Communication device

Abstract

A communication device (100) is provided with: a main body unit (101); and a wireless communication unit that is housed in the main body unit (101) and performs wireless communication by magnetic coupling with an external device close to the main body unit (101). The main body section (101) has an exposed surface (103) that is exposed from the wall surface (203) in a state of being inserted into an opening (201) of the wall surface (203) and attached to the wall surface (203), the wireless communication section has a substrate (132) on which a coil pattern that magnetically couples with an external device is formed, and the substrate (132) is not parallel to the exposed surface (103).

Description

Technical Field

[0001] The invention relates to a communication device. Background Art

[0002] It is known that by installing a device such as a control panel used in FA (Factory Automation) sites, a device with functions such as a user interface can be added. If the device installed in such a device can perform wireless communication with mobile terminals such as smartphones and tablet terminals, it becomes easier for operators to input and output data, and convenience is improved.

[0003] Here, in order to allow users who use the device to easily install and use the device without having to perform complex preliminary operations such as network settings, it is preferred that the device installed in the device and the mobile terminal perform short-range wireless communication. Therefore, it is conceivable to apply the technology of short-range wireless communication to the device installed in the device (for example, refer to Patent Document 1).

[0004] Patent Document 1: Japanese Patent Application Publication No. 2011-091503 Summary of the invention

[0005] Patent Document 1 describes a digital camera having an antenna that performs short-range wireless communication when an antenna of a target device approaches. With such a digital camera, the target device can approach from top to bottom, left to right, and front to back, so the antenna can be arranged with high freedom.

[0006] However, the device installed in the equipment is usually integrated with the equipment except for one surface for performing the original function, so the short-range wireless communication is performed via this one surface. Here, as in Patent Document 1, if a planar antenna is built-in in a manner opposite to the antenna of the counterpart device, it is necessary to enlarge the above-mentioned one surface of the device to be installed in the equipment by at least the area of ​​the antenna. Therefore, when the short-range wireless communication function is installed in the device to be installed in the equipment, there is a concern that the device will become larger.

[0007] The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to suppress the enlargement of a device when a short-distance wireless communication function is installed in a device to be installed in an appliance.

[0008] In order to achieve the above-mentioned purpose, the communication device of the present invention comprises: a main body; and a wireless communication unit, which is housed in the main body and performs wireless communication with an external instrument close to the main body through magnetic coupling, the main body having an exposed surface exposed from the wall surface when inserted into an opening portion of the wall surface and installed on the wall surface, and the wireless communication unit having a substrate formed with a coil pattern for magnetic coupling with the external instrument, and the substrate is not parallel to the exposed surface.

[0009] Effects of the Invention

[0010] According to the present invention, the substrate on which the coil pattern is formed is not parallel to the exposed surface. Therefore, the area to be ensured in the exposed surface for wireless communication is smaller than the area of ​​the substrate. Thus, it is possible to suppress the enlargement of the device when the function of short-range wireless communication is installed in the device to be installed in the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a diagram showing the appearance of a communication device according to Embodiment 1.

[0012] Figure 2 This is a diagram showing a state in which the communication device according to Embodiment 1 is installed in a device.

[0013] Figure 3 This is a diagram showing the structure of the main body portion according to the first embodiment.

[0014] Figure 4 FIG. 1 is a diagram schematically showing a magnetic field generated by the coil pattern according to the first embodiment.

[0015] Figure 5 This is a diagram showing a state in which the substrate according to Embodiment 1 is tilted with respect to the exposed surface.

[0016] Figure 6 It is a diagram showing a frame including a substrate according to a comparative example.

[0017] Figure 7 It is a figure which shows the coil pattern concerning Embodiment 2.

[0018] Figure 8 This is a diagram schematically showing a magnetic field generated by a coil pattern according to the second embodiment.

[0019] Fig. 9 FIG. 1 is a first diagram showing a coil pattern according to a modification example.

[0020] Fig.10 It is a figure which shows the coil pattern concerning Embodiment 3.

[0021] Fig.11 This is a diagram schematically showing a cross section of a substrate according to the third embodiment.

[0022] Fig.12 FIG. 1 is a diagram schematically showing a magnetic field generated by a coil pattern according to the third embodiment.

[0023] Fig.13 It is a diagram schematically showing the generation of a magnetic field according to a modification example.

[0024] Fig.14 FIG. 1 schematically shows a cross section of a substrate according to a modification example.

[0025] Fig.15 FIG. 2 is a schematic diagram showing a cross section of a substrate according to a modification example.

[0026] Fig.16 It is a figure which shows the coil pattern concerning Embodiment 4.

[0027] Fig.17 This is a diagram schematically showing a cross section of a substrate according to a fourth embodiment.

[0028] Fig.18 FIG3 is a schematic diagram showing a cross section of a substrate according to a modification example.

[0029] Fig.19 FIG. 4 schematically shows a cross section of a substrate according to a modification example.

[0030] Fig. 20 It is a figure which shows the coil pattern concerning Embodiment 5.

[0031] Fig.21 This is a diagram schematically showing a cross section of a substrate according to the fifth embodiment.

[0032] Fig. 22 FIG5 schematically shows a cross section of a substrate according to a modification example.

[0033] Fig.23 It is a diagram showing a communication device according to a modification example. DETAILED DESCRIPTION

[0034] Below, while referring to the attached Figure 1 The communication device involved in the embodiment of the present invention is described in detail. In addition, in the figure, arrow Z1 refers to the direction of the communication device inserted into the device, and arrow Z2 refers to the direction opposite to arrow Z1. Arrows X1, X2 and arrows Y1, Y2 refer to directions orthogonal to arrows Z1, Z2, respectively. In the embodiment, the description is centered on an example in which arrows X1, X2 refer to the horizontal direction and arrows Y1, Y2 refer to the vertical direction. The exposed surface of the communication device when installed in the device is the XY plane.

[0035] Implementation Method 1

[0036] The communication device 100 according to this embodiment is as follows Figure 1As shown, the display is installed in the device 200 as a control panel, thereby functioning as a user interface of the device 200. The communication device 100 includes: a main body 101, which is used to perform the user interface function of the communication device 100; a mounting portion 102, which is used to mount and fix the main body 101 to the device 200; and an exposed surface 103, which is exposed to the outside of the device 200 when installed in the device 200.

[0037] The communication device 100 is mounted on the device 200 by inserting the main body 101 along the arrow Z1 from the side of the communication device 100 opposite to the exposed surface 103 toward the opening 201 provided on the wall surface 203 of the device 200, and fixing the mounting portion 102 to the hole 202 on the inner wall surface side of the device 200 by screws not shown. Figure 1 , the mounting portion 102 is illustrated as a metal fitting having a screw hole, but the mounting portion 102 may be a metal fitting mounting portion for mounting the metal fitting after the main body 101 is inserted into the opening 201. The exposed surface 103 is a surface on the Z2 side of the main body 101 that is exposed from the wall 201 when the main body 101 is inserted into the opening 201 of the wall 203 and mounted on the wall 201, and includes a display surface 104 that displays an image to an operator who operates the device 200.

[0038] Inside the communication device 100, a substrate 132 including a coil pattern that functions as an antenna for near-field wireless communication is arranged parallel to the XZ plane. Figure 2 2 shows a communication device 100 installed in a device 200 and integrated with the device 200. Figure 2 As shown, the exposed surface 103 includes the display surface 104 and the frame of the display surface 104 .

[0039] The main function of the communication device 100 as a display is a user interface, so it is preferred that the display surface 104 used to perform this function occupies a larger proportion of the exposed surface 103 and the frame occupies a smaller proportion. The operator brings the mobile terminal close to the substrate 132 arranged inside the frame to input and output data through short-range wireless communication.

[0040] exist Figure 3 The structure of the main body 101 is shown in FIG. Figure 3 As shown, the main body 101 includes: a control unit 110 that controls each component of the main body 101; a device communication unit 120 that communicates with the device 200; a wireless communication unit 130 that performs short-range wireless communication with an external device; and a display unit 140 that displays an image on the display surface 104. The display surface 104 is equivalent to an example of a screen that displays an image, and the display unit 140 is equivalent to an example of a display unit that displays an image on the screen within the exposed surface.

[0041] The device communication unit 120 may be connected to the device 200 via a cable to perform wired communication with the device 200 , or may be wirelessly connected to the device 200 .

[0042] The control unit 110 includes a CPU (Central Processing Unit) or an MPU (Micro Processing Unit) and memories such as RAM (Random Access Memory) and ROM (Read Only Memory). The control unit 110 controls the device communication unit 120, the wireless communication unit 130, and the display unit 140 by executing programs stored in the memory.

[0043] Specifically, the control unit 110 notifies the device 200 of the operation content of the operator on the touch screen of the display unit 140 or the result of processing the operation content via the device communication unit 120, thereby realizing the function as the input interface of the communication device 100. In addition, the control unit 110 displays an image created based on a signal received from the device 200 via the device communication unit 120 on the display unit 140, thereby realizing the function as the output interface of the communication device 100. In addition, the control unit 110 processes the data received from the external device via the wireless communication unit 130 and transmits the data to the external device via the wireless communication unit 130.

[0044] The wireless communication unit 130 is housed in the main body 101 and is equivalent to an example of a wireless communication unit. The wireless communication unit performs wireless communication with an external device close to the exposed surface 103 of the main body 101 through magnetic coupling. The wireless communication unit 130 includes: a communication circuit unit 131 including a communication interface circuit; and a substrate 132 on which a coil pattern 133 is formed for magnetic coupling with the external device. The coil pattern 133 has: Figure 3 The conductor portion represented by the solid line is printed on the surface of the substrate 132 as a rigid substrate; and the conductor portion represented by the dotted line is printed on the back of the substrate 132. These conductor portions are electrically connected by a through-hole conductor or a via conductor that penetrates the insulating layer of the substrate. Therefore, the coil pattern 133 forms a coil and acts as an inductor. The communication circuit portion 131 sends and receives data with the external instrument through the magnetic coupling between the coil pattern 133 and the coil possessed by the external instrument.

[0045] As described above, the substrate 132 is arranged parallel to the XZ plane. Therefore, when a current flows through the coil pattern 133, a Figure 4The magnetic field is represented by the dotted line in FIG. Generally, the magnetic flux density generated by a coil has a large value at the central axis of the coil, but according to Figure 4 It can be seen that a fringe magnetic field is also generated in the external device 300 located in the Z2 direction, and therefore communication can be achieved using the coil pattern 133 as an antenna.

[0046] In addition, since the induced current caused by the magnetic field generated by the antenna on the external device 300 side is weaker than when the substrates including the antennas are placed facing each other, the wireless communication unit 130 can receive data from the external device 300. When the central axis of the coil as the antenna on the external device 300 side coincides with the substrate 132, almost no induced current is generated, but in such a case, a message prompting the adjustment of the position or posture of the external device 300 may be displayed on the display unit 140.

[0047] The example in which the substrate 132 is parallel to the XZ plane, that is, the substrate 132 is perpendicular to the exposed surface 103 and the angle θ between the substrate 132 and the exposed surface 103 is 90 degrees is described, but the present invention is not limited thereto. The angle θ may also be Figure 5 The angle is greater than zero and less than 90 degrees. That is, the substrate 132 and the exposed surface 103 may not be parallel. Figure 5 It can be seen that the angle θ formed by the substrate 132 and the exposed surface 103 may also be the angle formed by a plane obtained by extending the substrate 132 and a plane obtained by extending the exposed surface 103. Figure 4 , 5 It can be seen that the angle θ is equal to the acute angle formed by the substrate 132 and the exposed surface 103 .

[0048] As described above, the substrate 132 on which the coil pattern 133 serving as the antenna is formed is not parallel to the exposed surface 103. Therefore, the area to be ensured for wireless communication in the exposed surface 103 is smaller than the area of ​​the substrate. Figure 5 The width D1 of the frame surrounding the display surface in the exposed surface 103 shown is smaller than that in Figure 6 The width D2 of the frame of the exposed surface 103 parallel to the substrate 132a is shown as a comparative example. Thus, when the communication device 100 to be mounted on the equipment 200 is equipped with a near-field wireless communication function, the size of the communication device 100 can be suppressed.

[0049] In particular, if the angle θ is greater than or equal to 60 degrees, the area to be ensured in the exposed surface 103 is less than or equal to half the area of ​​the substrate 132, and therefore, the angle θ is preferably greater than or equal to 60 degrees. If the angle θ is greater than or equal to 85 degrees, the area to be ensured in the exposed surface 103 is less than or equal to 10% of the area of ​​the substrate 132, and therefore, it is more suitable.

[0050] Furthermore, although the example in which the number of turns of the coil pattern 133 is two has been described, the number of turns may be one or may be greater than two.

[0051] Implementation Method 2

[0052] Next, in Embodiment 2, the differences from Embodiment 1 are mainly described. In addition, the same reference numerals are used for the same or equivalent structures as those in Embodiment 1. The difference between this embodiment and Embodiment 1 is that coil pattern 133 includes a plurality of coil-shaped patterns having different center points.

[0053] like Figure 7 As shown, the coil pattern 133 includes a first coil pattern 151 indicated by a blackened area and a second coil pattern 152 indicated by a shaded area. The number of turns of the first coil pattern 151 and the second coil pattern 152 is 1 respectively, and the coil pattern 133 is equivalent to a coil with a number of turns of 2. The first coil pattern 151 and the second coil pattern 152 are formed on the same surface 1321 of the substrate 132, and the first coil pattern 151 is formed on the outer peripheral side of the second coil pattern 152.

[0054] The center point C22 of the second coil pattern 152 is closer to the exposed surface 103 than the center point C21 of the first coil pattern 151. The center points C21 and C22 may be the centers of gravity of the first coil pattern 151 and the second coil pattern 152, or may be points on the surface 1321 of the substrate 132 that is the same as the first coil pattern 151 and the second coil pattern 152 where the magnetic flux density is the largest when current flows through the first coil pattern 151 and the second coil pattern 152, respectively.

[0055] The first coil pattern 151 includes a first conductor portion 151a on the exposed surface 103 side and a second conductor portion 151b located on the opposite side of the exposed surface 103 across the first conductor portion 151a, and the second coil pattern 152 includes a third conductor portion 152a on the exposed surface 103 side and a fourth conductor portion 152b located on the opposite side of the exposed surface 103 across the third conductor portion 152a. Furthermore, a distance D11 between the first conductor portion 151a and the third conductor portion 152a is smaller than a distance D12 between the second conductor portion 151b and the fourth conductor portion 152b.

[0056] According to the coil pattern 133 involved in this embodiment, as shown in FIG. Figure 8 As shown, it is considered that by making the conductor pattern on the exposed surface 103 side of the conductor pattern constituting the coil pattern 133 denser, the magnetic flux density around it becomes larger. This is expected to improve the efficiency of short-range wireless communication with the external device 300.

[0057] In addition, although the example in which the number of turns of each of the first coil pattern 151 and the second coil pattern 152 is 1 is described, the present invention is not limited thereto. The number of turns of at least one of the first coil pattern 151 and the second coil pattern 152 may be greater than 1. Fig. 9 , the coil pattern 133 is shown in the example in which the number of turns of the first coil pattern 151 and the second coil pattern 152 are 2 respectively. Regardless of the number of turns, it is sufficient as long as the distance D22 between the center point C22 of the second coil pattern 152 and the exposed surface 103 is smaller than the distance D21 between the center point C21 of the first coil pattern 151 and the exposed surface 103. However, in the case where the first coil pattern 151 is located on the inner circumference side and the second coil pattern 152 is located on the outer circumference side, it is sufficient as long as the distance D21 is smaller than the distance D22. The coil pattern 133 only needs to have the first coil pattern 151 and the second coil pattern 152 such that the distance D21 is different from the distance D22. The distance D21 is equivalent to an example of the first distance between the center of the first coil pattern and the exposed surface, and the distance D22 is equivalent to an example of the second distance between the center of the second coil pattern and the exposed surface.

[0058] Implementation 3

[0059] Next, in Embodiment 3, the explanation will be centered around the differences from Embodiment 1. In addition, the same reference numerals are used for the same or equivalent structures as those in Embodiment 1. The difference between this embodiment and Embodiment 1 is that the coil pattern 133 includes a plurality of coil-shaped patterns formed on different layers of the substrate 132.

[0060] like Fig.10 As shown, the coil pattern 133 includes a first coil pattern 161 indicated by a blackened area and a second coil pattern 162 indicated by a shaded area. The first coil pattern 161 is formed on the surface of the substrate 132 on the arrow Y1 side, and the second coil pattern 162 is formed on the back surface of the substrate 132 on the arrow Y2 side, and is electrically connected to the first coil pattern 161 via a conductor 163a which is a through-hole conductor or a via conductor. The number of turns of the first coil pattern 161 and the second coil pattern 162 is 1 respectively, and the coil pattern 133 is equivalent to a coil with 2 turns.

[0061] The center point C31 of the first coil pattern 161 is closer to the exposed surface 103 than the center point C32 of the second coil pattern 162. That is, the distance D31 between the center point C31 and the exposed surface 103 is smaller than the distance D32 between the center point C32 and the exposed surface 103. The center points C31 and C32 may be defined in the same manner as the center points C21 and C22 in the second embodiment.

[0062] The cross section of the substrate 132 at line AA is Fig.11 As shown schematically in Fig.11 As shown, the first coil pattern 161 is formed on the conductor layer on the surface of the substrate 132, and the second coil pattern 162 is formed on the conductor layer on the back surface of the substrate 132. Fig.11 It can be seen that the coil corresponding to the coil pattern 133 including the first coil pattern 161 and the second coil pattern 162 is inclined with respect to the substrate 132 .

[0063] According to the communication device 100 having the coil pattern 133 involved in this embodiment, as shown in FIG. Fig.12 As shown, even if the angle θ between the substrate 132 and the exposed surface 103 is 90 degrees, the central axis of the coil pattern 133 is inclined relative to the Y axis. As a result, the value of the magnetic flux density at the position of the external device 300 is expected to increase. Therefore, it is considered that the communication efficiency with the external device 300 is improved.

[0064] Furthermore, if the angle θ is made smaller than 90 degrees, then Fig.13 As shown, the central axis of the coil is brought closer to the Z axis, and as a result, the communication efficiency with the external device 300 is expected to be further improved.

[0065] Alternatively, the substrate 132 may be a multi-layer substrate, and the coil pattern 133 may include coil patterns formed on different conductor layers. Fig.14 1 shows an example in which the coil pattern 133 includes, in addition to the first coil pattern 161 and the second coil pattern 162, a third coil pattern 163 formed on the Y1 side relative to the first coil pattern 161, and a fourth coil pattern 164 and a fifth coil pattern 165 formed on the Y2 side relative to the second coil pattern 162. For any coil pattern, the distance D30 between the conductor on the exposed surface 103 side and the conductor on the opposite side is equal, and the center points C31, C32, the center point C33 of the third coil pattern 163, the center point C34 of the fourth coil pattern 164, and the center point C35 of the fifth coil pattern 165 approach the exposed surface 103 in sequence along the arrow Y1. In other words, in the order of the stacking direction of the substrate 132, the center points C31, C32, C33, C34, and C35 of each layer approach the exposed surface 103.

[0066] In addition, you can also Fig.15 As shown Fig.14 The scheme is further transformed. Fig.15 In the example, the center point C33 is closer to the exposed surface 103 than the center point C31, the center point C34 is closer to the exposed surface 103 than the center point C32, and the center point C35 is closer to the exposed surface 103 than the center point C34.

[0067] Furthermore, although the example in which the number of turns of each of the first coil pattern 161 and the second coil pattern 162 is 1 has been described, the present invention is not limited thereto. The number of turns of at least one of the first coil pattern 161 and the second coil pattern 162 may be greater than 1.

[0068] Implementation 4

[0069] Next, in Embodiment 4, the difference between Embodiment 1 and the above-mentioned Embodiment 1 is mainly described. In addition, the same reference numerals are used for the same or equivalent structures as those in Embodiment 1. The difference between this embodiment and Embodiment 1 is that the conductor portions on the exposed surface 103 side of the plurality of coil patterns constituting the coil pattern 133 are formed on the same surface of the substrate 132, while the conductor portions on the opposite side are formed on different layers.

[0070] like Fig.16 As shown, the coil pattern 133 includes a first coil pattern 171 indicated by a blackened area and a second coil pattern 172 indicated by a shaded area. The number of turns of the first coil pattern 171 and the second coil pattern 172 is 1 respectively, and the coil pattern 133 is equivalent to a coil with 2 turns.

[0071] The first coil pattern 171 includes a first conductor portion 171a on the exposed surface 103 side and a second conductor portion 171b located on the opposite side of the exposed surface 103 across the first conductor portion 171a. The first conductor portion 171a and the second conductor portion 171b are both formed on the surface 1321 of the substrate 132. The second coil pattern 172 includes a third conductor portion 172a on the exposed surface 103 side and a fourth conductor portion 172b located on the opposite side of the exposed surface 103 across the third conductor portion 172a. The third conductor portion 172a is formed on the surface 1321 in the same manner as the first coil pattern 171, but the fourth conductor portion 172b is formed on the back side of the substrate 132. The third conductor portion 172a and the fourth conductor portion 172b are arranged on the surface 1321. Fig.16 The two are electrically connected by conductors shown by hollow circles.

[0072] The cross section of the substrate 132 at line BB is Fig.17 As shown schematically in Fig.17 As shown, the first conductor portion 171a and the second conductor portion 171b constituting the first coil pattern 171 are both formed on the conductor layer on the surface of the substrate 132. On the other hand, the third conductor portion 172a of the second coil pattern 172 is formed on the conductor layer on the surface of the substrate 132, and the fourth conductor portion 172b is formed on the conductor layer on the back side of the substrate 132.

[0073] According to the communication device 100 having the substrate 132 of the present embodiment, the value of the magnetic flux density on the exposed surface 103 side becomes larger in the magnetic field generated by the coil pattern 133, and it is expected that the communication efficiency will be improved. In particular, it is preferred that the first conductor portion 171a and the third conductor portion 172a are arranged close to each other, and the second conductor portion 171b and the fourth conductor portion 172b overlap on the XZ plane.

[0074] Furthermore, although an example in which the angle θ is 90 degrees has been described, the angle θ may be changed as shown in the above embodiment.

[0075] Alternatively, the substrate 132 may be a multi-layer substrate, and the coil pattern 133 may include two or more coil patterns that are partially formed on different layers. Fig.18 In the example of , in addition to the first conductor portion 171a and the third conductor portion 172a, the fifth conductor portion 173a, the seventh conductor portion 174a, and the ninth conductor portion 175a are also formed in the same conductor layer on the exposed surface 103 side. In addition, the sixth conductor portion 173b constituting the third coil pattern together with the second conductor portion 171b, the fourth conductor portion 172b, and the fifth conductor portion 173a, the eighth conductor portion 174b constituting the fourth coil pattern together with the seventh conductor portion 174a, and the tenth conductor portion 175b constituting the fifth coil pattern together with the ninth conductor portion 175a are formed along the Y axis on the Z1 side. According to the substrate 132 configured in this way, it is also expected that the communication efficiency will be improved. Fig.18 The example is equivalent to the usual cylindrical coil such as Fig.15 Another example of deformation after bending is shown.

[0076] Furthermore, although the example in which the number of turns of each of the first coil pattern 171 and the second coil pattern 172 is 1 has been described, the present invention is not limited thereto. The number of turns of at least one of the first coil pattern 171 and the second coil pattern 172 may be greater than 1.

[0077] In addition, it is also considered that Fig.18 The configuration of the conductor parts on the Z1 side and the Z2 side shown in FIG. Fig.19 As shown in FIG. 1 , the conductor portion formed in multiple layers is arranged near the exposed surface 103, so that a more uniform magnetic field is formed on the exposed surface 103 side than on the opposite side, thereby improving the stability of communication with the external device 300. Figures 16 to 18In the embodiment, the substrate 132 may have a coil pattern that is symmetrical with respect to the X axis. The parameters that affect the magnetic flux density include, in addition to the coil pattern, the distance between the substrate 132 and the exposed surface 103, the materials of the communication device 100 and the equipment 200, the posture of the substrate 132, and other factors. Therefore, the coil pattern to be installed in the communication device 100 may be determined after verifying the communication efficiency and the stability of the communication.

[0078] The coil pattern formed on the substrate 132 includes a first coil pattern and a second coil pattern, the number of turns of the first coil pattern and the second coil pattern are at least 1, the first coil pattern includes a first conductor portion on one side and a second conductor portion on the other side in the direction of the Z2 direction in which the exposed surface is exposed and the Z1 direction in which the main body 101 is inserted, and the second coil pattern only needs to include a third conductor portion on one side and a fourth conductor portion on the other side. As long as the first conductor portion and the third conductor portion are formed on the same surface of the substrate, the second conductor portion and the fourth conductor portion may be formed on different layers of the substrate.

[0079] Implementation method 5

[0080] Next, in Embodiment 5, the difference from Embodiment 1 is mainly described. In addition, the same reference numerals are used for the same or equivalent configurations as those in Embodiment 1. The difference between this embodiment and Embodiment 1 is that part of the conductor parts constituting coil pattern 133 are connected in parallel.

[0081] like Fig. 20 As shown, the coil pattern 133 includes a first conductor portion 181 on the Z2 side, i.e., the exposed surface 103 side, and a conductor portion 182 on the Z1 side, i.e., located on the opposite side of the exposed surface 103 across the first conductor portion 181. However, the conductor portion 182 includes a second conductor portion 182a, a third conductor portion 182b, and a fourth conductor portion 182c formed in different layers from each other. The second conductor portion 182a, the third conductor portion 182b, and the fourth conductor portion 182c are electrically connected in parallel to the first conductor portion 181 via a through-hole conductor or a via conductor.

[0082] The cross section of the substrate 132 at line CC is Fig.21 is schematically shown in Fig.21 In the example of FIG. 1 , the conductor portion 182 of the coil pattern 133 electrically connects different conductor layers through via conductors.

[0083] According to the communication device 100 including the substrate 132 according to the present embodiment, in the magnetic field generated by the coil pattern 133 , the value of the magnetic flux density on the exposed surface 103 side becomes large, and it is expected that the communication efficiency will be improved.

[0084] In addition, the example in which the conductor portion 182 of the coil pattern 133 has a conductor pattern formed in three different layers is described, but the invention is not limited to this. The layers forming the conductor pattern constituting the conductor portion 182 may be two layers or more than three layers. In particular, the case in which the conductor pattern constituting the conductor portion 182 is formed across five layers is equivalent to Fig.18 The illustrated example shows an example in which the first conductor portion 171a, the third conductor portion 172a, the fifth conductor portion 173a, the seventh conductor portion 174a, and the ninth conductor portion 175a are collectively transformed into one conductor pattern.

[0085] In addition, although the example in which the number of turns of the coil pattern 133 is 1 is described, the present invention is not limited to this. The number of turns of the coil pattern 133 may be larger than 1.

[0086] In addition, it is also considered that Fig.21 The configuration of the conductor parts on the Z1 side and the Z2 side shown in FIG. Fig. 22 As shown in FIG. 1 , the conductor portion formed of multiple layers is arranged near the exposed surface 103, so that a more uniform magnetic field is formed on the exposed surface 103 side than on the opposite side, thereby improving the stability of communication with the external device 300. Figures 20-21 In the embodiment, the substrate 132 may have a coil pattern that is symmetrical with respect to the X axis. There are various parameters that affect the magnetic flux density, and therefore, after verifying the relationship between these parameters and the shape of the coil pattern, and the communication efficiency and stability of the communication, the coil pattern to be installed in the communication device 100 may be determined.

[0087] The coil pattern has a first conductor portion on one side of the Z2 direction in which the outside of the exposed surface 103 is exposed and a second conductor portion and a third conductor portion on the other side connected in parallel with the first conductor portion. The second conductor portion and the third conductor portion only need to be formed on different layers of the substrate.

[0088] As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment.

[0089] For example, the example in which the communication device 100 substantially corresponds to the main body 101 has been described, but the present invention is not limited thereto. The communication device 100 may include a component different from the mounting portion 102 in addition to the main body 101 .

[0090] In addition, the shape of the communication device 100 is not limited to a rectangular parallelepiped, and may be any shape. Fig.23As shown, the main body 101 of the communication device 100 may also include a screen unit 105 including a display surface that is larger than the opening 201 when viewed from the operator in the Z2 direction. In this example, when the communication device 100 is inserted and mounted in the opening 201 of the device 200, the substrate 132 disposed inside the frame at the periphery of the display surface in the screen unit 105 enables short-range wireless communication.

[0091] In addition, the example in which the communication device 100 is a display has been described, but the invention is not limited thereto. For example, the communication device 100 may be a speaker or a storage device installed in the device 200 as a control panel. In addition, the device 200 may not be a control panel. For example, the device 200 may be a wall of a building made of materials such as concrete, wood, and metal. The device 200 only needs to have a wall surface 203 for installing the communication device 100, and the communication device 100 may be installed in a recessed portion of the wall surface 203.

[0092] In addition, an example in which the communication device 100 is installed on the device 200 by fastening with screws using the installation portion 102 is described, but the present invention is not limited to this, and the method of installing the communication device 100 on the device 200 may be arbitrarily changed. For example, the installation portion 102 may be omitted from the communication device 100. Specifically, when the rectangular main body 101 is inserted into the opening 201, the installation portion that is installed by pressing or clamping the main body 101 may be provided on the wall surface 203 or the opening 201. In addition, the communication device 100 may be fixed to the opening 201 by adsorbing the steel plate included in the frame of the main body 101 through a magnet provided at the bottom of the opening 201.

[0093] The present invention can realize various embodiments and variations without departing from the broad spirit and scope of the present invention. In addition, the above-mentioned embodiments are used to illustrate the present invention and are not intended to limit the scope of the present invention. That is, the scope of the present invention is not shown by the embodiments but by the claims. Moreover, various variations implemented within the scope of the claims and within the scope of the meaning of the invention equivalent thereto are deemed to be included within the scope of the present invention.

[0094] Industrial Applicability

[0095] The present invention is applicable to a device which is mounted on a wall surface and performs short-range wireless communication.

[0096] Description of the label

[0097] 100 communication device, 101 main body, 102 mounting portion, 103 exposed surface, 104 display surface, 105 screen unit, 110 control portion, 120 device communication portion, 130 wireless communication portion, 131 communication circuit portion, 132, 132a substrate, 1321 surface, 133 coil pattern, 140 display portion, 151, 161, 171 first coil pattern, 151a, 171a, 181 first conductor portion, 151b, 171b, 182a second conductor portion, 152, 162, 172 second coil pattern, 152a, 172a, 182b third conductor portion, 152b, 172b , 182c the 4th conductor portion, 163 the 3rd coil pattern, 163a the conductor, 164 the 4th coil pattern, 165 the 5th coil pattern, 173a the 5th conductor portion, 173b the 6th conductor portion, 174a the 7th conductor portion, 174b the 8th conductor portion, 175a the 9th conductor portion, 175b the 10th conductor portion, 182 the conductor portion, 200 the device, 201 the opening portion, 202 the hole, 300 the external instrument, C21, C22, C31, C32, C33, C34, C35 the center point, D1, D2 the width, D11, D12, D21, D22, D30, D31, D32 the distance, θ the angle.

Claims

1. A communication device, comprising: the main body; and a wireless communication unit, which is housed in the main body and performs wireless communication with an external device close to the main body by magnetic coupling, The main body has an exposed surface exposed from the wall surface in a state where the main body is inserted into the opening of the wall surface and mounted on the wall surface. The wireless communication unit includes a substrate on which a coil pattern for performing the magnetic coupling with the external device is formed. The substrate is not parallel to the exposed surface.

2. The communication device according to claim 1, wherein: An angle formed between the substrate and the exposed surface is greater than or equal to 60 degrees.

3. The communication device according to claim 1 or 2, wherein: The coil pattern includes a first coil pattern and a second coil pattern, and the number of turns of the first coil pattern and the second coil pattern is at least 1, respectively. A first distance between a center of the first coil pattern and the exposed surface is different from a second distance between a center of the second coil pattern and the exposed surface.

4. The communication device according to claim 3, wherein: The first coil pattern is formed on the surface of the substrate on which the second coil pattern is formed, and on the outer peripheral side of the second coil pattern. The center of the second coil pattern is closer to the exposed surface than the center of the first coil pattern.

5. The communication device according to claim 3, wherein: The first coil pattern is formed on the substrate in a layer different from a layer on which the second coil pattern is formed.

6. The communication device according to claim 1 or 2, wherein: The coil pattern includes a first coil pattern and a second coil pattern, and the number of turns of the first coil pattern and the second coil pattern is at least 1, respectively. The first coil pattern includes a first conductor portion on one side of a direction in which the outside of the exposed surface is exposed and a direction in which the main body is inserted, and a second conductor portion on the other side. The second coil pattern includes a third conductor portion on the one side and a fourth conductor portion on the other side. The first conductor portion and the third conductor portion are formed on the same surface of the substrate. The second conductor portion and the fourth conductor portion are formed on different layers of the substrate.

7. The communication device according to claim 1 or 2, wherein: The coil pattern includes a first conductor portion on one side of a direction in which the exposed surface is exposed to the outside and a direction in which the main body portion is inserted, and a second conductor portion and a third conductor portion on the other side connected in parallel to the first conductor portion. The second conductor portion and the third conductor portion are formed on different layers of the substrate.

8. The communication device according to any one of claims 1 to 7, wherein: It also includes a display unit, which displays an image on a screen within the exposed surface. The substrate is arranged inside a frame surrounding the screen.

Images