Heat dissipation device and heat dissipation system

Abstract

The invention discloses a heat dissipation device and a heat dissipation system, the heat dissipation device comprises a box body, a liquid separator and a heat dissipation device, the box body is provided with a liquid inlet side and a liquid outlet side, an electronic device is accommodated between the liquid inlet side and the liquid outlet side, the liquid separator is arranged on the liquid inlet side, and the liquid separator is provided with a first passage and a second passage; the first passage is used for being connected with a first area of the electronic equipment for liquid cooling, the second passage is used for being connected with a second area of the electronic equipment for liquid cooling, the radiator is used for being arranged in the second area and connected with a heating element located in the second area, and the radiator is connected with the second passage.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a heat dissipation system. Background Art

[0002] Compared with air cooling, immersion liquid cooling can improve the heat dissipation efficiency of electronic equipment. However, the current immersion liquid cooling uses liquid to cool the entire electronic equipment, and the utilization efficiency of the liquid is low. Summary of the invention

[0003] This application provides the following technical solutions:

[0004] A heat dissipation device, comprising:

[0005] A box body, the box body having a liquid inlet side and a liquid outlet side, and the liquid inlet side and the liquid outlet side are used to accommodate electronic equipment;

[0006] A liquid distributor, the liquid distributor is arranged at the liquid inlet side, the liquid distributor has a first passage and a second passage, the first passage is used to connect to the first area of ​​the electronic device for liquid cooling, and the second passage is used to connect to the second area of ​​the electronic device for liquid cooling;

[0007] A heat sink is used to be arranged in the second area and connected to the heating element located in the second area, and the heat sink is connected to the second passage.

[0008] Optionally, the heat dissipation device includes:

[0009] a one-way regulating valve, the one-way regulating valve being arranged in the first passage and / or the second passage and being used for distributing the coolant of the liquid distributor;

[0010] A controller is electrically connected to the one-way regulating valve.

[0011] Optionally, the heat dissipation device includes:

[0012] An in-position sensor, the in-position sensor is arranged in the first passage and / or the second passage, and is used to detect the connection status between the first passage and / or the second passage and the electronic device;

[0013] The controller is electrically connected to the on-site sensor, and controls the opening and closing of the one-way regulating valve based on the connection state of the electronic device detected by the on-site sensor.

[0014] Optionally, in the above heat dissipation device, the liquids in the first passage and the second passage flow in the same direction, and the first passage is connected to the first region for liquid cooling of the radiator and the heat-generating components located in the first region;

[0015] The size of the first area is greater than the size of the second area.

[0016] Optionally, in the above-mentioned heat dissipation device, the radiator includes a cold plate, the cold plate is arranged in the second area of ​​the electronic device, the heating element is located in the accommodating cavity of the cold plate, and at least one second passage extends to the second area and is connected to the cold plate, so as to allow the cooling liquid from the liquid distributor to enter the accommodating cavity.

[0017] Optionally, in the above heat dissipation device, the radiator includes a heat dissipation element, the heat dissipation element is located in the accommodating cavity and is used to be connected to the heating element, and the heat dissipation element allows the coolant to flow to the liquid outlet side.

[0018] Optionally, in the above heat dissipation device, the heat dissipation element and the heating element are stacked, and a flow guiding structure is provided on a side of the heat dissipation element facing away from the heating element, and the flow guiding structure includes at least one of the following:

[0019] A plurality of spoilers are arranged in a first area on the surface of the heat sink, and are used to make the coolant undergo multiple flow direction changes when flowing through the first area to achieve enhanced heat exchange;

[0020] A plurality of first guide strips are arranged in a second area on the surface of the heat sink to form a first flow channel for guiding the coolant from both sides to the middle, and the second area and the first area are arranged in sequence along the direction from the liquid inlet end of the cold plate to the liquid outlet end of the cold plate;

[0021] A plurality of second guide strips are arranged in a third area on the surface of the heat sink to form a second flow channel for guiding the coolant from the middle to both sides, and the first area and the third area are arranged in sequence along the direction from the liquid inlet end of the cold plate to the liquid outlet end of the cold plate;

[0022] A plurality of third guide strips are arranged in a fourth area on the surface of the heat sink to form a third flow channel for guiding the coolant to the first area. The fourth area is located on both sides of the first area in a first direction, and the first direction is perpendicular to a second direction from the liquid inlet end of the cold plate to the liquid outlet end of the cold plate.

[0023] A heat dissipation system, comprising:

[0024] An electronic device having a first area and a second area;

[0025] A heat dissipation device, the heat dissipation device comprising:

[0026] A box body, the box body having a liquid inlet side and a liquid outlet side, the electronic device is connected to the box body and is located between the liquid inlet side and the liquid outlet side;

[0027] A liquid distributor, the liquid distributor is arranged at the liquid inlet side, the liquid distributor has a first passage and a second passage, the first passage is connected to the first area of ​​the electronic device for liquid cooling, and the second passage is connected to the second area of ​​the electronic device for liquid cooling;

[0028] A heat sink is disposed in the second area and connected to a heating element located in the second area, and the heat sink is connected to the second passage.

[0029] Optionally, the heat dissipation system comprises an external circulation device, which is connected to the heat dissipation device to perform immersion liquid cooling on the electronic device;

[0030] The external circulation device comprises:

[0031] A liquid inlet pipeline, the liquid inlet pipeline is connected to the liquid inlet side, and the liquid inlet pipeline connects the liquid distributor and a portion of the box body located outside the liquid distributor;

[0032] A liquid outlet pipeline is connected to the liquid outlet side.

[0033] Optionally, in the above heat dissipation system, the external circulation device includes:

[0034] A circulation pump, wherein the circulation pump is connected to the liquid inlet pipeline and the liquid outlet pipeline, and the first passage and / or the second passage are provided with a one-way regulating valve and an in-situ sensor;

[0035] a control circuit, the control circuit being electrically connected to a controller, the controller being electrically connected to the one-way regulating valve and the in-position sensor respectively, and controlling the opening and closing of the one-way regulating valve based on the connection state between the first passage and / or the second passage and the electronic device detected by the in-position sensor;

[0036] The control circuit controls the rotation speed of the circulation pump based on the heat generated by the heat generating component in the first area and / or the heat generated by the heat generating element in the second area. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0038] Figure 1 is a schematic diagram of the use state of the heat dissipation device according to an embodiment of the present application;

[0039] Figure 2 is a schematic diagram of a heat dissipation system according to an embodiment of the present application;

[0040] Figure 3 is a schematic diagram of the working principle of the heat dissipation system according to an embodiment of the present application;

[0041] Figure 4 yes Figure 2 A cross-sectional schematic diagram of the middle radiator;

[0042] Figure 5 is along Figure 4 A schematic cross-sectional view of line AA in FIG.

[0043] Figure 6 yes Figure 4 A three-dimensional schematic diagram of a heat sink in FIG.

[0044] Figure 7 yes Figure 6 A top view of the heat sink is shown.

[0045] The markings in the figure are:

[0046] 100, housing; 200, electronic equipment; 210, carrier; 220, heating element;

[0047] 300, radiator; 310, cold plate; 320, heat sink; 321, first drain bar; 322, second drain bar; 323, third drain bar; 324, spoiler; 330, fastener;

[0048] 400, liquid distributor; 410, first passage; 420, second passage; 500, sealing ring; 600, one-way regulating valve; 700, in-position sensor; 810, liquid outlet pipeline; 820, circulating pump; 830, heat exchanger; 840, liquid inlet pipeline; 841, first branch; 842, second branch; 900, coolant. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0050] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0051] In the description of this specification, relational terms such as first and second, etc. are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0052] See also Figure 1 to Figure 7 The embodiment of the present application provides a heat dissipation device, including a housing 100, a liquid distributor 400 and a radiator 300, wherein the housing 100 has a liquid inlet side and a liquid outlet side, the liquid inlet side and the liquid outlet side are used to accommodate the electronic device 200, the liquid distributor 400 is arranged on the liquid inlet side, the liquid distributor 400 has a first passage 410 and a second passage 420, the first passage 410 is used to connect to a first area of ​​the electronic device 200 for liquid cooling, the second passage 420 is used to connect to a second area of ​​the electronic device 200 for liquid cooling, the radiator 300 is used to be arranged in the second area of ​​the electronic device 200 and connected to the heating element 220 located in the second area, and the radiator 300 is connected to the second passage 420 of the liquid distributor 400.

[0053] The heat dissipation device of the present application can use immersion liquid cooling technology to dissipate heat for the electronic device 200. The box 100 provides a storage space for accommodating the electronic device 200 and can contain a coolant 900, so that part or all of the electronic device 200 is immersed in the coolant 900, and the coolant 900 is used to dissipate heat and cool down the electronic device 200. The electronic device 200 can be a computer host, a server, and other types. It should be understood that the coolant 900 is a non-conductive liquid that can be used in the immersion liquid cooling technology. The electronic device 200 can work normally when immersed in the coolant 900. Moreover, since the coolant 900 dissipates heat and cools down the electronic device 200, the working performance of the electronic device 200 can be protected from the influence of high temperature, that is, the functional components of the electronic device 200 can perform better.

[0054] The liquid distributor 400 is arranged on the liquid inlet side of the housing 100, and can transport and distribute the cooling liquid 900. The liquid distributor 400 has a first passage 410 and a second passage 420, wherein the first passage 410 is used to transport the cooling liquid 900 to the first area of ​​the electronic device 200, and the second passage 420 is used to transport the cooling liquid 900 to the second area of ​​the electronic device 200. The second area of ​​the electronic device 200 is provided with a heating element 220, and the heating element 220 refers to an element that generates heat when working, such as a central processing unit, a graphics processing unit, and the like. The radiator 300 can be arranged in the second area of ​​the electronic device 200, and is connected to the second passage 420 of the liquid distributor 400, and is also connected to the heating element 220 located in the second area of ​​the electronic device 200. The radiator 300 and the heating element 220 are connected in a heat transfer manner, and the heat generated by the heating element 220 can be transferred to the radiator 300 for dissipation. The second passage 420 of the liquid distributor 400 is connected to the radiator 300 , which means that the coolant 900 from the liquid distributor 400 can reach the radiator 300 through the second passage 420 , that is, the second passage 420 can directly transport the coolant 900 to the radiator 300 .

[0055] When the heat dissipation device of the present application is used to dissipate heat for the electronic device 200, the radiator 300 is arranged in the second area of ​​the electronic device 200 and is heat-transferably connected to the heating element 220, so that the heating element 220 can be efficiently dissipated. At the same time, the second passage 420 of the liquid distributor 400 directly transports the coolant 900 to the second area where the radiator 300 is located, which is conducive to improving the utilization efficiency of the coolant 900, that is, the second passage 420 realizes the targeted transportation of the coolant 900 to the second area where the heating element 220 is located. Under the transportation action of the second passage 420, the coolant 900 can not only reach the second area of ​​the electronic device 200 more smoothly, but also the flow rate when reaching the second area is higher than that in the case where there is no second passage 420. That is to say, the second passage 420 of the distributor enables the coolant 900 to flow through the second area where the heating element 220 is located at a relatively high speed. In this way, the second area of ​​the electronic device 200, which has higher requirements for heat dissipation due to the arrangement of the heating element 220, can obtain a good heat dissipation effect, thereby achieving a more reasonable flow path of the coolant 900 in the electronic device 200 and a flow speed for more efficient heat dissipation.

[0056] In some embodiments, the heat dissipation device can be configured as follows: the liquid flow direction of the first passage 410 and the second passage 420 is the same, the first passage 410 is connected to the first area of ​​the electronic device 200 for liquid cooling of the radiator 300 and the heat generating components located in the first area, and the size of the first area is larger than the size of the second area. The first passage 410 of the liquid dispenser 400 delivers the cooling liquid 900 to the first area of ​​the electronic device 200 which is larger than the second area, and the liquid flow direction of the first passage 410 and the second passage 420 is the same, so that the cooling liquid 900 can cool the radiator 300 and the heat generating components arranged in the first area at the same time after reaching the first area, further improving the utilization efficiency of the cooling liquid 900 leading to the first area. The heat generating components refer to components that generate heat when working, such as storage modules, gateway modules, power modules and other components arranged in the electronic device 200. There can be multiple situations for the positional relationship between the first area and the second area, which are relatively larger in size. For example, the first area and the second area can be at least partially connected. For example, the second area can be an area on the motherboard of the electronic device 200 where the central processor is arranged, and the first area can be an area on the motherboard adjacent to the second area where the memory module is arranged. For another example, the relationship between the first area and the second area may be that the first area includes the second area, that is, the second area is a part of the first area. For example, the second area may be an area on the mainboard of the electronic device 200 where the central processor is arranged, and the first area may be the entire area of ​​the mainboard, or the first area may be the entire area of ​​the electronic device. For another example, the relationship between the first area and the second area may be that the projection of the first area covers the second area. For example, the second area may be the entire area of ​​the mainboard of the electronic device 200, and the first area may be all other areas inside the electronic device 200 except the mainboard.

[0057] exist Figure 1 In the exemplified embodiment, the electronic device 200 may be a server placed upright in the housing 100, and the liquid flows in the first passage 410 and the second passage 420 of the dispenser 400 are both from bottom to top. In other embodiments, the electronic device 200 may be placed horizontally in the housing 100, that is, the electronic device 200 is placed in the housing 100 with its mainboard in a flat state. In this case, the liquid flows in the first passage 410 and the second passage 420 of the dispenser 400 may be configured to be in a horizontal direction, such as from left to right or from front to back. In addition, it should be noted that the liquid inlet side of the housing 100 may be understood as any situation in which the surface area corresponding to the liquid inlet side is greater than, equal to, or less than one surface of the housing 100, so that Figure 1Taking the illustrated case as an example, the box 100 includes a top surface, a bottom surface, and a side surface between the top surface and the bottom surface. The liquid inlet side of the box 100 can be set to include the entire bottom surface and a portion of the side surface located at the bottom, or can be set to include only the entire or partial bottom surface, or only include a portion of the side surface located at the bottom. Similarly, the liquid outlet side of the box 100 can be understood as any situation where the surface area corresponding to the liquid outlet side is greater than, equal to, or less than one surface of the box 100, with Figure 1 Taking the illustrated case as an example, the liquid outlet side of the box body 100 can be configured to include the entire top surface and a portion of the side surface located at the upper portion, or can be configured to include only the entire or partial top surface, or only include a portion of the side surface located at the upper portion.

[0058] In some embodiments, the heat dissipation device may include a controller (not shown in the figure) and a one-way regulating valve 600. The one-way regulating valve 600 is arranged in the first passage 410 and / or the second passage 420, and is used for distributing the coolant 900 of the liquid distributor 400. The controller is electrically connected to the one-way regulating valve 600, and can control the one-way regulating valve 600 to adjust the opening size. The coolant 900 of the liquid distributor 400 is distributed at least between the first passage 410 and the second passage 420. The one-way regulating valve 600 can be arranged only on the first passage 410 or only on the second passage 420, or on both the first passage 410 and the second passage 420. In addition, when the number of the first passage 410 or the second passage 420 is more than one, the one-way regulating valve 600 can be arranged only on a part of the first passage 410 or the second passage 420, or on all the first passages 410 or the second passages 420.

[0059] exist Figure 1 In the exemplary embodiment, the first passage 410 and the second passage 420 are both provided in plurality, and each of the first passage 410 and each of the second passage 420 is provided with a one-way regulating valve 600. Figure 1Taking the case shown as an example, when the total flow of the liquid distributor 400 remains unchanged, increasing the opening of the one-way regulating valve 600 on the first passage 410 or decreasing the opening of the one-way regulating valve 600 on the second passage 420 can increase the amount of cooling liquid 900 delivered to the first area of ​​the electronic device 200. Conversely, decreasing the opening of the one-way regulating valve 600 on the first passage 410 or increasing the opening of the one-way regulating valve 600 on the second passage 420 can increase the amount of cooling liquid 900 delivered to the second area of ​​the electronic device 200. By controlling the opening of the one-way regulating valve 600, more cooling liquid 900 can be allocated to areas with relatively higher heat generation, so that the cooling liquid 900 can be used more reasonably and efficiently. It should be noted that controlling the opening of the one-way regulating valve 600 may include closing the one-way regulating valve 600, in which case the opening of the one-way regulating valve 600 is adjusted to zero.

[0060] In other embodiments, Figure 1 The two first passages 410 shown can be configured as follows: a one-way regulating valve 600 is only provided on one of the first passages 410. For example, the two first passages 410 transport the coolant 900 to the heating elements with different heat output. Since the heating element with lower heat output has a relatively smaller demand for coolant, a one-way regulating valve 600 can be provided on the first passage 410 corresponding to the heating element with lower heat output, while no one-way regulating valve 600 is provided on the other first passage 410. In this way, on the basis of simplifying the overall structure and reducing the manufacturing cost, the one-way regulating valve 600 can be controlled to be smaller in opening so that the heating element with higher heat output can obtain the coolant supply relatively preferentially, thereby improving the utilization efficiency of the coolant. Similarly, Figure 1 The two second passages 420 shown can be configured as follows: a one-way regulating valve 600 is only provided on one of the second passages 420. For example, the two second passages 420 transport the coolant 900 to heat-generating components with different heat generation. The one-way regulating valve 600 can be provided on the second passage 420 corresponding to the heat-generating component with lower heat generation, while the one-way regulating valve 600 is not provided on the other second passage 420. In this way, on the basis of simplifying the overall structure and reducing the manufacturing cost, the one-way regulating valve 600 can be controlled to open smaller so that the heat-generating component with higher heat generation can obtain the coolant supply relatively preferentially, thereby improving the utilization efficiency of the coolant.

[0061] In some embodiments, the heat dissipation device may include: an in-position sensor 700, which is arranged in the first passage 410 and / or the second passage 420, and is used to detect the connection status between the first passage 410 and / or the second passage 420 and the electronic device 200; and a controller is electrically connected to the in-position sensor 700, and controls the opening and closing of the one-way regulating valve 600 based on the connection status of the electronic device 200 detected by the in-position sensor 700. The in-position sensor 700 and the corresponding one-way regulating valve 600 are arranged on the same passage, and the function of the in-position sensor 700 is to detect whether the passage where it is located is connected to the electronic device 200, that is, the connection between the electronic device 200 and the passage where the in-position sensor 700 is located can trigger the in-position sensor 700 to send an in-position signal to the controller, so that the controller knows that the connection between the passage and the electronic device 200 has been established; the disconnection between the electronic device 200 and the passage where the in-position sensor 700 is located (for example, the electronic device 200 is moved out of the box 100) can trigger the in-position sensor 700 to send a non-position signal to the controller, so that the controller knows that the passage is not connected to the electronic device 200. After receiving the in-position signal sent by the in-position sensor 700, the controller controls the one-way regulating valve 600 on the passage where the in-position sensor 700 is located to open, so that the coolant 900 of the liquid distributor 400 can be delivered to the electronic device 200 through the passage. After receiving the out-of-position signal sent by the in-position sensor 700, the controller controls the one-way regulating valve 600 on the passage where the in-position sensor 700 is located to close, so that the coolant 900 of the liquid distributor 400 does not flow through the passage. By setting the in-position sensor 700, the intelligent automation of the heat dissipation device can be improved, and the one-way regulating valve 600 on the corresponding passage can be quickly selected to open or close in response to the connection status of the electronic device 200, thereby creating a reasonable flow path for the efficient use of the coolant 900.

[0062] As mentioned above when introducing the setting mode of the one-way regulating valve 600, the liquid dispenser 400 can be provided with the one-way regulating valve 600 only in the first passage 410 or only in the second passage 420. Correspondingly, the liquid dispenser 400 can be provided with the in-position sensor 700 only in the first passage 410 or only in the second passage 420. That is to say, the setting mode of the in-position sensor 700 can be flexibly adjusted according to the setting mode of the one-way regulating valve 600, so as to meet the requirements of simplifying the overall structure and reducing the manufacturing cost. In addition, in some embodiments, the in-position sensor 700 can be provided in the passage of the liquid dispenser 400 alone rather than in combination with the one-way regulating valve 600. In this case, the controller can be configured to control the total flow of the liquid dispenser 400 to increase or decrease based on the connection state of the electronic device 200 detected by the in-position sensor 700, which can also make reasonable use of the coolant 900, but it is not as efficient as the in-position sensor 700 and the one-way regulating valve 600 provided in the passage as described above.

[0063] See also Figure 1 Different electronic devices 200 may have different numbers of interfaces for connecting to the dispenser 400. Figure 1 In the exemplary embodiment, the dispenser 400 is provided with two first passages 410 and two second passages 420 , and the electronic device 200 is provided with four interfaces, two of which are respectively connected to the two first passages 410 , and the other two interfaces are respectively connected to the two second passages 420 . When the number of interfaces provided on the electronic device 200 is less than four, one or some passages of the dispenser 400 will be idle. For example, the electronic device 200 is only provided with one interface for connecting to the first passage 410 and two interfaces for connecting to the second passage 420. After the electronic device 200 is installed in the housing 100, a first passage 410 of the dispenser 400 is idle, that is, the first passage 410 of the dispenser 400 is not connected to the electronic device 200. At this time, since the in-position sensor 700 can detect the connection status of the electronic device 200, the controller can close the one-way regulating valve 600 on the idle first passage 410 based on the connection status of the electronic device 200 detected by the in-position sensor 700, thereby achieving more efficient delivery of the coolant 900 of the dispenser 400 to the electronic device 200. In some embodiments, a dispenser 400 can be configured to be connected to one or more electronic devices 200. For example, the dispenser 400 can be provided with multiple groups of passages, each group of passages including the following: Figure 1 The two first paths 410 and the two second paths 420 shown in FIG. Figure 1 The electronic device 200 shown is connected to the dispenser 400 , so that one dispenser 400 corresponds to multiple electronic devices 200 .

[0064] See also Figure 1 In some embodiments, a sealing ring 500 may be provided at the end of the passage of the dispenser 400, and the electronic device 200 and the dispenser 400 may be configured to be connected by plugging. After the interface of the electronic device 200 is plugged into the end of the passage of the dispenser 400, the sealing ring 500 is used to improve the sealing of the connection, which is conducive to the coolant 900 in the dispenser 400 being delivered to the electronic device 200 at a more precise flow rate. There are many types of in-place sensors 700, such as proximity sensors, contact sensors, etc. Figure 1 In the exemplary embodiment, the in-place sensor 700 is arranged on the outer surface of the passage of the dispenser 400 and is triggered by a touch rod arranged on the electronic device 200, that is, the electronic device 200 is provided with a touch rod protruding outward on the side of the interface. When the electronic device 200 is installed on the dispenser 400, the touch rod contacts the in-place sensor 700; when the electronic device 200 is removed from the dispenser 400, the touch rod is detached from the in-place sensor 700 and no longer contacts.

[0065] The structure of the heat sink 300 can be selected in many ways. In some embodiments, the heat sink can include a cold plate 310, which is disposed in the second region of the electronic device 200. The heating element 220 is located in the receiving cavity of the cold plate 310. At least one second passage 420 extends to the second region and is connected to the cold plate 310, so as to allow the coolant 900 from the liquid distributor 400 to enter the receiving cavity. Figure 2 and Figure 4 The cold plate 310 can be set to a cover shape, fixed on the carrier 210 (such as a printed circuit board) carrying the heating element 220, and the heating element 220 is covered in the accommodating cavity of the cold plate 310. Since the cold plate 310 is connected to at least one second passage 420, the coolant 900 can enter the accommodating cavity of the cold plate 310 through the second passage 420, immerse the heating element 220, and flow through the heating element 220. It should be understood that the cold plate 310 has an outlet for the coolant 900 to flow out, that is, after the cold plate 310 is installed on the carrier 210 carrying the heating element 220, the accommodating cavity of the cold plate 310 is not closed. Therefore, the coolant in the first passage 410 flows directly from the liquid inlet side to the first area of ​​the electronic device 200, and the coolant in the second passage 420 flows directly from the liquid inlet side to the second area of ​​the electronic device 200. The coolant in the second area flows to the first area, and after merging with the coolant in the first area, it flows to the liquid outlet side. See. Figure 4 The outlet of the cold plate 310 may be disposed at an end opposite to the second passage 420 , which is conducive to better fluidity of the coolant 900 in the accommodating cavity of the cold plate 310 through the cold plate 310 .

[0066] In some embodiments, the radiator may include a heat sink 320, which is located in the accommodating cavity of the cold plate 310 for connecting with the heating element 220, and the heat sink 320 allows the coolant 900 to flow to the liquid outlet side of the housing 100. That is, while the heat sink 320 is connected to the heating element 220 by heat transfer, it can guide the coolant 900 to flow smoothly to the liquid outlet side of the housing 100. By arranging the heat sink 320 in the accommodating cavity of the cold plate 310, the heat generated by the heating element 220 can be transferred to the heat sink 320 to achieve rapid dissipation. There are many options for the structural form of the heat sink 320 and the connection method with the heating element 220. For example, the heat sink 320 can be set to a flat plate shape and stacked with the heating element 220, providing a larger surface area than the heating element 220, accelerating the dissipation of heat, that is, the heat of the heating element 220 is transferred to the heat sink 320 to achieve diffusion over a larger area, and improve the heat exchange efficiency with the coolant 900. The heat sink 320 may be directly connected to the heat generating element 220 , or may be indirectly connected to the heat generating element 220 via a thermal pad.

[0067] In some embodiments, the heat sink 320 and the heating element 220 can be stacked, and a guide structure can be provided on the side of the heat sink 320 facing away from the heating element 220. The guide structure can include at least one of the following: a plurality of spoiler blocks 324, which are arranged in the first area on the surface of the heat sink 320, and are used to make the coolant 900 undergo multiple flow direction changes during the process of flowing through the first area to achieve enhanced heat exchange; a plurality of first guide strips 321, which are arranged in the second area on the surface of the heat sink 320, to form a first flow channel for guiding the coolant 900 from both sides to the middle, and the second area and the first area are connected along the liquid inlet end of the cold plate 310 to the cold plate 310. 10 is arranged in sequence; a plurality of second guide strips 322 are arranged in the third zone on the surface of the heat sink 320 to form a second flow channel for guiding the coolant 900 from the middle to both sides, and the first zone and the third zone are arranged in sequence along the direction from the liquid inlet end of the cold plate 310 to the liquid outlet end of the cold plate 310; a plurality of third guide strips 323 are arranged in the fourth zone on the surface of the heat sink 320 to form a third flow channel for guiding the coolant 900 to the first zone, and the fourth zone is located on both sides of the first zone in the first direction, and the first direction and the second direction from the liquid inlet end of the cold plate 310 to the liquid outlet end of the cold plate 310 meet the vertical condition.

[0068] See also Figure 5~Figure 7 In the case where a plurality of spoilers 324 are disposed on the side of the heat sink 320 facing away from the heating element 220, the coolant 900 can flow through the gaps between the spoilers 324. The spoilers 324 can be Figure 7The arrangement is shown as being staggered regularly, or it can be arranged randomly without regularity, as long as the gap formed as a whole can guide the coolant 900 to turn multiple times during the forward process. In the case where a plurality of first guide strips 321 are provided on the side of the heat sink 320 facing away from the heating element 220, a first flow channel is formed between adjacent first guide strips 321, which can guide the coolant 900 to flow to the inner middle of the heat sink 320, so that the portion of the heat sink 320 corresponding to the heating element 220 can obtain more coolant 900. In the case where a plurality of second guide strips 322 are provided on the side of the heat sink 320 facing away from the heating element 220, a second flow channel is formed between adjacent second guide strips 322, which can guide the coolant 900 to flow to the outer sides of the heat sink 320, so that the coolant 900 flows to a larger area after flowing through the heat sink 320, thereby improving the flow smoothness downstream. In the case where a plurality of third drain strips 323 are provided on the side of the heat sink 320 facing away from the heating element 220, a third flow channel is formed between adjacent third drain strips 323. The third flow channel has a similar function to the aforementioned first flow channel, and can guide the coolant 900 to flow toward the inner middle of the heat sink 320, so that the portion of the heat sink 320 corresponding to the heating element 220 can obtain more coolant 900. The difference between the third flow channel and the first flow channel lies in the different locations where they are provided. In the case where the third flow channel and the first flow channel are provided on the side of the heat sink 320 facing away from the heating element 220, the coolant 900 first flows through the location where the first flow channel is located, and then flows through the location where the third flow channel is located. The third flow channel can make the coolant 900 that has dispersed to both sides after flowing through the first flow channel gather again toward the inner middle of the heat sink 320.

[0069] exist Figure 6 and Figure 7 In the exemplary embodiment, the first guide strip 321, the second guide strip 322 and the third guide strip 323 can be respectively configured as straight strips, and the spoiler block 324 can be configured as a prism. In other embodiments, the guide strip can be configured as a curved strip, and the spoiler block can be configured as a cylindrical shape. Figure 5 and Figure 6 In the exemplary embodiment, the heat sink 320 is connected to the carrier 210 carrying the heating element 220 by means of fasteners 330 (such as screws, bolts, etc.), and the fasteners 330 enable the heat sink 320 to press the heating element 220, which helps to avoid a small gap between the heat sink 320 and the heating element 220 that affects heat transfer. In other embodiments, the heat sink 320 may also be fixedly connected to the inner wall of the cold plate 310 to achieve a relatively fixed and reliable connection between the heat sink 320 and the heating element 220.

[0070] See also Figure 1 to Figure 7The present application also provides a heat dissipation system, including an electronic device 200 and a heat dissipation device, wherein the electronic device 200 has a first area and a second area, and the heat dissipation device includes a housing 100, a liquid dispenser 400, and a heat sink 300. The housing 100 has a liquid inlet side and a liquid outlet side, the electronic device 200 is connected to the housing 100 and is located between the liquid inlet side and the liquid outlet side, the liquid dispenser 400 is arranged on the liquid inlet side of the housing 100, the liquid dispenser 400 has a first passage 410 and a second passage 420, the first passage 410 is connected to the first area of ​​the electronic device 200 for liquid cooling, and the second passage 420 is connected to the second area of ​​the electronic device 200 for liquid cooling. The heat sink 300 is arranged in the second area of ​​the electronic device 200 and is connected to the heating element 220 located in the second area, and the heat sink 300 is connected to the second passage 420 of the liquid dispenser 400. The heat dissipation device of the heat dissipation system can be understood with reference to the above description of the heat dissipation device, and the implementation methods of the heat dissipation device introduced in the above embodiments can be applied when forming the heat dissipation system. Similarly, the configuration of the electronic device 200 of the heat dissipation system may refer to the above description of the electronic device 200 .

[0071] In some embodiments, the heat dissipation system may include an external circulation device, which is connected to the heat dissipation device to perform immersion liquid cooling on the electronic device 200. The external circulation device may include a liquid inlet pipeline 840 and a liquid outlet pipeline 810. The liquid outlet pipeline 810 is connected to the liquid outlet side of the housing 100, and the liquid inlet pipeline 840 is connected to the liquid inlet side of the housing 100. The liquid inlet pipeline 840 connects the liquid distributor 400 and the portion of the housing 100 located outside the liquid distributor 400. The external circulation device is connected to the heat dissipation device to form a circulation loop, so that the coolant 900 circulates back and forth, thereby efficiently dissipating the heat of the electronic device 200 immersed in the housing 100. After the coolant 900 flows out of the housing 100, it enters the liquid outlet pipeline 810. The coolant 900 in the liquid outlet pipeline 810 flows to the liquid inlet pipeline 840, and the coolant 900 in the liquid inlet pipeline 840 flows to the heat dissipation device. See. Figure 2 and Figure 3Since the liquid inlet pipeline 840 connects the liquid distributor 400 and the part of the housing 100 located outside the liquid distributor 400, a part of the cooling liquid 900 of the external circulation device can be directly delivered to the inside of the electronic device 200 through the liquid distributor 400, and another part of the cooling liquid 900 can be delivered to the inside of the housing 100 but does not directly enter the inside of the electronic device 200. For example, the end of the liquid inlet pipeline 840 away from the liquid outlet pipeline 810 can be divided into two branches leading to the heat dissipation device, namely a first branch 841 and a second branch 842, wherein the first branch 841 is connected to the inlet of the liquid distributor 400, and the second branch 842 is connected to the inlet of the housing 100 itself. In some embodiments, the first branch 841 and the second branch 842 can be connected to the liquid inlet pipeline 840 through a three-way pipe joint, or the first branch 841 and the second branch 842 can be integrally formed with the liquid inlet pipeline 840. The first branch 841 delivers the cooling liquid 900 to the liquid distributor 400, and then the cooling liquid 900 is delivered to the inside of the electronic device 200 by the liquid distributor 400, that is, this part of the cooling liquid 900 directly enters the inside of the electronic device 200, thereby improving the efficiency of the cooling liquid 900 entering the electronic device 200. The second branch 842 delivers the cooling liquid 900 to the inside of the box 100, but this part of the cooling liquid 900 does not directly enter the inside of the electronic device 200, but can enter the inside of the electronic device 200 through structures such as gaps and small holes on the outer shell of the electronic device 200. By setting the second branch 842, a part of the cooling liquid 900 can be separated when the flow rate suddenly increases, thereby avoiding the flow overload of the liquid distributor 400 causing excessive impact on the internal components of the electronic device 200. In addition, the second branch 842 can allow the cooling liquid 900 to quickly enter the part of the box 100 other than the electronic device 200, which can improve the work efficiency when cleaning the box 100 and replacing the cooling liquid 900. In some embodiments, a control valve for adjusting the flow rate may be provided on the first branch 841 and / or the second branch 842 , so as to facilitate the distribution of the coolant 900 flowing into the liquid distributor 400 and directly flowing into the inner cavity of the housing 100 .

[0072] In some embodiments, the external circulation device may include a circulation pump 820 and a control circuit, the circulation pump 820 is connected to the liquid inlet pipeline 840 and the liquid outlet pipeline 810, the first passage 410 and / or the second passage 420 are provided with a one-way regulating valve 600 and an in-position sensor 700, the control circuit is electrically connected to the controller, the controller is electrically connected to the one-way regulating valve 600 and the in-position sensor 700 respectively, the opening and closing of the one-way regulating valve 600 is controlled based on the connection state of the first passage 410 and / or the second passage 420 and the electronic device 200 detected by the in-position sensor 700, and the control circuit controls the speed of the circulation pump 820 based on the heat generation of the heating component in the first area and / or the heat generation of the heating element 220 in the second area. In some embodiments, the control circuit can be configured to: control the speed of the circulation pump 820 only for the heat generation of one of the heating component in the first area and the heating element 220 in the second area. Alternatively, the control circuit can be configured to: control the speed of the circulation pump 820 for the total heat generation of the heating component in the first area and the heating element 220 in the second area. For example, when the calorific value of the first area is less than that of the second area, the control circuit can be configured to adjust the speed of the circulation pump 820 only according to the calorific value of the heating element 220 in the second area, that is, when the calorific value of the heating element 220 in the second area increases, the speed of the circulation pump 820 is controlled to increase; when the calorific value of the heating element 220 in the second area decreases, the speed of the circulation pump 820 is controlled to decrease. For another example, when the calorific value of the first area is greater than that of the second area, the control circuit can be configured to adjust the speed of the circulation pump 820 only according to the calorific value of the heating component in the first area, that is, when the calorific value of the heating component in the first area increases, the speed of the circulation pump 820 is controlled to increase; when the calorific value of the heating component in the first area decreases, the speed of the circulation pump 820 is controlled to decrease. For another example, when the heating value of the first area is approximately equal to that of the second area, the control circuit can be configured to adjust the rotation speed of the circulation pump 820 according to the heating value of the heating components in the first area, and also to adjust the rotation speed of the circulation pump 820 according to the heating value of the heating elements 220 in the second area, that is, when the heating value of the heating components in the first area and / or the heating elements 220 in the second area increases, the rotation speed of the circulation pump 820 is controlled to increase; when the heating value of the heating components in the first area and / or the heating elements 220 in the second area decreases, the rotation speed of the circulation pump 820 is controlled to decrease.

[0073] The function of the circulation pump 820 is to provide power for the circulation of the coolant 900 and to adjust the flow rate. When the speed of the circulation pump 820 increases, the flow rate of the external circulation device increases. Conversely, when the speed of the circulation pump 820 decreases, the flow rate of the external circulation device decreases. The working principle of the one-way regulating valve 600 and the in-position sensor 700 can be understood by referring to the above introduction to the heat dissipation device. The control circuit of the external circulation device is electrically connected to the controller, so that the circulation pump 820 can adaptively adjust the speed according to the heat dissipation requirements of the electronic device 200. For example, Figure 2 In the exemplary embodiment, the dispenser 400 has two first passages 410 and two second passages 420. For the case where the first area and the second area of ​​the electronic device 200 generate high heat, the electronic device 200 may be provided with four interfaces. When the electronic device 200 is installed on the dispenser 400, the four passages of the dispenser 400 are used, that is, the two first passages 410 and the two second passages 420 are connected to the electronic device 200. For the case where the first area or the second area of ​​the electronic device 200 generates low heat, the electronic device 200 may be provided with only two interfaces, one of which is used for The first passage 410 is connected, and the other interface is used to connect the second passage 420. Then, when the electronic device 200 in the latter case replaces the electronic device 200 in the former case and is installed on the above-mentioned dispenser 400, a first passage 410 and a second passage 420 of the dispenser 400 are not connected to the electronic device 200, so the one-way regulating valve 600 on the passage not connected to the electronic device 200 is closed, resulting in a reduction in the demand for flow. At the same time, the control circuit of the external circulation device reduces the speed of the circulation pump 820 to adapt to the situation where the one-way regulating valve 600 on the above-mentioned part of the passage is closed. It is easy to understand that when the closed one-way regulating valve 600 is reopened, the demand for flow of the dispenser 400 will increase. At this time, the control circuit of the external circulation device can increase the speed of the circulation pump 820 to meet the demand.

[0074] See also Figure 2 In some embodiments, the external circulation device may include a heat exchanger 830. The coolant 900 flowing through the external circulation device exchanges heat with external equipment or heat-conducting medium (such as the atmosphere) through the heat exchanger 830, thereby accelerating the temperature reduction rate of the coolant 900 in the external circulation device, so that the coolant 900 flowing back to the heat dissipation device has a stronger heat dissipation effect. Figure 2 In the exemplary embodiment, the heat exchanger 830 is disposed downstream of the circulation pump 820 . In other embodiments, the heat exchanger 830 may also be disposed upstream of the circulation pump 820 .

[0075] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0076] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A heat dissipation device, comprising: A box body, the box body having a liquid inlet side and a liquid outlet side, and the liquid inlet side and the liquid outlet side are used to accommodate electronic equipment; A liquid distributor, the liquid distributor is arranged at the liquid inlet side, the liquid distributor has a first passage and a second passage, the first passage is used to connect to the first area of ​​the electronic device for liquid cooling, and the second passage is used to connect to the second area of ​​the electronic device for liquid cooling; A heat sink is used to be arranged in the second area and connected to the heating element located in the second area, and the heat sink is connected to the second passage.

2. The heat dissipation device according to claim 1, comprising: a one-way regulating valve, the one-way regulating valve being arranged in the first passage and / or the second passage and being used for distributing the coolant of the liquid distributor; A controller is electrically connected to the one-way regulating valve.

3. The heat dissipation device according to claim 2, comprising: An in-position sensor, the in-position sensor is arranged in the first passage and / or the second passage, and is used to detect the connection status between the first passage and / or the second passage and the electronic device; The controller is electrically connected to the on-site sensor, and controls the opening and closing of the one-way regulating valve based on the connection state of the electronic device detected by the on-site sensor.

4. The heat dissipation device according to claim 1, wherein the liquid in the first passage and the second passage have the same flow direction, and the first passage is connected to the first region for liquid cooling of the radiator and the heat-generating components located in the first region; The size of the first area is greater than the size of the second area.

5. According to the heat dissipation device according to claim 1 or 4, the radiator includes a cold plate, the cold plate is arranged in the second area of ​​the electronic device, the heating element is located in the accommodating cavity of the cold plate, and at least one second passage extends to the second area and is connected to the cold plate, so as to allow the cooling liquid from the liquid distributor to enter the accommodating cavity.

6. The heat dissipation device according to claim 5, wherein the radiator comprises a heat dissipation element, wherein the heat dissipation element is located in the accommodating cavity and is used to be connected to the heating element, and wherein the heat dissipation element allows the coolant to flow toward the liquid outlet side.

7. The heat dissipation device according to claim 6, wherein the heat dissipation element and the heating element are stacked, and a flow guiding structure is provided on a side of the heat dissipation element facing away from the heating element, and the flow guiding structure comprises at least one of the following: A plurality of spoilers are arranged in a first area on the surface of the heat sink, and are used to make the coolant undergo multiple flow direction changes when flowing through the first area to achieve enhanced heat exchange; A plurality of first guide strips are arranged in a second area on the surface of the heat sink to form a first flow channel for guiding the coolant from both sides to the middle, and the second area and the first area are arranged in sequence along the direction from the liquid inlet end of the cold plate to the liquid outlet end of the cold plate; A plurality of second guide strips are arranged in a third area on the surface of the heat sink to form a second flow channel for guiding the coolant from the middle to both sides, and the first area and the third area are arranged in sequence along the direction from the liquid inlet end of the cold plate to the liquid outlet end of the cold plate; A plurality of third guide strips are arranged in a fourth area on the surface of the heat sink to form a third flow channel for guiding the coolant to the first area. The fourth area is located on both sides of the first area in a first direction, and the first direction is perpendicular to a second direction from the liquid inlet end of the cold plate to the liquid outlet end of the cold plate.

8. A heat dissipation system, comprising: An electronic device having a first area and a second area; A heat dissipation device, the heat dissipation device comprising: A box body, the box body having a liquid inlet side and a liquid outlet side, the electronic device is connected to the box body and is located between the liquid inlet side and the liquid outlet side; A liquid distributor, the liquid distributor is arranged at the liquid inlet side, the liquid distributor has a first passage and a second passage, the first passage is connected to the first area of ​​the electronic device for liquid cooling, and the second passage is connected to the second area of ​​the electronic device for liquid cooling; A heat sink is disposed in the second area and connected to a heating element located in the second area, and the heat sink is connected to the second passage.

9. The heat dissipation system according to claim 8, comprising an external circulation device, wherein the external circulation device is connected to the heat dissipation device to perform immersion liquid cooling on the electronic device; The external circulation device comprises: A liquid inlet pipeline, the liquid inlet pipeline is connected to the liquid inlet side, and the liquid inlet pipeline connects the liquid distributor and a portion of the box body located outside the liquid distributor; A liquid outlet pipeline is connected to the liquid outlet side.

10. The heat dissipation system according to claim 9, wherein the external circulation device comprises: A circulation pump, wherein the circulation pump is connected to the liquid inlet pipeline and the liquid outlet pipeline, and the first passage and / or the second passage are provided with a one-way regulating valve and an in-situ sensor; a control circuit, the control circuit being electrically connected to a controller, the controller being electrically connected to the one-way regulating valve and the in-position sensor respectively, and controlling the opening and closing of the one-way regulating valve based on the connection state between the first passage and / or the second passage and the electronic device detected by the in-position sensor; The control circuit controls the rotation speed of the circulation pump based on the heat generated by the heat generating component in the first area and / or the heat generated by the heat generating element in the second area.

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