Camera components and electronic devices

Abstract

This invention provides a camera assembly including a lens, a support frame, and a circuit board. The lens includes a lens barrel and a heat-absorbing element. The lens barrel has a heat dissipation groove, and the heat-absorbing element is housed in the heat dissipation groove. The support frame supports the lens barrel and has a receiving cavity. The circuit board has a photosensitive chip mounted on it and is connected to the side of the support frame opposite to the lens. The photosensitive chip is housed in the receiving cavity. One end of the heat dissipation groove communicates with the receiving cavity, and the opposite end of the heat dissipation groove penetrates the outer surface of the lens barrel. The heat generated by the photosensitive chip during operation can be quickly transferred to the outside of the lens through the heat-absorbing element, greatly improving the heat dissipation efficiency of the photosensitive chip. This invention also provides an electronic device equipped with the camera assembly.

Description

Technical Field

[0001] This invention relates to the field of optical imaging devices, and more particularly to a camera assembly and an electronic device equipped with the camera assembly. Background Technology

[0002] Currently, fixed-focus cameras in some technologies generally include a lens, a base for supporting the lens, a circuit board, and a heat sink. The lens contains multiple lenses and is mounted on the base. A photosensitive chip is mounted on the circuit board. The side of the base away from the lens is sealed to the circuit board surrounding the photosensitive chip with adhesive. The heat sink (such as a graphite sheet) is attached to the side of the circuit board away from the photosensitive chip. When the fixed-focus camera is working, the photosensitive chip is the heat source. The heat generated by the photosensitive chip is transferred to the inner cavity of the lens. Because the lens is sealed with adhesive and the lens barrel is made of plastic, the heat dissipation effect of the lens is poor, and the temperature inside the lens rises rapidly. The increased temperature can cause the photosensitive plastic lenses inside the lens to deform and loosen, resulting in blurred resolution. Current fixed-focus cameras generally use a heat sink attached to the side of the circuit board away from the photosensitive chip. However, the heat sink and the photosensitive chip are separated by circuit boards and adhesives, which are materials with low heat dissipation efficiency. This results in slow and inefficient heat dissipation of the photosensitive chip, making it impossible to dissipate the heat generated by the photosensitive chip in time. This causes the internal temperature of the lens to rise continuously, resulting in thermal deformation of components such as the lens, which leads to changes in optical parameters and blurred resolution. Summary of the Invention

[0003] The purpose of this invention is to provide a camera assembly with better heat dissipation, and an electronic device equipped with the camera assembly.

[0004] To address the aforementioned technical problems, the present invention provides a camera assembly comprising a lens, a support frame, and a circuit board. The lens includes a lens barrel and a heat-absorbing component. The lens barrel is provided with a heat dissipation groove, and the heat-absorbing component is housed within the heat dissipation groove. The support frame supports the lens barrel and is provided with a receiving cavity. A photosensitive chip is provided on the circuit board, which is connected to the side of the support frame opposite to the lens. The photosensitive chip is housed within the receiving cavity. One end of the heat dissipation groove communicates with the receiving cavity, and the opposite end of the heat dissipation groove penetrates the outer surface of the lens barrel.

[0005] The present invention also provides an electronic device, comprising a housing, a motherboard disposed within the housing, and a camera assembly. The camera assembly is disposed within the housing and includes a lens, a support frame, and a circuit board. The lens includes a lens barrel and a heat-absorbing element. The lens barrel has a heat dissipation groove, and the heat-absorbing element is housed in the heat dissipation groove. The support frame supports the lens barrel and has a receiving cavity. The circuit board has a photosensitive chip and is connected to the side of the support frame away from the lens. The photosensitive chip is housed in the receiving cavity. One end of the heat dissipation groove communicates with the receiving cavity, and the other end of the heat dissipation groove passes through the outer surface of the lens barrel. The circuit board of the camera assembly is electrically connected to the motherboard.

[0006] The heat-absorbing component of the camera assembly provided by the present invention can directly contact the cold air outside the lens barrel at one end, and directly contact the hot air inside the lens at the other end. The heat-absorbing component is made of a material with high heat absorption and thermal conductivity. Therefore, the heat generated by the photosensitive chip during operation can be quickly transferred to the outside of the lens through the heat-absorbing component, which greatly improves the heat dissipation efficiency of the photosensitive chip. This reduces the amount of heat generated by the photosensitive chip transferred to the inner cavity of the lens, avoids lens deformation inside the lens, and prevents a decrease in refractive power. Attached Figure Description

[0007] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0008] Figure 1 This is a three-dimensional structural diagram of the camera assembly provided in the first embodiment of the present invention;

[0009] Figure 2 yes Figure 1 A cross-sectional view of the camera assembly along line II-II;

[0010] Figure 3 yes Figure 2 An exploded view of the camera components;

[0011] Figure 4 This is a three-dimensional structural diagram of the camera assembly provided in the second embodiment of the present invention;

[0012] Figure 5 yes Figure 4 A cross-sectional view of the camera component along the VV line;

[0013] Figure 6 yes Figure 5 An exploded view of the camera components;

[0014] Figure 7 This is a three-dimensional structural diagram of the camera assembly provided in the third embodiment of the present invention;

[0015] Figure 8 yes Figure 7 A cross-sectional view of the camera assembly along line VIII-VIII;

[0016] Figure 9 yes Figure 8 An exploded view of the camera components;

[0017] Figure 10 This is a three-dimensional structural diagram of the camera assembly provided in the fourth embodiment of the present invention;

[0018] Figure 11 yes Figure 10 A cross-sectional view of the camera assembly along line XI-XI;

[0019] Figure 12 yes Figure 11 An exploded view of the camera components;

[0020] Figure 13 This is a three-dimensional structural diagram of the camera assembly provided in the fifth embodiment of the present invention;

[0021] Figure 14 yes Figure 13 A cross-sectional view of the camera assembly along line XIV-XIV;

[0022] Figure 15 yes Figure 14 An exploded view of the camera components;

[0023] Figure 16 This is a three-dimensional structural diagram of the camera assembly provided in the sixth embodiment of the present invention;

[0024] Figure 17 yes Figure 16 A cross-sectional view of the camera assembly along line XVII-XVII;

[0025] Figure 18 yes Figure 17 An exploded view of the camera components;

[0026] Figure 19 This is a three-dimensional structural diagram of an electronic device provided in one embodiment of the present invention.

[0027] Main labeling descriptions: 100, Camera assembly; 20, Lens; 21, Lens barrel; 201, Bottom surface; 212, Positioning part; 2121, Second front side; 2124, Outer side; 213, Heat dissipation groove; 2132, First groove; 2134, Second groove; 2135, First groove segment; 2136, Second groove segment; 214, Barrel body; 2141, First front side; 2143, First back side; 2145, Outer peripheral surface; 23, Lens; 231, First lens; 233, Second lens; 235, Third lens; 237, Fourth lens; 24, Heat absorption component; 241, First end face; 242, First heat dissipation element. 243. Second end face; 244. Second heat dissipation part; 2441. First heat dissipation strip; 2443. Second heat dissipation strip; 245. Side; 426. Support step; 251. First support ring; 253. Second support ring; 255. Third support ring; 257. Fourth support ring; 30. Optical filter; 40. Support frame; 42. Receiving cavity; 421. Positioning groove; 423. Alternating groove; 425. Through groove; 43. Third front; 45. Third back; 60. Circuit board; 62. Photosensitive chip; 64. Conductive wire; 80. Heat sink; 400. Housing; 500. Main board; 600. Display screen. Detailed Implementation

[0028] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0029] Furthermore, the following descriptions of various embodiments are based on the accompanying illustrations and are used to illustrate specific embodiments that can be implemented in this application. Directional terms used in this application, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are merely for reference to the accompanying illustrations. Therefore, the directional terms used are for better and clearer explanation and understanding of this application, and are not intended to indicate or imply that the referred device or element must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0030] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed," "connected," "linked," and "set on" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] Please see Figures 1 to 3 The camera assembly 100 provided in the first embodiment of the present invention includes a lens 20, a support frame 40, a circuit board 60, and a heat sink 80. The lens 20 includes a lens barrel 21, multiple lenses 23, and a heat absorber 24. The lens barrel 21 is provided with a heat dissipation groove 213. The multiple lenses are positioned at intervals within the lens barrel 21. The support frame 40 is used to support the lens 20 and is provided with a receiving cavity 42. The receiving cavity 42 passes through the front and back of the support frame 40 along the axial direction of the lens barrel 21. The circuit board 60 is provided with a photosensitive chip 62 and conductive lines 64. A board 60 is connected to the support frame 40 on the side away from the lens 20. The photosensitive chip 62 is housed in the receiving cavity 42. One end of the conductive wire 64 is connected to the photosensitive chip 62, and the other end of the conductive wire 64 away from the photosensitive chip 62 is connected to a pad on the circuit board 60. One end of the heat sink 213 is connected to the receiving cavity 42, and the opposite end of the heat sink 213 passes through the outer surface of the lens barrel 21. One end of the heat absorber 24 in the heat sink 213 can directly contact the cold air outside the lens 20, and the other end of the heat absorber 24 can directly contact the hot air inside the lens barrel 21. When the camera assembly 100 is working, the heat generated by the photosensitive chip 62 is transferred to the receiving cavity 42, turning the air inside the receiving cavity 42 into hot air. One end of the heat absorber 24 exchanges heat with the hot air inside the receiving cavity 42, allowing the heat to be transferred to the heat absorber 24. The heat on the heat absorber 24 then exchanges heat with the cold air outside the lens barrel 21, thereby achieving high-efficiency heat dissipation of the photosensitive chip 62. Understandably, the heat-absorbing component 24 is made of a material with high heat absorption and thermal conductivity. Specifically, the heat-absorbing component 24 may be made of, but is not limited to, polymers such as iron, steel, aluminum, copper, silver, silicon carbide, graphite, carbon black, polyethylene, polypropylene, and polystyrene, as well as oxides such as iron oxide and titanium dioxide.

[0032] Optionally, a heat dissipation groove 213 can be formed by hollowing out the lens barrel 21, and heat dissipation material can be filled into the heat dissipation groove 213 to form a heat-absorbing element 24. Specifically, the heat dissipation material can be dispensed into the heat dissipation groove 213 by a dispensing machine, and the heat dissipation material can be cured to form the heat-absorbing element 24; or the heat dissipation material can be injected into the heat dissipation groove 213 of the lens barrel 21 by an injection molding machine to form the heat-absorbing element 24.

[0033] Understandably, the number of heat dissipation slots 213 and the number of heat-absorbing elements 24 on the lens barrel 21 can be set as needed. For example, if there is one heat dissipation slot 213 on the lens barrel 21, the number of heat-absorbing elements 24 is one, and one heat-absorbing element 24 is positioned in one heat dissipation slot 213; if there are two heat dissipation slots 213 on the lens barrel 21, the number of heat-absorbing elements 24 is two, the two heat dissipation slots 213 are located at opposite ends of the radial direction of the lens barrel 21, and the two heat-absorbing elements 24 are respectively positioned in the two heat dissipation slots 213; if there are three heat dissipation slots 213 on the lens barrel 21, the number of heat-absorbing elements 24 is three, the three heat dissipation slots 213 are arranged at intervals along the circumference of the lens barrel 21, and the three heat-absorbing elements 24 are respectively positioned in the three heat dissipation slots 213; if there are more than three heat dissipation slots 213 on the lens barrel 21, the number of heat-absorbing elements 24 is the same as the number of heat dissipation slots 213, the more than three heat dissipation slots 213 are arranged at intervals along the circumference of the lens barrel 21, and multiple heat-absorbing elements 24 are respectively positioned in the corresponding heat dissipation slots 213. In this embodiment, the lens barrel 21 is provided with four heat dissipation slots 213, and the number of heat-absorbing elements 24 is four. The four heat dissipation slots 213 are arranged in a circle with uniform intervals along the circumference of the lens barrel 21, and the four heat-absorbing elements 24 are respectively positioned in the four heat dissipation slots 213. In other embodiments, the lens barrel 21 is provided with multiple heat dissipation slots 213, and the number of heat-absorbing elements 24 is multiple. The multiple heat dissipation slots 213 are arranged in a circle with uniform intervals along the circumference of the lens barrel 21, and the multiple heat-absorbing elements 24 are respectively positioned in the multiple heat dissipation slots 213.

[0034] The heat-absorbing element 24 of the camera assembly 100 provided by the present invention can directly contact the cold air outside the lens barrel 21 at one end, and directly contact the hot air inside the lens 20 at the other end. The heat-absorbing element 24 is made of a material with high thermal conductivity. Therefore, the heat generated by the photosensitive chip 62 during operation is transferred to the lens barrel 21. When the heat is transferred to the heat-absorbing element 24, the heat will be continuously absorbed by the heat-absorbing element 24 and quickly transferred to the outside of the lens 20 to cool the lens barrel 21. This greatly improves the heat dissipation efficiency of the photosensitive chip 62, reduces the heat generated by the photosensitive chip 62 from being transferred to the inner cavity of the lens 20, avoids lens deformation inside the lens 20, and prevents a decrease in refractive power. This solves the problem of decreased refractive power of the camera assembly 100 caused by heat accumulation during long-term shooting operation of the photosensitive chip 62.

[0035] Optionally, the lens 20 has a bottom surface 201 facing the support frame 40, and one end of the heat dissipation groove 213 passes through the bottom surface 201 so that the heat dissipation groove 213 communicates with the receiving cavity 42. The lens 20 includes a positioning part 212 and a cylindrical body 214 connected to the positioning part 212. The positioning part 212 is positioned on the support frame 40, and the heat dissipation groove 213 is disposed on the cylindrical body 214 and / or the positioning part 212. In this embodiment, the heat dissipation groove 213 is disposed on the cylindrical body 214. Optionally, the cylindrical body 214 is provided with a plurality of heat dissipation grooves 213, which are arranged circumferentially along the cylindrical body 214, and a plurality of heat-absorbing elements 24 are respectively housed in the plurality of heat dissipation grooves 213. In this embodiment, the cylindrical body 214 is provided with four heat dissipation grooves 213. The four heat dissipation grooves 213 are evenly spaced around the circumference of the lens barrel 21. One end of each heat dissipation groove 213 passes through the surface of the cylindrical body 214 facing the support frame 40 so that the heat dissipation groove 213 connects to the receiving cavity 42. The other end of the heat dissipation groove 213 passes through the outer surface of the cylindrical body 214. The four heat-absorbing elements 24 are respectively housed in the four heat dissipation grooves 213. The positioning part 212 surrounds one end of the cylindrical body 214. The cylindrical body 214 includes a first front surface 2141, a first back surface 2143, and an outer peripheral surface 2145 connecting the first front surface 2141 and the first back surface 2143. The first back surface 2143 faces the receiving cavity 42. One end of the heat dissipation groove 213 passes through the surface of the cylindrical body 214 facing the receiving cavity 42, that is, one end of the heat dissipation groove 213 passes through the first back surface 2143 and connects to the receiving cavity 42. The other end of the heat dissipation groove 213 passes through at least the first front surface 2141 and connects to the cold air outside the lens barrel 21. The positioning part 212 includes a second front surface 2121, a second back surface opposite to the second front surface 2121, and an outer side surface 2124 connecting the second front surface 2121 and the second back surface. The second back surface of the positioning part 212 is coplanar with the bottom surface 201. In this embodiment, the bottom surface 201, the first back surface 2143, and the second back surface of the positioning part 212 are coplanar. In other embodiments, the first back surface 2143 and the bottom surface 201 may not be coplanar, such as the first back surface 2143 being closer to or further away from the support frame 40 than the bottom surface 201.

[0036] Optionally, the heat dissipation groove 213 extends axially along the cylindrical body 214, with a section of the heat dissipation groove 213 away from the photosensitive chip 62 penetrating the outer surface of the cylindrical body 214, and a section of the heat-absorbing member 24 away from the photosensitive chip 62 protruding from the outer surface of the cylindrical body 214. Specifically, a section of the heat dissipation groove 213 away from the photosensitive chip 62 penetrates the outer peripheral surface 2145 and / or the first front surface 2141 of the cylindrical body 214, and a section of the heat-absorbing member 24 away from the photosensitive chip 62 protrudes from the outer peripheral surface 2145 and / or the first front surface 2141 of the cylindrical body 214. In this embodiment, the heat dissipation groove 213 is a straight groove, with a section of the heat dissipation groove 213 away from the photosensitive chip 62 penetrating the outer peripheral surface 2145 and the first front surface 2141 of the cylindrical body 214; and a section of the heat-absorbing member 24 away from the photosensitive chip 62 protrudes from the outer peripheral surface 2145 and the first front surface 2141 of the cylindrical body 214. In other embodiments, one end of the heat sink 213 away from the support frame 40 passes through the outer peripheral surface 2145, and a section of the heat absorber 24 away from the photosensitive chip 62 is exposed on the outer peripheral surface 2145 of the cylinder 214; or one end of the heat sink 213 away from the support frame 40 passes through the first front surface 2141, and a section of the heat absorber 24 away from the photosensitive chip 62 is exposed on the first front surface 2141 of the cylinder 214.

[0037] In this embodiment, the heat dissipation groove 213 is a rectangular groove, and the heat absorption element 24 is a rectangular strip. The heat absorption element 24 includes a first end face 241, a second end face 243, and a side face 245 connected between the first end face 241 and the second end face 243. When the heat absorption element 24 is positioned in the heat dissipation groove 213, the first end face 241 is exposed to the first back face 2143. Preferably, the first end face 241 and the first back face 2143 are coplanar. The second end face 243 is exposed to the first front face 2141. Preferably, the second end face 243 and the first front face 2141 are coplanar. The side face 245 is exposed to the outer peripheral face 2145. Preferably, the side face 245 and the outer peripheral face 2145 are coplanar.

[0038] In other embodiments, the heat dissipation groove 213 may be, but is not limited to, a circular groove, a polygonal groove, or an elliptical groove, and the heat absorption element 24 may be, but is not limited to, a circular strip, a polygonal strip, or an elliptical strip.

[0039] like Figure 2 and Figure 3As shown, the plurality of lenses 23 include a first lens 231, a second lens 233, a third lens 235, and a fourth lens 237. The first lens 231, second lens 233, third lens 235, and fourth lens 237 are arranged alternately along axis L from object image to image, and are coaxial. A first support ring 251 is held between the first lens 231 and the second lens 233, a second support ring 253 is held between the second lens 233 and the third lens 235, a third support ring 255 is held between the third lens 235 and the fourth lens 237, and a fourth support ring 257 is provided around the side of the fourth lens 237 facing away from the third lens 235. The lens 20 and the support frame 40 are fixedly connected by a connecting adhesive 70, which can be, but is not limited to, adhesive glue, double-sided tape, etc. In this embodiment, the bottom surface of the positioning part 212 is connected to the front periphery of the support frame 40 by adhesive glue.

[0040] Optionally, the support frame 40 includes a third front side 43 and a third back side 45. A receiving cavity 42 is located in the middle of the support frame 40, with its opposite ends penetrating the third front side 43 and the third back side 45, respectively. The receiving cavity 42 includes a positioning groove 421 and a clearance groove 423 located at its opposite ends, and a through groove 425 connecting the positioning groove 421 and the clearance groove 423. The positioning groove 421, clearance groove 423, and through groove 425 share a common centerline. The side of the positioning groove 421 opposite to the clearance groove 423 penetrates the third front side 43, and the side of the clearance groove 423 opposite to the positioning groove 421 penetrates the third back side 45. The camera assembly 100 also includes an optical filter 30, positioned on the side of the support frame 40 opposite to the circuit board 60, with the middle portion of the photosensitive chip 62 directly opposite the middle portion of the optical filter 30. Specifically, the optical filter 30 is positioned in the positioning groove 421, and the tactile photosensitive chip 62 is accommodated in the clearance groove 423, with the optical filter 30 directly opposite the tactile photosensitive chip 62. The opening area of ​​the positioning groove 421 is larger than the opening area of ​​the through groove 425, and the opening area of ​​the clearance groove 423 is larger than the opening area of ​​the through groove 425, so that the support frame 40 forms a support step 426 between the positioning groove 421 and the through groove 425, and the support step 426 is used to support the optical filter 30.

[0041] In this embodiment, the support frame 40 is a rectangular frame, the positioning groove 421 is a circular groove, the clearance groove 423 is a rectangular space, and the through groove 425 is a circular groove. The axis of the positioning groove 421 and the axis of the through groove 425 are collinear. The diameter of the positioning groove 421 is larger than the diameter of the through groove 425, and the length of the rectangular side of the clearance groove 423 is larger than the diameter of the positioning groove 421. The optical filter 30 and the support frame 40 can be fixedly connected by, but not limited to, adhesive bonding or snap-fitting. Specifically, the optical filter 30 and the support step 426 can be fixedly connected by, but not limited to, adhesive bonding or snap-fitting. In other embodiments, the optical filter 30 and the support frame 40 can also be integrally formed by injection molding. In other embodiments, the support frame 40 can be, but not limited to, a circular frame, an elliptical frame, or a polygonal frame.

[0042] Optionally, the circuit board 60 is rectangular, and the front side of the circuit board 60 is connected to the third back side 45 of the support frame 40. In other embodiments, the circuit board 60 may also be, but is not limited to, a circular plate, an elliptical plate, or a polygonal plate.

[0043] A heat sink 80 is attached to the side of the circuit board 60 facing away from the photosensitive chip 62, with the heat sink 80 directly opposite the photosensitive chip 62. The shape of the heat sink 80 is similar to that of the photosensitive chip 62, and the front area of ​​the heat sink 80 facing the circuit board 60 is larger than the back area of ​​the photosensitive chip 62 facing the circuit board 60. The heat sink 80 can be, but is not limited to, a graphite sheet, a high thermal conductivity silicone pad, or a thermally conductive silicone sheet. The heat sink 80 provides auxiliary heat dissipation for the photosensitive chip 62.

[0044] When assembling the camera assembly 100, the heat-absorbing component 24 is positioned in the heat dissipation groove 213. Specifically, the heat-absorbing component 24 is integrally formed with the lens barrel 21. The optical filter 30 is positioned in the positioning groove 421 of the support frame 40. The bottom surface 201 of the positioning part 212 is connected to the third front surface 43 of the support frame 40 with adhesive 70, so that the lens 23 faces the optical filter 30. The front surface of the circuit board 60 is connected to the third back surface 45 of the support frame 40, so that the lens 23, the optical filter 30, and the photosensitive chip 62 are on the same center line. Then, the heat sink 80 is attached to the back of the circuit board 60 away from the photosensitive chip 62.

[0045] In this application, one end of the heat-absorbing element 24 on the lens 20 of the camera assembly 100 protrudes from the receiving cavity 42 to facilitate heat exchange between the heat-absorbing element 24 and the hot air in the receiving cavity 42; the portion of the heat-absorbing element 24 facing away from the photosensitive chip 62 protrudes from the outer surface of the barrel 214 to facilitate heat exchange between the heat-absorbing element 24 and the cold air outside the lens 20. When the photosensitive chip 62 operates, the heat generated is transferred to the heat-absorbing element 24, and then dissipated to the outside of the lens barrel 21 through the heat-absorbing element 24. Since the heat-absorbing element 24 is a high thermal conductivity material, its heat conduction and dissipation efficiency is high, thereby greatly improving the heat dissipation efficiency of the photosensitive chip 62, reducing the heat generated by the photosensitive chip 62 from being transferred to the lens 20, preventing lens 23 deformation, and avoiding a decrease in resolution. The heat generated by the photosensitive chip 62 during operation can be dissipated in a timely manner, reducing the internal impedance of the photosensitive chip 62 and reducing its energy consumption. The camera assembly 100 of this application can be used for, but is not limited to, front-facing video or rear-facing video. The heat generated by the photosensitive chip 62 during operation can be dissipated in time, which can effectively alleviate the deformation of the lens 23 caused by the temperature rise of the lens 20 and avoid the decrease in resolution. It can ensure clear focus for long-term front-facing or rear-facing video and maintain normal resolution.

[0046] like Figures 4-6As shown, the structure of the camera assembly 100a in the second embodiment of this application is similar to that of the camera assembly 100 in the first embodiment, except that the shape of the heat dissipation groove 213a and the shape of the heat absorption member 24a on the lens barrel 21 of the camera assembly 100a in the second embodiment are different from the shape of the heat dissipation groove 213a and the shape of the heat absorption member 24a on the lens barrel 21 of the camera assembly 100 in the first embodiment. In the second embodiment, the heat dissipation groove 213a includes a first groove 2132 and a second groove 2134 that are interconnected. The first groove 2132 is disposed on the cylinder 214, one end of the first groove 2132 is connected to the receiving cavity 42, and the opposite end of the first groove 2132 passes through the outer surface of the cylinder 214. The end of the second groove 2134 away from the first groove 2132 passes through the outer surface of the positioning part 212. Specifically, the length direction of the first groove 2132 is parallel to the axis L direction of the cylinder 214, and the section of the first groove 2132 away from the circuit board 60 passes through the first front surface 2141 and / or the outer peripheral surface 2145 of the cylinder 214; the second groove 2134 is provided in the positioning part 212, one end of the second groove 2134 is connected to the first groove 2132, and the end of the second groove 2134 away from the first groove 2132 passes through the second front surface 2121 and / or the outer side surface 2124 of the positioning part 212. In this embodiment, the end of the first groove 2132 away from the circuit board 60 passes through the first front surface 2141 and the outer peripheral surface 2145 of the cylinder 214, and the end of the second groove 2134 away from the first groove 2132 passes through the second front surface 2121 and the outer side surface 2124 of the positioning part 212. The second groove 2134 includes a first groove segment 2135 and a second groove segment 2136 that are interconnected. At least one of the first groove segment 2135 and the second groove segment 2136 is connected to the first groove 2132. The ends of the first groove segment 2135 and the second groove segment 2136 away from the first groove 2132 pass through the outer surface of the positioning part 212. Specifically, the second groove 2134 is a cross-shaped groove. The length direction of the first groove segment 2135 is perpendicular to the axial direction of the cylinder 214, and the length direction of the second groove segment 2136 is parallel to the axial direction of the cylinder 214. One end of the first groove segment 2135 is connected to the first groove 2132, and the end of the first groove segment 2135 away from the first groove 2132 passes through the outer side 2124. The end of the second groove segment 2136 away from the first groove 2132 passes through the second front side 2121.

[0047] The heat-absorbing component 24a includes a first heat-dissipating part 242 and a second heat-dissipating part 244 connected to each other. The first heat-dissipating part 242 is housed in the first groove 2132. One end of the first heat-dissipating part 242 protrudes from the surface of the cylinder 214 facing the receiving cavity 42, that is, one end of the first heat-dissipating part 242 protrudes from the first back side 2143. A section of the first heat-dissipating part 242 away from the photosensitive chip 62 protrudes from the outer surface of the cylinder. Specifically, a section of the first heat-dissipating part 242 away from the circuit board 60 protrudes from the first front side 2141 and / or the outer peripheral side 2145. The second heat-dissipating part 244 is housed in the second groove 2134. A section of the second heat-dissipating part 244 away from the photosensitive chip protrudes from the outer surface of the positioning part 212. Specifically, the end face of the second heat-dissipating part 244 away from the first heat-dissipating part 242 protrudes from the second front side 2121 and / or the outer side side 2124 of the positioning part 212. In this embodiment, the first heat dissipation part 242 is a strip-shaped strip. A section of the first heat dissipation part 242 away from the circuit board 60 is exposed on the first front surface 2141 and the outer peripheral surface 2145. The end face of the second heat dissipation part 244 away from the first heat dissipation part 242 is exposed on the second front surface 2121 and the outer side surface 2124. The second heat dissipation part 244 includes a first heat dissipation strip 2441 and a second heat dissipation strip 2443. The first heat dissipation strip 2441 is accommodated in the first groove segment 2135, and the second heat dissipation strip 2443 is accommodated in the second groove segment 2136. The end faces of the first heat dissipation strip 2441 and the second heat dissipation strip 2443 away from the first heat dissipation part 242 are exposed on the outer surface of the positioning part 212. Specifically, the second heat dissipation part 244 is a cross-shaped heat dissipation strip. The length direction of the first heat dissipation strip 2441 is perpendicular to the length direction of the first heat dissipation part 242, and the length direction of the second heat dissipation strip 2443 is parallel to the length direction of the first heat dissipation part 242. The end face of the first heat dissipation strip 2441 facing away from the first heat dissipation part 242 is exposed on the outer side 2124. The second heat dissipation strip 2443 is positioned in the second slot segment 2136, and the end face of the second heat dissipation strip 2443 facing away from the first heat dissipation part 242 is exposed on the second front face 2121. Preferably, the end face of the first heat dissipation part 242 facing away from the circuit board 60 is coplanar with the first front face 2141, the side face of the first heat dissipation part 242 is coplanar with the outer peripheral surface 2145, the end face of the first heat dissipation strip 2441 facing away from the first heat dissipation part 242 is coplanar with the outer side 2124, and the end face of the second heat dissipation strip 2443 away from the first heat dissipation part 242 is coplanar with the second front face 2121.

[0048] In other embodiments, the length direction of the first groove 2132 may also be inclined to the axial direction of the lens barrel 21, and the length direction of the first heat dissipation part 242 is consistent with the length direction of the first groove 2132; the length directions of the first groove segment 2135 and the second groove segment 2136 may both be inclined to the radial direction of the lens barrel 21, the length direction of the first heat dissipation strip 2441 is consistent with the length direction of the first groove segment 2135, and the length direction of the second heat dissipation strip 2443 is consistent with the length direction of the second groove segment 2136.

[0049] The assembly method of the camera component 100a in the second embodiment is the same as the assembly method of the camera component 100 in the first embodiment, and will not be described again here.

[0050] In the second embodiment, one end of the first heat dissipation portion 242 of the heat-absorbing member 24a of the camera assembly 100a protrudes from the receiving cavity 42 to facilitate heat exchange between the first heat dissipation portion 242 and the hot air in the receiving cavity 42. A section of the first heat dissipation portion 242 facing away from the photosensitive chip 62 protrudes from the outer surface of the barrel 214, and one end of the second heat dissipation portion 244 is connected to the first heat dissipation portion 242. The end face of the second heat dissipation portion 244 away from the first heat dissipation portion 242 protrudes from the second front face 2121 and the outer side face 2124 to facilitate heat exchange between the heat-absorbing member 24a and the cold air outside the lens 20. When the photosensitive chip 62 operates, heat is generated and transferred to the first heat dissipation portion 242. A portion of the heat is conducted through the first heat dissipation portion 242 to the second heat dissipation portion 244. The heat on the first heat dissipation portion 242 and the heat on the second heat dissipation portion 244 exchange heat with the cold air outside the lens barrel 21 for rapid heat dissipation. Because the heat absorber 24a is made of a highly thermally conductive material, its heat conduction and dissipation efficiency is high. Furthermore, the increased area of ​​heat exchange between the heat absorber 24a and the cold air outside the lens 20 enhances the heat dissipation area and speed, significantly improving the heat dissipation efficiency of the image sensor 62. This also reduces the transfer of heat generated by the image sensor 62 to the lens 20, preventing lens 23 deformation and avoiding a decrease in resolution. The timely dissipation of heat generated by the image sensor 62 during operation reduces its internal impedance and energy consumption.

[0051] The camera component 100a in this embodiment can be used for, but is not limited to, front-facing video or rear-facing video. The heat generated by the photosensitive chip 62 during operation can be dissipated in time, which can effectively alleviate the deformation of the lens 23 caused by the temperature rise of the lens 20 and avoid the decrease in resolution. It can ensure that the front-facing or rear-facing video is in focus for a long time and maintain normal resolution.

[0052] Please refer to the following: Figures 7-9, the structure of the camera module 100b in the third embodiment of the present application is similar to that of the camera module 100 in the first embodiment. The differences are as follows: The shapes of the heat dissipation grooves 213b on the barrel 21 of the camera module 100b and the shape of the heat absorption member 24b in the third embodiment are different from the shapes of the heat dissipation grooves 213 on the barrel 21 of the camera module 100 and the shape of the heat absorption member 24 in the first embodiment. In the third embodiment, the heat dissipation groove 213b includes a first groove 2132 and a second groove 2134 that are interconnected. The first groove 2132 is provided in the barrel body 214. One end of the first groove 2132 communicates with the accommodation cavity 42, and the opposite end of the first groove 2132 penetrates the outer surface of the barrel body 214. One end of the second groove 2134 away from the first groove 2132 penetrates the outer surface of the positioning portion 212. Specifically, the length direction of the first groove 2132 is parallel to the axis L direction of the barrel body 214, and a section of the first groove 2132 away from the circuit board 60 penetrates the first front surface 2141 and / or the outer peripheral surface 2145 of the barrel body 214; the second groove 2134 is provided in the positioning portion 212. One end of the second groove 2134 communicates with the first groove 2132, and one end of the second groove 2134 away from the photosensitive chip 62 penetrates the second front surface 2121 and / or the outer side surface 2124 of the positioning portion 212. In this embodiment, one end of the first groove 2132 away from the circuit board 60 penetrates the first front surface 2141 and the outer peripheral surface 2145 of the barrel body 214, and one end of the second groove 2134 away from the first groove 2132 penetrates the second front surface 2121 and the outer side surface 2124 of the positioning portion 212; specifically, the second groove 2134 is a "艹" - shaped groove. The second groove 2134 includes a first groove segment 2135 and two second groove segments 2136 that are interconnected. The length direction of the first groove segment 2135 is perpendicular to the axis direction of the barrel body 214, the two second groove segments 2136 are parallel and spaced apart from each other, the length direction of the second groove segment 2136 is parallel to the axis direction of the barrel body 214, one end of the first groove segment 2135 away from the first groove 2132 penetrates the outer side surface 2124, and one end of the two second groove segments 2136 away from the first groove 2132 penetrates the second front surface 2121.

[0053] The heat absorption member 24b includes a first heat dissipation portion 242 and a second heat dissipation portion 244 which are connected to each other. The first heat dissipation portion 242 is accommodated in the first groove 2132. One end of the first heat dissipation portion 242 exposes the first back surface 2143, and a section of the first heat dissipation portion 242 facing away from the photosensitive chip 62 exposes the first front surface 2141 and / or the outer peripheral surface 2145. The second heat dissipation portion 244 is accommodated in the second groove 2134, and an end surface of the second heat dissipation portion 244 away from the first heat dissipation portion 242 exposes the second front surface 2121 and / or the outer side surface 2124 of the positioning portion 212. In this embodiment, the first heat dissipation portion 242 is a strip-shaped bar, and a section of the first heat dissipation portion 242 away from the circuit board 60 exposes the first front surface 2141 and the outer peripheral surface 2145. An end surface of the second heat dissipation portion 244 away from the first heat dissipation portion 242 exposes the second front surface 2121 and the outer side surface 2124. In this embodiment, the second heat dissipation portion 244 is a "艹"-shaped heat dissipation strip. The second heat dissipation portion 244 includes a first heat dissipation strip 2441 and two second heat dissipation strips 2443. The first heat dissipation strip 2441 is accommodated in the first groove segment 2135, and the two second heat dissipation strips 2443 are respectively accommodated in the two second groove segments 2136. End surfaces of the first heat dissipation strip 2441 and the second heat dissipation strips 2443 away from the first heat dissipation portion 242 expose the outer surface of the positioning portion 212. Specifically, the length direction of the first heat dissipation strip 2441 is perpendicular to the length direction of the first heat dissipation portion 242, the length direction of the second heat dissipation strips 2443 is parallel to the length direction of the first heat dissipation portion 242, and an end surface of the first heat dissipation strip 2441 facing away from the first heat dissipation portion 242 exposes the outer side surface 2124. End surfaces of the two second heat dissipation strips 2443 facing away from the first heat dissipation portion 242 both expose the second front surface 2121. Preferably, an end surface of the first heat dissipation portion 242 facing away from the circuit board 60 is coplanar with the first front surface 2141, a side surface of the first heat dissipation portion 242 is coplanar with the outer peripheral surface 2145, an end surface of the first heat dissipation strip 2441 facing away from the first heat dissipation portion 242 is coplanar with the outer side surface 2124, and end surfaces of the two second heat dissipation strips 2443 away from the first heat dissipation portion 242 are coplanar with the second front surface 2121.

[0054] The assembling method of the camera module 100b in the third embodiment is the same as that of the camera module 100 in the first embodiment, and will not be described herein again.

[0055] In the third embodiment, the photosensitive chip 62 of the camera assembly 100b generates heat during operation, which is transferred to the first heat dissipation part 242. A portion of this heat is conducted through the first heat dissipation part 242 to the second heat dissipation part 244. The heat on the first heat dissipation part 242 and the heat on the second heat dissipation part 244 exchange heat with the cold air outside the lens barrel 21 for rapid heat dissipation. Since the heat-absorbing element 24b is made of a highly thermally conductive material, its heat conduction and dissipation efficiency is high. Furthermore, the increased area of ​​heat exchange between the heat-absorbing element 24b and the cold air outside the lens 20 further enhances the heat dissipation efficiency of the photosensitive chip 62, reduces the amount of heat generated by the photosensitive chip 62 transferred to the lens 20, prevents lens 23 deformation, and avoids a decrease in resolution. The timely dissipation of heat generated by the photosensitive chip 62 reduces its internal impedance and energy consumption.

[0056] In other embodiments, the second groove 2134 may include three or more second groove segments 2136 that are parallel to each other and two or more first groove segments 2135 that are parallel to each other. The two or more first groove segments 2135 are interconnected with the three or more second groove segments 2136, and one end of the first groove segment 2135 is connected to the first groove 2132.

[0057] Please refer to the following: Figures 10-12 The structure of the camera assembly 100c in the fourth embodiment of this application is similar to that of the camera assembly 100 in the first embodiment, except that the shape of the heat dissipation groove 213c and the shape of the heat absorption element 24c on the lens barrel 21 of the camera assembly 100c in the fourth embodiment are different from the shape of the heat dissipation groove 213 and the shape of the heat absorption element 24 on the lens barrel 21 of the camera assembly 100 in the first embodiment. In the fourth embodiment, the heat dissipation groove 213c includes a first groove 2132 and a second groove 2134 that are interconnected. The first groove 2132 is disposed on the cylinder 214, one end of the first groove 2132 is connected to the receiving cavity 42, and the other end of the first groove 2132 passes through the outer surface of the cylinder 214. The second groove 2134 is disposed on the second front surface 2121 of the positioning part 212. Specifically, the length direction of the first groove 2132 is parallel to the axis L direction of the cylinder 214, and a section of the first groove 2132 away from the circuit board 60 passes through the first front surface 2141 and / or the outer peripheral surface 2145 of the cylinder 214; the length direction of the second groove 2134 is parallel to the radial direction of the cylinder 214, one end of the second groove 2134 is connected to the first groove 2132, and the opposite end of the second groove 2134 passes through the outer surface 2124 of the positioning part 212. In this embodiment, the end of the first groove 2132 away from the circuit board 60 passes through the first front surface 2141 and the outer peripheral surface 2145 of the cylinder 214, and the second groove 2134 passes through the second front surface 2121 and the outer surface 2124 of the positioning part 212.

[0058] The heat-absorbing component 24c includes a first heat-dissipating portion 242 and a second heat-dissipating portion 244 connected to each other. The first heat-dissipating portion 242 is housed in a first groove 2132, with one end of the first heat-dissipating portion 242 exposed on a first back surface 2143, and a portion of the first heat-dissipating portion 242 away from the circuit board 60 exposed on a first front surface 2141 and / or an outer peripheral surface 2145. The second heat-dissipating portion 244 is housed in a second groove 2134, with the end face of the second heat-dissipating portion 244 away from the first heat-dissipating portion 242 exposed on the outer side surface 2124 of the positioning portion 212, and the side face of the second heat-dissipating portion 244 away from the circuit board 60 exposed on a second front surface 2121. In this embodiment, the first heat-dissipating portion 242 is a strip, with the portion of the strip away from the circuit board 60 exposed on the first front surface 2141 and the outer peripheral surface 2145, and the side face and the end face away from the first heat-dissipating portion 244 both exposed on the second front surface 2121 and the outer side surface 2124. In this embodiment, the length direction of the first heat dissipation part 242 is parallel to the axial direction of the cylinder 214, and the length direction of the second heat dissipation part 244 is perpendicular to the length direction of the first heat dissipation part 242. Preferably, the end face of the first heat dissipation part 242 away from the circuit board 60 is coplanar with the first front face 2141, the side face of the first heat dissipation part 242 is coplanar with the outer peripheral face 2145, the end face of the second heat dissipation part 244 away from the first heat dissipation part 242 is coplanar with the outer side face 2124, and the side face of the second heat dissipation part 244 facing the first heat dissipation part 242 is coplanar with the second front face 2121.

[0059] The assembly method of the camera component 100c in the fourth embodiment is the same as the assembly method of the camera component 100 in the first embodiment, and will not be described again here.

[0060] In the fourth embodiment, when the photosensitive chip 62 of the camera assembly 100c is working, the heat generated is transferred to the first heat dissipation part 242. A portion of the heat is conducted through the first heat dissipation part 242 to the second heat dissipation part 244. The heat on the first heat dissipation part 242 and the heat on the second heat dissipation part 244 exchange heat with the cold air outside the lens barrel 21 for rapid heat dissipation. Since the heat-absorbing element 24b is made of a highly thermally conductive material, its heat conduction and dissipation efficiency is high. Furthermore, the increased area of ​​heat exchange between the heat-absorbing element 24c and the cold air outside the lens 20 further improves the heat dissipation efficiency of the photosensitive chip 62, reduces the amount of heat generated by the photosensitive chip 62 transferred to the lens 20, prevents lens 23 deformation, and avoids a decrease in resolution. The timely dissipation of heat generated by the photosensitive chip 62 reduces its internal impedance and energy consumption.

[0061] Please refer to the following: Figures 13-15The structure of the camera assembly 100d in the fifth embodiment of this application is similar to that of the camera assembly 100 in the first embodiment, except that the shape of the heat dissipation groove 213d and the shape of the heat absorption element 24d on the lens barrel 21 of the camera assembly 100d in the fifth embodiment are different from the shape of the heat dissipation groove 213 and the shape of the heat absorption element 24d on the lens barrel 21 of the camera assembly 100 in the first embodiment. In the fifth embodiment, the heat dissipation groove 213d includes a first groove 2132 and a second groove 2134 that are interconnected. The first groove 2132 is disposed on the cylinder 214, one end of the first groove 2132 is connected to the receiving cavity 42, and a corresponding section of the first groove 2132 penetrates the outer surface of the cylinder 214. The second groove 2134 is disposed on the outer surface of the positioning part 212. Specifically, the length direction of the first groove 2132 is parallel to the axis L of the cylinder 214, and a section of the first groove 2132 away from the circuit board 60 passes through the first front surface 2141 and / or the outer peripheral surface 2145 of the cylinder 214; the second groove 2134 is L-shaped and includes a first groove segment 2135 and a second groove segment 2136 that are interconnected. One end of the first groove segment 2135 is connected to the first groove 2132 and is located on the second front surface 2121. One end of the second groove segment 2136 is connected to the end of the first groove 2132 away from the first groove 2132 and is located on the outer side surface 2124. Specifically, the length direction of the first groove segment 2135 is perpendicular to the axis L of the cylinder 214, and the length direction of the second groove segment 2136 is parallel to the length direction of the first groove 2132. In this embodiment, the end of the first groove 2132 away from the circuit board 60 passes through the first front surface 2141 and the outer peripheral surface 2145 of the barrel 214, and the second groove 2134 passes through the second front surface 2121 and the outer side surface 2124 of the positioning part 212. Specifically, the first groove segment 2135 passes through the second front surface 2121, and the end of the second groove segment 2136 away from the first groove segment 2135 extends to the bottom surface 201 of the lens barrel 21.

[0062] The heat-absorbing component 24d includes a first heat-dissipating part 242 and a second heat-dissipating part 244 connected to each other. The first heat-dissipating part 242 is housed in a first groove 2132. One end of the first heat-dissipating part 242 is exposed on a first back surface 2143. A portion of the first heat-dissipating part 242 away from the circuit board 60 is exposed on a first front surface 2141 and / or an outer peripheral surface 2145. The second heat-dissipating part 244 is housed in a second groove 2134. The second heat-dissipating part 244 is exposed on the outer surface of the positioning part 212. The surface of the second heat-dissipating part 244 away from the positioning part 212 is exposed on the second groove 2134. In this embodiment, the first heat dissipation part 242 is a strip-shaped strip, with a section of the strip away from the circuit board 60 exposed on the first front surface 2141 and the outer peripheral surface 2145. The second heat dissipation part 244 includes a first heat dissipation strip 2441 and a second heat dissipation strip 2443. One end of the first heat dissipation strip 2441 is connected to the first heat dissipation part 242, and one end of the second heat dissipation strip 2443 is connected to the end of the first heat dissipation strip 2441 away from the first heat dissipation part 242. In this embodiment, the length direction of the first heat dissipation part 242 is parallel to the axial direction of the cylinder 214, the first heat dissipation strip 2441 is perpendicular to the first heat dissipation part 242, and the length direction of the second heat dissipation strip 2443 is parallel to the length direction of the first heat dissipation part 242. Preferably, the end face of the first heat dissipation part 242 away from the circuit board 60 is coplanar with the first front face 2141, the side face of the first heat dissipation part 242 is coplanar with the outer peripheral face 2145, the side face of the first heat dissipation strip 2441 away from the positioning part 212 is coplanar with the second front face 2121, and the side face of the second heat dissipation strip 2443 away from the positioning part 212 is coplanar with the outer side face 2124.

[0063] The assembly method of the camera component 100d in the fifth embodiment is the same as the assembly method of the camera component 100 in the first embodiment, and will not be described again here.

[0064] In the fifth embodiment, when the photosensitive chip 62 of the camera assembly 100d is working, the heat generated is transferred to the first heat dissipation part 242. A portion of the heat is conducted through the first heat dissipation part 242 to the first heat dissipation strip 2441 and the second heat dissipation strip 2443. The heat on the first heat dissipation part 242, the first heat dissipation strip 2441, and the second heat dissipation strip 2443 exchange heat with the cold air outside the lens barrel 21 for rapid heat dissipation. Since the heat-absorbing element 24d is made of a highly thermally conductive material, its heat conduction and dissipation efficiency is high. Furthermore, the increased area of ​​heat exchange between the heat-absorbing element 24d and the cold air outside the lens 20 further improves the heat dissipation efficiency of the photosensitive chip 62, reduces the amount of heat generated by the photosensitive chip 62 transferred to the lens 20, prevents lens 23 deformation, and avoids a decrease in resolution. The timely dissipation of heat generated by the photosensitive chip 62 reduces its internal impedance and energy consumption.

[0065] Please refer to the following: Figures 16-18The structure of the camera assembly 100e in the sixth embodiment of this application is similar to that of the camera assembly 100 in the first embodiment, except that the shape of the heat dissipation groove 213e and the shape of the heat absorption element 24e on the lens barrel 21 of the camera assembly 100e in the sixth embodiment are different from the shape of the heat dissipation groove 213 and the shape of the heat absorption element 24e on the lens barrel 21 of the camera assembly 100 in the first embodiment. In the sixth embodiment, the heat dissipation groove 213e includes a first groove 2132 and two second grooves 2134 that are interconnected. The first groove 2132 is disposed in the cylinder 214, one end of the first groove 2132 is connected to the receiving cavity 42, and the opposite end of the first groove 2132 passes through the outer surface of the cylinder 214. The two second grooves 2134 are both disposed in the positioning part 212, one end of each second groove 2134 passes through the first groove 2132, and the opposite end of each second groove 2134 passes through the outer surface 2124. Specifically, the length direction of the first groove 2132 is parallel to the axis L direction of the cylinder 214, and the portion of the first groove 2132 away from the circuit board 60 passes through the first front surface 2141 and / or the outer peripheral surface 2145 of the cylinder 214; the length direction of the second groove 2134 is parallel to the radial direction of the cylinder 214. In this embodiment, the end of the first groove 2132 away from the circuit board 60 passes through the first front surface 2141 and the outer peripheral surface 2145 of the cylinder 214, and the end of the second groove 2134 away from the first groove 2132 passes through the outer surface 2124.

[0066] The heat-absorbing component 24e includes a first heat-dissipating portion 242 and two second heat-dissipating portions 244 interconnected. The first heat-dissipating portion 242 is housed in a first groove 2132, with one end of the first heat-dissipating portion 242 exposed on a first back surface 2143, and a portion of the first heat-dissipating portion 242 away from the circuit board 60 exposed on a first front surface 2141 and / or an outer peripheral surface 2145. The two second heat-dissipating portions 244 are respectively housed in two second grooves 2134, with each second heat-dissipating portion 244 exposing the outer side surface 2124 of the positioning portion 212 on the end face away from the first heat-dissipating portion 242. In this embodiment, the first heat-dissipating portion 242 is a strip, with a portion of the strip away from the circuit board 60 exposed on the first front surface 2141 and the outer peripheral surface 2145. The second heat-dissipating portions 244 are also strips, with the end face of the second heat-dissipating portion 244 away from the first heat-dissipating portion 242 exposed on the outer side surface 2124. In this embodiment, the length direction of the first heat dissipation part 242 is parallel to the axial direction of the cylinder 214, and the length direction of the second heat dissipation part 244 is perpendicular to the length direction of the first heat dissipation part 242. Preferably, the end face of the first heat dissipation part 242 away from the circuit board 60 is coplanar with the first front face 2141, the side face of the first heat dissipation part 242 is coplanar with the outer peripheral face 2145, and the end face of the second heat dissipation part 244 away from the first heat dissipation part 242 is coplanar with the outer side face 2124.

[0067] The assembly method of the camera component 100e in the sixth embodiment is the same as the assembly method of the camera component 100 in the first embodiment, and will not be described again here.

[0068] In the sixth embodiment, when the photosensitive chip 62 of the camera assembly 100e is working, the heat generated is transferred to the first heat dissipation part 242. A portion of the heat is conducted through the first heat dissipation part 242 to the two second heat dissipation parts 244. The heat on the first heat dissipation part 242 and the two second heat dissipation parts 244 exchange heat with the cold air outside the lens barrel 21 for rapid heat dissipation. Since the heat-absorbing element 24e is made of a highly thermally conductive material, its heat conduction and dissipation efficiency is high. Furthermore, the increased area of ​​heat exchange between the heat-absorbing element 24e and the cold air outside the lens 20 further improves the heat dissipation efficiency of the photosensitive chip 62, reduces the amount of heat generated by the photosensitive chip 62 transferred to the lens 20, prevents lens 23 deformation, and avoids a decrease in resolution. The timely dissipation of heat generated by the photosensitive chip 62 reduces its internal impedance and energy consumption.

[0069] like Figure 19 As shown, the present invention also provides an electronic device, which includes a housing 400, a motherboard 500 disposed within the housing 400, a display screen 600 disposed on the front of the housing 400, and a camera assembly 100 as described in any of the above embodiments. The camera assembly 100 is disposed within the housing 400, and the camera assembly 100 and the display screen 600 are electrically connected to the motherboard 500. In this embodiment, the electronic device is a mobile phone, and the camera assembly 100 is the front-facing camera of the mobile phone. Because the heat generated by the photosensitive chip of the camera assembly 100 exchanges heat with the heat-absorbing element, and the heat on the heat-absorbing element directly exchanges heat with the cold air outside the lens, the heat dissipation efficiency of the lens 20 is higher, thereby further improving the heat dissipation efficiency of the photosensitive chip, reducing the heat generated by the photosensitive chip from being transferred to the lens, preventing lens deformation, and avoiding a decrease in resolution. In other embodiments, the camera assembly can also be a rear-facing camera.

[0070] In other embodiments, the camera component may also be, but is not limited to, any electronic device that requires a lens, such as a tablet computer, display screen, smart TV, smart watch, or smart bracelet.

[0071] The above are the embodiments of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the embodiments of the present invention, and these improvements and modifications are also considered to be within the protection scope of the present invention.

Claims

1. A camera assembly, comprising: The camera assembly comprises: a lens barrel and a heat-absorbing member, the lens barrel comprising a positioning portion, the lens barrel being provided with a heat dissipation groove, the heat-absorbing member being accommodated in the heat dissipation groove, the heat dissipation groove comprising a first groove and a second groove in communication with each other, the second groove comprising a first groove segment and a second groove segment in communication with each other, at least one of the first groove segment and the second groove segment being in communication with the first groove, the first groove segment and the second groove segment penetrating the outer surface of the positioning portion at one end away from the first groove; the heat-absorbing member comprising a first heat dissipation portion and a second heat dissipation portion connected with each other, the second heat dissipation portion comprising a first heat dissipation strip and a second heat dissipation strip, the first heat dissipation strip being accommodated in the first groove segment, the second heat dissipation strip being accommodated in the second groove segment, the first heat dissipation strip and the second heat dissipation strip being exposed to the outer surface of the positioning portion at the end face away from the first heat dissipation portion; a support frame supporting the lens barrel, the support frame being provided with a receiving cavity; and a circuit board provided with a photosensitive chip, the circuit board being connected to one side of the support frame away from the lens barrel, the photosensitive chip being accommodated in the receiving cavity, one end of the heat dissipation groove being in communication with the receiving cavity, and the opposite end of the heat dissipation groove penetrating the outer surface of the lens barrel.

2. The camera assembly of claim 1, wherein, The lens barrel further comprises a barrel body connected to the positioning portion, the positioning portion being positioned on the support frame, and the heat dissipation groove being arranged on the barrel body and / or the positioning portion.

3. The camera assembly of claim 2, wherein, The heat dissipation groove extends along the axial direction of the barrel body, one segment of the heat dissipation groove away from the photosensitive chip penetrating the outer surface of the barrel body, and one segment of the heat-absorbing member away from the photosensitive chip being exposed to the outer surface of the barrel body.

4. The camera assembly of claim 2, wherein, The heat dissipation groove extends along the axial direction of the barrel body, one segment of the heat dissipation groove away from the photosensitive chip penetrating the outer peripheral surface of the barrel body and / or the first front surface of the barrel body, and one segment of the heat-absorbing member away from the photosensitive chip being exposed to the outer peripheral surface of the barrel body and / or the first front surface of the barrel body.

5. The camera assembly of claim 4, wherein, The first groove is arranged on the barrel body, one end of the first groove being in communication with the receiving cavity, and the opposite end of the first groove penetrating the outer surface of the barrel body, and the second groove penetrating the outer surface of the positioning portion at one end away from the first groove.

6. The camera assembly of claim 5, wherein, The first heat dissipation portion is accommodated in the first groove, one end of the first heat dissipation portion being exposed to the surface of the barrel body facing the receiving cavity, and one segment of the first heat dissipation portion away from the photosensitive chip being exposed to the outer surface of the barrel body; and the second heat dissipation portion is accommodated in the second groove, and the part of the second heat dissipation portion away from the photosensitive chip being exposed to the outer surface of the positioning portion.

7. The camera assembly of claim 6, wherein, One end face of the first heat dissipation portion is coplanar with the surface of the barrel body facing the receiving cavity, the end face of the first heat dissipation portion away from the circuit board is coplanar with the first front surface, the side face of the first heat dissipation portion is coplanar with the outer peripheral surface of the barrel body, and one end of the second heat dissipation portion away from the first heat dissipation portion is exposed to the second front surface and / or the outer side face of the positioning portion.

8. The camera assembly of claim 2, wherein, The barrel is provided with a plurality of heat dissipation grooves, and the plurality of heat dissipation grooves are arranged along the circumference of the barrel; the lens comprises a plurality of heat absorption members, and the plurality of heat absorption members are respectively accommodated in the plurality of heat dissipation grooves.

9. An electronic device, comprising: It comprises a shell, a mainboard arranged in the shell, and a camera assembly as claimed in any one of claims 1-8, the camera assembly is arranged in the shell, and the circuit board of the camera assembly is electrically connected to the mainboard.

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