Manufacturing method of circuit board assembly and circuit board assembly

Abstract

A manufacturing method of a circuit board assembly comprises the following steps that conductive paste is arranged between a first connecting area of a first circuit board and a second connecting area of a second circuit board, and the first connecting area and the second connecting area are arranged in a stacked mode so that the first circuit board can be electrically connected with the second circuit board; forming an accommodating groove in the first connecting area and the second connecting area, wherein the accommodating groove penetrates through the first connecting area and extends to at least part of the second connecting area; and filling an insulating material in the accommodating groove to form a fixed column. The invention further discloses a circuit board assembly.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board assembly, and in particular to a method for manufacturing a circuit board assembly and a circuit board assembly. Background Art

[0002] Multiple existing circuit boards are usually connected to each other using connectors, but the connectors are relatively large. Therefore, solder paste is used to achieve electrical connection between the two interconnected circuit boards, and the connection reliability of the two circuit boards is increased by bonding them with adhesive. However, during the manufacturing process, the adhesive and solder paste are placed between the two circuit boards, and then go through a re-melting process to melt and solidify the solder paste. During this process, the adhesive bonding performance of the adhesive is reduced. If high-temperature resistant thermosetting adhesive or hot melt adhesive is used, it needs to go through a high-temperature pressurized process. Pressurization in a limited connection area can easily lead to abnormalities in the solder joints, such as insufficient solder, misalignment, etc. Summary of the invention

[0003] A method for manufacturing a circuit board assembly includes the following steps: arranging a conductive paste between a first connection area of ​​a first circuit board and a second connection area of ​​a second circuit board and stacking the first connection area and the second connection area to electrically connect the first circuit board to the second circuit board; forming a receiving groove in the first connection area and the second connection area, the receiving groove passing through the first connection area and extending to at least a portion of the second connection area; and filling the receiving groove with insulating material to form a fixing column.

[0004] In some embodiments of the present application, before the step of stacking the first connection area and the second connection area, the manufacturing method further includes: forming a through hole penetrating the first connection area on the first circuit board;

[0005] After the step of stacking the first connection area and the second connection area, a part of the second connection area is exposed to the through hole; in the step of forming the receiving groove, the receiving groove is formed in the area where the through hole is located.

[0006] In some embodiments of the present application, a filler is disposed on the second connection region exposed to the through hole, and the color of the filler is different from the color of the surface of the first connection region.

[0007] In some embodiments of the present application, along a direction perpendicular to the stacking direction of the first circuit board and the second circuit board, the aperture of the positioning groove is larger than the aperture of the through hole, and the filler is also accommodated in the through hole.

[0008] In some embodiments of the present application, the material of the filler is the same as the material of the conductive paste.

[0009] In some embodiments of the present application, before the step of stacking the first connection area and the second connection area, the first circuit board includes a first circuit layer, the first connection area is provided with a first opening, and the first circuit layer is exposed to the first opening; the second circuit board includes a second circuit layer, the second connection area is provided with a second opening, and the second circuit layer is exposed to the second opening;

[0010] The conductive paste is disposed in the first opening and / or the second opening and is melted and then solidified.

[0011] A circuit board assembly includes a first circuit board, a second circuit board, a conductive paste and a fixing column, wherein the first circuit board includes a first connection area; the second circuit board includes a second connection area, and the first connection area and the second connection area are stacked; the conductive paste is arranged between the first connection area and the second connection area to electrically connect the first circuit board with the second circuit board; the fixing column passes through the first connection area and is arranged at least part of the second connection area to fix the first circuit board with the second circuit board.

[0012] In some embodiments of the present application, the fixing column penetrates both the first connection area and the second connection area.

[0013] In some embodiments of the present application, the circuit board assembly further includes a filler, which is located between the first connection area and the second connection area and surrounds the fixing column.

[0014] In some embodiments of the present application, the material of the filler is the same as the material of the conductive paste.

[0015] The manufacturing method of the circuit board assembly of the embodiment of the present application first sets a conductive paste for electrical connection between the first circuit board and the second circuit board, and then forms a fixing column for fixing, that is, it first goes through a high temperature and high pressure step. Therefore, it has no effect on the fixing effect of the subsequently formed fixing column, that is, it will not reduce the connection performance of the fixing column. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a cross-sectional schematic diagram of the first circuit board according to an embodiment of the present application.

[0017] Figure 2 For Figure 1 The schematic cross-sectional view of a circuit board after a through hole is formed is shown.

[0018] Figure 3 It is a schematic cross-sectional view of the second circuit board according to an embodiment of the present application.

[0019] Figure 4 For Figure 2 The first circuit board and Figure 3 A cross-sectional schematic diagram showing a conductive paste disposed between the second circuit boards is shown.

[0020] Figure 5 For the general Figure 4 The cross-sectional view shows a first circuit board and a second circuit board electrically connected via a conductive paste.

[0021] Figure 6 For Figure 5 The schematic cross-sectional view of the first circuit board and the second circuit board after receiving grooves are formed is shown.

[0022] Figure 7 For Figure 6 The schematic cross-sectional view of the circuit board assembly obtained after the fixing posts are formed in the receiving groove is shown.

[0023] Figure 8 FIG. 1 is a schematic cross-sectional view of a circuit board assembly according to another embodiment of the present application.

[0024] Fig. 9 It is a schematic structural diagram of the arrangement of the conductive paste and the fixing pillars in an embodiment of the present application.

[0025] Main component symbols

[0026] Circuit Board Assembly 100、100a First circuit board 10 The first dielectric layer 11 First circuit layer 13 First covering layer 15 First opening 152 Through Hole 17 First connection area 19 Second circuit board 20 Second dielectric layer 21 Second circuit layer 23 Second covering layer 25 Second opening 252 Positioning slot 254 Second connection area 27 Conductive paste 30 Filling 35 Storage tank 40、40a Fixed column 45、45a DETAILED DESCRIPTION

[0027] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application, and the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this article are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes all and any combination of one or more related listed items.

[0029] In the embodiments of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the patent application specification and claims of the present application is not limited to physical or mechanical connection, whether direct or indirect. "Up", "down", "above", "below", "left", "right", etc. are only used to indicate relative position relationship. When the absolute position of the described object changes, the relative position relationship also changes accordingly.

[0030] See also Figures 1 to 7The present application embodiment has a method for manufacturing a circuit board assembly 100, which may include the following steps:

[0031] Step S1: Please refer to Figure 1 , a first circuit board 10 having a first opening 152 .

[0032] The first circuit board 10 includes a first dielectric layer 11, a first circuit layer 13 and a first covering layer 15. The first circuit layer 13 is located on the surface of the first dielectric layer 11. The first covering layer 15 is located on the outermost layer of the first circuit board 10. The first covering layer 15 covers the first circuit layer 13 and the first dielectric layer 11 exposed to the first circuit layer 13.

[0033] The number of layers of the first dielectric layer 11 and the first circuit layer 13 is not limited. In the present embodiment, the number of layers of the first dielectric layer 11 is one layer, and the number of layers of the first circuit layer 13 is two layers. The two first circuit layers 13 are located on two opposite surfaces of the first dielectric layer 11, and the two first circuit layers 13 are electrically connected to each other.

[0034] The material of the first dielectric layer 11 can be selected from one of flexible materials such as polyimide (PI), liquid crystal polymer (LCP) and modified polyimide (MPI), or can be selected from one of hard materials such as polypropylene (PP) and polytetrafluoroethylene (PTFE).

[0035] The first opening 152 is formed on the first cover layer 15 located in the first connection area 19 of the first circuit board 10, and the first circuit layer 13 is exposed in the first opening 152. The first connection area 19 is a region of the first circuit board 10 for electrical connection. The first circuit layer 13 exposed in the first opening 152 is used for electrical connection. In this embodiment, the first opening 152 is formed on the surface of one of the first cover layers 15, and the first opening 152 penetrates the first cover layer 15.

[0036] The number and arrangement of the first openings 152 are not limited and can be arranged according to actual electrical connection requirements.

[0037] Step S2: Please refer to Figure 2 , forming a through hole 17 penetrating the first connection area 19.

[0038] The through hole 17 penetrates the first connection area 19 along the direction in which the first circuit board 10 is stacked. In this embodiment, the through hole 17 penetrates the first cover layer 15, the first circuit layer 13 and the first dielectric layer 11.

[0039] The through holes 17 are used for positioning in subsequent manufacturing processes. The number and arrangement of the through holes 17 are not limited and can be set according to actual positioning requirements.

[0040] Step S3: Please refer to Figure 3 , a second circuit board 20 having a second opening 252 .

[0041] The second circuit board 20 includes a second dielectric layer 21, a second circuit layer 23 and a second covering layer 25. The second circuit layer 23 is located on the surface of the second dielectric layer 21. The second covering layer 25 is located on the outermost layer of the second circuit board 20. The second covering layer 25 covers the second circuit layer 23 and the second dielectric layer 21 exposed to the second circuit layer 23.

[0042] The material of the second dielectric layer 21 can be selected from a flexible material or a hard material. The number of layers of the second dielectric layer 21 and the second circuit layer 23 is not limited.

[0043] The second opening 252 is located on the second cover layer 25 of the second connection area 27 of the second circuit board 20, and the second circuit layer 23 is exposed at the second opening 252. The second connection area 27 is an area of ​​the second circuit board 20 for electrically connecting to the first circuit board 10. The second circuit layer 23 exposed at the second opening 252 is used for electrical connection. In this embodiment, the second opening 252 is formed on the surface of one layer of the second cover layer 25, and the second opening 252 penetrates the second cover layer 25.

[0044] The number of the second openings 252 is the same as the number of the first openings 152. The position of each second opening 252 is corresponding to the position of one first opening 152.

[0045] The second circuit board 20 further includes a positioning groove 254, which is located in the second connection area 27 and is located on the same side of the second circuit board 20 as the second opening 252. The depth of the positioning groove 254 in the second connection area 27 is not limited. For example, the positioning groove 254 can be opened on the second cover layer 25 but does not penetrate the second cover layer 25, can penetrate the second cover layer 25, can penetrate the second cover layer 25 and be opened on the second circuit layer 23, can penetrate the second cover layer 25 and the second circuit layer 23, can penetrate the second cover layer 25 and the second circuit layer 23 and be opened on the second dielectric layer 21. In this embodiment, the positioning groove 254 penetrates the second cover layer 25, and the second circuit layer 23 is exposed to the second cover layer 25.

[0046] The number of the positioning grooves 254 is the same as the number of the through holes 17. The position of each positioning groove 254 is corresponding to the position of a through hole 17.

[0047] Step S4: Please refer to Figure 4 and Figure 5 , a conductive paste 30 is disposed between the first connection area 19 and the second connection area 27 to electrically connect the first circuit board 10 to the second circuit board 20 .

[0048] The conductive paste 30 is disposed in the first opening 152 and / or the second opening 252, the first connection area 19 is attached to the second connection area 27, and the positions of the conductive paste 30 in the first opening 152 and the second opening 252 correspond to each other. After the first circuit board 10 and the second circuit board 20 are attached, they are placed in a reflow furnace so that the conductive paste 30 is melted and fully fills the first opening 152 and the second opening 252 and then solidifies to connect the first circuit layer 13 exposed in the first opening 152 and the second circuit layer 23 exposed in the second opening 252, thereby realizing electrical connection between the first circuit board 10 and the second circuit board 20.

[0049] Before the step of attaching the first connection area 19 to the second connection area 27, a filler 35 is also filled in the positioning groove 254, and the color of the filler 35 is different from the color of the surface of the first connection area 19. In the process of attaching the first connection area 19 to the second connection area 27, since the color of the filler 35 is different from the color of the surface of the first connection area 19, the filler 35 filled in the positioning groove 254 can play a role in alignment, so that the first connection area 19 and the second connection area 27 are accurately aligned. After attaching the first connection area 19 to the second connection area 27, the filler 35 in the positioning groove 254 can be identified by observing from the through hole 17 along the direction from the first connection area 19 to the second connection area 27, so that the position of the through hole 17 corresponds to the position of the positioning groove 254, and the positions of the first opening 152 and the second opening 252 also correspond to each other.

[0050] The material of the filler 35 may be the same as that of the conductive paste 30 .

[0051] The distance between the filler 35 and the conductive paste 30 may be greater than or equal to 50 μm to match the accuracy of the printing machine for printing the conductive paste 30 .

[0052] Step S5: Please refer to Figure 6 A receiving groove 40 is formed in the first connecting area 19 and the second connecting area 27 , and the receiving groove 40 penetrates the first connecting area 19 and extends to at least a portion of the second connecting area 27 .

[0053] The receiving groove 40 is formed in the area where the through hole 17 is located, so that the receiving groove 40 is formed in the preset area.

[0054] Along the direction perpendicular to the stacking direction of the first circuit board 10 and the second circuit board 20, the aperture of the positioning groove 254 is larger than the aperture of the through hole 17. The through hole 17 is used for alignment, and the positioning groove 254 is used to accommodate the filler 35, so that the positioning groove 254 can accommodate more fillers 35. The filler 35 can move toward the through hole 17 and be accommodated in the through hole 17. The filler 35 can further play a role in alignment, so as to identify the area where the through hole 17 is located in the process of forming the receiving groove 40, which is conducive to more accurately forming the receiving groove 40 in the preset area.

[0055] In some embodiments, the aperture of the positioning groove 254 is 300 μm-400 μm, and the aperture of the through hole 17 is 100 μm-200 μm.

[0056] Step S6: Please refer to Figure 7 , an insulating material is filled in the receiving groove 40 to form a fixing column 45 , thereby obtaining the circuit board assembly 100 .

[0057] The insulating material may be a resin, such as epoxy resin. The fixing column 45 may be used to strengthen the connection strength between the first circuit board 10 and the second circuit board 20 .

[0058] When the receiving groove 40 is a through hole, the fixing column 45 formed in the receiving groove 40 passes through the first circuit board 10 and the second circuit board 20. The connection area between the fixing column 45 and the first circuit board 10 and the second circuit board 20 is large, which is beneficial to further improve the connection strength between the first circuit board 10 and the second circuit board 20.

[0059] In this embodiment, the receiving groove 40 may be a through hole that penetrates both the first connection area 19 and the second connection area 27 . Then, in the circuit board assembly 100 , the fixing column 45 penetrates both the first connection area 19 and the second connection area 27 .

[0060] See also Figure 8 In other embodiments, the receiving groove 40a can also be a blind hole that passes through the first connection area 19 and is opened in a portion of the second connection area 27. In this case, in the circuit board assembly 100a, the fixing column 45a passes through the first connection area 19 and extends to a portion of the second connection area 27.

[0061] See also Figure 7 The embodiment of the present application also has a circuit board assembly 100, which may include a first circuit board 10, a second circuit board 20, a conductive paste 30 and a fixing column 45. The conductive paste 30 electrically connects the first circuit board 10 and the second circuit board 20 to electrically connect the first circuit board 10 with the second circuit board 20. The fixing column 45 passes through the first circuit board 10 and is accommodated in at least a portion of the second circuit board 20 to strengthen the connection strength between the first circuit board 10 and the second circuit board 20.

[0062] The first circuit board 10 includes a first connection area 19, and the second circuit board 20 includes a second connection area 27. The first connection area 19 and the second connection area 27 are stacked, and the conductive paste 30 is arranged between the first connection area 19 and the second connection area 27. The conductive paste 30 is connected to the first circuit layer 13 located in the first connection area 19, and is also connected to the second circuit layer 23 located in the second connection area 27, thereby realizing the electrical connection between the first circuit board 10 and the second circuit board 20.

[0063] In some embodiments, the fixing column 45 can penetrate the first connection area 19 and the second connection area 27 at the same time. Figure 8 In other embodiments, the fixing column 45 a may penetrate the first connection area 19 and extend to a portion of the second connection area 27 .

[0064] The circuit board assembly 100 further includes a filler 35 . The filler 35 is located between the first connection area 19 and the second connection area 27 . The filler 35 surrounds the fixing column 45 , that is, the fixing column 45 passes through the filler 35 .

[0065] The material of the filler 35 can be the same as the material of the conductive paste 30. The distance between the filler 35 and the conductive paste 30 is greater than or equal to 50 μm.

[0066] See also Fig. 9 The number and arrangement of the fixing posts 45 and the conductive paste 30 can be set according to actual needs. For example, the fixing posts 45 and the conductive paste 30 are arranged in a straight line. Fig. 9 (a), (b); the fixing column 45 is located on one side of the conductive paste 30, such as Fig. 9 (c); or the fixing column 45 half surrounds the conductive paste 30; or the fixing column 45 fully surrounds the conductive paste 30, such as Fig. 9 (d) in.

[0067] In the manufacturing method of the circuit board assembly 100 of the embodiment of the present application, a conductive paste 30 for electrical connection is first arranged between the first circuit board 10 and the second circuit board 20, and then a fixing column 45 for fixing is formed, that is, a high temperature and high pressure step is first performed. Therefore, the fixing effect of the subsequently formed fixing column 45 is not affected, that is, the connection performance of the fixing column 45 will not be reduced.

[0068] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A method for manufacturing a circuit board assembly, characterized in that: The following steps are involved: Disposing conductive paste between a first connection area of ​​a first circuit board and a second connection area of ​​a second circuit board and stacking the first connection area and the second connection area to electrically connect the first circuit board and the second circuit board; A receiving groove is formed in the first connection area and the second connection area, and the receiving groove penetrates the first connection area and extends to at least a portion of the second connection area; as well as The receiving groove is filled with insulating material to form a fixing column.

2. The method for manufacturing a circuit board assembly according to claim 1, characterized in that: Before the step of stacking the first connection area and the second connection area, the manufacturing method further includes: forming a through hole penetrating the first connection area on the first circuit board; After the step of stacking the first connection region and the second connection region, a portion of the second connection region is exposed to the through hole; and In the step of forming the receiving groove, the receiving groove is formed in the area where the through hole is located.

3. The method for manufacturing a circuit board assembly according to claim 2, characterized in that: A filler is disposed on the second connection area exposed to the through hole, and the color of the filler is different from the color of the surface of the first connection area.

4. The method for manufacturing a circuit board assembly according to claim 3, characterized in that: Along a direction perpendicular to the stacking direction of the first circuit board and the second circuit board, the aperture of the positioning groove is larger than the aperture of the through hole, and the filler is also accommodated in the through hole.

5. The method for manufacturing a circuit board assembly according to claim 3 or 4, characterized in that: The material of the filler is the same as that of the conductive paste.

6. The method for manufacturing a circuit board assembly according to claim 1, characterized in that: Before the step of stacking the first connection area and the second connection area, the first circuit board includes a first circuit layer, the first connection area is provided with a first opening, and the first circuit layer is exposed to the first opening; the second circuit board includes a second circuit layer, the second connection area is provided with a second opening, and the second circuit layer is exposed to the second opening; The conductive paste is disposed in the first opening and / or the second opening to be melted and then solidified.

7. A circuit board assembly, characterized in that: include: A first circuit board including a first connection area; A second circuit board includes a second connection area, wherein the first connection area and the second connection area are stacked; Conductive paste, disposed between the first connection area and the second connection area, so as to electrically connect the first circuit board with the second circuit board; as well as A fixing post passes through the first connection area and is disposed at least partially in the second connection area to fix the first circuit board and the second circuit board.

8. The circuit board assembly according to claim 7, characterized in that: The fixing column passes through the first connection area and the second connection area at the same time.

9. The circuit board assembly according to claim 7, characterized in that: The circuit board assembly further includes a filler, which is located between the first connection area and the second connection area and surrounds the fixing column.

10. The circuit board assembly according to claim 9, characterized in that: The material of the filler is the same as that of the conductive paste.

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