Adjustable rapid constant-force packaging and bonding mechanism

Abstract

The invention discloses an adjustable rapid constant-force packaging and bonding mechanism, and relates to the technical field of semiconductor packaging. A bonding head body is movably mounted in the mechanism main body along a first linear direction; the two sides, in the second linear direction perpendicular to the first linear direction, of the bonding head body are connected with the mechanism body through a negative stiffness structure and a linear positive stiffness structure respectively. The linear positive stiffness structure is connected with a guide head of the flexible guide mechanism; a sliding table mechanism is mounted on the mechanism main body; a sliding table body of the sliding table mechanism is connected with guide heads on the two sides through a connecting rod mechanism. The connecting rod mechanism is used for converting the displacement of the sliding table body in the first linear direction into the displacement of the guide head in the second linear direction; a thread adjusting part is movably mounted on the mechanism main body; and the thread adjusting piece is used for adjusting the displacement of the bonding head body in the first linear direction by rotating the thread adjusting piece. The mechanism designed by the invention has the function of quickly entering a constant force range, and meanwhile, different constant forces can be adjusted to be output.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging technology, and in particular to an adjustable fast constant force packaging bonding mechanism. Background Art

[0002] Package bonding is a core link in the semiconductor packaging process, which involves connecting the chip to the substrate (such as a lead frame or PCB board) through specific technology to achieve electrical connection and provide physical support. This technology is widely used in the manufacture of various semiconductor devices, including integrated circuits (ICs), microprocessors (MPUs), memories, etc. With the continuous advancement of semiconductor technology, package bonding technology is also continuously innovating and improving to meet the growing demand for semiconductor device manufacturing and achieve the goals of higher density, higher performance and lower power consumption.

[0003] The packaging bonding process usually includes the steps of chip preparation, substrate preparation, bonding operation and quality inspection. However, 40% of packaging bonding failures are related to chip damage and poor solder ball deformation during the bonding operation. Figure 1 As shown in the schematic diagram a in FIG. 1 , during the bonding operation, the bonding head (100) applies pressure to the chip (101), so that the solder balls (102) on the chip (101) are deformed and connected to the substrate (103) on the base (104).

[0004] As the number of I / O ports of the chip (101) increases, the spacing between the solder balls (102) becomes smaller and smaller. When the bonding force is too large, the solder balls may be excessively deformed and exceed their corresponding substrate areas, resulting in contact short circuits between the solder balls (e.g. Figure 1 In addition, excessive bonding force may cause solder balls to break (such as Figure 1 On the contrary, too small a bonding force will result in insufficient deformation of the solder ball, making it impossible for the solder ball and the substrate to form an effective connection (such as Figure 1 f diagram in the figure), all of the above situations will affect the quality of package bonding. Therefore, whether the bonding force is too large or too small, it will lead to package bonding failure. In the final analysis, controlling the bonding force during the bonding operation is the key to successful package bonding ( Figure 1 Schematic diagram b in the figure is a schematic diagram of good packaging bonding).

[0005] Therefore, it is urgent to provide a solution to solve the above problems and requirements. Summary of the invention

[0006] In view of this, the purpose of the present application is to provide an adjustable fast constant force packaging bonding mechanism, which has the function of quickly entering the constant force range and can adjust the output of different constant forces to meet the requirements of packaging bonding for different bonding forces.

[0007] In order to achieve the above technical purpose, the present application provides an adjustable rapid constant force packaging bonding mechanism, including a mechanism body;

[0008] A bonding head body is movably mounted in the mechanism body along a first straight line direction;

[0009] The bonding head body extends out of the mechanism body at one end of the first straight line direction;

[0010] The bonding head body is connected to the mechanism body via negative stiffness structures on both sides of a second straight line direction perpendicular to the first straight line direction;

[0011] Both sides of the bonding head body in the second straight line direction are also connected to the flexible guide mechanism through linear positive stiffness structures;

[0012] The flexible guide mechanism has a guide head capable of displacement in a second linear direction;

[0013] The guide head is connected to the linear positive stiffness structure through the connecting block;

[0014] A slide mechanism is installed on the mechanism body;

[0015] The slide body of the slide mechanism is slidably adjustable along the first straight line direction;

[0016] The slide body is connected to the flexible guide mechanism through a connecting rod mechanism, and is connected to the linear positive stiffness structure through the connecting blocks located on both sides of the bonding head body;

[0017] The connecting rod mechanism is used to convert the displacement of the slide body in the first linear direction into the displacement of the guide head in the second linear direction;

[0018] The mechanism body is provided with a through hole along the first straight line direction;

[0019] A threaded adjustment member is movably mounted on the through hole;

[0020] The bonding head body is provided with a threaded hole at the other end of the first straight line direction for the threaded section of the threaded adjusting member to be inserted and threadedly matched;

[0021] The threaded adjustment member is used to adjust the displacement of the bonding head body in the first linear direction by rotating itself.

[0022] Furthermore, two cavities are sequentially provided in the mechanism body along the first straight line direction;

[0023] One end of the bonding head body passes through one of the cavities and extends into the other cavity;

[0024] One of the cavities is used to accommodate the linear positive stiffness structure;

[0025] The other cavity is used to accommodate the negative stiffness structure.

[0026] Further, the through hole is connected to another cavity, and includes a first hole segment and a second hole segment coaxially connected to the first hole segment;

[0027] The first hole section has a diameter larger than that of the second hole section and is used to accommodate the head of the threaded adjusting member;

[0028] The second hole section is for the threaded section of the threaded adjusting member to pass through.

[0029] Furthermore, a mounting plate is fixed on the mechanism body;

[0030] The slide mechanism is mounted on the mounting plate.

[0031] Further, the connecting rod mechanism includes two connecting rod assemblies;

[0032] The linear positive stiffness structures located on both sides of the bonding head body are connected to the slide body through the connecting rod assembly in a one-to-one correspondence;

[0033] The connecting rod assembly includes a first connecting rod and a second connecting rod;

[0034] One end of the first connecting rod is rotatably connected to the slide body, and the other end is rotatably connected to the guide head;

[0035] One end of the second connecting rod is rotatably connected to the first connecting rod and is located between the two rotating ends of the first connecting rod;

[0036] The other end of the second connecting rod is rotatably connected to the constant force mechanism;

[0037] The rotation center lines of one ends of the two first connecting rods are coaxial;

[0038] The rotation center lines of the other ends of the two second connecting rods are coaxial.

[0039] Furthermore, the slide mechanism is a manual slide.

[0040] Further, the flexible guide mechanism comprises two guide fixing blocks, at least one guide beam and one guide head;

[0041] The two guide fixing blocks are fixed on the mechanism body at intervals along the first straight line direction;

[0042] At least one of the guide beams is fixed between the two guide fixing blocks along the first straight line direction;

[0043] The guide head is fixed on the guide beam;

[0044] The connecting block connects the guide head and the linear positive stiffness structure.

[0045] Furthermore, the negative stiffness structure is an inclined beam structure.

[0046] Furthermore, the linear positive stiffness structure is a broken line beam structure.

[0047] Furthermore, a plurality of mounting holes are provided on the mechanism body.

[0048] It can be seen from the above technical solutions that the adjustable fast constant force packaging bonding mechanism designed in this application has the following beneficial effects:

[0049] 1. The bonding head body is respectively connected with a negative stiffness structure and a linear positive stiffness structure in the second straight line direction, so that the negative stiffness structure and the linear positive stiffness structure are connected in parallel to form a constant force mechanism.

[0050] 2. The displacement of the bond head body in the first straight line direction is adjusted by cooperating with the threaded adjustment part and the threaded hole of the bond head body, thereby realizing the advance pre-tightening of the constant force mechanism, so that it has the function of quickly entering the constant force range, shortening the time for the constant force mechanism to enter its constant force range, and effectively improving the working efficiency of the constant force mechanism.

[0051] 3. By moving the slide body, the connecting rod mechanism can be used to drive the guide head of the flexible guide mechanism to move, and then drive the linear positive stiffness structure 32 to move, so as to achieve adjustable constant force to meet different usage requirements. Compared with the method of driving piezoelectric ceramics (PZT) to adjust the output constant force, it effectively simplifies the adjustment process and improves the efficiency of constant force adjustment. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0053] Figure 1 A schematic diagram of a bonding model for package bonding provided in this application;

[0054] Figure 2 A three-dimensional diagram of an adjustable rapid constant force packaging bonding mechanism provided in the present application;

[0055] Figure 3A schematic diagram of a first partial structure of an adjustable rapid constant force packaging bonding mechanism provided in the present application;

[0056] Figure 4 A schematic diagram showing the structure, simplified model and corresponding force-displacement curve of the negative stiffness part of an adjustable rapid constant-force packaging bonding mechanism provided in the present application;

[0057] Figure 5 A schematic diagram showing the structure, simplified model and corresponding force-displacement curve of a linear positive stiffness part of an adjustable rapid constant-force packaging bonding mechanism provided in the present application;

[0058] Figure 6 A schematic diagram showing a structure consisting of a negative stiffness part and a linear positive stiffness part of an adjustable rapid constant force packaging bonding mechanism provided in the present application, a simplified model and a corresponding force displacement curve;

[0059] Figure 7 A schematic diagram of a model of a pre-tightening process of an adjustable rapid constant force packaging bonding mechanism provided in the present application;

[0060] Figure 8 A comparison diagram of constant force curves before and after pre-tightening of an adjustable fast constant force packaging bonding mechanism provided in the present application;

[0061] Fig. 9 A schematic diagram of a second partial structure of an adjustable rapid constant force packaging bonding mechanism provided in the present application;

[0062] Fig.10 A schematic diagram of a model for adjusting constant force of an adjustable rapid constant force packaging bonding mechanism provided in the present application;

[0063] Fig.11 A schematic diagram of the principle of adjusting the constant force of an adjustable rapid constant force packaging bonding mechanism provided in the present application;

[0064] Figure 2 In: 1. Mechanism body; 11. Through hole; 12. Cavity; 13. Mounting hole; 2. Bonding head body; 21. Threaded hole; 31. Negative stiffness structure; 32. Linear positive stiffness structure; 4. Flexible guide mechanism; 41. Guide fixing block; 42. Guide beam; 43. Guide head; 44. Connecting block; 5. Slide mechanism; 51. Slide body; 52. Screw assembly; 6. Connecting rod mechanism; 61. First connecting rod; 62. Second connecting rod; 7. Mounting plate. DETAILED DESCRIPTION

[0065] The technical solutions of the embodiments of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. All other embodiments obtained by ordinary technicians in this field without creative work based on the embodiments in the embodiments of the present application are within the scope of protection of the embodiments of the present application.

[0066] In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, the terms "first", "second", and "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0067] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a replaceable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0068] The embodiment of the present application discloses an adjustable rapid constant force packaging bonding mechanism.

[0069] See also Figure 2 as well as Figure 3 , an embodiment of an adjustable fast constant force packaging bonding mechanism provided in the embodiments of the present application includes:

[0070] Institutional entity 1.

[0071] The bonding head body 2 is movably mounted in the mechanism body 1 along a first linear direction, wherein the first linear direction refers to a preset bonding movement direction of the bonding head body 2. Figure 2 For example, it can refer to the vertical direction.

[0072] One end of the bonding head body 2 extends out of the mechanism body 1 in the first straight line direction, and the end extending out of the mechanism body 1 is used to contact the chip to perform a bonding operation on the chip.

[0073] The bonding head body 2 is connected to the mechanism body 1 on both sides of the second straight line direction perpendicular to the first straight line direction through the negative stiffness structure 31; the negative stiffness structure 31 is a special mechanical structure, in which, when subjected to external force, the relationship between the displacement and force generated in a section presents a negative correlation, rather than a positive correlation between the displacement and force as in a conventional positive stiffness structure. In the entire displacement process, there is a section of displacement ( Figure 4 The stiffness coefficient k is less than 0.

[0074] Figure 4 The schematic diagram a in the figure is a schematic diagram of the structure of the negative stiffness part of this application. Figure 4 The schematic diagram b in the figure is the corresponding model diagram. Figure 4 The schematic diagram c in FIG. 1 is the corresponding force F / displacement x curve.

[0075] The bonding head body 2 is also connected to the flexible guide mechanism 4 on both sides of the second straight line direction through a linear positive stiffness structure 32; the linear positive stiffness structure 32 refers to a structure in which the force exerted on the structure and the displacement generated are linearly related within the elastic range, and the stiffness is a positive value. Stiffness is the ability of a structure to resist deformation. For the linear positive stiffness structure 32, its force-displacement relationship can be described by Hooke's law, that is, F=kx, where F is the external force applied to the structure, x is the displacement generated by the structure, k is the stiffness coefficient, and k>0.

[0076] Figure 5 The schematic diagram a in the figure is a schematic diagram of the structure of the linear positive stiffness part of this application. Figure 5 The schematic diagram b in the figure is the corresponding model diagram. Figure 5 The schematic diagram c in FIG. 1 is the corresponding force F / displacement x curve.

[0077] like Figure 6 As shown, a constant force mechanism can be obtained by connecting the negative stiffness structure 31 and the linear positive stiffness structure 32 in parallel. Figure 6 The schematic diagram a in the figure is a schematic diagram of the structure of the combination of the negative stiffness structure 31 and the linear positive stiffness structure 32 of the present application. Figure 6 The schematic diagram b in the figure is the corresponding model diagram. Figure 6 In the figure, c is the corresponding force F / displacement x curve.

[0078] The flexible guide mechanism 4 has a guide head 43 that can be displaced in the second linear direction. The guide head 43 is connected to the linear positive stiffness structure 32 via a connecting block 44 .

[0079] The mechanism body 1 is provided with a slide mechanism 5, and a slide body 51 of the slide mechanism 5 can be slidably adjusted along the first linear direction. The slide body 51 is connected to the flexible guide mechanism 4 through a connecting rod mechanism 6, and is connected to the linear positive stiffness structure 32 through connecting blocks 44 located on both sides of the bonding head body 2; the connecting rod mechanism 6 is used to convert the displacement of the slide body 51 in the first linear direction into the displacement of the guide head 43 in the second linear direction.

[0080] The mechanism body 1 is provided with a through hole 11 along the first straight line direction, and a threaded adjustment member (not shown in the figure) is movably installed on the through hole 11; the bond head body 2 is provided with a threaded hole 21 at the other end in the first straight line direction for the threaded segment of the threaded adjustment member to be inserted and threadedly matched; the threaded adjustment member is used to adjust the displacement of the bond head body 2 in the first straight line direction by rotating itself.

[0081] The threaded adjustment member can be a screw, a bolt, or other threaded structural members with a head and a threaded rod section, and there is no specific limitation. When the threaded adjustment member is turned, since the threaded adjustment member itself does not move due to contact with the mechanism body 1, the threaded cooperation between the threaded adjustment member and the threaded hole 21 can be turned into the key head body 2 in the first straight line direction upward (such as Figure 3 The displacement of the bonding head body 2 is adjusted to achieve the pre-tightening purpose. When the upward input direction (such as the first straight line direction) is continued, the bonding head body 2 is displaced by the displacement x input direction) to achieve the displacement adjustment of the bonding head body 2 to achieve the pre-tightening purpose. Figure 3 When the displacement is in the direction of the displacement x input), the threaded adjustment member will move along with the bond head body 2.

[0082] The working principle of this application of fast constant force: Figure 7 as well as Figure 8 As shown, before the constant force mechanism is pre-tightened, the constant force mechanism needs to go through The distance (in millimeters) can enter the constant force range s; by adjusting the threaded part to pre-tighten the bonding head body 2, the constant force mechanism is pre-tightened in advance. , so that the constant force mechanism is directly at the constant force point A, and then the constant force mechanism only needs to pass The distance (micrometer level) can directly enter the constant force range s, effectively shortening the time for the constant force mechanism to enter the constant force range.

[0083] The working principle of this application to adjust the constant force is as follows: Fig. 9 as well as Fig.10 As shown, the slide body 51 is adjusted to move up and down, and the displacement generated by the slide body 51 is transmitted to the flexible guide mechanism 4 through the connecting rod mechanism 6. The flexible guide mechanism 4 is connected to the linear positive stiffness structure 32 of the constant force mechanism through the connecting block 44, so that the displacements generated by the two parts are the same. Finally, the displacement of the slide body 51 is transmitted to the linear positive stiffness structure 32 of the constant force mechanism, so as to adjust the output force of the constant force mechanism to meet different bonding force requirements in the packaging bonding process.

[0084] like Fig.11 As shown in FIG. 1 , when the adjustment slide body 51 produces a downward displacement, the displacement is transmitted to the linear positive stiffness structure 32 of the constant force mechanism through the connecting rod mechanism 6, the flexible guide mechanism 4 and the connecting block 44. At this time, the linear positive stiffness structure 32 produces a positive stiffness greater than that before adjustment. The output force increases due to the deformation , the output constant force of the constant force mechanism also increases accordingly , thus achieving constant force regulation.

[0085] The adjustable fast constant force packaging bonding mechanism designed in this application has the following beneficial effects:

[0086] 1. The bonding head body 2 is respectively connected with a negative stiffness structure 31 and a linear positive stiffness structure 32 in the second straight line direction, so that the negative stiffness structure 31 and the linear positive stiffness structure 32 are connected in parallel to form a constant force mechanism.

[0087] 2. The threaded adjustment member is used in conjunction with the threaded hole 21 of the bonding head body 2 to adjust the displacement of the bonding head body 2 in the first straight line direction, thereby realizing the advance pre-tightening of the constant force mechanism, so that it has the function of quickly entering the constant force range (fast constant force), shortening the time for the constant force mechanism to enter its constant force range, and effectively improving the working efficiency of the constant force mechanism.

[0088] 3. By moving the slide body 51, the connecting rod mechanism 6 can be used to drive the guide head 43 of the flexible guide mechanism 4 to move, and then drive the linear positive stiffness structure 32 to move, so as to achieve the adjustable constant force to meet different usage requirements (improving the flexibility of use), and compared with the conventional method of driving piezoelectric ceramics (PZT) to adjust the output constant force, it also effectively simplifies the adjustment process and greatly improves the efficiency of constant force adjustment.

[0089] The above is an embodiment of an adjustable fast constant force packaging bonding mechanism provided in the embodiment of the present application. The following is an embodiment of an adjustable fast constant force packaging bonding mechanism provided in the embodiment of the present application. For details, please refer to Figures 2 to 11 .

[0090] Based on the solution of the above embodiment 1:

[0091] Furthermore, if Figure 3 As shown, two cavities 12 are sequentially arranged in the mechanism body 1 along the first straight line direction; one end of the bonding head body 2 passes through one of the cavities 12 and extends into the other cavity 12; one of the cavities 12 is used to accommodate the linear positive stiffness structure 32; and the other cavity 12 is used to accommodate the negative stiffness structure 31.

[0092] like Figure 3As shown, the mechanism body 1 can be a square frame structure, with a partition beam arranged in the middle to divide the internal space into two cavities 12, the upper cavity 12 can be used to accommodate the negative stiffness structure 31, and the lower cavity 12 can be used to accommodate the linear positive stiffness structure 32.

[0093] Furthermore, if Figure 3 As shown, the through hole 11 is connected to another cavity 12, including a first hole section and a second hole section coaxially connected to the first hole section; the first hole section has a larger diameter than the second hole section and is used to accommodate the head of the threaded adjusting member; the second hole section is for the threaded section of the threaded adjusting member to pass through.

[0094] The countersunk hole design can hide the head of the threaded adjustment piece, making the overall structure more compact and more aesthetically pleasing.

[0095] Furthermore, if Figure 2 As shown, a mounting plate 7 is fixed on the mechanism body 1, and the mounting plate 7 can be detachably mounted on the front side of the mechanism body 1 by fasteners such as bolts, and there is no specific limitation.

[0096] Similarly, the slide mechanism 5 can be detachably mounted on the mounting plate 7 by fasteners such as bolts.

[0097] In addition, it should be noted that a pad is provided between the mounting plate 7 and the mechanism body 1 to ensure that the mounting plate will not contact the linear positive stiffness structure 32 and the negative stiffness structure 31, thereby avoiding friction that affects the use of the linear positive stiffness structure 32 and the negative stiffness structure 31.

[0098] Furthermore, if Figure 2 as well as Fig. 9 As shown, the connecting rod mechanism 6 includes two connecting rod assemblies; the guide heads 43 located on both sides of the bonding head body 2 are connected to the slide body 51 through the connecting rod assemblies in a one-to-one correspondence.

[0099] The connecting rod assembly includes a first connecting rod 61 and a second connecting rod 62; one end of the first connecting rod 61 is rotatably connected to the slide body 51, and the other end is rotatably connected to the guide head 43; one end of the second connecting rod 62 is rotatably connected to the first connecting rod, and is located between the two rotating ends of the first connecting rod 61; the other end of the second connecting rod 62 is rotatably connected to the constant force mechanism; the rotation center lines of one end of the two first connecting rods 61 are coaxial; the rotation center lines of the other ends of the two second connecting rods 62 are coaxial.

[0100] The rotationally connected ends of the first connecting rod 61 and the second connecting rod 62 are both rotationally connected via a rotation pair. Taking the mounting plate 7 as an example, the second connecting rod 62 is rotationally mounted on the mounting plate 7 .

[0101] Furthermore, with regard to the design of the slide mechanism 5 , it is designed for an existing slide module, such as a manual slide, and more specifically, it can be a manual screw slide, including a slide body 51 and a screw assembly 52 for adjusting the slide body 51 .

[0102] Further, with respect to the design of the flexible guide mechanism 4, Figure 2 as well as Fig. 9 As shown, it includes two guide fixing blocks 41 , at least one guide beam 42 and a guide head 43 .

[0103] Two guide fixing blocks 41 are fixed on the mechanism body 1 at intervals along the first straight line direction; at least one guide beam 42 is fixed between the two guide fixing blocks 41 along the first straight line direction; the guide head 43 is fixed on the guide beam 42; and the connecting block 44 connects the guide head 43 and the linear positive stiffness structure 32.

[0104] In the present application, the guide beams 42 are designed to be two, and the connecting block 44, the guide head 43 and the linear positive stiffness structure 32 can be detachably connected by fasteners such as bolts.

[0105] Furthermore, if Figure 3 As shown, the negative stiffness structure 31 may be an inclined beam structure, or other structures satisfying the negative stiffness characteristics.

[0106] The number of inclined beam structures of the present application can be designed and changed as needed. For example, two inclined beams are respectively arranged on both sides of the bonding head body 2, and one end of the inclined beam connected to the bonding head body 2 is relatively located below the other end of the inclined beam connection mechanism body 1.

[0107] Furthermore, if Figure 3 As shown, the linear positive stiffness structure 32 may be a broken line beam structure, or may be other structures satisfying the linear positive stiffness characteristics.

[0108] Furthermore, the mechanism body 1 is provided with a plurality of mounting holes 13. The mounting holes 13 may be bolt holes, through which the mechanism body 1 may be mounted on other devices to play a role of mounting and fixing.

[0109] The above is a detailed introduction to an adjustable fast constant force packaging bonding mechanism provided by the present application. For a general technician in this field, according to the ideas of the embodiments of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. An adjustable fast constant force packaging bonding mechanism, characterized in that: Including institutional entities (1); A bonding head body (2) is movably mounted in the mechanism body (1) along a first straight line direction; The bonding head body (2) extends out of the mechanism body (1) at one end of the first straight line direction; The bonding head body (2) is connected to the mechanism body (1) via negative stiffness structures (31) on both sides in a second straight line direction perpendicular to the first straight line direction; The bonding head body (2) is also connected to the flexible guide mechanism (4) on both sides in the second straight line direction via linear positive stiffness structures (32); The flexible guide mechanism (4) has a guide head (43) capable of displacement in a second linear direction; The guide head (43) is connected to the linear positive stiffness structure (32) via a connecting block (44); A slide mechanism (5) is installed on the mechanism body (1); The slide body (51) of the slide mechanism (5) is slidably adjustable along the first straight line direction; The slide body (51) is connected to the flexible guide mechanism (4) via a connecting rod mechanism (6), and is connected to the linear positive stiffness structure (32) via the connecting blocks (44) located on both sides of the bonding head body (2); The connecting rod mechanism (6) is used to convert the displacement of the slide body (51) in the first linear direction into the displacement of the guide head (43) in the second linear direction; The mechanism body (1) is provided with a through hole (11) along the first straight line direction; A threaded adjustment member is movably mounted on the through hole (11); The bonding head body (2) is provided with a threaded hole (21) at the other end of the first straight line direction for the threaded section of the threaded adjustment member to be inserted and threadedly engaged; The threaded adjustment member is used to adjust the displacement of the bonding head body (2) in the first straight line direction by rotating itself.

2. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: Two cavities (12) are sequentially arranged in the mechanism body (1) along a first straight line direction; One end of the bonding head body (2) passes through one of the cavities (12) and extends into the other cavity (12); One of the cavities (12) is used to accommodate the linear positive stiffness structure (32); The other cavity (12) is used to accommodate the negative stiffness structure (31).

3. The adjustable fast constant force packaging bonding mechanism according to claim 2, characterized in that: The through hole (11) is connected to another cavity (12), and comprises a first hole segment and a second hole segment coaxially connected to the first hole segment; The first hole section has a diameter larger than that of the second hole section and is used to accommodate the head of the threaded adjusting member; The second hole section is for the threaded section of the threaded adjusting member to pass through.

4. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: A mounting plate (7) is fixed on the mechanism body (1); The slide mechanism (5) is mounted on the mounting plate (7).

5. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: The connecting rod mechanism (6) comprises two connecting rod assemblies; The linear positive stiffness structures (32) located on both sides of the bonding head body (2) are connected to the slide table body (51) in a one-to-one correspondence via the connecting rod assembly; The connecting rod assembly comprises a first connecting rod (61) and a second connecting rod (62); One end of the first connecting rod (61) is rotatably connected to the slide body (51), and the other end is rotatably connected to the guide head (43); One end of the second connecting rod (62) is rotatably connected to the first connecting rod and is located between the two rotating ends of the first connecting rod (61); The other end of the second connecting rod (62) is rotatably connected to the constant force mechanism; The rotation center lines of one end of the two first connecting rods (61) are coaxial; The rotation center lines of the other ends of the two second connecting rods (62) are coaxial.

6. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: The slide mechanism (5) is a manual slide.

7. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: The flexible guide mechanism (4) comprises two guide fixing blocks (41), at least one guide beam (42) and a guide head (43); The two guide fixing blocks (41) are fixed on the mechanism body (1) at intervals along the first straight line direction; At least one guide beam (42) is fixed between the two guide fixing blocks (41) along the first straight line direction; The guide head (43) is fixed on the guide beam (42); The connecting block (44) connects the guide head (43) and the linear positive stiffness structure (32).

8. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: The negative stiffness structure (31) is an inclined beam structure.

9. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: The linear positive stiffness structure (32) is a broken line beam structure.

10. The adjustable fast constant force packaging bonding mechanism according to claim 1, characterized in that: A plurality of mounting holes (13) are provided on the mechanism body (1).

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