Chip packaging processing device and method

Abstract

The invention relates to the technical field of chip processing, in particular to a chip packaging processing device and method.The chip packaging processing device comprises a mounting frame, a driving mechanism, a limiting mechanism, a discharging mechanism, a dispensing mechanism, a packaging mechanism and a material taking mechanism; a conveying belt is movably arranged in the mounting frame; the output end of the driving mechanism is in transmission connection with the conveying belt and used for driving the conveying belt to move. The multiple sets of limiting mechanisms are arranged on the surface of the conveying belt at equal intervals. The number of the discharging mechanisms is two, and the two discharging mechanisms are used for discharging packaging substrates and chips correspondingly. The dispensing mechanism is arranged between the two groups of discharging mechanisms and is used for dispensing the packaging substrate; the packaging mechanism is arranged on the mounting rack and is used for packaging the chip; and the material taking mechanism is arranged on the mounting rack and is used for taking down the packaged chips from the conveying belt. Through cooperative arrangement of the limiting drum beating and the material taking mechanism, the whole packaging process is smoother.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing, and in particular to a chip packaging processing device and method. Background Art

[0002] An integrated circuit is a microelectronic device or component. Most semiconductor industry applications are based on silicon integrated circuits. An integrated circuit chip refers to a silicon wafer containing an integrated circuit. It is very small and is often part of a computer or other electronic device. An important process in the production of integrated circuit chips is packaging. The process of integrated circuit chip packaging mainly involves covering the placement points of the silicon wafer with thermally conductive epoxy resin on the surface of the substrate, then placing the silicon wafer directly on the surface of the substrate, and heat treating it until the silicon wafer is firmly fixed to the substrate. Then, wire bonding is used to directly establish an electrical connection between the silicon wafer and the substrate.

[0003] A Chinese patent with publication number CN114023661B discloses an integrated circuit chip packaging and processing device, including a workbench, a table plate and an auxiliary assembly mechanism. The workbench is placed on the ground, a table plate is arranged at the upper end of the workbench, and an auxiliary assembly mechanism is provided at the upper end of the table plate. The present invention adopts a design concept combining adjustment and guidance. The auxiliary assembly mechanism provided in the present invention can implement multi-directional clamping of substrates of different sizes, and the overall processing range of the device is expanded. At the same time, the auxiliary assembly mechanism can also play a guiding and limiting role in the placement of silicon wafers, thereby improving the packaging quality of the chip. The present invention can adjust the position of the limit plate through the cooperation between the inverted U-shaped plate and the dimension line thereon, the inverted L-shaped plate and the inverted U-shaped block, so as to ensure that the silicon wafer is directly connected with the placement point on the substrate under the guidance of the limit plate, thereby helping to improve the packaging quality of the chip.

[0004] However, the above technical solution has the following shortcomings: the mounting table utilizes a telescopic cylinder in conjunction with a one-way valve to give itself the function of negative pressure suction and fixing, and the packaging substrate can be directly fixed to the mounting table without the need for external circuits or air circuits to cooperate. However, in actual use, once the packaging substrate is adsorbed onto the mounting table by negative pressure, if the negative pressure environment is not destroyed, a large external force will be required to remove the packaging substrate from the mounting table. Summary of the invention

[0005] The purpose of the present invention is to provide a chip packaging processing device and method in view of the problems existing in the background technology.

[0006] The technical solution of the present invention is a chip packaging processing device, comprising:

[0007] A mounting frame, wherein a conveyor belt is movably arranged inside the mounting frame;

[0008] A driving mechanism is arranged on the mounting frame, and an output end of the driving mechanism is connected to the conveyor belt for driving the conveyor belt to move;

[0009] A plurality of limiting mechanisms are provided, and the limiting mechanisms are equidistantly arranged on the surface of the conveyor belt to limit and fix the packaging substrate;

[0010] Each set of limiting mechanisms includes an installation box, an adjustment component, a transmission component and a limiting component; the bottom of the installation box is fixedly connected to the conveyor belt through a connecting strip, the adjustment component is arranged in the installation box, the transmission components are arranged in two groups, one end of the transmission component is connected to the adjustment component by transmission, the limiting component is arranged in multiple groups and corresponds to the transmission component one by one, the limiting component is slidably arranged on the installation box, and one end of the limiting component is connected to the transmission component by transmission;

[0011] The unloading mechanism is provided with two groups, and the two groups of unloading mechanisms are used for unloading the packaging substrate and the chip respectively;

[0012] A glue dispensing mechanism, which is arranged between the two sets of unloading mechanisms and is used for dispensing glue on the packaging substrate;

[0013] A packaging mechanism, which is arranged on the mounting frame and is used to package the chip;

[0014] The material taking mechanism is arranged on the mounting frame and is used for taking the packaged chips off the conveyor belt.

[0015] Preferably, the driving mechanism includes an active roller, a driven roller and a driving motor; the active roller and the driven roller are both rotatably arranged in the mounting frame and are transmission-connected to the conveyor belt, and the driving mechanism includes an active roller, a driven roller and a driving motor; the output end of the driving motor is transmission-connected to the active roller.

[0016] Preferably, the adjustment assembly includes an installation shaft, a bevel gear ring, an adjusting worm wheel and an adjusting worm; the installation shaft is rotatably arranged in the installation box, the bevel gear ring is fixedly connected to the installation shaft, the adjusting worm wheel is fixedly connected to the installation shaft, one end of the adjusting worm is rotatably connected to the inner wall of the installation box, the other end of the adjusting worm passes through the installation box and extends to the outside of the installation box, and the adjusting worm wheel is adapted to the adjusting worm.

[0017] Preferably, each transmission assembly includes a transmission screw, a bevel gear, a threaded sleeve and a transmission block; one end of the transmission screw is rotatably connected to the inner wall of the mounting box, the bevel gear is fixedly connected to the other end of the transmission screw, the bevel gear and the bevel gear ring are meshed with each other, the threaded sleeve is threadedly connected to the transmission screw, the transmission block is fixedly connected to the threaded sleeve, and the transmission block passes through the mounting box and extends to the outside of the mounting box.

[0018] Preferably, the limit assembly includes a push rod, a limit plate, a limit spring and a follower plate; the push rod passes through the transmission block and is slidably connected to the transmission block, the limit plate is fixedly connected to one end of the push rod, the limit spring is sleeved on the surface of the push rod, one end of the limit spring is connected to the transmission block, the other end of the limit spring is connected to the limit plate, and the follower plate is fixedly connected to the other end of the push rod.

[0019] Preferably, the material picking mechanism includes a storage table, a support frame, a power assembly, a grabbing assembly and a trigger assembly; the storage table is fixedly connected to the mounting frame, the support frame is arranged on the mounting frame and the storage table, the power assembly is arranged on the support frame, the grabbing assembly is movably arranged on the support frame, the grabbing assembly is transmission-connected to the power assembly, the trigger assembly is arranged in multiple groups and corresponds one-to-one with the limit assemblies, and the trigger assembly is fixedly connected to the grabbing assembly.

[0020] Preferably, the power assembly includes a power motor, a rocker, a mounting rod and a linkage rod; the power motor is fixedly connected to the support frame, the rocker is fixedly connected to the output shaft of the power motor, the mounting rod is rotatably connected to the rocker, one end of the linkage rod is rotatably connected to the mounting rod, the other end of the linkage rod is rotatably connected to the support frame, and the linkage rod is arranged parallel to the rocker.

[0021] Preferably, the grabbing assembly includes a mounting plate, a limiting ring, a return spring and a suction cup; the mounting rod passes through the mounting plate and is slidably connected to the mounting plate, the limiting ring is fixedly connected to the mounting rod, one end of the return spring is fixedly connected to the limiting ring, the other end of the return spring is fixedly connected to the mounting plate, and the suction cup is fixedly connected to the mounting rod.

[0022] Preferably, each trigger assembly includes a fixed plate, a fixed block, a trigger block and an adjusting screw; the fixed plate is fixedly connected to the mounting plate, the fixed block is fixedly connected to the fixed plate, the trigger block is slidably connected to the fixed plate, the follower plate is provided with a trigger hole adapted to the trigger block, one end of the adjusting screw is rotatably connected to the trigger block, and the other end of the adjusting screw passes through the fixed block and is threadedly connected to the fixed block.

[0023] On the other hand, the present invention provides a chip packaging method, which uses the above chip packaging equipment and specifically includes the following steps:

[0024] S1. Before use, adjust the distance between the limit plates according to the size of the packaging substrate. Turn the adjusting worm to drive the adjusting worm wheel, the mounting shaft and the bevel gear ring to rotate together through meshing. The bevel gear ring rotates to drive the bevel gear and the transmission screw to rotate together through meshing. The transmission screw rotates to cooperate with the threaded sleeve. The threaded sleeve moves to drive the limit plates to move through the transmission block and the push rod. Adjust the distance between the limit plates to a suitable size. At the same time, turn the adjusting screw to adjust the trigger block to a suitable position.

[0025] S2. Repeat the above steps to adjust all the limit mechanisms on the conveyor belt;

[0026] S3, turn on the driving motor, feeding mechanism, glue dispensing mechanism, packaging mechanism and material taking mechanism through the control panel;

[0027] S4, the driving motor drives the conveyor belt to rotate through the active roller, and the rotation of the conveyor belt drives the limit mechanism to move;

[0028] S5, when the limiting mechanism moves to the unloading mechanism on the left, the unloading mechanism moves to place the package substrate on the limiting mechanism, the limiting mechanism with the package substrate continues to move to the position of the dispensing mechanism, the dispensing mechanism works to dispense glue on the package substrate, the package substrate after dispensing continues to move, the unloading mechanism on the right side moves to place the chip to be packaged on the package substrate, the limiting mechanism with the package substrate and the chip continues to move to the package mechanism for package curing, the packaged chip and the limiting mechanism continue to move to the material taking mechanism;

[0029] S6, the power motor drives the installation rod to move through the rocker, and the movement of the installation rod drives the suction cup to move onto the packaged chip. The installation plate drives the trigger block to move downward through the fixed plate and insert it into the trigger hole of the follower plate. During the process of the trigger block inserting into the trigger hole, the follower plate drives the limit plate to move through the ejector rod. The movement of the limit plate loses its limit effect on the chip, and the suction cup sucks up the packaged chip;

[0030] S7, the power motor rotates in the opposite direction to drive the mounting plate and the suction cup to move upward through the rocker and the mounting rod. Due to the action of the reset spring, the suction cup first moves upward with the mounting rod to leave the position of the limit plate, and then the mounting plate moves upward with the mounting rod to drive the trigger block to leave the trigger hole of the follower plate. The limit plate is reset under the action of the limit spring, and the power motor continues to rotate through the rocker, the mounting rod and the suction cup to drive the chip to move to the storage table, and the suction cup is ventilated to put the chip down.

[0031] Compared with the prior art, the above technical solution of the present invention has the following beneficial technical effects:

[0032] By equidistantly arranging multiple limit mechanisms on the conveyor belt, assembly line processing is facilitated, which is beneficial to improving the efficiency of packaging processing. The distance between the limit plates can be adjusted according to actual use requirements to meet the packaging processing of chips of different specifications. The limit plates limit and fix the packaging substrate under the action of the limit spring, and no external circuit or air path is required for cooperation. Through the setting of the material picking mechanism, when the packaged chip is taken down from the limit mechanism, the trigger component can first push the limit plate open, and then the grabbing component only needs a small suction force to suck up the packaged chip, and then the power component transfers the chip to the storage table, making the entire packaging process smoother. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1A perspective view of an embodiment of the present invention;

[0034] Figure 2 A three-dimensional diagram of a driving mechanism in an embodiment of the present invention;

[0035] Figure 3 A cross-sectional view of a limiting mechanism in an embodiment of the present invention;

[0036] Figure 4 A schematic diagram of the structure of an adjustment component in an embodiment of the present invention;

[0037] Figure 5 A schematic diagram of the structure of a transmission assembly in an embodiment of the present invention;

[0038] Figure 6 A structural schematic diagram of a material taking mechanism in an embodiment of the present invention;

[0039] Figure 7 A schematic diagram of the structure of a trigger component in an embodiment of the present invention.

[0040] Figure numerals: 1, mounting frame; 2, conveyor belt; 3, driving mechanism; 31, active roller; 32, driven roller; 33, driving motor; 4, limiting mechanism; 41, mounting box; 42, adjusting assembly; 421, mounting shaft; 422, bevel gear ring; 423, adjusting worm gear; 424, adjusting worm; 43, transmission assembly; 431, transmission screw; 432, bevel gear; 433, threaded sleeve; 434, transmission block; 44, limiting assembly; 441, ejector rod; 442, limiting plate; 443, limiting spring; 4 44. Follow-up plate; 5. Material picking mechanism; 51. Storage table; 52. Support frame; 53. Power assembly; 531. Power motor; 532. Rocker; 533. Mounting rod; 534. Linkage rod; 54. Grabbing assembly; 541. Mounting plate; 542. Limiting ring; 543. Reset spring; 544. Suction cup; 55. Trigger assembly; 551. Fixed plate; 552. Fixed block; 553. Trigger block; 554. Adjusting screw; 555. Trigger hole; 6. Material unloading mechanism; 7. Glue dispensing mechanism; 8. Packaging mechanism. DETAILED DESCRIPTION

[0041] Embodiment 1, as Figure 1 As shown, a chip packaging processing device proposed by the present invention includes a mounting frame 1, a driving mechanism 3, a limiting mechanism 4, a material unloading mechanism 6, a glue dispensing mechanism 7, a packaging mechanism 8 and a material taking mechanism 5;

[0042] A conveyor belt 2 is movably arranged inside the mounting frame 1;

[0043] The driving mechanism 3 is arranged on the mounting frame 1, and the output end of the driving mechanism 3 is drivingly connected with the conveyor belt 2 to drive the conveyor belt 2 to move;

[0044] There are multiple groups of limiting mechanisms 4, which are equidistantly arranged on the surface of the conveyor belt 2 to limit and fix the packaging substrate;

[0045] Each set of limiting mechanisms 4 includes an installation box 41, an adjustment component 42, a transmission component 43 and a limiting component 44; the bottom of the installation box 41 is fixedly connected to the conveyor belt 2 through a connecting strip, the adjustment component 42 is arranged in the installation box 41, and the transmission components 43 are arranged in groups of two, and two groups are arranged, one end of the transmission component 43 is transmission-connected to the adjustment component 42, and the limiting components 44 are arranged in multiple groups and correspond one to one with the transmission components 43, and the limiting components 44 are slidably arranged on the installation box 41, and one end of the limiting components 44 is transmission-connected to the transmission component 43.

[0046] There are two groups of unloading mechanisms 6, and the two groups of unloading mechanisms 6 are used for unloading packaging substrates and chips respectively;

[0047] The glue dispensing mechanism 7 is arranged between the two sets of unloading mechanisms 6 and is used for dispensing glue on the packaging substrate;

[0048] The packaging mechanism 8 is arranged on the mounting frame 1 and is used to package the chip;

[0049] The material taking mechanism 5 is arranged on the mounting frame 1 and is used to take the packaged chips off the conveyor belt 2 .

[0050] like Figure 2 As shown, the driving mechanism 3 includes an active roller 31, a driven roller 32 and a driving motor 33; the active roller 31 and the driven roller 32 are both rotatably arranged in the mounting frame 1 and are transmission-connected to the conveyor belt 2, and the driving mechanism 3 includes an active roller 31, a driven roller 32 and a driving motor 33; the output end of the driving motor 33 is transmission-connected to the active roller 31, and the driving motor 33 is a variable frequency motor, which is connected to the control system and the power supply through a wire.

[0051] like Figure 3-Figure 4 As shown, the adjustment component 42 includes an installation shaft 421, a bevel gear ring 422, an adjustment worm wheel 423 and an adjustment worm 424; the installation shaft 421 is rotatably set in the installation box 41, the bevel gear ring 422 is fixedly connected to the installation shaft 421, the adjustment worm wheel 423 is fixedly connected to the installation shaft 421, one end of the adjustment worm 424 is rotatably connected to the inner wall of the installation box 41, the other end of the adjustment worm 424 passes through the installation box 41 and extends to the outside of the installation box 41, and the adjustment worm wheel 423 is adapted to the adjustment worm 424.

[0052] like Figure 5As shown, each transmission assembly 43 includes a transmission screw 431, a bevel gear 432, a threaded sleeve 433 and a transmission block 434; one end of the transmission screw 431 is rotatably connected to the inner wall of the installation box 41, the bevel gear 432 is fixedly connected to the other end of the transmission screw 431, the bevel gear 432 and the bevel gear ring 422 are meshed with each other, the threaded sleeve 433 is threadedly connected to the transmission screw 431, the transmission block 434 is fixedly connected to the threaded sleeve 433, and the transmission block 434 passes through the installation box 41 and extends to the outside of the installation box 41.

[0053] like Figure 5 As shown, the limiting assembly 44 includes a push rod 441, a limiting plate 442, a limiting spring 443 and a follower plate 444; the push rod 441 passes through the transmission block 434 and is slidably connected to the transmission block 434, the limiting plate 442 is fixedly connected to one end of the push rod 441, the limiting spring 443 is sleeved on the surface of the push rod 441, one end of the limiting spring 443 is connected to the transmission block 434, the other end of the limiting spring 443 is connected to the limiting plate 442, and the follower plate 444 is fixedly connected to the other end of the push rod 441.

[0054] like Figure 6 As shown, the material picking mechanism 5 includes a storage table 51, a support frame 52, a power assembly 53, a grabbing assembly 54 and a trigger assembly 55; the storage table 51 is fixedly connected to the mounting frame 1, the support frame 52 is arranged on the mounting frame 1 and the storage table 51, the power assembly 53 is arranged on the support frame 52, the grabbing assembly 54 is movably arranged on the support frame 52, the grabbing assembly 54 is transmission-connected to the power assembly 53, the trigger assembly 55 is provided with multiple groups and corresponds one-to-one with the limit assembly 44, and the trigger assembly 55 is fixedly connected to the grabbing assembly 54.

[0055] like Figure 6 As shown, the power assembly 53 includes a power motor 531, a rocker 532, a mounting rod 533 and a linkage rod 534; the power motor 531 is fixedly connected to the support frame 52, the power motor 531 has the function of forward and reverse rotation, and is connected to the control system and the power supply through a wire, the rocker 532 is fixedly connected to the output shaft of the power motor 531, the mounting rod 533 is rotatably connected to the rocker 532, one end of the linkage rod 534 is rotatably connected to the mounting rod 533, the other end of the linkage rod 534 is rotatably connected to the support frame 52, and the linkage rod 534 is arranged parallel to the rocker 532.

[0056] like Figure 6As shown, the grabbing assembly 54 includes a mounting plate 541, a limiting ring 542, a return spring 543 and a suction cup 544; the mounting rod 533 passes through the mounting plate 541 and is slidably connected to the mounting plate 541, the limiting ring 542 is fixedly connected to the mounting rod 533, one end of the return spring 543 is fixedly connected to the limiting ring 542, the other end of the return spring 543 is fixedly connected to the mounting plate 541, the suction cup 544 is fixedly connected to the mounting rod 533, and the suction cup 544 is connected to a vacuum pump to provide negative pressure for the suction cup 544.

[0057] like Figure 7 As shown, each trigger assembly 55 includes a fixed plate 551, a fixed block 552, a trigger block 553 and an adjusting screw 554; the fixed plate 551 is fixedly connected to the mounting plate 541, the fixed block 552 is fixedly connected to the fixed plate 551, the trigger block 553 is slidably connected to the fixed plate 551, the follower plate 444 is provided with a trigger hole 555 adapted to the trigger block 553, one end of the adjusting screw 554 is rotatably connected to the trigger block 553, and the other end of the adjusting screw 554 passes through the fixed block 552 and is threadedly connected to the fixed block 552.

[0058] Embodiment 2, a chip packaging processing method proposed by the present invention, using the chip packaging processing equipment in embodiment 1, specifically comprises the following steps:

[0059] S1. Before use, adjust the distance between the limit plates 442 according to the size of the packaging substrate, rotate the adjustment worm 424 to drive the adjustment worm wheel 423, the installation shaft 421 and the bevel gear ring 422 to rotate together through meshing, the bevel gear ring 422 rotates to drive the bevel gear 432 and the transmission screw 431 to rotate together through meshing, the transmission screw 431 rotates to cooperate with the threaded sleeve 433, the threaded sleeve 433 moves through the transmission block 434 and the push rod 441 to drive the limit plates 442 to move, adjust the distance between the limit plates 442 to a suitable size, and at the same time rotate the adjustment screw 554 to adjust the trigger block 553 to a suitable position;

[0060] S2, repeat the above steps to adjust all the limiting mechanisms 4 on the conveyor belt 2;

[0061] S3, turning on the driving motor 33, the feeding mechanism 6, the glue dispensing mechanism 7, the packaging mechanism 8 and the material taking mechanism 5 through the control panel;

[0062] S4, the driving motor 33 drives the conveyor belt 2 to rotate through the active roller 31, and the rotation of the conveyor belt 2 drives the limiting mechanism 4 to move;

[0063] S5, when the limiting mechanism 4 moves to the unloading mechanism 6 on the left, the unloading mechanism 6 moves to place the packaging substrate on the limiting mechanism 4, the limiting mechanism 4 with the packaging substrate continues to move to the position of the glue dispensing mechanism 7, the glue dispensing mechanism 7 works to dispense glue on the packaging substrate, the packaging substrate after dispensing glue continues to move, the unloading mechanism 6 on the right side moves to place the chip to be packaged on the packaging substrate, the limiting mechanism 4 with the packaging substrate and the chip continues to move to the packaging mechanism 8 for packaging and curing, and the packaged chip and the limiting mechanism 4 continue to move to the material taking mechanism 5;

[0064] S6, the power motor 531 works to drive the installation rod 533 to move through the rocker 532, and the movement of the installation rod 533 drives the suction cup 544 to move onto the packaged chip, and the installation plate 541 drives the trigger block 553 to move downward through the fixing plate 551 and insert into the trigger hole 555 of the follower plate 444. During the process of the trigger block 553 inserting into the trigger hole 555, the follower plate 444 drives the limiting plate 442 to move through the ejector rod 441, and the movement of the limiting plate 442 loses its limiting effect on the chip, and the suction cup 544 sucks up the packaged chip;

[0065] S7, the power motor 531 rotates in the opposite direction to drive the mounting plate 541 and the suction cup 544 to move upward first through the rocker 532 and the mounting rod 533. Due to the action of the reset spring 543, the suction cup 544 first moves upward with the mounting rod 533 to disengage from the position of the limit plate 442, and then the mounting plate 541 moves upward together with the mounting rod 533 to drive the trigger block 553 to disengage from the trigger hole 555 of the follower plate 444. The limit plate 442 is reset under the action of the limit spring 443, and the power motor 531 continues to rotate through the rocker 532, the mounting rod 533 and the suction cup 544 to drive the chip to move above the storage table 51, and the suction cup 544 ventilates to place the chip on the storage table 51.

[0066] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited thereto, and various changes can be made within the knowledge scope of technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A chip packaging processing device, characterized in that: include: A mounting frame (1) having a conveyor belt (2) movably arranged inside the mounting frame; A driving mechanism (3) is arranged on the mounting frame (1), and an output end of the driving mechanism (3) is drivingly connected to the conveyor belt (2) to drive the conveyor belt (2) to move; A plurality of limiting mechanisms (4) are provided, and the limiting mechanisms (4) are equidistantly arranged on the surface of the conveyor belt (2) for limiting and fixing the packaging substrate; Each group of limiting mechanisms (4) comprises an installation box (41), an adjustment component (42), a transmission component (43) and a limiting component (44); the bottom of the installation box (41) is fixedly connected to the conveyor belt (2) through a connecting strip; the adjustment component (42) is arranged in the installation box (41); the transmission components (43) are arranged in groups of two and two, one end of the transmission component (43) is transmission-connected to the adjustment component (42); a plurality of limiting components (44) are arranged and correspond to the transmission components (43) one by one; the limiting components (44) are slidably arranged on the installation box (41); one end of the limiting components (44) is transmission-connected to the transmission component (43); A material unloading mechanism (6), which is provided with two groups, and the two groups of material unloading mechanisms (6) are used for unloading packaging substrates and chips respectively; A glue dispensing mechanism (7), which is arranged between the two sets of unloading mechanisms (6) and is used for dispensing glue on the packaging substrate; A packaging mechanism (8), which is arranged on the mounting frame (1) and is used to package the chip; A material taking mechanism (5) is arranged on the mounting frame (1) and is used for taking the packaged chips off the conveyor belt (2).

2. A chip packaging processing device according to claim 1, characterized in that: The driving mechanism (3) comprises an active roller (31), a driven roller (32) and a driving motor (33); the active roller (31) and the driven roller (32) are both rotatably arranged in the mounting frame (1) and are transmission-connected to the conveyor belt (2); the driving mechanism (3) comprises an active roller (31), a driven roller (32) and a driving motor (33); the output end of the driving motor (33) is transmission-connected to the active roller (31).

3. A chip packaging processing device according to claim 2, characterized in that: The adjusting assembly (42) comprises a mounting shaft (421), a bevel gear ring (422), an adjusting worm wheel (423) and an adjusting worm (424); the mounting shaft (421) is rotatably arranged in the mounting box (41); the bevel gear ring (422) is fixedly connected to the mounting shaft (421); the adjusting worm wheel (423) is fixedly connected to the mounting shaft (421); one end of the adjusting worm (424) is rotatably connected to the inner wall of the mounting box (41); the other end of the adjusting worm (424) passes through the mounting box (41) and extends to the outside of the mounting box (41); and the adjusting worm wheel (423) is matched with the adjusting worm (424).

4. The chip packaging processing device according to claim 3, characterized in that: Each transmission assembly (43) comprises a transmission screw (431), a bevel gear (432), a threaded sleeve (433) and a transmission block (434); one end of the transmission screw (431) is rotatably connected to the inner wall of the installation box (41), the bevel gear (432) is fixedly connected to the other end of the transmission screw (431), the bevel gear (432) and the bevel gear ring (422) are meshed with each other, the threaded sleeve (433) is threadedly connected to the transmission screw (431), the transmission block (434) is fixedly connected to the threaded sleeve (433), and the transmission block (434) passes through the installation box (41) and extends to the outside of the installation box (41).

5. The chip packaging processing device according to claim 4, characterized in that: The limiting assembly (44) comprises a push rod (441), a limiting plate (442), a limiting spring (443) and a follower plate (444); the push rod (441) passes through the transmission block (434) and is slidably connected to the transmission block (434); the limiting plate (442) is fixedly connected to one end of the push rod (441); the limiting spring (443) is sleeved on the surface of the push rod (441); one end of the limiting spring (443) is connected to the transmission block (434); the other end of the limiting spring (443) is connected to the limiting plate (442); and the follower plate (444) is fixedly connected to the other end of the push rod (441).

6. The chip packaging processing device according to claim 5, characterized in that: The material taking mechanism (5) comprises a storage platform (51), a support frame (52), a power assembly (53), a grab assembly (54) and a trigger assembly (55); the storage platform (51) is fixedly connected to the mounting frame (1), the support frame (52) is arranged on the mounting frame (1) and the storage platform (51), the power assembly (53) is arranged on the support frame (52), the grab assembly (54) is movably arranged on the support frame (52), the grab assembly (54) is transmission-connected to the power assembly (53), a plurality of trigger assemblies (55) are arranged and correspond to the limit assemblies (44) one by one, and the trigger assembly (55) is fixedly connected to the grab assembly (54).

7. The chip packaging processing device according to claim 6, characterized in that: The power assembly (53) comprises a power motor (531), a rocker (532), a mounting rod (533) and a linkage rod (534); the power motor (531) is fixedly connected to the support frame (52), the rocker (532) is fixedly connected to the output shaft of the power motor (531), the mounting rod (533) is rotatably connected to the rocker (532), one end of the linkage rod (534) is rotatably connected to the mounting rod (533), the other end of the linkage rod (534) is rotatably connected to the support frame (52), and the linkage rod (534) and the rocker (532) are arranged in parallel.

8. A chip packaging processing device and method according to claim 7, characterized in that: The grabbing assembly (54) comprises a mounting plate (541), a limiting ring (542), a return spring (543) and a suction cup (544); the mounting rod (533) passes through the mounting plate (541) and is slidably connected to the mounting plate (541); the limiting ring (542) is fixedly connected to the mounting rod (533); one end of the return spring (543) is fixedly connected to the limiting ring (542); the other end of the return spring (543) is fixedly connected to the mounting plate (541); and the suction cup (544) is fixedly connected to the mounting rod (533).

9. The chip packaging processing device according to claim 8, characterized in that: Each trigger assembly (55) comprises a fixed plate (551), a fixed block (552), a trigger block (553) and an adjusting screw rod (554); the fixed plate (551) is fixedly connected to the mounting plate (541), the fixed block (552) is fixedly connected to the fixed plate (551), the trigger block (553) is slidably connected to the fixed plate (551), the follower plate (444) is provided with a trigger hole (555) adapted to the trigger block (553), one end of the adjusting screw rod (554) is rotatably connected to the trigger block (553), and the other end of the adjusting screw rod (554) passes through the fixed block (552) and is threadedly connected to the fixed block (552).

10. A chip packaging method, using the chip packaging equipment according to any one of claims 1 to 9, characterized in that: The specific steps include: S1. Before use, the distance between the limit plates (442) is adjusted according to the size of the packaging substrate, the adjustment worm (424) is rotated to drive the adjustment worm wheel (423), the installation shaft (421) and the bevel gear ring (422) to rotate together through meshing action, the bevel gear ring (422) rotates to drive the bevel gear (432) and the transmission screw (431) to rotate together through meshing action, the transmission screw (431) rotates to cooperate with the threaded sleeve (433), the threaded sleeve (433) moves through the transmission block (434) and the push rod (441) to drive the limit plates (442) to move, and the distance between the limit plates (442) is adjusted to a suitable size, and at the same time, the adjustment screw (554) is rotated to adjust the trigger block (553) to a suitable position; S2. Repeat the above steps to adjust all the limit mechanisms (4) on the conveyor belt (2); S3, turning on the driving motor (33), the material discharging mechanism (6), the glue dispensing mechanism (7), the packaging mechanism (8) and the material taking mechanism (5) through the control panel; S4, the driving motor (33) works to drive the conveyor belt (2) to rotate through the active roller (31), and the rotation of the conveyor belt (2) drives the limiting mechanism (4) to move; S5, when the limiting mechanism (4) moves to the unloading mechanism (6) on the left, the unloading mechanism (6) moves to place the packaging substrate on the limiting mechanism (4), the limiting mechanism (4) with the packaging substrate continues to move to the position of the glue dispensing mechanism (7), the glue dispensing mechanism (7) works to dispense glue on the packaging substrate, the packaging substrate after dispensing glue continues to move, the unloading mechanism (6) on the right moves to place the chip to be packaged on the packaging substrate, the limiting mechanism (4) with the packaging substrate and the chip continues to move to the packaging mechanism (8) for packaging and curing, and the packaged chip and the limiting mechanism (4) continue to move to the material taking mechanism (5); S6, the power motor (531) works to drive the installation rod (533) to move through the rocker (532), and the movement of the installation rod (533) drives the suction cup (544) to move onto the packaged chip, and the installation plate (541) drives the trigger block (553) to move downward through the fixing plate (551) and insert into the trigger hole (555) of the follower plate (444). During the process of the trigger block (553) inserting into the trigger hole (555), the follower plate (444) drives the limit plate (442) to move through the ejector rod (441), and the limit plate (442) loses its limit function on the chip due to the movement, and the suction cup (544) sucks up the packaged chip; S7, the power motor (531) rotates in the opposite direction to drive the mounting plate (541) and the suction cup (544) to move upward first through the rocker (532) and the mounting rod (533). Due to the action of the reset spring (543), the suction cup (544) first moves upward with the mounting rod (533) to disengage from the position of the limit plate (442). Then, the mounting plate (541) moves upward together with the mounting rod (533) to drive the trigger block (553) to disengage from the trigger hole (555) of the follower plate (444). The limit plate (442) is reset under the action of the limit spring (443). The power motor (531) continues to rotate through the rocker (532), the mounting rod (533) and the suction cup (544) to drive the chip to move onto the storage table (51). The suction cup (544) is ventilated to put the chip down.

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