Manufacturing method of electronic equipment protective shell

Abstract

The manufacturing method of the electronic equipment protection shell comprises the steps that a PET sheet and a PC sheet are bonded through a photosensitive adhesive to form a back plate; the back plate is placed in an injection mold for injection molding, the PC sheet and the injection molding material are welded, and a frame surrounding the back plate is formed; and releasing the injection mold to obtain the electronic equipment protection shell. According to the invention, injection molding is carried out by bonding the PET sheet and the PC sheet, the PC sheet and the injection molding material are welded during injection molding, and a hot melt high-temperature reaction is not directly generated on the surface of the PET sheet, so that on one hand, the welding defect possibly generated by hot melt adhesive welding is avoided, and on the other hand, the reduction of the transparency of the PET sheet due to injection molding is avoided; compared with the prior art, the device has prominent substantive features and remarkable progress.

Description

Technical Field

[0001] The present invention relates to the technical field of peripheral accessories of electronic equipment, and in particular to a method for manufacturing a protective shell of an electronic equipment. Background Art

[0002] Electronic device protective cases, such as tablet protective cases, mobile phone protective cases, etc., not only have the function of protecting electronic devices, but also have a certain decorative function. PET material is very popular among users due to its high transparency and high hardness, and is often used as the back plate of electronic device protective cases; however, in the prior art, the back plate of PET material is usually combined with the frame of the electronic device protective case by a snap-on method, which limits the overall sealing of the protective case; some manufacturers also apply hot melt adhesive on the surface of the PET back plate, so that the hot melt adhesive layer melts in the injection molding machine and fuses with the PC injection molding material to form an integrated protective case with a PET back plate and a PC frame. In this process, the hot melt adhesive will reduce the light transmittance of the PET back plate and increase the haze when it dissolves.

[0003] How to strike a balance between the sealing of the protective case and the light transmittance of the PET back panel is a technical problem that mobile phone case manufacturers are eager to solve. Summary of the invention

[0004] The purpose of the present invention is to provide a method for manufacturing an electronic device protective shell, by injection molding by bonding a PET sheet to a PC sheet, and welding the PC sheet to the injection molding material during injection molding without directly causing a hot melt high-temperature reaction on the surface of the PET sheet. On the one hand, the welding defects that may be caused by hot melt adhesive welding are avoided, and on the other hand, the decrease in transparency of the PET sheet due to injection molding is avoided; compared with the prior art, the method has outstanding substantial characteristics and significant progress.

[0005] The present invention provides a method for manufacturing an electronic device protective shell, comprising: The PET sheet and the PC sheet are bonded with a photosensitive adhesive to form a backplane; Put the back plate into an injection mold for injection molding, so that the PC sheet and the injection molding material are welded to form a frame surrounding the back plate; The injection mold is released to obtain a protective case for an electronic device.

[0006] Furthermore, before the PET sheet and the PC sheet are bonded by using a photosensitive adhesive, a pattern is printed on the surface where the PET sheet and the PC sheet are bonded.

[0007] Furthermore, a pattern is printed on the surface where the PET sheet and the PC sheet are bonded by means of silk screen printing or printing.

[0008] Furthermore, the photosensitive adhesive is UV glue.

[0009] Furthermore, a laminated roller coating machine is used to bond the PET sheet and the PC sheet with a photosensitive adhesive.

[0010] Furthermore, the injection molding material is PC material, ABS material or TPU material.

[0011] Furthermore, camera holes are provided on both the PET sheet and the PC sheet.

[0012] Furthermore, the back plate is placed in an injection mold for injection molding to form a frame surrounding the back plate and a camera protection ring, and the camera protection ring passes through the camera holes on the PET sheet and the PC sheet.

[0013] Furthermore, a charging hole and at least one button hole are formed on the frame.

[0014] Furthermore, a detachable button is arranged in the button hole.

[0015] The manufacturing method of the electronic device protective shell provided by the present invention is to perform injection molding by bonding PET sheets and PC sheets. During injection molding, the PC sheets and the injection molding material are welded, and a hot melt high-temperature reaction does not directly occur on the surface of the PET sheet. On the one hand, the welding defects that may be caused by hot melt adhesive welding are avoided, and on the other hand, the transparency of the PET sheet is avoided. The decrease due to injection molding has outstanding substantial characteristics and significant progress compared with the prior art. In the present invention, the PC sheet is used as a welding material for performing the injection molding step and is welded with the injection molding material to isolate the PET sheet. This ingenious process provides a basis for the application of PET sheets in the field of protective shell manufacturing, especially for setting patterns on the PET sheets. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. The drawings in the following description are only for some embodiments. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 The flowchart of the method for manufacturing the protective shell of an electronic device in the embodiment of the present application is shown. Figure 1 ; Figure 2 A schematic diagram of the process flow of a method for manufacturing a protective shell for an electronic device in an embodiment of the present application is shown; Figure 3 The flowchart of the method for manufacturing the protective shell of an electronic device in the embodiment of the present application is shown. Figure 2 ; Figure 4A schematic structural diagram of a protective shell for an electronic device in an embodiment of the present application is shown.

[0018] Description of the drawings: 1-PET sheet; 2-photosensitive adhesive; 3-PC sheet; 4-back panel; 5-electronic device protective shell; 51-frame; 52-charging port; 53-detachable button; 54-camera protection ring DETAILED DESCRIPTION

[0019] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0020] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0021] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0022] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0024] In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of the present invention.

[0025] In the following description, suffixes such as "module", "component", "assembly" or "unit" are used only to facilitate the description of the present invention and have no specific meanings. Therefore, they can be used in combination.

[0026] The present invention will be further described in detail below through specific implementation modes in conjunction with the accompanying drawings.

[0027] According to one embodiment of the present invention, Figure 1 and Figure 2 As shown, a method for manufacturing an electronic device protective case comprises: Step 1: Bonding the PET sheet 1 and the PC sheet 3 with a photosensitive adhesive 2 to form a back plate 4; Step 2: Put the back plate 4 into an injection mold for injection molding, so that the PC sheet 3 is welded with the injection molding material to form a frame 51 surrounding the back plate 4; Step 3: The injection mold is released to obtain an electronic device protective case 5.

[0028] In order to ensure the high permeability of the PET back plate 4 while taking into account the sealing of the electronic device protective shell 5, the inventor of the present application proposed a method for manufacturing an electronic device protective shell, as shown in the figure, comprising the following steps: First, the back plate 4 of the electronic device protective shell 5 is formed by bonding the PET sheet 1 and the PC sheet 3 with the photosensitive adhesive 2; after bonding with the photosensitive adhesive, the PET sheet 1 and the PC sheet 3 are irradiated with light to form a composite sheet, namely the back plate 4. Since the PET sheet 1 does not need to be heated in this step, the transparency of the PET sheet 1 can be ensured.

[0029] Then, a frame 51 of the electronic device protective shell 5 is formed, and the PET sheet 1 and the PC sheet 3 are formed into a composite sheet and put into an injection mold for injection molding, so that the PC sheet 3 is welded with the injection molding material. In this step, the PC sheet 3 can be fully welded with various resin materials such as PC, ABS, and TPU after plasticization, so that the sealing of the electronic device protective shell 5 is guaranteed, and the defect of reduced transparency caused by the PET sheet 1 requiring hot melt adhesive to be welded with various resin materials such as PC, ABS, and TPU is solved.

[0030] The manufacturing method of the electronic device protective shell 5 provided by the present invention is to perform injection molding by bonding the PET sheet 1 and the PC sheet 3. During the injection molding, the PC sheet 3 is welded to the injection molding material instead of directly causing a hot melt high-temperature reaction on the surface of the PET sheet 1. On the one hand, it avoids the welding defects that may be caused by hot melt adhesive welding, and on the other hand, it avoids the decrease in transparency of the PET sheet 1 due to injection molding. Compared with the prior art, it has outstanding substantial characteristics and significant progress.

[0031] In this embodiment, the PC sheet 3 is used as a welding material for performing the injection molding step and is welded with the injection molding material to isolate the PET sheet 1. This ingenious process provides a basis for the application of the PET sheet 1 in the field of protective shell manufacturing, especially for setting patterns on the PET sheet 1.

[0032] According to one embodiment of the present invention, Figure 3 As shown, a method for manufacturing an electronic device protective case comprises: Printing a pattern on the surface where the PET sheet 1 and the PC sheet 3 are bonded; The PET sheet 1 and the PC sheet 3 are bonded together using a photosensitive adhesive 2 to form a back plate 4; Put the back plate 4 into an injection mold for injection molding, so that the PC sheet 3 is welded with the injection molding material to form a frame 51 surrounding the back plate 4; The injection mold is released to obtain the electronic device protective shell 5.

[0033] In this embodiment, before the PET sheet 1 and the PC sheet 3 are bonded by the photosensitive adhesive 2, a pattern is printed on the surface where the PET sheet 1 and the PC sheet 3 are bonded. As described above, the present invention utilizes the high melting point and easy plasticization characteristics of the PC sheet 3 to block the printed pattern, thereby avoiding thermal deformation of the printed pattern or decomposition of the ink. Because the ink usually begins to decompose when the temperature reaches above 150°C, the PC sheet 3 is provided, and the PC sheet 3 also blocks the transfer of temperature while being welded with the injection molding material, thereby avoiding the decomposition of the ink.

[0034] In this embodiment, a pattern is printed on the surface where the PET sheet 1 and the PC sheet 3 are bonded by screen printing or printing. Because the PET sheet 1 has high permeability, no matter what printing method is used, as long as the surface where the pattern PET sheet 1 and the PC sheet 3 are bonded, it has a good display effect when viewed from the back, and because the printed pattern is equivalent to being protected behind the PET sheet 1, there is no need to worry about the printed pattern being damaged due to oxidation of the ink or scratches on the back plate 4 during use.

[0035] According to one embodiment of the present invention, the photosensitive adhesive 2 used is UV glue, which can be a colored glue, i.e., UV ink, or a colorless glue; the choice of glue can be determined according to the process of printing the pattern. If a silk screen printing process is used, UV ink can be directly used as the photosensitive adhesive 2 to complete the bonding of the PET sheet and the PC sheet while coloring the printed pattern; if a printing process is used, colorless UV glue can be used to form a protective layer on the surface of the pattern while bonding the PET sheet and the PC sheet to avoid oxidation of the printed pattern.

[0036] According to one embodiment of the present invention, the injection molding material is PC material or ABS material or TPU material. The aforementioned three injection molding materials are all commonly used materials for the current production of mobile phone cases, among which the injection molding temperature of PC material is 270℃-320℃, and the injection molding temperatures of the other two materials are also around 200℃; and the melting temperature of PET is usually between 250℃-270℃, so if the traditional process is used to directly coat the surface of the PET sheet 1 with hot melt adhesive and then perform injection molding, the surface of the PET sheet 1 will be atomized due to the high temperature, reducing its transparency. The present invention utilizes the characteristics of PC sheet 3 being resistant to high temperatures and being able to be fully welded with PC material, ABS material or TPU material after plasticization, and separates the PET sheet 1 with PC sheet 3, thereby avoiding atomization of the surface of the PET sheet 1.

[0037] Further, such as Figure 4 As shown, in this embodiment, the PET sheet 1 and the PC sheet 3 used to produce the electronic device protective shell 5 are both provided with camera holes. The back plate 4 is placed in an injection mold for injection molding, and a frame 51 surrounding the back plate 4 is formed, and a camera protection ring 54 is also formed. The camera protection ring 54 passes through the camera holes on the PET sheet 1 and the PC sheet 3. The camera protection ring 54 is formed by injection molding, which simplifies the process of forming the electronic device protective shell 5 and helps to improve the production efficiency of the product.

[0038] According to an embodiment of the present invention, in this embodiment, a charging hole 52 and at least one button hole are formed on the frame 51, and a detachable button 53 is arranged in the button hole. By providing the charging hole 52 and the button hole, the charging of the mobile phone and the operation of the side buttons are facilitated.

[0039] In the description of the specification, the description with reference to the terms "one embodiment", "some embodiments", "an embodiment", "some embodiments", "an example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A method for manufacturing an electronic device protective shell, characterized in that: include: The PET sheet and the PC sheet are bonded with a photosensitive adhesive to form a backplane; Put the back plate into an injection mold for injection molding, so that the PC sheet and the injection molding material are welded to form a frame surrounding the back plate; The injection mold is released to obtain a protective case for an electronic device.

2. The method for manufacturing an electronic device protective case according to claim 1, characterized in that: Before the PET sheet and the PC sheet are bonded by using a photosensitive adhesive, a pattern is printed on the surface where the PET sheet and the PC sheet are bonded.

3. The method for manufacturing an electronic device protective case according to claim 2, characterized in that: On the surface where the PET sheet and the PC sheet are bonded, a pattern is printed by screen printing or printing.

4. The method for manufacturing an electronic device protective case according to claim 2, characterized in that: The photosensitive adhesive is UV glue.

5. The method for manufacturing an electronic device protective case according to claim 1, characterized in that: The PET sheet and the PC sheet were bonded with a photosensitive adhesive using a laminated roller coater.

6. The method for manufacturing an electronic device protective case according to claim 1, characterized in that: The injection molding material is PC material, ABS material or TPU material.

7. The method for manufacturing an electronic device protective case according to claim 1, characterized in that: The PET sheet and the PC sheet are both provided with camera holes.

8. The method for manufacturing an electronic device protective case according to claim 7, characterized in that: The back plate is placed in an injection mold for injection molding to form a frame surrounding the back plate and a camera protection ring, and the camera protection ring passes through the camera holes on the PET sheet and the PC sheet.

9. The method for manufacturing an electronic device protective case according to claim 1, characterized in that: A charging hole and at least one button hole are formed on the frame.

10. A computer touch panel according to claim 9, characterized in that: A detachable button is arranged in the button hole.

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