Resin molding apparatus and method for manufacturing resin molded article

Abstract

In order to reliably collect unwanted resin on a groove block while reliably carrying out a resin molded article from a lower mold provided with the groove block having an extension part, a carrying mechanism 19 is provided with: a first holding part 20 for holding the resin molded article W2; a second holding section (21) that holds the unwanted resin (K) on the groove block (141); a first lifting / moving mechanism 22 that lifts the first holding section 20 so that the resin molded article W2 held by the first holding section 20 moves upward below the extension section 141b; and a horizontal movement mechanism (23) that moves the first holding section (20) in the horizontal direction so that the resin molded article (W2) held by the first holding section (20) moves to the outside of the extension section (141b) in a state in which the first holding section (20) is raised by the first raising / lowering movement mechanism (22), and that moves the resin molded article (W2) in the horizontal direction so that the resin molded article (W2) moves to the outside of the extension section (141b) in a state in which the resin molded article (W2) is raised by the first raising / lowering movement mechanism (22). In a state in which the second holding section 21 is in contact with the unwanted resin K on the groove block 141, the lower mold 15 is lowered by a mold clamping mechanism 17, and the plunger 142a is raised relative to the lower mold by a transfer mechanism 142.

Description

Technical Field

[0001] The present invention relates to a resin molding device and a method for manufacturing a resin molded product. Background Art

[0002] Previously, for example, as shown in Patent Document 1, it was considered to close the upper mold and the lower mold, and in a state where the extension of the groove block provided in the lower mold sandwiches a part of the molded object between the upper surface of the groove block and the lower surface of the upper mold, inject molten resin into the mold cavity of the upper mold from the space formed between the upper surface of the groove block and the lower surface of the upper mold to perform resin sealing.

[0003] In the resin molding device, after the resin molding, the resin molded product and the unnecessary resin are unloaded using a conveying device (unloader) having a molded product suction part and an unnecessary resin suction part. Here, the molded product suction part and the unnecessary resin suction part both include a resin suction pad.

[0004] The resin molded product is adsorbed by the molded product adsorption part, and the molded product adsorption part adsorbing the resin molded product is horizontally moved in a direction away from the tank block, so that the resin molded product is moved outside the extension part. In addition, the plunger is raised in a state where the unnecessary resin adsorption part is in contact with the unnecessary resin on the tank block, so that the unnecessary resin is lifted from the tank block and the unnecessary resin adsorption part adsorbs the unnecessary resin. In addition, the adsorption pad of the unnecessary resin adsorption part is elastically deformed and contracted while being in contact with the unnecessary resin due to the unnecessary resin being lifted.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2022-39709 Summary of the invention

[0008] Problems to be solved by the invention

[0009] However, for example, in a resin molded product in which a cavity is formed in a lower mold and a resin sealing portion is formed on the lower side of a molding object, the resin sealing portion on the lower side cannot be moved horizontally unless the resin sealing portion on the lower side is extended upward from the cavity of the lower mold. In addition, in a case where there are alignment pins for a substrate (molding object) in the lower mold, the resin molded product cannot be moved horizontally unless the resin molded product (substrate) is moved upward and removed from the alignment pins. Furthermore, even in a structure in which there is no cavity in the lower mold, there is a case in which a release film is provided in the lower mold, and the resin molded product cannot be reliably separated from the release film by simply adsorbing the resin molded product using the molded product adsorption portion.

[0010] In view of these problems, it is conceivable to move the molded product suction part that suctions the resin molded product upward and then move it in a direction away from the tank block. Here, in order to prevent the resin molded product from touching the protruding part when the molded product suction part is moved upward, it is conceivable to increase the distance between the protruding part of the tank block and the mold surface of the lower mold.

[0011] Furthermore, if the distance between the protruding portion of the tank block and the mold surface of the lower mold is increased, the distance between the upper surface of the tank block and the lower surface of the upper mold becomes relatively smaller. As a result, the size of the adsorption pad of the unnecessary resin adsorption part is restricted, and the elastic deformation amount of the unnecessary resin adsorption part for removing the unnecessary resin from the tank cannot be ensured, making it difficult to stably recover the unnecessary resin.

[0012] Therefore, the present invention is made to solve the above-mentioned problems, and a main subject thereof is to reliably remove a resin molded product from a lower mold provided with a tank block having a protruding portion and to reliably recover unnecessary resin on the tank block.

[0013] Technical means of solving problems

[0014] That is, the resin molding device of the present invention is characterized in that it includes: a molding die having an upper die and a lower die, at least one of which has a mold cavity formed therein; a mold clamping mechanism for clamping the upper die and the lower die; a groove block provided in the lower die and having a groove for accommodating a resin material; a transfer mechanism for moving a plunger in the groove to inject the resin material into the mold cavity; and a conveying mechanism for conveying a resin molded product from the lower die after resin molding, the groove block having an extension portion extending between at least a portion of the resin molded product and the upper die, the conveying mechanism having: a first holding portion for holding the resin molded product; a second holding portion for holding unnecessary resin on the groove block; a first lifting mechanism for lifting the resin molded product out of the lower die. A descending movement mechanism, which raises the first holding part in such a manner that the resin molded product held by the first holding part moves upward below the extending part; and a horizontal movement mechanism, which moves the first holding part in a horizontal direction in such a manner that the resin molded product held by the first holding part moves to the outside of the extending part while the first holding part is raised by the first lifting and lowering movement mechanism, and when the resin molded product moves to the outside of the extending part and the second holding part contacts unnecessary resin on the groove block, the lower mold is lowered by the clamping mechanism, and the plunger is raised relative to the lower mold by the transfer mechanism.

[0015] Effects of the Invention

[0016] According to the present invention thus constituted, the resin molded product can be reliably removed from the lower mold provided with the tank block having the protruding portion, and unnecessary resin on the tank block can be reliably recovered. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] [ Figure 1 ] is a schematic diagram showing the structure of a resin molding device according to one embodiment of the present invention.

[0018] [ Figure 2 ] is a schematic diagram showing the states of the molding module of the embodiment (a) before mold closing, (b) during mold closing, and (c) after mold opening.

[0019] [ Figure 3 ] is a side view schematically showing the structure of the conveying mechanism of the embodiment.

[0020] [ Figure 4 ] is a side view schematically showing the lifting action (first vertical movement) performed by the first lifting mechanism of the embodiment.

[0021] [ Figure 5 ] is a diagram schematically showing the structure of the horizontal moving mechanism of the embodiment.

[0022] [ Figure 6 ] is a diagram schematically showing the operation of the horizontal moving mechanism of the embodiment.

[0023] [ Figure 7 ] is a side view schematically showing the horizontal movement performed by the horizontal moving mechanism of the embodiment.

[0024] [ Figure 8 ] is a side view schematically showing the lifting action (second vertical movement) performed by the second lifting mechanism of the embodiment.

[0025] [ Fig. 9 ] is a side view schematically showing a state in which the interval between the conveying claws is reduced in the conveying device of the embodiment.

[0026] [ Fig.10 ] is a side view schematically showing the adsorption action of unnecessary resin in the above-mentioned embodiment. DETAILED DESCRIPTION

[0027] Next, the technology of the present invention will be described in further detail with reference to examples. However, the present invention is not limited to the following technology.

[0028] The resin molding device of the present invention is characterized in that it includes: a molding die having an upper die and a lower die, at least one of which has a mold cavity; a mold clamping mechanism for clamping the upper die and the lower die; a groove block provided in the lower die and having a groove for accommodating a resin material; a transfer mechanism for moving a plunger in the groove to inject the resin material into the mold cavity; and a conveying mechanism for conveying a resin molded product from the lower die after resin molding, the groove block having an extension portion extending between at least a portion of the resin molded product and the upper die, and the conveying mechanism having: a first holding portion for holding the resin molded product; a second holding portion for holding unnecessary resin on the groove block; a first A lifting and moving mechanism for lifting the first holding portion so that the resin molded product held by the first holding portion moves upward below the extending portion; and a horizontal moving mechanism for moving the first holding portion in a horizontal direction so that the resin molded product held by the first holding portion moves to the outside of the extending portion while the first holding portion is lifted by the first lifting and moving mechanism, and when the resin molded product moves to the outside of the extending portion and the second holding portion contacts unnecessary resin on the groove block, the lower mold is lowered by the clamping mechanism, and the plunger is raised relative to the lower mold by the transfer mechanism.

[0029] In the case of the resin molding device, the resin molded product held by the first holding portion is moved upward below the extending portion, and then the resin molded product is moved to the outside of the extending portion. Therefore, even if a resin molded product has a resin sealing portion formed on the lower side of the molding object or a release film is provided on the lower mold, the resin molded product can be reliably removed from the lower mold.

[0030] In addition, when the resin molded product moves to the outside of the protruding portion and the second holding portion is in contact with the unnecessary resin on the tank block, the lower mold is lowered and the plunger is raised relative to the lower mold, so that the unnecessary resin is peeled off from the tank block in a state where the second holding portion is in contact with the unnecessary resin on the tank block. As a result, poor recovery caused by the unnecessary resin tilting on the tank block can be prevented.

[0031] The resin molding device according to the second aspect of the present invention is characterized in that, in addition to the structure of the first aspect, the second holding portion includes a bellows-type suction pad for sucking the unnecessary resin.

[0032] With the above structure, the effect of the structure of the above technique 1 (the structure in which the lower mold is lowered and the plunger is raised relative to the lower mold) can be further enhanced. That is, there is no need to use an adsorption pad with a large elastic deformation, and the amount of resin remaining in the groove (groove residual portion) is not limited by the elastic deformation of the adsorption pad.

[0033] In addition, the "residual amount of resin remaining in the groove (groove residue)" corresponds to the deviation of the resin amount or the change in the resin amount caused by the presence or absence of electronic components. For example, when the same amount of resin material is used for resin molding in virtual molding without electronic components and mounting molding with electronic components, the change in the resin material caused by the presence or absence of electronic components is absorbed by the groove residue.

[0034] The resin molding device of technology 3 of the present invention is characterized in that, based on the structure of technology 1 or 2, the height position of the plunger relative to the second holding portion is maintained by raising the plunger relative to the lower mold using the transfer mechanism.

[0035] With the above structure, the relative positional relationship between the second retaining portion in contact with the unnecessary resin and the plunger does not change. For example, in the case of a structure in which the second retaining portion has an adsorption pad, when the unnecessary resin is squeezed out of the groove, the elastic deformation amount of the adsorption pad hardly changes. Therefore, it is not necessary to use an adsorption pad with a large elastic deformation amount. In addition, when the unnecessary resin is squeezed out of the groove, the position of the unnecessary resin hardly changes, so the unnecessary resin can be reliably held by the second retaining portion, so that the unnecessary resin on the groove block can be reliably recovered.

[0036] The resin molding device of technology 4 of the present invention is characterized in that, based on any one of the structures of technologies 1 to 3, the conveying mechanism also includes: a base member on which the first holding portion is movably arranged; a first movable body that moves in a horizontal direction relative to the base member; a second movable body that moves in a horizontal direction together with the first movable body and moves in an up and down direction relative to the first movable body; and a connecting member that connects the second movable body to the first holding portion.

[0037] According to the structure, the first moving body moves horizontally relative to the base member, the second moving body moves horizontally together with the first moving body, and the first holding portion connected to the second moving body moves horizontally. In addition, the second moving body moves vertically relative to the first moving body, and the first holding portion connected to the second moving body moves vertically.

[0038] As specific embodiments of the first lifting and lowering mechanism, the following can be considered.

[0039] That is, the resin molding device of technology 5 of the present invention is characterized in that, based on the structure of technology 4, the first lifting and moving mechanism has: a first sliding member, which moves in a horizontal direction relative to the base member; and a first lifting and lowering cam mechanism, which moves the first retaining portion upward by causing the second moving body to move upward along with the movement of the first sliding member.

[0040] As specific embodiments of the horizontal movement mechanism, the following can be considered.

[0041] That is, the resin molding device of technology 6 of the present invention is characterized in that, based on the structure of technology 4 or 5, the horizontal moving mechanism has: a second sliding member, which moves in a horizontal direction relative to the base member; and a connecting rod mechanism, which enables the first moving body to move in a direction away from the groove block as the second sliding member moves.

[0042] According to the above structure, since the horizontal movement mechanism has the link mechanism, the movement of the second sliding member can be smoothly transmitted to the movement of the holding member.

[0043] As specific embodiments of the conveying mechanism, the following can be considered.

[0044] That is, the resin molding device of technology 7 of the present invention is characterized in that, based on any one of the structures of technologies 1 to 6, the conveying mechanism also includes a second lifting and moving mechanism, which raises the first holding part when the resin molded product is moved to the outside of the extension part by the horizontal moving mechanism.

[0045] The resin molding device of technology 8 of the present invention is characterized in that, based on the structure of technology 7, the conveying mechanism also includes a second lifting and moving mechanism, which raises the first holding part when the resin molded product is moved to the outside of the extension part by the horizontal moving mechanism, and the second lifting and moving mechanism has a second lifting cam mechanism, which moves the first holding part upward by moving the second moving body in the upward direction as the second sliding member moves.

[0046] According to the above structure, the second sliding member of the horizontal moving mechanism can be used to form the second lifting and lowering moving mechanism, so that not only the structure can be simplified but also the cost can be reduced.

[0047] The resin molding device of technology 9 of the present invention is characterized in that, based on the structure of technology 7 or 8, the conveying mechanism also includes a conveying claw, which hooks and holds the resin molded product, and uses the conveying claw to hold the resin molded product when the first holding part is raised by the second lifting and moving mechanism.

[0048] With the above structure, the resin molded product can be transported more stably, thereby preventing the resin molded product from falling. In addition, the resin molded product can be held by the holding claws when the first holding portion is raised by the second lifting mechanism, so the lower surface of the resin molded product can be held. In addition, the holding claws can be prevented from contacting the mold surface of the lower mold and damaging it.

[0049] The resin molding device of technology 10 of the present invention is characterized in that, based on any one of the structures of technologies 1 to 9, the cavity is formed in the lower mold, and the first lifting and moving mechanism causes the first retaining part to rise until the resin sealing part formed by the cavity of the lower mold is located above the parting line of the lower mold.

[0050] In addition, the following method for manufacturing a resin molded product is also an embodiment of the present invention. The method for manufacturing a resin molded product uses any one of the resin molding devices in the technologies 1 to 10 to manufacture a resin molded product. The method for manufacturing a resin molded product includes: a molding step of resin molding a molding object; and a carrying-out step of carrying out the resin molded product that has been resin molded.

[0051] <One embodiment of the present invention>

[0052] Hereinafter, one embodiment of the resin molding device of the present invention will be described with reference to the accompanying drawings. In order to facilitate understanding, any of the following figures are schematically depicted in an appropriately omitted or exaggerated manner. The same components are marked with the same reference numerals and the description thereof is appropriately omitted.

[0053] <Overall structure of resin molding device>

[0054] The resin molding apparatus 100 of the present embodiment performs resin molding of the molding object W1 to which the electronic component Wx is fixed by transfer molding using the resin material J.

[0055] Here, the molding object W1 includes, for example, a metal substrate, a resin substrate, a glass substrate, a ceramic substrate, a circuit substrate, a semiconductor substrate, a lead frame, a silicon wafer, a glass wafer, etc., regardless of whether or not there is wiring. In addition, the resin material J used for resin molding is, for example, a composite material containing a thermosetting resin, and the form of the resin material J is granular, powdery, liquid, sheet or flake. In addition, as the electronic component Wx, for example, electronic components such as semiconductor chips, resistor elements, capacitor elements, or electronic components in a form in which at least one of these electronic components is sealed with resin can be listed.

[0056] Specifically, if Figure 1 As shown, the resin molding device 100 includes the following components as components: a supply module 100A that supplies a molding object W1 and a resin material J before molding; a molding module 100B that performs resin molding; and a storage module 100C that stores a molding object W2 (hereinafter referred to as a resin molded product W2) after molding. In addition, the supply module 100A, the molding module 100B, and the storage module 100C are detachable from each other and replaceable relative to other components.

[0057] The supply module 100A is provided with the following components: a forming object supply section 11 for supplying a forming object W1; a resin material supply section 12 for supplying a resin material J; and a conveying mechanism 13 (hereinafter referred to as a loader 13) for receiving the forming object W1 from the forming object supply section 11 and conveying it to the forming module 100B, and for receiving the resin material J from the resin material supply section 12 and conveying it to the forming module 100B.

[0058] The loader 13 reciprocates between the supply module 100A and the forming module 100B, and moves along a rail (not shown) provided across the supply module 100A and the forming module 100B.

[0059] like Figure 2 As shown, the molding module 100B has: a lower mold 15, in which a resin injection portion 14 is provided, and a mold cavity 15a is formed for injecting resin material J; an upper mold 16 is provided opposite to the lower mold 15, and a mold cavity 16a is formed for injecting resin material J; and a clamping mechanism 17 is provided to clamp the lower mold 15 and the upper mold 16. The lower mold 15 is provided on a movable plate 101 which is raised and lowered by the clamping mechanism 17 via a lower pressing plate 102. The upper mold 16 is provided on an upper fixed plate (not shown) via an upper pressing plate 103. In addition, Figure 2 Only one side (left side) of the resin injection portion 14 is shown, and the other side (right side) is omitted. Figure 2 The structure of the other side is the same as that of one side.

[0060] The resin injection unit 14 of this embodiment includes: a groove block 141, which is formed with a groove 141a for accommodating the resin material J; and a transfer mechanism 142, which has a plunger 142a disposed in the groove 141a. Here, the transfer mechanism 142 includes: a plunger 142a for pressurizing the resin material J accommodated in the groove 141a; and a plunger driving unit 142b for driving the plunger 142a. In addition, the plunger 142a pressurizes the resin material J heated and melted in the groove 141a.

[0061] The groove block 141 is provided on the lower mold 15 and is elastically supported by the elastic member 144 so as to be able to rise and fall relative to the lower mold 15. In addition, an extension portion 141b extending from the upper surface, i.e., the mold surface, of the lower mold 15 is formed at the upper end of the groove block 141. When the upper mold 16 and the lower mold 15 are closed, the upper surface of the extension portion 141b contacts the upper mold 16, and the lower surface sandwiches the molding object W1 between the mold surface of the lower mold 15 (see Figure 2 (b)). In addition, after the resin molding, the protruding portion 141b becomes a portion protruding between at least a portion of the resin molded product W2 and the upper mold 16 (see Figure 2 (c)). Furthermore, a cull portion and a gate portion (not shown) serving as a resin flow path for introducing the resin material J injected from the groove 141a into the cavity 15a and the cavity 16a may be formed on the upper surface of the groove block 141.

[0062] The cavity 15a of the lower mold 15 is used to resin-seal the lower surface of the molding object W1, and the cavity 16a of the upper mold 16 is used to resin-seal the upper surface of the molding object W1. Here, at least one of the cavity 15a of the lower mold 15 or the cavity 16a of the upper mold 16 accommodates the electronic component Wx of the molding object W1.

[0063] In the upper mold 16, a recess 16b is formed in a portion facing the protruding portion 141b of the tank block 141, and a flow channel 16c is formed to connect the cutout portion and the gate portion of the tank block 141 with the cavity 15a and the cavity 16a. In addition, a flow channel to connect the cutout portion and the gate portion of the tank block 141 with the cavity 15a and the cavity 16a may be formed in the lower mold 15. Although not shown in the figure, an exhaust port is formed on the side opposite to the tank block 141 in the lower mold 15 or the upper mold 16.

[0064] And, if Figure 2As shown in (b), when the lower mold 15 and the upper mold 16 are clamped by the clamping mechanism 17, the groove block 141 descends, and the groove side end of the molding object W1 is sandwiched between the lower surface of the extension 141b of the groove block 141 and the upper surface of the lower mold 15. In this state, when the molten resin material J is injected into the mold cavity 15a and the mold cavity 16a by the plunger 142a, the electronic component Wx of the molding object W1 is sealed with resin.

[0065] The storage module 100C is provided with a storage section 18 for storing the resin molded product W2 and a conveying mechanism 19 (hereinafter referred to as an unloader 19 ) for receiving the resin molded product W2 from the molding module 100B and conveying it to the storage section 18 .

[0066] The unloader 19 reciprocates between the forming module 100B and the storage module 100C, and moves along a rail (not shown) provided over the forming module 100B and the storage module 100C. The details of the unloader 19 will be described later.

[0067] Reference Figure 2 The basic operation of the resin molding apparatus 100 will be briefly described. The following operation is performed by, for example, the control unit COM provided in the supply module 100A controlling each unit.

[0068] In the state where the lower mold 15 and the upper mold 16 are opened, the molding object W1 is conveyed by the loader 13, and Figure 2 (a) is placed on the lower mold 15. At this time, the upper mold 16 and the lower mold 15 are heated to a temperature at which the resin material J can be melted and hardened. In addition, the resin material J is transported by the loader 13 and accommodated in the groove 141a of the groove block 141.

[0069] In the above state, when the lower mold 15 is raised by the mold clamping mechanism 17, Figure 2 As shown in (b), the groove block 141 touches the upper mold 16 and descends relative to the lower mold 15, and the lower surface of the protruding portion 141b contacts the groove side end of the molding object W1. In addition, the lower surface of the upper mold 16 contacts the exhaust side end of the molding object W1. As a result, the lower mold 15 and the upper mold 16 are clamped. When the plunger 142a is raised by the plunger driving portion 142b after the clamping, the molten resin material J in the groove 141a is injected into the mold cavity 15a and the mold cavity 16a through the resin passage. Then, after the resin material J in the mold cavity 15a and the mold cavity 16a is hardened, as shown in Figure 2As shown in (c), the mold is opened by the mold clamping mechanism 17. By the mold opening, the tank block 141 rises relative to the lower mold 15, and the elastic member 144 of the tank block 141 is extended. The plunger 142a rises in coordination with the extension of the elastic member 144, and the unnecessary resin K on the tank block 141 is separated from the resin molded product W2 (gate disconnection). Then, the resin molded product W2 is unloaded by the unloader 19 and transported to the storage unit 18.

[0070] <Detailed structure of unloader 19>

[0071] Next, refer to Figures 3 to 10 The specific structure of the unloader 19 in this embodiment will be described. Figure 3 , Figure 6 to Figure 10 Only one side (left side) of the slot block 141 is shown, and the other side (right side) is omitted, but the state of the other side is the same as the state of one side in each figure.

[0072] like Figures 3 to 10 As shown, the unloading machine 19 includes: a first holding portion 20 for holding a resin molded product W2; a second holding portion 21 for holding unnecessary resin K on the tank block 141; a first lifting and moving mechanism 22 for lifting the first holding portion 20 in such a manner that the resin molded product W2 held on the first holding portion 20 moves upward below the extension portion 141b; a horizontal moving mechanism 23 for moving the first holding portion 20 in a horizontal direction in such a manner that the resin molded product W2 held on the first holding portion 20 moves to the outside of the extension portion 141b when the first holding portion 20 is lifted by the first lifting and moving mechanism 22; and a second lifting and moving mechanism 24 for lifting the first holding portion 20 in such a manner that the resin molded product W2 held on the first holding portion 20 moves to the outside of the extension portion 141b when the first holding portion 20 is lifted by the first lifting and moving mechanism 22;

[0073] The first holding portion 20 holds the resin molded product W2 from which the unnecessary resin K on the groove block 141 is separated, and has a molded product suction pad 20a for sucking the resin molded product W2 placed on the lower mold 15. The molded product suction pad 20a is provided on the lower surface of the first holding portion 20, and a suction mechanism (not shown) for sucking the resin molded product W2 is connected to the molded product suction pad 20a. The molded product suction pad 20a of the present embodiment is a bellows-type suction pad. In addition, the suction mechanism has, for example, a suction flow path formed inside the first holding portion 20 and a suction pump connected to the suction flow path.

[0074] The second holding part 21 has an unnecessary resin adsorption pad 21a for adsorbing the unnecessary resin K on the tank block 141. The unnecessary resin adsorption pad 21a is provided on the lower surface of the second holding part 21, and a suction mechanism (not shown) for adsorbing the unnecessary resin K is connected to the unnecessary resin adsorption pad 21a. The unnecessary resin adsorption pad 21a of the present embodiment is a bellows-type adsorption pad. In addition, the suction mechanism has, for example, a suction flow path formed inside the second holding part 21 and a suction pump connected to the suction flow path.

[0075] Furthermore, the first holding portion 20 and the second holding portion 21 are provided on the base member 25. Specifically, the first holding portion 20 is movably provided on the base member 25, and the second holding portion 21 is fixed to the base member 25. Alternatively, the second holding portion 21 may be movably provided on the base member 25.

[0076] As a structure capable of moving the first holding portion 20 on the base member 25, the unloading machine 19 includes: a first movable body 31, which moves in a horizontal direction relative to the base member 25; a second movable body 32, which moves in a horizontal direction together with the first movable body 31 and moves in an up and down direction relative to the first movable body 31; and a connecting member 33, which connects the second movable body 32 to the first holding portion 20.

[0077] The first moving body 31 is in the shape of a plate, for example, that moves in the horizontal direction on the base member 25. The first moving body 31 is provided so as to be movable relative to the base member 25 in a direction toward the tank block 141 or in a direction away from the tank block 141 through a guide portion (not shown). In addition, the guide portion includes: a rail provided in the base member 25 along the front-rear direction of the tank block 141; and a slider provided on the first moving body 31 and moving on the rail.

[0078] The second moving body 32 has a plate shape, for example, that moves in the up-down direction relative to the first moving body 31. The second moving body 32 is provided in a state of sandwiching the first moving body 31 between the first holding portion 20 and the second holding portion 20.

[0079] Furthermore, the connecting member 33 connecting the second moving body 32 and the first holding part 20 is provided so as to be able to move up and down relative to the first moving body 31 via the through hole 31h formed in the first moving body 31. Here, one or more connecting members 33 are provided, and when multiple connecting members 33 are provided, the second moving body 32 and the first holding part 20 are connected at multiple locations. In addition, the through hole 31h formed in the first moving body 31 and the connecting member 33 function as a guide portion 241 that guides the movement of the second moving body 32 in the up and down direction.

[0080] According to this structure, the first moving body 31 moves in the horizontal direction relative to the base member 25, the second moving body 32 moves in the horizontal direction together with the first moving body 31, and the first holding portion 20 connected to the second moving body 32 moves in the horizontal direction. In addition, the second moving body 32 moves in the up-down direction relative to the first moving body 31, and the first holding portion 20 connected to the second moving body 32 moves in the up-down direction.

[0081] In addition, the base member 25 is arranged to be movable in the horizontal direction and the vertical direction along the track (not shown). The base member 25 is provided with a conveying claw 26, and the conveying claw 26 is used to prevent the resin molded product W2 held by the first holding portion 20 from falling or to hold the resin molded product W2. The conveying claw 26 is a pair of conveying claws 26 arranged in a manner of hooking at both ends of the resin molded product W2, and the distance between the conveying claws 26 is expanded or reduced by a driving portion not shown. The distance between the conveying claws 26 is reduced by the driving portion so as to be hooked to the resin molded product W2, and the distance between the conveying claws 26 is expanded so as not to hinder the lifting and lowering movement of the resin molded product W2 by the second lifting and moving mechanism 24.

[0082] <First lifting and moving mechanism 22>

[0083] The first lifting mechanism 22 lifts the first holding part 20 and moves the resin molded product W2 held by the first holding part 20 linearly upward below the extension 141b. When the first lifting mechanism 22 moves, the first holding part 20 holds the resin molded product W2 by suction.

[0084] Here, the first lifting mechanism 22 raises the first holding portion 20 until the lower resin sealing portion formed by the cavity 15a of the lower mold 15 is located above the parting line (mold surface) of the lower mold 15 (see Figure 4 ). In addition, the lifting amount of the first holding part 20 by the first lifting and moving mechanism 22 is such that the resin molded product W2 does not contact the extension part 141b of the tank block 141. In addition, the height position of the extension part 141b of the tank block 141 relative to the lower mold 15 is set to such an extent that the resin molded product W2 lifted by the first lifting and moving mechanism 22 does not contact.

[0085] Specifically, if Figure 3 , Figure 4 , Figure 7 to Figure 10As shown, the first lifting and moving mechanism 22 includes: a first sliding member 221, which moves in the horizontal direction relative to the base member 25; a first driving unit 222, which moves the first sliding member 221; and a first lifting cam mechanism 223, which moves the first holding unit 20 upward by moving the second moving body 32 upward along with the movement of the first sliding member 221. The first sliding member 221 of this embodiment is configured to move in a direction toward the tank block 141 or in a direction away from the tank block 141. In addition, the first driving unit 222 is, for example, a block including a cylinder (not shown), and the first sliding member 221 and the first driving unit 222 include a pneumatic slide.

[0086] like Figure 3 , Figure 4 , Figure 7 to Figure 10 As shown, the first lifting cam mechanism 223 includes: a lifting roller member 223a, which is provided on the second moving body 32; and a lifting roller contact portion 223b, which is provided on the first sliding member 221, so that the lifting roller member 223a moves along with the movement of the first sliding member 221. In addition, the lifting roller contact portion 223b has an inclined surface, that is, as the first sliding member 221 moves toward the groove block 141, it contacts the lifting roller member 223a and allows the lifting roller member 223a to move upward. In addition, the lifting roller member 223a may also include, for example, a rolling element (bearing) or a bushing rotatably provided on the second moving body 32.

[0087] When the first sliding member 221 is moved toward the tank block 141 by the first lifting and moving mechanism 22, the lifting roller member 223a in contact with the inclined surface of the lifting roller contact portion 223b moves upward (see Figure 4 ). As a result, the second moving body 32 and the first holding portion 20 connected to the second moving body 32 move upward relative to the first moving body 31 (first vertical movement).

[0088] Furthermore, when the first sliding member 221 is moved in a direction away from the groove block 141, the second moving body 32 and the first holding portion 20 connected to the second moving body 32 move downward relative to the first moving body 31 due to their own weight (see Figure 3 ).

[0089] <Horizontal moving mechanism 23>

[0090] The horizontal moving mechanism 23 linearly moves the first holding portion 20 holding the resin molded product W2 in a direction away from the tank block 141. In addition, as described above, the resin molded product W2 is positioned above the parting line (mold surface) of the lower mold 15 by the first lifting and lowering moving mechanism 22, so the horizontal moving mechanism 23 linearly moves the resin molded product W2 held by the suction pad 20a in a direction away from the tank block 141.

[0091] Specifically, if Figures 3 to 10 As shown, the horizontal movement mechanism 23 includes: a second sliding member 231 that moves in the horizontal direction relative to the base member 25; a second driving unit 232 that moves the second sliding member 231; and a link mechanism 233 that moves the first moving body 31 in a direction away from the tank block 141 along with the movement of the second sliding member 231. The second sliding member 231 of this embodiment is configured to move in a direction toward the tank block 141 or in a direction away from the tank block 141. In addition, the second driving unit 232 uses, for example, an air cylinder.

[0092] like Figure 5 and Figure 6 As shown, the link mechanism 233 of this embodiment is configured to move the first holding portion 20 (first moving body 31) in a direction away from the tank block 141 as the second sliding member 231 moves in a direction away from the tank block 141. Here, the link mechanism 233 is configured to include a first link arm 233a and a second link arm 233b rotatably provided on the base member 25, and the second link arm 233b rotates in a direction opposite to the first link arm 233a as the first link arm 233a rotates.

[0093] Furthermore, if Figure 5 and Figure 6 As shown, the horizontal moving mechanism 23 is provided with a first horizontal cam mechanism 234 between the second sliding member 231 and the link mechanism 233 , and includes a second horizontal cam mechanism 235 between the link mechanism 233 and the first moving body 31 .

[0094] The first horizontal cam mechanism 234 includes: a first roller contact portion 234a, which is provided on the second sliding member 231; and a first roller member 234b, which is provided on the first link arm 233a and moves along the first roller contact portion 234a. The first roller contact portion 234a of this embodiment is configured to include an inclined surface and a flat surface formed on the side surface of the second sliding member 231, and the first roller member 234b slides on the inclined surface and the flat surface. As the first roller member 234b moves along the inclined surface of the first roller contact portion 234a, the first link arm 233a rotates in one direction (refer to Figure 6(b)) On the other hand, the first roller member 234b moves along the flat surface of the first roller contact portion 234a, so that the first link arm 233a does not rotate but maintains its state (see Figure 6 (c)) In addition, the first roller member 234b may include, for example, a rolling element (bearing) or a bushing rotatably provided at the inner end of the first link arm 233a.

[0095] The second horizontal cam mechanism 235 includes: a second roller contact portion 235a provided on the first moving body 31; and a second roller member 235b provided on the second link arm 233b and moving along the second roller contact portion 235a. In addition, the second roller member 235b may include, for example, a rolling element (bearing) or a bushing rotatably provided on the outer end of the second link arm 233b. In addition, the second roller contact portion 235a is provided on the surface of the first moving body 31 facing the groove block 141 side, and is set as a flat surface in this embodiment.

[0096] By means of the link mechanism 233, when the second sliding member 231 moves in a direction away from the slot block 141 ( Figure 6 (a)→(b)), the first roller member 234b moves along the inclined surface of the first roller contact portion 234a of the second sliding member 231 to rotate the first link arm 233a. Then, the second link arm 233b rotates in the opposite direction to the first link arm 232a as the first link arm 233a rotates, and the second roller member 235b of the second link arm 233b presses the second roller contact portion 235a of the first moving body 31 in a direction away from the groove block 141. As a result, the first moving body 31 moves in a direction away from the groove block 141. Then, when the first roller member 234b reaches the flat surface of the first roller contact portion 234a ( Figure 6 (b)→(c)), the rotation of the first link arm 233a stops, and the horizontal movement of the first moving body 31 stops.

[0097] Furthermore, the first movable body 31 is urged toward the groove block 141 by, for example, the elastic member 28 provided via the T-block 27 , and when the second sliding member 231 is moved toward the groove block 141 , the first movable body 31 moves toward the groove block 141 .

[0098] <Second lifting and moving mechanism 24>

[0099] The second lifting mechanism 24 raises the first holding portion 20 when the resin molded product W2 is moved to the outside of the extension portion 141b by the horizontal movement mechanism 23. The second lifting mechanism 24 moves the second moving body 32 moved by the horizontal movement mechanism 23 linearly upward, and moves the first holding portion 20 connected to the second moving body 32 upward.

[0100] Specifically, if Figure 3 , Figure 4 , Figure 7 to Figure 10 As shown, the second lifting and moving mechanism 24 has: a guide part 241, which guides the second moving body 32 along the vertical direction (up and down direction); and a second lifting and lowering cam mechanism 242, which makes the second moving body 32 move upward along with the horizontal movement of the second sliding member 231 of the horizontal moving mechanism 23.

[0101] The guide portion 241 of this embodiment is formed by inserting the connecting member 33 into the through hole 31h of the first moving body 31 and the connecting member 33. In addition, the guide portion 241 may also include a rail provided in the first moving body 31 along the vertical direction and a slider provided in the second moving body and moving on the rail.

[0102] like Figure 3 , Figure 4 , Figure 7 to Figure 10 As shown, the second lifting cam mechanism 242 includes: a lifting roller member 242a, which is provided on the second sliding member 231; and a lifting roller contact portion 242b, which is provided on the second moving body 32 and moves along with the movement of the lifting roller member 242a. In addition, the lifting roller contact portion 242b has an inclined surface, that is, the lifting roller contact portion 242b moves upward along with the movement of the lifting roller member 242a away from the tank block 141.

[0103] By means of the second lifting mechanism 24, when the second sliding member 231 moves in a direction away from the slot block 141 ( Figure 6 (b) → (c)), the lifting roller member 242a contacts the inclined surface of the lifting roller contact portion 242b (see Figure 7 ), so that the lifting roller contact portion 242b moves upward (refer to Figure 8 ). As a result, the second moving body 32 and the first holding portion 20 connected to the second moving body 32 move upward relative to the first moving body 31 (second vertical movement).

[0104] In addition, when the second sliding member 231 moves toward the groove block 141, the second moving body 32 and the first holding portion 20 connected to the second moving body 32 move downward relative to the first moving body 31 due to their own weight (see Figure 7 ).

[0105] <Carrying out operation of unloader 19>

[0106] Next, refer to Figures 3 to 10 The unloading operation of the unloader 19 will be described.

[0107] When the upper mold 16 and the lower mold 15 are opened, Figure 3 As shown in the figure, after the unloader 19 is moved to the upper part of the lower mold 15, it is lowered to a predetermined position for adsorbing and holding the resin molded product W2 and the unnecessary resin K. Then, the resin molded product W2 is adsorbed and held by the adsorption pad 20a of the first holding part 20, and the unnecessary resin K is adsorbed and held by the adsorption pad 21a of the second holding part 21. In addition, the interval between the conveying claws 26 is expanded so as not to hinder the adsorption and holding of the resin molded product W2. In addition, the second holding part 21 provided on the base member 25 is in a state of contact with the unnecessary resin K remaining on the upper surface of the tank block 141.

[0108] And, if Figure 4 As shown, when the first sliding member 221 of the first lifting and moving mechanism 22 is moved, the second moving body 32 is lifted along with the movement. Specifically, when the first sliding member 221 is moved in the direction toward the groove block 141, the second moving body 32 is moved upward through the first lifting and lowering cam mechanism 223. When the second moving body 32 moves upward, the first holding portion 20 connected to the second moving body 32 moves upward (first vertical movement). Through the first vertical movement, the resin sealing portion on the lower side of the resin molded product W2 held by the first holding portion 20 is located at a position higher than the parting line (mold surface) of the lower mold 15. In addition, when the lower mold 15 is provided with a release film, the resin sealing portion on the lower side is located at a position higher than the upper surface of the release film on the parting line.

[0109] Then, if Figure 7 As shown, the first moving body 31 is moved in a direction away from the tank block 141 by the horizontal moving mechanism 23. Specifically, when the second sliding member 231 of the horizontal moving mechanism 23 is moved in a direction away from the tank block 141, the first moving body 31 is moved in a direction away from the tank block 141 by the link mechanism 233 and the horizontal cam mechanism 234 and the horizontal cam mechanism 235 ( Figure 6 (a)→(b)). When the first movable body 31 moves, the second movable body 32 and the first holding portion 20 also move simultaneously with the first movable body 31. By the above movement, the resin molded product W2 moves to the outside of the protruding portion 141b of the groove block 141.

[0110] Furthermore, if Figure 8 As shown in FIG. 1 , when the second sliding member 231 of the horizontal moving mechanism 23 is moved, the second moving body 32 is lifted along with the movement. Specifically, when the second sliding member 231 is moved from Figure 7 moves away from the slot block 141 ( Figure 6(b)→(c)), the second moving body 32 moves upward through the second lifting cam mechanism 242. When the second moving body 32 moves upward, the first holding portion 20 connected to the second moving body 32 also moves upward at the same time (second vertical movement). Through the second vertical movement, the resin molded product W2 moves to a height that can be held by the conveying claw 26. And, as Fig. 9 As shown, the interval between the conveying claws 26 is reduced so that the conveying claws 26 are located below the resin molded product W2. When the second vertical movement is completed, the movement of the second slide member 231 is completed.

[0111] As described above, after the resin molded product W2 is moved to the outer side of the extension portion 141b and the second holding portion 21 is in contact with the unnecessary resin K on the groove block 141, as shown in FIG. Fig.10 As shown, the lower mold 15 is lowered by the mold clamping mechanism 17, and the plunger 142a is raised relative to the lower mold 15 by the transfer mechanism 142. In addition, by lowering the lower mold 15, the tank block 141 is also lowered.

[0112] In the present embodiment, the plunger 142a is raised relative to the lower mold 15 by the transfer mechanism 142, thereby maintaining the height position of the plunger 142a relative to the second holding portion 21 regardless of the lowering of the lower mold 15. As a result, the relative positional relationship between the second holding portion 21 that adsorbs and holds the unnecessary resin K and the plunger 142a does not change. In other words, when the unnecessary resin K is squeezed out of the groove 141a, the elastic deformation amount of the adsorption pad 21a of the second holding portion 21 hardly changes. And, through the above-mentioned action, the unnecessary resin K adsorbed and held by the adsorption pad 21a of the second holding portion 21 is peeled off from the groove block 141 and lifted up.

[0113] As described above, when the first holding portion 20 adsorbs and holds the resin molded product W2 and the second holding portion 21 adsorbs and holds the unnecessary resin K, the unloader 19 withdraws from the upper mold 16 and the lower mold 15, transports the resin molded product W2 to the storage portion 18 of the storage module 100C, and transports the unnecessary resin K to a waste box not shown.

[0114] <Effects of the present embodiment>

[0115] According to the resin molding device 100 of this embodiment, the resin molded product W2 held by the first holding portion 20 is moved upward below the extension portion 141b, and then the resin molded product W2 is moved to the outside of the extension portion 141b. Therefore, even if the resin molded product W2 has a resin sealing portion formed on the lower side of the molding object W1 or a release film is provided on the lower mold 15, the resin molded product W2 can be reliably removed from the lower mold 15.

[0116] In addition, when the resin molded product W2 moves to the outside of the extension portion 141b and the second holding portion 21 is in contact with the unnecessary resin K on the tank block 141, the lower mold 15 is lowered by the mold clamping mechanism 17, and the plunger 142a is raised relative to the lower mold 15 by the transfer mechanism 142, so that the unnecessary resin K is peeled off from the tank block 141 while the second holding portion 21 is in contact with the unnecessary resin K on the tank block 141. As a result, poor recovery caused by the unnecessary resin K tilting on the tank block 141 can be prevented.

[0117] <Other Modified Embodiments>

[0118] In addition, the present invention is not limited to the above-described embodiments.

[0119] For example, in the above-described embodiment, the second lifting mechanism 24 is configured using the second sliding member 231 of the horizontal movement mechanism 23 . However, the second lifting mechanism 24 may be provided separately from the horizontal movement mechanism 23 without using the second sliding member 231 .

[0120] In the above embodiment, the lower mold 15 has the cavity 15a, but the lower mold 15 may not have the cavity 15a. Even in this case, the resin molded product W2 can be reliably removed from the lower mold 15 by providing the release film.

[0121] In the above embodiment, when the lower mold 15 is lowered to squeeze out the unnecessary resin K from the groove 141a, the height position of the plunger 142a relative to the second holding portion 21 is maintained, but the height position of the plunger 142a does not necessarily need to be maintained. For example, the height position of the plunger 142a relative to the second holding portion 21 may be changed within a range in which the suction pad 21a of the second holding portion 21 is kept in contact with the unnecessary resin K.

[0122] In the first lifting cam mechanism 223 of the first lifting and moving mechanism 22 of the above-described embodiment, the lifting roller member 223a may be provided on the first sliding member 221, and the lifting roller contact portion 223b may be provided on the second moving body 32. In addition, in the second lifting cam mechanism 242 of the second lifting and moving mechanism 24, the lifting roller member 242a may be provided on the second moving body 32, and the lifting roller contact portion 242b may be provided on the second sliding member 231.

[0123] Furthermore, in the above embodiment, the first holding portion 20 is moved in a direction away from the tank block 141 by moving the second sliding member 231 in a direction away from the tank block 141, but the first holding portion 20 may be moved in a direction away from the tank block 141 by moving the second sliding member 231 in a direction toward the tank block 141. In such a case, for example, it is conceivable that the link mechanism 233 is constituted by one link arm (for example, the first link arm 233a in the above embodiment).

[0124] In the embodiment, the structure is such that when the unloader 19 is lowered to a predetermined position for adsorbing and holding the resin molded product W2, the second holding portion 21 contacts the unnecessary resin K on the tank block 141. However, the structure may also be such that after the resin molded product W2 is raised by the second lifting and moving mechanism 24, the second holding portion 21 contacts the unnecessary resin K on the tank block 141.

[0125] In the above-described embodiment, the conveying claw 26 prevents the resin molded product W2 held by suction from falling, but the resin molded product W2 may be lifted up and then released from suction and held by the conveying claw 26. In addition, as long as the structure is one that performs suction and holding during conveyance, a structure without the conveying claw 26 may be used.

[0126] In addition, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the gist of the present invention.

[0127] Industrial Applicability

[0128] According to the present invention, it is possible to reliably remove the resin molded product from the lower mold provided with the tank block having the protruding portion, and reliably recover the unnecessary resin on the tank block.

[0129] Explanation of symbols

[0130] 100: Resin molding device

[0131] J: Resin material

[0132] W1: Molding object

[0133] W2: Resin molded product

[0134] K: Unnecessary resin

[0135] 141: Slot block

[0136] 141a: Slot

[0137] 141b: Extension

[0138] 142: Transfer agency

[0139] 142a: Plunger

[0140] 15: Lower die

[0141] 15a: Cavity

[0142] 16: Upper mold

[0143] 16a: Cavity

[0144] 17: Clamping mechanism

[0145] 19: Transport mechanism (unloader)

[0146] 20: First holding part

[0147] 20a: Absorption pad for molded products

[0148] 21: Second holding unit

[0149] 21a: Absorbent pad for unnecessary resin

[0150] 22: The first lifting and moving mechanism

[0151] 221: First sliding member

[0152] 223: First lifting cam mechanism

[0153] 23: Horizontal movement mechanism

[0154] 231: Second sliding member

[0155] 233: Linkage

[0156] 24: Second lifting and moving mechanism

[0157] 242: Second lifting cam mechanism

[0158] 25: Base component

[0159] 26: Transport claw

[0160] 31: First Moving Object

[0161] 32: Second moving body

[0162] 33: Connecting parts

Claims

1. A resin molding device, comprising: A forming die having an upper die and a lower die, at least one of which has a cavity formed therein; A mold clamping mechanism for clamping the upper mold and the lower mold; A groove block is provided on the lower mold and is formed with a groove for receiving the resin material; a transfer mechanism for moving a plunger in the groove to inject the resin material into the mold cavity; as well as The conveying mechanism carries out the resin molded product from the lower mold after the resin molding. The tank block has a protruding portion that protrudes between at least a portion of the resin molded product and the upper mold. The conveying mechanism comprises: a first holding portion for holding the resin molded product; a second holding portion for holding unnecessary resin on the tank block; a first lifting and moving mechanism for lifting the first holding portion in such a manner that the resin molded product held by the first holding portion moves upward below the extending portion; as well as a horizontal moving mechanism for moving the first holding portion in a horizontal direction so that the resin molded product held by the first holding portion moves to the outside of the extending portion when the first holding portion is raised by the first lifting and lowering moving mechanism; When the resin molded product moves to an outer side than the protruding portion and the second retaining portion contacts unnecessary resin on the groove block, the lower mold is lowered by the mold clamping mechanism and the plunger is raised relative to the lower mold by the transfer mechanism.

2. The resin molding device according to claim 1, wherein: The plunger is raised relative to the lower mold by the transfer mechanism, so that the height position of the plunger relative to the second holding portion is maintained.

3. The resin molding device according to claim 1 or 2, wherein: The conveying mechanism also includes: a base member on which the first holding portion is movably disposed; A first moving body, moving in a horizontal direction relative to the base member; a second moving body that moves in a horizontal direction together with the first moving body and moves in a vertical direction relative to the first moving body; and The connecting member connects the second moving body and the first holding portion.

4. The resin molding device according to claim 3, wherein: The first lifting and moving mechanism comprises: A first sliding member, movable in a horizontal direction relative to the base member; as well as The first lifting cam mechanism moves the first holding portion upward by causing the second moving body to move upward along with the movement of the first sliding member.

5. The resin molding device according to claim 3 or 4, wherein: The horizontal movement mechanism comprises: a second sliding member, movable in a horizontal direction relative to the base member; as well as The link mechanism enables the first moving body to move in a direction away from the tank block along with the movement of the second sliding member.

6. The resin molding device according to any one of claims 1 to 5, wherein: The conveying mechanism further includes a second lifting and moving mechanism configured to lift the first holding portion in a state where the resin molded product is moved to the outside of the extending portion by the horizontal moving mechanism.

7. The resin molding device according to claim 5, wherein: The conveying mechanism further includes a second lifting and moving mechanism, which raises the first holding portion when the resin molded product is moved to the outside of the extending portion by the horizontal moving mechanism. The second lifting and lowering movement mechanism includes a second lifting and lowering cam mechanism that moves the first holding portion upward by causing the second moving body to move upward along with the horizontal movement of the second sliding member.

8. The resin molding device according to claim 6 or 7, wherein: The conveying mechanism further includes a conveying claw, the conveying claw hooking and holding the resin molded product, The resin molded product is held by the transport claws in a state where the first holding portion is lifted by the second lifting and moving mechanism.

9. The resin molding device according to any one of claims 1 to 8, wherein: The cavity is formed in the lower mold. The first lifting and lowering mechanism raises the first holding portion until a resin sealing portion formed by the cavity of the lower mold is located above a parting line of the lower mold.

10. A method for manufacturing a resin molded product, using the resin molding apparatus according to any one of claims 1 to 9 to manufacture the resin molded product, the method for manufacturing the resin molded product comprising: A molding process is to perform resin molding on the molding object; as well as The unloading step is to unload the resin molded product after being molded by the resin.

Images