Closing unit of rectifying element module

Abstract

The invention provides a closing unit of a rectifying element module, which can suppress adverse effects on the rectifying element module forming a rectifying circuit. The closing unit (100) of the rectifying element module is provided with: the rectifying element module (10) having a rectifying element; a plate-shaped first substrate (20) having a first surface (21) on which the rectifying element module (10) is disposed and a first rear surface (22); a plate-shaped second substrate (30) having a second surface (31) and a second back surface (32), the second substrate (30) being disposed with respect to the first substrate (20) such that the second surface (31) faces the first surface (21); and a side wall section (40) that, by covering a laterally open region between the first substrate (20) and the second substrate (30), forms, together with the first substrate (20) and the second substrate (30), a closed space (Sp) in which the rectifying element module (10) is disposed.

Description

Technical Field

[0001] The invention relates to a closed unit of a rectifying element module. Background Art

[0002] The power conversion device, for example, includes a primary side circuit that receives an input voltage, a secondary side circuit that outputs an output voltage, and a transformer that magnetically connects the primary side circuit and the secondary side circuit. A rectifier circuit that rectifies the voltage waveform generated in the secondary side winding of the transformer is provided in the secondary side circuit. Patent document 1 discloses a power conversion device, which is provided with a switching element as a primary side circuit, a rectifier circuit as a secondary side circuit, an input capacitor on the primary side, an output capacitor on the secondary side, and various control circuits on the surface of a multilayer substrate. In addition, a pattern coil is formed on the substrate by a copper foil pattern, etc., and a transformer is formed by the pattern coil and a magnetic core. A cooler for cooling the heat generated by the rectifier circuit, etc. is provided on the back of the substrate.

[0003] A heat dissipation pattern is formed on such a substrate, and the heat transferred in the planar direction between various components and pattern coils is dissipated by the cooler via the heat dissipation pattern. Therefore, thermal interference between various components on the substrate is suppressed, various components can be arranged close to each other, and the area of ​​the substrate can be reduced. Prior art literature Patent Literature

[0004] Patent Document 1: International Publication No. 2018 / 105465 Summary of the invention Problems to be solved by the invention

[0005] However, in the configuration of Patent Document 1, the substrate is exposed in a state where a rectifier circuit and the like are arranged. Therefore, depending on the dust, humidity, chemical liquid atmosphere and other pollution conditions in the exposed space, dust may adhere to the rectifier circuit and wiring and other components on the substrate, and the components may be corroded. Therefore, adverse effects such as malfunction, damage, and shortened life of the rectifier circuit may occur. Therefore, it is required to suppress adverse effects on the rectifier element module constituting the rectifier circuit.

[0006] Therefore, a main object of the present invention is to provide a sealing unit for a rectifier element module that can suppress adverse effects on the rectifier element module constituting a rectifier circuit. Technical solutions to solve problems

[0007] The enclosed unit of the rectifier element module involved in the present invention comprises: a rectifier element module, which has a rectifier element; a first substrate, which is plate-shaped, has a first surface and a first back surface, and the rectifier element module is arranged on the first surface; a second substrate, which is plate-shaped, has a second surface and a second back surface, and is arranged relative to the first substrate in a manner that the second surface is opposite to the first surface; and a side wall portion, which, by covering the area between the first substrate and the second substrate that is open to the side, forms a closed space with the rectifier element module arranged inside together with the first substrate and the second substrate.

[0008] According to the above configuration, it is possible to provide a sealing unit for a rectifier element module that can suppress adverse effects on the rectifier element module constituting the rectifier circuit. Effects of the Invention

[0009] According to the present invention, it is possible to provide a sealing unit for a rectifier element module that can suppress adverse effects on the rectifier element module constituting a rectifier circuit.

[0010] The above-mentioned object, other objects, features and advantages of the present invention will become more apparent from the following description of specific embodiments with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a top view of a closed cell of a rectifier circuit according to an embodiment of the present invention. Figure 2 yes Figure 1 A top view with the upper second substrate removed. Figure 3 yes Figure 1 Sectional view along line III-III. Figure 4 This is a circuit diagram of a power conversion device having a synchronous rectification circuit. Figure 5 (a) is a top perspective view of the rectifier element module, and (b) is a rear perspective view of (a). Figure 6 It is shown Figure 1 Current path diagram of the flow of current in a closed unit of a rectifier element module. Figure 7 It is a plan view of a state where the second substrate on the upper portion of the closing unit of the rectifier circuit according to another embodiment of the present invention is removed. Figure 8 is a rectifier circuit according to another embodiment of the present invention, which is equivalent to Figure 1 A sectional view of the line III-III. DETAILED DESCRIPTION

[0012] 1. Implementation Method (1) Structure of the closed unit of the rectifier element module Hereinafter, the configuration of the enclosing unit 100 of the rectifying element module according to the embodiment of the present invention will be described with reference to the drawings. Figure 1 It is a top view of a closed cell of a rectifier circuit according to an embodiment of the present invention. Figure 2 yes Figure 1 A top view with the upper second substrate removed. Figure 3 yes Figure 1 Sectional view along line III-III.

[0013] The closed unit 100 of the rectifier element module includes at least one rectifier element module 10, a first substrate 20, a second substrate 30, and a side wall 40. Each rectifier element module 10 has a rectifier element having a switching function and generating a rectified output voltage. In the present embodiment, the plurality of rectifier element modules 10 are divided into two first groups and a second group that are opposite to each other in the x direction via a first wiring board 51 described later. The first group includes a plurality of rectifier element modules 10a, and the second group includes a plurality of rectifier element modules 10b. The first substrate 20 is plate-shaped and has a first surface 21 and a first back surface 22. The rectifier element module 10 is arranged on the first surface 21. The second substrate 30 is plate-shaped and has a second surface 31 and a second back surface 32. The second substrate 30 is arranged relative to the first substrate 20 in such a manner that the second surface 31 faces the first surface 21. The side wall 40 covers the area between the first substrate 20 and the second substrate 30 that is open to the side. Thus, a closed space Sp in which the rectifying device module 10 is arranged is formed by the space surrounded by the first substrate 20, the second substrate 30 and the side wall 40. The closed space Sp is a closed space isolated from the external space other than the space surrounded by the first substrate 20, the second substrate 30 and the side wall 40.

[0014] The closed unit 100 of the rectifier element module further includes a first wiring board 51, a second wiring board 52, a cooling unit 60, an insulating heat sink 65, and a connector 70. The cooling unit 60 is arranged below the first substrate 20 to cool the first substrate 20. The first wiring board 51 and the insulating heat sink 65 are arranged between the first substrate 20 and the cooling unit 60. The first wiring board 51 electrically connects the first substrate 20 and the cooling unit 60. The insulating heat sink 65 electrically insulates a predetermined portion of the first substrate 20 from the cooling unit 60, and transfers the heat of the first substrate 20 to the cooling unit 60 for heat dissipation. The second wiring board 52 electrically connects at least one of the elements on the second substrate 30 and the external circuit to the rectifier element module 10. The connector 70 electrically connects the first substrate 20 and the second substrate 30.

[0015] Here, in Figure 1 to Figure 3In the above, the direction in which the plurality of rectifying element modules 10a face each other across the first wiring board 51 is defined as the x direction. In addition, the direction in which the plurality of rectifying element modules 10 are arranged in each of the first group and the second group of rectifying element modules 10 is defined as the y direction. Figure 1 to Figure 3 In the above description, the y direction is also the direction in which the first wiring board 51 extends between the plurality of rectifier element modules 10a and the plurality of rectifier element modules 10a. The direction orthogonal to the x direction and the y direction is set as the z direction, which is sometimes referred to as the vertical direction, up, and down. In addition, the plane parallel to the xy plane is referred to as the horizontal plane. In the present embodiment, the first substrate 20 and the second substrate 30 are along the horizontal plane. The following describes each part.

[0016] The rectifying element module 10 has rectifying elements for generating a rectified output voltage therein. The rectifying elements constitute a synchronous rectifying circuit. Such a synchronous rectifying circuit is used in the power conversion device 1. Figure 4 This is a circuit diagram of a power conversion device having a synchronous rectification circuit.

[0017] There are many types of power conversion devices using synchronous rectification circuits. As an example, a midpoint tap power conversion device 1 is taken as an example for explanation. Figure 3 As shown, the power conversion device 1 includes a transformer 2, a primary side circuit 3, and a secondary side circuit 4. The primary side circuit 3 generates an AC voltage from a DC voltage and supplies the AC voltage to the primary side winding 2b of the transformer 2. A magnetic field is generated by the flow of current in the primary side winding 2b, and a current is induced in the secondary side windings 2c and 2d of the transformer 2 by electromagnetic induction of the magnetic field. As a result, an output voltage corresponding to the winding ratio is obtained from the secondary side windings 2c and 2d.

[0018] The transformer 2 has a core 2a, a primary winding 2b, and secondary windings 2c and 2d. The primary winding 2b is wound on the core 2a from the primary winding start end 2b1 to the primary winding end end 2b2. The secondary windings 2c and 2d are wound on the core 2a and have a first partial winding 2c and a second partial winding 2d. The first partial winding 2c is wound on the core 2a from the first partial winding start end 2c1 to the first partial winding end end 2c2. The second partial winding 2d is wound on the core 2a from the second partial winding start end 2d1 to the second partial winding end end 2d2. In addition, the first partial winding end end 2c2 is connected to the second partial winding start end 2d1 in a manner that the first partial winding 2c and the second partial winding 2d are connected in series. The first partial winding start end 2c1 and the second partial winding end end 2d2 are connected to the secondary side output (-) line Vout(-) via the secondary side circuit 4. The connection between the first winding end 2c2 and the second winding start 2d1 is connected to the secondary output (+) line Vout(+). The output voltage induced in the first winding 2c and the second winding 2d is output from the secondary output (+) line Vout(+).

[0019] The primary side circuit 3 is not limited as long as it can receive the input of the DC voltage from the primary side input (+) line Vin(+) and the primary side input (-) line Vin(-) and generate the AC voltage from the DC voltage. For example, the primary side circuit 3 has a plurality of transistors that receive the DC voltage from the primary side input (+) line Vin(+) and the primary side input (-) line Vin(-). By switching the plurality of transistors, the primary side circuit 3 can generate the AC voltage from the DC voltage.

[0020] The secondary side circuit 4 rectifies the output voltage induced in the secondary side windings 2c and 2d. The secondary side circuit 4 has first and second transistors Q1 and Q2 (an example of a rectifying element). The first transistor Q1 has a first gate terminal G1, a first source terminal S1, and a first drain terminal D1. In addition, the second transistor Q2 has a second gate terminal G2, a second source terminal S2, and a second drain terminal D2. The first gate signal g1 is input to the first gate terminal G1, and the second gate signal g2 is input to the second gate terminal G2. In addition, the first and second drain terminals D1 and D2 are connected to the secondary side windings 2c and 2d. Specifically, the first drain terminal D1 is connected to the second partial winding end 2d2, and the second drain terminal D2 is connected to the first partial winding start end 2c1. The first and second source terminals S1 and S2 are commonly connected to the secondary side output (-) line Vout(-).

[0021] In such a secondary side circuit 4, the first and second transistors Q1 and Q2 perform switching operations based on the voltage difference applied to the first and second gate terminals G1 and G2, the first and second source terminals S1 and S2, and the first and second drain terminals D1 and D2. Figure 3 In the example of , the first and second transistors Q1 and Q2 are alternately turned on and off. As a result, the output voltage from the first partial winding 2c and the output voltage from the second partial winding 2d are alternately output from the secondary side output (+) line Vout(+), and as a result, the rectified output voltage is output from the secondary side output (+) line Vout(+). In this embodiment, the first and second transistors Q1 and Q2 constitute a synchronous rectification circuit 4a.

[0022] In addition, the secondary side circuit 4 may include a rectification-related circuit such as a smoothing circuit in addition to the synchronous rectification circuit 4 a .

[0023] In this embodiment, the transistor is, for example, a MOSFET transistor (Metal Oxide Semiconductor Field Effect Transistor). However, an IGBT (Insulated Gate Bipolar Transistor) or the like may be used instead of the MOSFET transistor.

[0024] Furthermore, in the present embodiment, the transistor is preferably a power transistor, and preferably can handle a large current of at least 500A or more.

[0025] Next, a rectifier element module 10 including first and second transistors Q1 and Q2 (an example of a rectifier element) will be described. Figure 5 , (a) is a top perspective view of the rectifier element module, and (b) is a rear perspective view of (a).

[0026] like Figure 5 As shown, the rectifier element module 10 has an element body 11, a first lead terminal 12, and a second module terminal 13. The element body 11 is internally configured with a transistor (a first transistor Q1 or a second transistor Q2), and is formed by sealing the transistor with a resin. The element body 11 has an element body back 11a, an element body front 11b, and an element body side 11c. The element body 11 is substantially in the shape of a rectangular parallelepiped in this embodiment, the element body back 11a is the back of the element body 11, the element body front 11b is the front of the element body 11 opposite to the element body back 11a, and the element body side 11c is the side other than the element body back 11a and the element body front 11b.

[0027] Hereinafter, the rectifying element module 10 will be described assuming that the first transistor Q1 is arranged inside the element body 11 .

[0028] In the present embodiment, the first lead terminal 12 extends from the element body 11. The first lead terminal 12 is formed of a conductive material, for example, a metal mainly composed of copper. The first lead terminal 12 has, for example, 6 pins 12a to 12f, each having a gate pin 12a, pins 12b to 12e, and a first module terminal 12f. The 6 pins 12a to 12f extend from the side surface 11c of the element body along the back surface 11a of the element body and are arranged in sequence. The first module terminal 12f is electrically connected to the first source terminal S1. The gate pin 12a is electrically connected to the first gate terminal G1. The gate pin 12a and the first module terminal 12f extend from one side of the side surface 11c of the element body to the outside of the element body 11 and extend toward the back surface 11a of the element body. Although not limited to this, in the present embodiment, the gate lead 12a and the first module terminal 12f have a portion extending from the element body side surface 11c along the element body back surface 11a, and a portion bent or curved from the front end of the portion and extending toward the element body back surface 11a side. In addition, one side of the element body side surface 11c from which the gate lead 12a and the first module terminal 12f are led out is a side opposite to the side on which a part of the second module terminal 13 protrudes from the element body 11. That is, the direction in which the first lead terminal 12 extends from the element body 11 is opposite to the direction in which the second module terminal 13 protrudes from the element body 11.

[0029] The second module terminal 13 is electrically connected to the first drain terminal D1. At least a portion of the second module terminal 13 is arranged in contact with the back surface 11a of the element body. In the present embodiment, the second module terminal 13 is in the shape of a plate extending along the back surface 11a of the element body, and a portion of the second module terminal 13 is arranged in surface contact with the back surface 11a of the element body. The second module terminal 13 is arranged to be coplanar with the back surface 11a of the element body. In addition, the remaining portion of the second module terminal 13 that is not in contact with the back surface 11a of the element body extends from one side of the element body side surface 11c toward the opposite side to the direction in which the first module terminal 12f extends from the element body 11, while extending to the outside of the element body 11 along the back surface 11a of the element body. Such a second module terminal 13 is formed of a conductive material, for example, a metal mainly composed of copper.

[0030] In the above-mentioned rectifier element module 10, the first module terminal 12f extends to the outside of the element body 11 and extends to the back side 11a of the element body, and at least a part of the second module terminal 13 is arranged in contact with the back side 11a of the element body. The above-mentioned rectifier element module 10 is, for example, a surface mounting component in which the state is a standard state. Therefore, the rectifier element module 10 can be mounted on the first substrate 20 in the standard state without requiring additional work other than the usual mounting.

[0031] like Figure 1 to Figure 3As shown, the first substrate 20 is used to configure the rectifier element module 10. The first substrate 20 is formed in a plate shape and has a first surface 21 and a first back surface 22. The first substrate 20 is arranged along the arrangement surface 61 of the cooling unit 60. Here, the first substrate 20 is arranged along a horizontal plane, and the first surface 21 and the first back surface 22 are along the horizontal plane. The rectifier element module 10 is arranged on the first surface 21 side of the first substrate 20. Figure 1 to Figure 3 In the example of FIG. 2 , a first group including a plurality of rectifier element modules 10a and a second group including a plurality of rectifier element modules 10b are arranged on the first substrate 20 in an opposing manner with the center portion of the first substrate 20 in the x direction as the center. On the first surface 21, a first connector 71 is arranged between the rectifier element module 10a and the rectifier element module 10b.

[0032] In each rectifier element module 10, the first module terminal 12f is mounted on the first substrate 20 at a tip extending from the element body side surface 11c of the element body 11 along the element body back surface 11a and toward the element body back surface 11a side. In the present embodiment, the first module terminal 12f is mounted on the first substrate 20 extending from the element body side surface 11c in the x direction and extending downward in the z direction. Furthermore, the first module terminal 12f is electrically connected to the first wiring board 51 via a through member not shown. The through member is composed of a conductive member that penetrates the first substrate 20 in the thickness direction (z direction) from the first surface 21 to the first back surface 22. In addition, the gate pin 12a is mounted on the first substrate 20 at a tip extending along the element body back surface 11a and toward the element body back surface 11a side, similarly to the first module terminal 12f. The gate pin 12a is electrically connected to a gate signal circuit not shown, for example, via wiring (not shown) on the first substrate 20, and receives supply of the first gate signal g1.

[0033] The element body 11 and the second module terminals 13 are in contact with each other along the first surface 21. The second module terminals 13 and the second wiring board 52 are electrically connected.

[0034] A rectifier element module 10 is arranged on the first surface 21 of the first substrate 20 as a first substrate side component. The first substrate side components are not limited to the rectifier element module 10, and various electronic components other than the rectifier element module 10, wiring other than the wiring for the rectifier element module 10, etc. can be cited. As first substrate side components other than the rectifier element module 10, for example, electronic components that will not be adversely affected by malfunction, damage, etc. due to the heat generated by the rectifier element module 10 can be cited. As first substrate side components other than the rectifier element module 10, for example, chip ceramic capacitors for smoothing and anti-noise of power supplies, chip resistors for gate resistors, etc., various connectors for wiring connections for input and output of gate signals, power supplies, etc. can be cited.

[0035] The second substrate 30 is arranged opposite to the first substrate 20 in a state where the second surface 31 of the second substrate 30 faces the first surface 21 of the first substrate. The second substrate 30 is formed in a plate shape and has a second surface 31 and a second back surface 32. The second substrate 30 is arranged along the first substrate 20. Here, the second substrate 30 is arranged along a horizontal plane, and the second surface 31 and the second back surface 32 are along the horizontal plane. A second substrate side component 35 is arranged on the second surface 31 of the second substrate 30. The second substrate side component 35 can constitute the secondary side circuit 4 together with the rectifier element module 10 of the first substrate, for example. The first substrate 20 and the second substrate 30 are electrically connected via, for example, a connector 70, and the first substrate side component including the rectifier element module 10 is electrically connected to the second substrate side component 35. In addition, on the second surface 31, a second connector 72 is arranged corresponding to the first connector 71. The first connector 71 and the second connector 72 are combined to constitute the connector 70, and the first substrate 20 and the second substrate 30 are electrically connected.

[0036] In addition, second substrate side parts 35 and wirings, etc., which may be adversely affected by malfunction, destruction, etc. due to the heat of the rectifier element module 10, are preferably arranged on the second surface 31 of the second substrate 30. For example, as the second substrate side parts 35 arranged on the second surface 31, chip ceramic capacitors for power smoothing and noise reduction, etc., electrolytic capacitors for power smoothing and reverse bias circuits, etc., various connectors for wiring connection for input and output of gate signals, abnormal signals, power supplies, etc., high-speed diodes (FRD) as protection circuits, Zener diodes as protection circuits and constant voltage sources, photocouplers for gate signal transmission, drive circuits for gate signal transmission, chip resistors such as gate resistors, etc., etc. can be cited.

[0037] As the first substrate 20, a relatively cheap resin substrate such as glass epoxy resin, a ceramic substrate, etc. can be used. In addition, the first substrate 20 can use a relatively thin substrate with a thickness of, for example, 1.6 mm or more and 2.0 mm or less. As the second substrate 30, a relatively cheap resin substrate such as glass epoxy resin can be used. In addition, the second substrate 30 can use a relatively thin substrate with a thickness of, for example, 1.6 mm or more and 2.0 mm or less.

[0038] The side wall portion 40 covers the area between the first substrate 20 and the second substrate 30 which are arranged horizontally and face each other and are open to the side. The side wall portion 40 is plate-shaped and is arranged vertically relative to the first substrate 20 and the second substrate 30. The side wall portion 40 is formed of an insulating member, for example. Figure 3In the example of FIG. 1 , the side wall portion 40 extends from the cooling portion 60 in the z direction at positions corresponding to both edges of the first substrate 20 and the second substrate 30. A closed space Sp is formed by a space surrounded by the first substrate 20, the second substrate 30, and the side wall portion 40. The first surface 21 of the first substrate 20, the second surface 31 of the second substrate 30, the rectifier element module 10, a portion of the second wiring board 52, and the like are located in the closed space Sp.

[0039] In addition, Figure 3 In the closed space Sp, the configuration surface 61 of the cooling unit 60 to the second surface 31 of the second substrate 30 may also be included. Therefore, the first substrate 20, the second surface 31 of the second substrate 30, the configuration surface 61 of the cooling unit 60, the rectifier element module 10, the first wiring board 51, a part of the second wiring board 52, and the insulating heat sink 65 may be located in the closed space Sp.

[0040] The first wiring board 51 is disposed between the first substrate 20 and the cooling unit 60 so as to be in contact with the first rear surface 22 of the first substrate 20 and the arrangement surface 61 of the cooling unit 60. Figure 2 , Figure 3 In the example of , the first wiring board 51 is plate-shaped, extends with the longitudinal direction set to the y direction, and is formed of a conductive material such as Cu and Al. The first group of rectifier element modules 10a and the second group of rectifier element modules 10b are arranged opposite to each other on the first substrate 20 via the first wiring board 51 extending in the y direction. In addition, each first lead terminal 12 of the plurality of rectifier element modules 10a and each first lead terminal 12 of the plurality of rectifier element modules 10b are opposite to each other with the center portion of the x direction of the first substrate 20 as the center. In this case, the first module terminal 12f of the first group of rectifier element modules 10a and the first module terminal 12f of the second group of rectifier element modules 10b are opposite to each other via the first wiring board 51. In addition, the first module terminal 12f of the rectifier element module 10a extends toward the first wiring board 51 and penetrates the first substrate 20 via a through component to be connected to the first wiring board 51. Similarly, the first module terminal 12f of the rectifying element module 10b extends toward the first wiring board 51 and penetrates the first substrate 20 via a through member to be connected to the first wiring board 51. The first wiring board 51 connects the first module terminal 12f of the rectifying element module 10 to the secondary side output (-) line Vout(-) via the cooling unit 60, for example.

[0041] The second wiring board 52 is disposed on the first surface 21 of the first substrate 20 and extends to the outside of the closed unit 100 of the rectifier element module. Figure 2 , Figure 3In the example of , the second wiring board 52 includes a second wiring board 52 corresponding to the first group of rectifier element modules 10a, and a second wiring board 52 corresponding to the second group of rectifier element modules 10b. Each second wiring board 52 is arranged to be opposite to the center in the x direction. Each second wiring board 52 is in the shape of a plate bent on the xz plane and extends in the y direction. The second wiring board 52 is formed of a conductive material such as Cu and Al. One side of the bent portion of the second wiring board 52 is arranged on the first surface 21 of the first substrate 20, and the other side of the bent portion of the second wiring board 52 is arranged along the side wall portion 40. In addition, the second wiring board 52 extends upward along the side wall portion 40 and extends to the outside of the closed unit 100 of the rectifier element module. The second wiring board 52 is electrically connected to the second module terminal 13 of the rectifier element module 10 of the first substrate 20. Each second wiring board 52, for example, connects the second module terminal 13 of the rectifier element module 10 to the secondary side output (+) line Vout(+).

[0042] Alternatively, the first wiring board 51 may electrically connect the first module terminal 12f to the secondary output (+) line Vout(+), and the second wiring board 52 may electrically connect the second module terminal 13 to the secondary output (−) line Vout(−).

[0043] The cooling unit 60 cools at least the first substrate 20. The cooling unit 60 is formed of a conductive member such as Cu or Al. Figure 3 In the example of , the cooling unit 60 has a configuration surface 61 which is the upper surface of the cooling unit 60 and is a horizontal surface. On the cooling unit 60, the first wiring board 51 and the insulating heat sink 65 are configured on the configuration surface 61. In addition, on the cooling unit 60, the first substrate 20 is configured via the first wiring board 51 and the insulating heat sink 65. The insulating heat sink 65 is divided into two. The insulating heat sink 65 on one side is configured on the cooling unit 60 corresponding to the first substrate 20 where the first group of rectifier element modules 10a are configured. The insulating heat sink 65 on the other side is configured on the cooling unit 60 corresponding to the first substrate 20 where the second group of rectifier element modules 10b are configured. Thus, the first group of rectifier element modules 10a and the second group of rectifier element modules 10b can be insulated and the heat of the first substrate 20 and the rectifier element modules 10 can be dissipated. In addition, the insulating heat sink 65 can also be configured corresponding to any one of the first group of rectifier element modules 10a and the second group of rectifier element modules 10b.

[0044] When the rectifier element module 10 has the first transistor Q1, the cooling unit 60 mainly cools the heat generated by the first current passing through the first source terminal S1 and the second current passing through the second drain terminal D1. In the rectifier element module 10, a large first current and a second current flow, so the heat generated by the first current and the second current is also large. The heat generated by the first current and the second current can be considered to be generated in the rectifier element module 10, and in the first substrate 20 through which the first current and the second current pass. The cooling unit 60 can cool the heat generated by the first substrate 20 and the rectifier element module 10 caused by the first current and the second current.

[0045] The cooling unit 60 is not limited in structure as long as it can cool the first substrate 20 and the rectifying element module 10. The cooling unit 60 may be, for example, a water-cooled heat sink composed of one or more fins and a conduit through which a liquid such as water can flow, or an air-cooled heat sink composed of one or more fins that can dissipate heat.

[0046] In the above description, the case where the first transistor Q1 is arranged inside the rectifying element module 10 is described. However, the case where the second transistor Q2 is arranged inside the rectifying element module 10 will be briefly described below, centering on the differences.

[0047] The first module terminal 12f is electrically connected to the second source terminal S2. The gate pin 12a is electrically connected to the second gate terminal G2. The second module terminal 13 is electrically connected to the second drain terminal D2.

[0048] The first module terminal 12f extends to the outside of the element body 11 and toward the back surface 11a of the element body, and is mounted on the first substrate 20. The first module terminal 12f penetrates the first substrate 20 via a through member and is electrically connected to the cooling unit 60. The gate pin 12a extends to the outside of the element body 11 and toward the back surface 11a of the element body, and is mounted on the first substrate 20. The gate pin 12a is electrically connected to a gate signal circuit (not shown) via, for example, a wiring (not shown) on the first substrate 20, and receives supply of the second gate signal g2.

[0049] In addition, the second source terminal S2 is electrically connected to the secondary side output (-) line Vout(-), and the cooling unit 60 mainly cools the heat caused by the first current passing through the second source terminal S2. In addition, the second drain terminal D2 is electrically connected to the first partial winding start end 2c1 of the first partial winding 2c, and the cooling unit 60 mainly cools the heat caused by the second current passing through the second drain terminal D2.

[0050] (2) Overall Arrangement and Configuration of the Enclosed Unit of the Rectifier Element Module Next, the configuration and structure of the rectifier element module 10, the first substrate 20, the second substrate 30, the side wall portion 40, the first wiring board 51, the second wiring board 52, the cooling portion 60, the insulating heat sink 65, and the connector 70 in the closed unit 100 of the rectifier element module will be further described.

[0051] In the closed unit 100 of the rectifier element module of the present embodiment, the cooling unit 60 is arranged at the bottom, and a pair of insulating heat sinks 65 are arranged opposite to each other in the x direction with respect to the arrangement surface 61 of the cooling unit 60 via the first wiring board 51. The first substrate 20 is arranged on the upper surface of the first wiring board 51 and the pair of insulating heat sinks 65. On the first substrate 20, the rectifier element module 10a is arranged corresponding to one insulating heat sink 65, and the rectifier element module 10b is arranged corresponding to the other insulating heat sink 65. The first module terminals 12f of each rectifier element module 10a and 10b are arranged to face each other in the x direction. The first module terminal 12f penetrates the first substrate 20 via a through member not shown here and is electrically connected to the first wiring board 51. The first wiring board 51 is electrically connected to the secondary side output (-) line Vout (-) via the cooling unit 60. In addition, the pair of second wiring boards 52 are arranged to face each other with respect to the center in the x direction. Each second wiring board 52 is electrically connected to the second module terminal 13 of each rectifier element module 10a, 10b. The second substrate 30 is arranged opposite to the first substrate 20. The second wiring board 52 along the side wall portion 40 passes through the end of the second substrate 30 and is led to the outside and electrically connected to the secondary side output (+) line Vout(+).

[0052] With such a configuration, a closed space Sp surrounded by the first substrate 20, the second substrate 30, and the side wall portion 40 is formed. In the closed space Sp, at least the rectifier element module 10 is disposed, and in addition, the first surface 21 of the first substrate 20, the second surface 31 of the second substrate 30, a portion of the second wiring board 52, and the like are disposed.

[0053] In this embodiment, a connector 70 for electrically connecting the first substrate 20 and the second substrate 30 is disposed in the center of the first substrate 20, that is, between the rectifier element modules 10a and 10b. The connector 70 is disposed at the center of the first substrate 20 and the second substrate 30, for example.

[0054] In this embodiment, if Figure 2 As shown, a plurality of rectifying element modules 10 are arranged in the y direction on the first surface 21. Each rectifying element module 10 has a first or second transistor Q1, Q2 as appropriate. The configuration and arrangement of each rectifying element module 10 are the same as described above.

[0055] (3) Current path Next, the flow of current in the closed cell 100 of the rectifying element module will be described. The flow of current in the closed cell 100 of the rectifying element module is the same whether the first transistor Q1 or the second transistor Q2 is arranged inside the rectifying element module 10 .

[0056] Figure 6 It is shown Figure 1 Current path diagram of the flow of current in a closed unit of a rectifier element module. A portion of the first current path 90 of the first current from the first source terminal S1 (or the second source terminal S2) through the first module terminal 12f to the secondary side output (-) line Vout (-) is composed of a first through-current path 91 through which the first current penetrates the first substrate 20 from the first surface 21 to the first back surface 22. The length of the first through-current path 91 is the same as the thickness t of the first substrate 20 from the first surface 21 to the first back surface 22. In addition, a portion of the first current path 90 also includes a first wiring board current path 92 through which the first current passes through the first wiring board 51.

[0057] In a portion of the second current path 80 of the second current from the first drain terminal D1 (or the second drain terminal D2) through the second module terminal 13 and the second partial winding 2d (or the first partial winding 2c) to the secondary side output (+) line Vout(+), a second wiring board current path 81 in which the second current passes through the second wiring board 52 is included.

[0058] When the first transistor Q1 is turned on and the second transistor Q2 is turned off, the signal from the secondary side output (-) line Vout(-) is transmitted as the first current to the first source terminal S1 via the first current path 90 including the first through current path 91 and the first wiring plate current path 92, and the current flows from the first source terminal S1 to the first drain terminal D1. Then, the second current flows from the first drain terminal D1 to the second partial winding end 2d2 of the second partial winding 2d via the second current path 80 including the second wiring plate current path 81. Then, the output voltage induced in the second partial winding 2d is output from the second partial winding start end 2d1 and the secondary side output (+) line Vout(+).

[0059] On the other hand, when the second transistor Q2 is turned on and the first transistor Q1 is turned off, the signal from the secondary side output (-) line Vout(-) is transmitted as the first current to the second source terminal S2 via the first current path 90 including the first through current path 91 and the first wiring plate current path 92, and the current flows from the second source terminal S2 to the second drain terminal D2. Then, the second current flows from the second drain terminal D2 to the first partial winding starting end 2c1 of the first partial winding 2c via the second current path 80 including the second wiring plate current path 81. Then, the output voltage induced in the first partial winding 2c is output from the first partial winding terminating end 2c2 and the secondary side output (+) line Vout(+).

[0060] (4) Effect (4-1) According to the above configuration, the rectifying element module 10 is disposed in the closed space Sp, so that the rectifying element module 10 can be isolated from the external environment in a polluted state such as dust, humidity, and chemical liquid atmosphere.

[0061] Here, the rectifier circuit for generating the rectified output voltage is configured by combining a plurality of rectifier element modules 10 as described above, for example. Each rectifier element module 10 may include: first and second transistors Q1, Q2 (an example of a rectifier element) having a switching function, and module terminals 12f, 13 for inputting and outputting signals to and from the first and second transistors Q1, Q2 (an example of a rectifier element). The first and second transistors Q1, Q2 (an example of a rectifier element) are configured, for example, as an element body 11 molded by a molded resin or the like in a state where the first and second transistors Q1, Q2 (an example of a rectifier element) are arranged inside. The module terminals 12f, 13 are terminals electrically connected to the first and second transistors Q1, Q2 (an example of a rectifier element), and are led out from the element body 11 to the outside. The module terminals 12f, 13 input and output signals between wirings for the rectifier element module 10 and the first and second transistors Q1, Q2 (an example of a rectifier element).

[0062] According to the above configuration, such a rectifier element module 10 is arranged in the closed space Sp, so the rectifier element module 10 can be isolated from the highly polluted external environment. Therefore, it is possible to suppress contamination, corrosion, dust adhesion, etc. on the rectifier element module 10. As a result, it is possible to suppress adverse effects such as malfunction, damage, and shortened life of the first and second transistors Q1 and Q2 (an example of a rectifier element) in the rectifier element module 10 and even the rectifier circuit. In particular, the module terminals 12f, 13, etc. that are not covered by the mold resin can be isolated from the highly polluted external environment.

[0063] The above-mentioned rectifier element module 10 is sometimes used in a highly polluted environment such as a site (factory) where metal plating is performed. The rectifier element module 10 is cooled by sucking in air in the highly polluted environment. Therefore, when the rectifier element module 10 is not arranged in the closed space Sp, the rectifier element module 10 is actively exposed to the highly polluted environment, and the rectifier circuit composed of the rectifier element module 10 may have adverse effects such as malfunction. According to the above-mentioned closed unit 100 of the rectifier element module, the rectifier circuit can be isolated from the highly polluted external environment.

[0064] In addition, the wiring etc. for the rectifying element module 10 can be formed on the first surface 21 of the first substrate 20. The first surface 21 is also located in the closed space Sp, so it is possible to suppress contamination, corrosion, adhesion of dust, etc. to the wiring etc. for the rectifying element module 10. Thus, it is possible to suppress adverse effects such as signal shielding and superposition of noise on the signal caused by damage, disconnection, etc. of the wiring etc. for the rectifying element module 10. In addition, by also arranging wiring etc. other than the wiring for the rectifying element module 10 in the closed space Sp, it is possible to suppress adverse effects on the wiring.

[0065] Furthermore, in the above-mentioned closed unit 100 of the rectifying element module, the rectifying element module 10 is formed on the first substrate 20, so the closed unit 100 of the rectifying element module can be miniaturized and cost-effective.

[0066] As described above, the external environment in which the rectifier element module 10 is used is sometimes highly polluted, so it is necessary to suppress the occurrence of malfunctions of the rectifier circuit due to pollution. Therefore, in order to isolate the large rectifier element composed of diodes currently used from the external environment, the rectifier element is enclosed in a molded resin to make it a larger molded part. In addition, the connection between the molded part and other parts is not carried out using the wiring on the substrate, but using, for example, copper wiring with a large thickness and a wide width covered by an insulating material. Therefore, although the rectifier circuit composed of molded parts and copper wiring covered by an insulating material is not exposed to the external environment, it will cause enlargement and cost increase. On the other hand, in the above-mentioned structure, the smaller rectifier element module 10 arranged on the first substrate 20 is arranged in the closed space Sp together with the first substrate 20. Furthermore, the connection between the rectifier element modules 10 and the rectifier element module 10 and other elements can be carried out by the thinner wiring formed on the first substrate 20. In addition, the first substrate 20 itself is plate-shaped and thin. Therefore, by adopting the closed unit 100 of the rectifying element module described above, it is possible to achieve downsizing and cost reduction.

[0067] (4-2) According to the above configuration, the rectifying element module 10 is arranged on the first substrate 20, while the second substrate side components 35 and wiring, etc., which tend to have performance reduced by the influence of heat generated by the rectifying element module 10, are arranged on the second substrate 30 different from the first substrate 20. Thus, the components and the like that are easily affected by heat can be isolated from the rectifying element module 10. Therefore, compared with the case where the rectifying element module 10 and the components that are easily affected by heat are arranged on the same substrate, the influence of heat generated on the components that are easily affected by heat can be suppressed.

[0068] In addition, the second surface 31 of the second substrate 30 is also arranged inside the closed space Sp, so the second substrate side parts 35 and wiring arranged on the second substrate 30 that are easily affected by heat can be prevented from being adversely affected by malfunction, damage, shortened life, etc. due to the external environment.

[0069] Furthermore, since the first substrate 20 and the second substrate 30 are opposed to each other, the electrical connection between the first substrate 20 and the second substrate 30 can be easily ensured.

[0070] (4-3) According to the above configuration, the rectifier element module 10 is included in the secondary side circuit 4 connected to the transformer 2, a large current flows, and heat is likely to increase. According to the above configuration, the second substrate side parts 35 and wiring, etc., which are easily affected by heat, can be arranged on the second substrate 30, and isolated from the first substrate 20 on which the rectifier element module 10 is arranged. Therefore, the parts, etc., which are easily affected by heat on the second substrate 30 can be protected from the influence of heat. Therefore, the above-mentioned sealing unit 100 of the rectifier element module is useful when applied to the secondary side circuit 4 of the transformer 2.

[0071] (4-4) According to the above configuration, the rectifying element module 10 is disposed on the first surface 21 of the first substrate 20, and the cooling unit 60 is provided on the first rear surface 22 of the first substrate 20. Therefore, the cooling unit 60 can easily cool the heat generated by the first substrate 20 on which the rectifying element module 10 is disposed.

[0072] (4-5) According to the above configuration, a part of the first current path 90 of the current flowing in the rectifying element module 10 is formed by the first through-current path 91. Therefore, compared with the case where the first current path 90 is entirely formed as a wiring on the first substrate 20, it is possible to suppress the heating of the first substrate 20 caused by the current flowing in the rectifying element module 10 flowing through the first substrate 20. That is, by reducing the length of the wiring through which the current flows in the first substrate 20, the heating of the first substrate 20 caused by the current flowing through the wiring is suppressed. Therefore, it is possible to suppress the heating of the rectifying element module 10 due to the influence of the heating of the first substrate 20. Furthermore, the heat generated by the first substrate 20 and the rectifying element module 10 is cooled by the cooling unit 60. Thus, it is also possible to suppress the damage of the rectifying element module 10 due to the heating.

[0073] (4-6) According to the above configuration, the first substrate 20 and the second substrate 30 can be supported by the connector 70 in a state where they are opposed to each other, and the substrates 20 and 30 can be electrically connected.

[0074] (4-7) According to the above configuration, since the side wall portion 40 is formed of an insulating member, it is possible to prevent current from flowing through the side wall portion 40 and form a current path using a desired path.

[0075] Furthermore, as described above, although the embodiments of the present invention are disclosed in the above description, the present invention is not limited thereto. That is, various changes can be made to the above-described embodiments in terms of mechanism, shape, material, number, position, or arrangement without departing from the scope of the technical idea and purpose of the present invention, and all of them are included in the present invention.

[0076] 2. Modifications (1) About closed space Sp In the closed unit 100 of the rectifier element module shown in the above-mentioned embodiment, the closed space Sp is formed by combining the first substrate 20, the second substrate 30, and the side wall portion 40. However, as long as the closed space Sp can be formed, the side wall portion 40 can be omitted. For example, by bending the edge of the first substrate 20 or by bending the edge of the second substrate 30 to function as the side wall portion 40, the closed space Sp can be formed by the first substrate 20 and the second substrate 30. In the above-mentioned embodiment, the side wall portion 40 is formed of an insulating member, but the side wall portion 40 may be formed of the same material as the first substrate 20 and the second substrate 30, for example, a substrate.

[0077] (2) About the rectifier module In the above-mentioned embodiment, in the rectifier element module 10, the first lead terminal 12 is led out from the element body side 11c, and the second module terminal 13 extends along the element body back 11a. However, in the rectifier element module 10, the second module terminal 13 on the element body back 11a may not be used as a terminal, but only the first lead terminal 12 may be used as a terminal. For example, the first lead terminal 12 has a gate pin 12a for receiving an input of a gate signal, a first module terminal 12f electrically connected to the first source terminal S1, and a second module terminal 12d electrically connected to the first drain terminal D1. In addition, the second module terminal 12d is electrically connected to the second wiring board 52. In this case, the second module terminal 12d is used instead of the second module terminal 13 in the above-mentioned embodiment.

[0078] In addition, the above-mentioned rectifying element module 10 is a surface-mounted component. However, the form of the rectifying element module 10 is not limited, and for example, it may be a discrete component.

[0079] (3) Electronic components on the second substrate In the above-described embodiment, the second substrate side components 35 are arranged on the second substrate 30 . However, it is not necessary to arrange components on the second substrate 30 .

[0080] (4) Rectification circuit In the above-mentioned embodiment, the secondary side circuit 4 includes a synchronous rectification circuit using the first and second transistors Q1 and Q2. However, as long as the secondary side circuit 4 can rectify the output voltage induced in the secondary side windings 2c and 2d, it can also include a rectification circuit instead of a synchronous rectification circuit. For example, the rectification circuit includes a diode (an example of a rectification element) as a rectification element instead of the first and second transistors Q1 and Q2. The diode has an anode (an example of a first element terminal) and a cathode (an example of a second element terminal), and current flows in the forward direction from the anode to the cathode, and no current flows in the reverse direction from the cathode to the anode. Therefore, based on the voltage difference applied to the anode and the cathode, the diode performs a switching action. The output voltage rectified by the rectification action of the diode is obtained as the output of the rectification circuit.

[0081] 2. Other Implementation Methods Hereinafter, the configuration of a closing unit 200 of a rectifying element module according to another embodiment of the present invention will be described with reference to the drawings. Figure 7 It is a plan view of a closed unit 200 of a rectifier circuit according to another embodiment of the present invention, and is a plan view when the upper second substrate is removed. Figure 8 The closed unit 200 of the rectifier circuit according to another embodiment of the present invention is equivalent to Figure 1However, for the embodiment of the present invention, Figure 1 The same or corresponding components of the closed unit 100 of the rectifier element module are marked with the same reference numerals, and their detailed description is omitted below except for special descriptions regarding the common aspects with this embodiment and their relationships. The closed unit 200 of the rectifier circuit has Figure 1 The side wall portion 40 is omitted in the closed unit 100 of the rectifier element module. In addition, the second substrate 30 is supported from below by the second wiring board 52 and is maintained at a predetermined distance relative to the first substrate 20. Thus, the area C between the first substrate 20 and the second substrate 30 that is open to the side is in communication with the outside. When such a closed unit 200 of the rectifier circuit is not used in a highly polluted environment such as a metal plating site (factory), the rectifier element module 10 is cooled by inhaling air in a low-pollution environment, so the rectifier circuit is less likely to have adverse effects such as malfunction. The closed unit 200 of the rectifier circuit has Figure 1 The cooling unit 60 has the same structure and the same effect as the closed unit 100 of the rectifier element module. That is, the cooling unit 60 has a configuration surface 61 which is a horizontal surface and is the upper surface of the cooling unit 60. On the cooling unit 60, the first wiring board 51 and the insulating heat sink 65 are arranged on the configuration surface 61. Thus, the first group of rectifier element modules 10a and the second group of rectifier element modules 10b can be insulated and heat generated by the first substrate 20 and the rectifier element modules 10 can be dissipated. In addition, the insulating heat sink 65 can be arranged corresponding to either the first group of rectifier element modules 10a or the second group of rectifier element modules 10b. According to the above composition, Figure 6 As in the case of the closed unit 100 of the rectifier circuit shown in FIG. 1 , in the cooling unit 60, a part of the first current path 90 of the current flowing in the rectifier element module 10 is formed by the first through current path 91. Therefore, compared with the case where the first current path 90 is entirely formed as a wiring on the first substrate 20, it is possible to suppress the heating of the first substrate 20 caused by the current flowing in the rectifier element module 10 flowing through the first substrate 20. That is, by reducing the length of the wiring through which the current flows in the first substrate 20, the heating of the first substrate 20 caused by the current flowing through the wiring is suppressed. Therefore, it is possible to suppress the heating of the rectifier element module 10 due to the influence of the heating of the first substrate 20. Furthermore, the heat generated by the first substrate 20 and the rectifier element module 10 is cooled by the cooling unit 60. Thus, it is also possible to suppress the damage of the rectifier element module 10 due to the heating. In addition, the cooling unit 60 is not limited in structure as long as it can cool the first substrate 20 and the rectifying element module 10. As the cooling unit 60, for example, a water-cooled heat sink composed of one or more fins and a conduit that can allow a liquid such as water to flow through, an air-cooled heat sink composed of one or more fins that can dissipate heat, etc. can be cited. More specifically, the cooling unit 60 is preferably made of a material having electrical and thermal conductivity such as metals such as Cu and Al. Thus, even when the rectifying element module 10 in the rectifying circuit handles a large current of, for example, 500 A or more, good electrical conductivity and heat dissipation are achieved. Description of Reference Numerals

[0082] 1: Power conversion device 2: Transformer 2a: Core 2b: Primary winding 2c, 2d: Secondary winding, first winding section, second winding section 3: Primary side circuit 4: Secondary side circuit 4a: Synchronous Rectification Circuit 10, 10a, 10b: Rectifier component module 11: Component body 11a: Back side of component body 11b: Front of component body 11c: Side of the component body 12: First lead terminal 12a: Gate pin 12b~12e:Pin 12f: First module terminal 12d, 13: Second module terminal 20: First substrate 21: First Surface 22: The first back 30: Second substrate 31: Second Surface 32: Second back 35: Second substrate side parts 40: Side wall 51: First wiring board 52: Second wiring board 60: Cooling unit 61: Configuration surface 65: Insulation heat sink 70: Connector 71, 72: first connector, second connector 80: Second current path 81: Second wiring board current path 90: First current path 91: First through-current path 92: First wiring board current path 100, 200: Enclosed unit of rectifier element module D1, D2: First drain terminal, second drain terminal G1, G2: first gate terminal, second gate terminal Q1, Q2: first transistor, second transistor Sp: Enclosed Space S1, S2: First source terminal to fourth source terminal (first element terminal) Vin(+): primary side input (+) line Vin(-): Primary side input (-) line Vout(+): Secondary side output (+) line Vout(-): Secondary side output (-) line g1, g2: first gate signal, second gate signal

Claims

1. A closed unit of a rectifier element module, comprising: A rectifying element module, which has a rectifying element; A first substrate, which is plate-shaped and has a first surface and a first back surface, and the rectifier element module is arranged on the first surface; A second substrate, which is plate-shaped, has a second surface and a second back surface, and is arranged relative to the first substrate in such a manner that the second surface faces the first surface; as well as The side wall portion, by covering a region between the first substrate and the second substrate that is open to the side, forms a closed space with the first substrate and the second substrate, in which the rectifying element module is arranged.

2. The closed unit of the rectifying element module according to claim 1, wherein: A component that is electrically connected to the first substrate and has a tendency to have its performance reduced due to the influence of heat generated by the rectifier element module is arranged on the second surface of the second substrate.

3. The closed unit of the rectifying element module according to claim 1 or 2, wherein: The rectifying element module is included in a secondary side circuit connected to a transformer.

4. The sealing unit of the rectifying element module according to claim 1 or 2, further comprising: A cooling unit is disposed on the first back side of the first substrate and is used to cool the first substrate.

5. The closed unit of the rectifying element module according to claim 4, wherein: The cooling part is formed by a conductive member, A part of a current path of a current flowing through the rectifying element module is constituted by a through current path penetrating the first substrate from the first surface to the first back surface.

6. The sealing unit of the rectifying element module according to claim 1 or 2, further comprising: A connector supports the second substrate relative to the first substrate and electrically connects the first substrate and the second substrate.

7. The closed unit of the rectifying element module according to claim 1 or 2, wherein: The side wall portion is formed of an insulating member.

8. A closed unit of a rectifier element module, comprising: A rectifying element module, which has a rectifying element; A first substrate, which is plate-shaped and has a first surface and a first back surface, and the rectifier element module is arranged on the first surface; A second substrate, which is plate-shaped, has a second surface and a second back surface, and is arranged relative to the first substrate in such a manner that the second surface faces the first surface; as well as a cooling unit, disposed on the first back side of the first substrate, for cooling the first substrate; The cooling part is formed by a conductive member, A part of a current path of a current flowing through the rectifying element module is constituted by a through current path penetrating the first substrate from the first surface to the first back surface.

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