A packaging structure for an integrated circuit

Abstract

The present invention discloses a packaging structure for integrated circuits, which relates to the technical field of integrated circuit manufacturing. In the present invention, a first reciprocating lead screw is rotatably installed on one side of the packaging control frame, and a second reciprocating lead screw is rotatably installed on the other side of the packaging control frame. The first reciprocating lead screw and the second reciprocating lead screw are arranged in a cross shape and rotate synchronously. A packaging station is arranged inside the packaging control frame, and a lifting packaging plate located at the packaging station is installed inside the packaging control frame. A plurality of elastic supporting components are arranged in an array on the first conveying component, and a packaging cover supported on the elastic supporting components is arranged on the first conveying component. A plurality of integrated circuit boards are arranged in an array on the top of the second conveying component. The buckling of the packaging cover and the integrated circuit board at the packaging station is realized by controlling the reciprocating motion of the lifting packaging plate. The present invention realizes the automation of the packaging feeding process through the cooperation of the automatic feeding channels and the automatic feeding mechanisms on the left and right sides, and improves the efficiency of the packaging operation to a certain extent.

Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuit manufacturing, and particularly relates to a packaging structure for integrated circuits. Background Art

[0002] In the process of integrated circuit board packaging manufacturing, epoxy resin is usually encapsulated above the integrated circuit board to protect components such as transistors, resistors, capacitors, and inductors in the circuit. To further improve the safety performance of the integrated circuit board, a hard protective shell needs to be added on the basis of the epoxy resin encapsulation.

[0003] In the prior art, when packaging the protective shell and the integrated circuit board, the packaging methods used include glue bonding and snap - fixing. Both of these packaging methods require pressure to achieve a tight package of the protective shell and the integrated circuit board. Although the traditional manual packaging method can achieve the packaging process of the integrated circuit board, the degree of automation in its packaging manufacturing process is relatively reduced, which is not conducive to improving the packaging efficiency of the integrated circuit board. Therefore, we provide a packaging structure for integrated circuits to solve the above problems. Summary of the Invention

[0004] The purpose of the present invention is to provide a packaging structure for integrated circuits. Through the specific structural design of the packaging control mechanism, the first conveying mechanism, the second conveying mechanism, and the automatic feeding mechanism, the problems in the above - mentioned background art are solved.

[0005] To solve the above - mentioned technical problems, the present invention is realized through the following technical solutions:

[0006] The present invention relates to a packaging structure for integrated circuits, which includes a packaging control mechanism. The packaging control mechanism includes a packaging control frame. A first reciprocating screw rod is rotatably installed on one side of the packaging control frame, and a second reciprocating screw rod is rotatably installed on the other side of the packaging control frame. The first reciprocating screw rod and the second reciprocating screw rod are arranged in a cross shape and rotate synchronously. A packaging station is arranged inside the packaging control frame, and a lifting packaging tray located on the packaging station is installed inside the packaging control frame; a first conveying mechanism is arranged on one side of the packaging control frame and is slidably matched with the packaging control frame. The first reciprocating screw rod is arranged below the first conveying mechanism and is in transmission cooperation with the first conveying mechanism. The first conveying mechanism includes a first conveying component, and a plurality of elastic supporting components are arranged in an array on the first conveying component. A packaging cover supported on the elastic supporting components is arranged on the first conveying component; and a second conveying mechanism is arranged on the other side of the packaging control frame and is slidably matched with the packaging control frame. The second reciprocating screw rod is arranged below the second conveying mechanism and is in transmission cooperation with the second conveying mechanism. The second conveying mechanism includes a second conveying component, and a plurality of integrated circuit boards are arranged in an array on the top of the second conveying component. When the packaging cover at the front end of the first conveying mechanism is driven by the first reciprocating screw rod to move to the packaging station, the integrated circuit board at the front end of the second conveying mechanism driven by the second reciprocating screw rod that rotates synchronously with the first reciprocating screw rod moves to the lower part of the packaging cover at the packaging station. By controlling the reciprocating movement of the lifting packaging tray, the buckling of the packaging cover and the integrated circuit board at the packaging station is realized.

[0007] The present invention is further configured such that a first packaging channel corresponding to the first reciprocating screw rod is opened on one side of the packaging control frame, and a second packaging channel corresponding to the second reciprocating screw rod is opened on the other side of the packaging control frame. A first mounting frame and a second mounting frame are respectively fixedly arranged on the top of the packaging control frame. The output end of a packaging control motor installed on the top of the first mounting frame is connected with a packaging control shaft. A first transmission wheel is fixedly installed on the circumferential side of the packaging control shaft. A transmission worm is fixedly installed on the top of a linkage shaft rotatably arranged at the bottom inside the packaging control frame. A second transmission wheel fixedly installed on the circumferential side of the linkage shaft is connected with the first transmission wheel through a first transmission belt.

[0008] The present invention is further configured such that a transmission worm gear and a first bevel gear are respectively fixedly installed on the circumferential side of the first reciprocating screw rod. The transmission worm is in meshing transmission with the transmission worm gear. A second bevel gear meshing with the first bevel gear is fixedly installed at the end of the second reciprocating screw rod. A packaging cylinder is fixedly installed on the top of the second mounting frame. The lifting packaging tray is connected to the output end of the packaging cylinder.

[0009] The present invention is further configured such that the first conveying assembly includes a first conveying seat slidably fitted in the first encapsulation channel. A first supporting portion that is in transmission cooperation with the first reciprocating lead screw is fixedly provided at the rear end of the first conveying seat. Pressing and discharging ports adapted to the encapsulation cover are arranged in an array on the surface of the first conveying seat. A guiding port is formed inside the pressing and discharging port. Mounting cavities corresponding to the pressing and discharging ports one by one are formed on the surface of the first conveying seat. The mounting cavity and the corresponding guiding port are connected through a guiding through hole.

[0010] The present invention is further configured such that the elastic supporting assembly includes an inclined-plane supporting seat slidably fitted in the guiding port. A moving rod that is in sliding cooperation with the guiding through hole is fixedly provided on one side of the inclined-plane supporting seat. A moving plate that is slidably fitted in the corresponding mounting cavity is fixedly provided at the end of the moving rod. An elastic element connected to the moving plate is arranged inside the mounting cavity. The encapsulation cover supported by the top of the inclined-plane supporting seat is in clearance fit inside the corresponding pressing and discharging port.

[0011] The present invention is further configured such that the second conveying assembly includes a second conveying seat slidably fitted in the second encapsulation channel. A second supporting portion that is in transmission cooperation with the second reciprocating lead screw is fixedly provided at the rear end of the second conveying seat. Positioning grooves adapted to the integrated circuit board are arranged in an array on the surface of the second conveying seat; A plurality of engaging portions are installed on the inner wall of the encapsulation cover. Engaging grooves corresponding to the engaging portions one by one are provided on the side wall of the integrated circuit board.

[0012] The present invention is further configured such that the present invention further includes an automatic feeding mechanism, and the automatic feeding mechanism is installed on one side of the encapsulation control frame close to the second mounting frame; wherein, the automatic feeding mechanism includes two sealing bottom plates symmetrically arranged. A transfer cavity is formed at the top of the sealing bottom plate. Feeding platforms are fixedly provided on both the inner and outer sides of the encapsulation control frame. A limiting channel is formed at the top of the feeding platform. The sealing bottom plate is slidably attached to the top of the corresponding feeding platform. The limiting member fixed to the bottom of the sealing bottom plate is slidably fitted inside the limiting channel. A blanking port adapted to the transfer cavity is formed at the top of the feeding platform. Automatic feeding channels are fixedly installed on both the inner and outer sides of the encapsulation control frame. The automatic feeding channel is arranged above the corresponding feeding platform and is in contact with the top of the sealing bottom plate. The top surface of the encapsulation cover in the transfer cavity is flush with the top surface of the sealing bottom plate.

[0013] The present invention is further configured such that the automatic feeding mechanism further includes a first mounting shaft and a second mounting shaft disposed above it. Both the first mounting shaft and the second mounting shaft are rotatably connected to the fixed seats on the encapsulation control frame. A third transmission wheel is fixedly installed on the circumferential side of the first reciprocating lead screw. A fourth transmission wheel and a fifth transmission wheel are respectively fixedly installed on the first mounting shaft. The third transmission wheel and the fourth transmission wheel are connected by a second transmission belt. The sixth transmission wheel fixedly installed on the second mounting shaft and the fifth transmission wheel are connected by a third transmission belt. A connecting seat is fixedly provided on one side of the sealing bottom plate. Two reciprocating spiral channels are symmetrically arranged on the circumferential side of the second mounting shaft. A pushing and pulling part that is in transmission cooperation with the reciprocating spiral channels is slidably sleeved on the second mounting shaft. A feeding control plate is rotatably connected between the pushing and pulling part and the corresponding connecting seat.

[0014] The present invention has the following beneficial effects: 1. By controlling the rotation of the encapsulation control shaft, the present invention realizes the synchronous rotation of the first reciprocating lead screw and the second reciprocating lead screw, so that the encapsulation cover at the front end of the first conveying seat moves to the encapsulation station, and at the same time, the integrated circuit board at the front end of the second conveying seat moves to directly below the encapsulation cover at the encapsulation station. At this time, the rotation of the encapsulation control shaft is paused. The lifting encapsulation plate is controlled to move downward by the encapsulation cylinder. The downward-moving lifting encapsulation plate presses the encapsulation cover downward. During this process, the inclined surface supporting seat moves under the downward pressure and compresses the elastic element until the encapsulation cover and the integrated circuit board below it complete the snap encapsulation. Through the cooperation of the automatic feeding channels on both sides and the automatic feeding mechanism, the automation of the encapsulation feeding process is realized, which improves the efficiency of the encapsulation operation to a certain extent.

[0015] 2. By controlling the rotation of the encapsulation control shaft, the present invention realizes the synchronous rotation of the first reciprocating lead screw, the second reciprocating lead screw, and the second mounting shaft, so that the two pushing and pulling parts on the second mounting shaft start to approach. When the rotation of the encapsulation control shaft is paused again, the transfer cavity returns to its initial position. At this time, the next encapsulation cover in the automatic feeding channel falls into the transfer cavity. The next downward pressing discharge port on the first conveying seat just aligns with and is close to the material dropping port on the side of the second conveying mechanism. The encapsulation cover in the material dropping port at this position drops into the corresponding downward pressing discharge port. The elastic force of the elastic element can ensure the stable support of the inclined surface supporting seat for the encapsulation cover. The encapsulation cover at the front end of the first conveying seat moves to the encapsulation station, and at the same time, the integrated circuit board at the front end of the second conveying seat moves to directly below the encapsulation cover at the encapsulation station. The lifting encapsulation plate is controlled to move downward by the encapsulation cylinder. The downward-moving lifting encapsulation plate presses the encapsulation cover downward until the encapsulation cover and the integrated circuit board below it complete the snap encapsulation.

[0016] Of course, it is not necessary for any product implementing the present invention to simultaneously achieve all the above-mentioned advantages. Description of the Drawings

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other accompanying drawings can be obtained based on these drawings.

[0018] Figure 1 It is a schematic structural diagram of a packaging structure for an integrated circuit.

[0019] Figure 2 It is a schematic structural diagram of the packaging control mechanism in the present invention.

[0020] Figure 3 It is Figure 2 a partial structural diagram of

[0021] Figure 4 It is Figure 3 a schematic structural diagram from another angle.

[0022] Figure 5 It is Figure 3 a schematic structural diagram from a perspective view.

[0023] Figure 6 It is a schematic structural diagram of the first conveying mechanism in the present invention.

[0024] Figure 7 It is Figure 6 a schematic structural diagram from a perspective view.

[0025] Figure 8 It is a schematic structural diagram of the first conveying component in the present invention.

[0026] Figure 9 It is Figure 8 a schematic structural diagram from a perspective view.

[0027] Figure 10 It is a schematic structural diagram of the elastic supporting component in the present invention.

[0028] Figure 11 It is a schematic structural diagram of the second conveying mechanism in the present invention.

[0029] Figure 12 It is a schematic structural diagram of the second conveying component in the present invention.

[0030] Figure 13 It is a schematic structural diagram of the packaging cover in the present invention.

[0031] Figure 14 It is a coordination relationship diagram of the packaging cover and the integrated circuit board in the present invention.

[0032] Figure 15This is a schematic structural diagram of the automatic feeding mechanism in the present invention.

[0033] In the attached drawings, the list of components represented by each reference numeral is as follows:

[0034] 1 - Encapsulation control mechanism, 101 - Encapsulation control frame, 102 - First reciprocating lead screw, 103 - Second reciprocating lead screw, 104 - Lifting encapsulation tray, 105 - First encapsulation channel, 106 - Second encapsulation channel, 107 - First mounting bracket, 108 - Second mounting bracket, 109 - Encapsulation control motor, 110 - Encapsulation control shaft, 111 - First transmission wheel, 112 - Transmission worm, 113 - Second transmission wheel, 114 - First transmission belt, 115 - Transmission worm gear, 116 - First bevel gear, 117 - Second bevel gear, 118 - Encapsulation cylinder, 119 - Material guiding table, 120 - Limiting channel, 121 - Automatic feeding channel, 122 - Material dropping port, 123 - Belt through port, 2 - First conveying mechanism, 3 - First conveying assembly, 301 - First conveying seat, 302 - First supporting part, 303 - Lower pressing discharge port, 304 - Guide port, 305 - Installation cavity, 306 - Through hole, 4 - Elastic supporting assembly, 401 - Inclined surface supporting seat, 402 - Moving rod, 403 - Moving plate, 404 - Elastic element, 5 - Second conveying mechanism, 6 - Second conveying assembly, 601 - Second conveying seat, 602 - Second supporting part, 603 - Positioning groove, 7 - Automatic feeding mechanism, 701 - Sealing bottom plate, 702 - Transfer cavity, 703 - Feeding control plate, 704 - First mounting shaft, 705 - Second mounting shaft, 706 - Fixed seat, 707 - Third transmission wheel, 708 - Fourth transmission wheel, 709 - Fifth transmission wheel, 710 - Second transmission belt, 711 - Sixth transmission wheel, 712 - Third transmission belt, 713 - Connecting seat, 714 - Reciprocating spiral groove, 715 - Pushing and pulling part, 8 - Encapsulation cover, 801 - Engaging part, 9 - Integrated circuit board, 901 - Engaging groove. Specific embodiments

[0035] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0036] For Specific Embodiment 1, please refer to Figure 1-15, the present invention is a packaging structure for integrated circuits, including a packaging control mechanism 1, a first conveying mechanism 2, and a second conveying mechanism 5; the packaging control mechanism 1 includes a packaging control frame 101, a first reciprocating lead screw 102 is rotatably installed on one side of the packaging control frame 101, a second reciprocating lead screw 103 is rotatably installed on the other side of the packaging control frame 101, the first reciprocating lead screw 102 and the second reciprocating lead screw 103 are arranged crosswise and rotate synchronously, a packaging station is provided inside the packaging control frame 101, and a lifting packaging plate 104 located at the packaging station is installed inside the packaging control frame 101; the first conveying mechanism 2 is arranged on one side of the packaging control frame 101 and is slidably matched with it, the first reciprocating lead screw 102 is arranged below the first conveying mechanism 2 and is in transmission cooperation with it, the first conveying mechanism 2 includes a first conveying component 3, a plurality of elastic supporting components 4 are arranged in an array on the first conveying component 3, and a packaging cover 8 supported on the elastic supporting components 4 is arranged on the first conveying component 3; the second conveying mechanism 5 is arranged on the other side of the packaging control frame 101 and is slidably matched with it, the second reciprocating lead screw 103 is arranged below the second conveying mechanism 5 and is in transmission cooperation with it, the second conveying mechanism 5 includes a second conveying component 6, and a plurality of integrated circuit boards 9 are arranged in an array on the top of the second conveying component 6. When the packaging cover 8 at the front end of the first conveying mechanism 2 is driven by the first reciprocating lead screw 102 to move to the packaging station, the second reciprocating lead screw 103 that rotates synchronously with the first reciprocating lead screw 102 drives the integrated circuit board 9 at the front end of the second conveying mechanism 5 to move below the packaging cover 8 at the packaging station, and the buckling of the packaging cover 8 and the integrated circuit board 9 at the packaging station is realized by controlling the reciprocating movement of the lifting packaging plate 104.

[0037] In this embodiment of the present invention, a first encapsulation channel 105 corresponding to the first reciprocating lead screw 102 is provided on one side of the encapsulation control frame 101, and a second encapsulation channel 106 corresponding to the second reciprocating lead screw 103 is provided on the other side of the encapsulation control frame 101. A first mounting frame 107 and a second mounting frame 108 are fixedly arranged at the top of the encapsulation control frame 101. The output end of the encapsulation control motor 109 mounted on the top of the first mounting frame 107 is connected with an encapsulation control shaft 110. A first transmission wheel 111 is fixedly mounted on the circumferential side of the encapsulation control shaft 110. A transmission worm 112 is fixedly mounted at the top of the linkage shaft rotatably arranged at the bottom inside the encapsulation control frame 101. A second transmission wheel 113 fixedly mounted on the circumferential side of the linkage shaft is connected with the first transmission wheel 111 through a first transmission belt 114; Transmission worm wheels 115 and first bevel gears 116 are fixedly mounted on the circumferential side of the first reciprocating lead screw 102 respectively. Meshing transmission is carried out between the transmission worm 112 and the transmission worm wheel 115. A second bevel gear 117 meshing with the first bevel gear 116 is fixedly mounted at the end of the second reciprocating lead screw 103. By driving the encapsulation control shaft 110 to rotate through the encapsulation control motor 109, the first transmission wheel 111 rotating synchronously with the encapsulation control shaft 110 drives the first transmission belt 114 to rotate. The second transmission wheel 113 rotating synchronously with the first transmission belt 114 drives the transmission worm 112 to rotate. Under the action of the transmission worm 112, the transmission worm wheel 115 is driven to rotate, thereby driving the first reciprocating lead screw 102 to rotate. In this process, the first bevel gear 116 rotating synchronously with the first reciprocating lead screw 102 drives the second bevel gear 117 to rotate. Thus, the synchronous rotation of the first reciprocating lead screw 102 and the second reciprocating lead screw 103 can be realized by controlling the rotation of the encapsulation control shaft 110. An encapsulation cylinder 118 is fixedly mounted at the top of the second mounting frame 108. The lifting encapsulation disc 104 is connected to the output end of the encapsulation cylinder 118.

[0038] In this embodiment of the present invention, the first conveying assembly 3 includes a first conveying seat 301 slidably fitted in the first encapsulation channel 105. A first support portion 302 drivingly engaged with the first reciprocating lead screw 102 is fixedly provided at the rear end of the first conveying seat 301. Pressing and discharging openings 303 adapted to the encapsulation cover 8 are arranged in an array on the surface of the first conveying seat 301 (in this embodiment, the size of the pressing and discharging openings 303 can be set to be the same as that of the encapsulation cover 8 to play a positioning role during the movement of the encapsulation cover 8). A guiding opening 304 is formed inside the pressing and discharging opening 303. Mounting cavities 305 corresponding to the pressing and discharging openings 303 one by one are formed on the surface of the first conveying seat 301. The mounting cavity 305 and the corresponding guiding opening 304 are connected through a guiding through hole 306. The elastic supporting assembly 4 includes an inclined plane supporting seat 401 slidably fitted in the guiding opening 304. A moving rod 402 slidably engaged with the guiding through hole 306 is fixedly provided on one side of the inclined plane supporting seat 401. A moving plate 403 slidably fitted in the corresponding mounting cavity 305 is fixedly provided at the end of the moving rod 402. An elastic element 404 connected to the moving plate 403 is arranged inside the mounting cavity 305. The encapsulation cover 8 supported by the top of the inclined plane supporting seat 401 is in clearance fit inside the corresponding pressing and discharging opening 303. In the initial state, the moving plate 403 is in contact with the inner wall of the mounting cavity 305 close to the inclined plane supporting seat 401. Under the elastic force of the elastic element 404, the moving plate 403 is tightly attached to the inner wall of the mounting cavity 305, thereby ensuring the stability of the position of the inclined plane supporting seat 401. Whether in the initial state or when the lifting encapsulation tray 104 completes one encapsulation action, the up and down movement of the lifting encapsulation tray 104 is not interfered by the inclined plane supporting seat 401.

[0039] In this embodiment of the present invention, the second conveying assembly 6 includes a second conveying seat 601 slidably fitted in the second encapsulation channel 106. A second support portion 602 drivingly engaged with the second reciprocating lead screw 103 is fixedly provided at the rear end of the second conveying seat 601. Positioning grooves 603 adapted to the integrated circuit board 9 are arranged in an array on the surface of the second conveying seat 601 to ensure the stability of the position of the integrated circuit board 9 during the encapsulation process. Multiple sets of engaging portions 801 are installed on the inner wall of the encapsulation cover 8. Engaging grooves 901 corresponding to the engaging portions 801 one by one are provided on the side wall of the integrated circuit board 9. When the lifting encapsulation tray 104 completes one up and down reciprocating movement, through the downward pressing action of the lifting encapsulation tray 104 on the encapsulation cover 8 at the encapsulation station, the encapsulation cover 8 moves downward to be clamped with the integrated circuit board 9 below. At this time, the engaging portion 801 is fitted into the corresponding engaging groove 901.

[0040] Before the encapsulation operation, place the encapsulation covers 8 in the respective downward pressing and discharging outlets 303 on the first conveying base 301 (each encapsulation cover 8 is supported on the corresponding inclined surface supporting base 401), then place the integrated circuit board 9 in the respective positioning grooves 603 on the second conveying base 601, and then control the rotation of the encapsulation control shaft 110 to achieve the synchronous rotation of the first reciprocating lead screw 102 and the second reciprocating lead screw 103, so that the encapsulation cover 8 at the front end of the first conveying base 301 moves to the encapsulation station (i.e., the encapsulation cover 8 moves directly below the lifting encapsulation disk 104). At the same time, the integrated circuit board 9 at the front end of the second conveying base 601 moves directly below the encapsulation cover 8 at the encapsulation station. At this time, pause the rotation of the encapsulation control shaft 110, and control the lifting encapsulation disk 104 to move downward through the encapsulation cylinder 118. The downward moving lifting encapsulation disk 104 presses the encapsulation cover 8 downward. During this process, the inclined surface supporting base 401 moves under the downward pressure and compresses the elastic element 404 until the encapsulation cover 8 and the integrated circuit board 9 below it complete the snap encapsulation (during the downward pressing encapsulation process, the encapsulation cover 8 moves downward along the downward pressing and discharging outlet 303 until it completes the snap mounting with the integrated circuit board 9. At this time, the encapsulation cover 8 disengages from the corresponding downward pressing and discharging outlet 303). Subsequently, control the lifting encapsulation disk 104 to move upward through the encapsulation cylinder 118 to complete the reset. Then continue to control the rotation of the encapsulation control shaft 110 to achieve the synchronous rotation of the first reciprocating lead screw 102 and the second reciprocating lead screw 103, so that the next encapsulation cover 8 on the first conveying base 301 moves to the encapsulation station (i.e., the encapsulation cover 8 moves directly below the lifting encapsulation disk 104). At the same time, the next integrated circuit board 9 on the second conveying base 601 moves directly below the encapsulation cover 8 at the encapsulation station. At this time, pause the rotation of the encapsulation control shaft 110, and control the lifting encapsulation disk 104 to move downward through the encapsulation cylinder 118. The downward moving lifting encapsulation disk 104 presses the encapsulation cover 8 downward until the snap encapsulation of the encapsulation cover 8 and the integrated circuit board 9 is achieved. In this way, the snap encapsulation of the encapsulation cover 8 on the first conveying base 301 and the integrated circuit board 9 on the second conveying base 601 can be successively realized. The encapsulated integrated circuit board assembly passes through the second encapsulation channel 106 as the second conveying base 601 moves. During the encapsulation operation, the staff can remove the integrated circuit board assembly passing through the second encapsulation channel 106 and place a new integrated circuit board 9. Thus, the feeding operation of the integrated circuit board 9 on the second conveying base 601 is realized. At the same time, a new encapsulation cover 8 can also be placed in the empty downward pressing and discharging outlet 303 (the top surface of the encapsulation cover 8 placed in the downward pressing and discharging outlet 303 does not exceed the top surface of the first conveying base 301). When continuing to control the rotation of the encapsulation control shaft 110 to achieve the synchronous rotation of the first reciprocating lead screw 102 and the second reciprocating lead screw 103, so that the first conveying base 301 and the second conveying base 601 move in the opposite direction at the same time, the snap encapsulation of the encapsulation cover 8 and the integrated circuit board 9 at the encapsulation station can be continued (during the encapsulation operation in the reverse direction,The staff can remove the integrated circuit board assembly exiting from the second encapsulation channel 106 again and place a new integrated circuit board 9, thereby realizing the feeding operation of the integrated circuit board 9 on the second conveying seat 601. At the same time, a new encapsulation cover 8 can also be placed into the empty downward unloading outlet 303), thereby realizing the continuous encapsulation operation of the integrated circuit board 9.

[0041] Specific Embodiment 2. On the basis of Specific Embodiment 1, the present invention further includes an automatic feeding mechanism 7, and the automatic feeding mechanism 7 is installed on one side of the encapsulation control frame 101 close to the second mounting frame 108; wherein, the automatic feeding mechanism 7 includes two symmetrically arranged bottom sealing plates 701, a transfer cavity 702 is opened at the top of the bottom sealing plate 701, guide material platforms 119 are fixedly arranged on both the inner and outer sides of the encapsulation control frame 101, a limiting channel 120 is opened at the top of the guide material platform 119, the bottom sealing plate 701 is slidably attached to the top of the corresponding guide material platform 119, and the limiting members fixed to the bottom of the bottom sealing plate 701 are slidably fitted inside the limiting channel 120 (the encapsulation cover 8 falling into the transfer cavity 702 slides on the top surface of the guide material platform 119 as the bottom sealing plate 701 moves), a blanking port 122 adapted to the transfer cavity 702 is opened at the top of the guide material platform 119, and automatic feeding channels 121 are fixedly installed on both the inner and outer sides of the encapsulation control frame 101 (a number of encapsulation covers 8 are stacked and placed inside the automatic feeding channel 121, the opening of each encapsulation cover 8 faces downward, and the size of the encapsulation cover 8 is designed to be the same as that of the encapsulation cover 8 to ensure that the encapsulation cover 8 can smoothly fall into the transfer cavity 702, and the top surface of the encapsulation cover 8 falling into the transfer cavity 702 is flush with the top surface of the bottom sealing plate 701 to ensure that other encapsulation covers 8 inside the automatic feeding channel 121 will not interfere with the movement of the bottom sealing plate 701 during the movement of the bottom sealing plate 701), the automatic feeding channel 121 is arranged above the corresponding guide material platform 119 and is in contact with the top of the bottom sealing plate 701, and the top surface of the encapsulation cover 8 in the transfer cavity 702 is flush with the top surface of the bottom sealing plate 701.

[0042] In this embodiment of the present invention, the automatic feeding mechanism 7 further includes a first mounting shaft 704 and a second mounting shaft 705 disposed above it. Both the first mounting shaft 704 and the second mounting shaft 705 are rotatably connected to a fixed seat 706 on the encapsulation control frame 101. A third transmission wheel 707 is fixedly installed on the circumferential side of the first reciprocating lead screw 102. A fourth transmission wheel 708 and a fifth transmission wheel 709 are respectively and fixedly installed on the first mounting shaft 704. The third transmission wheel 707 is connected to the fourth transmission wheel 708 through a second transmission belt 710 (the second transmission belt 710 passes through the belt through-port 123). A sixth transmission wheel 711 fixedly installed on the second mounting shaft 705 is connected to the fifth transmission wheel 709 through a third transmission belt 712. A connecting seat 713 is fixedly provided on one side of the bottom sealing plate 701. Two reciprocating spiral channels 714 are symmetrically arranged on the circumferential side of the second mounting shaft 705. A pushing and pulling part 715 that is in transmission cooperation with the reciprocating spiral channels 714 is slidably sleeved on the second mounting shaft 705. A feeding control plate 703 is rotatably connected between the pushing and pulling part 715 and the corresponding connecting seat 713. In the initial state, the downward pressing discharge port 303 at the front end of the first conveying seat 301 is aligned with and close to the material dropping port 122 on one side of the second conveying mechanism 5 (i.e., Figure 1 the left material dropping port 122 in the figure). The positioning groove 603 at the front end of the second conveying seat 601 is located inside the encapsulation control frame 101. At this time, the distance between the positioning groove 603 at the front end of the second conveying seat 601 and the downward pressing discharge port 303 at the front end of the first conveying seat 301 to the encapsulation station is the same. The material dropping ports 122 on both the left and right sides are blocked by the first conveying seat 301. At the beginning, an encapsulation cover is placed into the downward pressing discharge port 303 at the front end of the first conveying seat 301 from the corresponding material dropping port 122, and at the same time, a plurality of integrated circuit boards 9 are placed into the respective positioning grooves 603 on the second conveying seat 601. Thus, the preparation work before encapsulation is completed.

[0043] Subsequently, the synchronous rotation of the first reciprocating lead screw 102 and the second reciprocating lead screw 103 is achieved by controlling the rotation of the encapsulation control shaft 110. The third transmission wheel 707 that rotates synchronously with the first reciprocating lead screw 102 drives the fourth transmission wheel 708 to rotate. The first mounting shaft 704 that rotates synchronously with the fourth transmission wheel 708 drives the fifth transmission wheel 709 to rotate. The sixth transmission wheel 711 that rotates synchronously with the fifth transmission wheel 709 drives the second mounting shaft 705 to rotate. Under the action of the reciprocating spiral channel 714, the two pushing and pulling parts 715 move in opposite directions. When the encapsulation control shaft 110 pauses rotation, the transfer cavity 702 just moves below the automatic feeding channel 121 to align with the corresponding blanking port 122. At this time, the other encapsulation covers 8 in the automatic feeding channel 121 are blocked by the sealing bottom plate 701 and will not continue to fall. However, the encapsulation covers 8 in the transfer cavities 702 on both the left and right sides fall along the blanking port 122 onto the top surface of the first conveying seat 301. The encapsulation cover 8 at the front end of the first conveying seat 301 and the integrated circuit board 9 at the front end of the second conveying seat 601 have not moved to the encapsulation station.

[0044] Then, continue to achieve the synchronous rotation of the first reciprocating lead screw 102, the second reciprocating lead screw 103, and the second mounting shaft 705 by controlling the rotation of the encapsulation control shaft 110, so that the two pushing and pulling parts 715 on the second mounting shaft 705 start to approach. When the encapsulation control shaft 110 pauses rotation again, the transfer cavity 702 returns to its initial position (i.e., the transfer cavity 702 aligns with the corresponding automatic feeding channel 121). At this time, the next encapsulation cover 8 in the automatic feeding channel 121 falls into the transfer cavity 702. The next downward pressing discharge port 303 on the first conveying seat 301 just aligns with and is close to the blanking port 122 on one side of the second conveying mechanism 5. The encapsulation cover 8 in the blanking port 122 at this position falls into the corresponding downward pressing discharge port 303 (the encapsulation cover 8 in the blanking port 122 on the right side still stays in this blanking port 122). The elastic force of the elastic element 404 can ensure the stable support of the inclined surface supporting seat 401 for the encapsulation cover 8. And the encapsulation cover 8 at the front end of the first conveying seat 301 moves to the encapsulation station (i.e., the encapsulation cover 8 moves directly below the lifting encapsulation disk 104). At the same time, the integrated circuit board 9 at the front end of the second conveying seat 601 moves directly below the encapsulation cover 8 at the encapsulation station. The lifting encapsulation disk 104 is controlled by the encapsulation cylinder 118 to move downward. The downward moving lifting encapsulation disk 104 presses the encapsulation cover 8 downward until the encapsulation cover 8 is snap - encapsulated with the integrated circuit board 9 below it.

[0045] Subsequently, continue to realize the synchronous rotation of the first reciprocating lead screw 102, the second reciprocating lead screw 103, and the second mounting shaft 705 by controlling the rotation of the encapsulation control shaft 110, so that the two pushing and pulling parts 715 move in the reverse direction again. When the rotation of the encapsulation control shaft 110 pauses again, the next downward pressing and discharging outlet 303 with the encapsulation cover 8 placed thereon moves forward to disengage from the left material dropping port 122, and the left transfer cavity 702 just moves from below the automatic feeding channel 121 to align with the corresponding material dropping port 122, so that the encapsulation cover 8 in the left transfer cavity 702 drops onto the top surface of the first conveying seat 301. At this time, the other encapsulation covers 8 in the left automatic feeding channel 121 are blocked by the sealing bottom plate 701 and will not continue to drop. At the same time, the right transfer cavity 702 just moves from below the automatic feeding channel 121 to align with the corresponding material dropping port 122. Since there is already an encapsulation cover 8 in the right material dropping port 122, the encapsulation cover 8 in the right transfer cavity 702 cannot drop.

[0046] Then continue to realize the synchronous rotation of the first reciprocating lead screw 102, the second reciprocating lead screw 103, and the second mounting shaft 705 by controlling the rotation of the encapsulation control shaft 110, so that the two pushing and pulling parts 715 on the second mounting shaft 705 start to approach. When the rotation of the encapsulation control shaft 110 pauses again, the transfer cavity 702 returns to the initial position. In this process, the left transfer cavity 702 returns to the initial position with no load. At this time, the lowermost encapsulation cover 8 in the corresponding automatic feeding channel 121 drops into this transfer cavity 702, while the right transfer cavity 702 returns to the initial position with the encapsulation cover 8 therein. At this time, the lowermost encapsulation cover 8 in the corresponding automatic feeding channel 121 cannot drop. The empty downward pressing and discharging outlet 303 at the front end of the first conveying seat 301 just moves to the right material dropping port 122. At this time, the encapsulation cover 8 in the right material dropping port 122 drops into the downward pressing and discharging outlet 303 at the front end of the first conveying seat 301 (the subsequent material feeding process of the right material dropping port 122 is the same as that of the left material dropping port 122). The third downward pressing and discharging outlet 303 on the front side of the first conveying seat 301 just moves to the left material dropping port 122. At this time, the encapsulation cover 8 in the left material dropping port 122 drops into this downward pressing and discharging outlet 303. The second encapsulation cover 8 on the front side of the first conveying seat 301 just moves to the encapsulation station. At the same time, the second integrated circuit board 9 on the front side of the second conveying seat 601 just moves to directly below the encapsulation cover 8 at the encapsulation station. Control the lifting encapsulation disc 104 to move downward through the encapsulation cylinder 118. The downward moving lifting encapsulation disc 104 presses the encapsulation cover 8 downward until the encapsulation cover 8 is snap-encapsulated with the integrated circuit board 9 below it.

[0047] Implement the encapsulation operation process in the left-to-right direction according to the same encapsulation control method as above ( Figure 1) When the downward unloading outlet 303 at the rear end of the first conveying seat 301 just moves to the blanking port 122 on the left, the encapsulation cover 8 in the blanking port 122 on the left drops into the downward unloading outlet 303. After continuing to complete the snap-fitting encapsulation of the encapsulation cover 8 and the integrated circuit board 9 below it, continue to control the rotation of the encapsulation control shaft 110 to achieve the synchronous rotation of the first reciprocating lead screw 102, the second reciprocating lead screw 103, and the second mounting shaft 705, so that the two pushing and pulling parts 715 on the second mounting shaft 705 move in the opposite direction again. When the rotation of the encapsulation control shaft 110 pauses again, the encapsulation cover 8 at the rear end of the first conveying seat 301 moves forward and disengages from the blanking port 122 on the left. The transfer cavity 702 on the left just moves below the automatic feeding channel 121 and aligns with the corresponding blanking port 122, so that the encapsulation cover 8 in the transfer cavity 702 on the left drops onto the top surface of the first conveying seat 301. At the same time, the encapsulation cover 8 in the transfer cavity 702 on the right also drops onto the top surface of the first conveying seat 301. During the above encapsulation process, the automatic feeding operation of the encapsulation cover 8 in the downward unloading outlet 303 after encapsulation is achieved through the automatic feeding channel 121 on the right. When the rotation of the encapsulation control shaft 110 is controlled again to achieve the synchronous rotation of the first reciprocating lead screw 102, the second reciprocating lead screw 103, and the second mounting shaft 705, so that the two pushing and pulling parts 715 on the second mounting shaft 705 approach each other, the encapsulation cover 8 at the rear end of the first conveying seat 301 moves forward to the encapsulation station. At the same time, the integrated circuit board 9 at the rear end of the second conveying seat 601 just moves to directly below the encapsulation cover 8 at the encapsulation station. The lifting encapsulation plate 104 is controlled to move downward by the encapsulation cylinder 118. The downward moving lifting encapsulation plate 104 presses the encapsulation cover 8 downward until the encapsulation cover 8 and the integrated circuit board 9 below it complete the snap-fitting encapsulation. During this process, the encapsulation cover 8 in the transfer cavity 702 on the left slides along the top surface of the first support part 302. At this time, the downward unloading outlet 303 at the rear end of the first conveying seat 301 is in an empty state. During the entire encapsulation process, the encapsulated integrated circuit board assembly is removed from the second conveying seat 601 and a new integrated circuit board 9 is placed.

[0048] Next, continue to control the rotation of the encapsulation control shaft 110 to achieve the synchronous rotation of the first reciprocating lead screw 102, the second reciprocating lead screw 103, and the second mounting shaft 705, so that the two pushing and pulling parts 715 on the second mounting shaft 705 move in the opposite direction again. At the same time, the first conveying seat 301 and the second conveying seat 601 start to move in the opposite direction towards the initial position. When the rotation of the encapsulation control shaft 110 pauses again, the lower pressing discharge port 303 at the rear end of the first conveying seat 301 disengages from the encapsulation station. The transfer cavity 702 on the left just moves below the automatic feeding channel 121 and aligns with the corresponding blanking port 122. The transfer cavity 702 on the left moves to the left blanking port 122 with the encapsulation cover 8 inside it. Since there is already an encapsulation cover 8 in the left blanking port 122, the encapsulation cover 8 in the transfer cavity 702 on the left cannot fall, and at the same time, the encapsulation cover 8 in the transfer cavity 702 on the right falls onto the top surface of the first conveying seat 301.

[0049] Subsequently, continue to control the rotation of the encapsulation control shaft 110 to achieve the synchronous rotation of the first reciprocating lead screw 102, the second reciprocating lead screw 103, and the second mounting shaft 705, so that the two pushing and pulling parts 715 on the second mounting shaft 705 approach each other. When the rotation of the encapsulation control shaft 110 pauses again, the transfer cavity 702 returns to the initial position. The lower pressing discharge port 303 at the rear end of the first conveying seat 301 moves to the left blanking port 122. At this time, the encapsulation cover 8 in the left blanking port 122 falls into the lower pressing discharge port 303 at the rear end of the first conveying seat 301. The second encapsulation cover 8 at the rear end of the first conveying seat 301 moves to the encapsulation station. At the same time, the integrated circuit board 9 at the rear end of the second conveying seat 601 just moves directly below the encapsulation cover 8 at the encapsulation station. Control the lifting encapsulation plate 104 to move downward through the encapsulation cylinder 118. The downward-moving lifting encapsulation plate 104 presses the encapsulation cover 8 downward until the encapsulation cover 8 is snap-encapsulated with the integrated circuit board 9 below it.

[0050] Next, continue to achieve the synchronous rotation of the first reciprocating lead screw 102, the second reciprocating lead screw 103, and the second mounting shaft 705 by controlling the rotation of the encapsulation control shaft 110, so that the two pushing and pulling parts 715 on the second mounting shaft 705 move in the reverse direction again. When the encapsulation control shaft 110 pauses rotation again, the transfer cavity 702 on the left moves to the left blanking port 122, and the encapsulation cover 8 in the left blanking port 122 falls onto the top surface of the first conveying seat 301. The transfer cavity 702 on the right moves to the right blanking port 122, and the encapsulation cover 8 in the right blanking port 122 falls onto the top surface of the first conveying seat 301. Since the encapsulation covers 8 are placed in each of the downward pressing and discharging ports 303 on the right side of the encapsulation station on the first conveying seat 301 (automatically fed by the automatic feeding channel 121 on the right during the encapsulation process when the first conveying seat 301 moves to the right), the right blanking port 122 is always occupied by an encapsulation cover 8 thereafter, and the encapsulation cover 8 in the transfer cavity 702 on the right cannot enter the right blanking port 122 anymore. During this process, when the downward pressing and discharging port 303 with the encapsulation cover 8 moves to the right blanking port 122, although the encapsulation cover 8 in the right blanking port 122 forms a stack with the encapsulation cover 8 in the corresponding downward pressing and discharging port 303, the strength setting of the elastic element 404 in this embodiment can ensure that the upper encapsulation cover 8 will not affect the lower encapsulation cover 8 (only when the downward pressure of the lifting encapsulation disc 104 is applied can the elastic element 404 be compressed), that is, the top surface of the encapsulation cover 8 in the downward pressing and discharging port 303 is still flush with the top surface of the first conveying seat 301, ensuring that the encapsulation cover 8 in the downward pressing and discharging port 303 will not interfere with the movement of the first conveying seat 301.

[0051] According to the same encapsulation control method described above, a batch of encapsulation covers 8 and integrated circuit boards 9 can be clamped and encapsulated again. When the downward unloading outlet 303 at the front end of the first conveying seat 301 returns to the blanking port 122 on the left again, the encapsulation cover 8 in the left blanking port 122 falls into the downward unloading outlet 303. At this time, the encapsulation covers 8 are placed in each downward unloading outlet 303 on the entire first conveying seat 301, thus realizing the automatic reloading of each downward unloading outlet 303 on the first conveying seat 301. The positioning slots 603 at the front end of the second conveying seat 601 also return to the initial position. At this time, new integrated circuit boards 9 are placed in each positioning slot 603. Finally, continue to control the rotation of the encapsulation control shaft 110 and continue the encapsulation operation according to the same encapsulation control method described above. The difference is that during the encapsulation operation when the first conveying seat 301 moves to the right, the automatic feeding channel 121 on the left pauses the automatic feeding, and the automatic feeding channel 121 on the right continues to automatically feed the empty downward unloading outlet 303. Subsequently, during the encapsulation operation when the first conveying seat 301 moves to the left to reset, the automatic feeding channel 121 on the right pauses the automatic feeding, and the automatic feeding channel 121 on the left continues to automatically feed the empty downward unloading outlet 303.

[0052] In the description of this specification, the descriptions referring to terms such as "one embodiment", "example", "specific example", etc. mean that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0053] The preferred embodiments of the present invention disclosed above are only used to help explain the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and variations can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principle and practical application of the present invention, so that those skilled in the relevant technical field can understand and utilize the present invention well. The present invention is only limited by the claims and their full scope and equivalents.

Claims

1. A packaging structure for an integrated circuit, characterized in that, Including: A packaging control mechanism (1), the packaging control mechanism (1) includes a packaging control frame (101), a first reciprocating lead screw (102) is rotatably installed on one side of the packaging control frame (101), a second reciprocating lead screw (103) is rotatably installed on the other side of the packaging control frame (101), the first reciprocating lead screw (102) and the second reciprocating lead screw (103) are arranged in a cross shape and rotate synchronously, a packaging station is arranged inside the packaging control frame (101), and a lifting packaging plate (104) located at the packaging station is installed inside the packaging control frame (101); A first conveying mechanism (2), the first conveying mechanism (2) is arranged on one side of the packaging control frame (101) and is slidably matched with it, the first reciprocating lead screw (102) is arranged below the first conveying mechanism (2) and is in transmission cooperation with it, the first conveying mechanism (2) includes a first conveying component (3), a plurality of elastic supporting components (4) are arranged in an array on the first conveying component (3), and a packaging cover (8) supported on the elastic supporting components (4) is arranged on the first conveying component (3); And a second conveying mechanism (5), the second conveying mechanism (5) is arranged on the other side of the packaging control frame (101) and is slidably matched with it, the second reciprocating lead screw (103) is arranged below the second conveying mechanism (5) and is in transmission cooperation with it, the second conveying mechanism (5) includes a second conveying component (6), a plurality of integrated circuit boards (9) are arranged in an array on the top of the second conveying component (6). When the packaging cover (8) at the front end of the first conveying mechanism (2) is driven by the first reciprocating lead screw (102) to move to the packaging station, the second reciprocating lead screw (103) rotating synchronously with the first reciprocating lead screw (102) drives the integrated circuit board (9) at the front end of the second conveying mechanism (5) to move below the packaging cover (8) at the packaging station, and the reciprocating movement of the lifting packaging plate (104) is controlled to realize the buckling of the packaging cover (8) and the integrated circuit board (9) at the packaging station.

2. The packaging structure for an integrated circuit according to claim 1, wherein A first packaging channel (105) corresponding to the first reciprocating lead screw (102) is opened on one side of the packaging control frame (101), a second packaging channel (106) corresponding to the second reciprocating lead screw (103) is opened on the other side of the packaging control frame (101), a first mounting frame (107) and a second mounting frame (108) are respectively fixedly arranged on the top of the packaging control frame (101), the output end of a packaging control motor (109) installed on the top of the first mounting frame (107) is connected with a packaging control shaft (110), a first transmission wheel (111) is fixedly installed on the circumferential side of the packaging control shaft (110), a transmission worm (112) is fixedly installed on the top of a linkage shaft rotatably arranged at the inner bottom of the packaging control frame (101), and a second transmission wheel (113) fixedly installed on the circumferential side of the linkage shaft is connected with the first transmission wheel (111) through a first transmission belt (114).

3. A packaging structure for an integrated circuit according to claim 2, characterized in that, The circumferential side surfaces of the first reciprocating lead screw (102) are respectively fixedly provided with a transmission worm gear (115) and a first bevel gear (116). The transmission worm (112) is in meshing transmission with the transmission worm gear (115). The end of the second reciprocating lead screw (103) is fixedly provided with a second bevel gear (117) meshing with the first bevel gear (116). The top of the second mounting bracket (108) is fixedly provided with a packaging cylinder (118). The lifting packaging disc (104) is connected to the output end of the packaging cylinder (118).

4. A packaging structure for an integrated circuit according to claim 3, characterized in that, The first conveying component (3) includes a first conveying seat (301) slidably fitted in the first packaging channel (105). A first supporting part (302) in transmission cooperation with the first reciprocating lead screw (102) is fixedly provided at the rear end of the first conveying seat (301). Pressing unloading outlets (303) adapted to the packaging cover (8) are arranged in an array on the surface of the first conveying seat (301). A guiding port (304) is formed inside the pressing unloading outlet (303). Mounting cavities (305) corresponding to the pressing unloading outlets (303) one by one are formed on the surface of the first conveying seat (301). The mounting cavity (305) and the corresponding guiding port (304) are connected through a guiding through hole (306).

5. A packaging structure for an integrated circuit according to claim 4, wherein, The elastic supporting component (4) includes an inclined plane supporting seat (401) slidably fitted in the guiding port (304). A moving rod (402) slidably fitted with the guiding through hole (306) is fixedly provided on one side of the inclined plane supporting seat (401). A moving plate (403) slidably fitted in the corresponding mounting cavity (305) is fixedly provided at the end of the moving rod (402). An elastic element (404) connected to the moving plate (403) is arranged inside the mounting cavity (305). The packaging cover (8) supported by the top of the inclined plane supporting seat (401) is in clearance fit inside the corresponding pressing unloading outlet (303).

6. A packaging structure for an integrated circuit according to claim 5, characterized in that, The second conveying component (6) includes a second conveying seat (601) slidably fitted in the second packaging channel (106). A second supporting part (602) in transmission cooperation with the second reciprocating lead screw (103) is fixedly provided at the rear end of the second conveying seat (601). Positioning grooves (603) adapted to the integrated circuit board (9) are arranged in an array on the surface of the second conveying seat (601). A plurality of engaging parts (801) are mounted on the inner wall of the packaging cover (8). Engaging grooves (901) corresponding to the engaging parts (801) one by one are arranged on the side wall of the integrated circuit board (9).

7. A packaging structure for an integrated circuit according to claim 6, characterized in that, An automatic feeding mechanism (7) is further included. The automatic feeding mechanism (7) is mounted on one side of the packaging control frame (101) close to the second mounting bracket (108). Among them, the automatic feeding mechanism (7) includes two symmetrically arranged bottom sealing plates (701). A transfer cavity (702) is provided at the top of the bottom sealing plate (701). Feeding guides (119) are fixedly arranged on both the inner and outer sides of the packaging control frame (101). A limiting channel (120) is provided at the top of the feeding guide (119). The bottom sealing plate (701) is slidably attached to the top of the corresponding feeding guide (119). The limiting member fixed to the bottom of the bottom sealing plate (701) is slidably fitted inside the limiting channel (120). A blanking port (122) adapted to the transfer cavity (702) is provided at the top of the feeding guide (119). Automatic feeding channels (121) are fixedly installed on both the inner and outer sides of the packaging control frame (101). The automatic feeding channel (121) is arranged above the corresponding feeding guide (119) and is in contact with the top of the bottom sealing plate (701). The top surface of the packaging cover (8) in the transfer cavity (702) is flush with the top surface of the bottom sealing plate (701).

8. A packaging structure for an integrated circuit according to claim 7, characterized in that, The automatic feeding mechanism (7) further includes a first mounting shaft (704) and a second mounting shaft (705) arranged above it. Both the first mounting shaft (704) and the second mounting shaft (705) are rotatably connected to the fixed seat (706) on the packaging control frame (101). A third transmission wheel (707) is fixedly installed on the circumferential surface of the first reciprocating lead screw (102). A fourth transmission wheel (708) and a fifth transmission wheel (709) are respectively fixedly installed on the first mounting shaft (704). The third transmission wheel (707) is connected to the fourth transmission wheel (708) through a second transmission belt (710). The sixth transmission wheel (711) fixedly installed on the second mounting shaft (705) is connected to the fifth transmission wheel (709) through a third transmission belt (712). A connecting seat (713) is fixedly arranged on one side of the bottom sealing plate (701). Two reciprocating spiral channels (714) are symmetrically arranged on the circumferential side of the second mounting shaft (705). A pushing and pulling part (715) that is in transmission cooperation with the reciprocating spiral channel (714) is slidably sleeved on the second mounting shaft (705). A feeding control plate (703) is rotatably connected between the pushing and pulling part (715) and the corresponding connecting seat (713).

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