Tin dispensing device for printed circuit board processing

Abstract

The invention discloses a tin dispensing device for printed circuit board processing, and belongs to the technical field of printed circuit board processing, the tin dispensing device comprises a tin dispensing table, a tin dispensing cleaning structure and a tin dispensing moving structure, and the tin dispensing table is provided with a placing groove for placing a circuit board; the tin dispensing cleaning structure comprises a cleaning box, a tin dispensing rotating assembly, a welding slag cleaning assembly and a welding slag cleaning assembly, the cleaning box is located on the rear portion of the tin dispensing table, the tin dispensing rotating assembly is arranged in the cleaning box, the welding slag cleaning assembly is located at the rotating end of the tin dispensing rotating assembly, and the welding slag cleaning assembly is located in the cleaning box; the tin dispensing moving structure is erected above the tin dispensing table, an automatic tin dispensing head and an automatic tin wire feeding system are arranged at the moving end of the tin dispensing moving structure, and the tin dispensing moving structure can drive the automatic tin dispensing head and the automatic tin wire feeding system to move within the range area of the tin dispensing table and the tin dispensing cleaning structure. According to the automatic tin soldering head, welding slag on the automatic tin soldering head can be cleaned.

Description

Technical Field

[0001] The invention belongs to the technical field of printed circuit board processing, and in particular relates to a tinning device for printed circuit board processing. Background Art

[0002] Printed circuit boards (PCBs) are an integral part of electronic devices, providing mechanical support and electrical connections for electronic components. With the continuous development of electronic technology, the quality and performance requirements for PCBs are becoming increasingly higher. As a key link in PCB processing, tinning directly affects the electrical performance and reliability of PCBs.

[0003] During the process of tinning and welding, the tinning head is usually used to heat the heating wire and then welded to the corresponding place on the circuit board. However, after each welding of the circuit board, there will be residual welding slag on the welding head. The presence of welding slag may cause the welding parts to be loose, and it is easy to break or loosen when subjected to external force. Summary of the invention

[0004] The embodiment of the present invention provides a tinning device for processing a printed circuit board to solve the problems in the prior art.

[0005] The embodiment of the present invention adopts the following technical scheme: a tinning device for printed circuit board processing, comprising a tinning table, a tinning cleaning structure and a tinning moving structure, wherein the tinning table is horizontally arranged, and a placement slot for placing the circuit board is provided on the tinning table; the tinning cleaning structure comprises a cleaning box, a tinning rotating assembly, a solder slag cleaning assembly and a solder slag cleaning assembly, wherein the cleaning box is located at the rear of the tinning table, the tinning rotating assembly is arranged in the cleaning box, the solder slag cleaning assembly is located on the rotating end of the tinning rotating assembly, and the solder slag cleaning assembly is located in the cleaning box and arranged toward the solder slag cleaning assembly; the tinning moving structure is erected above the tinning table, and an automatic tinning head and an automatic tin feeding line system are provided on the moving end of the tinning moving structure, and the tinning moving structure can drive the automatic tinning head and the automatic tin feeding line system to move within the range area of ​​the tinning table and the tinning cleaning structure.

[0006] Furthermore, the tinning rotating assembly includes a rotating motor and a rotating disk. A cleaning filter is horizontally arranged in the cleaning box. A collection drawer that slides together with the cleaning filter is provided at the bottom of the cleaning filter in the cleaning box. The rotating motor is located at the bottom of the cleaning filter, and the rotating disk is rotatably connected to the cleaning filter and connected to the main shaft of the rotating motor.

[0007] Furthermore, the welding slag cleaning assembly includes an inclined plate, a support rod and a support frame horizontally arranged on the top of the support rod, the support rod is vertically arranged on the top of the rotating disk, the support frame is provided with a horizontally arranged sliding electric cylinder, the side wall of the support frame is provided with two arc grooves, a vertically arranged slider is provided in the support frame, the slider slides with the support frame, the telescopic end of the sliding electric cylinder is connected to the slider, and a horizontally arranged rotating shaft is provided at the bottom of the inclined plate, the rotating shaft rotates on the slider, and the two ends of the rotating shaft rotate in two arc grooves respectively and slide up and down.

[0008] Furthermore, the inclined plate is provided with two horizontally arranged rotating rods, the two rotating rods are sleeved with grinding belts, and the inclined plate is provided with a driving motor which is transmission-connected to the rotating rods.

[0009] Furthermore, the welding slag cleaning assembly includes a mounting frame, which is located on the top of the cleaning filter. Dust suction fans are provided on the four side walls of the mounting frame. A dust suction bag extending to the top of the cleaning filter is provided on the dust outlet end of the dust suction fan.

[0010] Furthermore, the mesh of the cleaning filter is larger than the pore size of the tin slag.

[0011] Furthermore, the tinning mobile structure includes a mobile frame, a horizontal electric slide and two working electric slides. The two working electric slides are symmetrically arranged on both sides of the tinning platform. The two ends of the mobile frame are respectively connected to the mobile ends of the two working electric slides. The horizontal electric slide is horizontally arranged on the side wall of the mobile frame. The mobile end of the horizontal electric slide is provided with an up and down moving electric cylinder. The automatic tinning head and the automatic tin feeding line system are connected to the telescopic ends of the up and down moving electric cylinders.

[0012] Furthermore, a limiting plate which is slidably matched with the placement groove is provided in the placement groove, and a plurality of tightening springs which are arranged at equal intervals are provided on the limiting plate.

[0013] At least one of the above technical solutions adopted in the embodiments of the present invention can achieve the following beneficial effects:

[0014] Firstly, when the present invention cleans and removes the welding slag on the automatic tinning head, the sliding electric cylinder drives the slider to move horizontally on the support frame, and the movement of the slider drives the rotating shaft to move along the length direction of the two arc grooves, so that the inclined plate is tilted and rotated on the slider, so that the grinding belt on the inclined plate is rotated and adjusted to adapt to the automatic tinning head, and the inclined plate is rotated from a horizontal state to a vertical state to adapt to the vertically set automatic tinning head. The inclined plate can also be stopped at any position within 0-90 degrees according to the angular position of the automatic tinning head, and the grinding belt can be stopped at any angle, so as to clean the welding slag and tin slag on different types of automatic tinning heads.

[0015] Secondly, in the process of cleaning the tin slag remaining on the automatic tinning head of the present invention, the dust suction fan can absorb the tin slag polished off, and the dust suction fans are arranged on the side walls around the installation frame, which can absorb the tin slag and welding slag in any direction on the automatic tinning head, so that the absorption is more comprehensive and the effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0018] Figure 2 It is a schematic diagram of the three-dimensional structure of the tinning platform of the present invention;

[0019] Figure 3 It is a three-dimensional structural schematic diagram of the midpoint tin cleaning structure of the present invention;

[0020] Figure 4 It is a three-dimensional structural schematic diagram of the midpoint tinning rotating assembly and the solder slag cleaning assembly of the present invention;

[0021] Figure 5 It is a schematic diagram of the first three-dimensional structure of the welding slag cleaning component of the present invention;

[0022] Figure 6 It is a second three-dimensional structural schematic diagram of the welding slag cleaning component in the present invention;

[0023] Figure 7 It is a front view of the welding slag cleaning component of the present invention;

[0024] Figure 8 It is a schematic diagram of the three-dimensional structure of the midpoint tin moving structure of the present invention;

[0025] Reference numerals

[0026] Tinning table 1, placement slot 11, limit plate 12, tightening spring 13, tinning cleaning structure 2, cleaning box 21, cleaning filter 211, collecting drawer 212, tinning rotating assembly 22, rotating motor 221, rotating disk 222, welding slag cleaning assembly 23, tilting plate 230, support rod 231, support frame 232, sliding electric cylinder 233, slider 234, arc groove 235, rotating shaft 236, rotating rod 237, grinding belt 238, driving motor 239, welding slag cleaning assembly 24, mounting frame 241, dust suction fan 242, tinning moving structure 3, moving frame 31, horizontal electric slide 32, working electric slide 33, up and down moving electric cylinder 34, automatic tinning head 4. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the specific embodiments of the present invention and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0028] The technical solutions provided by various embodiments of the present invention are described in detail below in conjunction with the accompanying drawings.

[0029] Reference Figures 1 to 8 As shown, an embodiment of the present invention provides a tinning device for printed circuit board processing, comprising a tinning platform 1, a tinning cleaning structure 2 and a tinning moving structure 3, wherein the tinning platform 1 is horizontally arranged, and a placement slot 11 for placing a circuit board is provided on the tinning platform 1; the tinning cleaning structure 2 comprises a cleaning box 21, a tinning rotating assembly 22, a solder slag cleaning assembly 23 and a solder slag cleaning assembly 24, wherein the cleaning box 21 is located at the rear of the tinning platform 1, the tinning rotating assembly 22 is arranged in the cleaning box 21, the solder slag cleaning assembly 23 is located on the rotating end of the tinning rotating assembly 22, and the solder slag cleaning assembly 24 is located in the cleaning box 21 and is arranged toward the solder slag cleaning assembly 23; the tinning moving structure 3 is erected above the tinning platform 1, and an automatic tinning head 4 and an automatic tin feeding line system are provided on the moving end of the tinning moving structure 3, and the tinning moving structure 3 can drive the automatic tinning head 4 and the automatic tin feeding line system to move within the range area of ​​the tinning platform 1 and the tinning cleaning structure 2.

[0030] During operation, the circuit board is horizontally placed in the placement slot 11, and the limiting plate 12 in the placement slot 11 limits and fixes the position of the circuit board through a plurality of tightening springs 13. Then, the tinning moving structure 3 works to drive the automatic tinning head 4 and the automatic tinning line system to move their positions, and tinning work is performed on different positions of the circuit board;

[0031] After the tinning of the circuit board is completed, the automatic tinning head 4 is moved into the cleaning box 21 through the tinning moving structure 3, and the tinning rotating component 22, the solder slag cleaning component 23 and the solder slag cleaning component 24 cooperate with each other to clean the solder slag remaining on the automatic tinning head 4.

[0032] It should be noted that when the automatic tinning head 4 is moved to the tinning cleaning structure 2 , the automatic tinning head 4 is located at the center of the rotating disk 222 , so as to better clean the solder slag on the automatic tinning head 4 .

[0033] 1. Ensure welding quality

[0034] Precise tinning: After cleaning the solder slag, the tin outlet of the tinning head remains unobstructed, which can ensure that the tin wire flows out with accurate flow and shape, making the solder joints uniform and full in size, and improving the accuracy and consistency of welding.

[0035] Avoid cold solder joints and false solder joints: The presence of welding slag may affect the good contact between the tin wire and the welding part. Cleaning it can effectively reduce the risk of cold solder joints and false solder joints and enhance the reliability of welding.

[0036] 2. Improve production efficiency

[0037] Stable operation: The accumulation of welding slag may cause the soldering head to jam and become blocked during operation, affecting the normal operation speed of the equipment. After cleaning the welding slag, the soldering head can perform the soldering operation smoothly, reducing equipment failures and downtime, and improving production efficiency.

[0038] Reduce adjustment time: Without the interference of welding slag, the working parameters of the tinning head are more stable, and there is no need to frequently adjust the tinning time, temperature and other parameters, saving operation time.

[0039] 3. Extend the service life of equipment

[0040] Protect the soldering tip: Solder slag is corrosive to a certain extent. If it is not cleaned for a long time, it will cause corrosion damage to the metal parts of the soldering tip. Cleaning the solder slag in time can reduce this corrosion and extend the service life of the soldering tip.

[0041] Reduce equipment maintenance costs: Reduce the repair and replacement of tinning heads due to damage, and reduce equipment maintenance costs.

[0042] 4. Improve the working environment

[0043] Reduce pollution: Cleaning welding slag can avoid slag splashing and scattering, keep the working area clean and tidy, and reduce pollution to the working environment.

[0044] Reduce safety hazards: The accumulation of welding slag may increase safety hazards such as fire, and cleaning it up helps improve workplace safety.

[0045] It should be noted that the automatic tinning wire system belongs to the prior art (not shown in the figure). The automatic tinning head 4 is generally in a vertical state, and some automatic tinning heads 4 are in an inclined state. Adaptive assembly selection can be performed according to the tinning work for different circuit boards.

[0046] Specifically, the tinning rotating assembly 22 includes a rotating motor 221 and a rotating disk 222. A cleaning filter 211 is horizontally arranged in the cleaning box 21. A collection drawer 212 that slides with the cleaning filter 211 is provided at the bottom of the cleaning filter 211 in the cleaning box 21; the rotating motor 221 is located at the bottom of the cleaning filter 211, and the rotating disk 222 is rotatably connected to the cleaning filter 211 and connected to the main shaft of the rotating motor 221.

[0047] After cleaning the solder on the automatic soldering head 4, the solder slag is transported to the collection drawer 212 below through the cleaning filter 211, and the solder slag and tin slag are collected and placed;

[0048] After the automatic tinning head 4 is cleaned, the rotating motor 221 drives the rotating disk 222 to rotate, thereby driving the rotating disk 222 to rotate, thereby rotating the grinding belt 238. The rotating disk 222 can be stopped at any position on the axis, thereby grinding and cleaning the welding slag at any position on the automatic tinning head 4, making the cleaning more comprehensive and effective.

[0049] Specifically, the welding slag cleaning assembly 23 includes an inclined plate 230, a support rod 231 and a support frame 232 horizontally arranged on the top of the support rod 231, the support rod 231 is vertically arranged on the top of the rotating disk 222, a horizontally arranged sliding electric cylinder 233 is provided on the support frame 232, two arc grooves 235 are provided on the side wall of the support frame 232, a vertically arranged slider 234 is provided in the support frame 232, the slider 234 slides with the support frame 232, the telescopic end of the sliding electric cylinder 233 is connected to the slider 234, a horizontally arranged rotating shaft 236 is provided at the bottom of the inclined plate 230, the rotating shaft 236 rotates on the slider 234, and the two ends of the rotating shaft 236 rotate and slide up and down in the two arc grooves 235 respectively.

[0050] When cleaning the welding slag on the automatic tinning head 4, the sliding electric cylinder 233 drives the slider 234 to move horizontally on the support frame 232, and the movement of the slider 234 drives the rotating shaft 236 to move along the length direction of the two arc grooves 235, so that the inclined plate 230 is tilted and rotated on the slider 234, so that the grinding belt 238 on the inclined plate 230 is rotated and adjusted to adapt to the automatic tinning head 4, and the inclined plate 230 is rotated from a horizontal state to a vertical state to adapt to the vertically set automatic tinning head 4. The inclined plate 230 can also be stopped at any position within 0-90 degrees according to the angular position of the automatic tinning head 4, so that the position of the grinding belt 238 is stopped at any angle, so as to clean the welding slag and tin slag on different types of automatic tinning heads 4;

[0051] Can ensure accurate tinning: After cleaning the solder slag, the tin outlet of the tinning head remains unobstructed, which can ensure that the tin wire flows out with accurate flow and shape, making the solder joints uniform and full in size, and improving the accuracy and consistency of welding.

[0052] Avoid cold solder joints and false solder joints: The presence of welding slag may affect the good contact between the tin wire and the welding part. Cleaning it can effectively reduce the risk of cold solder joints and false solder joints and enhance the reliability of welding.

[0053] Specifically, two horizontally arranged rotating rods 237 are further provided on the inclined plate 230 , and grinding belts 238 are sleeved on the two rotating rods 237 . A driving motor 239 transmission-connected to the rotating rods 237 is provided on the inclined plate 230 .

[0054] After the tilting plate 230 is rotated to contact the automatic soldering head 4, the driving motor 239 drives the rotating rod 237 to rotate on the tilting plate 230, and then drives the grinding belt 238 to rotate to clean the residual solder slag on the automatic soldering head 4;

[0055] It should be noted that the grinding belt 238 is a coarse-grained grinding belt and is only needed to clean the welding slag accumulated on the automatic tinning head 4. A proximity switch is provided on the side wall of the inclined plate 230. When the grinding belt 238 on the inclined plate 230 comes into contact with the welding slag on the automatic tinning head 4, the sliding electric cylinder 233 will be controlled to stop working, and the welding slag on the automatic tinning head 4 will be ground and cleaned without damaging the automatic tinning head 4 and affecting the subsequent tinning work of the automatic tinning head 4.

[0056] Specifically, the welding slag cleaning assembly 24 includes a mounting frame 241, and the mounting frame 241 is located at the top of the cleaning filter 211. Dust suction fans 242 are provided on the four side walls of the mounting frame 241. A dust suction bag (not shown in the figure) extending to the top of the cleaning filter 211 is provided at the dust outlet end of the dust suction fan 242.

[0057] In the process of cleaning the tin slag remaining on the automatic tinning head 4, the dust suction fan 242 can absorb the tin slag polished off, and the dust suction fans 242 are arranged on the four side walls of the installation frame 241, which can absorb the tin slag and welding slag in any direction on the automatic tinning head 4, so that the absorption is more comprehensive and the effect is better.

[0058] Specifically, the mesh of the cleaning filter 211 is larger than the aperture of the tin slag; after the tin slag is collected and transported to the cleaning filter 211 through the dust bag by the dust suction fan 242, the cleaning filter 211 will transport the tin slag to the collection drawer 212 below for storage, and the cleaning filter 211 can smoothly allow the tin slag to fall downward.

[0059] Specifically, the tinning mobile structure 3 includes a mobile frame 31, a horizontal electric slide 32 and two working electric slides 33. The two working electric slides 33 are symmetrically arranged on both sides of the tinning platform 1. The two ends of the mobile frame 31 are respectively connected to the moving ends of the two working electric slides 33. The horizontal electric slide 32 is horizontally arranged on the side wall of the mobile frame 31. The moving end of the horizontal electric slide 32 is provided with an up and down moving electric cylinder 34. The automatic tinning head 4 and the automatic tin feeding line system are connected to the telescopic ends of the up and down moving electric cylinder 34.

[0060] During the process of tinning the circuit board, the two working electric slides 33 will work simultaneously to drive the movable plate to move synchronously along the length direction of the tinning table 1, thereby driving the position of the automatic tinning head 4 to move in the length direction and perform tinning on the circuit board. The horizontal electric slide 32 works to drive the position of the automatic tinning head 4 to move horizontally and perform tinning on the circuit board. The up and down moving electric cylinder 34 works to drive the position of the automatic tinning head 4 to move up and down, and moves the position of the automatic tinning head 4 and the automatic tin feeding line system downward to the circuit board to perform tinning on the circuit board.

[0061] Specifically, a limiting plate 12 is provided in the placement groove 11 and is slidably matched with the limiting plate 12, and a plurality of equally spaced retaining springs 13 are provided on the limiting plate 12; during use, after the circuit board is placed in the placement groove 11, the plurality of retaining springs 13 use their own restoring force to enable the limiting plate 12 to press and fix the circuit board, thereby preventing the position deviation of the circuit board during the tinning process of the circuit board.

[0062] The above description is only an embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims

1. A tinning device for printed circuit board processing, characterized in that: It comprises a tinning platform (1), a tinning cleaning structure (2) and a tinning moving structure (3); The tinning platform (1) is arranged horizontally, and a placement groove (11) for placing the circuit board is provided on the tinning platform (1); The tinning cleaning structure (2) comprises a cleaning box (21), a tinning rotating assembly (22), a solder slag cleaning assembly (23) and a solder slag cleaning assembly (24); The cleaning box (21) is located at the rear of the tinning table (1), the tinning rotating assembly (22) is arranged in the cleaning box (21), the welding slag cleaning assembly (23) is located on the rotating end of the tinning rotating assembly (22), and the welding slag cleaning assembly (24) is located in the cleaning box (21) and is arranged toward the welding slag cleaning assembly (23); The tinning movable structure (3) is erected above the tinning platform (1), and an automatic tinning head (4) and an automatic tinning line system are arranged on the movable end of the tinning movable structure (3). The tinning movable structure (3) can drive the automatic tinning head (4) and the automatic tinning line system to move within the range of the tinning platform (1) and the tinning cleaning structure (2).

2. A tinning device for printed circuit board processing according to claim 1, characterized in that: The tinning rotating assembly (22) comprises a rotating motor (221) and a rotating disk (222); A cleaning filter (211) is horizontally arranged in the cleaning box (21), and a collecting drawer (212) is provided at the bottom of the cleaning filter (211) in the cleaning box (21) and is slidably matched with the cleaning filter (211); The rotating motor (221) is located at the bottom of the cleaning filter (211), and the rotating disk (222) is rotatably connected to the cleaning filter (211) and is connected to the main shaft of the rotating motor (221).

3. A tinning device for printed circuit board processing according to claim 2, characterized in that: The welding slag cleaning assembly (23) comprises an inclined plate (230), a support rod (231), and a support frame (232) horizontally arranged on the top of the support rod (231); The support rod (231) is vertically arranged on the top of the rotating disk (222); a horizontally arranged sliding electric cylinder (233) is arranged on the support frame (232); and two arc-shaped grooves (235) are arranged on the side wall of the support frame (232); A vertically arranged sliding block (234) is provided in the support frame (232), the sliding block (234) and the support frame (232) are slidably matched, and the telescopic end of the sliding electric cylinder (233) is connected to the sliding block (234); A horizontally arranged rotating shaft (236) is provided at the bottom of the inclined plate (230), and the rotating shaft (236) rotates on the slider (234), and the two ends of the rotating shaft (236) rotate and slide up and down in two arc-shaped grooves (235) respectively.

4. A tinning device for printed circuit board processing according to claim 3, characterized in that: The inclined plate (230) is also provided with two horizontally arranged rotating rods (237), the two rotating rods (237) are sleeved with grinding belts (238), and the inclined plate (230) is provided with a driving motor (239) which is transmission-connected to the rotating rods (237).

5. The tinning device for printed circuit board processing according to claim 2, characterized in that: The welding slag cleaning assembly (24) comprises a mounting frame (241), wherein the mounting frame (241) is located on the top of the cleaning filter (211); Dust suction fans (242) are provided on the four side walls of the installation frame (241), and a dust suction bag extending to the top of the cleaning filter (211) is provided on the dust outlet end of the dust suction fan (242).

6. A tinning device for printed circuit board processing according to claim 5, characterized in that: The mesh of the cleaning filter (211) is larger than the aperture of the tin slag.

7. The tinning device for printed circuit board processing according to claim 1, characterized in that: The tinning moving structure (3) comprises a moving frame (31), a horizontal electric slide (32) and two working electric slides (33); The two working electric slides (33) are symmetrically arranged on both sides of the tinning platform (1), the two ends of the moving frame (31) are respectively connected to the moving ends of the two working electric slides (33), and the horizontal electric slide (32) is horizontally arranged on the side wall of the moving frame (31); An up-and-down moving electric cylinder (34) is provided on the moving end of the horizontal electric slide (32), and the automatic tinning head (4) and the automatic tinning wire feeding system are connected to the telescopic end of the up-and-down moving electric cylinder (34).

8. The tinning device for printed circuit board processing according to claim 1, characterized in that: A limiting plate (12) is provided in the placement groove (11) and is slidably matched therewith, and a plurality of tightening springs (13) are provided on the limiting plate (12) and are arranged at equal intervals.

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