Sapphire crystal bar polishing quality evaluation method based on image processing
Through the image processing method, the sapphire crystal rod data before and after polishing is compared, the problem of the inability to comprehensively analyze the polishing quality in the prior art is solved, and a more accurate and reasonable polishing quality evaluation is achieved.
Patent Information
- Application Number
- CN202510088198.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2025-03-04
AI Technical Summary
In the prior art, in the evaluation of sapphire crystal rod polishing quality, it is impossible to comprehensively analyze the flatness of the polishing surface and the impact of the polishing process on internal defects, resulting in low rationality and accuracy of the analysis.
Using an image processing-based method, the polishing surface quality and defect analysis results were obtained by comparing the outer surface and internal defect data of the sapphire crystal rod before and after polishing, and a comprehensive evaluation was conducted based on the polishing time data.
It improves the rationality and accuracy of polishing quality analysis, can more comprehensively evaluate the polishing quality of polishing equipment, and quantify the polishing difficulty according to the defects of the polishing surface.
Smart Images

Figure CN119559162A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of image processing, and more specifically, is a method for evaluating the polishing quality of a sapphire crystal rod based on image processing. Background Art
[0002] Polishing of sapphire crystal rod is a delicate and technically demanding process. Its purpose is to obtain sapphire crystal wafers with smooth and highly flat surfaces to meet the needs of various application fields. The operation of the polishing equipment can effectively polish the sapphire crystal rod to meet the requirements of subsequent application fields. After polishing by the polishing equipment, the polishing quality of the sapphire crystal rod needs to be quantitatively evaluated. At this time, a sapphire crystal rod polishing quality evaluation method is needed; In the prior art, in the process of evaluating the polishing quality of sapphire crystal rods, most of the methods usually only analyze the smoothness of the polishing, but ignore the analysis of the impact of the polishing process on the internal defects of the sapphire crystal rods. It is impossible to comprehensively analyze the polishing quality by comprehensively considering the flatness of the polished surface and the damage changes caused by polishing, resulting in low rationality and accuracy of the polishing quality analysis. Most of the prior art has the above problems. In view of this, the present application designs a sapphire crystal rod polishing quality evaluation method based on image processing. Summary of the invention
[0003] In order to address the deficiencies in the prior art mentioned in the background technology, the present application proposes a sapphire crystal rod polishing quality assessment method based on image processing. The present application proposes a comparative analysis based on the outer surface image data of the sapphire crystal rod before and after polishing, and then a comparative analysis based on the internal defect data of the sapphire crystal rod before and after polishing, to obtain the polishing surface quality analysis results and the polishing process defect analysis results obtained by analysis, and at the same time obtain the polishing time data to evaluate the polishing quality of the polishing equipment. The present application comprehensively analyzes the polishing quality based on the flatness of the polishing surface and the damage changes caused by polishing, thereby improving the rationality and accuracy of the polishing quality analysis. At the same time, in the process of polishing quality assessment, the present application quantitatively assesses the polishing difficulty based on the aggregation degree and height of defects on the polishing surface, and then performs polishing quality analysis, thereby further improving the rationality and accuracy of the polishing quality analysis.
[0004] To achieve the above objectives, the present application provides the following technical solutions: In the first aspect, the present application provides a sapphire crystal rod polishing quality assessment method based on image processing, which includes the following specific steps: Step 1, obtaining outer surface image data of the sapphire crystal rod before and after polishing, obtaining internal defect data of the sapphire crystal rod before and after polishing, and obtaining polishing time data of the polishing equipment; Step 2: Perform comparative analysis based on the outer surface image data of the sapphire crystal rod before and after polishing to obtain a polishing surface quality analysis result; Step 3: Comparative analysis is performed based on the internal defect data of the sapphire crystal rod before and after polishing to obtain the defect analysis results of the polishing process; Step 4: Obtain the polishing surface quality analysis results and polishing process defect analysis results obtained by analysis, and at the same time obtain polishing time data to evaluate the polishing quality of the polishing equipment.
[0005] As a preferred technical solution of the sapphire crystal rod polishing quality assessment method based on image processing, the specific content of the data obtained in step 1 is: Step 11, before polishing, the outer surface image data of the unpolished sapphire crystal rod is obtained by the optical profile imaging component, and the position and size data of the internal defects of the sapphire crystal rod are obtained by the defect detection component. After the data is obtained, the sapphire crystal rod is fixed on the polishing equipment for polishing; Step 12: After polishing is completed, the outer surface image data of the polished sapphire crystal rod is obtained again through the optical profile imaging component, and the position and size data of the internal defects of the polished sapphire crystal rod are obtained at the same time, so as to provide comparative analysis of the data; Step 13: Obtain polishing time data of the polishing equipment, and store the obtained data in a corresponding storage component.
[0006] As a preferred technical solution of the sapphire crystal rod polishing quality assessment method based on image processing, the comparative analysis based on the outer surface image data of the sapphire crystal rod before and after polishing in S2 includes the following specific steps: Step 21, obtaining the outer surface image data of the sapphire crystal rod before polishing, and performing surface polishing difficulty analysis based on the surface flatness of the outer surface image data of the sapphire crystal rod before polishing, wherein the surface polishing difficulty calculation formula is: , where N is the number of detection points on the outer surface image of the polished sapphire crystal rod, cm is the average distance between points that are not on the same plane as the polishing plane of the sapphire crystal rod, c is the polishing thickness of the crystal rod, and xi is the height data of the i-th detection point of the crystal rod. is the height of the polishing plane of the sapphire crystal rod; Step 22: Obtain outer surface image data of the sapphire crystal rod before polishing and outer surface image data of the sapphire crystal rod after polishing, and perform polishing surface change analysis based on the outer surface image data of the sapphire crystal rod before polishing and outer surface image data of the sapphire crystal rod after polishing to obtain a polishing surface change analysis value, wherein the calculation formula of the polishing surface change analysis value is: , where vi is the height data of the i-th point on the polishing plane after polishing, is the average height information of the polishing surface after polishing; Step 23: Perform polishing surface quality analysis based on the surface polishing difficulty and polishing surface variation analysis results, wherein the polishing surface quality calculation formula is: .
[0007] As a preferred technical solution of the sapphire crystal rod polishing quality assessment method based on image processing, the comparative analysis based on the internal defect data of the sapphire crystal rod before and after polishing includes the following specific steps: Step 31, obtaining the internal defect data of the sapphire crystal rod before and after polishing, importing the internal defect data of the sapphire crystal rod before and after polishing into the defect abnormal value calculation formula to calculate the defect abnormal value of the sapphire crystal rod before and after polishing, wherein the defect abnormal value calculation formula is: , where Vj is the volume of the jth defect, Vs is the volume of the crystal rod before polishing, and N is the number of defects; Step 32, obtain the defect abnormality value of the sapphire crystal rod before and after polishing, and substitute it into the calculation formula of the defect analysis value of the polishing process to calculate the defect analysis value of the polishing process, wherein the calculation formula of the defect analysis value of the polishing process is: , where Psh is the defect anomaly value of the sapphire crystal rod after polishing, and Psq is the defect anomaly value of the sapphire crystal rod before polishing.
[0008] As a preferred technical solution of the sapphire crystal rod polishing quality assessment method based on image processing, the step 4 includes the following specific contents: Step 41, obtaining the polishing surface quality, polishing process defect analysis value and polishing time data of the polishing process calculated, and substituting the obtained data into the polishing quality assessment value calculation formula to calculate the polishing quality assessment value, wherein the polishing quality assessment value calculation formula is: , where a is the surface mass ratio and T is the polishing time; Step 42, obtain the calculated polishing quality assessment value and compare it with the set polishing quality assessment threshold. If the polishing quality assessment value is greater than or equal to the set polishing quality assessment threshold, it means that the polishing quality of the polishing equipment can meet the requirements. If the polishing quality assessment value is less than the set polishing quality assessment threshold, it means that the polishing quality of the polishing equipment cannot meet the polishing requirements and the polishing equipment needs to be maintained.
[0009] In a second aspect, the present application provides a sapphire crystal rod polishing quality assessment system based on image processing, which is implemented based on the above-mentioned sapphire crystal rod polishing quality assessment method based on image processing, and specifically includes a data acquisition module, a polishing surface quality analysis module, a polishing process defect analysis module, a polishing quality assessment module and a control component; wherein the data acquisition module is used to acquire the outer surface image data of the sapphire crystal rod before and after polishing, and acquire the internal defect data of the sapphire crystal rod before and after polishing, and acquire the polishing time data of the polishing equipment; the polishing surface quality analysis module is used to perform comparative analysis based on the outer surface image data of the sapphire crystal rod before and after polishing to obtain the polishing surface quality analysis result; the polishing process defect analysis module is used to perform comparative analysis based on the internal defect data of the sapphire crystal rod before and after polishing to obtain the polishing process defect analysis result; the polishing quality assessment module acquires the polishing surface quality analysis result and the polishing process defect analysis result obtained by analysis, and acquires the polishing time data to evaluate the polishing quality of the polishing equipment, and the control component controls the operation of the data acquisition module, the polishing surface quality analysis module, the polishing process defect analysis module and the polishing quality assessment module.
[0010] In a third aspect, the present application provides an electronic device, comprising: a processor and a memory, wherein the memory stores a computer program that can be called by the processor; The processor executes the above-mentioned sapphire crystal rod polishing quality assessment method based on image processing by calling the computer program stored in the memory.
[0011] In a fourth aspect, the present application provides a computer-readable storage medium storing instructions, which, when executed on a computer, enable the computer to execute the sapphire crystal rod polishing quality assessment method based on image processing as described above.
[0012] Compared with the prior art, the beneficial effects of the present application are as follows: the present application performs comparative analysis based on the external surface image data of the sapphire crystal rod before and after polishing, and then performs comparative analysis based on the internal defect data of the sapphire crystal rod before and after polishing, obtains the polishing surface quality analysis results and the polishing process defect analysis results obtained by analysis, and simultaneously obtains the polishing time data to evaluate the polishing quality of the polishing equipment. The present application comprehensively analyzes the polishing quality based on the flatness of the polishing surface and the damage changes caused by polishing, thereby improving the rationality and accuracy of the polishing quality analysis; At the same time, in the process of polishing quality assessment, the present application quantitatively assesses the polishing difficulty based on the degree and height of defects on the polishing surface, and then performs polishing quality analysis, which further improves the rationality and accuracy of the polishing quality analysis. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings; Figure 1 This is a schematic diagram of the overall process of the sapphire crystal rod polishing quality assessment method based on image processing in this application; Figure 2 This is a flow chart of step 2 of the sapphire crystal rod polishing quality assessment method based on image processing in this application; Figure 3 This is a schematic diagram of the framework of the sapphire crystal rod polishing quality assessment system based on image processing in this application; Figure 4 This is a schematic diagram of the framework of the electronic device of this application. DETAILED DESCRIPTION
[0014] In order to better understand the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are only descriptions of exemplary embodiments of the present application and do not limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.
[0015] In the accompanying drawings, the size, dimensions and shape of the elements have been slightly adjusted for ease of explanation. The accompanying drawings are only examples and are not strictly drawn to scale. As used herein, the terms "substantially", "approximately" and similar terms are used as terms to indicate approximation, not as terms to indicate degree, and are intended to illustrate the inherent deviations in measured or calculated values that will be recognized by those of ordinary skill in the art. In addition, in the present application, the order in which the steps are processed does not necessarily represent the order in which these processes occur in actual operation, unless otherwise clearly defined or deduced from the context. It should also be understood that expressions such as "including", "including", "having", "including" and / or "including" are open rather than closed expressions in this specification, which indicate the presence of the stated features, elements and / or components, but do not exclude the presence of one or more other features, elements, components and / or combinations thereof. In addition, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire list of features, rather than just modifying the individual elements in the list. In addition, when describing the embodiments of the present application, "may" is used to represent "one or more embodiments of the present application". Furthermore, the term "exemplary" is intended to refer to an example or illustration. Unless otherwise specified, all words used herein (including engineering terms and scientific and technological terms) have the same meaning as those commonly understood by those of ordinary skill in the art to which this application belongs. It should also be understood that, unless otherwise clearly stated in this application, words defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an idealized or overly formal sense.
[0016] Example 1 In order to solve the technical problems raised in the background technology, the present application provides a preferred embodiment: Figure 1-Figure 2 As shown, the sapphire crystal rod polishing quality assessment method based on image processing includes the following specific steps: Step 1, obtaining outer surface image data of the sapphire crystal rod before and after polishing, obtaining internal defect data of the sapphire crystal rod before and after polishing, and obtaining polishing time data of the polishing equipment; In this embodiment, the specific content of obtaining data in step 1 is: Step 11, before polishing, the outer surface image data of the unpolished sapphire crystal rod is obtained by the optical profile imaging component, and the position and size data of the internal defects of the sapphire crystal rod are obtained by the defect detection component. After the data is obtained, the sapphire crystal rod is fixed on the polishing equipment for polishing; It should be specifically explained here that obtaining the outer surface image data of the unpolished sapphire crystal rod and the location and size data of the internal defects usually requires the use of professional imaging and detection equipment, such as preparing optical profile imaging components and defect detection components. These devices include optical microscopes, interferometers, scanning electron microscopes (SEMs), X-ray diffraction equipment, etc. Using optical profile imaging components, such as optical microscopes or interferometers, place the sapphire crystal rod on the sample stage of the imaging equipment, adjust the optical system to ensure that the image is clear, adjust the light source and magnification to obtain the best image resolution, capture the outer surface image of the sapphire crystal rod, and record it. It may be necessary to obtain multiple images from different angles and magnifications to fully understand the outer surface characteristics of the crystal rod; Using defect detection components, such as X-ray diffraction equipment or scanning electron microscope (SEM), place the sapphire crystal rod on the sample stage of the detection equipment, and adjust the detection parameters, such as X-ray intensity, SEM acceleration voltage, and detector sensitivity, to suit the characteristics of the sapphire crystal rod and the required detection depth. Scan the ingot to detect the location and size of internal defects, which may involve rotating and tilting the ingot to observe the defects from different angles; record images and data of defects, including the type (such as cracks, inclusions, pores, etc.), location, size and distribution of defects; organize all image data and measurement results into a report, including the outer surface profile of the ingot and detailed information on internal defects; Step 12: After polishing is completed, the outer surface image data of the polished sapphire crystal rod is obtained again through the optical profile imaging component, and the position and size data of the internal defects of the polished sapphire crystal rod are obtained at the same time, so as to provide comparative analysis of the data; Step 13, obtaining polishing time data of the polishing equipment, and storing the obtained data in a corresponding storage component. The storage process here can have multiple storage modes to choose from, and can be classified and stored according to the acquisition time, or according to the type of the acquired data; Step 2: Perform comparative analysis based on the outer surface image data of the sapphire crystal rod before and after polishing to obtain a polishing surface quality analysis result; In this embodiment, the comparative analysis based on the outer surface image data of the sapphire crystal rod before and after polishing in S2 includes the following specific steps: Step 21, obtaining the outer surface image data of the sapphire crystal rod before polishing, and performing surface polishing difficulty analysis based on the surface flatness of the outer surface image data of the sapphire crystal rod before polishing, wherein the surface polishing difficulty calculation formula is: , where N is the number of detection points on the outer surface image of the polished sapphire crystal rod, cm is the average distance between points that are not on the same plane as the polishing plane of the sapphire crystal rod, c is the polishing thickness of the crystal rod, and xi is the height data of the i-th detection point of the crystal rod. is the height of the polishing plane of the sapphire crystal rod. In this formula, the polishing difficulty is quantitatively evaluated by the concentration and height of the protrusions or depressions on the polishing surface; Step 22: Obtain outer surface image data of the sapphire crystal rod before polishing and outer surface image data of the sapphire crystal rod after polishing, and perform polishing surface change analysis based on the outer surface image data of the sapphire crystal rod before polishing and outer surface image data of the sapphire crystal rod after polishing to obtain a polishing surface change analysis value, wherein the calculation formula of the polishing surface change analysis value is: , where vi is the height data of the i-th point on the polishing plane after polishing, is the average height information of the polishing surface after polishing; Step 23: Perform polishing surface quality analysis based on the surface polishing difficulty and polishing surface variation analysis results, wherein the polishing surface quality calculation formula is: , thus comprehensively analyzing the polishing quality based on the polishing surface changes and polishing difficulty after polishing; Step 3: Comparative analysis is performed based on the internal defect data of the sapphire crystal rod before and after polishing to obtain the defect analysis results of the polishing process; In this embodiment, the comparative analysis based on the internal defect data of the sapphire crystal rod before and after polishing includes the following specific steps: Step 31, obtaining the internal defect data of the sapphire crystal rod before and after polishing, importing the internal defect data of the sapphire crystal rod before and after polishing into the defect abnormal value calculation formula to calculate the defect abnormal value of the sapphire crystal rod before and after polishing, wherein the defect abnormal value calculation formula is: , where Vj is the volume of the jth defect, Vs is the volume of the crystal rod before polishing, and N is the number of defects; Step 32, obtain the defect abnormality value of the sapphire crystal rod before and after polishing, and substitute it into the calculation formula of the defect analysis value of the polishing process to calculate the defect analysis value of the polishing process, wherein the calculation formula of the defect analysis value of the polishing process is: , where Psh is the defect abnormality value of the sapphire crystal rod after polishing, and Psq is the defect abnormality value of the sapphire crystal rod before polishing; Step 4, obtaining the polishing surface quality analysis results and the polishing process defect analysis results obtained by analysis, and obtaining the polishing time data to evaluate the polishing quality of the polishing equipment; In this embodiment, step 4 includes the following specific contents: Step 41, obtaining the calculated polishing surface quality, polishing process defect analysis value and polishing time data of the polishing process, and substituting the obtained data into the polishing quality evaluation value calculation formula to calculate the polishing quality evaluation value, wherein the polishing quality evaluation value calculation formula is: , where a is the surface mass ratio and T is the polishing time; Step 42: Obtain the calculated polishing quality evaluation value and compare it with the set polishing quality evaluation threshold. If the polishing quality evaluation value is greater than or equal to the set polishing quality evaluation threshold, it means that the polishing quality of the polishing equipment can meet the requirements. If the polishing quality evaluation value is less than the set polishing quality evaluation threshold, it means that the polishing quality of the polishing equipment cannot meet the polishing requirements and the polishing equipment needs to be maintained. At the same time, it is necessary to explain that the setting parameters (such as surface quality ratio and polishing quality evaluation threshold, etc.) in this embodiment are obtained by a large number of experiments as a control group. The specific acquisition operation method is: obtain the outer surface image data of the sapphire crystal rod before and after historical polishing, and obtain the internal defect data of the sapphire crystal rod before and after polishing, and obtain the polishing time data of the polishing equipment to form a data set for a control experiment, substitute the obtained data sets into the polishing quality evaluation value calculation formula to calculate the polishing quality evaluation value, obtain the expert's judgment result on whether the polishing quality of the polishing equipment in the control experiment can meet the polishing requirements, import the calculation results and judgment results into the fitting software, and output the value of the setting parameter that meets the maximum judgment accuracy; Arrange the calculated maintenance values of all structures in descending order, and perform structure maintenance in the order of arrangement.
[0017] It should be noted in this example that this embodiment has the following advantages over the prior art: the present application comprehensively analyzes the polishing quality based on the flatness of the polishing surface and the damage changes caused by polishing, thereby improving the rationality and accuracy of the polishing quality analysis. In the process of polishing quality evaluation, the present application quantitatively evaluates the polishing difficulty based on the degree and height of defect aggregation on the polishing surface, and then performs polishing quality analysis, thereby further improving the rationality and accuracy of the polishing quality analysis.
[0018] Example 2 like Figure 3As shown, a sapphire crystal rod polishing quality assessment system based on image processing is implemented based on the above-mentioned sapphire crystal rod polishing quality assessment method based on image processing, and specifically includes a data acquisition module, a polishing surface quality analysis module, a polishing process defect analysis module, a polishing quality assessment module and a control component; wherein the data acquisition module is used to acquire the outer surface image data of the sapphire crystal rod before and after polishing, and acquire the internal defect data of the sapphire crystal rod before and after polishing, and acquire the polishing time data of the polishing device; the polishing surface quality analysis module is used to perform comparative analysis based on the outer surface image data of the sapphire crystal rod before and after polishing to obtain the polishing surface quality analysis result; the polishing process defect analysis module is used to perform comparative analysis based on the internal defect data of the sapphire crystal rod before and after polishing to obtain the polishing process defect analysis result; the polishing quality assessment module acquires the polishing surface quality analysis result and the polishing process defect analysis result obtained by analysis, and acquires the polishing time data to evaluate the polishing quality of the polishing device, and the control component controls the operation of the data acquisition module, the polishing surface quality analysis module, the polishing process defect analysis module and the polishing quality assessment module; the specific steps of each module in this embodiment have been described in detail in the above-mentioned method embodiment, and will not be repeated in this embodiment.
[0019] Example 3 This embodiment provides an electronic device, such as Figure 4 As shown, it includes: a processor and a memory, wherein the memory stores a computer program that can be called by the processor; The processor executes the above-mentioned sapphire crystal rod polishing quality assessment method based on image processing by calling the computer program stored in the memory.
[0020] The electronic device may have relatively large differences due to different configurations or performances, and may include one or more processors and one or more memories, wherein the memory stores at least one computer program, which is loaded and executed by the processor to implement the sapphire crystal rod polishing quality assessment method based on image processing provided by the above method embodiment. The electronic device may also include other components for realizing the functions of the device, for example, the electronic device may also have components such as a wired or wireless network interface and an input and output interface to input and output data. This embodiment will not be described in detail here.
[0021] Example 4 This embodiment provides a computer-readable storage medium having a rewritable computer program stored thereon; When the computer program is executed on a computer device, the computer device is enabled to execute the above-mentioned sapphire crystal rod polishing quality assessment method based on image processing.
[0022] For example, the computer readable storage medium can be a read-only memory, a random access memory, a read-only CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, and the like.
[0023] The above embodiments can be implemented in whole or in part by software, hardware, firmware or any other combination. When implemented by software, the above embodiments can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When a computer instruction or computer program is loaded or executed on a computer, a process or function according to an embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network or other programmable device. Computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, computer instructions can be transmitted from one website site, computer, server or data center to another website site, computer, server or data center through a wired network or / and a wireless network. The computer-readable storage medium can be any available medium that a computer can access or a data storage device such as a server or data center that contains one or more available media sets. The available medium can be a magnetic medium (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium. The semiconductor medium can be a solid-state hard disk.
[0024] The terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not expressly listed, or also includes elements inherent to such process, method, article, or apparatus.
[0025] The above description is only a preferred embodiment of the present application and an explanation of the technical principles used. Those skilled in the art should understand that the scope of application involved in the present application is not limited to the technical solution formed by a specific combination of the above technical features, but should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the aforementioned application concept. For example, the above features are replaced with (but not limited to) technical features with similar functions applied in the present application.
Claims
1. A sapphire crystal rod polishing quality assessment method based on image processing, characterized in that: It includes the following specific steps: Step 1, obtaining outer surface image data of the sapphire crystal rod before and after polishing, obtaining internal defect data of the sapphire crystal rod before and after polishing, and obtaining polishing time data of the polishing equipment; Step 2: Perform comparative analysis based on the outer surface image data of the sapphire crystal rod before and after polishing to obtain a polishing surface quality analysis result; Step 3: Comparative analysis is performed based on the internal defect data of the sapphire crystal rod before and after polishing to obtain the defect analysis results of the polishing process; Step 4: Obtain the polishing surface quality analysis results and polishing process defect analysis results obtained by analysis, and at the same time obtain polishing time data to evaluate the polishing quality of the polishing equipment.
2. The sapphire crystal rod polishing quality assessment method based on image processing according to claim 1, characterized in that: The comparative analysis based on the outer surface image data of the sapphire crystal rod before and after polishing in S2 includes the following specific steps: Step 21, obtaining outer surface image data of the sapphire crystal rod before polishing, and performing surface polishing difficulty analysis based on the surface flatness of the outer surface image data of the sapphire crystal rod before polishing; Step 22, obtaining outer surface image data of the sapphire crystal rod before polishing and outer surface image data of the sapphire crystal rod after polishing, and performing polishing surface change analysis based on the outer surface image data of the sapphire crystal rod before polishing and outer surface image data of the sapphire crystal rod after polishing to obtain a polishing surface change analysis value; Step 23: Perform polishing surface quality analysis based on the surface polishing difficulty and polishing surface variation analysis results, wherein the polishing surface quality calculation formula is: , where Xk is the polishing surface variation analysis value and Xn is the surface polishing difficulty.
3. The sapphire crystal rod polishing quality assessment method based on image processing according to claim 1, characterized in that: The comparative analysis based on the internal defect data of the sapphire crystal rod before and after polishing includes the following specific steps: Step 31, obtaining the internal defect data of the sapphire crystal rod before and after polishing, importing the internal defect data of the sapphire crystal rod before and after polishing into the defect abnormal value calculation formula to calculate the defect abnormal value of the sapphire crystal rod before and after polishing, wherein the defect abnormal value calculation formula is: , where Vj is the volume of the jth defect, Vs is the volume of the crystal rod before polishing, and N is the number of defects; Step 32, obtain the defect abnormality value of the sapphire crystal rod before and after polishing, and substitute it into the calculation formula of the defect analysis value of the polishing process to calculate the defect analysis value of the polishing process, wherein the calculation formula of the defect analysis value of the polishing process is: , where Psh is the defect anomaly value of the sapphire crystal rod after polishing, and Psq is the defect anomaly value of the sapphire crystal rod before polishing.
4. The sapphire crystal rod polishing quality assessment method based on image processing according to claim 3, characterized in that: The step 4 includes the following specific contents: Step 41, obtaining the polishing surface quality, polishing process defect analysis value and polishing time data of the polishing process obtained by calculation, and substituting the obtained data into the polishing quality evaluation value calculation formula to calculate the polishing quality evaluation value, wherein the polishing quality evaluation value calculation formula is: , where a is the surface mass ratio and T is the polishing time; Step 42, obtain the calculated polishing quality assessment value and compare it with the set polishing quality assessment threshold. If the polishing quality assessment value is greater than or equal to the set polishing quality assessment threshold, it means that the polishing quality of the polishing equipment can meet the requirements. If the polishing quality assessment value is less than the set polishing quality assessment threshold, it means that the polishing quality of the polishing equipment cannot meet the polishing requirements and the polishing equipment needs to be maintained.
5. The sapphire crystal rod polishing quality assessment method based on image processing according to claim 4, characterized in that: The surface polishing difficulty calculation formula is: , where N is the number of detection points on the outer surface image of the polished sapphire crystal rod, cm is the average distance between points that are not on the same plane as the polishing plane of the sapphire crystal rod, c is the polishing thickness of the crystal rod, and xi is the height data of the i-th detection point of the crystal rod. is the height of the polished surface of the sapphire crystal rod.
6. The sapphire crystal rod polishing quality assessment method based on image processing according to claim 5, characterized in that: The polishing surface variation analysis value calculation formula is: , where vi is the height data of the i-th point on the polishing plane after polishing, It is the average height information of the polishing surface after polishing.
7. The sapphire crystal rod polishing quality assessment method based on image processing according to claim 6, characterized in that: The specific content of the data obtained in step 1 is: Before polishing, the outer surface image data of the unpolished sapphire crystal rod is obtained by the optical profile imaging component, and the position and size data of the internal defects of the sapphire crystal rod are obtained by the defect detection component. After the data is obtained, the sapphire crystal rod is fixed on the polishing equipment for polishing; After polishing is completed, the outer surface image data of the polished sapphire crystal rod is obtained again through the optical profile imaging component, and the position and size data of the internal defects of the polished sapphire crystal rod are obtained at the same time; Obtain polishing time data of the polishing device, and store the obtained data in a corresponding storage component.
8. An electronic device comprising: A processor and a memory, wherein the memory stores a computer program that can be called by the processor; It is characterized in that the processor executes the sapphire crystal rod polishing quality assessment method based on image processing as described in any one of claims 1 to 7 by calling the computer program stored in the memory.
9. A computer-readable storage medium, characterized in that: Instructions are stored, and when the instructions are executed on a computer, the computer executes the sapphire crystal rod polishing quality assessment method based on image processing as described in any one of claims 1 to 7.
Citation Information
Patent Citations
Method for detecting sapphire wafer defects
CN109374633A
Device and method of detecting polished quartz wafer shallow scratch
CN110006919A
Polishing method for laser treatment of crystal fiber surface
CN112658486A
Polishing method of MAPbI3 crystals
CN113001376A
Annular jewelry automatic polishing equipment based on AI artificial intelligence control
CN113021165A