Process for water guided laser machining of alumina ceramic slices

Abstract

The application provides a process method for water guide laser processing of an alumina ceramic slice, comprising the following steps: cleaning and clamping and fixing the alumina ceramic slice to be processed; setting water guide laser processing parameters and water pressure parameters; processing an outer guide groove from a thickness direction in a peripheral area of a to-be-processed area of the alumina ceramic slice; processing an outer ring guide groove from the thickness direction along a contour edge of the to-be-processed area, the outer guide groove being adjacent to the outer ring guide groove; cutting and processing from an outer side of the to-be-processed area according to a planned water guide laser processing path, and cutting and processing in a layer-by-layer deepening mode until the processing is completed, wherein the position of initial cutting and processing is adjacent to the outer ring guide groove. The application can timely and effectively remove the milky white product generated in the processing process through the flushing action of the water jet combined with the reserved guide groove, avoid the interference of the product accumulation in the processing on the processing quality and process, and realize efficient and stable alumina processing.

Description

Technical Field

[0001] This invention relates to the field of water-guided laser processing technology, and more specifically to a process method for water-guided laser processing of alumina ceramic slices. Background Technology

[0002] Alumina (Al2O3), as an important engineering ceramic material, is widely used in high-tech fields such as aerospace, electronic devices, chemical equipment, and biomedical materials due to its high hardness, excellent wear resistance, corrosion resistance, and high-temperature mechanical properties. However, its typical brittleness and high hardness make it difficult for traditional machining techniques to achieve efficient processing while ensuring accuracy. In conventional cutting or grinding, tool wear is severe, and problems such as cracks, chipping, and micro-defects are easily generated during processing, directly affecting the machining quality and the service life of the workpiece.

[0003] For alumina, a difficult-to-machine material, water-guided laser processing technology offers an effective solution. This technology combines laser with a micro-water jet, transferring laser energy within a tiny water beam. The high energy density of the laser removes material, while the high specific heat capacity of water significantly reduces the heat-affected zone in the processing area. Compared to traditional laser processing, water-guided lasers constrain the laser beam diameter through water jets, creating a highly concentrated processing beam. This not only enables precision cutting on complex curved surfaces but also effectively suppresses thermal cracking and thermal stress-induced material damage, avoiding oxidation and microcracks caused by thermal shock. It offers advantages such as improved surface finish and precision, while simultaneously reducing microscopic damage and stress concentration during processing. Furthermore, the cooling effect of the water jet eliminates processing splashes and molten material deposition, further enhancing the cleanliness and controllability of the processing environment. This overcomes the limitations of traditional laser processing and provides new possibilities for the efficient and precise processing of high-performance ceramic materials such as alumina.

[0004] Currently, the processing of alumina often faces the problem of low processing efficiency, especially since the milky white products generated during processing accumulate in the processing area, making it difficult to continue processing. Summary of the Invention

[0005] The purpose of this invention is to provide a process for water-guided laser processing of alumina ceramic slices. This process effectively removes the milky white products generated during processing, significantly improving processing efficiency. This method utilizes a pre-reserved guide channel combined with the flushing effect of the water jet to promptly remove product accumulation, avoiding interference with processing quality and progress caused by product buildup, thereby achieving efficient and stable alumina processing.

[0006] According to a first aspect of the present invention, a process method for water-guided laser processing of alumina ceramic slices is provided, comprising the following steps:

[0007] Step 1: Clean the alumina ceramic slices to be processed and clamp them in place;

[0008] Step 2: Set the water-guided laser processing parameters according to the ablation threshold of the alumina ceramic slice;

[0009] Step 3: Set the water pressure parameters;

[0010] Step 4: In the outer area of ​​the area to be processed of the alumina ceramic slice, an external guide groove of a first depth h1 is processed from the processing surface of the alumina ceramic slice along the thickness direction.

[0011] Step 5: Along the contour edge of the area to be processed on the alumina ceramic slice, process an outer ring guide groove of a second depth h2 from the processing surface of the alumina ceramic slice along the thickness direction, with one end of the outer ring guide groove adjacent to the outer ring guide groove;

[0012] Step 6: Couple the laser beam with the water beam to form a water jet for water-guided laser processing. According to the planned water-guided laser processing path, start cutting from the outside of the area to be processed and cut layer by layer until the processing is completed. The initial cutting position is adjacent to the outer ring guide groove.

[0013] As an optional embodiment, in step 4, an external guide groove of a first depth h1 is machined from the processed surface of the alumina ceramic slice along the thickness direction, wherein the first depth h1 is set to satisfy:

[0014] h1 = (40% ~ 60%) * H0;

[0015] H0 represents the total machining depth of the area to be processed along the thickness direction.

[0016] As an optional embodiment, in step 4, multiple external guide grooves of a first depth h1 are machined from the processing surface of the alumina ceramic slice along the thickness direction, and the multiple external guide grooves are evenly distributed in the circumferential direction of the alumina ceramic slice to be processed.

[0017] As an optional embodiment, the feature is that, in step 4, the external guide groove has a tendency to be wider inside and narrower outside along the radial direction of the alumina ceramic slice to be processed.

[0018] As an optional embodiment, the external flow channel is designed in a dovetail or triangular shape.

[0019] As an optional embodiment, in step 5, the outer ring guide groove of a second depth h2 is processed from the processing surface of the alumina ceramic slice along the thickness direction, wherein the second depth h2 is set to satisfy:

[0020] h2 = (40% ~ 60%) * H0;

[0021] H0 represents the total processing depth of the area to be processed along the thickness direction;

[0022] Furthermore, the width of the outer ring guide groove is 0.5 to 2 mm.

[0023] As an optional embodiment, the initial depth of the outer ring guide groove is processed to 40%*H0, and the first depth h1 is dynamically adjusted to increase its depth dimension as the processing depth of the area to be processed increases.

[0024] As an optional embodiment, in step 5, the planned water-guided laser processing path adopts a spiral cutting processing path.

[0025] As an optional embodiment, in steps 4 and 5, the external guide groove and the outer ring guide groove are formed by coupling the laser beam and the water beam to form a water jet processing for water guide laser processing.

[0026] As an optional embodiment, the water jet is also used to process the outer ring guide groove during the cutting process of the area to be processed, thereby increasing its depth dimension.

[0027] As an optional embodiment, during the cutting process of the area to be processed, the white alumina product generated during the processing is guided in real time along the outer ring guide groove and cleaned from the area to be processed by the impact water flow formed by the water jet.

[0028] The water-guided laser processing method for alumina ceramic slices described in the above embodiments of the present invention, by pre-processing external guide grooves and outer ring guide grooves, can promptly remove the accumulation of milky white products generated during the processing of alumina ceramic slices using water-guided laser. The accumulation of milky white products can hinder the normal progress of laser processing, increase processing time and energy consumption, resulting in low processing efficiency and causing surface quality problems. The process method designed in this invention can effectively remove the milky white products generated during processing, significantly improving processing efficiency. Through the flushing effect of the water jet, the accumulation of products is promptly removed, avoiding interference with processing quality and process caused by product accumulation during processing, and reducing thermal damage generated during processing. This achieves efficient and stable alumina processing, improving the quality and surface finish of alumina slices.

[0029] It should be understood that all combinations of the foregoing concepts and the additional concepts described in more detail below may be considered part of the inventive subject matter of this disclosure, provided that such concepts do not contradict each other. Furthermore, all combinations of the claimed subject matter are considered part of the inventive subject matter of this disclosure.

[0030] The foregoing and other aspects, embodiments, and features of the teachings of the present invention will be more fully understood from the following description in conjunction with the accompanying drawings. Other additional aspects of the invention, such as features and / or beneficial effects of exemplary embodiments, will become apparent from the following description or may be learned through practice of specific embodiments according to the teachings of the present invention. Attached Figure Description

[0031] The accompanying drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component shown in the various figures may be denoted by the same reference numeral. For clarity, not every component is labeled in each figure. Embodiments of various aspects of the invention will now be described by way of example and with reference to the accompanying drawings.

[0032] Figure 1 This is a schematic diagram of the external guide groove and the outer ring guide groove processed on the surface of an alumina ceramic slice by water-guided laser processing according to an embodiment of the present invention.

[0033] Figure 2 This is a schematic diagram of the spiral processing path for water-guided laser processing of alumina ceramic slices according to an embodiment of the present invention. Detailed Implementation

[0034] To better understand the technical content of the present invention, specific embodiments are described below in conjunction with the accompanying drawings.

[0035] Various aspects of the invention are described in this disclosure with reference to the accompanying drawings, which illustrate numerous illustrative embodiments. The embodiments of this disclosure are not necessarily intended to encompass all aspects of the invention. It should be understood that the various concepts and embodiments described above, as well as those described in more detail below, can be implemented in any of many ways, because the concepts and embodiments disclosed herein are not limited to any particular implementation. Furthermore, some aspects of the invention disclosed may be used alone or in any suitable combination with other aspects of the invention disclosed.

[0036] {Example 1}

[0037] Combination Figure 1 , Figure 2 As shown, the process method for water-guided laser processing of alumina ceramic slices according to an embodiment of the present invention includes:

[0038] Step 1: Clean 100 alumina ceramic slices to be processed and clamp them in place;

[0039] Step 2: Set the water-guided laser processing parameters according to the ablation threshold of the alumina ceramic slice;

[0040] Step 3: Set the water pressure parameters;

[0041] Step 4: In the outer region of the processing area 101 of the alumina ceramic slice, an external guide groove 110 of a first depth h1 is processed from the processing surface of the alumina ceramic slice along the thickness direction.

[0042] Step 5: Along the outline edge of the processing area 101 of the alumina ceramic slice, process an outer ring guide groove 120 with a second depth h2 from the processing surface of the alumina ceramic slice along the thickness direction. One end of the outer ring guide groove 110 is adjacent to the outer ring guide groove 120.

[0043] Step 6: Use the laser beam and water beam to couple to form a water jet for water-guided laser processing. According to the planned water-guided laser processing path, start cutting from the outside of the area to be processed 101 and cut layer by layer until the processing is completed. The initial cutting position is adjacent to the outer ring guide groove 120.

[0044] Therefore, combined Figure 1 As shown, during the cutting process of the area 101 to be processed, the white alumina product generated during the processing is guided in real time along the outer ring guide groove 120 and cleaned from the area 101 to be processed by the impact water flow formed by the water jet.

[0045] In step 4, an external guide groove 110 of a first depth h1 is machined from the processing surface of the alumina ceramic slice along the thickness direction, wherein the first depth h1 is set to satisfy:

[0046] h1 = (40% ~ 60%) * H0;

[0047] H0 represents the total machining depth of the area to be processed 101 along the thickness direction.

[0048] In step 4, multiple external guide grooves 110 of a first depth h1 are machined from the processing surface of the alumina ceramic slice along the thickness direction. The multiple external guide grooves 110 are evenly distributed in the circumferential direction of the alumina ceramic slice 100 to be processed.

[0049] In step 4, the external guide groove 110 has a tendency to be wider inside and narrower outside along the radial direction of the alumina ceramic slice 100 to be processed, for example, by adopting a dovetail or triangular design.

[0050] exist Figure 1In the example shown, a dovetail design is used as an example. Its two tail wing structures facing the processing area 101 are adjacent to the outer ring guide groove 120, which realizes the effective cleaning of white alumina products and the discharge of water during the water-guided laser processing. This avoids the interference of product accumulation on processing quality and process, reduces thermal damage, and improves the efficiency, quality and smoothness of alumina slice processing.

[0051] In step 5, the outer ring guide groove 120 with a second depth h2 is machined from the processing surface of the alumina ceramic slice along the thickness direction, wherein the second depth h2 is set to satisfy:

[0052] h2 = (40% ~ 60%) * H0;

[0053] H0 represents the total processing depth of the area to be processed 101 along the thickness direction;

[0054] Furthermore, the width of the outer ring guide groove 120 is 0.5 to 2 mm.

[0055] In this process, the initial depth of the outer ring guide groove 120 is processed to be 40%*H0, and as the processing depth of the area to be processed 101 increases, the first depth h1 is dynamically adjusted to increase its depth dimension.

[0056] As an optional example, combined Figure 2 As shown, in step 5, the planned water-guided laser processing path adopts a helical cutting processing path. Therefore, by using a helical cutting path, thermal damage caused by localized heat accumulation during processing is minimized, which helps to evenly distribute heat and reduces the risk of cracks or material damage on the processed surface.

[0057] As an optional embodiment, in steps 4 and 5, the outer guide groove 110 and the outer ring guide groove 120 are formed by coupling the laser beam and the water beam to form a water jet processing for water guide laser processing.

[0058] Furthermore, during the cutting process of the area 101 to be processed, the water jet is used to process the outer ring guide groove 120 when dynamically adjusting its depth dimension.

[0059] {Example 2}

[0060] In this embodiment, combined with Figure 1 The process method for water-guided laser processing of alumina ceramic slices according to the present invention is further described below.

[0061] The specific steps of the water-guided laser processing method for alumina ceramic slices in this embodiment are as follows:

[0062] 1. Cleaning and clamping: Clean the alumina ceramic slices to be processed and clamp them in place;

[0063] Before processing alumina, the sample to be processed is ultrasonically cleaned in anhydrous ethanol to remove surface dirt and impurities; then the sample surface is rinsed with distilled water to ensure that there are no contaminants left and to ensure cleanliness during the processing; then the sample is precisely fixed using a clamp, which can ensure accurate positioning and avoid sample breakage due to stress concentration during processing, thus ensuring the integrity of the sample and processing stability.

[0064] 2. Set laser processing parameters: Based on the ablation threshold of the alumina ceramic slice, set the water-guided laser processing parameters;

[0065] The optimal processing parameters were determined through actual testing by setting different single-pulse energies. The formula for calculating the single-pulse energy E is as follows:

[0066] E = P / f

[0067] Where E is the single pulse energy, P is the average power in the water jet, and f is the laser repetition frequency;

[0068] 3. Set water pressure parameters: Set the corresponding water pressure parameters;

[0069] In this embodiment, appropriate water pressure parameters are set to avoid the formation of a remelted layer due to excessively low water pressure, or the decrease in water jet stability due to excessively high water pressure. The coherence length of the water jet depends on the water pressure and the micropore diameter. The relationship between water velocity v and water pressure p is as follows:

[0070]

[0071] Where v is the water velocity in m / s and p is the water pressure in bar; by setting an appropriate water velocity, the stability of the water jet and the processing quality can be ensured.

[0072] 4. Machining external guide grooves: In the outer area of ​​the area to be processed, external guide grooves with a first depth h1 are machined from the processing surface along the thickness direction. h1 is set to 40% * H0, where H0 is the total processing depth of the area to be processed along the thickness direction. Multiple grooves can be machined and are evenly distributed in the circumferential direction. In the radial direction, they are machined into a dovetail shape that is wider on the inside and narrower on the outside, so that the flow can be guided outward.

[0073] 5. Machining the outer ring guide groove: Along the contour edge of the area to be processed, machine the outer ring guide groove with a second depth h2 from the processing surface along the thickness direction. The initial depth value is 40%*H0, and the width dimension is 1mm. The first depth h1 is dynamically adjusted as the processing depth increases to increase its depth, ensuring that the white emulsion product and water flow can be smoothly discharged, reducing the interference of reflected water droplets on the water jet, thereby further improving the processing efficiency;

[0074] 6. Cutting Processing: A water jet is formed by coupling a laser beam with a water jet, and a planned spiral cutting path is created, such as... Figure 2 As shown, the cutting process begins from the outside of the area to be processed, and the cutting continues in a layer-by-layer manner until the processing is completed. The initial cutting position is adjacent to the outer ring guide channel, and one end of the outer guide channel is adjacent to the outer ring guide channel, so that the white emulsion product and water flow are guided outward during the processing, thereby improving processing efficiency and quality.

[0075] Meanwhile, during processing, the scanning speed can be dynamically adjusted by monitoring the reflection state of the water jet. Especially at the edge of the processing tank, a larger processing depth is ensured, and the tank opening can guide the water flow out, reducing the interference of reflected water droplets on the water jet, thereby further improving processing efficiency.

[0076] After processing, the alumina sample is removed from the fixture and placed in anhydrous ethanol for ultrasonic cleaning to thoroughly remove surface residues and ensure sample cleanliness. Then, the processing results are observed, tested, and recorded.

[0077] The method proposed in this invention can effectively improve the processing efficiency of alumina, improve surface quality, reduce the interference of thermal damage and product accumulation on the processing process, greatly improve the processing efficiency of alumina, and at the same time reduce the thermal damage generated during processing, resulting in high-quality and smooth alumina.

[0078] While the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the invention. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention shall be determined by the claims.

Claims

1. A process for water-guided laser processing of alumina ceramic slices, characterized in that, include: Step 1: Clean the alumina ceramic slices (100) to be processed and clamp them in place; Step 2: Set the water-guided laser processing parameters according to the ablation threshold of the alumina ceramic slice; Step 3: Set the water pressure parameters; Step 4: In the outer region of the area to be processed (101) of the alumina ceramic slice, an external guide groove (110) of a first depth h1 is processed from the processing surface of the alumina ceramic slice along the thickness direction. Step 5: Along the outline edge of the area (101) to be processed of the alumina ceramic slice, process an outer ring guide groove (120) of a second depth h2 from the processing surface of the alumina ceramic slice along the thickness direction. One end of the outer ring guide groove (110) is adjacent to the outer ring guide groove (120). Step 6: Use the laser beam and water beam to couple to form a water jet for water-guided laser processing. According to the planned water-guided laser processing path, start cutting from the outside of the area to be processed (101) and cut in a layer-by-layer manner until the processing is completed. The initial cutting position is adjacent to the outer ring guide groove (120). The external guide groove (110) is designed in a dovetail shape along the radial direction of the alumina ceramic slice (100) to be processed; In step 5, the outer ring guide groove (120) of a second depth h2 is machined from the processing surface of the alumina ceramic slice along the thickness direction, wherein the second depth h2 is set to satisfy: h2 = (40%~60%) * H0; H0 represents the total processing depth of the area to be processed (101) along the thickness direction; The width of the outer ring guide groove (120) is 0.5 to 2 mm; The initial depth of the outer ring guide groove (120) is processed to 40%*H0, and as the processing depth of the area to be processed (101) increases, the second depth h2 is dynamically adjusted to increase its depth dimension.

2. The process method for water-guided laser processing of alumina ceramic slices according to claim 1, characterized in that, In step 4, an external guide groove (110) of a first depth h1 is machined from the processing surface of the alumina ceramic slice along the thickness direction, wherein the first depth h1 is set to satisfy: h1 = (40%~60%) * H0; H0 represents the total machining depth of the area to be processed (101) along the thickness direction.

3. The process method for water-guided laser processing of alumina ceramic slices according to claim 1, characterized in that, In step 4, multiple external guide grooves (110) of a first depth h1 are processed from the processing surface of the alumina ceramic slice along the thickness direction. The multiple external guide grooves (110) are evenly distributed in the circumferential direction of the alumina ceramic slice (100) to be processed.

4. The process method for water-guided laser processing of alumina ceramic slices according to claim 1, characterized in that, In step 5, the planned water-guided laser processing path adopts a spiral cutting processing path.

5. The process method for water-guided laser processing of alumina ceramic slices according to claim 1, characterized in that, In steps 4 and 5, the external guide groove (110) and the outer ring guide groove (120) are formed by coupling the laser beam and the water beam to form the water jet processing of the water guide laser processing. Furthermore, during the cutting process of the area to be processed (101), the depth of the outer ring guide groove (120) is dynamically adjusted by using the water jet to increase its depth dimension.

6. The process method for water-guided laser processing of alumina ceramic slices according to claim 1, characterized in that, During the cutting process of the area to be processed (101), the white alumina product generated during the processing is guided in real time along the outer ring guide groove (120) and the outer ring guide groove (120) to be cleaned from the area to be processed (101).

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