Device, method and control system for cutting silicon wafer through diamond wire

Abstract

The invention discloses equipment, a method and a control system for cutting a silicon wafer by using a diamond wire. The cutting equipment comprises a shaft roller, a diamond wire, a silicon material feeding device, a cutting liquid main tank and the like, and the specific specification of the diamond wire is as follows: a base material tungsten filament bus is 26-33 microns, the thickness of a coating is 2-3 microns, and the number of diamond particles is 50-200. The cutting method comprises the steps of installing the silicon material, starting the shaft roller and the ultrasonic device, conveying the cutting liquid and the like, and cutting is completed through circulation of the cutting liquid. The control system comprises a user interaction module, a data acquisition module and the like, and the functions of parameter setting, equipment driving, data storage and analysis, remote communication and the like are achieved through cooperation of the modules. The problems that diamond wire thinning cutting liquid is difficult to bring in and the like are solved, the wire using amount is reduced, the cutting time is shortened, the silicon wafer cutting efficiency and quality are improved, cost reduction and efficiency improvement are achieved, great significance is achieved for the photovoltaic slicing link, and meanwhile the control system ensures that the cutting process is stable and efficient.

Description

Technical Field

[0001] The present invention mainly relates to the field of using diamond wire for cutting silicon wafers, and in particular to a device and method for using diamond wire for cutting silicon wafers and a control system adapted thereto, aiming to solve many problems existing in the existing silicon wafer cutting technology, improve the efficiency and quality of silicon wafer cutting and reduce the cost. Background Art

[0002] As the world actively seeks sustainable energy solutions, photovoltaic energy has become increasingly prominent in the energy field due to its clean and renewable advantages. As one of the core components of photovoltaic power generation systems, the optimization of silicon wafer cutting technology is crucial to the development of the entire photovoltaic industry. At present, diamond wire cutting technology dominates the field of silicon wafer cutting, but it still faces a series of severe challenges.

[0003] The basic principle of diamond wire cutting silicon wafers is to grind the silicon material with the diamond particles embedded in the diamond wire by means of the high-speed reciprocating motion of the diamond wire and the precise feeding of the silicon material, so as to cut the silicon material into silicon wafers of the required thickness. In this delicate physical process, the cutting fluid plays a key role in many aspects.

[0004] From the perspective of lubrication performance, the cutting fluid forms a stable lubricating film between the diamond wire and the silicon material, which effectively reduces the friction coefficient between the two. On the one hand, it significantly reduces the heat generated by friction, avoids scratches, cracks and other defects on the surface of the silicon wafer due to overheating, and ensures that the surface of the silicon wafer has good flatness and finish, which is crucial for the silicon wafer to achieve efficient photoelectric conversion in the photovoltaic power generation process; on the other hand, good lubrication reduces the wear rate of the diamond wire, extends the service life of the diamond wire, and reduces the increase in production costs caused by frequent replacement of the diamond wire.

[0005] In terms of heat dissipation, the intense friction between the diamond wire and the silicon material during the cutting process will instantly generate a large amount of heat. If this heat cannot be dissipated in time, the local temperature of the silicon wafer will rise sharply. The cutting fluid, with its good thermal conductivity, can quickly absorb and take away this heat, maintaining a relatively stable temperature in the cutting area. This not only prevents the internal crystal structure of the silicon wafer from changing due to high temperature, ensuring that the electrical properties of the silicon wafer are not affected, and ensuring its normal performance in the subsequent battery preparation process, but also helps to maintain the stability of the cutting environment and improve the reliability of the cutting process.

[0006] The excretion function of the cutting fluid should not be ignored. During the cutting process, the silicon material will be ground and produce a large number of fine impurities such as silicon chips. If these impurities accumulate in the cutting area, they will interfere with the normal movement of the diamond wire, increase the cutting resistance, and may even cause the diamond wire to break, seriously affecting the continuity and stability of the cutting. The cutting fluid can wash away these impurities in time, ensuring that the cutting area is always kept clean, and providing a good environment for the smooth progress of the cutting process.

[0007] However, the current way of cutting fluid entering the cutting area has many defects that are difficult to overcome.

[0008] The cutting fluid is introduced by the reciprocating motion of the diamond wire. Due to the physical properties of the diamond wire itself, its surface tension and adsorption capacity limit the amount of cutting fluid that can be carried to a certain extent. In particular, as the photovoltaic industry continues to increase its requirements for silicon wafer quality, the thinning of diamond wire has become an inevitable trend in the development of the industry. The thinned diamond wire has a smaller diameter and a correspondingly greatly reduced surface area, which further weakens its ability to carry cutting fluid. In actual cutting operations, this method of carrying fluid is difficult to meet the needs of the cutting fluid in terms of lubrication, cooling and excretion during thin wire cutting, thus affecting the cutting quality and efficiency.

[0009] Another common method is to spray the cutting fluid to the slit through the nozzle and let it penetrate into the cutting area. However, the effectiveness of this method is restricted by many factors. Slight changes in parameters such as the nozzle position, spray angle, and spray pressure may lead to uneven distribution of the cutting fluid in the slit. At the same time, the microstructure and flatness of the silicon surface will also affect the penetration effect of the cutting fluid. In practical applications, the cutting fluid is often unevenly distributed in the slit. Some areas may not be able to achieve good lubrication and cooling due to insufficient supply of cutting fluid, resulting in a decrease in the surface quality of the silicon wafer; while other areas may accumulate too much cutting fluid, which not only causes waste, but also may affect the stability of the cutting process.

[0010] Although thinning diamond wires can theoretically help reduce silicon material loss and increase silicon wafer yield, in actual production, the problem of difficulty in carrying liquid has not been effectively solved. In order to ensure the cutting effect, the amount of diamond wire used has to be increased. This not only directly leads to a significant increase in material costs, but also the time required to cut silicon materials is significantly extended as the amount of diamond wire used increases. In large-scale industrial production, longer cutting time means lower equipment utilization and increased energy consumption, which further exacerbates the increase in slicing costs and seriously restricts the cost reduction, efficiency improvement and sustainable development of the photovoltaic industry.

[0011] In summary, the existing silicon wafer cutting technology urgently needs an innovative solution to overcome the problem of liquid carrying caused by the thinning of diamond wire, reduce the usage of diamond wire and cutting time, and improve the overall performance of silicon wafer cutting, thereby promoting the healthy and rapid development of the photovoltaic energy industry. Summary of the invention

[0012] In order to overcome the above-mentioned problems or at least partially solve the above-mentioned problems, the purpose of the present invention is to provide a device, method and control system for using diamond wire for silicon wafer cutting, so as to overcome the problem of liquid carrying caused by the thinning of diamond wire, reduce the usage of diamond wire and cutting time, improve the overall performance of silicon wafer cutting, and thus promote the healthy and rapid development of the photovoltaic energy industry.

[0013] In a first aspect, an embodiment of the present invention provides a device for using diamond wire for silicon wafer cutting, which is mainly composed of the following parts:

[0014] Axis roller: As the core transmission component in the slicing process, it can perform precise reciprocating motion, provide power and guidance for the movement of the diamond wire, and ensure that the diamond wire maintains a stable motion trajectory and speed during the cutting process.

[0015] Diamond wire: Its wire mesh is evenly distributed on the shaft roller. The base material of the diamond wire adopts a tungsten wire mother wire of specific specifications, with a specification range of 26-33μm, a coating thickness controlled at 2-3μm, and the number of diamond particles on the diamond wire is 50-200. This specific parameter setting is designed to meet the new cutting process requirements and reduce costs while ensuring cutting capabilities.

[0016] Silicon material feeding device: It is equipped with a high-precision feeding control system, which can push the silicon material at a stable speed during the slicing process according to the preset parameters, ensuring the relative movement of the silicon material and the diamond wire is coordinated and consistent to achieve precise cutting.

[0017] Cutting fluid main groove: A gap with a width of 1mm is opened at the diamond wire mesh. The gap not only provides space for the reciprocating cutting of the diamond wire, but also serves as a key channel for the circulation and reflux of the cutting fluid, ensuring the effective supply and recycling of the cutting fluid in the cutting area.

[0018] Cutting fluid: The carefully formulated cutting fluid has good lubrication, cooling, and drainage properties. It can form a stable lubricating film during the cutting process, effectively reduce the friction coefficient, quickly take away heat, and promptly remove impurities generated by cutting.

[0019] Ultrasonic device: By generating high-frequency ultrasonic vibrations, it acts on the cutting fluid, allowing it to better disperse and penetrate in the cutting area, enhancing the lubrication and cooling effects of the cutting fluid, and improving cutting efficiency and quality.

[0020] Cutting fluid inlet: As the inlet for cutting fluid to be replenished into the system, it is connected to the external cutting fluid supply source to ensure the continuous supply of cutting fluid during the cutting process and maintain the stable liquid level and performance of the cutting fluid in the system.

[0021] Cutting fluid reflux tank: It is responsible for collecting the cutting fluid returning from the cutting area. Its design structure can effectively guide the reflux of the cutting fluid, prevent leakage and splashing during the reflux process, and ensure that the cutting fluid is smoothly returned to the subsequent processing link.

[0022] Cutting fluid sub-tank: works with the cutting fluid main tank to regulate the distribution and circulation of the cutting fluid, buffer and adjust the flow rate, pressure and other parameters of the cutting fluid, and ensure stable circulation and uniform distribution of the cutting fluid in the entire system.

[0023] Cutting fluid extraction pump: provides powerful power support for the circulation of cutting fluid, can accurately control the flow and pressure of cutting fluid according to system requirements, and ensure sufficient supply and effective circulation of cutting fluid in the cutting area.

[0024] Furthermore, the cutting method involved in the present invention comprises the following steps based on the above-mentioned device:

[0025] Equipment preparation stage:

[0026] First, the silicon material is accurately installed on the silicon material feeding device, and the precise feeding speed is set in the control system according to the process requirements of silicon wafer cutting.

[0027] Carefully check the movement of the roller to ensure that it can reciprocate smoothly and accurately. At the same time, check the distribution of the diamond wire mesh to ensure its uniformity and reasonable tension.

[0028] Inject an appropriate amount of cutting fluid into the main cutting fluid tank and auxiliary cutting fluid tank to ensure that the liquid level is within the normal working range, and check whether the cutting fluid inlet, reflux tank and related pipeline connections are tight and leak-free.

[0029] Cutting start-up phase:

[0030] Start the shaft roller to drive the diamond wire to start running stably according to the preset reciprocating motion mode, forming a stable cutting motion trajectory.

[0031] The cutting liquid extraction pump is started synchronously to accurately transport the cutting liquid from the cutting liquid sub-tank to the cutting liquid main tank through the cutting liquid inlet. The cutting liquid reaches the cutting area evenly through the 1mm gap at the diamond wire mesh in the main tank, ensuring that the cutting area can get sufficient cutting liquid supply at the beginning of cutting.

[0032] Turn on the ultrasonic device and set the appropriate ultrasonic frequency and power according to the cutting process requirements, so that the cutting fluid can be quickly dispersed into tiny droplets under the action of ultrasonic waves and better penetrate into every corner of the cutting area, thereby improving the contact effect between the cutting fluid and the diamond wire and silicon material.

[0033] Cutting process stages:

[0034] During the cutting process, the silicon material feeding device feeds the silicon material stably and strictly according to the set speed, ensuring the precise relative movement speed between the silicon material and the diamond wire to achieve precise cutting.

[0035] The diamond wire continuously reciprocates, and with the lubrication and cooling of the cutting fluid and the assistance of ultrasound, the diamond particles on the diamond wire are used to efficiently grind and cut the silicon material.

[0036] The debris and excess cutting fluid generated by cutting flow smoothly back to the cutting fluid sub-tank through the cutting fluid reflux tank under the action of gravity and the flow of the cutting fluid, thereby realizing the recycling of the cutting fluid. At the same time, the filtering device in the cutting fluid sub-tank performs preliminary filtration on the reflux cutting fluid to remove some impurities.

[0037] The control system monitors the key parameters of the cutting process in real time, such as the tension of the diamond wire, the temperature, pressure, flow rate of the cutting fluid, and the feed position of the silicon material. Once any abnormality is found in the parameters, the corresponding adjustment mechanism is immediately activated.

[0038] Cutting completion stage:

[0039] When the cutting task is completed, stop the operation of the shaft roller, ultrasonic device, cutting fluid extraction pump and other equipment in turn to ensure that the equipment stops running safely.

[0040] Carefully take out the cut silicon wafer and conduct a preliminary appearance inspection of the silicon wafer to check for surface defects and other problems.

[0041] Clean the equipment thoroughly, including the main cutting fluid tank, auxiliary tank, reflux tank and diamond wire surface, remove residual cutting fluid and impurities such as silicon chips, and prepare for the next cutting operation.

[0042] Record all detailed data during the cutting process, such as cutting parameters, equipment operation data, silicon wafer quality data, etc. These data will serve as an important basis for subsequent process optimization and quality control.

[0043] In a second aspect, an embodiment of the present application provides a control system for diamond wire cutting of silicon wafers, comprising:

[0044] User interaction module:

[0045] It provides an intuitive and friendly human-computer interaction interface, through which the operator can input various cutting parameters, such as silicon material feed speed, shaft roller reciprocating motion frequency, ultrasonic power, initial flow rate of cutting fluid, etc. At the same time, the operator can also view the real-time operating status of the equipment, various monitoring data during the cutting process, and system prompt information.

[0046] It has a parameter validity verification function. When the operator inputs the parameters, the system will automatically check whether the parameters are within a reasonable range. If the parameters are wrong or out of range, a prompt box will pop up in time to inform the operator to make changes to ensure that the input parameters are accurate and avoid abnormal equipment operation or cutting failure due to incorrect parameters.

[0047] Data acquisition module:

[0048] It is closely connected to the sensors installed at various key positions of the equipment to collect various data in the cutting process in real time, including the tension data of the diamond wire (collected through the tension sensor), the temperature data of the cutting fluid (temperature sensor), the pressure data (pressure sensor), the flow data (flow sensor) and the feeding position data of the silicon material (position sensor), etc.

[0049] The collected data is pre-processed, such as data filtering, amplification, analog-to-digital conversion, etc., to convert the original analog signal into a digital signal for subsequent processing and analysis. At the same time, the data is checked for validity and abnormal data is eliminated to ensure the accuracy and reliability of the data.

[0050] Control algorithm module:

[0051] It has built-in multiple advanced control algorithms, such as PID (proportional-integral-differential) control algorithm, fuzzy control algorithm, etc. According to the requirements of the cutting process and the operating characteristics of the equipment, the appropriate control algorithm is selected to accurately control the equipment.

[0052] The collected real-time data is used as input, and after calculation and processing by the control algorithm, the corresponding control signal is generated to adjust the equipment operating parameters such as the reciprocating speed of the shaft roller, the feed speed of the silicon material feeding device, the power of the ultrasonic device, and the flow rate of the cutting liquid extraction pump, to ensure that the cutting process is always in the best state.

[0053] It has the function of adaptive adjustment, which can automatically adjust the parameters of the control algorithm according to the actual situation during the cutting process to adapt to different cutting conditions and process requirements, and improve the control accuracy and stability of the system.

[0054] Device driver module:

[0055] The control signal generated by the control algorithm module is power amplified and converted so that it can drive the shaft roller motor, silicon material feeding motor, ultrasonic generator, cutting liquid extraction pump motor and other equipment to perform corresponding actions.

[0056] Real-time monitoring of the operating status of the equipment, such as the motor speed, current, voltage, etc. When the equipment fails or an abnormal situation occurs, the power supply is cut off in time, and an alarm signal is sent to the control system. At the same time, detailed fault information is displayed on the user interaction interface, so that maintenance personnel can quickly locate and eliminate the fault.

[0057] Data storage and analysis module:

[0058] Responsible for storing all data collected during the cutting process and the equipment's operating history data, and establishing a complete database management system to facilitate data query, retrieval and backup.

[0059] Use data analysis algorithms to conduct in-depth analysis of stored data and explore the patterns and potential problems behind the data. For example, by analyzing the quality data of silicon wafers under different cutting parameter combinations, the optimal cutting parameter settings can be found. Through trend analysis of equipment operation data, possible equipment failures can be predicted, and maintenance can be performed in advance to improve the reliability and service life of the equipment.

[0060] Remote communication module:

[0061] It is equipped with an Ethernet communication interface or a wireless communication module (such as Wi-Fi, 4G / 5G, etc.) to realize data communication between the control system and the remote monitoring center or other equipment.

[0062] Real-time data, equipment operating status, and alarm information during the cutting process can be uploaded to the remote monitoring center, making it convenient for managers to remotely monitor and manage the production process. At the same time, control instructions and parameter update information sent by the remote monitoring center can also be received to achieve remote operation and remote maintenance, thereby improving the flexibility and efficiency of production management.

[0063] In a third aspect, the present application provides a control system for diamond wire cutting of silicon wafers, wherein the control logic steps are as follows:

[0064] User interaction step: Provide a human-computer interaction interface to receive the cutting parameters input by the user, including silicon material feeding speed, shaft roller reciprocating frequency, ultrasonic power, and initial flow rate of cutting fluid. It also displays the real-time operating status of the equipment, cutting process monitoring data, and system prompt information, and verifies the legitimacy of the input parameters.

[0065] Data collection steps: By connecting with sensors at key parts of the equipment, real-time data on diamond wire tension, cutting fluid temperature, pressure, flow rate, and silicon material feed position are collected, and the collected data is pre-processed, including filtering, amplification, analog-to-digital conversion, and validity check;

[0066] Control algorithm steps: select the control algorithm according to the cutting process requirements and equipment operation characteristics, use the collected real-time data as input, generate control signals through algorithm calculation, adjust the reciprocating speed of the shaft roller, the feeding speed of the silicon material feeding device, the power of the ultrasonic device, and the flow rate of the cutting liquid extraction pump, and have an adaptive adjustment function;

[0067] Equipment driving steps: amplify and convert the control signal to drive the shaft roller motor, silicon material feeding motor, ultrasonic generator, and cutting liquid pump motor to perform corresponding actions, and monitor the equipment operation status in real time. When a fault occurs, cut off the power supply and alarm;

[0068] Data storage and analysis steps: store cutting process data and equipment operation history data, and use data analysis algorithms to mine data patterns and potential problems;

[0069] Remote communication steps: Realize data communication with the remote monitoring center or other equipment through the communication interface, upload real-time data, equipment status and alarm information, and receive remote control instructions and parameter update information.

[0070] In a fourth aspect, an embodiment of the present application provides an electronic device, comprising a memory for storing one or more programs; and a processor. When the one or more programs are executed by the processor, a system as described in any one of the first aspects above is implemented;

[0071] An embodiment of the present application provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the system according to any one of the first aspects described above is implemented.

[0072] The embodiments of the present invention have at least the following advantages or beneficial effects:

[0073] The present invention greatly improves the quality of silicon wafer cutting. The effective supply and uniform distribution of the cutting fluid in the present invention, thanks to the synergistic effect of the equipment structure and ultrasonic waves, forms a more stable and uniform lubricating film between the diamond wire and the silicon material. This greatly reduces the friction coefficient during the cutting process, effectively avoids scratches, cracks and other defects on the surface of the silicon wafer caused by uneven friction, ensures that the surface of the silicon wafer has higher flatness and finish, significantly improves the optical performance of the silicon wafer, and meets the strict requirements of photovoltaic power generation on the quality of silicon wafers.

[0074] Ensure stable electrical performance: Timely and efficient heat dissipation mechanism is another major advantage of the present invention. During the cutting process, the cutting fluid can quickly take away a large amount of heat generated by the friction between the diamond wire and the silicon material, preventing local overheating of the silicon wafer from causing changes in the internal crystal structure. The stable crystal structure ensures that the electrical performance of the silicon wafer is not affected during the subsequent battery preparation process, ensuring that the silicon wafer can perform its photoelectric conversion function normally, and improving the overall efficiency and stability of the photovoltaic power generation system.

[0075] The present invention significantly improves production efficiency and shortens the single-batch cutting time. During the operation of the cutting method and equipment of the present invention, the cooperation between the various components is more efficient. From the precise feeding of the silicon material feeding device, the stable reciprocating motion of the diamond wire driven by the shaft roller, to the optimized design of the cutting liquid circulation system and the strengthening effect of the ultrasonic device on the cutting liquid, each link is closely coordinated, making the cutting process smoother and greatly shortening the cutting time of a single batch of silicon wafers. This not only improves the production efficiency of the equipment, but also can produce more silicon wafers in the same time to meet the market's growing demand for silicon wafers; the control system monitors and accurately adjusts the equipment's operating parameters in real time to ensure that the equipment is always in the best working state during the entire cutting process. This reduces the downtime caused by equipment failure or abnormal parameters and improves the long-term stability and utilization of the equipment. At the same time, the stable equipment operation state also helps to further improve the cutting quality of silicon wafers, forming a virtuous circle and providing a strong guarantee for the efficient production of the photovoltaic industry.

[0076] The control system involved in the present invention realizes intelligent control and efficient management of precise intelligent control of the cutting process: the control algorithm module in the control system adopts advanced algorithms, such as PID control algorithm and fuzzy control algorithm, and has an adaptive adjustment function. It can accurately calculate and generate control signals according to the data collected in real time during the cutting process, such as diamond wire tension, cutting liquid temperature, pressure, flow rate and silicon material feeding position, and dynamically adjust the equipment operating parameters such as shaft roller movement speed, silicon material feeding speed, ultrasonic power, cutting liquid pump flow rate, etc. This precise intelligent control ensures that the cutting process is always kept under the best process conditions, effectively improves the cutting quality and efficiency, and reduces the scrap rate; at the same time, the data storage and analysis module stores and deeply analyzes the massive data in the cutting process, and can dig out the intrinsic relationship between different cutting parameter combinations and silicon wafer quality, thereby providing data support for process optimization, helping enterprises to continuously improve cutting processes and improve product quality. At the same time, through the trend analysis of equipment operation data, possible equipment failures can be predicted in advance, maintenance can be carried out in time, production interruptions caused by sudden equipment failures can be avoided, maintenance costs can be reduced, and the reliability and service life of the equipment can be improved; and the remote communication module enables the control system to communicate real-time data with the remote monitoring center or other equipment. Managers can check the equipment's operating status, cutting process data, and alarm information at any time through the remote monitoring center, and realize remote monitoring and management of the production process. In addition, control instructions and updated parameters can be sent remotely to respond to various changes in the production process in a timely manner, improve the flexibility and efficiency of production management, and adapt to the development trend of modern intelligent manufacturing. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0078] Figure 1 It is a schematic diagram of the cutting step in the present invention;

[0079] Figure 2 It is a schematic diagram of the control steps of the control system in the present invention;

[0080] Figure 3 It is a schematic diagram of the principle of the cutting equipment involved in the present invention;

[0081] Figure 4 A structural block diagram of an electronic device provided by an embodiment of the present invention.

[0082] Explanation of the reference numerals: 1. Shaft roller; 2. Diamond wire; 3. Silicon material feeding device; 4. Cutting liquid main tank; 5. Cutting liquid; 6. Ultrasonic wave; 7. Cutting liquid inlet; 8. Cutting liquid reflux tank; 9. Cutting liquid sub-tank; 10. Cutting liquid extraction pump; 101. Memory; 102. Processor; 103. Communication interface. DETAILED DESCRIPTION

[0083] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0084] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0085] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0086] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprise" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0087] In the description of the embodiments of the present invention, "plurality" means at least 2.

[0088] In the description of the embodiments of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0089] like Figure 1-4 The present application provides a device for using diamond wire for silicon wafer cutting, which is mainly composed of the following parts:

[0090] Axis roller: As the core transmission component in the slicing process, it can perform precise reciprocating motion, provide power and guidance for the movement of the diamond wire, and ensure that the diamond wire maintains a stable motion trajectory and speed during the cutting process.

[0091] Diamond wire: Its wire mesh is evenly distributed on the shaft roller. The base material of the diamond wire adopts a tungsten wire mother wire of specific specifications, with a specification range of 26-33μm, a coating thickness controlled at 2-3μm, and the number of diamond particles on the diamond wire is 50-200. This specific parameter setting is designed to meet the new cutting process requirements and reduce costs while ensuring cutting capabilities.

[0092] Silicon material feeding device: It is equipped with a high-precision feeding control system, which can push the silicon material at a stable speed during the slicing process according to the preset parameters, ensuring the relative movement of the silicon material and the diamond wire is coordinated and consistent to achieve precise cutting.

[0093] Cutting fluid main groove: A gap with a width of 1mm is opened at the diamond wire mesh. The gap not only provides space for the reciprocating cutting of the diamond wire, but also serves as a key channel for the circulation and reflux of the cutting fluid, ensuring the effective supply and recycling of the cutting fluid in the cutting area.

[0094] Cutting fluid: The carefully formulated cutting fluid has good lubrication, cooling, and drainage properties. It can form a stable lubricating film during the cutting process, effectively reduce the friction coefficient, quickly take away heat, and promptly remove impurities generated by cutting.

[0095] Ultrasonic device: By generating high-frequency ultrasonic vibrations, it acts on the cutting fluid, allowing it to better disperse and penetrate in the cutting area, enhancing the lubrication and cooling effects of the cutting fluid, and improving cutting efficiency and quality.

[0096] Cutting fluid inlet: As the inlet for cutting fluid to be replenished into the system, it is connected to the external cutting fluid supply source to ensure the continuous supply of cutting fluid during the cutting process and maintain the stable liquid level and performance of the cutting fluid in the system.

[0097] Cutting fluid reflux tank: It is responsible for collecting the cutting fluid returning from the cutting area. Its design structure can effectively guide the reflux of the cutting fluid, prevent leakage and splashing during the reflux process, and ensure that the cutting fluid is smoothly returned to the subsequent processing link.

[0098] Cutting fluid sub-tank: works with the cutting fluid main tank to regulate the distribution and circulation of the cutting fluid, buffer and adjust the flow rate, pressure and other parameters of the cutting fluid, and ensure stable circulation and uniform distribution of the cutting fluid in the entire system.

[0099] Cutting fluid extraction pump: provides powerful power support for the circulation of cutting fluid, can accurately control the flow and pressure of cutting fluid according to system requirements, and ensure sufficient supply and effective circulation of cutting fluid in the cutting area.

[0100] Furthermore, the cutting method involved in the present application includes the following steps based on the above-mentioned device:

[0101] Equipment preparation stage:

[0102] First, the silicon material is accurately installed on the silicon material feeding device, and the precise feeding speed is set in the control system according to the process requirements of silicon wafer cutting.

[0103] Carefully check the movement of the roller to ensure that it can reciprocate smoothly and accurately. At the same time, check the distribution of the diamond wire mesh to ensure its uniformity and reasonable tension.

[0104] Inject an appropriate amount of cutting fluid into the main cutting fluid tank and auxiliary cutting fluid tank to ensure that the liquid level is within the normal working range, and check whether the cutting fluid inlet, reflux tank and related pipelines are tightly connected and there is no leakage.

[0105] Cutting start-up phase:

[0106] Start the shaft roller to drive the diamond wire to start running stably according to the preset reciprocating motion mode, forming a stable cutting motion trajectory.

[0107] The cutting liquid extraction pump is started synchronously to accurately transport the cutting liquid from the cutting liquid sub-tank to the cutting liquid main tank through the cutting liquid inlet. The cutting liquid reaches the cutting area evenly through the 1mm gap at the diamond wire mesh in the main tank, ensuring that the cutting area can get sufficient cutting liquid supply at the beginning of cutting.

[0108] Turn on the ultrasonic device and set the appropriate ultrasonic frequency and power according to the cutting process requirements, so that the cutting fluid can be quickly dispersed into tiny droplets under the action of ultrasonic waves and better penetrate into every corner of the cutting area, thereby improving the contact effect between the cutting fluid and the diamond wire and silicon material.

[0109] Cutting process stages:

[0110] During the cutting process, the silicon material feeding device feeds the silicon material stably and strictly according to the set speed, ensuring the precise relative movement speed between the silicon material and the diamond wire to achieve precise cutting.

[0111] The diamond wire continuously reciprocates, and with the lubrication and cooling of the cutting fluid and the assistance of ultrasound, the diamond particles on the diamond wire are used to efficiently grind and cut the silicon material.

[0112] The debris and excess cutting fluid generated by cutting flow smoothly back to the cutting fluid sub-tank through the cutting fluid reflux tank under the action of gravity and the flow of the cutting fluid, thereby realizing the recycling of the cutting fluid. At the same time, the filtering device in the cutting fluid sub-tank performs preliminary filtration on the reflux cutting fluid to remove some impurities.

[0113] The control system monitors the key parameters of the cutting process in real time, such as the tension of the diamond wire, the temperature, pressure, flow rate of the cutting fluid, and the feed position of the silicon material. Once any abnormality is found in the parameters, the corresponding adjustment mechanism is immediately activated.

[0114] Cutting completion stage:

[0115] When the cutting task is completed, stop the operation of the shaft roller, ultrasonic device, cutting fluid extraction pump and other equipment in turn to ensure that the equipment stops running safely.

[0116] Carefully take out the cut silicon wafer and conduct a preliminary appearance inspection of the silicon wafer to check for surface defects and other problems.

[0117] Clean the equipment thoroughly, including the main cutting fluid tank, auxiliary tank, reflux tank and diamond wire surface, remove residual cutting fluid and impurities such as silicon chips, and prepare for the next cutting operation.

[0118] Record all detailed data during the cutting process, such as cutting parameters, equipment operation data, silicon wafer quality data, etc. These data will serve as an important basis for subsequent process optimization and quality control.

[0119] Embodiment 1:

[0120] Equipment preparation

[0121] Select diamond wire with specifications of 26μm tungsten wire busbar, 2μm coating thickness and 50 diamond particles, and install it evenly on the shaft roller to ensure that the wire mesh is evenly distributed and the tension is moderate.

[0122] The silicon material was accurately installed on the silicon material feeding device and the silicon material feeding speed was set to 0.5 mm / s.

[0123] Inject an appropriate amount of carefully prepared cutting fluid into the main cutting fluid tank and auxiliary cutting fluid tank, check the cutting fluid inlet, reflux tank and the tightness of each pipeline connection to ensure there is no leakage.

[0124] Turn on the power of the equipment, perform an idling test on the shaft roller, check the smoothness of its reciprocating motion, and ensure that the motion error is within the allowable range.

[0125] Cutting process

[0126] Start the shaft roller to drive the diamond wire to reciprocate at a speed of 10m / s.

[0127] Start the cutting liquid extraction pump to transport the cutting liquid from the auxiliary tank to the main tank through the liquid inlet. Set the cutting liquid flow rate to 5L / min, and the cutting liquid will evenly reach the cutting area through the 1mm gap in the main tank.

[0128] At the same time, start the ultrasonic device, set the ultrasonic frequency to 20kHz and the power to 500W, so that the cutting fluid can be better dispersed and penetrated into the cutting area under the action of ultrasonic waves.

[0129] During the cutting process, the control system monitors the diamond wire tension in real time and keeps it between 10-15N, the cutting fluid temperature between 25-35°C, the pressure between 0.2-0.3MPa, the flow rate stable at around 5L / min, and the silicon material feeding device feeds silicon material steadily at the set speed.

[0130] After cutting is completed

[0131] After cutting is completed, stop the shaft roller, ultrasonic device and cutting liquid extraction pump.

[0132] The silicon wafer was carefully taken out and its surface was thoroughly inspected using an optical microscope. No obvious scratches, cracks or other defects were found, and the surface roughness of the silicon wafer reached 0.8μm.

[0133] Clean the equipment, including the main tank, sub-tank, reflux tank and diamond wire surface, to ensure there is no residual cutting fluid and silicon chips.

[0134] Record the cutting process data, such as cutting parameters, equipment operation data, silicon wafer quality data, etc., to provide a reference for subsequent process optimization.

[0135] Embodiment 2:

[0136] Equipment preparation

[0137] A diamond wire with a specification of 33μm tungsten wire busbar, a coating thickness of 3μm, and 200 diamond particles is used. It is installed on the shaft roller and the wire mesh is adjusted.

[0138] Install the silicon material on the feeding device and set the feeding speed to 0.8 mm / s.

[0139] After injecting the cutting fluid, check the system sealing, start the equipment preheating, check the movement accuracy of the shaft roller, and control the reciprocating motion error within a very small range.

[0140] Cutting process

[0141] The starting shaft roller drives the diamond wire to reciprocate at a speed of 15m / s.

[0142] Start the liquid extraction pump to deliver the cutting liquid to the main tank at a flow rate of 8L / min, and then the cutting liquid reaches the cutting area through the gap. Turn on the ultrasonic device, set the frequency to 30kHz, and the power to 800W.

[0143] During cutting, the control system monitors the diamond wire tension at 12-18N, the cutting fluid temperature at 20-30℃, the pressure at 0.25-0.35MPa, the flow rate at about 8L / min, and the silicon material feeding device feeds stably.

[0144] After cutting is completed

[0145] The relevant equipment was stopped, the silicon wafer was taken out, and the surface of the silicon wafer was inspected with an atomic force microscope. The surface roughness was 0.6 μm, and there were no obvious defects.

[0146] Clean all parts of the equipment and record cutting data, including the equipment operating time of 150 minutes, which is 20% shorter than traditional methods, and the use of diamond wire is reduced by 15%.

[0147] Comparative Example 1 (traditional cutting method, without ultrasonic device and special equipment structure):

[0148] Equipment preparation

[0149] Conventional diamond wire (similar to the parameters in Example 1) was used and installed on a common shaft roller. The silicon material was installed in a conventional feeding device and the feeding speed was set to 0.6 mm / s.

[0150] Fill with normal cutting fluid and check basic plumbing connections.

[0151] Cutting process

[0152] The starting shaft roller drives the diamond wire to reciprocate at a speed of 8m / s, and the cutting fluid is only sprayed into the cutting seam through the spray port, without any special circulation structure.

[0153] The cutting parameters cannot be effectively monitored and adjusted during the cutting process, and the operation can only rely on experience.

[0154] After cutting is completed

[0155] The equipment was stopped and the silicon wafer was taken out. It was found that there were many scratches and micro cracks on the surface of the silicon wafer, and the surface roughness reached 1.5μm.

[0156] The recording device was operated for 200 minutes, and the amount of diamond wire used was 25% more than that in Example 1.

[0157] Comparative Example 2 (only optimizing the diamond wire parameters, other cutting conditions remain unchanged):

[0158] Equipment preparation

[0159] An optimized diamond wire (26 μm tungsten wire busbar, 2 μm coating thickness, 50 diamond particles) of the same specifications as in Example 1 was used and installed on a conventional cutting device, and the silicon material feed speed was set to 0.5 mm / s.

[0160] Inject conventional cutting fluid and check the basic operating conditions of the equipment.

[0161] Cutting process

[0162] The start roller makes the diamond wire reciprocate at a speed of 10m / s, and the cutting fluid is supplied in the traditional way. During the cutting process, the diamond wire wears quickly and breaks frequently because the problem of liquid carrying cannot be effectively solved.

[0163] After cutting is completed

[0164] The equipment was stopped and the silicon wafer was taken out. The surface of the silicon wafer had obvious scratches and the surface roughness was 1.2 μm. The running time of the recording equipment was 180 minutes. The amount of diamond wire used was 18% more than that of Example 1.

[0165] By comparing Example 1 and Example 2 with Comparative Examples 1 and Comparative Examples 2, it can be seen that the equipment, method and control system of the present invention have significant advantages in silicon wafer cutting quality, cutting efficiency, diamond wire usage, etc., and effectively solve the problems existing in the prior art mentioned in the background technology.

[0166] The embodiment of the present application also provides a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by the processor 102, a system as in any one of the first aspects described above is implemented. If the function is implemented in the form of a software function module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on such an understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or the part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM, Read-Only Memory), a random access memory (RAM, Random Access Memory), a disk or an optical disk.

[0167] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention. For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or basic features of the present application. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present application is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved.

Claims

1. A method for using diamond wire for silicon wafer cutting, characterized in that: The following steps are involved: S1. Install the silicon material on the silicon material feeding device and set the silicon material feeding speed; S2. Start the shaft roller to make the diamond wire reciprocate; S3. The cutting liquid is pumped from the cutting liquid auxiliary tank to the cutting liquid main tank through the cutting liquid inlet, and the cutting liquid reaches the cutting area through the 1 mm gap at the diamond wire mesh in the cutting liquid main tank; S4. Start the ultrasonic device to disperse and penetrate the cutting fluid into the cutting area under the action of ultrasonic waves; S5. During the cutting process, the cutting fluid lubricates, cools and drains the cutting area. The silicon material feeding device feeds the silicon material at a set speed. The diamond wire continuously reciprocates for cutting. The debris and excess cutting fluid generated by the cutting flow back to the cutting fluid sub-tank through the cutting fluid reflux tank, thereby realizing the recycling of the cutting fluid.

2. A control system for diamond wire cutting of silicon wafers, characterized in that: The control logic steps include the following: User interaction step: providing a human-computer interaction interface, receiving the cutting parameters input by the user, including silicon material feeding speed, shaft roller reciprocating motion frequency, ultrasonic power, and cutting fluid initial flow rate, while displaying the real-time operation status of the equipment, cutting process monitoring data, and system prompt information, and verifying the legitimacy of the input parameters; Data collection steps: By connecting with sensors at key parts of the equipment, real-time data on diamond wire tension, cutting fluid temperature, pressure, flow rate, and silicon material feed position are collected, and the collected data is pre-processed, including filtering, amplification, analog-to-digital conversion, and validity check; Control algorithm steps: select the control algorithm according to the cutting process requirements and equipment operation characteristics, use the collected real-time data as input, generate control signals through algorithm calculation, adjust the reciprocating speed of the shaft roller, the feeding speed of the silicon material feeding device, the power of the ultrasonic device, and the flow rate of the cutting liquid extraction pump, and have an adaptive adjustment function; Equipment driving steps: amplify and convert the control signal to drive the shaft roller motor, silicon material feeding motor, ultrasonic generator, and cutting liquid extraction pump motor to perform corresponding actions, and monitor the equipment operation status in real time. When a fault occurs, cut off the power supply and alarm; Data storage and analysis steps: store cutting process data and equipment operation history data, and use data analysis algorithms to mine data patterns and potential problems; Remote communication steps: Realize data communication with the remote monitoring center or other equipment through the communication interface, upload real-time data, equipment status and alarm information, and receive remote control instructions and parameter update information.

3. The method for using diamond wire for silicon wafer cutting according to claim 1, characterized in that: The base material of the diamond wire is a tungsten wire mother wire with a specification of 26-33 μm, a coating thickness of 2-3 μm, and 50-200 diamond particles on the diamond wire.

4. The method for using diamond wire for silicon wafer cutting according to claim 1, characterized in that: During the equipment preparation stage, it also includes checking the movement status of the shaft rollers and the distribution of the diamond wire mesh, as well as checking the tightness of the cutting fluid system pipeline connections.

5. The method for using diamond wire for silicon wafer cutting according to claim 1, characterized in that: After cutting is completed, the silicon wafer is visually inspected and various data of the cutting process are recorded, including cutting parameters, equipment operation data, and silicon wafer quality data.

6. The control system for diamond wire cutting of silicon wafers according to claim 2, characterized in that: The control algorithms in the control algorithm step include PID control algorithm and fuzzy control algorithm.

7. The control system for diamond wire cutting of silicon wafers according to claim 2, characterized in that: The data analysis algorithm in the data storage and analysis step is used to analyze the silicon wafer quality data under different cutting parameter combinations to find the optimal parameter settings, and to perform trend analysis on the equipment operation data to predict equipment failures.

8. The control system for diamond wire cutting of silicon wafers according to claim 2, characterized in that: The communication interface in the remote communication step includes an Ethernet communication interface or a wireless communication module, and the wireless communication module includes Wi-Fi, 4G / 5G.

9. The control system for diamond wire cutting of silicon wafers according to claim 2, characterized in that: The monitoring of the equipment operation status in the equipment driving step includes the monitoring of the motor speed, current and voltage.

10. The control system for diamond wire cutting of silicon wafers according to claim 2, characterized in that: If the parameter validity verification in the user interaction step finds an error or exceeds the range, a prompt box will pop up to inform the operator to make changes.

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