Electronic device

Abstract

The invention provides an electronic device. The electronic equipment comprises a middle frame and a first antenna. The middle frame comprises a frame body and a frame, the frame is arranged on the periphery of the frame body, the frame is provided with a first frame part, and the first frame part and the frame body are arranged at an interval of a first gap; the first antenna comprises a first radiating body, a first feed source and a grounding piece, the first feed source is electrically connected to the first radiating body, the first radiating body comprises the first frame part, the first frame part is provided with a first grounding end, the first grounding end is disconnected from the frame body, and the grounding piece is electrically connected to the first radiating body. And the first grounding end is electrically connected to the frame body through the grounding piece so as to be grounded. The temperature of the first frame part of the electronic equipment provided by the embodiment of the invention is relatively low, so that the holding experience of a user when the user touches the first frame part when holding the electronic equipment can be improved.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an electronic device. Background Art

[0002] With the development of technology, electronic devices with communication functions such as mobile phones are becoming more and more popular and more powerful. However, when the functional components in the electronic devices in the related art generate heat, it is easy to transfer the heat to the frame of the middle frame, resulting in excessively high temperature of the frame. When the user holds the electronic device, the frame touches the frame, causing discomfort. Summary of the invention

[0003] In a first aspect, an embodiment of the present application provides an electronic device, the electronic device comprising:

[0004] A middle frame, the middle frame comprising a frame body and a frame, the frame being arranged at the periphery of the frame body, the frame having a first frame portion, the first frame portion being arranged with a first gap from the frame body; and

[0005] A first antenna, the first antenna includes a first radiator, a first feed source and a grounding member, the first feed source is electrically connected to the first radiator, the first radiator includes the first frame portion, the first frame portion has a first grounding end, and the first grounding end is disconnected from the frame body, and the first grounding end is electrically connected to the frame body through the grounding member for grounding.

[0006] In summary, the electronic device provided in the embodiment of the present application includes a middle frame, the middle frame includes a frame body and a frame, and the frame includes a first frame portion. The electronic device also includes a first antenna, and the first radiator of the first antenna includes the first frame portion, the first frame portion and the frame body are separated by a first gap, and the first grounding end of the first frame portion is disconnected from the frame body, so that when the heat of the functional device of the electronic device is transferred to the frame body, the heat of the frame body is difficult to be transferred to the first frame portion through the first gap. The first grounding end of the first frame portion is connected to the frame body through a grounding member to be grounded, so as to realize the grounding function of the first radiator of the first antenna. The grounding member is a component independent of the frame body and the first frame portion, so the thermal resistance of the grounding member is relatively large, so that the heat generated by the functional device of the electronic device is less than the heat transmitted to the first frame portion through the frame body and the grounding member, and the temperature of the first frame portion is relatively low. When the user holds the electronic device and touches the first frame portion, the holding feeling is more comfortable. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0008] Figure 1 A three-dimensional schematic diagram of an electronic device provided in the related art;

[0009] Figure 2 for Figure 1 A rear view of a portion of the structure of an electronic device is provided;

[0010] Figure 3 for Figure 2 Schematic diagram of heat transfer path of electronic equipment shown in;

[0011] Figure 4 for Figure 1 A temperature cloud diagram of a first frame portion of an electronic device in a gaming scenario as shown in FIG.

[0012] Figure 5 A three-dimensional schematic diagram of an electronic device provided in one embodiment of the present application;

[0013] Figure 6 for Figure 5 A rear view of a portion of the structure of the electronic device shown in ;

[0014] Figure 7 for Figure 6 The enlarged schematic diagram of point A in the middle;

[0015] Figure 8 For one embodiment Figure 7 Detailed schematic diagram of the structure shown in FIG.

[0016] Fig. 9 For another embodiment Figure 7 Detailed schematic diagram of the structure shown in FIG.

[0017] Fig.10 for Figure 7 A schematic diagram of the width of the first gap in the electronic device shown in ;

[0018] Fig.11 A temperature cloud diagram of the first frame portion of the electronic device provided in one embodiment of the present application and the electronic device in the related art in the same scene;

[0019] Fig.12 for Figure 5 A schematic diagram of an electronic device in a vertical screen state and held in one hand;

[0020] Fig.13 for Figure 5 A schematic diagram of an electronic device in a horizontal screen state;

[0021] Fig.14 for Fig.13 A schematic diagram of an electronic device provided in the figure is in landscape mode and is held by two hands;

[0022] Fig.15 A three-dimensional schematic diagram of an electronic device provided in another embodiment of the present application;

[0023] Fig.16 for Fig.15 A partial structural diagram of an electronic device provided in FIG. DETAILED DESCRIPTION

[0024] The technical solution of the present application will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the embodiments described in the present application are only a part of the embodiments, not all of the embodiments. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in this field without creative work belong to the protection scope of the present application.

[0025] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it mutually exclusive, independent, or alternative to other embodiments. It can be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments.

[0026] The terms "first", "second", etc. in the specification and claims of this application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example: a component or device including one or more parts is not limited to the one or more parts listed, but optionally includes one or more parts that are not listed but inherent to the exemplified product, or one or more parts that it should have based on the described function.

[0027] Before introducing the electronic device 1 provided in the embodiment of the present application, the electronic device 1 provided in the related art before the electronic device 1 provided in the present application is improved is first introduced in detail.

[0028] See also Figure 1 , Figure 2 and Figure 3 , Figure 1 A three-dimensional schematic diagram of an electronic device provided in the related art; Figure 2 for Figure 1 A rear view of a portion of the structure of an electronic device is provided; Figure 3 for Figure 2 Schematic diagram of heat transfer path of electronic device shown in . In the related art, electronic device 1 includes middle frame 10, first antenna 20 and functional device 80. Middle frame 10 includes frame body 110 and frame 120. Frame 120 is arranged at the periphery of frame body 110. Since middle frame 10 includes metal, frame body 110 is also called inner ring metal, and frame 120 is also called outer ring metal. Frame 120 includes first frame portion 121. The radiator of first antenna 20 includes first frame portion 121. First frame portion 121 has first grounding terminal 1211, and first grounding terminal 1211 is electrically connected to frame body 110 through connecting rib 900 for grounding. In other words, frame body 110 and first frame portion 121 are an integrated structure. Functional device 80 may be but is not limited to a main chip on a main board, etc. When functional device 80 works, heat is generated. Therefore, functional device 80 is also called a heat source. The heat generated by the functional device 80 can be easily transferred to the first frame portion 121 via the frame body 110 and the connecting ribs 900, thereby causing the temperature of the first frame portion 121 to be too high. Figure 3 In the figure, the dotted line with an arrow indicates the path of heat transfer. When a user holds the electronic device 1 and touches the first frame portion 121, discomfort will occur. Figure 2 The upper right corner of the electronic device 1 shown in FIG. is used as an example for illustration. It can be understood that this should not be construed as a limitation on the electronic device 1 provided in the embodiments of the present application.

[0029] See also Figure 4 , Figure 4 for Figure 1 The temperature cloud diagram of the first frame portion of the electronic device in the game scene shown in FIG. In this embodiment, the electronic device 1 is measured when it is displayed in the game scene with a higher picture quality (for example, 120 frames of extreme picture quality). It can be seen that the temperature of the first frame portion 121 of the electronic device 1 in the related art is as high as 41.21°C. It can be seen that the temperature of the first frame portion 121 of the electronic device 1 in the related art is relatively high.

[0030] Next, the electronic device 1 provided in the embodiment of the present application is introduced in detail. An embodiment of the present application provides an electronic device 1. The electronic device 1 includes but is not limited to mobile phones, telephones, televisions, tablet computers (Pad), personal computers, laptop computers (Personal Computer, PC), vehicle-mounted equipment, headphones, watches, wearable devices and other devices that can send and receive electromagnetic wave signals. In the schematic diagram of the embodiment of the present application, the electronic device 1 is illustrated as a mobile phone as an example. It can be understood that it should not be understood as a limitation on the electronic device 1 provided in the embodiment of the present application. The electronic device 1 provided in the embodiment of the present application is introduced.

[0031] See also Figure 5 , Figure 6 and Figure 7 , Figure 5 A three-dimensional schematic diagram of an electronic device provided in one embodiment of the present application; Figure 6 for Figure 5 A rear view of a portion of the structure of the electronic device shown in ; Figure 7 for Figure 6 An enlarged schematic diagram of point A in the figure. The electronic device 1 includes a middle frame 10 and a first antenna 20. The middle frame 10 includes a frame body 110 and a frame 120. The frame 120 is arranged at the periphery of the frame body 110. The frame 120 has a first frame portion 121. The first frame portion 121 is arranged with a first gap 120a between the frame body 110. The first antenna 20 includes a first radiator 210, a first feed source S1 and a grounding member 220. The first feed source S1 is electrically connected to the first radiator 210. The first radiator 210 includes the first frame portion 121. The first frame portion 121 has a first grounding terminal 1211, and the first grounding terminal 1211 is disconnected from the frame body 110. The first grounding terminal 1211 is electrically connected to the frame body 110 through the grounding member 220 for grounding.

[0032] The frame body 110 is the main part of the middle frame 10. The frame body 110 can be used as at least a part of the ground of the electronic device 1.

[0033] In this embodiment, the material of the middle frame 10 includes metal, and the middle frame 10 includes a frame body 110 and a frame 120. Therefore, the material of the frame body 110 includes metal, and the material of the frame 120 includes metal. For example, the material of the frame body 110 may include but not limited to aluminum-magnesium alloy, and the material of the frame 120 may include but not limited to aluminum-magnesium alloy. Since the material of the frame body 110 includes metal, the material of the frame 120 includes metal, and since the frame 120 is arranged at the periphery of the frame body 110, the frame body 110 is also called inner ring metal, and the frame 120 is also called outer ring metal.

[0034] The first frame portion 121 is a part of the frame 120. A first gap 120a is separated from the frame body 110 by the first frame portion 121. The first gap 120a may be, but is not limited to, formed by computer numerical control (CNC) processing. When the first gap 120a is formed by CNC processing, the first frame portion 121 and the frame body 110 are milled to form the first gap 120a.

[0035] The first radiator 210 includes the first frame portion 121, and the first frame portion 121 has a first grounding terminal 1211, and the first grounding terminal 1211 is disconnected from the frame body 110. Therefore, the first frame portion 121 in the first radiator 210 is disconnected from the frame body 110. Therefore, when the functional device 80 of the electronic device 1 generates heat, the heat generated by the functional device 80 is transferred to the frame body 110. Since there is the first gap 120a between the first frame portion 121 and the frame body 110, and the first grounding terminal 1211 is disconnected from the frame body 110, the first gap 120a blocks the heat of the frame body 110 from being transferred to the first frame portion 121, and the heat of the frame body 110 is also blocked from being transferred to the first grounding terminal 1211.

[0036] Furthermore, the first grounding end 1211 is electrically connected to the frame body 110 through the grounding member 220, so as to realize the grounding function of the first radiator 210. As can be seen from the above description, the first frame portion 121 and the frame body 110 are separated by a first gap 120a, and the first grounding end 1211 is disconnected from the frame body 110, so the grounding member 220 is a component independent of the frame body 110 and the first frame portion 121. In other words, the grounding member 220 and the frame body 110 are separate structures, and the grounding member 220 and the first frame portion 121 are separate structures.

[0037] In one embodiment, the thermal resistance of the grounding member 220 is greater than the thermal resistance of the connecting rib 900 in the related art. Therefore, compared with the heat of the functional device 80 of the electronic device 1 in the related art being transferred to the first frame portion 121 via the frame body 110 and the connecting rib 900, the heat generated by the functional device 80 of the electronic device 1 provided in the embodiment of the present application is less than the heat transferred to the first frame portion 121 via the frame body 110. Therefore, the maximum temperature of the first frame portion 121 of the electronic device 1 provided in the embodiment of the present application is lower than the temperature of the first frame portion 121 in the electronic device 1 in the related art.

[0038] In one embodiment, the grounding member 220 may be, but is not limited to, a steel sheet.

[0039] In summary, the electronic device 1 provided in the embodiment of the present application includes a middle frame 10, the middle frame 10 includes a frame body 110 and a frame 120, and the frame 120 includes a first frame portion 121. The electronic device 1 also includes a first antenna 20, and the first radiator 210 of the first antenna 20 includes the first frame portion 121, the first frame portion 121 and the frame body 110 are separated by a first gap 120a, and the first grounding end 1211 of the first frame portion 121 is disconnected from the frame body 110, so that when the heat of the functional device 80 of the electronic device 1 is transferred to the frame body 110, the heat of the frame body 110 is difficult to be transferred to the first frame portion 121 through the first gap 120a. The first grounding end 1211 of the first frame portion 121 is connected to the frame body 110 through the grounding member 220 to be grounded, so as to realize the grounding function of the first radiator 210 of the first antenna 20. The grounding member 220 is a component independent of the frame body 110 and the first frame portion 121, so the thermal resistance of the grounding member 220 is relatively large, so that the heat generated by the functional device 80 of the electronic device 1 is less transferred to the first frame portion 121 via the frame body 110 and the grounding member 220, and the temperature of the first frame portion 121 is relatively low. When the user holds the electronic device 1 and touches the first frame portion 121, the holding feeling is more comfortable.

[0040] The present application does not limit the frequency band supported by the first antenna 20. The frequency band supported by the first antenna 20 may be, but is not limited to, a frequency band of a communication standard such as 2G, 3G, 4G, 5G, or 6G. For example, the frequency band supported by the first frequency band may be, but is not limited to, a low frequency band (Low Band, LB), a middle frequency band (Middle Band, MB), or a high frequency band (High Band, HB).

[0041] See also Figure 7 and Figure 8 , Figure 8 For one embodiment Figure 7 The grounding member 220 includes a first connection portion 221 and a second connection portion 222. The first connection portion 221 is stacked and electrically connected to the first grounding terminal 1211. The second connection portion 222 is electrically connected to the first connection portion 221, and the second connection portion 222 is stacked and electrically connected to the frame body 110.

[0042] The first connection portion 221 and the first grounding end 1211 are stacked and electrically connected, so that a relatively large contact area can be provided between the first connection portion 221 and the first grounding end 1211, so that the electrical connection performance between the first connection portion 221 and the first grounding end 1211 is better.

[0043] The second connection portion 222 and the frame body 110 are stacked and electrically connected, so that the second connection portion 222 and the frame body 110 have a relatively large contact area, so that the electrical connection performance between the second connection portion 222 and the frame body 110 is better.

[0044] It can be seen that the electronic device 1 provided in the embodiment of the present application has good electrical connection performance between the first connecting part 221 and the first grounding terminal 1211, and has good electrical connection performance between the second connecting part 222 and the frame body 110, so that the grounding performance of the first grounding terminal 1211 is better, and the first antenna 20 has relatively good antenna performance.

[0045] Please continue reading Figure 7 and Figure 8 A plurality of first connection points 221 a are arranged at intervals between the first connection portion 221 and the first ground terminal 1211. A plurality of second connection points 222 a are arranged at intervals between the second connection portion 222 and the frame body 110.

[0046] The first connection point 221a between the first connection portion 221 and the first ground terminal 1211 may be formed by laser welding but is not limited to being formed by laser welding. When the first connection point 221a is formed by laser welding, the electrical connection performance between the first connection portion 221 and the first ground terminal 1211 is stable and reliable.

[0047] In one embodiment, the number of the first connection points 221 a may be, but is not limited to, 6 to 9. This allows the electrical connection performance between the first connection portion 221 and the first ground terminal 1211 to be stable and reliable.

[0048] In this embodiment, the plurality of first connection points 221a are divided into two groups, wherein the first connection points 221a in one of the two groups are arranged corresponding to the gap between two adjacent first connection points 221a in the other of the two groups. In this way, the stability and reliability of the electrical connection performance between the first connection portion 221 and the first ground terminal 1211 can be further improved.

[0049] The second connection point 222a between the second connection portion 222 and the frame body 110 may be, but is not limited to, formed by laser welding. When the second connection point 222a is formed by laser welding, the electrical connection performance between the second connection portion 222 and the frame body 110 is stable and reliable.

[0050] In one embodiment, the number of the second connection points 222 a may be, but is not limited to, 6 to 9. This allows the electrical connection performance between the second connection portion 222 and the frame body 110 to be stable and reliable.

[0051] In this embodiment, the plurality of second connection points 222a are divided into two groups, wherein the second connection points 222a in one of the two groups are arranged corresponding to the gap between two adjacent second connection points 222a in the other of the two groups. In this way, the stability and reliability of the electrical connection performance between the second connection portion 222 and the frame body 110 can be further improved.

[0052] For further information, please refer to Figure 7 and Figure 8 In this embodiment, the grounding member 220 further includes a third connection portion 223. One end of the third connection portion 223 is electrically connected to the first connection portion 221, and the other end of the third connection portion 223 is electrically connected to the second connection portion 222. A portion of the third connection portion 223 is arranged corresponding to the first gap 120a, and another portion of the third connection portion 223 is arranged in a stacked manner with the frame body 110.

[0053] One end of the third connection portion 223 is electrically connected to the first connection portion 221 , and the other end of the third connection portion 223 is electrically connected to the second connection portion 222 . Therefore, the first grounding terminal 1211 can be grounded through the first connection portion 221 , the third connection portion 223 and the second connection portion 222 .

[0054] Part of the third connection part 223 is arranged corresponding to the first gap 120a, and the other part of the third connection part 223 is arranged in a stacked manner with the frame body 110, so that the length of the third connection part 223 can be relatively long, and the thermal resistance of the grounding member 220 can be relatively large. When the heat of the functional device 80 of the electronic device 1 is transferred to the frame body 110, it is difficult for the heat of the frame body 110 to be transferred to the first frame part 121 via the second connection part 222, the third connection part 223 and the first connection part 221. As a result, the temperature of the first frame part 121 is relatively low. When the user holds the electronic device 1 and touches the first frame part 121, the holding feeling is more comfortable.

[0055] See also Fig. 9 , Fig. 9 For another embodiment Figure 7 The third connecting portion 223 has at least one hollow 223a.

[0056] The third connection part 223 has at least one hollow 223a, which can improve the anti-torsion characteristics of the grounding member 220 and improve the connection reliability when the first grounding end 1211 is electrically connected to the frame body 110 through the grounding member 220 when the electronic device 1 falls. On the other hand, the thermal resistance of the grounding member 220 can be increased, so that the thermal resistance of the grounding member 220 is relatively large. When the heat of the functional device 80 of the electronic device 1 is transferred to the frame body 110, it is difficult for the heat of the frame body 110 to be transferred to the first frame part 121 via the second connection part 222, the third connection part 223 and the first connection part 221. As a result, the temperature of the first frame part 121 is relatively low. When the user holds the electronic device 1 and touches the first frame part 121, the holding feeling is more comfortable.

[0057] In the schematic diagram of the present embodiment, the third connection portion 223 having two hollows 223a is taken as an example for illustration. It can be understood that this should be understood as a limitation on the embodiment of the present application.

[0058] Please continue reading Fig. 9 , the first connection part 221 and the second connection part 222 are arranged along the first direction D1. The third connection part 223 has a plurality of sub-connection parts 2231. One end of the sub-connection part 2231 is connected to the first connection part 221, and the other end of the sub-connection part 2231 is connected to the second connection part 222. The plurality of sub-connection parts 2231 are arranged at intervals along the second direction D2, and two adjacent sub-connection parts 2231 form a hollow 223a.

[0059] The second direction D2 is different from the first direction D1. In this embodiment, the second direction D2 is perpendicular or approximately perpendicular to the first direction D1.

[0060] In this embodiment, the width of the sub-connection portion 2231 is smaller than the width of the first connection portion 221, and the width of the sub-connection portion 2231 is smaller than the width of the second connection portion 222. Therefore, the thermal resistance of the sub-connection portion 2231 is relatively large, making it difficult for the heat of the frame body 110 to be transferred to the first connection portion 221 and the first frame portion 121 through the third connection portion 223. The temperature of the first frame portion 121 is relatively low, and when the user holds the electronic device 1 and contacts the first frame portion 121, the holding feeling is more comfortable.

[0061] Further, the third connection portion 223 has a plurality of sub-connection portions 2231. One end of the sub-connection portion 2231 is connected to the first connection portion 221, and the other end of the sub-connection portion 2231 is connected to the second connection portion 222. The plurality of sub-connection portions 2231 are arranged at intervals in the second direction D2, and two adjacent sub-connection portions 2231 form a hollow 223a, so that the hollow 223a can be formed more conveniently.

[0062] In this embodiment, the third connection portion 223 having three sub-connection portions 2231 to form two hollows 223a is taken as an example for illustration. It can be understood that this should not be construed as a limitation on the embodiments of the present application.

[0063] In one embodiment, when the plurality of sub-connecting portions 2231 form a plurality of hollows 223a arranged along the second direction D2, the size of each hollow 223a in the second direction D2 is equal. In this way, the torsion resistance of the grounding member 220 can be improved, and the connection reliability when the first grounding end 1211 is electrically connected to the frame body 110 through the grounding member 220 when the electronic device 1 falls can be improved. On the other hand, the thermal resistance of the grounding member 220 can be increased, so that the thermal resistance of the grounding member 220 is relatively large. When the heat of the functional device 80 of the electronic device 1 is transferred to the frame body 110, the heat of the frame body 110 is difficult to be transferred to the first frame portion 121 via the second connecting portion 222, the third connecting portion 223 and the first connecting portion 221. Thereby, the temperature of the first frame portion 121 is relatively low. When the user holds the electronic device 1 and touches the first frame portion 121, the holding feeling is more comfortable.

[0064] Please also read Figure 6 , Figure 7 , and see Fig.10 , Fig.10 for Figure 7 A schematic diagram of the width of the first gap in the electronic device is shown in FIG. The width W1 of the first gap 120a satisfies: 0.6 mm ≤ W1 ≤ 2 mm.

[0065] The width W1 of the first gap 120a may be, but is not limited to, 0.6 mm, or 0.7 mm, or 0.8 mm, or 0.9 mm, or 1 mm, or 1.1 mm, or 1.2 mm, or 1.3 mm, or 1.4 mm, or 1.5 mm, or 1.6 mm, or 1.7 mm, or 1.8 mm, or 1.9 mm, or 2 mm.

[0066] The first frame portion 121 is separated from the frame body 110 by a first gap 120a, and the width W1 of the first gap 120a satisfies: 0.6mm≤W1≤2mm, so that when the heat of the functional device 80 of the electronic device 1 is transferred to the frame body 110, it is difficult for the heat of the frame body 110 to be transferred to the first frame portion 121 through the first gap 120a. The temperature of the first frame portion 121 is relatively low. When the user holds the electronic device 1 and touches the first frame portion 121, the holding feeling is more comfortable.

[0067] Please continue reading Fig.10 The width of the grounding member 220 is greater than the width of the first gap 120a, and the width W2 of the grounding member 220 satisfies: 1.0mm≤W2≤3.5mm.

[0068] The width of the grounding member 220 is greater than the width of the first gap 120 a , so that the grounding member 220 can cross the first gap 120 a and ensure electrical connection with the first grounding end 1211 and the frame body 110 .

[0069] The width W2 of the grounding member 220 may be, but is not limited to, 1.0 mm, 1.5 mm, 2.0 mm, 2.5 mm, 3.0 mm, or 3.5 mm.

[0070] In this way, the grounding member 220 can be electrically connected to the first grounding terminal 1211 in a better manner, and the grounding member 220 can be electrically connected to the frame body 110 in a better manner.

[0071] Furthermore, in one embodiment, the thermal conductivity of the grounding member 220 is smaller than the thermal conductivity of the frame body 110 , and the thickness of the grounding member 220 is smaller than the thickness of the frame body 110 .

[0072] The larger the thermal conductivity of an object, the better the thermal conductivity; correspondingly, the smaller the thermal conductivity of an object, the worse the thermal conductivity. The thermal conductivity of the grounding member 220 is smaller than the thermal conductivity of the frame body 110. Therefore, it is difficult for the heat of the frame body 110 to be transferred to the grounding member 220. Then, it is difficult for the heat of the frame body 110 to be transferred to the first frame portion 121 via the grounding member 220. The temperature of the first frame portion 121 is relatively low. When the user holds the electronic device 1 and touches the first frame portion 121, the holding feeling is more comfortable.

[0073] Furthermore, the thickness of the grounding member 220 is smaller than the thickness of the frame body 110, thereby further making the thermal resistance of the grounding member 220 larger, and the heat of the frame body 110 is difficult to be transferred to the grounding member 220, and then, the heat of the frame body 110 is difficult to be transferred to the first frame portion 121 via the grounding member 220. The temperature of the first frame portion 121 is relatively low. When the user holds the electronic device 1 and touches the first frame portion 121, the holding feeling is more comfortable.

[0074] In one embodiment, the grounding member 220 includes a steel sheet, and a thickness d1 of the grounding member 220 satisfies: 0.05 mm ≤ d1 ≤ 0.2 mm.

[0075] The first grounding member includes a steel sheet, and the thermal conductivity of the steel sheet is relatively small. Therefore, when the grounding member 220 includes a steel sheet, the thermal conductivity of the grounding member 220 is relatively small.

[0076] The thermal conductivity of the steel sheet is 14W / m / k to 16W / m / k, wherein W is the unit of power consumption, m is the unit of length, and k is the unit of temperature.

[0077] In the related art, the material of the connecting rib 900 is an aluminum-magnesium alloy, and the thermal conductivity of the aluminum-magnesium alloy is 150W / m / k to 180W / m / k.

[0078] In one embodiment, the material of the frame body 110 provided in the embodiment of the present application is an aluminum-magnesium alloy, and the material of the first frame portion 121 is also an aluminum-magnesium alloy.

[0079] The thickness d1 of the grounding member 220 may be, but is not limited to, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm, 0.15 mm, 0.16 mm, 0.17 mm, 0.18 mm, 0.19 mm, or 0.2 mm.

[0080] The thermal resistance of the grounding member 220 is not only related to the thermal conductivity of the grounding member 220, but also to the thickness of the grounding member 220. When the thermal conductivity of the grounding member 220 is constant, the greater the thickness of the grounding member 220, the smaller the thermal resistance of the grounding member 220. Correspondingly, the smaller the thickness of the grounding member 220, the greater the thermal resistance of the grounding member 220.

[0081] In one embodiment, when the grounding member 220 includes a steel sheet, the thickness d1 of the grounding member 220 satisfies: 0.05 mm ≤ d1 ≤ 0.2 mm, and therefore, the thermal resistance of the grounding member 220 is relatively large. It is difficult for the heat of the frame body 110 to be transferred to the first frame portion 121 via the grounding member 220. The temperature of the first frame portion 121 is relatively low. When the user holds the electronic device 1 and contacts the first frame portion 121, the holding feeling is relatively comfortable.

[0082] See also Fig.11 , Fig.11 This is a temperature cloud diagram of the first frame portion of an electronic device provided in an embodiment of the present application and an electronic device in the related art in the same scene. Fig.11 (a) is a temperature cloud diagram of the side where the first frame portion 121 is located of the electronic device 1 provided in an embodiment of the present application in a preset scenario; Fig.11 (b) is a temperature cloud map of the side of the first border portion 121 of the electronic device 1 in the related art where the preset scene is located. In an implementation, the electronic device 1 is measured when displaying at a higher picture quality (for example, 120 frames of extreme picture quality) in a game scene. It can be seen that the maximum temperature of the first border portion 121 of the electronic device 1 provided in the implementation of the present application is 39.50°C, and the maximum temperature of the first border portion 121 of the electronic device 1 in the related art is 41.02°C. It can be seen that compared with the electronic device 1 in the related art, the maximum temperature of the first border portion 121 of the electronic device 1 provided in the implementation of the present application has dropped by 1.71°C.

[0083] In summary, the electronic device 1 provided in one embodiment of the present application creatively adopts a steel sheet spot welding solution, replacing the frame body 110 of the middle frame 10 described in the related art with the first frame portion 121 connected by connecting ribs 900 as an integrated structure. The electronic device 1 provided in the embodiment of the present application not only meets the ground return requirement (i.e. a certain resistivity) when the first antenna 20 realizes antenna performance, but also greatly increases the thermal resistance of the frame body 110 to the frame 120, optimizing the user's thermal grip experience in the game scenario. The maximum temperature of the first frame portion 121 is optimized by more than 1.7°C.

[0084] In the electronic device 1 provided in one embodiment of the present application, since the frame body 110 and the first frame portion 121 are electrically connected through the grounding member 220, the frame body 110 and the first frame portion 121 are not an integral structure. Therefore, the electronic device 1 provided in the embodiment of the present application allows different conductive materials to be used between the frame body 110 and the first frame portion 121. The material of the frame body 110 can be metal, so the frame body 110 is also called the inner ring metal. The material of the first frame portion 121 can also be metal, so the first frame portion 121 is also called the outer ring metal. In one embodiment, the frame body 110 is made of die-cast integrated aluminum alloy, and the first frame portion 121 is made of high-gloss aluminum alloy. The frame body 110 and the first frame portion 121 can be processed by CNC technology.

[0085] It should be noted that, in the electronic device 1 provided in the embodiment of the present application, the material of the grounding member 220 may be, but is not limited to, a steel sheet, and may also be an aluminum sheet or a copper foil.

[0086] In one implementation, the thickness d1 of the grounding member 220 satisfies: 0.05 mm ≤ d1 ≤ 0.2 mm.

[0087] In one embodiment, the width W2 of the grounding member 220 satisfies: 1.0 mm ≤ W2 ≤ 3.5 mm. In another embodiment, when the width of the grounding member 220 is greater than the width of the first gap 120 a , the width W2 of the grounding member 220 satisfies: 0.05 mm ≤ W2 ≤ 10 mm.

[0088] In the electronic device 1 in one embodiment, the width W1 of the first gap 120a is greater than or equal to 0.6mm, the grounding member 220 includes a steel sheet, the thickness d1 of the grounding member 220 is 0.08mm, the width W2 of the grounding member 220 is 3mm, the grounding member 220 and the first grounding end 1211 are welded to form a first connection point 221a, in other words, the first connection point 221a is a welding point, and the number of the first connection points 221a is 6 to 9, and the grounding member 220 and the frame body 110 are welded to form a second connection point 222a, in other words, the second connection point 222a is a welding point, and the number of the second connection points 222a is 6 to 9. The beneficial effects of the electronic device 1 provided by this embodiment are described above and will not be repeated here.

[0089] See also Figure 5 , Fig.12 , Fig.13 and Fig.14 , Fig.12 for Figure 5A schematic diagram of an electronic device in a vertical screen state and held in one hand; Fig.13 for Figure 5 A schematic diagram of an electronic device in a horizontal screen state; Fig.14 for Fig.13 A schematic diagram of an electronic device provided in the figure is in a horizontal screen state and is held by both hands. The electronic device 1 has a first side 1a, a second side 1b and a third side 1c that are bent and connected in sequence. The third side 1c is arranged opposite to the first side 1a. The length of the second side 1b is greater than the length of the first side 1a, and the length of the second side 1b is greater than the length of the third side 1c. The first radiator 210 is arranged corresponding to the first side 1a; or, a portion of the first radiator 210 is arranged corresponding to an end of the first side 1a adjacent to the second side 1b and another portion of the first radiator 210 is arranged corresponding to an end of the second side 1b adjacent to the first side 1a; or, a portion of the first radiator 210 is arranged corresponding to the third side 1c; or, a portion of the first radiator 210 is arranged corresponding to an end of the third side 1c adjacent to the second side 1b and another portion of the first radiator 210 is arranged corresponding to an end of the second side 1b adjacent to the third side 1c.

[0090] In this embodiment, the length of the second side 1b is greater than the length of the first side 1a, and the length of the second side 1b is greater than the length of the third side 1c. Therefore, the first side 1a is the short side of the electronic device 1, the second side 1b is the long side of the electronic device 1, and the third side 1c is the short side of the electronic device 1.

[0091] In the schematic diagram of this embodiment, when the electronic device 1 is in a portrait state, the first side 1a is the top side of the electronic device 1, the second side 1b is the side side of the electronic device 1, and the third side 1c is the bottom side of the electronic device 1. It can be understood that in other embodiments, when the electronic device 1 is in a portrait state, the first side 1a is the bottom side of the electronic device 1, the second side 1b is the side side of the electronic device 1, and the third side 1c is the top side of the electronic device 1.

[0092] The first radiator 210 is arranged corresponding to the first side 1a; or, part of the first radiator 210 is arranged corresponding to one end of the first side 1a adjacent to the second side 1b and the other part of the first radiator 210 is arranged corresponding to one end of the second side 1b adjacent to the first side 1a; or, part of the first radiator 210 is arranged corresponding to the third side 1c; or, part of the first radiator 210 is arranged corresponding to one end of the third side 1c adjacent to the second side 1b and the other part of the first radiator 210 is arranged corresponding to one end of the second side 1b adjacent to the third side 1c. Therefore, when the electronic device 1 is in the horizontal screen state, the first radiator 210 is easier to be held by the user's hand.

[0093] When the user holds the electronic device 1 in the horizontal screen state with both hands, the top area, the bottom area and the corners of the four sides of the electronic device 1 are all the user's high-light holding areas, which are also the core experience areas for the user to experience the temperature when holding the electronic device 1. In the electronic device 1 provided in the embodiment of the present application, the position of the first radiator 210 is set, so that when the electronic device 1 is in the horizontal screen state, the first radiator 210 is easier to be held by the user's hand.

[0094] As can be seen from the above description, the first radiator 210 is the first frame portion 121. The thermal resistance of the grounding member 220 is relatively large, so that the heat generated by the functional device 80 of the electronic device 1 is less transferred to the first frame portion 121 via the frame body 110 and the grounding member 220, and the temperature of the first frame portion 121 is relatively low. When the user holds the electronic device 1 and touches the first frame portion 121, the holding feeling is more comfortable.

[0095] See also Fig.15 and Fig.16 , Fig.15 A three-dimensional schematic diagram of an electronic device provided in another embodiment of the present application; Fig.16 for Fig.15A schematic diagram of a partial structure of an electronic device provided in . In this embodiment, the frame 120 also has a second frame portion 122. The second frame portion 122 is located in the middle of the second side 1b. A portion of the second frame portion 122 is arranged with a second gap 120b between the frame body 110, and one end of the second frame portion 122 is an integral structure with the frame body 110. The electronic device 1 also includes a second antenna 30. The second antenna 30 includes a second radiator 310 and a second feed source S2. The second feed source S2 is electrically connected to the second radiator 310, and the second radiator 310 includes the second frame portion 122, and the second frame portion 122 has a second ground terminal 1221, and the second ground terminal 1221 is an integral structure with the frame body 110.

[0096] In one embodiment, the second side 1b includes a first section 11b adjacent to the first side 1a, a second section 12b away from the first side 1a, and a third section 13b located between the first section 11b and the second section 12b. In the figure, a dotted line is used to indicate the boundary between the first section 11b and the third section 13b, and a dotted line is used to indicate the boundary between the third section 13b and the second section 12b. In one embodiment, the length of the first section 11b, the length of the second section 12b, and the length of the third section 13b are all equal.

[0097] The third section 13b is located between the first section 11b and the second section 12b, so in this embodiment, the third section 13b is the middle of the second side 1b. In other words, the middle of the second side 1b includes the midpoint of the second side 1b, the midpoint of the middle of the second side 1b is the midpoint of the second side 1b, and the length of the middle of the second side 1b is one third of the length of the second side 1b. It can be understood that in this embodiment, the middle of the second side 1b includes the midpoint of the second side 1b, the midpoint of the middle of the second side 1b is the midpoint of the second side 1b, and the length of the middle of the second side 1b is 40% of the length of the second side 1b, or approximately 40%.

[0098] The second frame portion 122 is located in the middle of the second side 1 b . Therefore, when the electronic device 1 is in a horizontal state and is held by both hands, the second frame portion 122 cannot be touched or is difficult to be touched.

[0099] One end of the second frame portion 122 is integrally formed with the frame body 110. For example, one end of the second frame portion 122 is connected to the frame body 110 via a connecting rib 900. Specifically, the second frame portion 122, the frame body 110 and the connecting rib 900 are integrally formed.

[0100] The second radiator 310 of the second antenna 30 includes the second frame portion 122, the second frame portion 122 includes a second grounding terminal 1221, the second grounding terminal 1221 and the frame body 110 are an integral structure, specifically, the one end of the second frame portion 122 is the second grounding terminal 1221 of the second frame portion 122. The second grounding terminal 1221 and the frame body 110 are connected to the frame body 110 through a connecting rib 900. Specifically, the second frame portion 122, the frame body 110 and the connecting rib 900 are an integral structure.

[0101] When the second radiator 310 is processed by using the middle frame 10, since one end of the second frame portion 122 (i.e., the second grounding end 1221) is an integral structure with the frame body 110, the second grounding end 1221 does not need to be cut off. Therefore, on the one hand, the cost of processing the middle frame 10 can be reduced, and on the other hand, the antenna performance of the second antenna 30 can be improved.

[0102] Since the second frame portion 122 is located in the middle of the second side 1b, when the electronic device 1 is in the horizontal screen state and is held by both hands, the user's hands cannot touch or are difficult to touch the second frame portion 122. Therefore, when the electronic device 1 is in the horizontal screen state and is held by both hands, even if the heat of the functional device 80 of the electronic device 1 is transferred to the frame body 110 and then transferred to the second frame portion 122 via the frame 120 body, the user is not likely to feel the heat of the second frame portion 122.

[0103] In another embodiment, the frame body 110 and the frame 120 are completely milled off to prevent the temperature of the frame body 110 from being transferred to the frame 120. When the frame body 110 is made of metal and the frame 120 is made of metal, the frame body 110 is also called the inner ring metal and the frame 120 is also called the outer ring metal. The frame body 110 and the frame 120 are completely milled off, which can also be called the inner ring metal and the outer ring metal are completely milled off. In this way, the temperature of the inner ring metal can be prevented from being transferred to the outer ring metal.

[0104] Furthermore, in one embodiment, the electronic device 1 further includes a display screen 50 and a back cover 60. The display screen 50 is disposed on one side of the middle frame 10. The display screen 50 is a component for realizing a display function in the electronic device 1. The display screen 50 may be, but is not limited to, a screen with a touch function, or a screen without a touch function, which is not limited in the present application. The back cover 60 is disposed on the other side of the middle frame 10. In other words, the back cover 60 and the display screen 50 are respectively disposed on two opposite sides of the middle frame 10. When the electronic device 1 further includes a battery, the back cover 60 is also referred to as a battery cover. The material of the back cover 60 may be metal or non-metal, which is not limited in the present embodiment.

[0105] The above is part of the implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. An electronic device, characterized in that: The electronic device comprises: A middle frame, the middle frame comprising a frame body and a frame, the frame being arranged at the periphery of the frame body, the frame having a first frame portion, the first frame portion being arranged with a first gap from the frame body; and A first antenna, the first antenna includes a first radiator, a first feed source and a grounding member, the first feed source is electrically connected to the first radiator, the first radiator includes the first frame portion, the first frame portion has a first grounding end, and the first grounding end is disconnected from the frame body, and the first grounding end is electrically connected to the frame body through the grounding member for grounding.

2. The electronic device according to claim 1, wherein: The grounding element comprises: A first connecting portion, the first connecting portion and the first grounding end are stacked and electrically connected; and The second connection portion is electrically connected to the first connection portion, and the second connection portion is stacked and electrically connected to the frame body.

3. The electronic device according to claim 2, characterized in that: There are a plurality of first connection points arranged at intervals between the first connection portion and the first grounding end; A plurality of second connection points are arranged at intervals between the second connection portion and the frame body.

4. The electronic device according to claim 2, characterized in that: The grounding element further comprises: A third connection part, one end of the third connection part is electrically connected to the first connection part, the other end of the third connection part is electrically connected to the second connection part, the third connection part is arranged corresponding to the first gap, and the other part of the third connection part is stacked with the frame body.

5. The electronic device according to claim 4, characterized in that: The third connecting portion has at least one hollow portion.

6. The electronic device according to claim 5, characterized in that: The first connection portion and the second connection portion are arranged along a first direction; The third connection part has a plurality of sub-connection parts, one end of each sub-connection part is connected to the first connection part, and the other end of each sub-connection part is connected to the second connection part. The plurality of sub-connection parts are arranged at intervals in the second direction, and two adjacent sub-connection parts form a hollow.

7. The electronic device according to claim 1, wherein: The width W1 of the first gap satisfies: 0.6 mm≤W1≤2 mm.

8. The electronic device according to claim 7, characterized in that: The width of the grounding piece is greater than the width of the first gap, and the width W2 of the grounding piece satisfies: 1.0 mm≤W2≤3.5 mm.

9. The electronic device according to claim 1 or 8, characterized in that: The thermal conductivity of the grounding member is smaller than the thermal conductivity of the frame body, and the thickness of the grounding member is smaller than the thickness of the frame body.

10. The electronic device according to claim 9, characterized in that: The grounding member includes a steel sheet, and a thickness d1 of the grounding member satisfies: 0.05 mm ≤ d1 ≤ 0.2 mm.

11. The electronic device according to claim 1, wherein: The electronic device comprises a first side, a second side and a third side which are bent and connected in sequence, the third side is arranged opposite to the first side, the length of the second side is greater than the length of the first side, and the length of the second side is greater than the length of the third side; Wherein, the first radiator is arranged corresponding to the first side; Alternatively, a portion of the first radiator is disposed corresponding to an end of the first side adjacent to the second side, and another portion of the first radiator is disposed corresponding to an end of the second side adjacent to the first side; Alternatively, a portion of the first radiator is arranged corresponding to the third side; Alternatively, a portion of the first radiator is disposed corresponding to an end of the third side adjacent to the second side, and another portion of the first radiator is disposed corresponding to an end of the second side adjacent to the third side.

12. The electronic device according to claim 11, characterized in that: The frame further comprises a second frame portion, the second frame portion is located in the middle of the second side, a portion of the second frame portion is spaced apart from the frame body by a second gap, and one end of the second frame portion is an integral structure with the frame body; the electronic device further comprises: The second antenna comprises a second radiator and a second feed source, the second feed source is electrically connected to the second radiator, the second radiator comprises the second frame portion, the second frame portion has a second ground terminal, and the second ground terminal is an integral structure with the frame body.

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