A high speed turret inspection packaging apparatus for semiconductor

Abstract

The application discloses a high-speed turret detection packaging equipment for semiconductors and relates to the technical field of semiconductor production. The equipment comprises a machine table, a vibrating feeding mechanism arranged on the machine table, a distributing mechanism arranged at the discharging end of the vibrating feeding mechanism, a turret detection mechanism arranged on one side of the distributing mechanism, and a carrier tape packaging mechanism arranged on one side of the turret detection mechanism. The turret detection mechanism comprises a suction nozzle rotating mechanism arranged in the machine table and a lifting driving mechanism arranged above the suction nozzle rotating mechanism. The suction nozzle rotating mechanism comprises a disc rotatably arranged on the machine table, a plurality of vacuum suction nozzles equally arranged on the disc, an air pipe connecting column arranged at the upper end of the disc, a suction nozzle rotating motor arranged at the lower end of the disc and used for rotating the disc, and the vacuum suction nozzles are slidably connected to the disc. Reset springs are arranged outside the vacuum suction nozzles. The application can detect the chips in multiple stations, and the detection precision and efficiency are greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor production, in particular to a high-speed turret detection packaging equipment for semiconductor. BACKGROUND

[0002] With the promotion of the semiconductor discrete device industry in the international market occupies a pivotal position, and maintains the sustained, rapid and stable development, at the same time, the development of electronic whole machine, consumer electronics and other markets, make the demand of semiconductor discrete device growth. Therefore, the modern production plant needs a high-speed, high-performance test sorting equipment to meet the production needs, however, the conventional semiconductor discrete device test sorting machine, the equipment running speed is low, resulting in unable to meet the production demand of high capacity, high quality. Therefore, the present application provides a high-speed turret detection packaging equipment for semiconductor. SUMMARY

[0003] The purpose of the present application is to make up for the shortcomings of the prior art, and provide a high-speed turret detection packaging equipment for semiconductor.

[0004] In order to achieve the above purpose, the present application provides the following technical scheme: a high-speed turret detection packaging equipment for semiconductor, including machine table, vibration feeding mechanism is arranged on the machine table, the discharge end of the vibration feeding mechanism is provided with a distribution mechanism, one side of the distribution mechanism is provided with a turret detection mechanism;

[0005] One side of the turret detection mechanism is provided with a carrier tape packaging mechanism, the turret detection mechanism comprises a suction nozzle rotating mechanism installed in the machine table and a lifting driving mechanism arranged above the suction nozzle rotating mechanism;

[0006] The suction nozzle rotating mechanism comprises a disc rotatably arranged on the machine table, a plurality of vacuum nozzles are installed on the disc at equal intervals, an air pipe connecting column is arranged on the upper end of the disc, a suction nozzle rotating motor is arranged on the lower end of the disc to drive the disc to rotate, the vacuum nozzles are slidably connected to the disc, and a return spring is arranged outside the vacuum nozzles;

[0007] The lifting driving mechanism comprises a lifting mechanism support fixedly installed on the machine table, the lifting mechanism support is provided with a plurality of lifting driving units, the lifting driving unit comprises a lifting driving motor, a first cam is connected to the output shaft of the lifting driving motor downward, a fixed seat is fixedly connected to the lifting mechanism support on one side of the first cam, a sliding seat is slidably connected to one side of the fixed seat, a cam follower roller is installed on the upper end of the sliding seat, the first cam and the cam follower roller are in abutment, the sliding seat is connected to the fixed seat through a spring, and a plurality of detection mechanisms are arranged directly below the vacuum nozzles.

[0008] Preferably, the plurality of detection mechanisms include a chip detection jig, the chip detection jig includes a holder, the holder has a pair of spaced-apart pins, an elastic ejector pin is provided between the pair of pins, a plurality of probes are provided on both sides of the elastic ejector pin, and the probes are electrically connected to the test instrument.

[0009] Preferably, a laser marking mechanism is also provided on one side of the multiple detection mechanisms, and the laser marking mechanism includes a marking base body fixedly connected to the machine platform, and a rotatable chip fixing fixture table is provided on the marking base body, and four chip placement slots are provided on the chip fixing fixture table. A vacuum negative pressure channel is provided in the chip fixing fixture table and is connected to the bottom of the four chip placement slots. The chip fixing fixture table is driven to rotate by a marking base motor, and a laser generator and a CCD detection camera are respectively provided on one side of the chip fixing fixture table.

[0010] Preferably, the material distribution mechanism comprises a material distribution frame fixedly connected to the machine platform, a material distribution track is installed on the material distribution frame, a blocking mechanism is provided at one end of the material distribution track, and a material receiving mechanism is provided on one side of the blocking mechanism;

[0011] Preferably, a flipping mechanism is also provided on one side of the multiple detection mechanisms, and the flipping mechanism includes a flipping base fixedly connected to the machine table, a rotatable support frame is provided in the flipping base through a bearing, a clamping positioning motor is installed on the support frame, and the output shaft of the clamping positioning motor drives an opening and closing cam upward, a clamping fixture is provided on the top of the support frame, and the clamping fixture includes four clamping blocks movably connected to the top of the support frame, a driving roller is installed at the bottom of the clamping block, and the opening and closing cam is provided between the driving rollers, and a synchronous wheel is installed at the bottom end of the support frame, and the synchronous wheel is connected to a driving wheel through a belt, and the driving wheel is installed on the output shaft of the flipping motor, and the flipping motor is connected to the synchronous wheel through a belt drive to rotate the support frame.

[0012] The blocking mechanism includes a block connected to the material distribution frame for sliding up and down, and a tension spring is connected between the block and the material distribution frame;

[0013] The material receiving mechanism includes a material receiving seat connected to the material distribution frame for front and rear sliding, a tension spring is connected between the material receiving mechanism and the material distribution frame, a vacuum negative pressure pipeline is arranged in the material receiving seat, a fixing groove matching the chip is arranged on the material receiving seat, a vacuum suction hole is arranged in the fixing groove, and a material receiving seat driving roller is connected to the material receiving seat;

[0014] A material distributing motor is installed on the material distributing frame, and the output shaft of the material distributing motor is connected to a second cam, the front end of the second cam abuts against the driving roller of the material receiving seat, and the side wall of the second cam abuts against the stop block.

[0015] Preferably, one side of the distribution mechanism is provided with a first CCD camera detection unit.

[0016] Preferably, one side of the plurality of detection mechanisms is further provided with a defective product collection mechanism.

[0017] Preferably, one side of the plurality of detection mechanisms is further provided with a second defective product distribution mechanism, the second defective product distribution mechanism comprising a defective product rack, a rotatable distribution switching wheel being arranged in the defective product rack, a plurality of distribution holes being arranged on the distribution switching wheel, an upper cover plate and a lower cover plate being respectively arranged on the upper and lower ends of the distribution switching wheel, a chip inlet being arranged on the upper cover plate, and two discharge ports being arranged on the lower cover plate, the two discharge ports being respectively connected to two defective product collection boxes, and the defective product collection boxes being placed in the defective product rack.

[0018] Preferably, one side of the turnover mechanism is provided with a defective product blowing and removing mechanism.

[0019] Preferably, the carrier tape packaging mechanism comprises a carrier tape rack, a plurality of carrier tape guide wheels being arranged on the carrier tape rack, a carrier tape being placed on the carrier tape guide wheels, a carrier tape moving motor being arranged on one side of the carrier tape to drive the carrier tape to move, a drive wheel being drivingly connected to the carrier tape moving motor and pressing the carrier tape, a film loading disc being mounted on the carrier tape rack, a film roll being placed on the film loading disc, the film roll being pulled to the surface of the carrier tape by a plurality of guide wheels and passing through the bottom of a plurality of hot pressing blocks together with the carrier tape, the hot pressing blocks being mounted on a lifting slide, the lifting slide being slidably connected to the carrier tape rack, a driving groove being arranged on the top of the lifting slide, a lifting driving roller being arranged in the driving groove, the lifting driving roller being mounted on an eccentric block, and the eccentric block being connected to a pressing block lifting driving motor. Advantages

[0020] Compared with the prior art, the high-speed turret detection and packaging device for semiconductors has the following advantages:

[0021] The chip can be subjected to multi-station defective detection, and the detection accuracy and efficiency are greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 The figure is a structural schematic diagram of the application;

[0023] Figure 2 The figure is a structural schematic diagram of the turret detection mechanism of the application;

[0024] Figure 3 The figure is a structural schematic diagram of another perspective of the application;

[0025] Figure 4 The figure is a structural schematic diagram of the suction nozzle rotating mechanism of the application;

[0026] Figure 5 Schematic diagram of the structure of the lifting drive mechanism of the present invention;

[0027] Figure 6 Schematic diagram of the structure of the lifting drive mechanism of the present invention;

[0028] Figure 7 It is a structural schematic diagram of the detection mechanism of the present invention;

[0029] Figure 8 This is a schematic structural diagram of the laser marking mechanism of the present invention;

[0030] Figure 9 It is a structural schematic diagram of the material distribution mechanism of the present invention;

[0031] Figure 10 It is a structural schematic diagram of the material distribution mechanism of the present invention;

[0032] Figure 11 This is a structural diagram of the second defective product sorting mechanism of the present invention;

[0033] Figure 12 This is a structural diagram of the second defective product sorting mechanism of the present invention;

[0034] Figure 13 This is a structural diagram of the second defective product sorting mechanism of the present invention;

[0035] Figure 14 It is a structural schematic diagram of the carrier tape packaging mechanism of the present invention;

[0036] Figure 15 It is a structural schematic diagram of the carrier tape packaging mechanism of the present invention;

[0037] Figure 16 It is a structural schematic diagram of the carrier tape packaging mechanism of the present invention;

[0038] Figure 17 It is a structural schematic diagram of the turning mechanism of the present invention;

[0039] Figure 18 It is a structural schematic diagram of the chip shape to be detected in the present invention.

[0040] In the picture:

[0041] 1. Machine; 2. Vibrating feeding mechanism; 3. Material separation mechanism; 4. Turret detection mechanism; 5. Carrier packaging mechanism; 6. First CCD camera detection unit; 7. Defective product collection mechanism; 8. Second defective product separation mechanism; 9. Turning mechanism; 10. Defective product air blowing and rejection mechanism;

[0042] 41. Nozzle rotation mechanism; 42. Lifting drive mechanism; 43. Detection mechanism; 44. Laser marking mechanism; 411. Disc; 412. Vacuum nozzle; 413. Nozzle rotation motor; 414. Return spring; 421. Lifting mechanism bracket; 422. Lifting drive motor; 423. First cam; 424. Fixed seat; 425. Sliding seat; 426. Cam follower roller; 431. Clamping seat; 432. Clamping foot; 433. Elastic ejector pin; 434. Probe; 441. Marking seat; 442. Chip fixing fixture; 443. Chip placement slot; 444. Marking seat motor; 445. Laser generator; 446. CCD detection camera;

[0043] 31. Material dispensing frame; 32. Material dispensing track; 33. Blocking mechanism; 34. Material receiving mechanism; 331. Stopper; 332. Tension spring; 341. Material receiving seat; 342. Second tension spring; 343. Vacuum negative pressure pipeline; 344. Fixing groove; 345. Vacuum suction hole; 346. Material receiving seat driving roller; 311. Material dispensing motor; 312. Second cam;

[0044] 81. Defective product storage rack; 82. Material distribution switching wheel; 83. Material distribution hole; 84. Upper cover; 85. Lower cover; 86. Defective product collection box;

[0045] 91. Turning machine base; 92. Support frame; 93. Clamping and positioning motor; 94. Opening and closing cam; 95. Clamping fixture; 96. Synchronous pulley; 97. Belt; 98. Driving pulley; 99. Turning motor;

[0046] 51. Carrier frame; 52. Carrier guide wheel; 53. Driving carrier; 54. Carrier moving motor; 55. Driving wheel; 56. Sealing film loading tray; 57. Sealing film roll; 58. Hot pressing block; 59. Lifting slide; 510. Lifting drive roller; 511. Eccentric block; 512. Lifting drive motor. DETAILED DESCRIPTION

[0047] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0048] See also Figures 1 to 17 As shown, the present invention provides a technical solution: a high-speed turret inspection and packaging equipment for semiconductors, comprising a machine platform 1, a vibration feeding mechanism 2 is provided on the machine platform 1, a material separation mechanism 3 is provided at the discharge end of the vibration feeding mechanism 2, and a turret inspection mechanism 4 is provided on one side of the material separation mechanism 3;

[0049] A carrier packaging mechanism 5 is provided on one side of the turret detection mechanism 4. The turret detection mechanism 4 includes a nozzle rotating mechanism 41 installed in the machine platform 1 and a lifting drive mechanism 42 provided above the nozzle rotating mechanism 41.

[0050] The nozzle rotation mechanism 41 includes a rotatable disk 411 mounted on the machine platform 1. A plurality of equally spaced vacuum nozzles 412 are mounted on the disk 411. An air pipe connection column is provided at the upper end of the disk 411. A nozzle rotation motor 413 for driving the disk 411 to rotate is provided at the lower end of the disk 411. The vacuum nozzles 412 are slidably connected to the disk 411. A return spring 414 is provided on the outer side of the vacuum nozzles 412.

[0051] The lifting drive mechanism 42 includes a lifting mechanism bracket 421 fixedly mounted to the machine platform 1, and the lifting mechanism bracket 421 is provided with multiple lifting drive units. The lifting drive unit includes a lifting drive motor 422, and the output shaft of the lifting drive motor 422 is downwardly connected to a first cam 423, and one side of the first cam 423 is provided with a fixed seat 424 fixedly connected to the lifting mechanism bracket 421, and one side of the fixed seat 424 is slidably connected to a slide 425, and a cam follower roller 426 is installed on the upper end of the slide 425. The first cam 423 is in contact with the cam follower roller 426, and the slide 425 is connected to the fixed seat 424 through a spring. Multiple detection mechanisms 43 are arranged directly below the vacuum suction nozzle 412.

[0052] Please pay attention to Figures 3 to 8 , multiple detection mechanisms 43 include a chip detection fixture, the chip detection fixture includes a card seat 431, the card seat 431 has a pair of spaced card pins 432, an elastic ejector pin 433 is arranged between the pair of card pins 432, and multiple probes 434 are arranged on both sides of the elastic ejector pin 433, the probes 434 are electrically connected to the test instrument, and a laser marking mechanism 44 is also provided on one side of the multiple detection mechanisms 43. The laser marking mechanism 44 includes a marking seat body 441 fixedly connected to the machine 1, and a rotatable chip fixing fixture table 442 is provided on the marking seat body 441. Four chip placement slots 443 are provided on the chip fixing fixture table 442. A vacuum negative pressure channel 447 is provided in the chip fixing fixture table 442 and is connected to the bottom of the four chip placement slots 443. The chip fixing fixture table 442 is driven to rotate by a marking seat motor 444, and a laser generator 445 and a CCD detection camera 446 are respectively provided on one side of the chip fixing fixture table 442.

[0053] Please pay attention to Figure 9 and Figure 10 The material distribution mechanism 3 includes a distribution frame 31 fixedly connected to the machine 1, a distribution track 32 is installed on the distribution frame 31, a blocking mechanism 33 is provided at one end of the distribution track 32, and a material receiving mechanism 34 is provided on one side of the blocking mechanism 33;

[0054] The blocking mechanism 33 comprises a blocking block 331 connected with the distribution frame 31 in sliding mode, and the blocking block 331 is connected with the distribution frame 31 through a tension spring 332;

[0055] The receiving mechanism 34 comprises a receiving seat 341 connected with the distribution frame 31 in sliding mode, and the receiving mechanism 34 is connected with the distribution frame 31 through a second tension spring 342. The receiving seat 341 is provided with a vacuum negative pressure pipeline 343, and the receiving seat 341 is provided with a fixing groove 344 matched with the chip. The fixing groove 344 is provided with a vacuum suction hole 345, and the receiving seat 341 is connected with a receiving seat driving roller 346.

[0056] The distribution frame 31 is provided with a distribution motor 311, and the output shaft of the distribution motor 311 is connected with a second cam 312. The front end of the second cam 312 abuts against the receiving seat driving roller 346, and the side wall of the second cam 312 abuts against the blocking block 331.

[0057] Please refer to Figure 11 and Figure 13 , one side of the distribution mechanism 3 is provided with a first CCD camera detection unit 6. One side of the plurality of detection mechanisms 43 is further provided with a defective product collecting mechanism 7. One side of the plurality of detection mechanisms 43 is further provided with a second defective product distribution mechanism 8. The second defective product distribution mechanism 8 comprises a defective product rack 81, and the defective product rack 81 is provided with a rotatable distribution switch wheel 82. The distribution switch wheel 82 is provided with a plurality of distribution holes 83. The upper and lower ends of the distribution switch wheel 82 are respectively provided with an upper cover plate 84 and a lower cover plate 85. The upper cover plate 84 is provided with a chip inlet 841. The lower cover plate 85 is provided with two oppositely arranged discharge ports 851. The two discharge ports 851 are respectively connected with two defective product collecting boxes 86, and the defective product collecting boxes 86 are placed in the defective product rack 81.

[0058] One side of the plurality of detection mechanisms 43 is further provided with a turnover mechanism 9. The turnover mechanism 9 comprises a turnover base 91 fixedly connected with the machine table 1. The turnover base 91 is provided with a rotatable support frame 92 through a bearing. The support frame 92 is provided with a clamping positioning motor 93. The output shaft of the clamping positioning motor 93 is upwardly and drivingly connected with an opening and closing cam 94. The top end of the support frame 92 is provided with a clamping jig 95. The clamping jig 95 comprises four clamping blocks movably connected to the top end of the support frame 92. The clamping blocks are provided with driving rollers at the bottom. The driving rollers are provided with the opening and closing cam. The bottom end of the support frame 92 is provided with a synchronous wheel 96. The synchronous wheel 96 is connected with a driving wheel 98 through a belt 97. The driving wheel 98 is mounted on the output shaft of a turnover motor 99. The turnover motor 99 is drivingly connected with the synchronous wheel 96 through the belt 97 to make the support frame 92 rotate. One side of the turnover mechanism 9 is provided with a defective product blowing and removing mechanism 10.

[0059] The carrier packaging mechanism 5 includes a carrier frame 51, on which a plurality of carrier guide wheels 52 are provided, on which a carrier 53 is placed, and a carrier moving motor 54 is provided on one side of the carrier 53 to drive the carrier 53 to move, and the carrier moving motor 54 drives a driving wheel 55 connected to the carrier 53, and the driving wheel 55 presses the carrier 53, and a sealing film loading tray 56 is installed on the carrier frame 51, on which a sealing film roll 57 is placed, and the sealing film roll 57 passes through a plurality of A guide wheel 52 is pulled to the surface of the carrier tape 53 and passes through the bottom of multiple hot pressing blocks 58 along with the carrier tape 53. The hot pressing blocks 58 are installed on a lifting slide 59. The lifting slide 59 can slide up and down and is connected to the carrier tape frame 51. A driving groove 591 is provided on the top of the lifting slide 59. A lifting driving roller 510 is provided in the driving groove 591. The lifting driving roller 510 is installed on an eccentric block 511. The eccentric block 511 is connected to a pressing block lifting driving motor 512.

[0060] Working principle: Figure 18 The chip shown has two pins on one side and one pin on the other side. The detection process for this chip is as follows: first, the chip flows out from the discharge track of the vibrating feeder and flows to the material distribution mechanism. The material distribution motor drives the block to move up and down and drives the receiving mechanism to engage and disengage with the discharge track through the material distribution cam. When the block is lifted, the receiving seat of the receiving mechanism is seamlessly connected with the discharge track. Due to the blowing of the blowing mechanism, the front end chip moves into the receiving seat. Then the material distribution motor works again, driving the block to sink and close the discharge track. At the same time, the receiving seat is separated from the discharge track. In this way, a chip is successfully moved to the receiving mechanism (vacuum adsorption at the same time). The design principle of this structure is mainly because chips have pins, and pins are easily hooked together. In order to prevent hooking, this mechanism is used for material distribution. When receiving, the block is lifted, and after receiving, the block sinks and the receiving mechanism is separated from the track, preventing the subsequent chip pins from hooking with each other, separating the chips into discrete states, avoiding the chip materials from being hooked together, which is not conducive to subsequent retrieval.

[0061] At this time, the chip is vacuum-adsorbed on the receiving mechanism (with vacuum suction holes at the bottom), sucked by the vacuum nozzle above, lifted up and rotated one step, and the chip is moved to the top of the CCD camera detection station. The CCD camera takes a picture of the chip. When the chip pins are inconsistent with the set direction, the chip is moved to the top of the flip mechanism. The clamping positioning motor of the flip mechanism drives the four clamps to clamp the chip from all sides. Then the flip motor drives the chip to rotate 180 degrees, so that all the chip pins are facing each other (that is, all two pins are in the same position).

[0062] The vacuum nozzle then absorbs the chip and continues to rotate and pass through the elastic ejector pins of multiple chip detection fixtures in turn, so that the pins of the chip are electrically connected to the test instrument through the probe for detection.

[0063] After the chips are tested by multiple test fixtures, the good chips are transferred to a laser marking mechanism for laser marking and appearance inspection of the marked characters.

[0064] Meanwhile, the bad chips found by the test are dropped from the chip inlet of the upper cover plate into the distribution holes of the distribution switching wheel when passing through the bad chip distribution mechanism. Then, the distribution motor drives the distribution wheel to rotate, so that the chips with the same bad problem are dropped into the same collection box below.

[0065] The good chips are finally placed on the carrier tape one by one by the vacuum suction nozzles, and are heat-pressed with the sealing film to be in a closed state. Finally, the whole process of detection and packaging of the good chips is completed.

[0066] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A high-speed turret inspection and packaging equipment for semiconductors, characterized by: The machine comprises a platform (1), a vibrating feeding mechanism (2) is provided on the platform (1), a discharging end of the vibrating feeding mechanism (2) is provided with a discharging mechanism (3), and a turret detection mechanism (4) is provided on one side of the discharging mechanism (3); A carrier packaging mechanism (5) is provided on one side of the turret detection mechanism (4), and the turret detection mechanism (4) includes a nozzle rotating mechanism (41) installed in the machine (1) and a lifting drive mechanism (42) provided above the nozzle rotating mechanism (41); The nozzle rotating mechanism (41) comprises a rotatable disk (411) arranged on the machine platform (1), a plurality of vacuum nozzles (412) arranged at equal intervals are mounted on the disk (411), an air pipe connecting column is provided at the upper end of the disk (411), a nozzle rotating motor (413) for driving the disk (411) to rotate is provided at the lower end of the disk (411), the vacuum nozzle (412) is connected to the disk (411) in a manner that it can slide up and down, and a return spring (414) is provided on the outer side of the vacuum nozzle (412); The lifting drive mechanism (42) includes a lifting mechanism bracket (421) fixedly mounted to the machine platform (1), the lifting mechanism bracket (421) is provided with a plurality of lifting drive units, the lifting drive units include a lifting drive motor (422), the output shaft of the lifting drive motor (422) is downwardly connected to a first cam (423), one side of the first cam (423) is provided with a fixed seat (424) fixedly connected to the lifting mechanism bracket (421), one side of the fixed seat (424) is slidably connected to a slide (425), the upper end of the slide (425) is provided with a cam follower roller (426), the first cam (423) is in contact with the cam follower roller (426), the slide (425) is connected to the fixed seat (424) via a spring, and a plurality of detection mechanisms (43) are provided directly below the vacuum suction nozzle (412); The plurality of detection mechanisms (43) include a chip detection fixture, wherein the chip detection fixture includes a card seat (431), the card seat (431) has a pair of spaced card pins (432), an elastic ejector pin (433) is provided between the pair of card pins (432), and a plurality of probes (434) are provided on both sides of the elastic ejector pin (433), and the probes (434) are electrically connected to a test instrument; A laser marking mechanism (44) is further provided on one side of the plurality of detection mechanisms (43), the laser marking mechanism (44) comprising a marking seat body (441) fixedly connected to the machine (1), a rotatable chip fixing fixture table (442) being provided on the marking seat body (441), four chip placement slots (443) being provided on the chip fixing fixture table (442), a vacuum negative pressure channel (447) being provided in the chip fixing fixture table (442) and connected to the bottoms of the four chip placement slots (443), the chip fixing fixture table (442) being driven to rotate by a marking seat motor (444), and a laser generator (445) and a CCD detection camera (446) being provided on one side of the chip fixing fixture table (442); The material distribution mechanism (3) comprises a material distribution frame (31) fixedly connected to the machine platform (1), a material distribution track (32) is installed on the material distribution frame (31), a blocking mechanism (33) is provided at one end of the material distribution track (32), and a material receiving mechanism (34) is provided on one side of the blocking mechanism (33); The blocking mechanism (33) comprises a blocking block (331) connected to the material distribution frame (31) in an up-and-down sliding manner, and a tension spring (332) is connected between the blocking block (331) and the material distribution frame (31); The material receiving mechanism (34) includes a material receiving seat (341) connected to the material distribution frame (31) in a forward and backward sliding manner. A tension spring (342) is connected between the material receiving mechanism (34) and the material distribution frame (31). A vacuum negative pressure pipeline (343) is provided in the material receiving seat (341). A fixing groove (344) matching the chip is provided on the material receiving seat (341). A vacuum suction hole (345) is provided in the fixing groove (344). A material receiving seat driving roller (346) is connected to the material receiving seat (341). A material distributing motor (311) is installed on the material distributing frame (31), and the output shaft of the material distributing motor (311) is connected to a second cam (312), the front end of the second cam (312) abuts against the material receiving seat driving roller (346), and the side wall of the second cam (312) abuts against the stopper (331); A flip mechanism (9) is further provided on one side of the plurality of detection mechanisms (43), wherein the flip mechanism (9) comprises a flip base (91) fixedly connected to the machine platform (1), a rotatable support frame (92) is provided in the flip base (91) via a bearing, a clamping positioning motor (93) is installed on the support frame (92), an output shaft of the clamping positioning motor (93) is driven upward to connect an opening and closing cam (94), a clamping fixture (95) is provided at the top of the support frame (92), and the clamping fixture (95) is provided. ) includes four clamping blocks movably connected to the top of the support frame (92), the bottom of the clamping blocks is equipped with a driving roller, the opening and closing cam is arranged between the driving rollers, the bottom of the support frame (92) is equipped with a synchronous wheel (96), the synchronous wheel (96) is connected to a driving wheel (98) through a belt (97), the driving wheel (98) is installed on the output shaft of the flip motor (99), and the flip motor (99) is connected to the synchronous wheel (96) through the belt (97) to rotate the support frame (92).

2. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: A first CCD camera detection unit (6) is provided on one side of the material distribution mechanism (3).

3. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: A defective product collection mechanism (7) is also provided on one side of the plurality of detection mechanisms (43).

4. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: A second defective product sorting mechanism (8) is further provided on one side of the plurality of detection mechanisms (43), the second defective product sorting mechanism (8) comprising a defective product bin (81), a rotatable sorting switching wheel (82) being provided in the defective product bin (81), a plurality of sorting holes (83) being provided on the sorting switching wheel (82), an upper cover plate (84) and a lower cover plate (85) being respectively installed at the upper and lower ends of the sorting switching wheel (82), a chip inlet (841) being provided on the upper cover plate (84), and two discharge ports (851) being arranged opposite to each other on the lower cover plate (85), the two discharge ports (851) being respectively connected to two defective product collection boxes (86), and the defective product collection boxes (86) being placed in the defective product bin (81).

5. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: A defective product blowing and rejecting mechanism (10) is provided on one side of the turnover mechanism (9).

6. The high-speed turret inspection and packaging equipment for semiconductors according to claim 1, characterized in that: The carrier packaging mechanism (5) includes a carrier rack (51), a plurality of carrier guide wheels (52) are provided on the carrier rack (51), a carrier (53) is placed on the carrier guide wheel (52), a carrier moving motor (54) for driving the carrier (53) to move is provided on one side of the carrier (53), the carrier moving motor (54) is connected to a driving wheel (55), the driving wheel (55) presses the carrier (53), a film loading tray (56) is installed on the carrier rack (51), a film roll (57) is placed on the film loading tray (56), and the film roll (57) is pressed against the film. 7) It is pulled to the surface of the carrier tape (53) through a plurality of carrier tape guide wheels (52) and passes through the bottom of a plurality of hot pressing blocks (58) along with the carrier tape (53). The hot pressing blocks (58) are mounted on a lifting slide (59). The lifting slide (59) can be slid up and down and connected to the carrier tape frame (51). A driving groove (591) is provided on the top of the lifting slide (59). A lifting driving roller (510) is provided in the driving groove (591). The lifting driving roller (510) is mounted on an eccentric block (511). The eccentric block (511) is connected to a pressing block lifting driving motor (512).

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