of the display module, a surface of the side wall of the bending region away from the substrate is flush with a side wall of the touch layer opposite thereto; Optionally, the display module further includes a back protective film layer, which is located on a side of the substrate away from the array layer, and along the thickness direction of the display module, a side wall of the back protective film layer is flush with a side wall of the substrate.

4. The display module according to claim 1, characterized in that: The display module also includes a blocking dam; Along the direction of the plane where the display module is located, the blocking dam is located between the light-emitting layer and the encapsulation layer; or, Along the direction of the plane where the display module is located, the light-emitting layer includes a plurality of light-emitting units arranged in an array, and the blocking dam is located between the side wall of the light-emitting layer and the light-emitting unit adjacent to the side wall of the light-emitting layer.

5. The display module according to claim 4, characterized in that: The barrier dam comprises a bottom, a barrier portion and a top connected in sequence; The bottom is located at the array layer, the top is located at the encapsulation layer, and the orthographic projections of the top and the blocking portion along the thickness direction of the display module are both located within the orthographic projection of the bottom along the thickness direction of the display module; Optionally, along the thickness direction of the display module, the bottom portion overlaps with the bending area; Optionally, the material of the barrier dam is a conductive material; Optionally, the array layer includes an anode layer, the bottom portion is located in the same layer as the anode layer and is spaced apart from the anode layer, the light-emitting layer includes a cathode layer, and the top portion is connected to the cathode layer.

6. The display module according to claim 1, characterized in that: The display module further includes a shielding structure, which is located in the array layer and overlaps with the display area and the bending area.

7. The display module according to claim 6, characterized in that: Part of the shielding structure and the bending region are bent together to the side wall of the substrate, wherein the shielding structure and the array layer are both made of flexible materials.

8. A display device, characterized in that: It comprises at least two display modules as described in any one of claims 1 to 7; the bending regions of at least two of the display modules are spliced ​​together, and along the thickness direction of the display module, the packaging layers of at least two of the display modules opposite to the bending regions are spliced ​​together.

9. The display device according to claim 8, characterized in that: The display module also includes a touch layer, a polarizing layer, an optical adhesive layer and a cover layer stacked in sequence on a side of the packaging layer away from the light-emitting layer. Along the thickness direction of the display module, the surface of the side wall of the bending zone away from the substrate is flush with the opposite side walls of the touch layer, the polarizing layer, the optical adhesive layer and the cover layer.

10. A method for manufacturing a display module, characterized in that: The method comprises: An initial display module is provided, wherein the initial display module comprises a display area and a bending area, and the initial display module comprises a substrate, an array layer, a light-emitting layer and a packaging layer which are stacked in sequence, wherein the packaging layer covers the light-emitting layer; removing the substrate and part of the packaging layer in the bending area; The array layer in the bending area is bent toward the side wall of the substrate to be located on the side wall of the substrate, wherein after bending, the orthographic projection of the packaging layer toward the substrate covers the orthographic projection of the array layer toward the substrate.

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