Thermal management method and system

Abstract

The present application provides a thermal management method and system, which relate to the field of thermal management technology. The method is applied to a thermal management system including a thermal load device, a controller, and a control valve; the thermal load device includes multiple thermal load modules, each of which is connected to a control valve; the method includes: monitoring a first temperature difference and a second temperature difference of the thermal load device based on the controller; and adjusting the opening of the control valve based on the temperature of each thermal load module within a T time period; wherein the first temperature difference is the difference between the maximum temperature of the thermal load device as a whole within the T time period and the minimum temperature of the thermal load device as a whole within the T time period, and the second temperature difference is the maximum value of the difference between the maximum temperatures of each thermal load module. The thermal management method provided in the present application adjusts the temperature of the thermal load module by monitoring the thermal monitoring data of the thermal management system and adjusting the opening of the control valve to prevent overheating, protect the equipment from thermal damage, and extend the service life of the equipment.

Description

Technical Field

[0001] The present application relates to the field of thermal management technology, and in particular to a thermal management method and system. Background Art

[0002] As electronic equipment performance continues to improve, the amount of heat generated by heat-loading devices during operation is increasing, placing higher demands on thermal management systems. Existing thermal management systems primarily rely on temperature sensors to monitor device temperature and, based on these temperature readings, adjust the operating state of cooling devices, such as fan speed or coolant flow, to reduce heat generation in heat-loading devices. However, traditional thermal management systems struggle to adapt quickly to varying operating environments and heat load conditions, failing to adjust cooling strategies in a timely manner to maintain optimal device performance. Summary of the Invention

[0003] In view of this, the purpose of the embodiments of the present application is to provide a thermal management method to improve the problem in the prior art that the thermal management system cannot adjust the heat dissipation strategy in time to maintain good performance of the device.

[0004] The method is applied to a thermal management system including a heat load device, a controller, and a control valve; the heat load device includes a plurality of heat load modules, each of which is connected to the control valve; the method includes: monitoring the maximum temperature and minimum temperature of the entire heat load device within a time period T, and calculating a first temperature difference; wherein the first temperature difference is the difference between the maximum temperature and the minimum temperature of the entire heat load device within the time period T; determining whether the first temperature difference is greater than a first preset temperature value; if the first temperature difference is determined to be greater than the first preset temperature value, monitoring the maximum temperature of each heat load module and calculating a second temperature difference; wherein the second temperature difference is the maximum value of the difference between the maximum temperatures of each heat load module; determining whether the second temperature difference is greater than a second preset temperature value; if the second temperature difference is determined to be greater than the second preset temperature value, monitoring the temperature of each heat load module within the time period T, and adjusting the opening of the control valve based on the temperature of each heat load module within the time period T.

[0005] In the above implementation, the maximum and minimum temperatures of the entire heat load device within a set time period T are first monitored. Based on these maximum and minimum temperatures, a first temperature difference is calculated. This first temperature difference represents the temperature fluctuation range of the entire heat load device within time period T. This calculated first temperature difference is compared with a preset first temperature value. If the first temperature difference exceeds this value, it indicates significant temperature variations within the system. Heat load devices may exhibit varying temperature fluctuations under different environmental conditions; monitoring the first temperature difference helps the system adapt to environmental changes. If the first temperature difference exceeds this value, the maximum temperature of each heat load module is further monitored and a second temperature difference is calculated. This second temperature difference is the maximum of all the maximum temperature differences among the heat load modules and provides information on temperature variations between them. The system then compares this second temperature difference with a preset second temperature value. If this second temperature difference also exceeds this value, there may be a risk of local overheating in the system, requiring adjustment of the control valve to balance the temperature. Controlling the second temperature difference helps prevent local overheating and thus extend the life of the equipment. When the adjustment requirements are met (i.e., when both the first temperature difference and the second temperature difference exceed the preset values), the system will adjust the opening of the control valve connected to each heat load module based on the specific temperature of the module within the time period T. Specifically, the system will provide more cooling to the hotter areas and less cooling to the less hotter areas, thereby improving the overall thermal management efficiency of the system.

[0006] Optionally, adjusting the opening of the control valve based on the temperature of each of the heat load modules within the time period T includes: sorting the temperatures of each of the heat load modules and numbering them in sequence; and adjusting the control valve connected to the heat load module with the highest temperature to a first opening value.

[0007] In the above implementation process, the temperature data of all heat load modules within time period T is collected and sorted from high to low. After sorting, the system assigns a number to each heat load module. For the module with the highest temperature, the system adjusts the control valve connected to it to the first opening value. This first opening value is a pre-set value, which is intended to provide a better cooling effect for this heat load module than other heat load modules in the system, thereby quickly reducing its temperature. By prioritizing the modules with the highest temperatures, the system can quickly respond to possible overheating situations and reduce the risk of equipment performance degradation or damage due to local overheating.

[0008] In one embodiment of the present application, the module with the highest temperature is numbered 0, followed by number 1, and so on until all heat load modules are numbered. For the module with the highest temperature, numbered 0, the control valve connected to it is adjusted to the maximum opening value to achieve a better cooling effect.

[0009] Optionally, adjusting the opening of the control valve based on the temperature of each heat load module within the time period T further includes: calculating and adjusting the openings of the remaining control valves according to the following calculation rules:

[0010]

[0011] After the adjustment is completed, keep the first time and set the adjustment times plus 1.

[0012] In the above implementation process, using the formula

[0013]

[0014] Taking into account the first temperature difference (temperature fluctuation of the entire device) and the second temperature difference (maximum temperature difference between modules), the control valve opening is dynamically adjusted according to the number of adjustments (historical adjustments), so that the system can respond to temperature changes instead of relying solely on static preset values, which helps to reduce temperature non-uniformity inside the equipment and improve thermal management efficiency. The first time provides a time period for monitoring when the temperature of the heat load equipment tends to stabilize after adjustment. By setting the first time, frequent and potentially unnecessary adjustments are avoided, reducing wear on the control valve. After the first time ends, the system will increase the number of adjustments by 1, which helps to track the number of adjustment iterations and provide a reference for the next adjustment.

[0015] Optionally, the method further includes: if it is determined that the first temperature difference is not greater than the first temperature preset value, maintaining the second time and setting the number of adjustments to an initial value; continuing to monitor the maximum temperature and the minimum temperature of the entire heat load equipment within the T time period, and calculating the first temperature difference.

[0016] In the above implementation, if the first temperature difference is not greater than the first temperature preset value, the second time is maintained, and the system resets the number of adjustments to the initial value in preparation for subsequent adjustments. Simultaneously, the system's temperature status will continue to be monitored, and adjustments will only be made when necessary (when the first temperature difference is greater than the first temperature preset value and the second temperature difference is greater than the second temperature preset value). This system can save energy and improve efficiency by avoiding unnecessary control valve actuation.

[0017] Optionally, the method further includes: if the second temperature difference is not greater than the second temperature preset value, maintaining the second time and setting the number of adjustments to an initial value; continuing to monitor the maximum temperature and the minimum temperature of the heat load equipment as a whole within the T time period, and calculating the first temperature difference; and when the first temperature difference is greater than the first temperature preset value, calculating the second temperature difference.

[0018] In the above implementation, if the second temperature difference is not greater than the second temperature preset value, the second time is also maintained. During the second time, the system resets the number of adjustments to the initial value in preparation for subsequent adjustments. At the same time, the system temperature status continues to be monitored, and adjustments are only made when necessary (when the first temperature difference is greater than the first temperature preset value and the second temperature difference is greater than the second temperature preset value). This system can save energy and improve efficiency by avoiding unnecessary control valve operations.

[0019] Optionally, adjusting the opening of the control valve based on the temperature of each of the heat load modules within the time period T further includes: after the first time has passed, determining whether the opening of the control valve connected to the heat load module with the lowest temperature reaches a second opening value.

[0020] In the above implementation, after the first time period ends, the system evaluates the opening status of the control valve connected to the module with the lowest temperature. If the control valve opening has not reached the second opening value, the system may increase the opening to ensure sufficient coolant flow to the cooler module, reducing temperature rise caused by insufficient cooling. If the control valve opening has reached or fallen below the second opening value, the system may maintain the current opening or make minor adjustments as needed.

[0021] Optionally, adjusting the opening of the control valve based on the temperature of each of the heat load modules within the time period T further includes: if it is determined that the opening of the control valve has not reached the preset opening value, continuing to monitor the maximum temperature and the minimum temperature of the heat load device within the time period T to calculate a first temperature difference; determining whether the first temperature difference is greater than the first preset temperature value; if the first temperature difference is greater than the first preset temperature value, determining whether the second temperature difference is greater than the second preset temperature value; if the second temperature difference is greater than the second preset temperature value, adjusting the opening of the control valve again until the second opening value is reached.

[0022] In the above implementation process, after the first time, the system checks whether the opening of the control valve connected to each heat load module reaches the preset opening value. If the opening of the control valve does not reach the preset value, the system will continue to monitor the maximum and minimum temperatures of the heat load equipment within the T time period. After calculating the first temperature difference, it is determined whether the calculated first temperature difference is greater than the preset first temperature value. If the first temperature difference is greater than the preset value, the system will further calculate the second temperature difference and determine whether the calculated second temperature difference is greater than the preset second temperature value. If the second temperature difference is greater than the preset value, it indicates that there is a large temperature difference between the modules, and the system will adjust the opening of the control valve again to reduce the temperature difference and maintain the thermal stability of the heat load equipment. The system will continue to adjust the opening of the control valve until it reaches the second opening value, which is another preset opening value used to control the temperature while not overcooling and causing energy waste.

[0023] Optionally, adjusting the opening of the control valve based on the temperature of each of the heat load modules within the time period T further includes: if it is determined that the opening of the control valve reaches the second opening value, maintaining the second time, setting the adjustment times to an initial value, and connecting each of the heat load modules to the control valve to adjust them to the same opening.

[0024] In the above implementation, during the second time period, the system resets the number of adjustments to the initial value. This means the system will restart counting the number of adjustments in preparation for the next adjustment cycle. The system adjusts the control valve connected to each heat load module to the same opening, so that all modules receive the same cooling effect. After the second time period, the system recalculates the first and second temperature differences to assess whether further adjustment of the control valve opening is necessary. The system may repeat this process until the temperature distribution of the heat load equipment reaches a desired state, or until external conditions change, requiring a new adjustment strategy.

[0025] The present application also provides a thermal management system, comprising: a control valve, a heat load device, and a controller; the heat load device comprises a plurality of heat load modules, each of which is connected to the control valve; the controller is configured to: monitor the maximum temperature and minimum temperature of the entire heat load device within a time period T, and calculate a first temperature difference; wherein the first temperature difference is the difference between the maximum temperature and the minimum temperature of the entire heat load device within the time period T; determine whether the first temperature difference is greater than a first preset temperature value; if the first temperature difference is determined to be greater than the first preset temperature value, monitor the maximum temperature of each heat load module and calculate a second temperature difference; wherein the second temperature difference is the maximum value of the difference between the maximum temperatures of each heat load module; determine whether the second temperature difference is greater than a second preset temperature value; if the second temperature difference is determined to be greater than the second preset temperature value, monitor the temperature of each heat load module within the time period T, and adjust the opening of the control valve based on the temperature of each heat load module within the time period T.

[0026] In the above implementation process, the thermal management system includes: a control valve, a heat load device, and a controller. The controller first monitors the maximum temperature and the minimum temperature of the heat load device within a set time period T, and calculates the first temperature difference, that is, the difference between the maximum temperature and the minimum temperature of the heat load device as a whole within the time period T. It is judged whether the calculated first temperature difference is greater than the preset first temperature value. If the first temperature difference is greater than the preset value, the controller will further monitor the maximum temperature of each heat load module and calculate the second temperature difference, that is, the maximum value of the maximum temperature difference of each heat load module. It is judged whether the calculated second temperature difference is greater than the preset second temperature value. If the second temperature difference is greater than the preset value, the controller will adjust the opening of the control valve based on the temperature of each heat load module within the time period T to balance the temperature distribution. The controller continuously monitors the temperature of the heat load device and dynamically adjusts the opening of the control valve according to real-time data to respond to temperature changes.

[0027] Optionally, the thermal management system further includes: a heat exchange device; the heat exchange device has a first channel and a second channel built in; the first channel is connected to the first circuit, and the second channel is connected to the second circuit; the first circuit is composed of a fluid storage device, a fluid transport device, the control valve, the heat load device and the heat exchange device; the second circuit is composed of a compression device, a condensing device, a throttling device and the heat exchange device; the first circuit and the second circuit are connected in parallel, and heat exchange is performed based on the heat exchange device.

[0028] In the above implementation process, the system includes a heat exchange device, which has two built-in channels: a first channel and a second channel, which connect the first circuit and the second circuit respectively. The first circuit is composed of a fluid storage device, a fluid transport device, a control valve, a heat load device and a heat exchange device, and is responsible for taking heat away from the heat load device. The second circuit is composed of a compression device, a condensing device, a throttling device and a heat exchange device, and is responsible for the circulation and recompression of the cooling fluid. In the heat exchange device, the heat-carrying fluid in the first circuit exchanges heat with the cooling fluid in the second circuit, thereby realizing heat transfer and cooling. The controller monitors the temperature of the heat load device and adjusts the opening of the control valve as needed to control the speed and amount of the fluid flowing through the heat exchange device, thereby regulating the temperature of the heat load device. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0030] Figure 1A simple flow chart of the thermal management method provided in an embodiment of the present application;

[0031] Figure 2 Flowchart of adjusting the opening of a control valve using a thermal management method provided in an embodiment of the present application;

[0032] Figure 3 Flowchart of the thermal management method provided in the embodiment of the present application;

[0033] Figure 4 An overall flow chart of the thermal management method provided in the embodiment of the present application;

[0034] Figure 5 A simple schematic diagram of a thermal management system provided in an embodiment of the present application;

[0035] Figure 6 Schematic diagram of a thermal electronic device provided in an embodiment of the present application.

[0036] Icons: 100-control valve; 200-heat load device; 210-heat load module; 300-fluid storage device; 400-fluid transport device; 500-heat exchange device; 600-compression device; 700-throttling device; 800-condensing device; 900-electronic device; 910-memory; 920-storage controller; 930-processor; 940-peripheral interface; 950-input and output unit; 960-display unit. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the embodiments described are only part of the embodiments of the present application, not all of them. Based on the embodiments of the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the embodiments of the present application.

[0038] An embodiment of the present application provides a thermal management method, which is applied to a thermal management system including a thermal load device 200 , a controller, and a control valve 100 ; the thermal load device 200 includes a plurality of thermal load modules 210 , each of which is connected to the control valve 100 .

[0039] See also Figure 1 , Figure 1 A simple flow chart of the thermal management method provided in an embodiment of the present application.

[0040] First, the maximum and minimum temperatures of the heat load device 200 as a whole within a time period T are monitored to calculate a first temperature difference. A determination is then made as to whether the first temperature difference is greater than a first preset temperature value. If the determination is that the first temperature difference is greater than the first preset temperature value, the maximum temperature of each heat load module 210 is monitored to calculate a second temperature difference. At this point, a determination is made as to whether the second temperature difference is greater than a second preset temperature value. If the determination is that the second temperature difference is greater than the second preset temperature value, the temperature of each heat load module 210 within the time period T is monitored, and the opening of the control valve 100 is adjusted based on the temperature of each heat load module 210 within the time period T.

[0041] In the above implementation, the maximum and minimum temperatures of the entire heat load device 200 within a set time period T are first monitored. Based on the monitored maximum and minimum temperatures, a first temperature difference is calculated. The first temperature difference is the difference between the maximum temperature of the entire heat load device 200 within time period T and the minimum temperature of the entire heat load device 200 within time period T. The first temperature difference represents the temperature fluctuation range of the entire heat load device 200 within time period T. The calculated first temperature difference is compared with a preset first temperature value. If the first temperature difference exceeds the preset first temperature value, it indicates significant temperature variations within the system. Under different environmental conditions, the heat load device 200 may exhibit varying temperature fluctuations; monitoring the first temperature difference helps the system adapt to changes in the external environment. If the first temperature difference exceeds the preset value, the maximum temperature of each heat load module 210 is further monitored and a second temperature difference is calculated. The second temperature difference is the maximum value of the maximum temperature differences of each heat load module 210, providing information on the temperature differences between the heat load modules 210. The system then compares the second temperature difference with the preset second temperature value. If the second temperature difference also exceeds the second temperature preset value, the system may be at risk of local overheating, requiring adjustment of the control valve 100 to balance the temperature. Controlling the second temperature difference helps prevent local overheating, thereby extending the service life of the equipment. When the need for adjustment is met (i.e., when both the first and second temperature differences exceed the preset values), the system will adjust the opening of the control valve 100 connected to each heat load module 210 based on the specific temperature of each heat load module 210 during time period T. Specifically, it will provide more cooling to hotter areas and less cooling to cooler areas, thereby improving the overall thermal management efficiency of the system.

[0042] Optionally, see Figure 2 , Figure 2 The embodiment of the present application provides a flow chart of a thermal management method for adjusting the opening of the control valve 100.

[0043] Adjusting the opening of the control valve 100 based on the temperature of each heat load module 210 during the time period T includes: sorting the temperatures of each heat load module 210 and numbering them sequentially; adjusting the control valve 100 connected to the heat load module 210 with the highest temperature to a first opening value. The openings of the remaining control valves 100 are calculated and adjusted according to the following calculation rules:

[0044]

[0045] After the adjustment is completed, keep the first time and set the number of adjustments plus 1.

[0046] In the above implementation process, the temperature data of all heat load modules 210 in the time period T are collected and sorted in order from high to low. After sorting, the system assigns a number to each heat load module 210, and for the module with the highest temperature, the system adjusts the control valve 100 connected to it to the first opening value. This first opening value is a pre-set value, which is intended to provide the heat load module 210 with a better cooling effect than other heat load modules 210 in the system, so as to quickly reduce its temperature. By giving priority to the module with the highest temperature, the system can quickly respond to possible overheating situations and reduce the risk of equipment performance degradation or damage due to local overheating. Using the formula Taking into account the first temperature difference (temperature fluctuation of the entire device) and the second temperature difference (maximum temperature difference between modules), the opening of the control valve 100 is dynamically adjusted according to the number of adjustments (historical adjustments), so that the system can respond to temperature changes instead of relying solely on static preset values, which helps to reduce temperature non-uniformity inside the device and improve thermal management efficiency. The first time provides a time period for monitoring when the temperature of the heat load device 200 tends to stabilize after adjustment. By setting the first time, frequent and potentially unnecessary adjustments are avoided, reducing wear on the control valve 100. After the first time ends, the system adds 1 to the number of adjustments, which helps to track the number of iterations of the adjustment and provides a reference for the next adjustment.

[0047] In one embodiment of the present application, the module with the highest temperature is numbered 0, followed by number 1, and so on, until all heat load modules 210 are numbered. For the module with the highest temperature, number 0 is assigned, and the control valve 100 connected to it is adjusted to the maximum opening value. The remaining heat load modules 210 are numbered according to the formula

[0048]

[0049] Adjust the opening of the control valve 100 to the calculated value.

[0050] Optionally, see Figure 3 , Figure 3 Flowchart of the thermal management method provided in an embodiment of the present application.

[0051] Based on monitoring the maximum and minimum temperatures of the heat load device 200 as a whole within a time period T, if a first temperature difference is calculated, and if it is determined that the first temperature difference is not greater than the first temperature preset value, the second time is maintained and the number of adjustments is set to the initial value; the maximum and minimum temperatures of the heat load device 200 as a whole within the time period T are continuously monitored to calculate the first temperature difference. Based on monitoring the maximum temperature of each heat load module 210, if a second temperature difference is calculated, and if the second temperature difference is not greater than the second temperature preset value, the second time is maintained and the number of adjustments is set to the initial value; the maximum and minimum temperatures of the heat load device 200 as a whole within the time period T are continuously monitored to calculate the first temperature difference; and if the first temperature difference is greater than the first temperature preset value, the second temperature difference is calculated.

[0052] In the above implementation process, when the first temperature difference is not greater than the first temperature preset value, the second time is maintained, and the system resets the number of adjustments to the initial value in preparation for subsequent adjustments. When the second temperature difference is not greater than the second temperature preset value, the second time is also maintained, and the system resets the number of adjustments to the initial value in preparation for subsequent adjustments. At the same time, the system will continue to monitor the temperature status of the system, and adjustments will only be made when necessary (when the first temperature difference is greater than the first temperature preset value and the second temperature difference is greater than the second temperature preset value). This system can save energy and improve efficiency, avoiding unnecessary operation of the control valve 100.

[0053] See also Figure 4 , Figure 4 This is an overall flow chart of the thermal management method provided in an embodiment of the present application.

[0054] In one embodiment of the present application, the system starts from an initial state, in which the adjustment times are set to an initial value, and the opening degrees of the control valves 100 of all the heat load modules 210 are the same.

[0055] At the first process node, the system monitors the maximum and minimum temperatures of heat load device 200 during time period T, calculates a first temperature difference, and compares it with the first temperature preset value. If the first temperature difference exceeds the preset value, the system proceeds to the next step and calculates a second temperature difference. If the first temperature difference is not greater than the preset value, the system maintains the second time and returns to the first process node, continuing to monitor and calculate the first temperature difference until the first temperature difference exceeds the preset value.

[0056] At the second process node, after calculating the second temperature difference, the system determines whether the second temperature difference is greater than the second temperature preset value. If the second temperature difference is not greater than the preset value, the system maintains the second time, returns to the initial state, resets the adjustment times to the initial value, and then restarts monitoring and calculating the first temperature difference.

[0057] If the second temperature difference is greater than the preset value, the system continues to monitor the temperature and adjust the control valve 100 .

[0058] If the second temperature difference is determined to be greater than the second preset temperature value, the temperature of each heat load module 210 is monitored within the time period T, and the temperatures of each heat load module 210 are sorted and numbered sequentially. The control valve 100 connected to the heat load module 210 with the highest temperature is adjusted to a first opening value. Preferably, the first opening value is the maximum opening value of the control valve 100.

[0059] Calculate and adjust the remaining control valve openings according to the following calculation rules:

[0060]

[0061] After the adjustment is completed, the first time is maintained, and the number of adjustments is set to be increased by 1 to prepare for the next adjustment. After the first time has passed, it is determined whether the opening of the control valve 100 connected to the heat load module 210 with the lowest temperature reaches the second opening value.

[0062] If not, the system returns to the first process node and continues to monitor and calculate the temperature difference.

[0063] If it is reached, the system maintains the second time and returns to the initial state, resets the adjustment times to the initial value, and adjusts all the control valves 100 to the same opening.

[0064] In the above implementation, the system continuously adjusts the opening of the control valve 100 in a cyclical manner to respond to temperature changes in the heat load device 200, ensuring that the temperature remains within the optimal range. This system dynamically responds to temperature changes, continuously monitoring and adjusting the temperature of the heat load device 200. Based on conditional judgment and cyclic adjustment, the thermal management system can adapt to varying operating conditions and environmental changes, optimize energy consumption, and improve system stability and safety. Optionally, the system can record all relevant temperature data and the control valve 100 adjustment history to provide a basis for subsequent analysis and optimization.

[0065] See also Figure 5 , Figure 5 A simple schematic diagram of the thermal management system provided in an embodiment of the present application.

[0066] The thermal management system includes a control valve 100, a heat load device 200, a controller, and a heat exchange device 500. The heat load device 200 includes multiple heat load modules 210, each connected to the control valve 100. The heat exchange device 500 has a first channel and a second channel. The first channel is connected to the first circuit, and the second channel is connected to the second circuit. The first circuit consists of a fluid storage device 300, a fluid transport device 400, the control valve 100, the heat load device 200, and the heat exchange device 500. The second circuit consists of a compression device 600, a condensing device 800, a throttling device 700, and the heat exchange device 500. The first and second circuits are connected in parallel and exchange heat based on the heat exchange device 500. The fluid storage device 300 stores the heat exchange medium used for thermal management, providing sufficient heat exchange medium for the heat exchange process. The fluid transport device 400 is responsible for transporting coolant from the storage device to the heat load device 200 and the heat exchange device 500, allowing the coolant to circulate within the system.

[0067] In one embodiment of the present application, in the second loop, a compression device 600 is used to compress the heat exchange medium, increasing its temperature and pressure, and providing power for its circulation. A condensing device 800 is used to cool the compressed heat exchange medium, causing it to condense and release heat to the environment, preparing for its recirculation. A throttling device 700 controls the flow of the heat exchange medium into the evaporator, reducing its temperature through the throttling effect to prepare for heat exchange.

[0068] In one embodiment of the present application, the controller is configured to: monitor the maximum temperature and the minimum temperature of the heat load device 200 as a whole within a time period T, and calculate a first temperature difference; wherein the first temperature difference is the difference between the maximum temperature of the heat load device 200 as a whole within the time period T and the minimum temperature of the heat load device 200 as a whole within the time period T; determine whether the first temperature difference is greater than a first temperature preset value; if the first temperature difference is determined to be greater than the first temperature preset value, monitor the maximum temperature of each heat load module 210 and calculate a second temperature difference; wherein the second temperature difference is the maximum value of the difference between the maximum temperatures of each heat load module 210; determine whether the second temperature difference is greater than a second temperature preset value; if the second temperature difference is determined to be greater than the second temperature preset value, monitor the temperature of each heat load module 210 within the time period T, and adjust the opening of the control valve 100 based on the temperature of each heat load module 210 within the time period T.

[0069] In one embodiment of the present application, the fluid storage device 300, the fluid transport device 400, the control valve 100, the heat load device 200, and the heat exchange device 500 are responsible for heat transfer from the heat load device 200; the compression device 600, the condensing device 800, the throttling device 700, and the heat exchange device 500 are responsible for the circulation and recompression of the coolant; the first circuit and the second circuit are connected in parallel, and heat exchange is performed through the heat exchange device 500. The parallel connection allows the two circuits to operate independently, and the working state of each circuit can be adjusted as needed.

[0070] Optionally, in heat exchange apparatus 500, a counterflow configuration can provide the greatest temperature difference across the heat exchanger, while a co-flow configuration provides a lower temperature difference throughout the heat exchange process. While a counterflow configuration may be chosen for applications requiring large amounts of heat to be processed or for heat exchange within a compact space, a co-flow configuration may also be chosen based on different thermal management strategies.

[0071] In the above implementation, the system is able to control and manage the heat generated by the heat load device 200, keeping the device operating at an appropriate temperature and improving the overall performance and reliability of the system. Furthermore, through thermal management, the system can ensure that the heat load device 200 operates at an optimal operating temperature, extending the device's service life and improving overall efficiency.

[0072] Optionally, see Figure 6 , Figure 6 Schematic diagram of an electronic device provided in an embodiment of the present application. The electronic device 900 may include a memory 910, a storage controller 920, a processor 930, a peripheral interface 940, an input and output unit 950, and a display unit 960. A person skilled in the art will understand that Figure 6 The structure shown is only for illustration and does not limit the structure of the electronic device 900. For example, the electronic device 900 may further include Figure 6 More or fewer components than shown, or with Figure 6 Different configurations shown.

[0073] The aforementioned memory 910, storage controller 920, processor 930, peripheral interface 940, input / output unit 950, and display unit 960 are electrically connected to each other, directly or indirectly, to enable data transmission or interaction. For example, these components may be electrically connected to each other via one or more communication buses or signal lines. The aforementioned processor 930 is used to execute the executable modules stored in the memory.

[0074] The memory 910 may be, but is not limited to, a random access memory (RAM), a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM), etc. The memory 910 is used to store programs, and the processor 930 executes the programs after receiving an execution instruction. The method executed by the electronic device 900 defined by the process disclosed in any embodiment of the present application may be applied to the processor 930 or implemented by the processor 930.

[0075] The processor 930 may be an integrated circuit chip with signal processing capabilities. The processor 930 may be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The various methods, steps, and logic block diagrams disclosed in the embodiments of the present application may be implemented or executed. The general-purpose processor may be a microprocessor or any conventional processor.

[0076] The peripheral interface 940 couples various input / output devices to the processor 930 and the memory 910. In some embodiments, the peripheral interface 940, the processor 930, and the memory controller 920 can be implemented in a single chip. In other embodiments, they can be implemented in separate chips.

[0077] The input / output unit 950 is used to provide input data to the user and can be, but not limited to, a mouse and a keyboard.

[0078] The display unit 960 provides an interactive interface (e.g., a user operation interface) between the electronic device 900 and the user or is used to display image data for the user's reference. In this embodiment, the display unit 960 can be a liquid crystal display or a touch display. If it is a touch display, it can be a capacitive touch screen or a resistive touch screen that supports single-point and multi-touch operations. Supporting single-point and multi-touch operations means that the touch display can sense touch operations generated simultaneously from one or more positions on the touch display, and the sensed touch operations are handed over to the processor 930 for calculation and processing.

[0079] The electronic device 900 in this embodiment can be used to perform each step of the thermal management method provided in the embodiment of the present application. Since the principle of solving the problem of the device in the embodiment of the present application is similar to that of the embodiment of the thermal management method, the implementation of the device in this embodiment can refer to the description of the embodiment of the above method, and the repeated parts will not be repeated.

[0080] In the several embodiments provided in this application, it should be understood that the disclosed devices can also be implemented in other ways. The device embodiments described above are merely schematic. For example, the block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices according to the multiple embodiments of the present application. In this regard, each box in the block diagram can represent a module, a program segment or a part of a code, and the module, program segment or a part of the code contains one or more executable instructions for implementing the specified logical functions. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in an order different from that marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram, and the combination of the block diagrams, can be implemented with a dedicated hardware-based system that performs the specified function or action, or can be implemented with a combination of dedicated hardware and computer instructions.

[0081] The above is only a specific implementation method of the present application, but the scope of protection of the present application is not limited thereto. Any technician familiar with this technical field can easily think of changes or replacements within the technical scope disclosed in this application, which should be covered by the scope of protection of the present application.

[0082] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, the elements defined by the phrase "comprising..." do not exclude the presence of other identical elements in the process, method, article, or device comprising the elements.

Claims

1. A thermal management method, characterized in that: The method is applied to a thermal management system including a heat load device, a controller, and a control valve; the heat load device includes a plurality of heat load modules, each of which is connected to the control valve; the method includes: Monitor the maximum temperature and the minimum temperature of the entire heat load device within a time period T, and calculate a first temperature difference; wherein the first temperature difference is the difference between the maximum temperature of the entire heat load device within the time period T and the minimum temperature of the entire heat load device within the time period T; Determine whether the first temperature difference is greater than a first temperature preset value; if it is determined that the first temperature difference is greater than the first temperature preset value, monitor the maximum temperature of each of the heat load modules and calculate a second temperature difference; wherein the second temperature difference is the maximum value of the difference between the maximum temperatures of each of the heat load modules; determining whether the second temperature difference is greater than a second preset temperature value; if it is determined that the second temperature difference is greater than the second preset temperature value, monitoring the temperature of each of the heat load modules within a time period T, and adjusting the opening of the control valve based on the temperature of each of the heat load modules within the time period T; The step of adjusting the opening of the control valve based on the temperature of each heat load module within a time period T includes: Sort the temperatures of each of the heat load modules and number them in sequence; adjusting the control valve connected to the heat load module with the highest temperature to a first opening value; Wherein, adjusting the opening of the control valve based on the temperature of each of the heat load modules within the time period T further includes: The remaining control valve openings are calculated and adjusted according to the following calculation rules: ； After the adjustment is completed, keep the first time and set the adjustment times plus 1.

2. The method according to claim 1, characterized in that The method further comprises: If it is determined that the first temperature difference is not greater than the first temperature preset value, maintaining the second time and setting the number of adjustments to an initial value; Continue to monitor the maximum temperature and the minimum temperature of the entire heat load device within the time period T, and calculate the first temperature difference.

3. The method according to claim 1, characterized in that The method further comprises: If the second temperature difference is not greater than the second temperature preset value, maintaining the second time and setting the number of adjustments to an initial value; Continue to monitor the maximum temperature and the minimum temperature of the entire heat load device within the T time period, and calculate the first temperature difference; when the first temperature difference is greater than the first temperature preset value, calculate the second temperature difference.

4. The method according to claim 3, characterized in that The adjusting the opening of the control valve based on the temperature of each of the heat load modules within the time period T further includes: After the first time has passed, it is determined whether the opening of the control valve connected to the heat load module with the lowest temperature reaches a second opening value.

5. The method according to claim 4, characterized in that The adjusting the opening of the control valve based on the temperature of each of the heat load modules within the time period T further includes: If it is determined that the opening of the control valve has not reached the second opening value, continue to monitor the maximum temperature and the minimum temperature of the heat load device within the time period T, and calculate the first temperature difference; determining whether the first temperature difference is greater than the first temperature preset value; In the case where the first temperature difference is greater than the first preset temperature value, determining whether the second temperature difference is greater than the second preset temperature value; When the second temperature difference is greater than the second temperature preset value, the opening of the control valve is adjusted again until the second opening value is reached.

6. The method according to claim 5, characterized in that The adjusting the opening of the control valve based on the temperature of each of the heat load modules within the time period T further includes: If it is determined that the opening of the control valve reaches the second opening value, the second time is maintained, the adjustment times are set to an initial value, and each of the heat load modules connected to the control valve is adjusted to the same opening.

7. A thermal management system, applied to an energy storage device, characterized in that: The thermal management system includes: a control valve, a heat load device and a controller; the heat load device includes a plurality of heat load modules, each of which is connected to the control valve; The controller is configured as follows: Monitor the maximum temperature and the minimum temperature of the entire heat load device within a time period T, and calculate a first temperature difference; wherein the first temperature difference is the difference between the maximum temperature of the entire heat load device within the time period T and the minimum temperature of the entire heat load device within the time period T; Determining whether the first temperature difference is greater than a first temperature preset value; If it is determined that the first temperature difference is greater than the first temperature preset value, the maximum temperature of each of the heat load modules is monitored and a second temperature difference is calculated; wherein the second temperature difference is the maximum value of the difference between the maximum temperatures of each of the heat load modules; Determining whether the second temperature difference is greater than a second temperature preset value; If it is determined that the second temperature difference is greater than the second temperature preset value, monitoring the temperature of each of the heat load modules within the time period T, and adjusting the opening of the control valve based on the temperature of each of the heat load modules within the time period T; The step of adjusting the opening of the control valve based on the temperature of each heat load module within a time period T includes: Sort the temperatures of each of the heat load modules and number them in sequence; adjusting the control valve connected to the heat load module with the highest temperature to a first opening value; Wherein, adjusting the opening of the control valve based on the temperature of each of the heat load modules within the time period T further includes: The remaining control valve openings are calculated and adjusted according to the following calculation rules: ； After the adjustment is completed, keep the first time and set the adjustment times plus 1.

8. The system according to claim 7, characterized in that The thermal management system further comprises: a heat exchange device; The heat exchange device has a first channel and a second channel built therein; the first channel is connected to the first circuit, and the second channel is connected to the second circuit; The first circuit is composed of a fluid storage device, a fluid transport device, the control valve, the heat load device and the heat exchange device; The second circuit is composed of a compression device, a condensing device, a throttling device and the heat exchange device; The first circuit and the second circuit are connected in parallel and perform heat exchange based on the heat exchange device.

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