A metal substrate for a composite heat-conducting material and its manufacturing process

Abstract

The present invention belongs to the field of semiconductor technology, and discloses a metal substrate of a composite heat-conducting material and its manufacturing process. The process includes successively laminating a copper foil layer, an insulating layer, and a metal heat-dissipating substrate by hot pressing to form a metal-clad copper laminate, opening mounting holes corresponding to the high-heat-generation areas of electronic components on the metal-clad copper laminate, and manufacturing an adjustable heat-dissipating component. The adjustable heat-dissipating component includes a heat-dissipating block and an adjustable heat-dissipating connection structure. The adjustable heat-dissipating component is installed into the mounting holes of the metal-clad copper laminate and tightly connected. A heat-dissipating medium with high heat-conducting performance is filled in the space between the heat-dissipating block and the base of the electronic component, and a layer of high heat-conducting and heat-conducting film is added between the heat-dissipating block and the base of the electronic component. Through the adjustable heat-dissipating component, flexible adjustment can be realized according to the specific size and position of the electronic component. At the same time, the setting of the heat-dissipating medium and the high heat-conducting and heat-conducting film further optimizes the heat conduction path, improves the heat-dissipating performance of the metal substrate, and ensures the stable operation of high-power electronic components.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and particularly to a metal substrate of a composite heat-conducting material and a manufacturing process thereof. Background Art

[0002] With the rapid development of semiconductor technology, the integration and power density of electronic components have been continuously improved, resulting in a large amount of heat generated during the operation of devices. If heat cannot be dissipated in a timely and effective manner, the excessive temperature will affect the performance stability of electronic components and even shorten their service life. Therefore, in the semiconductor field, how to dissipate heat efficiently has become a key issue in the design and manufacturing process. Metal substrates are widely used in the packaging and heat dissipation of power electronic devices due to their excellent heat-conducting performance and mechanical strength.

[0003] Currently, the heat dissipation method of semiconductor metal substrates in the prior art usually adopts directly fixing electronic components on the metal substrate, or arranging heat dissipation devices in the dense area of electronic components, and coating a layer of heat-conducting medium between the metal substrate and the electronic components for heat conduction. However, this method has some defects. Firstly, the contact between the electronic components and the metal substrate is not tight enough, which easily generates interfacial voids, resulting in an increase in interfacial thermal resistance and affecting the heat transfer efficiency. Secondly, mainly due to the different sizes and shapes of different electronic components, while the heat dissipation devices are usually standard components with fixed sizes and installation angles, the fixed heat dissipation structure lacks flexibility, resulting in the inability to fully adapt and fit between the heat dissipation devices and the electronic components, and there are easily gaps, which all lead to an increase in thermal resistance and cannot meet the personalized heat dissipation requirements of high-heat generation areas. These problems cause the heat of electronic components not to be conducted out quickly and effectively, which may cause the device to overheat and affect its performance and reliability.

[0004] In view of this, it is necessary to improve the substrate heat dissipation structure in the prior art to solve the technical problem of the large thermal resistance of the fixed heat dissipation device. Summary of the Invention

[0005] The purpose of the present invention is to provide a metal substrate of a composite heat-conducting material and a manufacturing process thereof to solve the above technical problems.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] A manufacturing process of a metal substrate of a composite heat-conducting material, comprising:

[0008] Sequentially laminating a copper foil layer, an insulating layer, and a metal heat dissipation substrate by hot pressing to form a metal-clad copper laminate, and using a cutting device to slit the metal-clad copper laminate;

[0009] Installing holes are formed on the slit metal-clad copper laminate corresponding to the high-heat generation areas of the electronic components, where the installing holes are processed according to the shape and size of the component base;

[0010] An adjustable heat dissipation assembly is fabricated according to the size of the installing holes and the size of the corresponding electronic component base; the adjustable heat dissipation assembly includes a heat dissipation block and an adjustable heat dissipation connection structure, the heat dissipation block is made of a high thermal conductivity material, and the heat dissipation connection structure is used to adjust the position and angle of the heat dissipation block;

[0011] The adjustable heat dissipation assembly is installed into the installing holes of the metal-clad copper laminate, and the heat dissipation block is tightly connected to the metal heat dissipation substrate through the heat dissipation connection structure;

[0012] A heat dissipation medium with high thermal conductivity is filled in the space between the heat dissipation block and the electronic component base;

[0013] During the installation of the adjustable heat dissipation assembly and the filling of the heat dissipation medium, a layer of high thermal conductivity film is added between the heat dissipation block and the electronic component base.

[0014] Optionally, the copper foil layer, the insulating layer and the metal heat dissipation substrate are sequentially laminated by hot pressing to form a metal-clad copper laminate, and the metal-clad copper laminate is slit using a cutting device, specifically including:

[0015] The surfaces of the copper foil layer, the insulating layer and the metal heat dissipation substrate are pretreated, and the pretreatment includes cleaning, removing oxides and surface roughening treatment;

[0016] A layer of high thermal conductivity adhesive is respectively coated on the bonding surfaces of the copper foil layer and the metal heat dissipation substrate;

[0017] The pretreated copper foil layer, insulating layer and metal heat dissipation substrate are sequentially stacked in the order of copper foil layer, insulating layer, metal heat dissipation substrate to form a multi-layer structure to be hot-pressed, so that the layers are accurately aligned with no bubbles and impurities.

[0018] Optionally, after forming the multi-layer structure to be hot-pressed so that the layers are accurately aligned with no bubbles and impurities, it further includes:

[0019] The multi-layer structure is placed in a vacuum hot pressing device, and predetermined temperature, pressure and time parameters are set for hot pressing treatment to form a metal-clad copper laminate;

[0020] After the hot pressing is completed, the metal-clad copper laminate is taken out and naturally cooled to room temperature, and then the metal-clad copper laminate is slit according to the design requirements using a cutting device to obtain a metal-clad copper laminate meeting the specification dimensions.

[0021] Optionally, mounting holes are formed in the metal-clad copper laminate corresponding to the high-heat-generation areas of the electronic components during slitting, specifically including:

[0022] Performing a thermal distribution simulation on the metal-clad copper laminate through a thermal analysis tool to generate a thermal distribution map, so as to determine the positions of the high-heat-generation areas of the electronic components on the slit metal-clad copper laminate;

[0023] According to the thermal distribution map, in combination with the specific dimensions and shapes of the electronic components, designing the shapes and dimensions of the mounting holes to make the sizes of the mounting holes match those of the component bases;

[0024] Using a laser cutting device to drill holes in the high-heat-generation areas of the metal-clad copper laminate according to the design requirements.

[0025] Optionally, after using the laser cutting device to drill holes in the high-heat-generation areas of the metal-clad copper laminate according to the design requirements, the following steps are further included:

[0026] During the drilling process, cooling the peripheral areas of the mounting holes by means of air cooling;

[0027] After the processing of the mounting holes is completed, cleaning the metal-clad copper laminate.

[0028] Optionally, the heat dissipation connection structure includes:

[0029] A positioning part, which is used to be installed in the corresponding mounting hole to position the adjustable heat dissipation component;

[0030] A positioning and adjusting part, which is provided with a guide groove and an adjusting bolt for adjusting the position of the heat dissipation block;

[0031] An angle adjusting part, which includes an adjusting hinge for adjusting the angle of the heat dissipation block.

[0032] Optionally, filling a heat dissipation medium with high thermal conductivity in the space between the heat dissipation block and the electronic component base, specifically including:

[0033] Selecting a suitable type of heat dissipation medium according to the operating temperature and heat dissipation requirements of the electronic components; the heat dissipation medium can be any one of thermal conductive adhesives, thermal conductive silicone greases or phase change materials;

[0034] Cleaning the contact surfaces of the heat dissipation block and the electronic component base;

[0035] Using a dispensing coating device to uniformly fill a predetermined amount of heat dissipation medium in the space between the heat dissipation block and the electronic component base;

[0036] After filling the heat dissipation medium, curing the heat dissipation medium.

[0037] Optionally, during the installation of the adjustable heat dissipation component and the filling of the heat dissipation medium, a layer of high thermal conductivity film is added between the heat sink and the base of the electronic component, specifically including:

[0038] Before filling the heat dissipation medium, prepare a layer of high thermal conductivity film; the high thermal conductivity film is a thin film material with uniform thickness, having high thermal conductivity, and its size and shape match the contact surface between the heat sink and the base of the electronic component;

[0039] Set the high thermal conductivity film on the upper surface of the base of the electronic component, so that the high thermal conductivity film is completely adhered to the base of the electronic component without bubbles and wrinkles.

[0040] Optionally, after setting the high thermal conductivity film on the upper surface of the base of the electronic component, so that the high thermal conductivity film is completely adhered to the base of the electronic component without bubbles and wrinkles, it further includes:

[0041] Install the heat sink on the base of the electronic component with the high thermal conductivity film attached, so that the lower surface of the heat sink is in close contact with the upper surface of the high thermal conductivity film;

[0042] After the heat dissipation medium is filled, perform a preset pressure and heat treatment on the combination of the heat sink, the high thermal conductivity film and the heat dissipation medium to make the connections between the layers tight.

[0043] The present invention also provides a metal substrate of a composite heat conducting material, which is obtained by using the manufacturing process of the metal substrate of the composite heat conducting material as described above. The metal substrate includes:

[0044] A metal clad laminate, including a copper foil layer, an insulating layer and a metal heat dissipation substrate stacked in sequence; wherein, mounting holes are provided at preset positions of the metal clad laminate;

[0045] An adjustable heat dissipation component, including a heat sink and an adjustable heat dissipation connection structure, and the adjustable heat dissipation component is installed in the mounting hole of the metal clad laminate;

[0046] A high thermal conductivity film, a thin film layer located between the heat sink and the base of the electronic component, having high thermal conductivity, and used to reduce the interfacial thermal resistance between the heat sink and the base of the electronic component;

[0047] A heat dissipation medium, filled in the space between the heat sink and the base of the electronic component, surrounding the high thermal conductivity film.

[0048] Compared with the prior art, the present invention has the following beneficial effects: The copper foil layer, the insulating layer and the metal heat dissipation substrate are successively pressed into a metal-clad copper laminate by a hot pressing method, and then cut into the required size and shape by a cutting device. On the cut metal-clad copper laminate, according to the position of the high-heat generation area of the electronic component, mounting holes matching the shape and size of the base of the electronic component are opened. According to the sizes of the mounting holes and the base of the electronic component, an adjustable heat dissipation component is manufactured and installed into the mounting holes of the metal-clad copper laminate. The heat dissipation block is tightly connected to the metal heat dissipation substrate through a heat dissipation connection structure. A heat dissipation medium with high thermal conductivity is filled in the space between the heat dissipation block and the base of the electronic component. During the process of filling the heat dissipation medium, a high-thermal-conductivity and high-thermal-conduction film is added between the heat dissipation block and the base of the electronic component to further reduce the interface thermal resistance and enhance the heat conduction effect. Through the adjustable heat dissipation component in this solution, flexible adjustment can be achieved according to the specific size and position of the electronic component. At the same time, the setting of the heat dissipation medium and the high-thermal-conductivity and high-thermal-conduction film further optimizes the heat conduction path, improves the heat dissipation performance of the metal substrate, and ensures the stable operation of high-power electronic components. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0050] The structures, ratios, sizes, etc. shown in the drawings of this specification are only used to cooperate with the content disclosed in the specification for those who are familiar with this technology to understand and read, and are not used to limit the limited conditions under which the present invention can be implemented. Therefore, they do not have technical essence. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in the present invention.

[0051] Figure 1 It is one of the flow diagrams of the manufacturing process of the metal substrate of the composite heat-conducting material in the first embodiment;

[0052] Figure 2 It is the second of the flow diagrams of the manufacturing process of the metal substrate of the composite heat-conducting material in the first embodiment;

[0053] Figure 3 It is the third of the flow diagrams of the manufacturing process of the metal substrate of the composite heat-conducting material in the first embodiment. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0054] In order to make the object, features, and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the embodiments described below are only a part of the embodiments of the present invention, rather than all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

[0055] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "upper", "lower", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be an intermediate component present at the same time.

[0056] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0057] Embodiment 1:

[0058] Combined with Figures 1 to 3 As shown, the embodiment of the present invention provides a manufacturing process for a metal substrate of a composite heat-conducting material, including:

[0059] S1, successively laminating a copper foil layer, an insulating layer, and a metal heat dissipation substrate by hot pressing to form a metal-clad copper laminate, and using cutting equipment to cut the metal-clad copper laminate; the copper foil layer and the metal heat dissipation substrate have good heat conductivity, and the insulating layer has good heat resistance to achieve the heat conduction and insulation functions of the substrate. Using cutting equipment to cut the laminated metal-clad copper laminate into dimensions and shapes that meet the design specifications; to meet the subsequent installation and heat dissipation requirements.

[0060] S2, opening mounting holes on the cut metal-clad copper laminate corresponding to the high-heat-generation areas of the electronic components, wherein the mounting holes are processed according to the shape and size of the component base; to ensure that the heat dissipation components can be effectively installed and contacted.

[0061] It should be noted that at this stage, the corresponding electronic components or electronic component bases have been installed on the cut metal-clad copper laminate, and then the mounting holes are set. Since the focus of this solution is not on the development of electronic components, no more details will be described here. However, it is easy to understand that in this process, the installation of electronic components has been completed, so there is a setting of high-heat-generation areas.

[0062] S3. Fabricate an adjustable heat dissipation component according to the size of the mounting hole and the size of the corresponding electronic component base. The adjustable heat dissipation component includes a heat dissipation block and an adjustable heat dissipation connection structure. The heat dissipation block is made of a high thermal conductivity material, and the heat dissipation connection structure is used to adjust the position and angle of the heat dissipation block. By adjusting the position and angle of the heat dissipation block, the contact area between the electronic component and the heat dissipation component is optimized, and the heat dissipation efficiency is improved.

[0063] S4. Install the adjustable heat dissipation component into the mounting hole of the metal-clad copper laminate, and tightly connect the heat dissipation block with the metal heat dissipation substrate through the heat dissipation connection structure. Ensure good thermal conductivity contact between the heat dissipation block and the metal heat dissipation substrate, and at the same time maintain adjustability to meet the heat dissipation requirements of different electronic components.

[0064] S5. Fill the space between the heat dissipation block and the electronic component base with a heat dissipation medium having high thermal conductivity performance. The heat dissipation medium is, for example, thermal grease or thermal adhesive, and ensure that the heat dissipation medium is in close contact with the heat dissipation block and the base of the electronic component. The heat dissipation medium can fill tiny voids, reduce the interface thermal resistance, and improve the heat transfer efficiency.

[0065] S6. During the installation of the adjustable heat dissipation component and the filling of the heat dissipation medium, add a layer of high thermal conductivity and high thermal conductivity film between the heat dissipation block and the electronic component base. Through the high-efficiency heat conduction characteristics of the film, the heat conduction efficiency is further improved, the interface thermal resistance is reduced, and the overall heat dissipation effect is improved.

[0066] The working principle of the present invention is as follows: First, successively press a copper foil layer, an insulating layer, and a metal heat dissipation substrate into a metal-clad copper laminate by a hot pressing method, and use a cutting device to cut it into the required size and shape. On the cut metal-clad copper laminate, according to the position of the high heat generation area of the electronic component, open a mounting hole that matches the shape and size of the electronic component base. According to the size of the mounting hole and the electronic component base, fabricate an adjustable heat dissipation component, install the adjustable heat dissipation component into the mounting hole of the metal-clad copper laminate, and tightly connect the heat dissipation block with the metal heat dissipation substrate through the heat dissipation connection structure. Fill the space between the heat dissipation block and the electronic component base with a heat dissipation medium having high thermal conductivity performance. During the filling of the heat dissipation medium, add a layer of high thermal conductivity and high thermal conductivity film between the heat dissipation block and the electronic component base to further reduce the interface thermal resistance and enhance the heat conduction effect. This solution realizes flexible adjustment according to the specific size and position of the electronic component through the adjustable heat dissipation component. At the same time, the setting of the heat dissipation medium and the high thermal conductivity film further optimizes the heat conduction path, improves the heat dissipation performance of the metal substrate, and ensures the stable operation of high-power electronic components.

[0067] In this embodiment, specifically, step S1 specifically includes:

[0068] S11. Pretreat the surfaces of the copper foil layer, insulation layer, and metal heat dissipation substrate. The pretreatment includes cleaning, removing oxides, and surface roughening treatment to improve the interlayer bonding force and ensure the lamination quality.

[0069] S12. Coat a layer of highly thermally conductive adhesive on the bonding surfaces of the copper foil layer and the metal heat dissipation substrate respectively. This adhesive has high temperature resistance and high thermal conductivity, which can improve the interlayer heat conduction efficiency.

[0070] S13. Stack the pretreated copper foil layer, insulation layer, and metal heat dissipation substrate in sequence according to the order of copper foil layer, insulation layer, and metal heat dissipation substrate to form a multi-layer structure to be laminated, making the alignment between layers precise without bubbles and impurities.

[0071] S14. Place the multi-layer structure in a vacuum hot pressing device, set the predetermined temperature, pressure, and time parameters, and perform hot pressing treatment to form a metal-clad laminate. Hot pressing in a vacuum environment can prevent oxidation, improve the interlayer bonding strength, and form a metal-clad laminate with stable structure and excellent thermal conductivity.

[0072] S15. After the hot pressing is completed, take out the metal-clad laminate and cool it naturally to room temperature. Then use a cutting device to cut the metal-clad laminate according to the design requirements to obtain a metal-clad laminate that meets the specified dimensions, preparing for subsequent processing steps. The cutting device can be a numerical control cutting machine or a laser cutting machine.

[0073] In this embodiment, specifically, step S2 specifically includes:

[0074] S21. Use a thermal analysis tool to simulate the thermal distribution of the metal-clad laminate and generate a thermal distribution map to determine the position of the high-heat generation area of the electronic component on the cut metal-clad laminate. Generate the thermal distribution map through thermal imaging or computer-aided design (CAD) software to facilitate the precise positioning of the area where installation holes need to be opened.

[0075] S22. According to the thermal distribution map, combined with the specific size and shape of the electronic component, design the shape and size of the installation hole to make the size of the installation hole match that of the component base. Consider the heat dissipation requirements at the edge of the installation hole during the design to ensure there is enough heat conduction area around.

[0076] S23. Use a laser cutting device to punch holes in the high-heat generation area of the metal-clad laminate according to the design requirements. The device should ensure that the heat generated during the hole-opening process does not affect the bonding effect between the copper foil layer and the insulation layer, and at the same time keep the edge of the installation hole smooth to reduce mechanical stress concentration points.

[0077] In this embodiment, further, after step S23, it also includes:

[0078] S24. During the drilling process, the surrounding area of the mounting hole is cooled by air cooling to avoid material deformation or performance degradation caused by the high temperature generated during processing. Air cooling or liquid cooling methods can be used to ensure processing accuracy and material stability.

[0079] S25. After the mounting holes are machined, the metal-clad laminate is cleaned. A cleaning device is used to remove debris and impurities inside and around the holes, ensuring that the inner wall of the mounting holes is smooth. The accuracy of the mounting holes is inspected by a detection device to confirm that it meets the design specifications, providing a good foundation for the installation of the subsequent heat dissipation components.

[0080] In this embodiment, specifically, the heat dissipation connection structure includes:

[0081] A positioning part, which is used to be installed in the corresponding mounting hole to position the adjustable heat dissipation component. Specifically, it can be a plug-in pin or other connecting members.

[0082] A positioning and adjusting part, which is provided with a guide groove and an adjusting bolt for adjusting the position of the heat dissipation block. Structures such as slide rails, guide grooves or positioning holes can be adopted to allow the heat dissipation block to move within a certain range to accurately align with the heat generation area of the electronic component. This structure can ensure that the heat dissipation block can be flexibly adjusted during installation.

[0083] An angle adjusting part, which includes an adjusting hinge for adjusting the angle of the heat dissipation block. Through these mechanisms, the inclination angle of the heat dissipation block can be adjusted according to actual needs to make it in close contact with the base of the electronic component and optimize the heat conduction path.

[0084] It should be noted that the adjustable function of the heat dissipation block is only limited to the installation process. After installation, it is fixed through a locking structure (adjusting bolt), and then through the filling and curing process of the heat dissipation medium, the long-term stability of the system is ensured. Since the heat dissipation medium forms a stable heat conduction path after curing, there is no need to adjust the heat dissipation block subsequently. Therefore, although the heat dissipation block is adjustable during installation, once the installation and curing are completed, the adjustment function is locked, thus ensuring the reliability and heat conduction efficiency of the entire system.

[0085] The adjustable structure of the adjustable heat dissipation component is of great significance during the installation process. It can finely adjust the position and angle of the heat dissipation block according to specific requirements and fix the heat dissipation block through a locking structure. After filling with a high thermal conductivity medium and curing, the adjustment function of the system will be locked to ensure a stable and efficient heat conduction path of the heat dissipation block during the entire use process. This design solves the balance problem between the installation flexibility and subsequent stability of the heat dissipation block.

[0086] In this embodiment, specifically, step S5 specifically includes:

[0087] S51. Select a suitable type of heat dissipation medium according to the operating temperature and heat dissipation requirements of the electronic component; the heat dissipation medium can be any one of thermal conductive adhesives, thermal conductive greases, or phase change materials; select according to the operating temperature and heat dissipation requirements of the electronic component to ensure that the heat dissipation medium has excellent thermal conductivity and stable physical and chemical properties.

[0088] S52. Clean the contact surfaces of the heat sink and the electronic component base; remove oil stains, dust, and oxide layers on the surface to ensure surface smoothness, so as to improve the filling effect of the heat dissipation medium and the heat conduction efficiency.

[0089] S53. Use a dispensing coating device to evenly fill the space between the heat sink and the electronic component base with a predetermined amount of heat dissipation medium; control the thickness and distribution of the heat dissipation medium during the filling process to avoid the generation of bubbles and voids, so as to reduce the interface thermal resistance.

[0090] S54. After filling the heat dissipation medium, cure the heat dissipation medium. Such as using methods of heating, ultraviolet irradiation, or natural curing to make the heat dissipation medium reach the best physical properties and heat conduction effect.

[0091] In this embodiment, specifically, step S6 specifically includes:

[0092] S61. Before filling the heat dissipation medium, prepare a layer of high thermal conductivity film; the high thermal conductivity film is a thin film material with uniform thickness, having high thermal conduction performance, and its size and shape match the contact surface of the heat sink and the electronic component base;

[0093] S62. Set the high thermal conductivity film on the upper surface of the electronic component base, so that the high thermal conductivity film is completely attached to the electronic component base without bubbles and wrinkles. Vacuum bonding technology or electrostatic adsorption technology can be used to make the film form a tight contact with the base.

[0094] S63. Install the heat sink onto the electronic component base with the high thermal conductivity film already attached, so that the lower surface of the heat sink is in tight contact with the upper surface of the high thermal conductivity film; through an adjustable heat dissipation connection structure, adjust the position and angle of the heat sink to ensure full contact of the contact surface.

[0095] S64. After the heat dissipation medium is filled, perform a preset pressurization and heating treatment on the combination of the heat sink, the high thermal conductivity film, and the heat dissipation medium to make the layers tightly connected. Ensure that the film forms an efficient heat conduction path with the heat sink and the electronic component base.

[0096] Embodiment 2:

[0097] The present invention also provides a metal substrate of a composite thermal conductive material, which is prepared by using the manufacturing process of the metal substrate of the composite thermal conductive material as in Embodiment 1. The metal substrate includes:

[0098] A metal-clad laminate, comprising a copper foil layer, an insulating layer, and a metal heat dissipation substrate that are sequentially stacked; wherein, mounting holes are provided at preset positions of the metal-clad laminate;

[0099] Among them, the copper foil layer is located at the uppermost layer, used for arranging electronic components and circuits, and serving as the conductive layer of the circuit.

[0100] The insulating layer is below the copper foil layer, playing the role of electrical insulation to prevent current from directly conducting to the lower layer.

[0101] The metal heat dissipation substrate is located below the insulating layer, usually made of high thermal conductivity materials such as aluminum or copper, and is used for conducting and dissipating heat.

[0102] An adjustable heat dissipation component, comprising a heat dissipation block and an adjustable heat dissipation connection structure, the adjustable heat dissipation component is installed in the mounting hole of the metal-clad laminate;

[0103] It should be noted that the heat dissipation block is made of a high thermal conductivity material, installed in the mounting hole, connected to the base of the electronic component, and used for directly absorbing the heat generated by the electronic component.

[0104] The adjustable heat dissipation connection structure connects the heat dissipation block and the metal heat dissipation substrate, and is used for adjusting the position and angle of the heat dissipation block during the installation process to ensure close contact between the heat dissipation block and the base of the electronic component.

[0105] A high thermal conductivity film, a thin film located between the heat dissipation block and the base of the electronic component, having high thermal conductivity, and used for reducing the interfacial thermal resistance between the heat dissipation block and the base of the electronic component; improving the heat conduction efficiency.

[0106] A heat dissipation medium, filling the space between the heat dissipation block and the base of the electronic component, surrounding the high thermal conductivity film. Filling the micro voids, further reducing the interfacial thermal resistance, and ensuring efficient heat transfer.

[0107] As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A manufacturing process of a metal substrate of a composite thermal conductive material, characterized in that: include: The copper foil layer, the insulating layer and the metal heat dissipation substrate are sequentially pressed into a metal copper clad laminate by means of heat pressing, and the metal copper clad laminate is cut by using a cutting device; Opening mounting holes on the cut copper-clad metal board at high-heat-generating areas corresponding to the electronic components, wherein the mounting holes are processed according to the shape and size of the component base; According to the size of the mounting hole and the size of the corresponding electronic component base, an adjustable heat dissipation component is manufactured; the adjustable heat dissipation component comprises a heat dissipation block and an adjustable heat dissipation connection structure, the heat dissipation block is made of a high thermal conductivity material, and the heat dissipation connection structure is used to adjust the position and angle of the heat dissipation block; Install the adjustable heat dissipation assembly into the mounting hole of the metal copper-clad plate, and tightly connect the heat dissipation block to the metal heat dissipation substrate through the heat dissipation connection structure; Filling a heat dissipation medium with high thermal conductivity in the space between the heat dissipation block and the electronic component base; During the installation of the adjustable heat dissipation assembly and the filling of the heat dissipation medium, a layer of high thermal conductivity film is added between the heat dissipation block and the electronic component base; Wherein, the heat dissipation connection structure comprises: A positioning portion, the positioning portion being used to be installed in a corresponding mounting hole to position the adjustable heat dissipation assembly; A positioning adjustment member, which is provided with a guide groove and an adjustment bolt and is used to adjust the position of the heat sink; The angle adjustment member includes an adjustment hinge and is used to adjust the angle of the heat sink.

2. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 1, characterized in that: The method comprises: sequentially pressing the copper foil layer, the insulating layer and the metal heat dissipation substrate into a metal copper clad laminate by heat pressing, and cutting the metal copper clad laminate by using a cutting device, specifically comprising: Pre-treating the surfaces of the copper foil layer, the insulating layer and the metal heat dissipation substrate, wherein the pre-treatment includes cleaning, removing oxides and surface roughening; A layer of high thermal conductivity adhesive is applied on the surfaces to be bonded of the copper foil layer and the metal heat dissipation substrate respectively; The pre-treated copper foil layer, insulating layer and metal heat dissipation substrate are stacked in the order of copper foil layer, insulating layer and metal heat dissipation substrate to form a multi-layer structure to be pressed, so that the layers are accurately aligned without bubbles and impurities.

3. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 2, characterized in that: The forming of the multi-layer structure to be pressed together so that each layer is precisely aligned without bubbles and impurities, and then further comprising: Placing the multilayer structure in a vacuum hot pressing device, setting predetermined temperature, pressure and time parameters, and performing hot pressing treatment to form a metal copper clad laminate; After the hot pressing is completed, the metal copper clad laminate is taken out and naturally cooled to room temperature, and then the metal copper clad laminate is cut according to the design requirements using a cutting device to obtain a metal copper clad laminate that meets the specification size.

4. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 1, characterized in that: The step of opening a mounting hole on the cut copper-clad metal laminate corresponding to a high-heat-generating area of ​​the electronic component specifically includes: Performing thermal distribution simulation on the metal copper-clad laminate by using a thermal analysis tool to generate a thermal distribution map to determine the location of high-heat-generating areas of electronic components on the cut metal copper-clad laminate; According to the heat distribution diagram, combined with the specific size and shape of the electronic component, the shape and size of the mounting hole are designed so that the mounting hole matches the size of the component base; Use laser cutting equipment to punch holes in high heat areas of the metal copper clad laminate according to design requirements.

5. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 4, characterized in that: The laser cutting equipment is used to punch holes in the high-heat-generating area of ​​the metal copper-clad laminate according to the design requirements, and then the following is included: During the drilling process, air cooling is used to cool the area around the mounting hole; After the mounting holes are processed, the metal copper clad laminate is cleaned.

6. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 1, characterized in that: The space between the heat dissipation block and the electronic component base is filled with a heat dissipation medium with high thermal conductivity, which specifically includes: Select a suitable type of heat dissipation medium according to the operating temperature and heat dissipation requirements of the electronic components; the heat dissipation medium may be any one of thermal conductive glue, thermal conductive silicone grease or phase change material; Clean the contact surfaces of the heat sink and the electronic component base; Using glue dispensing equipment, a predetermined amount of heat dissipation medium is evenly filled in the space between the heat dissipation block and the electronic component base; After the heat dissipation medium is filled, the heat dissipation medium is cured.

7. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 1, characterized in that: During the installation of the adjustable heat dissipation assembly and the filling of the heat dissipation medium, a layer of high thermal conductivity film is added between the heat dissipation block and the electronic component base, specifically including: Before filling the heat dissipation medium, prepare a layer of high thermal conductivity film; the high thermal conductivity film is a thin film material with uniform thickness and high thermal conductivity, and its size and shape match the contact surface of the heat dissipation block and the electronic component base; The high thermal conductivity film is arranged on the upper surface of the electronic component base, so that the high thermal conductivity film and the electronic component base are completely fitted together without bubbles and wrinkles.

8. The manufacturing process of the metal substrate of the composite thermal conductive material according to claim 7, characterized in that: The high thermal conductivity film is arranged on the upper surface of the electronic component base so that the high thermal conductivity film is completely attached to the electronic component base without bubbles and wrinkles, and then further includes: Installing the heat dissipation block onto the electronic component base on which the high thermal conductivity film has been affixed, so that the lower surface of the heat dissipation block is in close contact with the upper surface of the high thermal conductivity film; After the heat dissipation medium is filled, the combination of the heat dissipation block, the high thermal conductivity film and the heat dissipation medium is subjected to a preset pressurization and heating process to ensure a tight connection between the layers.

9. A metal substrate of a composite thermal conductive material, characterized in that: The metal substrate is manufactured by the manufacturing process of the metal substrate of the composite thermal conductive material according to any one of claims 1 to 8, wherein the metal substrate comprises: A metal copper-clad laminate, comprising a copper foil layer, an insulating layer and a metal heat dissipation substrate stacked in sequence; wherein a mounting hole is provided at a preset position of the metal copper-clad laminate; An adjustable heat dissipation component, comprising a heat dissipation block and an adjustable heat dissipation connection structure, wherein the adjustable heat dissipation component is mounted in a mounting hole of a metal copper-clad plate; A high thermal conductivity film is a thin film located between the heat sink and the electronic component base, which has high thermal conductivity and is used to reduce the interface thermal resistance between the heat sink and the electronic component base; The heat dissipation medium is filled in the space between the heat dissipation block and the electronic component base, and surrounds the high thermal conductivity film.

Images