Anti-displacement SMT (Surface Mount Technology) device

Abstract

The invention discloses an SMT (Surface Mount Technology) device capable of preventing displacement. Comprising a machine frame, a substrate conveying assembly and a component mounting assembly, the substrate conveying assembly comprises a substrate conveying belt, the substrate conveying belt is provided with a substrate fixing structure, and the substrate fixing structure comprises a plurality of sets of telescopic fixing shafts; the component patch assembly comprises a center rotating shaft and a connecting module, a plurality of sets of component patch structures are arranged below the center rotating shaft, and aiming at fixing of the substrate, the edges of the two ends of the substrate are subjected to multi-point-position fixing through the structural design of multiple sets of telescopic fixing shafts; meanwhile, a positioning plate structure is designed on the telescopic fixing shaft, can rotate relative to the base plate, and can rotate by different angles according to different base plate shapes so as to fit and position the edge of the base plate; in order to prevent deviation in the chip mounting process, the chip mounting suction head uses a rotary structure to take and place electronic components, multi-directional complex displacement is not needed, and the influence of accumulated errors is reduced.

Description

Technical Field

[0001] The invention relates to the technical field of SMT patch technology, in particular to an anti-displacement SMT patch device. Background Art

[0002] Under normal circumstances, the electronic products we use are designed by PCB plus various capacitors, resistors and other electronic components according to the designed circuit diagram. Various electronic components need SMT patch processing technology to process. SMT patch refers to the abbreviation of a series of process flows based on PCB. PCB (Printed Circuit Board) is a printed circuit board. SMT is the abbreviation of surface mount technology (surface mount technology), which is the most popular technology and process in the electronic assembly industry. SMT is a circuit assembly technology that mounts pinless or short-lead surface mount components on the surface of PCB or other substrates, and assembles them by soldering or dip soldering. The advantages of SMT patch processing: high assembly density, small size and light weight of electronic products, the size and weight of patch components are only about 1 / 10 of traditional plug-in components, high reliability, strong vibration resistance, and low solder joint defect rate. Generally, after using SMT, the volume of electronic products can be reduced by 40% to 60%, and the weight can be reduced by 60% to 80%. SMT patches have good high-frequency characteristics, reduce electromagnetic and radio frequency interference, are easy to automate, improve production efficiency, and can reduce costs by 30% to 50%, saving materials, energy, equipment, manpower, time, etc.

[0003] SMT equipment refers to equipment that automatically assembles electronic components by placing them on PCBs. It consists of a screen printer and a patch device that mounts electronic components on a PCB substrate or other substrate coated with solder paste. For SMT patch devices, how to effectively prevent the substrate or electronic components from shifting during the patch process is one of the key issues in the development and improvement of the device. For traditional SMT patch devices, a vacuum adsorption structure based on XYZ axis activities is usually used to absorb (place) electronic components. However, this structural design that moves repeatedly in the XYZ axis direction will inevitably produce cumulative errors during long-term work, resulting in a shift in the position of the absorption (placement) of electronic components; and traditional SMT patch devices often use simple structure clamping or adsorption to fix the substrate. During the patch process, the substrate is easily shifted due to the slight vibration caused by the electronic components falling off the substrate.

[0004] In view of this, we propose an anti-displacement SMT patch device. On the one hand, in order to fix the electronic component patch assembly substrate during the transportation process, the present invention utilizes a structural design of multiple sets of telescopic fixed shafts to fix the two end edges of the electronic component patch assembly substrate at multiple points. On the other hand, in order to prevent deviation during the component patch process, the patch suction head structure of the present invention utilizes the rotating structure of the central rotating shaft to pick and place electronic components, without the need for complex displacement in multiple directions and processes, thereby reducing the impact of cumulative errors.

[0005] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention and should not be regarded as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art. Summary of the invention

[0006] In order to solve the problems raised in the above-mentioned background technology, the technical solution of the present invention proposes an anti-displacement SMT patch device. On the one hand, for the fixation of the electronic component patch assembly substrate during the transportation process, the present invention utilizes the structural design of multiple sets of telescopic fixed shafts to fix the two end edges of the electronic component patch assembly substrate at multiple points, and the multi-point fixed structural design is more stable than the single-point fixation; at the same time, the present invention designs a "double-plate structure" of a positioning plate and a fixing plate on the telescopic fixed shaft, wherein the positioning plate can rotate relative to the electronic component patch assembly substrate, and can rotate at different angles according to different substrate shapes to fit and position the edge of the substrate; on the other hand, for the anti-deviation during the component patch process, the patch suction head structure of the present invention utilizes the rotating structure of the central rotating shaft to take and place electronic components, without the need to undergo complex displacement in multiple directions and processes, thereby reducing the influence of cumulative errors.

[0007] The present invention provides an anti-displacement SMT patch device, comprising a machine frame, on which a substrate conveying assembly for conveying electronic component patch assembly substrates and a plurality of component patch assemblies for patch assembly of electronic components are installed.

[0008] In the technical solution of the present invention, the substrate conveying assembly includes a substrate conveyor belt, on which are installed several groups of substrate fixing structures, several groups of the substrate fixing structures respectively include several groups of telescopic fixing shafts, several groups of the telescopic fixing shafts are used to fix the electronic component patch assembly substrate, several groups of the telescopic fixing shafts can be respectively positioned and fixed by telescoping to fit the edge of the electronic component patch assembly substrate, the structural design of multiple groups of telescopic fixing shafts can fix the two end edges of the electronic component patch assembly substrate at multiple points, the multi-point fixed structural design is more stable than the single-point fixed, and the electronic component patch assembly substrate is usually less flat due to the influence of the material, and the multi-point fixed structural design can reduce the influence of flatness on the fixing effect.

[0009] In the technical solution of the present invention, several groups of component patch assemblies respectively include a central rotating shaft and a connecting module, the central rotating shaft can be rotatably installed below the connecting module, the central rotating shaft is connected and driven to rotate through an external motor control, and the central rotating shaft can be slidably installed on the machine frame through the connecting module, the component patch assembly can slide relative to the machine frame through the central rotating shaft to change its position, and several groups of component patch structures are also installed below the central rotating shaft, and several groups of component patch structures are used for patch assembly of electronic components.

[0010] Furthermore, the substrate conveyor belt is provided with several groups of substrate conveyor belt slide grooves, and several groups of the telescopic fixed shafts respectively include positioning plates, a side surface below the positioning plate is rotatably connected with a positioning plate slider, the positioning plate slider can be slidably installed inside the substrate conveyor belt slide groove, one side of the positioning plate slider is fixedly connected with a positioning plate telescopic shaft, the telescopic fixed shaft also includes a positioning plate telescopic motor, and the positioning plate telescopic motor is used to control and drive the positioning plate telescopic shaft to perform telescopic activities, so as to further control the movement of the positioning plate.

[0011] Furthermore, a fixing plate can be slidably installed on one side of the positioning plate, and the upper end surface of the fixing plate is fixedly connected to a fixing plate telescopic shaft, and the telescopic fixed shaft also includes a fixing plate telescopic motor, and the fixing plate telescopic motor is used to control and drive the fixing plate telescopic shaft to perform telescopic activities, so as to further control the movement of the fixing plate.

[0012] In the technical solution of the present invention, the positioning plate can be driven to move close to the edge of the electronic component patch assembly substrate through the positioning plate telescopic shaft, and then the fixing plate is controlled to move through the fixing plate telescopic shaft to fix it. At the same time, the positioning plate is rotatably connected to the positioning plate slider, and the positioning plate can be rotated relative to the electronic component patch assembly substrate. According to different substrate shapes, it can be rotated at different angles to fit and position the edge of the substrate, and then the edge of the substrate is pressed and fixed by the fixing plate.

[0013] In the technical solution of the present invention, several groups of the component patch structures respectively include patch suction heads, the upper ends of the patch suction heads are fixedly connected with suction head telescopic shafts, and several groups of the component patch structures respectively also include suction head telescopic motors, and the suction head telescopic motors are used to control and drive the suction head telescopic shaft to perform telescopic activities, so as to further control the patch suction heads to perform telescopic picking and placing activities.

[0014] Furthermore, several groups of the component patch structures respectively include a slide slot module, and the lower end surface of the central rotating shaft is provided with several groups of first slide slots, and the slide slot modules can be slidably installed inside the several groups of the first slide slots.

[0015] Furthermore, the slide slot modules are respectively provided with second slide slots, the suction head retractable motor can be slidably installed inside the second slide slots, and the sliding direction of the second slide slots is perpendicular to the sliding direction of the first slide slots.

[0016] In the technical solution of the present invention, image recognition components are respectively installed on one side of several groups of component patch structures, and the image recognition components are used for image recognition in the patch assembly process of the component patch structure. The patch suction head can be fine-tuned according to the feedback of the image recognition component. On the one hand, the patch suction head can be adjusted in a first direction by sliding the suction head telescopic motor in the second slide groove, and on the other hand, the patch suction head can be adjusted in a second direction perpendicular to the first direction by sliding the slide groove module in the first slide groove.

[0017] In the technical solution of the present invention, a component carrier tape installation platform is further provided on the side of the central rotating shaft, and the component carrier tape installation platform is used to fix and install the component carrier tape carrying assembled electronic components.

[0018] Effective gain: In summary, the present invention proposes an anti-displacement SMT patch device. On the one hand, for fixing the electronic component patch assembly substrate during the transportation process, the present invention utilizes a structural design of multiple sets of telescopic fixed shafts to fix the edges of both ends of the electronic component patch assembly substrate at multiple points. The multi-point fixed structural design is more stable than the single-point fixed structural design. In addition, the electronic component patch assembly substrate is usually less flat due to the influence of the material. The multi-point fixed structural design can reduce the influence of flatness on the fixing effect. At the same time, the present invention designs a "double-plate structure" of a positioning plate and a fixing plate on the telescopic fixed shaft, wherein the positioning plate can be rotated relative to the electronic component patch assembly substrate, and can be rotated at different angles according to different substrate shapes to fit and position the edge of the substrate, and then the edge of the substrate is pressed and fixed by the fixing plate.

[0019] On the other hand, in order to prevent deviation during the component patch process, the patch suction head structure of the present invention uses the rotating structure of the central rotating axis to pick up and place electronic components, without the need for complex displacement in multiple directions and processes, thereby reducing the impact of cumulative errors. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is a schematic diagram of the overall structure of an anti-displacement SMT patch device of the present invention;

[0021] Figure 2 A schematic diagram of a partial structure of an anti-displacement SMT patch device of the present invention Figure 1 ;

[0022] Figure 3 A schematic diagram of a partial structure of an anti-displacement SMT patch device of the present invention Figure 2 ;

[0023] Figure 4 This is an enlarged schematic diagram of a partial structure of an anti-displacement SMT patch device of the present invention. Figure 1 ;

[0024] Figure 5 This is an enlarged schematic diagram of a partial structure of an anti-displacement SMT patch device of the present invention. Figure 2 ;

[0025] Figure 6 This is an enlarged schematic diagram of a partial structure of an anti-displacement SMT patch device of the present invention. Figure 3 ;

[0026] Figure 7 This is an enlarged schematic diagram of a partial structure of an anti-displacement SMT patch device of the present invention. Figure 4 ;

[0027] Figure 8 This is an enlarged schematic diagram of a partial structure of an anti-displacement SMT patch device of the present invention. Figure 5 ;

[0028] Fig. 9 This is an enlarged schematic diagram of a partial structure of an anti-displacement SMT patch device of the present invention. Figure 6 ;

[0029] Fig.10 This is an enlarged schematic diagram of a partial structure of an anti-displacement SMT patch device of the present invention. Figure 7 ;

[0030] Fig.11 This is an enlarged schematic diagram of a partial structure of an anti-displacement SMT patch device of the present invention. Figure 8 ;

[0031] In the figure: 100, machine frame; 200, substrate conveying assembly; 210, substrate conveying belt; 211, substrate conveying belt slide; 220, substrate fixing structure; 221, telescopic fixed axis; 221-1, positioning plate; 221-2, positioning plate slider; 221-3, positioning plate telescopic axis; 221-4, positioning plate telescopic motor; 221-5, fixing plate; 221-6, fixing plate telescopic axis; 221-7, fixing plate telescopic motor; 300, component patch assembly; 310, central rotating axis; 311, first slide; 320, connecting module; 330, component patch structure; 331, patch suction head; 332, suction head telescopic axis; 333, suction head telescopic motor; 334, slide module; 334-1, second slide; 340, image recognition assembly; 350, component carrier tape installation platform; DETAILED DESCRIPTION

[0032] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0034] In the description of the present invention, it is necessary to understand that the orientations or positional relationships indicated by the terms "upper", "lower", "top", "bottom", "inside", "outside", etc. are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] In addition, in the description of the present invention, “several” means two or more than two, unless otherwise clearly and specifically defined.

[0036] In order to solve the problems raised in the above-mentioned background technology, an embodiment of the present invention proposes an anti-displacement SMT patch device. On the one hand, for the fixation of the electronic component patch assembly substrate during the transportation process, the present embodiment utilizes a structural design of multiple sets of telescopic fixed shafts to fix the two end edges of the electronic component patch assembly substrate at multiple points. The multi-point fixed structural design is more stable than the single-point fixation. At the same time, the present embodiment designs a "double-plate structure" of a positioning plate and a fixing plate on the telescopic fixed shaft, wherein the positioning plate can be rotated relative to the electronic component patch assembly substrate, and can be rotated at different angles according to different substrate shapes to fit and position the edge of the substrate. On the other hand, for the anti-deviation during the component patch process, the patch suction head structure of the present embodiment utilizes the rotating structure of the central rotating shaft to pick and place electronic components, without the need for complex displacement in multiple directions and processes, thereby reducing the influence of cumulative errors.

[0037] like Figure 1 As shown, this embodiment provides an anti-displacement SMT patch device, including a machine frame 100, on which a substrate conveying assembly 200 for conveying electronic component patch assembly substrates and a plurality of component patch assemblies 300 for patch assembly of electronic components are installed.

[0038] In this embodiment, if Figure 2 As shown, the substrate conveying assembly 200 includes a substrate conveying belt 210, and a plurality of substrate fixing structures 220 are installed on the substrate conveying belt 210. Figure 3 As shown, the plurality of groups of substrate fixing structures 220 respectively include a plurality of groups of telescopic fixing shafts 221, and the plurality of groups of telescopic fixing shafts 221 are used to fix the electronic component patch assembly substrate; Figure 7 As shown, several groups of component patch assemblies 300 respectively include a central rotating shaft 310 and a connecting module 320, the central rotating shaft 310 can be rotatably installed below the connecting module 320, the central rotating shaft 310 is connected and driven to rotate by an external motor control, and the central rotating shaft 310 can be slidably installed on the machine frame 100 through the connecting module 320, as shown in FIG. Figure 8 As shown, a plurality of component patch structures 330 are installed below the central rotating shaft 310 , and the plurality of component patch structures 330 are used for patch assembly of electronic components.

[0039] Specifically, Figure 4As shown, a plurality of groups of substrate conveyor belt chutes 211 are provided on the substrate conveyor belt 210, and a plurality of groups of telescopic fixed shafts 221 respectively include a positioning plate 221-1, a side surface below the positioning plate 221-1 is rotatably connected with a positioning plate slider 221-2, the positioning plate slider 221-2 can be slidably installed inside the substrate conveyor belt chutes 211, one side of the positioning plate slider 221-2 is fixedly connected with a positioning plate telescopic shaft 221-3, the telescopic fixed shaft 221 also includes a positioning plate telescopic motor 221-4, and the positioning plate telescopic motor 221-4 is used to control and drive the positioning plate telescopic shaft 221-3 to perform telescopic activities.

[0040] Among them, a fixed plate 221-5 can be slidably installed on one side of the positioning plate 221-1, and the upper end surface of the fixed plate 221-5 is fixedly connected with a fixed plate telescopic shaft 221-6. The telescopic fixed shaft 221 also includes a fixed plate telescopic motor 221-7, and the fixed plate telescopic motor 221-7 is used to control and drive the fixed plate telescopic shaft 221-6 to perform telescopic activities.

[0041] In this embodiment, if Fig.10 As shown, several groups of component patch structures 330 respectively include a patch suction head 331, and the upper end of the patch suction head 331 is fixedly connected with a suction head telescopic shaft 332. Several groups of component patch structures 330 also include a suction head telescopic motor 333, which is used to control and drive the suction head telescopic shaft 332 to perform telescopic activities.

[0042] Specifically, the plurality of component patch structures 330 further include a slide slot module 334 . The lower end surface of the central rotating shaft 310 is provided with a plurality of first slide slots 311 . The slide slot modules 334 can be slidably installed inside the plurality of first slide slots 311 .

[0043] Specifically, the slide slot modules 334 are respectively provided with second slide slots 334 - 1 , and the suction head retracting motor 333 is slidably installed inside the second slide slot 334 - 1 , and the sliding direction of the second slide slot 334 - 1 is perpendicular to the sliding direction of the first slide slot 311 .

[0044] In this embodiment, if Fig. 9 As shown, one side of the plurality of component patch structures 330 is respectively installed with an image recognition component 340, and the image recognition component 340 is used for image recognition during the patch assembly process of the component patch structure 330, such as Fig.11 As shown, a component carrier tape installation platform 350 is also provided on the side of the central rotating shaft 310 , and the component carrier tape installation platform 350 is used to fix and install the component carrier tape carrying assembled electronic components.

[0045] Specific working principle: When this embodiment is working, the electronic component patch assembly substrate is first fixed by the substrate fixing structure 220 on the substrate conveying assembly 200, and the positioning plate telescopic motor 221-4 is first used to control the positioning plate telescopic shaft 221-3 to perform telescopic activities to drive the positioning plate 221-1 to perform telescopic activities to position and fix the electronic component patch assembly substrate. The positioning plate 221-1 rotates relative to the electronic component patch assembly substrate during the telescopic activity, and rotates different angles according to different substrate shapes to fit and position the edge of the substrate. After several groups of telescopic fixing shafts 221 complete the positioning and fixation of the positioning plate 221-1, the fixed plate telescopic motor 221-7 controls the fixed plate 221-5 to fix the edge of the electronic component patch assembly substrate through the fixed plate telescopic shaft 221-6; after the electronic component patch assembly substrate is fixed, it is transported to the substrate conveyor belt 210 through the substrate conveyor belt 210. The patch is performed at the component patch assembly 300. It should be noted that, according to the patch positions of different electronic components, it is necessary to adjust the fixed position of the electronic component patch assembly substrate relative to the substrate conveyor belt 210 and adjust the position of each group of component patch assemblies 300 relative to the frame 100; the component patch structure 330 is driven by the central rotating shaft 310 to pass over the component carrier mounting platform 350 and absorb the electronic components, and then the central rotating shaft 310 is driven to pass over the electronic component patch assembly substrate to lower the patch, wherein the patch suction head 331 is fine-tuned according to the feedback of the image recognition component 340. On the one hand, the suction head retractable motor 333 slides in the second slide groove 334-1 to adjust the position in the first direction, and on the other hand, the slide groove module 334 slides in the first slide groove 311 to adjust the position in the second direction perpendicular to the first direction, thereby completing the patch process.

[0046] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. An anti-displacement SMT patch device, comprising a machine frame (100), on which a substrate conveying assembly (200) for conveying a substrate for patch assembly of electronic components and a plurality of component patch assemblies (300) for patch assembly of electronic components are mounted, characterized in that: The substrate conveying assembly (200) comprises a substrate conveying belt (210), on which a plurality of groups of substrate fixing structures (220) are installed, and the plurality of groups of substrate fixing structures (220) respectively comprise a plurality of groups of telescopic fixing shafts (221), and the plurality of groups of telescopic fixing shafts (221) are used to fix the electronic component patch assembly substrate; the plurality of groups of component patch assemblies (300) respectively comprise a central rotating shaft (310) and a connecting module (320), the central rotating shaft (310) being rotatably installed below the connecting module (320), the central rotating shaft (310) being connected and driven to rotate by an external motor control, and the central rotating shaft (310) being slidably installed on the machine frame (100) through the connecting module (320), and a plurality of groups of component patch structures (330) being installed below the central rotating shaft (310), and the plurality of groups of component patch structures (330) being used to patch assemble electronic components.

2. The anti-displacement SMT patch device according to claim 1, characterized in that: The substrate conveyor belt (210) is provided with a plurality of groups of substrate conveyor belt chutes (211), and the plurality of groups of telescopic fixed shafts (221) respectively include positioning plates (221-1), a side surface below the positioning plate (221-1) is rotatably connected with a positioning plate slider (221-2), the positioning plate slider (221-2) can be slidably installed inside the substrate conveyor belt chutes (211), one side of the positioning plate slider (221-2) is fixedly connected with a positioning plate telescopic shaft (221-3), and the telescopic fixed shaft (221) further includes a positioning plate telescopic motor (221-4), and the positioning plate telescopic motor (221-4) is used to control and drive the positioning plate telescopic shaft (221-3) to perform telescopic activities.

3. The anti-displacement SMT patch device according to claim 2, characterized in that: A fixing plate (221-5) can also be slidably mounted on one side of the positioning plate (221-1); an upper end surface of the fixing plate (221-5) is fixedly connected to a fixing plate telescopic shaft (221-6); the telescopic fixing shaft (221) further comprises a fixing plate telescopic motor (221-7); the fixing plate telescopic motor (221-7) is used to control and drive the fixing plate telescopic shaft (221-6) to perform telescopic activities.

4. The anti-displacement SMT patch device according to claim 1, characterized in that: Several groups of the component patch structures (330) respectively include patch suction heads (331), the upper ends of the patch suction heads (331) are fixedly connected with suction head telescopic shafts (332), and several groups of the component patch structures (330) respectively include suction head telescopic motors (333), and the suction head telescopic motors (333) are used to control and drive the suction head telescopic shafts (332) to perform telescopic activities.

5. The anti-displacement SMT patch device according to claim 4, characterized in that: The plurality of groups of component patch structures (330) further include a slide slot module (334), and the lower end surface of the central rotating shaft (310) is provided with a plurality of groups of first slide slots (311). The slide slot modules (334) can be slidably installed inside the plurality of groups of the first slide slots (311).

6. The anti-displacement SMT patch device according to claim 5, characterized in that: The slide slot modules (334) are respectively provided with second slide slots (334-1), and the suction head retractable motor (333) can be slidably installed inside the second slide slot (334-1), and the sliding direction of the second slide slot (334-1) is perpendicular to the sliding direction of the first slide slot (311).

7. The anti-displacement SMT patch device according to claim 1, characterized in that: An image recognition component (340) is installed on one side of each of the groups of component patch structures (330), and the image recognition component (340) is used for image recognition during the patch assembly process of the component patch structure (330). A component carrier mounting platform (350) is also provided on the side of the central rotating shaft (310), and the component carrier mounting platform (350) is used for fixedly mounting a component carrier carrying assembled electronic components.

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