Double-sided heat dissipation liquid cooling plate and electrical equipment
By designing parallel and series flow path structures for double-sided heat dissipation liquid cooling plates, the flow of coolant was optimized, solving the problems of large temperature difference and high cost of coolant, and achieving improved efficient heat dissipation and space utilization.
Patent Information
- Application Number
- CN202411887815.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-11-25
- Estimated Expiration
- 2044-12-20
AI Technical Summary
In existing PCS liquid cooling technology, the large temperature difference between the front and rear ends of the coolant in the pipe results in poor heat dissipation and requires more coolant to fill the cooling plate, increasing costs.
A double-sided heat dissipation liquid cooling plate is designed, which adopts parallel first and second loop modules and a series third loop module. By adjusting the pipe diameter and flow path design, the flow path of the coolant is optimized, the temperature difference is reduced and the heat dissipation area is increased.
It improves the heat dissipation of the PCS, reduces the amount of coolant used, lowers costs, and increases the integration and space utilization of electrical equipment.
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Figure CN119562502B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of liquid cooling plate, and particularly relates to a double-sided heat dissipation liquid cooling plate and electrical equipment. BACKGROUND
[0002] PCS is a bidirectional energy storage converter, and functions to convert alternating current into direct current and convert direct current into alternating current. At present, the heat dissipation modes of PCS mainly include forced air cooling and liquid cooling. Compared with air cooling, liquid cooling has the advantages of fast heat dissipation, low noise and low energy consumption.
[0003] However, in the existing PCS liquid cooling technology, the following two common modes are mainly included. The first mode is to divide the cooling plate into multiple cooling flow channels by using a partition plate in the liquid cooling plate, so as to prolong the flow route of the cooling liquid. However, although the heat dissipation area of the cooling plate is expanded, more cooling liquid needs to be introduced to fill the cooling plate with liquid, thereby increasing the cost. The second mode is to coil a pipe in the liquid cooling plate. However, the temperature difference of the cooling liquid in the front end and the rear end of the pipe is large, and when the cooling liquid flows to the rear end of the pipe, the temperature of the cooling liquid is high, and the heat dissipation effect is poor. SUMMARY
[0004] The present application provides a double-sided heat dissipation liquid cooling plate to solve the technical problems that more cooling liquid needs to be introduced to fill the cooling plate with liquid, thereby increasing the cost, and the temperature difference of the cooling liquid in the front end and the rear end of the pipe is large, thereby resulting in poor heat dissipation effect of the rear end of the pipe.
[0005] In order to solve the above technical problems, the present application provides a double-sided heat dissipation liquid cooling plate, both ends of the double-sided heat dissipation liquid cooling plate are provided with an inlet and an outlet, the double-sided heat dissipation liquid cooling plate has a first area close to the inlet, a second area close to the outlet, and an edge area away from the inlet and the outlet, and a heat dissipation pipe is coiled in the double-sided heat dissipation liquid cooling plate, the heat dissipation pipe includes:
[0006] An inlet pipe, the inlet pipe includes a first pipe, a second pipe and a third pipe, a first end of the first pipe is in communication with the inlet, first ends of the second pipe and the third pipe are in communication with a second end of the first pipe, and a pipe diameter of the third pipe is greater than a pipe diameter of the second pipe;
[0007] An outlet pipe, the outlet pipe includes a fourth pipe, a fifth pipe, a sixth pipe and a seventh pipe, a first end of the fourth pipe is in communication with the outlet, and first ends of the fifth pipe, the sixth pipe and the seventh pipe are in communication with a second end of the fourth pipe;
[0008] a first loop module located in the first area, the inlet pipe being located at a side of the first loop module away from the second area, an inlet of the first loop module being in communication with the second end of the second pipe, and an outlet of the first loop module being in communication with the second end of the fifth pipe;
[0009] a second loop module located in the second area, an inlet of the second loop module being in communication with the second end of the third pipe, and an outlet of the second loop module being in communication with the second end of the sixth pipe;
[0010] a third loop module located in the edge area, an inlet of the third loop module being in communication with the outlet of the second loop module and the second end of the sixth pipe, a diameter of the inlet of the third loop module being greater than a pipe diameter of the sixth pipe, and an outlet of the third loop module being in communication with the second end of the seventh pipe.
[0011] Further, a relationship among a volume of the first pipe, a volume of the second pipe and a volume of the third pipe is as follows:
[0012] D1 2 L1=D2 2 L2+D3 2 L3
[0013] wherein D1 is a pipe diameter of the first pipe, L1 is a length of the first pipe, D2 is a pipe diameter of the second pipe, L2 is a length of the second pipe, D3 is a pipe diameter of the third pipe, and L3 is a length of the third pipe.
[0014] Further, a relationship among the pipe diameter of the first pipe, the pipe diameter of the second pipe and the pipe diameter of the third pipe is as follows:
[0015] D1=2.3D2=1.5D3
[0016] wherein D1 is a pipe diameter of the first pipe, D2 is a pipe diameter of the second pipe, and D3 is a pipe diameter of the third pipe.
[0017] Further, the first loop module comprises a first inlet pipe, a first cooling pipe and a first outlet pipe, one end of the first inlet pipe being in communication with the second end of the second pipe, the first cooling pipe comprising a plurality of first branches, an inlet of each of the first branches being in communication with the other end of the first inlet pipe, and an outlet of each of the first branches being in communication with one end of the first outlet pipe, the other end of the first outlet pipe being in communication with the second end of the fifth pipe.
[0018] Further, the pipe diameter of the first inlet pipe gradually decreases from one end close to the second pipe to the other end, wherein the pipe diameter of the beginning end of the first inlet pipe is 3 times of the pipe diameter of the end.
[0019] Further, the second circuit module comprises a second liquid inlet pipeline, a second cooling pipeline and a second liquid outlet pipeline, one end of the second liquid inlet pipeline is communicated with the second end of the third pipeline, the second cooling pipeline comprises a plurality of second branches, the inlet of each second branch is communicated with the other end of the second liquid inlet pipeline, the outlet of each second branch is communicated with one end of the second liquid outlet pipeline, and the other end of the second liquid outlet pipeline is communicated with the second end of the sixth pipeline.
[0020] Further, the pipe diameter of the second liquid inlet pipeline gradually decreases from one end close to the third pipeline to the other end, wherein the initial pipe diameter of the second liquid inlet pipeline is 4.5 times the terminal pipe diameter.
[0021] Further, the third circuit module comprises a third liquid inlet pipeline, a third cooling pipeline and a third liquid outlet pipeline, one end of the third liquid inlet pipeline is communicated with the outlet of the second liquid outlet pipeline and the second end of the sixth pipeline, the third cooling pipeline comprises a plurality of third branches, fourth branches and a plurality of fifth branches, the inlet of each third branch is communicated with the other end of the third liquid inlet pipeline, the outlet of each third branch is communicated with the inlet of the fourth branch, the inlet of each fifth branch is communicated with the outlet of the fourth branch, the outlet of each fifth branch is communicated with one end of the third liquid outlet pipeline, and the other end of the third liquid outlet pipeline is communicated with the second end of the seventh pipeline.
[0022] Further, the pipe diameter of the third liquid inlet pipeline is greater than the pipe diameter of the third liquid outlet pipeline.
[0023] The embodiment of the present application also provides an electrical equipment, which comprises a cabinet body and a first power board, a second power board, a plurality of first inverter inductors, a plurality of second inverter inductors and the above-mentioned double-sided heat dissipation liquid cooling plate arranged in the cabinet body.
[0024] One end of the first power board and the second power board is located in the first area, and the other end is located in the second area, the first power board and the second power board are arranged back to back, and the first power board and the second power board are spaced apart.
[0025] The plurality of first inverter inductors and the plurality of second inverter inductors are located in the edge area, the plurality of first inverter inductors are located on the side surface of the first power board, the plurality of second inverter inductors are located on the side surface of the second power board, and the first inverter inductors and the second inverter inductors are arranged back to back.
[0026] The double-sided heat dissipation liquid cooling plate is located between the first power board and the second power board and between the first inverter inductor and the second inverter inductor.
[0027] The embodiment of the present application has the following beneficial effects:
[0028] The inlet of the first loop module of the double-sided heat dissipation liquid cooling plate is communicated with the second pipe, the outlet of the first loop module is communicated with the fifth pipe, the inlet of the second loop module is communicated with the third pipe, and the outlet of the second loop module is communicated with the sixth pipe, that is, the first loop module and the second loop module are connected in parallel, so that the cooling liquid in the liquid inlet pipe flows to the first loop module from the second pipe and flows to the second loop module from the third pipe at the same time, and since the first loop module is located in the first area close to the liquid inlet, the second loop module is located in the second area close to the liquid outlet, and the pipe diameter of the second pipe is smaller than that of the third pipe, the cooling liquid flows to the second loop module more and faster, thereby shortening the time difference between the cooling liquid reaching the first loop module and the second loop module. And the cooling liquid in the liquid inlet pipe directly flows into the first loop module and the second loop module, compared with the connection mode of the first loop module and the second loop module in the prior art, the temperature difference between the first loop module and the second loop module can be greatly reduced, so that the cooling effect can be achieved in each area of the double-sided heat dissipation liquid cooling plate, and the heat dissipation effect of the double-sided heat dissipation liquid cooling plate is improved.
[0029] The inlet of the third loop module is communicated with the outlet of the second loop module, and the outlet of the third loop module is communicated with the seventh pipe, that is, the third loop module is connected in series with the second loop module, the second liquid outlet pipe of the second loop module is communicated with the third liquid inlet pipe and the sixth pipe, and the pipe diameter of the third liquid inlet pipe is smaller than that of the sixth pipe, so that the second liquid outlet pipe flows more into the third liquid inlet pipe, and the third loop module realizes cooling and heat dissipation. Since the first liquid outlet pipe of the first loop module is communicated with the fifth pipe, the cooling liquid directly flows to the liquid outlet, and in the case that the cooling liquid circulation of the cooling equipment is not affected, the cooling liquid flowing out of the second loop module flows to the third loop module for heat dissipation, so that the heat dissipation area can be expanded, and the amount of cooling liquid supplied does not need to be increased.
[0030] The first power plate and the second power plate of the electrical equipment are spaced apart and oppositely arranged, one end of the first power plate and the second power plate is located in the first area, and the other end is located in the second area, and the above-mentioned double-sided heat dissipation liquid cooling plate can improve the overall heat dissipation effect of the first power plate and the second power plate, so that the temperature of the first power plate and the second power plate can be maintained at a certain low temperature; and the first power plate and the second power plate are arranged on the two surfaces of the double-sided heat dissipation liquid cooling plate respectively, so that the first power plate and the second power plate can be cooled at the same time, thereby improving the integration of the bidirectional energy storage converter and reducing the occupied space.
[0031] The plurality of first inverter inductors and the plurality of second inverter inductors are located in the edge area, and the third loop module cools the plurality of first inverter inductors and the plurality of second inverter inductors, thereby expanding the heat dissipation area of the double-sided heat dissipation liquid cooling plate and reducing the temperature of the case body. BRIEF DESCRIPTION OF DRAWINGS
[0032] Figure 1 is a structural schematic diagram of a double-sided heat dissipation liquid cooling plate;
[0033] Figure 2 is a structural schematic diagram of a heat dissipation pipe;
[0034] Figure 3 is a symbol marking schematic diagram of a liquid inlet pipe;
[0035] Figure 4 is a structural schematic diagram of an electrical device;
[0036] Figure 5 is a three-dimensional schematic diagram of the internal structure of an electrical device;
[0037] Figure 6 is a planar schematic diagram of the internal structure of an electrical device;
[0038] Among them, the reference signs of the drawings of the specification are as follows:
[0039] 100, double-sided heat dissipation liquid cooling plate, 1001, liquid inlet, 1002, liquid outlet, 100a, first area, 100b, second area, 100c, edge area, 200, case body, 300, first power plate, 400, second power plate, 500, first inverter inductor, 600, second inverter inductor, 700, circulating fan;
[0040] 10, liquid inlet pipe, 101, first pipe, 102, second pipe, 103, third pipe, 11, first loop module, 111, first liquid inlet pipeline, 112, first cooling pipeline, 1121, first branch, 113, first liquid outlet pipeline, 12, second loop module, 121, second liquid inlet pipeline, 122, second cooling pipeline, 1221, second branch, 123, second liquid outlet pipeline, 13, third loop module, 131, third liquid inlet pipeline, 132, third cooling pipeline, 1321, third branch, 1322, fourth branch, 1323, fifth branch, 133, third liquid outlet pipeline, 14, liquid outlet pipe, 141, fourth pipe, 142, fifth pipe, 143, sixth pipe, 144, seventh pipe, 15, extension pipe. DETAILED DESCRIPTION
[0041] The specific embodiments of the present application will be further described in detail below in conjunction with the drawings and examples. The following examples are used to illustrate the present application, but are not used to limit the scope of the present application.
[0042] In the description of the application, it needs to be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of facilitating the description of the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation to the application. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can be explicitly or implicitly included one or more of the features. In the description of the application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.
[0043] In the description of the application, it needs to be noted that, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, it can be direct connection, or indirect connection through intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.
[0044] In the present application, unless otherwise explicitly specified and limited, the "upper" or "lower" of the first feature to the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the "upper", "upper" and "upper" of the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "below", "below" and "below" of the first feature to the second feature include that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0045] Embodiment one
[0046] Please refer to Figures 1 to 3The embodiment of the present application provides a double-sided heat dissipation liquid cooling plate 100, characterized in that the double-sided heat dissipation liquid cooling plate 100 is provided with a liquid inlet 1001 and a liquid outlet 1002 at two ends, the double-sided heat dissipation liquid cooling plate 100 has a first area 100a close to the liquid inlet 1001, a second area 100b close to the liquid outlet 1002 and an edge area 100c away from the liquid inlet 1001 and the liquid outlet 1002, and the double-sided heat dissipation liquid cooling plate 100 is internally coiled with a heat dissipation pipe, and the heat dissipation pipe comprises:
[0047] The liquid inlet pipe 10 comprises a first pipe 101, a second pipe 102 and a third pipe 103, the first end of the first pipe 101 is communicated with the liquid inlet 1001, the first ends of the second pipe 102 and the third pipe 103 are communicated with the second end of the first pipe 101, and the pipe diameter of the third pipe 103 is greater than that of the second pipe 102;
[0048] The liquid outlet pipe 14 comprises a fourth pipe 141, a fifth pipe 142, a sixth pipe 143 and a seventh pipe 144, the first end of the fourth pipe 141 is communicated with the liquid outlet 1002, and the first ends of the fifth pipe 142, the sixth pipe 143 and the seventh pipe 144 are communicated with the second end of the fourth pipe 141;
[0049] The first loop module 11 is located in the first area 100a, the liquid inlet pipe 10 is located on the side of the first loop module 11 away from the second area 100b, the inlet of the first loop module 11 is communicated with the second end of the second pipe 102, and the outlet of the first loop module 11 is communicated with the second end of the fifth pipe 142;
[0050] The second loop module 12 is located in the second area 100b, the inlet of the second loop module 12 is communicated with the second end of the third pipe 103, and the outlet of the second loop module 12 is communicated with the second end of the sixth pipe 143;
[0051] The third loop module 13 is located in the edge area 100c, the inlet of the third loop module 13 is communicated with the outlet of the second loop module 12 and the second end of the sixth pipe 143, the inlet caliber of the third loop module 13 is greater than the pipe diameter of the sixth pipe 143, and the outlet of the third loop module 13 is communicated with the second end of the seventh pipe 144.
[0052] Specifically, the liquid inlet 1001 and the liquid outlet 1002 can be located on the same end face of the double-sided heat dissipation liquid cooling plate 100, but the liquid inlet 1001 and the liquid outlet 1002 are located at two ends of the double-sided heat dissipation liquid cooling plate 100. Of course, the liquid inlet 1001 and the liquid outlet 1002 can also be separately arranged on two opposite end faces of the double-sided heat dissipation liquid cooling plate 100.
[0053] In one embodiment, the double-sided heat dissipation liquid cooling plate 100 is arranged in the case 200 of the electrical equipment, the inlet 1001 is connected to the outlet of the cooling device through the extension pipe 15, the outlet 1002 is connected to the return port of the cooling device through the extension pipe 15, and the extension pipe 15 is arranged in the case 200 to connect the double-sided heat dissipation liquid cooling plate 100 and the cooling device.
[0054] In this embodiment, when the inlet 1001 is arranged at the lower left end of the double-sided heat dissipation liquid cooling plate 100 and the outlet 1002 is arranged at the lower right end of the double-sided heat dissipation liquid cooling plate 100, the first area 100a is the lower left half of the double-sided heat dissipation liquid cooling plate 100, the second area 100b is the lower right half of the double-sided heat dissipation liquid cooling plate 100, and the upper half is the part away from the inlet 1001 and the outlet 1002, that is, the edge area 100c.
[0055] In this embodiment, the inlet pipe 10 is used to connect the outlet of the cooling device, the outlet of the cooling device is communicated with the inlet 1001, the inlet 1001 is communicated with the first pipe 101, and the cooling device transmits the cooled cooling liquid to the first pipe 101 and flows out from the second pipe 102 and the third pipe 103.
[0056] The outlet pipe 14 is used to connect the return port of the cooling device, the return port of the cooling device is communicated with the outlet 1002, and the fourth pipe 141 is communicated with the outlet 1002. The cooling liquid flowing through the first loop module 11, the second loop module 12 and the third loop module 13 is respectively converged into the fourth pipe 141 from the fifth pipe 142, the sixth pipe 143 and the seventh pipe 144, and then flows to the outlet 1002. After the cooling liquid flows through the double-sided heat dissipation liquid cooling plate 100, it is cooled and heated in the cooling device to realize circulation.
[0057] In this embodiment, the inlet of the first loop module 11 is communicated with the second pipe 102, the outlet of the first loop module 11 is communicated with the fifth pipe 142, the inlet of the second loop module 12 is communicated with the third pipe 103, and the outlet of the second loop module 12 is communicated with the sixth pipe 143, that is, the first loop module 11 and the second loop module 12 are connected in parallel, so that the cooling liquid flows to the first loop module 11 from the second pipe 102 and flows to the second loop module 12 from the third pipe 103. Since the pipe diameter of the second pipe 102 is set to be smaller than that of the third pipe 103, the cooling liquid flows to the second loop module 12 more and faster, thereby shortening the time difference between the cooling liquid reaching the first loop module 11 and the second loop module 12.
[0058] The first loop module 11 and the second loop module 12 are connected in parallel, so that the cooling liquid in the liquid inlet pipe 10 can directly flow to the first loop module 11 and the second loop module 12, the temperature difference between the cooling liquid in the first loop module 11 and the second loop module 12 and the cooling liquid in the liquid inlet pipe 10 is small, and the heat dissipation effect is better. It can be applied to large-size circuit boards and / or circuit boards with a large number of heat-generating components, such as large-size power boards with a large number of MOS tubes.
[0059] It can be understood that in the case that a large number of MOS tubes are installed on the power board, the length extension direction of the power board can be substantially the same as the arrangement direction of the first loop module 11 and the second loop module 12, that is, one end of the power board is located in the first area 100a and the other end is located in the second area 100b; or the first loop module 11 and the second loop module 12 are uniformly distributed according to the actual situation of the power board, so that the first loop module 11 and the second loop module 12 simultaneously dissipate heat for the whole power board, and the temperature difference of the whole power board is small, and the heat dissipation effect is better.
[0060] The inlet of the third loop module 13 is communicated with the outlet of the second loop module 12, and the outlet of the third loop module 13 is communicated with the seventh pipe 144, that is, the third loop module 13 is connected in series with the second loop module 12. Since the cooling liquid of the third loop module 13 flows through the second loop module 12, compared with the components that need to be cooled by the first loop module 11 and the second loop module 12, the third loop module 13 can be used to cool the components with smaller heat.
[0061] When the cooling liquid flowing through the second loop module 12 flows out of the outlet, since the inlet diameter of the third loop module 13 is larger than the pipe diameter of the sixth pipe 143, most of the cooling liquid flows to the third loop module 13, and a small part of the cooling liquid flows to the sixth pipe 143, and finally flows to the liquid outlet 1002.
[0062] In this invention, the first loop module 11 and the second loop module 12 are connected in parallel, allowing the coolant in the inlet pipe 10 to simultaneously flow into both the first loop module 11 and the second loop module 12. The first loop module 11 is located in the first zone 100a near the inlet 1001, and the second loop module 12 is located in the second zone 100b near the outlet 1002. The diameter of the second pipe 102 is smaller than that of the third pipe 103, allowing more coolant to flow into the second loop module 12 more and faster, thereby shortening the time difference between the coolant reaching the first loop module 11 and the second loop module 12. Furthermore, the coolant in the inlet pipe 10 flows directly into the first loop module 11 and the second loop module 12. Compared to the prior art's series connection of the first loop module 11 and the second loop module 12, this invention can significantly reduce the temperature difference between the first loop module 11 and the second loop module 12, enabling all areas of the double-sided heat dissipation liquid cooling plate 100 to achieve a cooling effect simultaneously, thus improving the heat dissipation effect of the double-sided heat dissipation liquid cooling plate 100.
[0063] The third loop module 13 is connected in series with the second loop module 12. The second outlet pipe 123 of the second loop module 12 is connected to the third inlet pipe 131 and the sixth pipe 143. The diameter of the third inlet pipe 131 is smaller than that of the sixth pipe 143, allowing more coolant to flow into the third inlet pipe 131 from the second outlet pipe 123, thus enabling the third loop module 13 to cool down. Since the first outlet pipe 113 of the first loop module 11 is connected to the fifth pipe 142, the coolant flows directly to the outlet 1002. Without affecting the coolant circulation of the cooling equipment, the coolant flowing out of the second loop module 12 flows to the third loop module 13 for heat dissipation, which can expand the heat dissipation area without significantly increasing the amount of coolant supplied.
[0064] like Figure 3 As shown, specifically, the relationship between the volumes of the first tube, the second tube, and the third tube is as follows:
[0065] D1 2 L1 = D2 2 L2+D3 2 L3
[0066] In the formula, D1 is the diameter of the first pipe, L1 is the length of the first pipe, D2 is the diameter of the second pipe, L2 is the length of the second pipe, D3 is the diameter of the third pipe, and L3 is the length of the third pipe.
[0067] Specifically, the relationship between the diameters of the first pipe, the second pipe, and the third pipe is as follows:
[0068] D1 = 2.3D2 = 1.5D3
[0069] In the formula, D1 is the pipe diameter of the first pipe, D2 is the pipe diameter of the second pipe, and D3 is the pipe diameter of the third pipe.
[0070] Specifically, the first loop module 11 includes a first liquid inlet pipe 111, a first cooling pipe 112, and a first liquid outlet pipe 113. One end of the first liquid inlet pipe 111 is in communication with the second end of the second pipe 102. The first cooling pipe 112 includes a plurality of first branches 1121. The inlet of each first branch 1121 is in communication with the other end of the first liquid inlet pipe 111. The outlet of each first branch 1121 is in communication with one end of the first liquid outlet pipe 113. The other end of the first liquid outlet pipe 113 is in communication with the second end of the fifth pipe 142.
[0071] Preferably, the pipe diameter of the first liquid inlet pipe 111 gradually decreases from the end close to the second end of the second pipe 102 to the other end. The initial pipe diameter of the first liquid inlet pipe 111 is 3 times the final pipe diameter. Because the pipe diameter of the first liquid inlet pipe 111 gradually decreases from the end close to the second end of the second pipe 102 to the other end, the inlet diameter of the first branch 1121 closer to the second end of the second pipe 102 is larger.
[0072] More specifically, the pipe diameter of the first liquid inlet pipe 111 can also gradually decrease in a stepped manner from the end close to the second end of the second pipe 102 to the other end. Adjacent two first branches 1121 are located in different steps, i.e., the inlet diameters of adjacent two first branches 1121 are different.
[0073] Specifically, the second loop module 12 includes a second liquid inlet pipe 121, a second cooling pipe 122, and a second liquid outlet pipe 123. One end of the second liquid inlet pipe 121 is in communication with the second end of the third pipe 103. The second cooling pipe 122 includes a plurality of second branches 1221. The inlet of each second branch 1221 is in communication with the other end of the second liquid inlet pipe 121. The outlet of each second branch 1221 is in communication with one end of the second liquid outlet pipe 123. The other end of the second liquid outlet pipe 123 is in communication with the second end of the sixth pipe 143.
[0074] Preferably, the pipe diameter of the second liquid inlet pipe 121 gradually decreases from the end close to the second end of the third pipe 103 to the other end. The initial pipe diameter of the second liquid inlet pipe 121 is 4.5 times the final pipe diameter. Because the pipe diameter of the second liquid inlet pipe 121 gradually decreases from the end close to the second end of the third pipe 103 to the other end, the inlet diameter of the second branch 1221 closer to the second end of the third pipe 103 is larger.
[0075] More specifically, the pipe diameter of the second liquid inlet pipe 121 can also gradually decrease in a stepped manner from the end close to the second end of the third pipe 103 to the other end. Adjacent two second branches 1221 are located in different steps, i.e., the inlet diameters of adjacent two second branches 1221 are different.
[0076] In this embodiment, the first branch 1121 and the second branch 1221 are both formed by bending and folding a single pipe, specifically by folding it four times. This extends the flow path of the coolant in the first branch 1121 and the second branch 1221, thereby extending the cooling time and improving the cooling effect.
[0077] The number of the first branch 1121 can be 6, and the number of the second branch 1221 can also be 6. The number of the first branch 1121 and the second branch 1221 can be adjusted according to the size of the power board that needs to be cooled.
[0078] Specifically, the outlet diameter of each first branch 1121 can be equal, and the outlet diameter of each second branch 1221 can be equal.
[0079] like Figure 2 As shown, in this embodiment, the inlet pipe 10 is located on the left side of the first loop module 11. The left end of the first inlet pipe 111 is connected to the second end of the second pipe 102, and the right end extends outward and gradually tapers. Specifically, each first branch 1121 is connected to the first inlet pipe 111, and multiple first branches 1121 are arranged horizontally in a straight line. From left to right, the diameter of the first inlet pipe 111 gradually tapers.
[0080] The second loop module 12 is located to the right of the first loop module 11. The left end of the second liquid inlet pipe 121 is connected to the third pipe 103, and the right end extends outward and gradually becomes thinner. Specifically, each second branch 1221 is connected to the second liquid inlet pipe 121. Multiple second branches 1221 are arranged horizontally in a straight line. From left to right, the diameter of the second liquid inlet pipe 121 gradually becomes thinner.
[0081] Specifically, the third loop module 13 includes a third liquid inlet pipe 131, a third cooling pipe 132, and a third liquid outlet pipe 133. One end of the third liquid inlet pipe 131 is connected to the outlet of the second liquid outlet pipe 123 and the second end of the sixth pipe 143. The third cooling pipe 132 includes multiple third branches 1321, a fourth branch 1322, and multiple fifth branches 1323. The inlet of each third branch 1321 is connected to the other end of the third liquid inlet pipe 131, the outlet of each third branch 1321 is connected to the inlet of the fourth branch 1322, the inlet of each fifth branch 1323 is connected to the outlet of the fourth branch 1322, the outlet of each fifth branch 1323 is connected to one end of the third liquid outlet pipe 133, and the other end of the third liquid outlet pipe 133 is connected to the second end of the seventh pipe 144.
[0082] In this embodiment, the third loop module 13 is located above the first loop module 11 and the second loop module 12. There are two third branches 1321 and two fifth branches 1323, which extend the cooling path of the third branch 1321 and the fifth branch 1323 and improve the heat dissipation effect.
[0083] In other embodiments, due to the water flow of the two third branches 1321 merging into the fourth branch 1322, the pipe diameter of the fourth branch 1322 can be larger than that of the third branch 1321 and the fifth branch 1323, so that the water flow flows gently into the fifth branch 1323 and slows down the pipe pressure of the fourth branch 1322.
[0084] Preferably, the pipe diameter of the third liquid inlet pipe 131 is larger than that of the third liquid outlet pipe 133, in order to slow down the flow rate of the cooling liquid in the fifth branch 1323 and improve the heat dissipation effect of the third loop module 13.
[0085] Embodiment two
[0086] Please refer to Figures 1 to 6 The embodiment of the present application also provides an electrical equipment, which comprises a cabinet body 200 and a first power board 300, a second power board 400, a plurality of first inverter inductors 500, a plurality of second inverter inductors 600 and the above-mentioned double-sided heat dissipation liquid cooling plate 100 arranged in the cabinet body 200.
[0087] One end of the first power board 300 and the second power board 400 is located in the first area 100a, and the other end is located in the second area 100b. The first power board 300 and the second power board 400 are arranged back to back, and the first power board 300 is spaced apart from the second power board 400.
[0088] The plurality of first inverter inductors 500 and the plurality of second inverter inductors 600 are located in the edge area 100c. The plurality of first inverter inductors 500 are located on the side of the first power board 300, and the plurality of second inverter inductors 600 are located on the side of the second power board 400. The first inverter inductor 500 and the second inverter inductor 600 are arranged back to back.
[0089] The double-sided heat dissipation liquid cooling plate 100 is located between the first power board 300 and the second power board 400, and the first inverter inductor 500 and the second inverter inductor 600.
[0090] Specifically, the electrical equipment is a bidirectional energy storage converter.
[0091] The connection between the top plate, the four surrounding side walls and the bottom plate of the cabinet body 200 is sealed with a sealing strip, which is used to seal the gap at the connection, seal the space in the cabinet body 200 and protect the internal circuit board. Specifically, the extension pipe 15 can pass out from one side wall of the cabinet body 200, and the gap between the extension pipe 15 and the side wall of the cabinet body 200 is also sealed with a sealing strip. Other interfaces on the side wall are selected to meet the IP65 protection level, so that the waterproof level of the cabinet body 200 reaches IP65.
[0092] The first power plate 300 is spaced from the second power plate 400, and the first power plate 300 in the embodiment can be fixedly connected to the upper surface of the double-sided heat dissipation liquid cooling plate 100 through a stud, and the second power plate 400 can be fixedly connected to the lower surface of the double-sided heat dissipation liquid cooling plate 100 through a stud.
[0093] The main components installed on the first power plate 300 and the second power plate 400 in the embodiment are a plurality of MOS tubes, which generate heat during operation and are the main heat sources of the first power plate 300 and the second power plate 400. In order to avoid burning out the components, the first power plate 300 and the second power plate 400 need to be cooled. The cooling method for the plurality of MOS tubes in the embodiment is that the plurality of MOS tubes are in contact with the surface of the double-sided heat dissipation liquid cooling plate 100, and the heat of the MOS tubes is directly transferred to the double-sided heat dissipation liquid cooling plate 100.
[0094] In the embodiment, the bidirectional energy storage converter can be specifically an 800KW bidirectional energy storage converter. The 800KW bidirectional energy storage converter in the prior art is usually formed by connecting two 400KW bidirectional energy storage converters in series, but this obviously occupies a large space. In the embodiment, the two 400KW bidirectional energy storage converters are integrated in the case body 200 to improve the integration of the bidirectional energy storage converter. Since the existing liquid cooling plate has poor heat dissipation effect, the temperature difference between the cooling liquid in the cooling pipeline close to the liquid inlet 1001 and the cooling liquid in the cooling pipeline close to the liquid outlet 1002 is large. If the 800KW bidirectional energy storage converter uses one pipeline to flow from the cooling pipeline inlet of the liquid inlet 1001 to the outlet, the heat dissipation effect is not ideal, which affects the actual use of the 800KW bidirectional energy storage converter.
[0095] Therefore, the 800KW bidirectional energy storage converter in the embodiment uses the above-mentioned double-sided heat dissipation liquid cooling plate 100. The first loop module 11 and the second loop module 12 of the double-sided heat dissipation liquid cooling plate 100 can be distributed at the left end and the right end of the first power plate 300 and the second power plate 400. The cooling liquid flows into the first loop module 11 and the second loop module 12 at the same time, which reduces the temperature difference of the cooling liquid flowing into the first loop module 11 and the second loop module 12, and can cool the left end and the right end of the first power plate 300 and the second power plate 400 at the same time, so that the overall heat temperature of the first power plate 300 and the second power plate 400 is small. That is, the use of the above-mentioned double-sided heat dissipation liquid cooling plate 100 can improve the overall heat dissipation effect of the first power plate 300 and the second power plate 400, so that the temperature of the first power plate 300 and the second power plate 400 can be maintained at a certain low temperature. Moreover, the first power plate 300 and the second power plate 400 are arranged on the two surfaces of the double-sided heat dissipation liquid cooling plate 100 respectively, so that the first power plate 300 and the second power plate 400 can be cooled at the same time, thereby improving the integration of the bidirectional energy storage converter and reducing the occupied space.
[0096] Specifically, the back-to-back arrangement of the first power plate 300 and the second power plate 400 means that the back surface of the first power plate 300 is opposite to the back surface of the second power plate 400, and the orthographic projection of the first power plate 300 and the second power plate 400 overlaps.
[0097] The back-to-back arrangement of the first inverter inductor 500 and the second inverter inductor 600 means that the heat dissipation surface of the first inverter inductor 500 is opposite to the heat dissipation surface of the second power plate 400, and the orthographic projection of the first power plate 300 and the second power plate 400 overlaps.
[0098] The back-to-back arrangement of the first power plate 300 and the second power plate 400 and the back-to-back arrangement of the first inverter inductor 500 and the second inverter inductor 600 make it possible to sandwich the double-sided heat dissipation liquid cooling plate 100 between the first power plate 300 and the second power plate 400 and the first inverter inductor 500 and the second inverter inductor 600, and simultaneously dissipate heat from the components on both sides of the double-sided heat dissipation liquid cooling plate 100, which helps to improve the integration of the bidirectional energy storage converter and reduce the volume of the bidirectional energy storage converter and the occupied space.
[0099] Since the plurality of first inverter inductors 500 and the plurality of second inverter inductors 600 are also heat-generating components, but the heat dissipation amount of the first inverter inductors 500 and the second inverter inductors 600 is less than that of the MOS tubes on the first power plate 300 and the second power plate 400, the cooling liquid flowing through the second loop module 12 can also meet the required heat dissipation effect.
[0100] As shown in FIG. 1, the first power plate 300 and the second power plate 400 are arranged in a back-to-back manner. Figure 5 As shown in FIG. 1, the first inverter inductor 500 can be attached to the upper surface of the double-sided heat dissipation liquid cooling plate 100, and the second inverter inductor 600 can be attached to the lower surface of the double-sided heat dissipation liquid cooling plate 100, directly contacting and conducting heat. Preferably, heat-conducting mud can also be arranged between the first inverter inductor 500 and the upper surface of the double-sided heat dissipation liquid cooling plate 100 and between the second inverter inductor 600 and the lower surface of the double-sided heat dissipation liquid cooling plate 100 to promote heat transfer.
[0101] In the embodiment, the first power plate 300 is horizontally extended and placed, one end of the first power plate 300 is located in the first area 100a, and the other end is located in the second area 100b. The first loop module 11 dissipates heat for the part of the first power plate 300 located in the first area 100a, and the second loop module 12 dissipates heat for the part of the first power plate 300 located in the second area 100b. The inlet pipe 10 simultaneously communicates the first loop module 11 and the second loop module 12, so that the cooling liquid simultaneously flows into the first loop module 11 and the second loop module 12, thereby making the overall heat difference of the first power plate 300 small and the heat dissipation effect better. Since the first power plate 300 and the second power plate 400 are oppositely arranged, the heat dissipation principle of the second power plate 400 is the same as that of the first power plate 300, which will not be described here.
[0102] The plurality of first inverter inductors 500 are located above the first power plate 300 and arranged along the length direction of the first power plate 300. The first inverter inductor 500 is located in the edge area 100c. Since the heat of the first inverter inductor 500 is smaller than that of the first power plate 300, the cooling liquid flowing through the second loop module 12 can be used to flow into the third loop module 13 to dissipate heat for the first inverter inductor 500, thereby expanding the heat dissipation area of the double-sided heat dissipation liquid cooling plate 100 and reducing the temperature of the case body 200. The second inverter inductor 600 is oppositely arranged with the first inverter inductor 500, and the second inverter inductor 600 is also located in the edge area 100c. The heat dissipation principle of the second inverter inductor 600 is the same as that of the first inverter inductor 500, which will not be described here.
[0103] Specifically, the orthographic projection height of the first loop module 11 and the second loop module 12 is greater than the orthographic projection height of the first power plate 300 and the second power plate 400, so that the local of the first loop module 11 and the second loop module 12 in the double-sided heat dissipation liquid cooling plate 100 is exposed, specifically, the first inlet pipe 111, the first outlet pipe 113, the second inlet pipe 121 and the second outlet pipe 123 are located outside the orthographic projection range of the first power plate 300 and the second power plate 400.
[0104] More specifically, the plurality of first inverter inductors 500 are arranged with intervals, so that there is a gap between the adjacent two first inverter inductors 500. The plurality of second inverter inductors 600 are arranged with intervals, so that there is also a gap between the adjacent two second inverter inductors 600. The local of the third loop module 13 in the double-sided heat dissipation liquid cooling plate 100 is also exposed.
[0105] Specifically, the cabinet body 200 is also provided with a circulating fan 700, and an air outlet of the circulating fan 700 faces the double-sided heat dissipation liquid cooling plate 100. The inside of the cabinet body 200 is a closed space, and when the heat components heat, the air temperature in the cabinet is not uniform, that is, the air temperature of the local part with the heat components is higher, and the air temperature of the local part without the heat components is lower. To avoid heat accumulation, the circulating fan 700 is used to disturb the flow, so that the air in the cabinet body 200 flows, so that the air temperature in the cabinet body 200 is basically the same.
[0106] Specifically, the number of the circulating fan 700 can be multiple, one or more of which blow air to the double-sided heat dissipation liquid cooling plate 100, and the rest of the circulating fan 700 can blow air to the double-sided heat dissipation liquid cooling plate 100 or not. The purpose is to make the air in the cabinet body 200 flow, so that the air temperature in the cabinet body 200 is basically the same, and the air can exchange heat with the locally exposed part of the double-sided heat dissipation liquid cooling plate 100 to reduce the air temperature in the cabinet body 200.
[0107] Since the double-sided heat dissipation liquid cooling plate 100 is partially exposed, the circulating fan 700 blows air to the double-sided heat dissipation liquid cooling plate 100, which can make the exposed part of the double-sided heat dissipation liquid cooling plate 100 directly exchange heat with the air in the cabinet body 200, further dissipate heat from the temperature in the cabinet body 200, and improve the heat dissipation effect of the electrical equipment.
[0108] Specifically, the first power plate 300, the second power plate 400, the plurality of first inverter inductors 500 and the plurality of second inverter inductors 600 are centrally arranged on one side of the cabinet, so that the heat is concentrated, and the double-sided heat dissipation liquid cooling plate 100 is installed to concentrate heat dissipation.
[0109] The above specific embodiments further illustrate the purpose, technical solutions and advantages of the present application. It should be understood that the above description is only a specific embodiment of the present application and is not used to limit the protection scope of the present application. It is particularly pointed out that any modification, equivalent replacement, improvement, etc. made by those skilled in the art within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. A double-sided heat dissipation liquid cooling plate, characterized in that, The double-sided liquid cooling plate has an inlet and an outlet at both ends. The double-sided liquid cooling plate has a first region near the inlet, a second region near the outlet, and an edge region away from the inlet and outlet. A heat dissipation tube is coiled inside the double-sided liquid cooling plate. The heat dissipation tube includes: The inlet pipe includes a first pipe, a second pipe, and a third pipe. The first end of the first pipe is connected to the inlet port, and the first ends of the second pipe and the third pipe are both connected to the second end of the first pipe. The diameter of the third pipe is larger than the diameter of the second pipe. The liquid outlet tube includes a fourth tube, a fifth tube, a sixth tube, and a seventh tube. The first end of the fourth tube is connected to the liquid outlet, and the first ends of the fifth tube, the sixth tube, and the seventh tube are all connected to the second end of the fourth tube. The first circuit module is located in the first zone, and the inlet pipe is located on the side of the first circuit module away from the second zone. The inlet of the first circuit module is connected to the second end of the second pipe, and the outlet of the first circuit module is connected to the second end of the fifth pipe. The second circuit module is located in the second zone. The inlet of the second circuit module is connected to the second end of the third pipe, and the outlet of the second circuit module is connected to the second end of the sixth pipe. The third loop module is located in the edge region. The inlet of the third loop module is connected to the outlet of the second loop module and the second end of the sixth pipe. The inlet diameter of the third loop module is larger than the pipe diameter of the sixth pipe. The outlet of the third loop module is connected to the second end of the seventh pipe.
2. The double-sided heat dissipation liquid cooling plate as described in claim 1, characterized in that, The relationship between the volume of the first tube, the volume of the second tube, and the volume of the third tube is as follows: D1 2 L1=D2 2 L2+D3 2 L3 In the formula, D1 is the diameter of the first pipe, L1 is the length of the first pipe, D2 is the diameter of the second pipe, L2 is the length of the second pipe, D3 is the diameter of the third pipe, and L3 is the length of the third pipe.
3. The double-sided heat dissipation liquid cooling plate as described in claim 1, characterized in that, The relationship between the diameters of the first pipe, the second pipe, and the third pipe is as follows: D1 = 2.3D2 = 1.5D3 In the formula, D1 is the diameter of the first pipe, D2 is the diameter of the second pipe, and D3 is the diameter of the third pipe.
4. The double-sided heat dissipation liquid cooling plate as described in claim 1, characterized in that, The first circuit module includes a first liquid inlet pipe, a first cooling pipe, and a first liquid outlet pipe. One end of the first liquid inlet pipe is connected to the second end of the second pipe. The first cooling pipe includes multiple first branches. The inlet of each first branch is connected to the other end of the first liquid inlet pipe, and the outlet of each first branch is connected to one end of the first liquid outlet pipe. The other end of the first liquid outlet pipe is connected to the second end of the fifth pipe.
5. The double-sided heat dissipation liquid cooling plate as described in claim 4, characterized in that, The diameter of the first inlet pipe gradually tapers from one end near the second pipe to the other end, wherein the diameter at the beginning of the first inlet pipe is three times the diameter at the end.
6. The double-sided heat dissipation liquid cooling plate as described in claim 1, characterized in that, The second circuit module includes a second liquid inlet pipe, a second cooling pipe, and a second liquid outlet pipe. One end of the second liquid inlet pipe is connected to the second end of the third pipe. The second cooling pipe includes multiple second branches. The inlet of each second branch is connected to the other end of the second liquid inlet pipe, and the outlet of each second branch is connected to one end of the second liquid outlet pipe. The other end of the second liquid outlet pipe is connected to the second end of the sixth pipe.
7. The double-sided heat dissipation liquid cooling plate as described in claim 6, characterized in that, The diameter of the second inlet pipe gradually tapers from one end near the third pipe to the other end, wherein the diameter at the beginning of the second inlet pipe is 4.5 times the diameter at the end.
8. The double-sided heat dissipation liquid cooling plate as described in claim 1, characterized in that, The third loop module includes a third inlet pipe, a third cooling pipe, and a third outlet pipe. One end of the third inlet pipe is connected to the outlet of the second outlet pipe and the second end of the sixth pipe. The third cooling pipe includes multiple third branches, fourth branches, and multiple fifth branches. The inlet of each third branch is connected to the other end of the third inlet pipe, the outlet of each third branch is connected to the inlet of the fourth branch, the inlet of each fifth branch is connected to the outlet of the fourth branch, the outlet of each fifth branch is connected to one end of the third outlet pipe, and the other end of the third outlet pipe is connected to the second end of the seventh pipe.
9. The double-sided heat dissipation liquid cooling plate as described in claim 8, characterized in that, The diameter of the third inlet pipe is larger than the diameter of the third outlet pipe.
10. An electrical device, characterized in that, It includes a chassis enclosure and a first power board, a second power board, a plurality of first inverter inductors, a plurality of second inverter inductors disposed within the chassis enclosure, and a double-sided heat dissipation liquid cooling plate as described in any one of claims 1 to 9; One end of the first power board and the second power board are located in the first area, and the other end is located in the second area. The first power board and the second power board are arranged opposite to each other, and the first power board and the second power board are spaced apart. Multiple first inverter inductors and multiple second inverter inductors are located in the edge region. Multiple first inverter inductors are located on the side of the first power board, and multiple second inverter inductors are located on the side of the second power board. The first inverter inductors and the second inverter inductors are arranged opposite to each other. The double-sided heat dissipation liquid cooling plate is located between the first power board and the second power board, and between the first inverter inductor and the second inverter inductor.
Citation Information
Patent Citations
Energy storage device and energy storage system
CN117410614A
Liquid cooling plate and battery pack
CN218123549U