Wiring circuit board

Abstract

A wiring circuit board (1) is provided with a frame (2), a mounting part (3), and a connector (4). The carrying part (3) is surrounded by the frame (2). The mounting part (3) is spaced apart from the frame (2). The connecting piece (4) connects the frame (2) and the carrying part (3). The frame (2) and the mounting portion (3) each include a base insulating layer (12), a wiring layer (13), and a cover insulating layer (14), and may also include a metal support layer (11). The base insulating layer (12) is disposed on one surface of the metal support layer (11) in the thickness direction. The wiring layer (13) is disposed on one surface of the base insulating layer (12) in the thickness direction. The cover insulating layer (14) is disposed on one surface of the base insulating layer (12) in the thickness direction. The cover insulating layer (14) covers a part of the wiring layer (13). The connecting piece (4) does not comprise a metal supporting layer (11). The connector (4) includes a base insulating layer (12), a wiring layer (13), and a cover insulating layer (14).

Description

Technical Field

[0001] The present invention relates to a wiring circuit substrate. Background Art

[0002] A wiring circuit substrate for mounting an imaging element is known (for example, refer to Patent Document 1 below). The wiring circuit substrate described in Patent Document 1 includes: a frame; a mounting portion surrounded by the frame; and a supporting member connecting the frame and the mounting portion. The supporting member is formed of a rigid material. The rigid material includes stainless steel. The wiring circuit substrate described in Patent Document 1 is provided in an imaging device in a state where an imaging element is mounted in the mounting portion. In the wiring circuit substrate described in Patent Document 1, the frame elastically supports the mounting portion using the supporting member.

[0003] If the camera moves (vibrates), the frame moves (vibrates). In this way, the mounting portion swings (wobbles) in conjunction with the movement (vibration) of the frame. However, the swing (wobbles) of the mounting portion is corrected by the support member. The correction is referred to as swing correction (wobbles correction).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application No. 2020-30306 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] There is a demand to correct the swing of the mounting portion with a small force according to the use and purpose of the wired circuit board. However, the wired circuit board described in Patent Document 1 has a disadvantage that it cannot meet the above-mentioned demand.

[0009] The present invention provides a wiring circuit substrate capable of correcting the swing of a mounting portion with a small force.

[0010] Solutions for solving problems

[0011] The present invention [1] includes a wiring circuit substrate, wherein the wiring circuit substrate has: a frame; a mounting portion, which is surrounded by the frame and separated from the frame; and a connector, which connects the frame and the mounting portion, wherein the frame and the mounting portion each include: a base insulating layer; a wiring layer, which is arranged on a surface on one side in the thickness direction of the base insulating layer; and a covering insulating layer, which is arranged on a surface on one side in the thickness direction of the base insulating layer and covers a portion of the wiring layer, wherein the frame and the mounting portion each also include a metal supporting layer, which is arranged on a surface on the other side in the thickness direction of the base insulating layer, and the connector does not include the metal supporting layer, but includes the base insulating layer, the wiring layer, and the covering insulating layer.

[0012] In the wiring circuit substrate, the connector does not include a metal supporting layer, so the rigidity of the connector is reduced. As a result, the swing correction of the mounting portion can be performed with a small force.

[0013] The present invention [2] is based on the wiring circuit substrate described in [1], wherein the wiring layer of the mounting portion comprises: a plurality of terminals, the plurality of terminals being spaced apart from each other; and a plurality of wirings, the plurality of wirings being spaced apart from each other and electrically connected to the plurality of terminals respectively; the connector comprises a plurality of connector wirings, the plurality of connector wirings being spaced apart from each other and electrically connected to the plurality of wirings respectively; and the mounting portion comprises: a first portion, in which the plurality of wirings extend from the plurality of terminals; and a second portion, which is arranged between the first portion and the outer periphery of the mounting portion, in which the plurality of wirings are gathered together and the connector is connected to the second portion.

[0014] In this wiring circuit board, the connector is connected to the second portion where the wiring is gathered. Therefore, in the connector, the connection portion connected to the second portion can be prevented from widening. As a result, the rigidity of the connector can be reliably reduced.

[0015] Furthermore, when the frame moves and the connector bends, if the connection portion widens, the difference between the force applied to the center portion in the width direction and the force applied to one end portion in the width direction of the connector increases, and thus the swing of the mounting portion may not be accurately controlled.

[0016] However, in this wiring circuit substrate, when the frame moves and the connector bends, the connection portion can be prevented from widening, thereby reducing the difference between the force applied to the central portion in the width direction and the force applied to one end portion in the width direction in the connector, thereby enabling the swing of the mounting portion to be controlled with good precision.

[0017] The present invention [3] is based on the wiring circuit substrate described in [1] or [2], wherein the mounting portion has an edge at the outer periphery of the mounting portion, the connector includes a connecting portion that connects the connector to the edge, and the ratio of the length of the connecting portion in the direction along the edge to the length of the edge (the length of the connecting portion / the length of the edge) is less than 0.3.

[0018] In this wired circuit board, the ratio of the length of the connection portion in the direction along the side to the length of the side is 0.3 or less, so that the connection portion can be prevented from becoming wider. Therefore, the rigidity of the connector can be reliably reduced.

[0019] Furthermore, when the frame moves and the connector bends, if the connection portion widens, the difference between the force applied to the center portion in the width direction and the force applied to one end portion in the width direction of the connector increases, and thus the swing of the mounting portion may not be accurately controlled.

[0020] However, in this wiring circuit substrate, when the frame moves and the connector bends, the connection portion can be prevented from widening, thereby reducing the difference between the force applied to the central portion in the width direction and the force applied to one end portion in the width direction in the connector, thereby enabling the swing of the mounting portion to be controlled with good precision.

[0021] The present invention [4] is based on the wiring circuit substrate described in any one of [1] to [3], wherein the mounting portion has an edge at the outer periphery of the mounting portion, the connecting member is connected to a central area including a central portion of the edge, and the central area has a length of 1 / 2 of the length of the edge.

[0022] In this wired circuit board, since the connector is connected to the central region, the swing of the mounting portion can be controlled with high accuracy.

[0023] The present invention [5] is the wiring circuit board described in [3], wherein the connector is connected to a central region including a central portion of the side, and the central region has a length that is 1 / 2 of the length of the side.

[0024] In this wired circuit board, since the connector is connected to the central region, the swing of the mounting portion can be controlled with high accuracy.

[0025] The present invention [6] is the wired circuit board described in [4] or [5], wherein the connector is connected to the center portion of the side.

[0026] In this wired circuit board, since the connector is connected to the central portion, the swing of the mounting portion can be controlled with high accuracy.

[0027] The present invention [7] is based on the wiring circuit substrate described in any one of [1] to [6], wherein the mounting portion has a plurality of edges on the outer periphery of the mounting portion, a plurality of connectors are provided corresponding to the plurality of edges, and the difference in length between the longest connector and the shortest connector among the plurality of connectors is less than 3 mm.

[0028] In this wired circuit board, the difference in length between the longest connector and the shortest connector is 3 mm or less, and therefore, the accuracy of the swing correction of the mounting portion can be improved.

[0029] The present invention [8] provides the wired circuit board according to any one of [1] to [7], wherein the base insulating layer and the cover insulating layer of the connector have slits disposed between the plurality of connector wires.

[0030] In this wired circuit board, since the base insulating layer and the cover insulating layer of the connector have slits, the rigidity of the connector can be further reduced.

[0031] The present invention [9] is based on the wiring circuit substrate described in [8], wherein the slit extends along the plurality of connector wirings, and the connector has a sub-connector that divides the slit in the direction in which the slit extends and connects the plurality of connector wirings.

[0032] In this wired circuit board, the sub-connector can suppress the rigidity of the connector from being excessively reduced due to the slit, thereby suppressing excessive deformation of the connector.

[0033] The present invention

[10] is based on the wiring circuit substrate described in [9], wherein the connector includes a plurality of wiring bodies separated by the slits, and one wiring body includes at least two connector wirings.

[0034] In the wired circuit board, one wire body includes at least two wires, and therefore, the at least two wires can function as differential wirings.

[0035] The present invention

[11] is based on the wiring circuit substrate described in

[10] , wherein the slit extends along the plurality of wiring bodies, and the connector has a sub-connector that divides the slit in the direction in which the slit extends and connects the plurality of wiring bodies.

[0036] In this wired circuit board, the sub-connector can suppress the rigidity of the connector from being excessively reduced due to the slit, thereby suppressing excessive deformation of the connector.

[0037] The present invention

[12] provides the wired circuit board according to any one of [1] to

[11] , wherein the wiring layer of the connecting member includes a ground wiring electrically connected to the metal supporting layer.

[0038] The present invention

[13] is the wired circuit board according to any one of [1] to

[12] , wherein the connector has a curved shape.

[0039] In this wired circuit board, since the connector has a curved shape, the accuracy of wobble correction can be improved compared with a configuration having a straight shape and / or a bent shape.

[0040] The present invention

[14] is based on the wiring circuit substrate described in [1] or [2], wherein the mounting portion has a roughly rectangular shape, has an edge on the outer periphery of the mounting portion, the frame has a roughly rectangular frame shape, has an opposite edge opposite to the edge, and a non-opposite edge adjacent to the opposite edge and not opposite to the edge, and the connecting member connects the edge and the non-opposite edge.

[0041] In this wired circuit board, the connector connects the side and the non-opposing side that is not opposed to the side, so the connector can be extended. Therefore, the rigidity of the connector is reduced.

[0042] The present invention

[15] is based on the wiring circuit substrate described in [3], wherein the mounting portion has a roughly rectangular shape, the frame has a roughly rectangular frame shape, has a relative side opposite to the side, and a non-relative side adjacent to the relative side and not opposite to the side, and the connecting member connects the side and the non-relative side.

[0043] Effects of the Invention

[0044] The wired circuit board of the present invention can correct the swing of the mounting portion with a small force. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 It is a top view of one embodiment of the wired circuit board of the present invention.

[0046] Figure 2 yes Figure 1 An enlarged view of the wiring circuit substrate shown.

[0047] Figure 3 It is along Figure 2 Sectional view along line AA.

[0048] Figure 4 yes Figure 3 The manufacturing process diagram of the wiring circuit board shown in FIG. Figure 4 A is a step of forming a base insulating layer. Figure 4 B is a step of forming a wiring layer. Figure 4 C is a step of forming a cover insulating layer. Figure 4 D is a step of forming a metal supporting layer. Figure 4 E is a step of mounting the imaging element and the external substrate on the printed circuit substrate.

[0049] Figure 5 It is a top view of the first modified example.

[0050] Figure 6 It is a top view of the second modified example.

[0051] Figure 7 It is a top view of the third modified example.

[0052] Figure 8 It is a top view of the fourth variant.

[0053] Fig. 9 It is along Figure 8 Sectional view along line AA.

[0054] Fig.10 It is a cross-sectional view of the fifth modified example.

[0055] Fig.11 It is a cross-sectional view of the 6th variant. DETAILED DESCRIPTION

[0056] 1. One Embodiment of Wired Circuit Board

[0057] Reference Figure 1 to Figure 3 , an embodiment of the wiring circuit substrate of the present invention is described.

[0058] like Figure 1 As shown, the wiring circuit substrate 1 has a sheet shape. Figure 3 As shown, the wiring circuit substrate 1 has a thickness. Figure 1 As shown, the wired circuit board 1 extends in the plane direction.

[0059] The plane direction is perpendicular to the thickness direction. The wired circuit board 1 includes a frame 2 , a mounting portion 3 , and a connector 4 .

[0060] 1.2 Framework 2

[0061] In the present embodiment, the frame 2 has a substantially rectangular frame shape. The frame 2 includes an inner periphery 20. In the present embodiment, the frame 2 has four sides 23A, 23B, 23C, and 23D at the inner periphery 20. The four sides 23A, 23B, 23C, and 23D are arranged in sequence counterclockwise when viewed from above. The side 23A and the side 23C are opposite to each other. The side 23B connects one end of the side 23A and one end of the side 23C. The side 23D connects the other end of the side 23A and the other end of the side 23C. The side 23B and the side 23D are opposite to each other.

[0062] like Figure 3 As shown, the frame 2 includes a metal support layer 11 , a base insulating layer 12 , a wiring layer 13 , and a cover insulating layer 14 .

[0063] 1.2.1 Metal support layer 11 of frame 2

[0064] The metal supporting layer 11 extends in the plane direction of the frame 2 . The metal supporting layer 11 forms the other side surface of the frame 2 in the thickness direction.

[0065] The material of the metal support layer 11 of the frame 2 is, for example, a rigid material. Examples of the rigid material include stainless steel, 42 alloy, aluminum, copper-beryllium alloy, phosphor bronze, copper, silver, nickel, chromium, titanium, tantalum, platinum, gold, and copper alloy.

[0066] As the rigid material, stainless steel and copper alloy are preferably used from the viewpoint of ensuring the strength of the frame 2 and the mounting portion 3. The thickness of the metal supporting layer 11 of the frame 2 is, for example, 30 μm or more, preferably 100 μm or more, and, for example, 10000 μm or less, preferably 1000 μm or less.

[0067] 1.2.2 Base insulation layer 12 of frame 2

[0068] In the frame 2, the base insulating layer 12 is disposed on one side of the metal supporting layer 11 in the thickness direction. In other words, in the frame 2, the metal supporting layer 11 is disposed on the other side of the metal supporting layer 12 in the thickness direction. The base insulating layer 12 is in contact with one side of the metal supporting layer 11.

[0069] The material of the base insulating layer 12 of the frame 2 may be, for example, a resin, preferably a polyimide resin. The thickness of the base insulating layer 12 of the frame 2 is, for example, 1 μm or more, preferably 5 μm or more, and, for example, less than 20 μm, preferably 15 μm or less.

[0070] 1.2.3 Wiring layer 13 of frame 2

[0071] In the frame 2, the wiring layer 13 is arranged on one side of the base insulating layer 12 in the thickness direction. The wiring layer 13 is in contact with one side of the base insulating layer 12. Figure 2 As shown, the wiring layer 13 includes a plurality of frame terminals 131 and a plurality of frame wires 132 .

[0072] 1.2.3.1 Frame terminal 131

[0073] The plurality of frame terminals 131 and the four sides 23A and 23B (see Figure 1 )、23C(reference Figure 1), 23D (refer to Figure 1 ) are respectively arranged correspondingly. The plurality of frame terminals 131 corresponding to the edge 23A are spaced apart from each other along the edge 23A. Preferably, the plurality of frame terminals 131 are spaced apart from each other at equal intervals along the edge 23A. The plurality of frame terminals 131 corresponding to the edge 23A include a plurality of frame grounding terminals 131G and a plurality of frame differential terminals 131D. Figure 1 )、23C(reference Figure 1 ), 23D (refer to Figure 1 ) have the same structure as the structure of the multiple frame terminals 131 corresponding to the same side 23A, but this is not shown in the figure.

[0074] 1.2.3.2 Frame wiring 132

[0075] The plurality of frame wires 132 are electrically connected to the plurality of frame terminals 131. In the present embodiment, the plurality of frame wires 132 corresponding to the side 23A extend from the plurality of frame terminals 131 corresponding to the side 23A, bend, gather together, and then reach the inner peripheral edge 20. Specifically, the plurality of frame wires 132 each include a frame extension line 132A and a frame gathering line 132B.

[0076] The frame extension wires 132A corresponding to the side 23A extend from the plurality of frame terminals 131 corresponding to the side 23A toward the side 23A. The plurality of frame extension wires 132A corresponding to the side 23A are provided corresponding to the plurality of frame terminals 131 corresponding to the same side 23A.

[0077] The plurality of frame extension lines 132A are spaced apart from each other in a direction along the side 23A. The plurality of frame extension lines 132A extend in a direction intersecting the side 23A, respectively.

[0078] The frame extension wires 132A include a plurality of frame ground extension wires 132AG and a plurality of frame differential extension wires 132AD. The plurality of frame ground extension wires 132AG extend from a plurality of frame ground terminals 131G, respectively. The plurality of frame differential extension wires 132AD extend from a plurality of frame differential terminals 131D, respectively.

[0079] In the frame 2 , a region where the plurality of frame extension lines 132A are provided is referred to as a third portion 25 .

[0080] With side 23B (refer to Figure 1 )、23C(reference Figure 1 ), 23D (refer to Figure 1 ) The frame extension lines 132A corresponding to the respective sides 23A have the same structure as the frame extension lines 132A corresponding to the same sides 23A described above.

[0081] Corresponding to the multiple frame extension lines 132A corresponding to the same side 23A, there are provided multiple frame gathering lines 132B corresponding to the side 23A. The multiple frame gathering lines 132B gather together and face toward the vicinity of the second connection portion 46 (described later) of the connector 4A of the frame 3. The multiple frame gathering lines 132B respectively use one end edge of the multiple frame extension lines 132A as a starting point, and use the portion overlapping with the side 23A in the thickness direction as an end point. The one end edge is the end edge on the side opposite to the frame terminal 131 in the frame extension line 132A. The starting point of the frame gathering line 132B becomes the first bending point of the frame wiring 132. The frame gathering line 132B is bent in the area opposite to the second connection portion 46 of the connector 4A. The above-mentioned bend of the frame gathering line 132B becomes the second bending point of the frame wiring 132. The second bending point of the frame wiring 132 is spaced apart from the first bending point of the frame wiring 132 in the direction along the side 23A. Alternatively, the second bending point may be opposite to the connector 4A in the direction orthogonal to the side 23A, but not opposite to the corresponding frame terminal 131. The wiring density of the plurality of frame gathering wires 132B is higher than the wiring density of the above-mentioned frame extension wires 132A. The plurality of frame gathering wires 132B may also have equally spaced portions spaced apart from each other at equal intervals. In the present embodiment, the plurality of frame gathering wires 132B each have a substantially L-shaped shape.

[0082] In the frame 2, the region where the frame gathering line 132B is provided is set as the fourth portion 26. The fourth portion 26 is arranged between the inner peripheral edge 20 (side 23A) and the third portion 25 described above. The side 23A, the fourth portion 26, and the third portion 25 are arranged in this order. The wiring density of the frame gathering line 132B of the fourth portion 26 is higher than the wiring density of the frame extension line 132A of the third portion 25.

[0083] With side 23B (refer to Figure 1 )、23C(reference Figure 1 ), 23D (refer to Figure 1 ) The frame gathering lines 132B corresponding to the respective sides 23A have the same structure as the frame gathering lines 132B corresponding to the same sides 23A mentioned above.

[0084] As a material of the wiring layer 13 of the frame 2, a conductor can be mentioned, for example. As a conductor, copper can be mentioned preferably.

[0085] The thickness of the wiring layer 13 of the frame 2 is, for example, 1 μm or more, preferably 5 μm or more, and, for example, 50 μm or less, preferably 35 μm or less.

[0086] 1.2.4 Covering insulation layer 14 of frame 2

[0087] like Figure 3As shown, in the frame 2, the cover insulating layer 14 is arranged on one side of the thickness direction of the base insulating layer 12. The cover insulating layer 14 covers the frame wiring 132 (frame extension wire 132A and frame retracting wire 132B, see Figure 2 The cover insulating layer 14 makes the frame terminals 131 (frame ground terminals 131G and frame differential terminals 131D, see Figure 2 ) exposed.

[0088] Examples of the material of the cover insulating layer 14 include resins, preferably polyimide resins. The thickness of the cover insulating layer 14 of the frame 2 is, for example, 1 μm or more, preferably 5 μm or more, and, for example, less than 20 μm, preferably 15 μm or less.

[0089] 1.2.5 Dimensions of Frame 2

[0090] The outer dimensions of the frame 2 are not limited. Figure 1 As shown, the interval between the edge 23A and the edge 23C, and the interval between the edge 23B and the edge 23D are, for example, 5 mm or more, preferably 8 mm or more, and, for example, 50 mm or less, preferably 30 mm or less. The length of each of the edges 23A, 23B, 23C, and 23D is, for example, 5 mm or more, preferably 8 mm or more, and, for example, 50 mm or less, preferably 30 mm or less. The width of the frame 2 is, for example, 0.1 mm or more, preferably 0.3 mm or more, and, for example, 50 mm or less, preferably 30 mm or less. The width of the frame 2 is the length between the inner periphery 20 and the outer periphery.

[0091] like Figure 2 As shown, the width of each of the plurality of frame terminals 131 is, for example, greater than or equal to 10 μm, or preferably greater than or equal to 30 μm, and is, for example, less than or equal to 3000 μm, or preferably less than or equal to 1000 μm.

[0092] The pitch of the plurality of frame terminals 131 is, for example, greater than or equal to 30 μm, or preferably greater than or equal to 50 μm, and is, for example, less than or equal to 2000 μm, or preferably less than or equal to 1000 μm.

[0093] The pitch is the distance between the end edges of the adjacent frame terminals 131. The two end edges are one end edge in the direction along the side 23A. The definition of the pitch is the same as below.

[0094] In contrast, in the present embodiment, the spacing of the equally spaced portions of the plurality of frame gathering lines 132B is smaller than the spacing of the plurality of frame extension lines 132A. The spacing of the equally spaced portions of the plurality of frame gathering lines 132B is, for example, 1500 μm or less, preferably 1000 μm or less, more preferably 800 μm or less, and, for example, 10 μm or more. The ratio of the spacing of the equally spaced portions of the plurality of frame gathering lines 132B to the spacing of the plurality of frame extension lines 132A is, for example, less than 1, preferably 0.8 or less, more preferably 0.5 or less, and, for example, 0.01 or more.

[0095] The width of the frame wiring 132 is, for example, greater than or equal to 1 μm, or preferably greater than or equal to 5 μm, and, for example, less than or equal to 3000 μm, or preferably less than or equal to 1000 μm.

[0096] 1.3 Mounting part 3

[0097] like Figure 1 As shown, the mounting portion 3 is surrounded by the frame 2. The mounting portion 3 is spaced apart from the frame 2. In the present embodiment, the mounting portion 3 has a substantially rectangular shape. Preferably, the mounting portion 3 has a substantially rectangular outer shape, specifically, a substantially rectangular frame shape. The mounting portion 3 includes an outer periphery 30 and an inner periphery 39. In the present embodiment, the mounting portion 3 includes four sides 33A, 33B, 33C, and 33D in the outer periphery 30.

[0098] The four sides 33A, 33B, 33C, and 33D are arranged in order counterclockwise in a plan view. The sides 33A, 33B, 33C, and 33D of the mounting portion 3 face the sides 23A, 23B, 23C, and 23D of the frame 2, respectively.

[0099] In other words, the side 33B of the mounting portion 3 is opposed to (faces) the side 23B of the frame 2. In other words, the side 23B is an opposing side with respect to the side 33B. The side 33B extends in the same direction as the side 23B.

[0100] The side 33B of the mounting portion 3 is not opposite to (not facing) the side 23A of the frame 2. In other words, the side 23A is a non-opposite side relative to the side 33B. The side 33B is adjacent to the side 33A. The side 33B extends in a direction intersecting the side 23A. Preferably, the side 33B extends in a direction orthogonal to the side 23A.

[0101] The side 33C is along the same direction as the side 33A. The side 33B connects one end of the side 33A and one end of the side 33C. The side 33D connects the other end of the side 33A and the other end of the side 33C. The side 33D is along the same direction as the side 33B.

[0102] like Figure 3As shown, the mounting portion 3 includes a metal supporting layer 11 , a base insulating layer 12 , a wiring layer 13 , and a cover insulating layer 14 .

[0103] 1.3.1 Metal Support Layer 11 of Mounting Section 3

[0104] The metal supporting layer 11 extends in the plane direction in the mounting portion 3. The metal supporting layer 11 forms the other side surface in the thickness direction of the mounting portion 3. The material and thickness of the metal supporting layer 11 of the mounting portion 3 are the same as those of the metal supporting layer 11 of the frame 2.

[0105] 1.3.2 Base Insulation Layer 12 of Mounting Portion 3

[0106] In the mounting portion 3, the base insulating layer 12 is disposed on one side of the surface in the thickness direction of the metal supporting layer 11. In other words, in the mounting portion 3, the metal supporting layer 11 is disposed on the other side of the surface in the thickness direction of the base insulating layer 12. The base insulating layer 12 is in contact with one side of the surface of the metal supporting layer 11. The material and thickness of the base insulating layer 12 of the mounting portion 3 are the same as those of the base insulating layer 12 of the frame 2.

[0107] 1.3.3 Wiring Layer 13 of Mounting Section 3

[0108] In the mounting portion 3, the wiring layer 13 is disposed on one side of the base insulating layer 12 in the thickness direction. The wiring layer 13 is in contact with one side of the base insulating layer 12. Figure 2 As shown, the wiring layer 13 of the mounting portion 3 includes a plurality of terminals 133 and a plurality of wirings 134 .

[0109] 1.3.3.1 Terminal 133

[0110] The plurality of terminals 133 and the four sides 33A (see Figure 1 )、33B、33C(Refer to Figure 1 ), 33D (refer to Figure 1 ) are respectively arranged correspondingly. Specifically, the plurality of terminals 133 corresponding to the edge 33B are spaced apart from each other in the direction along the edge 33B. Preferably, the plurality of terminals 133 are spaced apart from each other at equal intervals in the direction along the edge 33B.

[0111] The plurality of terminals 133 corresponding to the side 33B include a plurality of ground terminals 133G and a plurality of differential terminals 133D. Figure 1 )、33C(reference Figure 1 ), 33D (refer to Figure 1 ) have the same structure as the terminal 133 corresponding to the same side 33B, but this is not shown in the figure.

[0112] 1.3.3.2 Wiring 134

[0113] The plurality of wirings 134 are electrically connected to the plurality of terminals 133, respectively. The plurality of wirings 134 are spaced apart from each other. In the present embodiment, the plurality of wirings 134 corresponding to the side 33B extend from the plurality of terminals 133 corresponding to the side 33B, respectively, and then converge to each other, and then reach the outer peripheral edge 30. Specifically, each of the plurality of wirings 134 includes an extension line 134A and a convergence line 134B.

[0114] The extension lines 134A corresponding to the side 33B extend from the plurality of terminals 133 corresponding to the side 33B toward the side 33B. A plurality of extension lines 134A corresponding to the side 33B are provided corresponding to the plurality of terminals 133 corresponding to the same side 33B.

[0115] The plurality of extension lines 134A are spaced apart from each other in the direction along the side 33B. The plurality of extension lines 134A extend in directions intersecting the side 33B. The extension lines 134A include a plurality of ground extension lines 134AG and a plurality of differential extension lines 134AD. The plurality of ground extension lines 134AG extend from a plurality of ground terminals 133G, respectively. The plurality of differential extension lines 134AD extend from a plurality of differential terminals 133D, respectively.

[0116] In the mounting portion 3 , a region where the plurality of extension lines 134A are provided is defined as the first portion 31 . In other words, the mounting portion 3 includes the first portion 31 . In other words, in the first portion 31 , the plurality of wirings 134 extend from the plurality of terminals 133 .

[0117] With side 33A (refer to Figure 1 )、33C(reference Figure 1 ), 33D (refer to Figure 1 ) respectively corresponding extension lines 134A have the same structure as the extension lines 134A corresponding to the same side 33B mentioned above.

[0118] Corresponding to the extension line 134A corresponding to the same side 33B, a plurality of gathering lines 134B corresponding to the side 33B are provided. The plurality of gathering lines 134B gather together and face the vicinity of the connection portion 45 (described later) of the connector 4A of the mounting portion 3. The plurality of gathering lines 134B respectively use one end edge of the plurality of extension lines 134A as a starting point and use a portion overlapping with the side 33B in the thickness direction as an end point. The one end edge is the end edge on the side opposite to the terminal 133 in the extension line 134A. The starting point of the gathering line 134B becomes the first bending point of the wiring 134. The gathering line 134B is bent in the area opposite to the connection portion 45 of the connector 4A. The above-mentioned bending of the gathering line 134B becomes the second bending point of the wiring 134. The second bending point of the wiring 134 is spaced apart from the first bending point of the wiring 134 in the direction along the side 33B. Alternatively, the second bending point is opposite to the connector 4A in a direction perpendicular to the side 33B, but is not opposite to the corresponding terminal 133. The wiring density of the plurality of gathering lines 134B is higher than the wiring density of the extension lines 134A. The plurality of gathering lines 134B may also have equally spaced portions spaced apart from each other at equal intervals. In the present embodiment, the plurality of gathering lines 134B each have a substantially L-shaped shape.

[0119] In the mounting portion 3, the region where the gathering line 134B is provided is set as the second portion 32. In other words, the mounting portion 3 has the second portion 32. The second portion 32 is arranged between the outer peripheral edge 30 (side 33A) and the first portion 31 described above. The side 33A, the first portion 31, and the second portion 32 are arranged in this order toward the inner peripheral edge 39. In the second portion 32, a plurality of wirings 134 are gathered. The wiring density of the gathering line 134B of the second portion 32 is higher than the wiring density of the extension line 134A of the first portion 31.

[0120] 1.3.4 Cover Insulation Layer 14 of Mounting Portion 3

[0121] like Figure 3 As shown, in the mounting portion 3, the cover insulating layer 14 is disposed on one side of the base insulating layer 12 in the thickness direction. The cover insulating layer 14 covers the wiring 134 (the extension line 134A and the gathering line 134B, see Figure 2 The covering insulating layer 14 makes the terminals 133 (see Figure 2 ) exposed.

[0122] 1.3.5 Dimensions of the mounting portion 3

[0123] The outer dimensions of the mounting portion 3 are not limited. Figure 1As shown, the interval between the side 33A and the side 33C, and the interval between the side 33B and the side 33D are, for example, 3 mm or more, preferably 5 mm or more, and, for example, 50 mm or less, preferably 30 mm or less. The lengths of the sides 33A, 33B, 33C, and 33D are, for example, 3 mm or more, preferably 5 mm or more, and, for example, 50 mm or less, preferably 30 mm or less.

[0124] The width of the mounting portion 3 is, for example, not less than 0.3 mm, preferably not less than 0.5 mm, and, for example, not more than 30 mm, preferably not more than 20 mm. The width of the mounting portion 3 is the length between the outer peripheral edge 30 and the inner peripheral edge 39 .

[0125] like Figure 2 As shown, the width of each of the plurality of terminals 133 is the same as the width of each of the plurality of frame terminals 131 described above.

[0126] The pitch of the plurality of terminals 133 is, for example, 30 μm or more, preferably 50 μm or more, and for example, 2000 μm or less, preferably 1000 μm or less. The interval between adjacent terminals 133 is, for example, 10 μm or more, preferably 30 μm or more, more preferably 1500 μm or more, and for example, 800 μm or less.

[0127] The spacing between the plurality of extension lines 134A is preferably the same as the spacing between the plurality of terminals 133. The spacing between the equally spaced portions of the gathering lines 134B is smaller than the spacing between the plurality of extension lines 134A. The spacing between the equally spaced portions of the gathering lines 134B is, for example, 1500 μm or less, preferably 1000 μm or less, more preferably 800 μm or less, and, for example, 10 μm or more. The ratio of the spacing between the equally spaced portions of the gathering lines 134B to the spacing between the plurality of extension lines 134A is, for example, less than 1, preferably 0.8 or less, more preferably 0.5 or less, and, for example, 0.01 or more.

[0128] The width of the wiring 134 is the same as the width of the frame wiring 132 described above.

[0129] 1.4 Connectors 4

[0130] like Figure 1As shown, the connector 4 is arranged between the frame 2 and the mounting portion 3. The connector 4 connects the frame 2 and the mounting portion 3. A plurality of connectors 4 are provided corresponding to the plurality of sides 33 of the mounting portion 3. In the present embodiment, the plurality of connectors 4A, 4B, 4C, 4D correspond to the plurality of sides 33B, 33C, 33D, 33A of the mounting portion 3, respectively. Specifically, the connector 4A connects the side 23A of the frame 2 and the side 33B of the mounting portion 3. The connector 4B connects the side 23B of the frame 2 and the side 33C of the mounting portion 3. The connector 4C connects the side 23C of the frame 2 and the side 33D of the mounting portion 3. The connector 4D connects the side 23D of the frame 2 and the side 33A of the mounting portion 3.

[0131] The connector 4A will be described in detail below. The connectors 4B, 4C, and 4D have the same structure as the connector 4A, and their details are omitted.

[0132] 1.4.1 Shape of connector 4A

[0133] like Figure 2 As shown, in this embodiment, the connector 4A has a curved shape when viewed from above. Preferably, the connector 4A does not have a straight shape and / or a bent shape, but only has a curved shape. Specifically, the connector 4A has a letter S shape or a hook shape. If the connector 4A has a curved shape, the stress can be uniformly relaxed without locally concentrating the stress, so that the accuracy of the swing correction of the mounting portion 3 can be improved.

[0134] 1.4.2 Connection of the connector 4 to the mounting portion 3

[0135] The connector 4A is connected to the second portion 32 of the mounting portion 3. That is, the connector 4A is not connected to the first portion 31 in the mounting portion 3 where a plurality of extension lines 134A are arranged at the same pitch as the pitch of the plurality of terminals 133 (relatively large pitch), but is connected to the second portion 32 where a plurality of gathering lines 134B are arranged at a smaller pitch than the pitch of the plurality of terminals 133.

[0136] The connector 4A includes a connecting portion 45 connected to the second portion 32. Figure 1 As shown, for example, the connection portion 45 is connected to the central region 34 of the side 33B of the mounting portion 3 .

[0137] The central region 34 is a region including the central portion 35 in the side 33B. The central portion 35 is the central point of the side 33B and its vicinity. The central region 34 has a length of 1 / 2 of the length of the side 33B. The central region 34 preferably has a length of 1 / 3 of the length of the side 33B, and more preferably has a length of 1 / 4 of the length of the side 33B.

[0138] Preferably, the connecting member 4A is connected to the central portion 35 of the side 33B.

[0139] The ratio of the length of the connection portion 45 along the side 33B to the length of the side 33B (length of the connection portion 45 / length of the side 33B) is, for example, 0.3 or less, preferably 0.25 or less, more preferably 0.2 or less, and for example, 0.01 or more.

[0140] If the ratio of the length of connection portion 45 along side 33B to the length of side 33B is equal to or less than the upper limit, connection portion 45 can be prevented from widening in the direction in which side 33B extends. Therefore, the rigidity of connector 4A can be reliably reduced.

[0141] 1.4.3 Connection of connector 4 to frame 2

[0142] like Figure 2 As shown, the connector 4A is connected to the fourth portion 26 of the frame 2. That is, the connector 4A is not connected to the third portion 25 in the frame 2 where a plurality of frame extension wires 132A are arranged at the same pitch as the plurality of frame terminals 131 (relatively large pitch), but is connected to the fourth portion 26 where a plurality of gathering wires 134B are arranged at a smaller pitch than the plurality of frame terminals 131.

[0143] The connector 4A includes a second connector 46 connected to the fourth portion 26. Figure 1 As shown, for example, the second connection portion 46 is connected to the second central region 29 of the side 23A of the frame 2 .

[0144] The second central region 29 is a region including the second central portion 28 in the side 23A. The second central portion 28 is the central point of the side 23A and its vicinity. The second central region 29 has a length of 1 / 2 of the length of the side 23A. Preferably, the second central region 29 has a length of 1 / 3 of the length of the side 23A. More preferably, the second central region 29 has a length of 1 / 4 of the length of the side 23A.

[0145] Preferably, the connector 4A is connected to the second central portion 28 of the side 23A.

[0146] The ratio of the length of the second connection portion 46 along the side 23A to the length of the side 23A (length of the second connection portion 46 / length of the side 23A) is, for example, 0.3 or less, preferably 0.25 or less, more preferably 0.2 or less, and, for example, 0.01 or more.

[0147] If the ratio of the length of second connection portion 46 along side 23A to the length of side 23A is equal to or less than the upper limit, the second connection portion 46 can be prevented from widening in the direction in which side 23A extends. Therefore, the rigidity of connector 4A can be reliably reduced.

[0148] like Figure 2 As shown, in this embodiment, the connector 4A includes a plurality of slits 421 , 422 , 423 , a plurality of wiring bodies 431 , 432 , and ground wiring bodies 433 , 434 .

[0149] 1.4.4 Slits 421, 422, 423

[0150] The plurality of slits 421, 422, 423 are respectively arranged at the middle part of the connector 4 in a direction intersecting the direction in which the connector 4 extends (intersecting direction, preferably orthogonal direction). The plurality of slits 421, 422, 423 are spaced apart from each other in the intersecting direction.

[0151] The plurality of slits 421, 422, 423 are respectively arranged in the connector 4 in the entire direction in which the connector 4 extends. The plurality of slits 421, 422, 423 are arranged in sequence in the cross direction. The plurality of slits 421, 422, 423 separate the wiring body 431, the wiring body 432, the ground wiring body 433, and the ground wiring body 434. Figure 3 As shown, the plurality of slits 421 , 422 , and 423 penetrate the base insulating layer 12 and the cover insulating layer 14 described later in the thickness direction.

[0152] 1.4.5 Wiring body 431, 432

[0153] The wiring body 431 and the wiring body 432 are separated by slits 421, 422, 423. The wiring body 431 and the wiring body 432 are spaced apart from each other in the cross direction. A plurality of slits 421, 422, 423 extend along the wiring bodies 431 and 432. The wiring body 431 and the wiring body 432 each include four connector wirings 1341, 1342, 1343, 1344, a base insulating layer 12, and a cover insulating layer 14.

[0154] The connector wirings 1341, 1342, 1343, 1344 are spaced apart from each other in the cross direction. The connector wirings 1341, 1342, 1343, 1344 are arranged in sequence in the cross direction. A plurality of slits 421, 422, 423 extend along the connector wirings 1341, 1342, 1343, 1344. In the present embodiment, the connector wirings 1341, 1342, 1343, 1344 can function as differential wirings. For example, the connector wiring 1341 and the connector wiring 1342 work as a differential pair. The connector wiring 1343 and the connector wiring 1344 work as a differential pair.

[0155] One base insulating layer 12 is in contact with the other surface of the connector wires 1341 , 1342 , 1343 , and 1344 in the thickness direction in the wire bodies 431 and 432 .

[0156] One insulating cover layer 14 covers all the connector wires 1341, 1342, 1343, and 1344 in the wire bodies 431 and 432. The insulating cover layer 14 is in contact with one surface and the outer side surface of each of the connector wires 1341, 1342, 1343, and 1344.

[0157] 1.4.6 Ground wiring body 433, 434

[0158] The ground wire body 433 is disposed with the wire body 431 through the slit 421. The ground wire body 434 is disposed with the wire body 432 through the slit 423. Each of the ground wire bodies 433 and 434 includes a ground wire 1345, a base insulating layer 12, and a cover insulating layer 14.

[0159] One base insulating layer 12 is in contact with the lower surface in the thickness direction of the ground wiring 1345 in each of the ground wiring body portions 433 and 434. The ground wiring 1345 is thicker than the connector wirings 1341, 1342, 1343, and 1344.

[0160] One insulating cover layer 14 covers the ground wiring 1345 in each of the ground wiring body portions 433 and 434. The insulating cover layer 14 is in contact with one surface of the ground wiring 1345 in the thickness direction and the outer side surface.

[0161] like Figure 2 As shown, the ground wiring 1345 is electrically connected to the frame ground terminal 131G of the frame 2. Specifically, the ground wiring 1345 is electrically connected to the metal supporting layer 11 of the frame 2 via the gathering wire 134B corresponding to the ground extension wire 134AG, the ground extension wire 134AG, and the frame ground terminal 131G. Thus, the ground wiring 1345 is grounded to the frame ground terminal 131G.

[0162] like Figure 3 As shown, in this embodiment, the connection member 4A does not include the metal supporting layer 11. The metal supporting layer 11 is a layer disposed on the other side surface of the base insulating layer 12 in the thickness direction.

[0163] The material of the metal support layer 11 is, for example, the rigid material mentioned above.

[0164] The connection member 4A includes a base insulating layer 12, a wiring layer 13, and a cover insulating layer 14. Preferably, the connection member 4A includes only the base insulating layer 12, the wiring layer 13, and the cover insulating layer 14.

[0165] 1.4.7 Base insulation layer 12 of connector 4A

[0166] In the connection member 4A, the base insulating layer 12 forms the surface on the other side in the thickness direction of the connection member 4A. The base insulating layer 12 is exposed toward the other side in the thickness direction.

[0167] The base insulating layer 12 has the above-mentioned plurality of slits 421 , 422 , 423 . The plurality of slits 421 , 422 , 423 are arranged between the wiring body portions 431 , 432 , between the wiring body portion 431 and the ground wiring body portion 433 , and between the wiring body portion 432 and the ground wiring body portion 434 .

[0168] 1.4.8 Wiring layer 13 of connector 4A

[0169] In the connector 4A, the wiring layer 13 includes the above-mentioned connector wirings 1341 , 1342 , 1343 , and 1344 and the above-mentioned two ground wirings 1345 .

[0170] In the connector 4A, the wiring layer 13 is disposed on one side of the base insulating layer 12 in the thickness direction. The wiring layer 13 is in contact with one side of the base insulating layer 12. The connector wirings 1341, 1342, 1343, and 1344 are spaced apart from each other in the intersecting direction (preferably, the orthogonal direction) in the connector 4A. Figure 2 As shown, the connector wirings 1341, 1342, 1343, 1344 are electrically connected to the plurality of wirings 134. In addition, the connector wirings 1341, 1342, 1343, 1344 are electrically connected to the plurality of frame wirings 132. That is, the plurality of connector wirings 1341, 1342, 1343, 1344 electrically connect the plurality of frame wirings 132 of the frame 2 and the plurality of wirings 134 of the mounting portion 3.

[0171] 1.4.9 Covering insulation layer 14 of connector 4A

[0172] like Figure 3 As shown, in the connector 4A, the cover insulating layer 14 forms one side surface of the connector 4A in the thickness direction. The cover insulating layer 14 is exposed toward one side in the thickness direction. The cover insulating layer 14 is arranged on one side surface of the base insulating layer 12 in the thickness direction. The cover insulating layer 14 covers a plurality of connector wirings 1341, 1342, 1343, 1344 and a ground wiring 1345.

[0173] The cover insulating layer 14 has the above-mentioned plurality of slits 421, 422, 423 together with the base insulating layer 12. The plurality of slits 421, 422, 423 penetrate the cover insulating layer 14 in the thickness direction. The inner side surface of each of the plurality of slits 421, 422, 423 of the cover insulating layer 14 is flush with the inner side surface of each of the plurality of slits 421, 422, 423 of the base insulating layer 12.

[0174] 1.4.10 Dimensions of connector 4A

[0175] The ratio of the thickness of the ground wiring 1345 to the thickness of the connector wirings 1341, 1342, 1343, and 1344 is, for example, 0.5 or more, preferably 0.8 or more, more preferably 1 or more, and, for example, 10 or less. The thickness of the connector wirings 1341, 1342, 1343, and 1344 is the same as the thickness of the frame wiring 132. The thickness of the ground wiring 1345 is, for example, 3 μm or more, preferably 6 μm or more, and, for example, 100 μm or less, preferably 50 μm or less.

[0176] The lengths of the plurality of connectors 4A, 4B, 4C, and 4D may be the same as or different from each other. When the lengths of the plurality of connectors 4A, 4B, 4C, and 4D are different from each other, the difference in length between the longest connector 4 and the shortest connector 4 is, for example, 3 mm or less, preferably 2 mm or less, and more preferably 1.5 mm or less. If the difference in length between the longest connector 4 and the shortest connector 4 is less than the above-mentioned upper limit, the accuracy of the swing correction of the mounting portion 3 can be improved.

[0177] The thickness of each of the wiring bodies 431 and 432 is, for example, 3 μm or more, preferably 5 μm or more, and for example, 100 μm or less, preferably 50 μm or less. The width of each of the wiring bodies 431 and 432 is, for example, 5 μm or more, preferably 10 μm or more, and for example, 500 μm or less, preferably 300 μm or less.

[0178] The thickness of each ground wiring body 433, 434 is, for example, 3 μm or more, preferably 5 μm or more, and for example, 100 μm or less, preferably 50 μm or less. The width of each ground wiring body 433, 434 is, for example, 5 μm or more, preferably 10 μm or more, and for example, 500 μm or less, preferably 300 μm or less.

[0179] The width of each of the slits 421 , 422 , and 423 is, for example, not less than 5 μm, or preferably not less than 10 μm, and, for example, not more than 500 μm, or preferably not more than 300 μm.

[0180] 1.5 Method for Manufacturing Wired Circuit Board 1

[0181] Reference Figure 4 A~ Figure 4 E Next, a method for manufacturing the wired circuit board 1 and mounting the imaging element 5 will be described.

[0182] like Figure 4 As shown in A, in this method, first, the insulating base layer 12 is formed on one surface of the metal supporting plate 110 in the thickness direction.

[0183] The metal support plate 110 is a metal plate for forming the metal support layer 11. The metal support plate 110 is formed of the same material as that of the metal support layer 11 and has the same thickness as that of the metal support layer 11.

[0184] For example, a resin is applied to one surface of the metal support plate 110, and a base insulating layer 12 having a pattern corresponding to the frame 2, the mounting portion 3, and the connector 4 is formed by photolithography. In this process, the base insulating layer 12 of the frame 2, the base insulating layer 12 of the mounting portion 3, and the base insulating layer 12 of the connector 4 are formed simultaneously.

[0185] like Figure 4 As shown in FIG. 1B, next, a wiring layer 13 is formed on one side of the base insulating layer 12 in the thickness direction. For example, the wiring layer 13 is formed by a conductor pattern forming method. As the conductor pattern forming method, for example, an additive method and a subtractive method can be cited, and preferably, an additive method can be cited. When the wiring layer 13 is formed by the additive method, first, the wiring layer 13 of the frame 2, a part of the wiring layer 13 of the mounting portion 3, and the wiring layer 13 of the connector 4 are formed at the same time. A part of the wiring layer 13 of the mounting portion 3 is a part on the other side of the connector wiring 1341, 1342, 1343, 1344 and the ground wiring 1345 in the thickness direction (refer to the imaginary line). Thereafter, a part on one side of the ground wiring 1345 in the thickness direction (refer to the imaginary line) is stacked on a part on the other side of the ground wiring 1345.

[0186] like Figure 4 As shown in FIG. 3C , the cover insulating layer 14 is formed on one surface in the thickness direction of the base insulating layer 12 so as to cover the frame wire 132 , the wire 134 , and the connector wires 1341 , 1342 , 1343 , and 1344 .

[0187] For example, a resin is applied to one side of the metal support plate 110, the base insulating layer 12, and the wiring layer 13, and a cover insulating layer 14 having a pattern corresponding to the frame 2, the mounting portion 3, and the connector 4 is formed by photolithography. In this process, the cover insulating layer 14 of the frame 2, the cover insulating layer 14 of the mounting portion 3, and the cover insulating layer 14 of the connector 4 are formed simultaneously.

[0188] like Figure 4 As shown in FIG. 2 , the metal support plate 110 is subjected to a contour processing to form the metal support layer 11. As the contour processing, for example, etching, punching, and laser can be cited. As the contour processing, etching can be cited preferably from the viewpoint of productivity. The metal support plate 110 is removed between the frame 2 and the mounting portion 3 by contour processing of the metal support plate 110. As a result, the connector 4 does not include the metal support layer 11.

[0189] like Figure 4 As shown in E, the imaging element 5 is mounted on the mounting portion 3. The electrodes 51 of the imaging element 5 are electrically connected to the plurality of terminals 133 of the mounting portion 3. The imaging element 5 can be mounted on the mounting portion 3 via a mounting substrate (not shown).

[0190] Then, the external substrate 6 is mounted on the frame 2. The electrodes 61 of the external substrate 6 are electrically connected to the plurality of frame terminals 131 of the frame 2. The outer edge 24 of the frame 2 (see Figure 1 ) can also be supported by an external member (not shown).

[0191] 2. Effects of an Implementation Method

[0192] like Figure 3 As shown, in the wired circuit board 1, the connector 4 does not include the metal supporting layer 11. Therefore, the rigidity of the connector 4 is reduced. As a result, the swing of the mounting portion 3 can be corrected with a small force.

[0193] like Figure 2 As shown, in the wired circuit board 1, the connector 4 is connected to the second portion 32 of the mounting portion 3 where the gathering line 134B is arranged. Therefore, in the connector 4, it is possible to suppress the connection portion 45 connected to the second portion 32 from becoming wider in the intersecting direction (width direction). As a result, the rigidity of the connector 4 can be reliably reduced.

[0194] In the wiring circuit substrate 1, when the frame 2 moves and the connector 4 bends, the connection portion 45 can be prevented from widening, thereby reducing the difference between the force applied to the central portion in the width direction and the force applied to one end portion in the width direction in the connector 4, thereby enabling the swing of the mounting portion 3 to be controlled with good precision.

[0195] In this wired circuit board 1, the ratio of the length of the connection portion 45 along the side 33B to the length of the side 33B is 0.3 or less, so that the connection portion 45 can be prevented from becoming wider. Therefore, the rigidity of the connector can be reliably reduced.

[0196] Furthermore, in this wired circuit board, since the connector 4 is connected to the central region 34 , the swing of the mounting portion 3 can be controlled with high accuracy.

[0197] like Figure 1 As shown, since the connecting member 4 is connected to the central portion 35 , the swing of the mounting portion 3 can be controlled with high accuracy.

[0198] like Figure 3 As shown, in the wired circuit board 1, the base insulating layer 12 and the cover insulating layer 14 of the connector 4 have the slits 421, 422, and 423, so that the rigidity of the connector can be further reduced.

[0199] In this wired circuit board, each of the wire bodies 431 and 432 includes four connector wires 1341 , 1342 , 1343 , and 1344 . Therefore, the connector wires 1341 , 1342 , 1343 , and 1344 can function as differential wirings.

[0200] like Figure 1 As shown, in the wired circuit board 1, the connector 4 has a curved shape, so that the accuracy of the wobble correction can be improved compared with a configuration having a straight shape and / or a bent shape.

[0201] In this wired circuit board 1, since the connector 4A connects the side 33B and the side 23A which is a non-opposing side not opposing the side 33B, the connector 4A can be extended. Therefore, the rigidity of the connector 4A is reduced.

[0202] 3. Modifications

[0203] In the following modifications, the same reference numerals are used for the same components and processes as those of the above-mentioned one embodiment, and their detailed description is omitted. In addition, each modification can achieve the same effects as those of the one embodiment unless otherwise specified. Moreover, the one embodiment and its modifications can be appropriately combined.

[0204] 3.1 First Modification

[0205] like Figure 5 As shown, the connector 4A is connected to the first position 36 of the side 33B. The first position 36 is offset from the central portion 35 to the side 33C in the central region 34. The first position 36 is included in the central region 34.

[0206] 3.2 Second Modification

[0207] like Figure 6 As shown, the connector 4A is connected to the second position 37 of the side 33B. The second position 37 is offset from the central portion 35 toward the side 33A in the central region 34. The second position 37 is included in the central region 34.

[0208] Among the embodiment, the first modification, and the second modification, the embodiment is preferred. In the embodiment, since the connector 4A is connected to the center portion 35 of the side 33B, the swing of the mounting portion 3 can be controlled with high accuracy.

[0209] 3.3 The third variant

[0210] like Figure 7 As shown in FIG. 2 , the connector 4A is connected to the third position 281 of the side 23A. The third position 281 is offset from the second central portion 28 to the side 23B in the second central region 29. Figure 6 ) Similarly, the connector 4A is connected to the second position 37 of the side 33B.

[0211] The connector 4D is connected to a fourth position 282 of the side 23A. The fourth position 282 is offset from the second central portion 28 to the side 23D in the second central region 29 .

[0212] The connector 4B connects the side 23C of the frame 2 and the side 33B of the mounting portion 3. The connector 4D connects the side 23A of the frame 2 and the side 33D of the mounting portion 3.

[0213] That is, in the third modification, the connectors 4A and 4D are connected to the side 23A of the frame 2, respectively. The connectors 4B and 4C are connected to the side 23C of the frame 2, respectively.

[0214] In the third modification, connectors 4A and 4B are respectively connected to side 33B of mounting portion 3 , and connectors 4C and 4D are respectively connected to side 33D of mounting portion 3 .

[0215] 3.4 Fourth Modification

[0216] In the fourth variant, if Figure 8 As shown, the connector 4 includes sub-connectors 4511 , 4512 , 4521 , 4522 , 4531 , and 4532 .

[0217] The sub-connectors 4511 and 4512 divide the slit 421 in the direction in which the slit 421 extends. The sub-connectors 4511 and 4512 are spaced apart in the direction in which the slit 421 extends.

[0218] The auxiliary connectors 4521 and 4522 divide the slit 422 in the direction in which the slit 422 extends. The auxiliary connectors 4521 and 4522 are spaced apart in the direction in which the slit 422 extends. Fig. 9 As shown, the sub-connectors 4521 and 4522 respectively connect the wiring body 431 and the wiring body 432. In addition, the sub-connectors 4521 and 4522 respectively connect the connector wiring 1344 of the wiring body 431 and the connector wiring 1341 of the wiring body 432.

[0219] like Figure 8 As shown, the secondary connectors 4511, 4521, and 4531 are arranged in parallel in a direction intersecting the direction in which the connector 4 extends (intersecting direction, preferably orthogonal direction). The secondary connectors 4512, 4522, and 4532 are arranged in parallel in a direction intersecting the direction in which the connector 4 extends (intersecting direction, preferably orthogonal direction).

[0220] The sub-connectors 4531 and 4532 divide the slit 423 in the direction in which the slit 421 extends. The sub-connectors 4531 and 4532 are spaced apart in the direction in which the slit 423 extends.

[0221] like Fig. 9 As shown, the sub-connectors 4511, 4512, 4521, 4522, 4531, and 4532 include the base insulating layer 12. In this modification, the sub-connectors 4511, 4512, 4521, 4522, 4531, and 4532 include only the base insulating layer 12.

[0222] According to the fourth modification, the sub-connectors 4521 and 4522 can suppress the rigidity of the connector 4 from being excessively reduced by the slit 422. Therefore, excessive deformation of the connector 4 can be suppressed.

[0223] 3.5 Fifth Modification

[0224] like Fig.10 As shown, the sub-connectors 4511, 4512, 4521, 4522, 4531, 4532 include a base insulating layer 12 and a cover insulating layer 14. In this modification, the sub-connectors 4511, 4512, 4521, 4522, 4531, 4532 include only the base insulating layer 12 and the cover insulating layer 14.

[0225] The sub-connectors 4511 , 4512 , 4521 , 4522 , 4531 , and 4532 may include only the cover insulating layer 14 , but this is not shown.

[0226] 3.6 Sixth Modification

[0227] like Fig.11 As shown, the frame 2 , the mounting portion 3 , and the connector 4 do not include the metal supporting layer 11 .

[0228] In the sixth modification, the frame 2 is supported by the external substrate 6 and the external member (not shown), and the mounting portion 3 is supported by the imaging element 5, so the rigidity of the connector 4 is lower than the rigidity of each of the frame 2 and the mounting portion 3. Therefore, the swing of the mounting portion 3 can be corrected with a small force.

[0229] 3.7 Other variations

[0230] The mounting portion 3 may not include the second portion 32 , but this is not shown. In this case, the connector 4A is connected to the first portion 31 of the mounting portion 3 .

[0231] Preferably, as in one embodiment, the mounting portion 3 has the second portion 32, and the connector 4A is connected to the second portion 32 of the mounting portion 3. In one embodiment, it is possible to suppress the connection portion 45 connected to the second portion 32 from becoming wider in the intersecting direction (width direction) in the connector 4. As a result, the rigidity of the connector 4 can be reliably reduced.

[0232] In one embodiment, the mounting portion 3 has a rectangular frame shape, but may also have a rectangular shape without the inner peripheral edge 39 .

[0233] The mounting portion 3 may have a curved shape or may be circular. In this case, the outer periphery 30 of the mounting portion 3 has no edge.

[0234] The frame 2 may have a curved shape or may further have a circular ring shape. In this case, the inner periphery 20 of the frame 2 has no edge.

[0235] The connection member 4A may also have a substantially wavy shape.

[0236] The number of the connecting members 4 may also be two.

[0237] The connecting element 4 may also have a straight shape and / or a bent shape.

[0238] In addition, the above invention is provided as an exemplary embodiment of the present invention, but this is only an example and the present invention is not to be interpreted as limiting. Modifications of the present invention that are obvious to those skilled in the art are included in the above claims.

[0239] Industrial Applicability

[0240] The printed circuit board is provided in, for example, an imaging device.

[0241] Description of Reference Numerals

[0242] 1. Wiring circuit substrate; 2. Frame; 3. Mounting part; 4. 4A, 4B, 4C, 4D. Connector; 11. Metal supporting layer; 12. Base insulating layer; 13. Wiring layer; 14. Cover insulating layer; 23A, 23B, 23C, 23D, Edge; 30. Outer periphery; 31. First part; 32. Second part; 33. 33A, 33B, 33C, 33D, Edge; 34. Central area; 35, central part; 45, connecting part; 133, 133B, terminal; 134, wiring; 421, 422, 423, slit; 431, 432, wiring body; 4511, 4512, 4521, 4522, 4531, 4532, auxiliary connector; 1341, 1342, 1343, 1344, connector wiring; 1345, ground wiring.

Claims

1. A wiring circuit substrate, wherein: The wired circuit substrate comprises: a frame; a mounting portion surrounded by the frame and spaced apart from the frame; and a connecting member connecting the frame and the mounting portion, The frame and the mounting portion each include: a base insulating layer; a wiring layer, which is arranged on one side of the base insulating layer in the thickness direction; and a cover insulating layer, which is arranged on one side of the base insulating layer in the thickness direction and covers a portion of the wiring layer, and the frame and the mounting portion each include a metal support layer, which is arranged on the other side of the base insulating layer in the thickness direction. The connection member does not include the metal supporting layer, but includes the base insulating layer, the wiring layer, and the cover insulating layer.

2. The wiring circuit substrate according to claim 1, wherein The wiring layer of the mounting portion includes: a plurality of terminals spaced apart from each other; and a plurality of wirings spaced apart from each other and electrically connected to the plurality of terminals, respectively. The connector includes a plurality of connector wirings, the plurality of connector wirings are spaced apart from each other and are electrically connected to the plurality of wirings, respectively. The mounting portion includes: a first portion in which the plurality of wirings extend from the plurality of terminals; and a second portion disposed between the first portion and the outer periphery of the mounting portion, wherein the plurality of wirings are gathered in the second portion, The connecting piece is connected to the second part.

3. The wired circuit substrate according to claim 1, wherein: The mounting portion has an edge at the outer periphery of the mounting portion, The connecting member includes a connecting portion that connects the connecting member to the edge. The ratio of the length of the connecting portion in the direction along the side to the length of the side, that is, the length of the connecting portion / the length of the side is 0.3 or less.

4. The wired circuit substrate according to claim 1, wherein: The mounting portion has an edge at the outer periphery of the mounting portion, The connecting member is connected to a central region of the side including a central portion, and the central region has a length of 1 / 2 of the length of the side.

5. The wired circuit substrate according to claim 3, wherein: The connecting member is connected to a central region of the side including a central portion, and the central region has a length of 1 / 2 of the length of the side.

6. The wired circuit substrate according to claim 4 or 5, wherein: The connecting member is connected to the central portion of the side.

7. The wired circuit substrate according to claim 1, wherein: The mounting portion has a plurality of edges at the outer periphery of the mounting portion, The connecting members are provided with a plurality of corresponding to the plurality of sides, The difference in length between the longest connector and the shortest connector among the plurality of connectors is 3 mm or less.

8. The wired circuit substrate according to claim 1, wherein: The wiring layer of the connector has a plurality of connector wirings spaced apart from each other. The base insulating layer and the cover insulating layer of the connector have slits arranged between the plurality of connector wirings.

9. The wired circuit substrate according to claim 8, wherein: The slits extend along the wiring of the plurality of connectors, The connector includes a sub-connector that divides the slit in a direction in which the slit extends and connects the plurality of connector wirings.

10. The wired circuit substrate according to claim 8, wherein: The connecting member includes a plurality of wiring bodies separated by the slits, One of the wiring bodies includes at least two connector wirings.

11. The wired circuit substrate according to claim 10, wherein: The slits extend along the plurality of wiring bodies, The connector includes a sub-connector that divides the slit in a direction in which the slit extends and connects the plurality of wiring bodies.

12. The wired circuit substrate according to claim 1, wherein: The wiring layer of the connection member includes a ground wiring electrically connected to the metal supporting layer.

13. The wired circuit substrate according to claim 1, wherein: The connecting piece has a curved shape.

14. The wired circuit substrate according to claim 1 or 2, wherein: The mounting portion has a substantially rectangular shape and has edges at the outer periphery of the mounting portion. The frame has a substantially rectangular frame shape, has an opposing side opposing the side, and a non-opposing side adjacent to the opposing side and not opposing the side. The connecting member connects the side and the non-opposite side.

15. The wired circuit substrate according to claim 3, wherein: The mounting portion has a substantially rectangular shape, The frame has a substantially rectangular frame shape, has an opposing side opposing the side, and a non-opposing side adjacent to the opposing side and not opposing the side. The connecting member connects the side and the non-opposite side.

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