A PCB assembly welding device and a method of using the same

Abstract

The present invention relates to the technical field of PCB board welding, and discloses an assembly welding device for a PCB board and a method of using the same, comprising: a lifting support mechanism, a PCB board fixing mechanism is arranged inside the lifting support mechanism, a fixed-point fill-in light mechanism is arranged inside the lifting support mechanism, a heat exchange cooling mechanism and a lifting and separating mechanism are arranged inside the fixed-point fill-in light mechanism, and the heat exchange cooling mechanism is located above the lifting and separating mechanism. The invention, through the provided lifting support mechanism, PCB board fixing mechanism, fixed-point fill-in light mechanism, heat exchange cooling mechanism and lifting and separating mechanism, can separate the heat exchange cooling mechanism from the PCB board through the lifting and separating mechanism during welding, and after welding is completed, the heat exchange cooling mechanism is driven to fit with the PCB board through the lifting and separating mechanism, and the cooling of the PCB board is accelerated through the heat exchange cooling mechanism, thereby accelerating the cooling and solidification of the solder paste, thereby improving the maintenance efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of PCB board welding, and in particular to an assembly welding device for a PCB board and a use method thereof. Background Art

[0002] PCB, whose Chinese name is printed circuit board, is also called printed circuit board. It is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. Because it is made by electronic printing technology, it is called a "printed" circuit board. Single-sided PCB circuit board is a kind of printed circuit board. Only one side of the PCB board has circuits, and the other side is a substrate or directly covered with insulating ink. There are no circuits and the whole board is translucent when placed under strong light. Only the side with circuits in the cross section contains copper foil.

[0003] When assembling and welding components on the surface of a single-sided PCB circuit board, some welding faults such as missing soldering or wrong soldering may occasionally occur. These faulty circuit boards will be collected together for screening. Some circuit boards with minor faults that have been screened out can be manually welded and repaired. During manual welding, the circuit board is generally fixed on a platform for welding work, but most general platforms cannot cool the circuit board. Before maintenance, the solder paste on the circuit board needs to be melted or tinned by a hot air gun or electric soldering iron, and then new components are connected. At this time, the welding position still has a relatively high residual temperature. After the components are welded with the solder paste, a relatively long time is required for the solder paste to cool naturally. The cooling time is relatively slow, which greatly affects the efficiency. Summary of the invention

[0004] In view of the deficiencies in the prior art, the present invention provides an assembly welding device for a PCB board and a method for using the same, which solves the problems mentioned in the above background.

[0005] The present invention provides the following technical solution: an assembly welding device for a PCB board, comprising: a lifting support mechanism, a PCB board fixing mechanism is arranged inside the lifting support mechanism, a fixed-point fill-in light mechanism is arranged inside the lifting support mechanism, a heat exchange cooling mechanism and a lifting and separating mechanism are respectively arranged inside the fixed-point fill-in light mechanism, and the heat exchange cooling mechanism is located above the lifting and separating mechanism.

[0006] Preferably, the lifting support mechanism includes a horizontal frame, a vertical frame, a connecting frame and a guide rail beam. The number of the horizontal frames is two, and the two horizontal frames are distributed in parallel. The vertical frame is fixedly connected to the bottom of the horizontal frame, the connecting frame is fixedly connected to the bottom end of the vertical frame, and bolt holes are provided on the surface of the connecting frame. The guide rail beam is fixedly connected between the two horizontal frames, and the number of the guide rail beams is two.

[0007] Preferably, the lifting support mechanism also includes a transverse frame, a guide column, a guide slide and a first damping block. The transverse frame is slidably connected to the surfaces of two guide rail beams, respectively, the guide column is fixedly connected between the two transverse frames, the guide slide is integrally arranged on one side of the transverse frame, the first damping block is fixedly connected to the inside of the transverse frame, and the surface of the first damping block is slidably connected to the surface of the guide rail beam.

[0008] Preferably, the PCB board fixing mechanism includes a connecting seat, a movable card plate, a fixed card plate, a positioning bevel bar, a limiting pad, a card plate slot and a spring leaf, the connecting seat and the fixed card plate are respectively fixedly connected to one side of two cross frames, the movable card plate is slidably connected to one side of the connecting seat, the positioning bevel bar is respectively integrally arranged on one side of the movable card plate and one side of the fixed card plate, the limiting pad is integrally arranged at the bottom of the positioning bevel bar, the card plate slot is opened between the positioning bevel bar and the limiting pad, and the longitudinal cross-section of the card plate slot is conical, the spring leaf is fixedly connected to the inner wall of the connecting seat, and the surface of the spring leaf is slidably connected to one side of the movable card plate, and the side of the movable card plate close to the spring leaf is fixedly connected to the limiting block.

[0009] Preferably, the fixed-point fill light mechanism includes a fixed shell, a top frame ring, a bottom frame ring, a second damping block, a sliding hole, a clearance hole, an extension arm, a fill light and a laser emitter. The fixed shell is slidably connected to the surface of the guide column through the sliding hole, the top frame ring and the bottom frame ring are respectively fixedly connected to the inner wall of the top end of the fixed shell and the inner wall of the bottom end of the fixed shell, the second damping blocks are respectively fixedly connected to both sides of the fixed shell, the clearance holes are respectively penetrated and opened on both sides of the fixed shell, the extension arm is fixedly connected to one side of the fixed shell, the fill light is fixedly installed at one end of the extension arm, and the fill light is located above the middle of the fixed shell, and the laser emitter is fixedly installed in the middle of the fill light.

[0010] Preferably, the heat exchange cooling mechanism includes a heat exchange box, a heat exchange plate, a thermally conductive silicone sheet, a stop block, a guide tube, a guide hose and a cold water joint. The heat exchange box is movably arranged inside a fixed shell, the heat exchange plate is fixedly connected to the inner wall at the top of the heat exchange box, the thermally conductive silicone sheet is fixedly attached to the upper surface of the heat exchange plate, the stop block is integrally arranged on the surface of the heat exchange box, and the surface of the stop block is slidably connected to the inner wall of the fixed shell, the number of the guide tubes is two, and the two guide tubes are respectively fixedly connected to both sides of the heat exchange box, and the two guide tubes are respectively a water inlet pipe and a drain pipe, and the top height of the water inlet pipe is lower than the top height of the drain pipe, the guide hose is respectively fixedly connected to the bottom ends of the two guide tubes, the cold water joints are respectively fixedly connected to the tops on both sides of the connecting frame, and the two cold water joints are respectively fixedly connected to the two guide hoses.

[0011] Preferably, the heat exchange cooling mechanism also includes an upper connecting piece, a rubber bellows, a guide slide column, a limit head, a lower connecting piece, a first slip ring and an extrusion spring, the upper connecting piece is fixedly connected to the lower surface of the heat exchange box, the rubber bellows is fixedly connected to the lower surface of the upper connecting piece, the lower connecting piece is fixedly connected to the bottom end of the rubber bellows, the guide slide column is fixedly inserted at the bottom of the upper connecting piece, the limit head is integrally arranged at the bottom end of the guide slide column, the first slip ring is fixedly connected to the inside of the lower connecting piece, and the inner wall of the first slip ring is slidably connected to the surface of the guide slide column, the extrusion spring is movably sleeved on the surface of the guide slide column, and the extrusion spring is located between the upper connecting piece and the lower connecting piece.

[0012] Preferably, the lifting and separating mechanism includes a lifting square tube, a mounting tube, a heat dissipation port, a lifting motor, a threaded column, a compression spring and a connecting frame. The lifting square tube is fixedly inserted into the bottom of the lower connecting plate, the mounting tube is slidably connected to the inner wall of the lifting square tube, the heat dissipation port is penetrated and opened on the surface of the mounting tube, the lifting motor is fixedly installed inside the mounting tube, the threaded column is fixedly installed on the output end of the lifting motor through a coupling, the compression spring is movably connected between the lifting square tube and the mounting tube, and the connecting frame is fixedly sleeved on the surface of the lifting square tube.

[0013] Preferably, the lifting and separating mechanism also includes a base plate, a second slip ring, a connecting column and a base frame, the base plate is fixedly connected to the inner wall of the bottom frame ring, the second slip ring is fixedly connected to the inner wall of the base plate, the connecting column is fixedly connected to the bottom of the connecting frame, and the surface of the connecting column is slidably connected to the inner wall of the second slip ring, and the base frame is fixedly connected to the bottom end of the connecting column, and the inner wall of the base frame is threadedly connected to the surface of the threaded column.

[0014] A method for using a PCB assembly welding device, comprising:

[0015] Step S1: Connect the cold water joint near the water inlet pipe to the external cooling water pipe, connect the cold water joint near the drain pipe to the external drain pipe, and turn on the switch of the external cooling water pipe;

[0016] Step S2: clamping the PCB board between the movable card board and the fixed card board;

[0017] Step S3: Start the lifting motor to lower the heat exchange box so that the thermal conductive silicone sheet is separated from the lower surface of the PCB board;

[0018] Step S4: Slide the extension arm, turn on the fill light and the laser transmitter, and move the heat exchange box to the bottom of the PCB repair position by using the laser transmitter as a reference;

[0019] Step S5: performing heating and welding work;

[0020] Step S6: After the welding is completed, the lifting motor is started to raise the heat exchange box so that the thermal conductive silicone sheet fits the lower surface of the PCB board, thereby accelerating the heat exchange and cooling of the PCB board.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The invention, through the provision of a lifting support mechanism, a PCB board fixing mechanism, a fixed-point fill light mechanism, a heat exchange cooling mechanism and a lifting and separating mechanism, can separate the heat exchange cooling mechanism from the PCB board through the lifting and separating mechanism during welding, and after welding is completed, drive the heat exchange cooling mechanism to fit the PCB board through the lifting and separating mechanism, and accelerate the cooling of the PCB board through the heat exchange cooling mechanism, thereby accelerating the cooling and solidification of the solder paste, thereby improving maintenance efficiency.

[0023] The invention, through the provision of a horizontal frame, a vertical frame, a connecting frame, a guide rail beam, a transverse frame, a guide column, a guide slide bar and a first damping block, can fix the PCB board during use, thereby ensuring that the fixed-point fill-light mechanism can change its position at the bottom of the PCB board, and there is no need for the fixed-point fill-light mechanism to fill the lower surface of the PCB board.

[0024] The invention, by providing a connecting seat, a movable card plate, a fixed card plate, a card-positioning bevel bar, a limiting pad, a card plate groove and a spring, can stably fix the PCB board and facilitate the disassembly and replacement of the PCB board.

[0025] The invention, by setting a fixed shell, a top frame ring, a bottom frame ring, a second damping block, a sliding hole, a yield hole, an extension arm, a fill light and a laser transmitter, can make it possible to fill in the light of the repair position through the fill light during use, thereby improving the brightness and facilitating maintenance. The laser transmitter can emit laser to accurately locate the repair position, thereby ensuring that the heat exchange cooling mechanism can be accurately aligned underneath it.

[0026] The invention, through the arrangement of a heat exchange box, a heat exchange plate, a thermally conductive silicone sheet, a stop block, a guide tube, a guide hose, a cold water joint, an upper connecting plate, a rubber bellows, a guide slide column, a limit head, a lower connecting plate, a first slip ring and an extrusion spring, can facilitate the heat of the PCB board to be continuously transferred to the cold water through the heat exchange box, the heat exchange plate and the thermally conductive silicone sheet when in use, thereby ensuring rapid cooling and accelerating the melting and solidification of the solder paste. At the same time, a buffer can be formed through the extrusion spring when the heat exchange box rises, ensuring that the thermally conductive silicone sheet can fit the PCB board without being too tight.

[0027] The invention, through the arrangement of a lifting square tube, an installation tube, a heat dissipation port, a lifting motor, a threaded column, a compression spring, a connecting frame, a base plate, a second slip ring, a connecting column and a base frame, can drive the heat exchange cooling mechanism to descend during welding heating to avoid cooling the PCB board and ensure that the temperature during welding will not be lost too quickly. After welding, the heat exchange cooling mechanism can be driven immediately to ensure timely cooling of the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the structure of the present invention;

[0029] Figure 2 This is a structural schematic diagram of the PCB board of the present invention when it is fixed;

[0030] Figure 3 This is a schematic diagram of the connection structure between the lifting support mechanism and the PCB board fixing mechanism of the present invention;

[0031] Figure 4 It is a structural schematic diagram of the fixed-point fill light mechanism of the present invention;

[0032] Figure 5 It is a schematic diagram of the explosion structure at the location of the fixed-point fill light mechanism of the present invention;

[0033] Figure 6 It is a schematic diagram of the connection structure between the heat exchange cooling mechanism and the lifting and separating mechanism of the present invention;

[0034] Figure 7 It is a schematic diagram of the explosion structure of the heat exchange cooling mechanism and the lifting and separating mechanism of the present invention;

[0035] Figure 8 This is a schematic diagram of the internal explosion structure of the heat exchange cooling mechanism of the present invention;

[0036] Fig. 9 This is a schematic diagram of the internal explosion structure of the rubber bellows of the present invention;

[0037] Fig.10 This is a schematic diagram of the structure of the lifting and closing mechanism of the present invention;

[0038] Fig.11 It is an internal cross-sectional view of the lifting and closing mechanism of the present invention.

[0039] In the figure: 101, horizontal frame; 102, vertical frame; 103, connecting frame; 104, guide rail beam; 105, transverse frame; 106, guide column; 107, guide slide; 108, first damping block; 201, connecting seat; 202, movable card plate; 203, fixed card plate; 204, card position inclined strip; 205, limit pad; 206, card plate groove; 207, spring; 301, fixed shell; 302, top frame ring; 303, bottom frame ring; 304, second damping block; 305, sliding hole; 306, clearance hole; 307, extension arm; 308, fill light; 309, laser transmitter; 401, heat exchange Box; 402, heat exchange plate; 403, thermal conductive silicone sheet; 404, stop block; 405, guide hard pipe; 406, guide hose; 407, cold water joint; 408, upper connecting plate; 409, rubber bellows; 410, guide slide column; 411, limit head; 412, lower connecting plate; 413, first slip ring; 414, extrusion spring; 501, lifting square tube; 502, installation tube; 503, heat dissipation port; 504, lifting motor; 505, threaded column; 506, compression spring; 507, connecting frame; 508, bottom plate; 509, second slip ring; 510, connecting column; 511, bottom frame. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0041] See also Figure 1-11 , an assembly welding device for a PCB board comprises: a lifting support mechanism, a PCB board fixing mechanism is arranged inside the lifting support mechanism, a fixed-point fill-in light mechanism is arranged inside the lifting support mechanism, a heat exchange cooling mechanism and a lifting separation and combination mechanism are respectively arranged inside the fixed-point fill-in light mechanism, and the heat exchange cooling mechanism is located above the lifting separation and combination mechanism. By setting the lifting support mechanism, the PCB board fixing mechanism, the fixed-point fill-in light mechanism, the heat exchange cooling mechanism and the lifting separation and combination mechanism, the heat exchange cooling mechanism can be separated from the PCB board through the lifting separation and combination mechanism during welding, and the heat exchange cooling mechanism is driven to fit the PCB board through the lifting separation and combination mechanism after welding is completed, and the cooling of the PCB board is accelerated by the heat exchange cooling mechanism, thereby accelerating the cooling and solidification of the solder paste, thereby improving the maintenance efficiency.

[0042] Among them, the lifting support mechanism includes a horizontal frame 101, a vertical frame 102, a connecting frame 103 and a guide rail beam 104. The number of the horizontal frames 101 is two, and the two horizontal frames 101 are distributed in parallel. The vertical frame 102 is fixedly connected to the bottom of the horizontal frame 101, the connecting frame 103 is fixedly connected to the bottom end of the vertical frame 102, and the surface of the connecting frame 103 is provided with bolt waist holes. The guide rail beam 104 is fixedly connected between the two horizontal frames 101, and the number of the guide rail beam 104 is two.

[0043] Among them, the lifting support mechanism also includes a transverse frame 105, a guide column 106, a guide slide 107 and a first damping block 108. The transverse frame 105 is slidably connected to the surfaces of the two guide beams 104, the guide column 106 is fixedly connected between the two transverse frames 105, the guide slide 107 is integrally arranged on one side of the transverse frame 105, the first damping block 108 is fixedly connected to the inside of the transverse frame 105, and the surface of the first damping block 108 is slidably connected to the surface of the guide beam 104. Through the set transverse frame 101, vertical frame 102, connecting frame 103, guide beam 104, transverse frame 105, guide column 106, guide slide 107 and first damping block 108, the PCB board can be fixed during use to ensure that the fixed-point fill light mechanism can change its position at the bottom of the PCB board, and the fixed-point fill light mechanism is not required to fill the lower surface of the PCB board.

[0044] The PCB board fixing mechanism includes a connecting seat 201, an active card plate 202, a fixed card plate 203, a card position oblique strip 204, a limiting pad 205, a card plate slot 206 and a spring 207. The connecting seat 201 and the fixed card plate 203 are respectively fixedly connected to one side of the two cross frames 101, the active card plate 202 is slidably connected to one side of the connecting seat 201, the card position oblique strip 204 is respectively integrally arranged on one side of the active card plate 202 and one side of the fixed card plate 203, the limiting pad 205 is integrally arranged at the bottom of the card position oblique strip 204, and the card plate slot 206 is opened at the card The positioning bevel strip 204 and the limiting pad 205 are interposed between them, and the longitudinal section of the card slot 206 is conical. The spring 207 is fixedly connected to the inner wall of the connecting seat 201, and the surface of the spring 207 is slidingly connected to one side of the movable card plate 202, and the side of the movable card plate 202 close to the spring 207 is fixedly connected to the limiting block. The connecting seat 201, the movable card plate 202, the fixed card plate 203, the positioning bevel strip 204, the limiting pad 205, the card slot 206 and the spring 207 are set so that the PCB board can be stably fixed and the PCB board can be conveniently disassembled and replaced.

[0045] The fixed-point fill light mechanism includes a fixed shell 301, a top frame ring 302, a bottom frame ring 303, a second damping block 304, a sliding hole 305, a clearance hole 306, an extension arm 307, a fill light 308 and a laser emitter 309. The fixed shell 301 is slidably connected to the surface of the guide column 106 through the sliding hole 305. The top frame ring 302 and the bottom frame ring 303 are respectively fixedly connected to the inner wall of the top end of the fixed shell 301 and the inner wall of the bottom end of the fixed shell 301. The second damping block 304 is respectively fixedly connected to both sides of the fixed shell 301. The clearance holes 306 are respectively opened on both sides of the fixed shell 301. The extension arm 307 is fixedly connected to one side of the fixed shell 301. The fill light 308 is fixedly mounted at one end of the extension arm 307, and the fill light 308 is located above the middle of the fixed shell 301. The laser emitter 309 is fixedly mounted in the middle of the fill light 308. Through the set fixed shell 301, the top frame ring 302, the bottom frame ring 303, the second damping block 304, the sliding hole 305, the yield hole 306, the extension arm 307, the fill light 308 and the laser emitter 309, the fill light 308 can be used to fill light to the repair position during use to improve the brightness and facilitate maintenance. The laser emitter 309 emits laser to accurately locate the repair position, ensuring that the heat exchange cooling mechanism can be accurately aligned below it.

[0046] Among them, the heat exchange cooling mechanism includes a heat exchange box 401, a heat exchange plate 402, a thermally conductive silicone sheet 403, a stopper block 404, a guide tube 405, a guide hose 406 and a cold water joint 407. The heat exchange box 401 is movably arranged inside the fixed shell 301, the heat exchange plate 402 is fixedly connected to the inner wall at the top of the heat exchange box 401, the thermally conductive silicone sheet 403 is fixedly attached to the upper surface of the heat exchange plate 402, the stopper block 404 is integrally arranged on the surface of the heat exchange box 401, and the surface of the stopper block 404 is slidably connected to the inner wall of the fixed shell 301, the number of the guide tube 405 is two, and the two guide tubes 405 are respectively fixedly connected to both sides of the heat exchange box 401, and the two guide tubes 405 are respectively a water inlet pipe and a drain pipe, and the top height of the water inlet pipe is lower than the top height of the drain pipe, and the guide hose 406 is The two cold water joints 407 are respectively fixedly connected to the bottom ends of the two flow-guiding hard pipes 405, and the two cold water joints 407 are respectively fixedly connected to the tops on both sides of the connecting frame 103, and the two cold water joints 407 are respectively fixedly connected to the two flow-guiding hoses 406. The heat is conducted by the arranged thermally conductive silicone sheet 403, which can ensure the heat conduction effect while ensuring the fitting effect with the PCB board. The thermally conductive silicone sheet 403 is a thermally conductive medium material synthesized by a special process with silicone as the base material and various auxiliary materials such as metal oxides. In the industry, it is also called thermally conductive silicone pad, thermally conductive silicone sheet, soft thermally conductive pad, thermally conductive silicone gasket, etc. It is specially designed for the use of gaps to transfer heat. It can fill the gaps, open up the heat channel between the heating part and the heat dissipation part, and effectively improve the heat transfer efficiency. At the same time, it also plays the role of insulation, shock absorption, sealing, etc.

[0047] The heat exchange cooling mechanism further includes an upper connecting piece 408, a rubber bellows 409, a guide slide column 410, a limit head 411, a lower connecting piece 412, a first slip ring 413 and an extrusion spring 414. The upper connecting piece 408 is fixedly connected to the lower surface of the heat exchange box 401, the rubber bellows 409 is fixedly connected to the lower surface of the upper connecting piece 408, the lower connecting piece 412 is fixedly connected to the bottom end of the rubber bellows 409, the guide slide column 410 is fixedly plugged into the bottom of the upper connecting piece 408, the limit head 411 is integrally arranged at the bottom end of the guide slide column 410, the first slip ring 413 is fixedly connected to the inside of the lower connecting piece 412, and the inner wall of the first slip ring 413 is slidably connected to the surface of the guide slide column 410, the extrusion spring 414 is movably sleeved on the surface of the guide slide column 410, and the extrusion spring 414 is located between the upper connecting piece 408 and the lower connecting piece 412. The heat exchange box 401, heat exchange sheet 402, thermally conductive silicone sheet 403, stop block 404, flow guide hard pipe 405, flow guide hose 406, cold water joint 407, upper connecting piece 408, rubber bellows 409, guide slide column 410, limit head 411, lower connecting piece 412, first slide ring 413 and extrusion spring 414 are arranged so that when in use, the heat of the PCB board can be continuously transferred to the cold water through the heat exchange box 401, heat exchange sheet 402 and thermally conductive silicone sheet 403 to be taken away, thereby ensuring rapid cooling and accelerating the melting and solidification of solder paste. At the same time, a buffer can be formed by the extrusion spring 414 when the heat exchange box 401 rises, ensuring that the thermally conductive silicone sheet 403 can fit the PCB board without being too tight.

[0048] Among them, the lifting and separating mechanism includes a lifting square tube 501, a mounting tube 502, a heat dissipation port 503, a lifting motor 504, a threaded column 505, a clamping spring 506 and a connecting frame 507. The lifting square tube 501 is fixedly inserted at the bottom of the lower connecting plate 412, the mounting tube 502 is slidably connected to the inner wall of the lifting square tube 501, the heat dissipation port 503 penetrates and is opened on the surface of the mounting tube 502, the lifting motor 504 is fixedly installed inside the mounting tube 502, the threaded column 505 is fixedly installed at the output end of the lifting motor 504 through a coupling, the clamping spring 506 is movably connected between the lifting square tube 501 and the mounting tube 502, and the connecting frame 507 is fixedly sleeved on the surface of the lifting square tube 501.

[0049] The lifting and closing mechanism further includes a bottom plate 508, a second slip ring 509, a connecting column 510 and a bottom frame 511. The bottom plate 508 is fixedly connected to the inner wall of the bottom frame ring 303, the second slip ring 509 is fixedly connected to the inner wall of the bottom plate 508, the connecting column 510 is fixedly connected to the bottom of the connecting frame 507, and the surface of the connecting column 510 is slidably connected to the inner wall of the second slip ring 509, and the bottom frame 511 is fixedly connected to the bottom end of the connecting column 510, and the inner wall of the bottom frame 511 is slidably connected to the surface of the threaded column 505. The threaded connection is provided through the lifting square tube 501, the installation tube 502, the heat dissipation port 503, the lifting motor 504, the threaded column 505, the compression spring 506, the connecting frame 507, the bottom plate 508, the second slip ring 509, the connecting column 510 and the bottom frame 511, so that the heat exchange cooling mechanism can be driven to descend during welding heating to avoid cooling the PCB board and ensure that the temperature during welding will not be lost too quickly. After welding, the heat exchange cooling mechanism can be driven immediately to ensure timely cooling of the PCB board.

[0050] A method for using a PCB assembly welding device, comprising:

[0051] Step S1: Connect the cold water joint 407 near the water inlet pipe to the external cooling water pipe, connect the cold water joint 407 near the drain pipe to the external drain pipe, and turn on the switch of the external cooling water pipe. Cold water enters the heat exchange box 401 from the water inlet pipe, fills the heat exchange box 401, and takes away the heat and is discharged from the drain pipe;

[0052] Step S2: clamping the PCB board between the movable clamping board 202 and the fixed clamping board 203. When clamping, first clamp the PCB board into the clamping board slot 206 of the fixed clamping board 203, and then press the other end of the PCB board to clamp it into the clamping board slot 206 of the movable clamping board 202 along the clamping inclined strip 204;

[0053] Step S3: Start the lifting motor 504 to lower the heat exchange box 401, so that the thermal conductive silicone sheet 403 is separated from the lower surface of the PCB board. After starting the lifting motor 504, the lifting motor 504 drives the threaded column 505 to rotate. When the threaded column 505 rotates, the bottom frame 511 is pushed down through the thread. The bottom frame 511 pulls the connecting frame 507 through the connecting column 510, so that the lifting square tube 501 and the heat exchange cooling mechanism are lowered, ensuring that the thermal conductive silicone sheet 403 is separated from the PCB board;

[0054] Step S4: Slide the extension arm 307, turn on the fill light 308 and the laser emitter 309, and move the heat exchange box 401 to the bottom of the PCB board maintenance position by using the laser emitter 309 as a reference. When the laser emitter 309 is turned on, a light spot will be displayed on the PCB board. When the light spot is moved to the maintenance position, the center of the heat exchange box 401 is just below the PCB board maintenance position, and the fill light 308 forms fill light around it.

[0055] Step S5: performing heating and welding work;

[0056] Step S6: After welding is completed, the lifting motor 504 is started to lift the heat exchange box 401, so that the thermal conductive silicone sheet 403 is in contact with the lower surface of the PCB board, thereby accelerating the heat exchange and cooling of the PCB board. The lifting motor 504 drives the threaded column 505 to rotate in the opposite direction. When the threaded column 505 rotates, the bottom frame 511 is pushed up by the thread. The bottom frame 511 pulls the connecting frame 507 through the connecting column 510, so that the lifting square tube 501 and the heat exchange and cooling mechanism are lifted, ensuring that the thermal conductive silicone sheet 403 is in contact with the PCB board. At this time, due to the good thermal conductivity of the PCB board, the high temperature at the maintenance position will be conducted to the inside of the cold water through the PCB board, the thermal conductive silicone sheet 403 and the heat exchange sheet 402, and then carried away by the water flow, thereby achieving rapid cooling of the maintenance position and ensuring rapid solidification of the solder paste.

[0057] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A PCB assembly welding device, characterized in that: include: A lifting support mechanism, wherein a PCB board fixing mechanism is arranged inside the lifting support mechanism, a fixed-point fill-in light mechanism is arranged inside the lifting support mechanism, a heat exchange cooling mechanism and a lifting separation and combination mechanism are arranged inside the fixed-point fill-in light mechanism, and the heat exchange cooling mechanism is located above the lifting separation and combination mechanism; The lifting support mechanism includes a horizontal frame, a vertical frame, a connecting frame and a guide rail beam. The number of the horizontal frames is two, and the two horizontal frames are distributed in parallel. The vertical frame is fixedly connected to the bottom of the horizontal frame, and the connecting frame is fixedly connected to the bottom end of the vertical frame. Bolt waist holes are opened on the surface of the connecting frame. The guide rail beam is fixedly connected between the two horizontal frames, and the number of the guide rail beam is two; The lifting support mechanism also includes a transverse frame, a guide column, a guide slide bar and a first damping block, the transverse frame is slidably connected to the surfaces of the two guide rail beams, the guide column is fixedly connected between the two transverse frames, the guide slide bar is integrally arranged on one side of the transverse frame, the first damping block is fixedly connected to the inside of the transverse frame, and the surface of the first damping block is slidably connected to the surface of the guide rail beam; The fixed-point fill-in light mechanism comprises a fixed shell, a top frame ring, a bottom frame ring, a second damping block, a sliding hole, a clearance hole, an extension arm, a fill-in light and a laser transmitter. The fixed shell is slidably connected to the surface of the guide column through the sliding hole. The top frame ring and the bottom frame ring are respectively fixedly connected to the inner wall of the top end of the fixed shell and the inner wall of the bottom end of the fixed shell. The second damping blocks are respectively fixedly connected to both sides of the fixed shell. The clearance holes are respectively penetrated and opened on both sides of the fixed shell. The extension arm is fixedly connected to one side of the fixed shell. The fill-in light is fixedly installed at one end of the extension arm, and the fill-in light is located above the middle of the fixed shell. The laser transmitter is fixedly installed in the middle of the fill-in light. The heat exchange cooling mechanism includes a heat exchange box, a heat exchange plate, a thermally conductive silicone sheet, a stop block, a guide tube, a guide hose and a cold water joint. The heat exchange box is movably arranged inside the fixed shell, the heat exchange plate is fixedly connected to the inner wall of the top of the heat exchange box, the thermally conductive silicone sheet is fixedly attached to the upper surface of the heat exchange plate, the stop block is integrally arranged on the surface of the heat exchange box, and the surface of the stop block is slidably connected to the inner wall of the fixed shell. There are two guide tubes, and the two guide tubes are respectively fixedly connected to both sides of the heat exchange box, and the two guide tubes are respectively a water inlet pipe and a drain pipe, and the top height of the water inlet pipe is lower than the top height of the drain pipe, the guide hoses are respectively fixedly connected to the bottom ends of the two guide tubes, the cold water joints are respectively fixedly connected to the tops of both sides of the connecting frame, and the two cold water joints are respectively fixedly connected to the two guide hoses.

2. According to claim 1, a PCB board assembly and welding equipment, the PCB board fixing mechanism comprises a connecting seat, a movable card plate, a fixed card plate, a card position bevel bar, a limiting pad, a card plate slot and a spring leaf, the connecting seat and the fixed card plate are respectively fixedly connected to one side of the two cross frames, the movable card plate is slidably connected to one side of the connecting seat, the card position bevel bar is respectively integrally arranged on one side of the movable card plate and one side of the fixed card plate, the limiting pad plate is integrally arranged at the bottom of the card position bevel bar, the card plate slot is opened between the card position bevel bar and the limiting pad plate, and the longitudinal cross-section of the card plate slot is conical, the spring leaf is fixedly connected to the inner wall of the connecting seat, and the surface of the spring leaf is slidably connected to one side of the movable card plate, and the side of the movable card plate close to the spring leaf is fixedly connected to the limiting block.

3. According to a PCB board assembly welding device according to claim 1, the heat exchange cooling mechanism also includes an upper connecting piece, a rubber bellows, a guide slide column, a limit head, a lower connecting piece, a first slip ring and an extrusion spring, the upper connecting piece is fixedly connected to the lower surface of the heat exchange box, the rubber bellows is fixedly connected to the lower surface of the upper connecting piece, the lower connecting piece is fixedly connected to the bottom end of the rubber bellows, the guide slide column is fixedly plugged into the bottom of the upper connecting piece, the limit head is integrally arranged at the bottom end of the guide slide column, the first slip ring is fixedly connected to the inside of the lower connecting piece, and the inner wall of the first slip ring is slidably connected to the surface of the guide slide column, the extrusion spring is movably sleeved on the surface of the guide slide column, and the extrusion spring is located between the upper connecting piece and the lower connecting piece.

4. A PCB assembly welding device according to claim 3, characterized in that: The lifting and closing mechanism includes a lifting square tube, a mounting tube, a heat dissipation port, a lifting motor, a threaded column, a compression spring and a connecting frame. The lifting square tube is fixedly inserted at the bottom of the lower connecting plate, the mounting tube is slidably connected to the inner wall of the lifting square tube, the heat dissipation port is penetrated and opened on the surface of the mounting tube, the lifting motor is fixedly installed inside the mounting tube, the threaded column is fixedly installed on the output end of the lifting motor through a coupling, the compression spring is movably connected between the lifting square tube and the mounting tube, and the connecting frame is fixedly sleeved on the surface of the lifting square tube.

5. A PCB assembly welding device according to claim 4, characterized in that: The lifting and separating mechanism also includes a base plate, a second slip ring, a connecting column and a base frame. The base plate is fixedly connected to the inner wall of the bottom frame ring, the second slip ring is fixedly connected to the inner wall of the base plate, the connecting column is fixedly connected to the bottom of the connecting frame, and the surface of the connecting column is slidably connected to the inner wall of the second slip ring, the base frame is fixedly connected to the bottom end of the connecting column, and the inner wall of the base frame is threadedly connected to the surface of the threaded column.

6. A method for using a PCB assembly welding device according to any one of claims 1 to 5, characterized in that: include: Step S1: Connect the cold water joint near the water inlet pipe to the external cooling water pipe, connect the cold water joint near the drain pipe to the external drain pipe, and turn on the switch of the external cooling water pipe; Step S2: Connect the PCB board between the movable card board and the fixed card board; Step S3: Start the lifting motor to lower the heat exchange box so that the thermal conductive silicone sheet is separated from the lower surface of the PCB board; Step S4: Slide the extension arm, turn on the fill light and the laser transmitter, and move the heat exchange box to the bottom of the PCB board maintenance position by using the laser transmitter as a reference. When the laser transmitter is turned on, a light spot will be displayed on the PCB board. When the light spot is moved to the maintenance position, the center of the heat exchange box is just below the PCB board maintenance position. Step S5: performing heating and welding work; Step S6: After the welding is completed, the lifting motor is started to raise the heat exchange box so that the thermal conductive silicone sheet fits the lower surface of the PCB board, thereby accelerating the heat exchange and cooling of the PCB board.

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