A laser cutting system for halogen-free insulation cladding and method thereof
By combining laser shaping, transmission, and cutting mechanisms, the problems of mushroom head and melting during the cutting of halogen-free insulating materials are solved, achieving a highly efficient and residue-free cutting effect.
Patent Information
- Application Number
- CN202411878954.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-19
- Publication Date
- 2025-11-04
- Estimated Expiration
- 2044-12-19
AI Technical Summary
When conventional laser equipment processes halogen-free insulating material insulation layers, the poor heat resistance of halogen-free insulating materials can easily cause mushroom-shaped defects, and the material can melt into the interior and surface of multi-core wires, leading to problems with subsequent soldering.
The laser shaping mechanism adjusts the shape and peak power of the laser spot, which is then switched and transmitted to the upper and lower laser optical paths via an intermediate transmission mechanism. Combined with a horizontal moving mechanism, multiple cyclic cuttings are performed, and the focus of the upper and lower focusing heads is adjusted to ensure the cutting of the halogen-free insulation cladding and avoid mushroom head and material melting.
It achieves efficient cutting of halogen-free insulation sheath, avoids mushroom head and material melting into the wire core, improves the quality and roundness of the light spot, makes the energy distribution more uniform and concentrated, and has a fine cut and a small heat-affected zone.
Smart Images

Figure CN119566567B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of laser processing, in particular to a laser cutting system for halogen-free insulation cladding and a method thereof. BACKGROUND
[0002] Generally, low-smoke halogen-free wire is made of thermoplastic and thermosetting materials, such as high-density polyethylene (HDPE) and ethylene-vinyl acetate copolymer (EVA). Such materials do not produce toxic gases when burning and have low smoke emission, but they are poor in heat resistance and rely on the addition of magnesium hydroxide and other flame retardants to improve their flame retardant ability. With the increasing environmental awareness, low-smoke halogen-free materials have gradually become the primary alternative to insulation materials. Conventional laser equipment is prone to form mushroom heads when processing halogen-free insulation material insulation layer products, and the halogen-free material will melt into the interior and surface of the multi-core wire core, resulting in problems such as inability to tin later.
[0003] Therefore, there is an urgent need to propose a new solution to solve the above problems. SUMMARY
[0004] The present application provides a laser cutting system for halogen-free insulation cladding and a method thereof, to solve the problem that conventional laser equipment is prone to form mushroom heads when processing halogen-free insulation material insulation layer products, and the halogen-free material will melt into the interior and surface of the multi-core wire core, resulting in problems such as inability to tin later.
[0005] The present application provides a laser cutting system for halogen-free insulation cladding, comprising a laser shaping mechanism, an intermediate transmission mechanism, a laser cutting mechanism, and a horizontal moving mechanism.
[0006] The laser shaping mechanism is used to adjust the shape and peak power of the light spot emitted by the water-cooled laser;
[0007] The intermediate transmission mechanism is used to switch and transmit the circular light spot emitted by the laser shaping mechanism to the upper laser light path part or the lower laser light path part;
[0008] The laser cutting mechanism comprises an upper laser light path part and a lower laser light path part arranged oppositely;
[0009] The horizontal moving mechanism is loaded with a plurality of wires, and the wires are moved horizontally to cooperate with the upper laser light path part and the lower laser light path part, and the light switched out by the upper and lower parts is used for annular cutting of the wires.
[0010] Further, the laser shaping mechanism comprises a first expansion mirror, a curved shaping lens group, and a grating lens, which are coaxially arranged;
[0011] The first beam expander is used for amplifying and collimating the light spot and reducing the central energy density of the light spot;
[0012] The curved surface shaping lens group is used for shaping the light spot into a circular shape and outputting a light spot with uniformly distributed energy.
[0013] The grating lens reduces the light spot and converts the wave-shaped distributed energy into uniformly distributed energy output.
[0014] Further, the curved surface shaping lens group comprises a first transverse curved surface shaping lens, a second transverse curved surface shaping lens, a first vertical curved surface shaping lens and a second vertical curved surface shaping lens, the first and second transverse curved surface shaping lenses are convex lenses, and the first and second vertical curved surface shaping lenses are concave lenses.
[0015] The first and second transverse curved surface shaping lenses are respectively used for stretching the transverse negative and positive light spots by 1.5-3.0 times, so that the central energy density is further dispersed to the transverse direction.
[0016] The first and second vertical curved surface shaping lenses are respectively used for stretching the vertical negative and positive light spots by 1.5-3.0 times, so that the central energy density is further dispersed to the vertical direction.
[0017] Further, the laser shaping mechanism further comprises a first reflector and a second reflector, the laser beam emitted by the water-cooled laser passes through the first reflector and the second reflector, the conveying direction is changed by 180°, and then the laser beam is conveyed to the first beam expander.
[0018] Further, the intermediate conveying mechanism comprises a second beam expander, a third reflector, a fourth reflector and a switching motor reflector, the second beam expander is used for amplifying and collimating the light spot, the third and fourth reflectors change the conveying direction of the laser beam transmitted by the second beam expander by 180°, the switching motor reflector is arranged on a switching motor, the switching motor reflector is controlled by the extension and retraction of the switching motor, so that the laser beam is transmitted to the upper laser light path part and the lower laser light path part.
[0019] Further, the upper laser light path part comprises a fifth reflector, a sixth reflector, a seventh reflector, an upper light path focusing mirror, an upper light path protection mirror and an upper focusing head, the laser beam is output vertically downward after passing through the fifth reflector, the sixth reflector and the seventh reflector, and the lower laser light path part comprises an eighth reflector, a ninth reflector, a lower light path focusing mirror, a lower light path protection mirror and a lower focusing head, the laser beam is output vertically upward after passing through the eighth reflector and the ninth reflector.
[0020] Further, the horizontal moving mechanism comprises an X-axis moving platform, a Y-axis moving platform is slidably connected to the X-axis moving platform, a carrier platform for placing wires with different diameters is fixed to the Y-axis moving platform, the X-axis moving platform is fixed to a first fixed plate, the upper focusing head and the lower focusing head are fixed to a second fixed plate, the first fixed plate is horizontally fixed to the rack, the second fixed plate is vertically fixed to the rack, and the first fixed plate and the second fixed plate are arranged perpendicularly to each other.
[0021] The application also provides a laser cutting method for halogen-free insulation materials, comprising the following steps:
[0022] S1, a plurality of wires to be stripped are arranged side by side on the carrier platform, the wires are fixed by the cover plate on the carrier platform, and the insulation layer covering of the wires to be stripped is exposed;
[0023] S2, parameters of the laser stripping device are set, the upper laser head is adjusted to ensure that the focal point is at the center position of the upper half of the wire, and the lower laser head is adjusted to ensure that the focal point is at the center position of the lower half of the wire;
[0024] S3, the Y-axis moving platform is set to move along the Y-axis direction for multiple cycles, and the laser stripping device parameters for each movement are set, so that the cutting position of the insulation layer covering to be stripped is at the focal points of the upper and lower laser heads.
[0025] Further, the Y-axis moving platform (41) is set to move along the Y-axis direction for at least three cycles, the laser stripping device parameters include the movement speed of the Y-axis moving platform, the power of the laser stripping device, the average power of the laser stripping device, and the working frequency of the laser stripping device, the values of each of the laser stripping device parameters remain unchanged during a single cycle, the movement speed of the Y-axis moving platform, the power of the laser stripping device, and the average power of the laser stripping device decrease in turn as the number of cycles increases, the first and last cycle correspond to the same value of the first laser stripping device working frequency, the cycle in the middle corresponds to the same value of the second laser stripping device working frequency, and the value of the first laser stripping device working frequency is greater than the value of the second laser stripping device working frequency.
[0026] Further, the Y-axis moving platform (41) is set to move along the Y-axis direction for three cycles, which includes six moving paths, and the six moving paths are as follows:
[0027] The first segment of the moving path is set to upper light emission through the switching motor mirror, the Y-axis moving platform moves in the positive direction of the Y-axis by a set distance, the moving speed of the Y-axis moving platform is set to 180-220mm / s, the power of the laser wire stripping device is set to 30% of the rated power, the average power of the laser wire stripping device is 14-16W, and the working frequency of the laser wire stripping device is 4KHz.
[0028] The second segment of the moving path is set to lower light emission through the switching motor mirror, the Y-axis moving platform moves in the negative direction of the Y-axis by the same distance as the first segment of the moving path, the moving speed of the Y-axis moving platform is set to 180-220mm / s, the power of the laser wire stripping device is set to 30% of the rated power, the average power of the laser wire stripping device is 14-16W, and the working frequency of the laser wire stripping device is 4KHz.
[0029] The third segment of the moving path is set to upper light emission through the switching motor mirror, the Y-axis moving platform moves in the positive direction of the Y-axis by the same distance as the first segment of the moving path, the moving speed of the Y-axis moving platform is set to 80-120mm / s, the power of the laser wire stripping device is set to 15% of the rated power, the average power of the laser wire stripping device is 7-9W, and the working frequency of the laser wire stripping device is 2KHz.
[0030] The fourth segment of the moving path is set to lower light emission through the switching motor mirror, the Y-axis moving platform moves in the negative direction of the Y-axis by the same distance as the first segment of the moving path, the moving speed of the Y-axis moving platform is set to 80-120mm / s, the power of the laser wire stripping device is set to 15% of the rated power, the average power of the laser wire stripping device is 7-9W, and the working frequency of the laser wire stripping device is 2KHz.
[0031] The fifth segment of the moving path is set to upper light emission through the switching motor mirror, the Y-axis moving platform moves in the positive direction of the Y-axis by the same distance as the first segment of the moving path, the moving speed of the Y-axis moving platform is set to 30-70mm / s, the power of the laser wire stripping device is set to 5% of the rated power, the average power of the laser wire stripping device is 2.5-3.5W, and the working frequency of the laser wire stripping device is 4KHz.
[0032] The sixth segment of the moving path is set to lower light emission through the switching motor mirror, the Y-axis moving platform moves in the negative direction of the Y-axis by the same distance as the first segment of the moving path, the moving speed of the Y-axis moving platform is set to 30-70mm / s, the power of the laser wire stripping device is set to 5% of the rated power, the average power of the laser wire stripping device is 2.5-3.5W, and the working frequency of the laser wire stripping device is 4KHz.
[0033] Compared with the prior art, the present application has the following advantages:
[0034] 1. This invention uses an external optical path shaping mechanism to adjust the laser peak value, improve the quality and roundness of the laser spot, and then transmits it to the laser cutting mechanism through an intermediate transmission mechanism. The laser cutting mechanism then uses two paths to switch the output light, and works in conjunction with a horizontal moving mechanism to perform multiple cyclic cuttings. At the same time, the focus of the upper and lower focusing heads is adjusted in advance to ensure that the halogen-free insulation layer of the wire is always at the focus, thereby completing the cutting of the halogen-free insulation layer, while ensuring that there is no mushroom head or material melting into the core layer.
[0035] 2. This invention sets up two sets of curved shaping lenses in the horizontal and vertical directions, and stretches the laser beams in the positive and negative directions in the horizontal and vertical directions respectively. This makes the resulting laser beams the same size and makes the final energy distribution more uniform and concentrated, resulting in a higher beam roundness.
[0036] 3. This invention adjusts the phase and amplitude of the light wave through a shaping system, thereby adjusting the shape and peak power of the light spot and improving the beam quality. It doubles the peak power of a 9300 laser with an average power between 100-120W, and creates a circular laser with an average power between 40-50W. The resulting flat-field energy distribution with a diameter of 4.8-5.2mm and a roundness greater than 99% improves the roundness of the light spot by 20%, resulting in a more concentrated energy distribution. This leads to high energy efficiency, low power consumption, finer kerf, and a smaller heat-affected zone (heated zone width less than 0.02mm). The edge of the insulating layer is cut before heating begins, increasing the laser peak power while requiring less energy to achieve the same vaporization effect.
[0037] 4. The laser cutting method of the present invention involves at least three cycles of cutting, using alternating upper and lower lasers for cutting. The first cycle uses a relatively high power and speed to quickly melt and vaporize the surface layer of the material to form a very small cut with a certain slope. The second cycle uses an appropriate speed and power to remove the sloped material without increasing the cut width. The third cycle uses a very low power and speed to remove the remaining material on the wire core, ensuring that the wire core is clean and free of residue. Attached Figure Description
[0038] Figure 1 This is a schematic diagram of the laser shaping mechanism of the present invention;
[0039] Figure 2 This is an image of the light spot after passing through each lens in the laser shaping mechanism of the present invention;
[0040] Figure 3 This is a schematic diagram of the overall structure of the laser cutting system for halogen-free insulating cladding according to the present invention;
[0041] Figure 4The internal structure diagram of the laser cutting system for the halogen-free insulation cladding layer of the application;
[0042] Figure 5 The optical path schematic diagram of the laser cutting system for the halogen-free insulation cladding layer of the application;
[0043] Figure 6 The structural schematic diagram of the wire rod of the application;
[0044] Figure 7 The layout diagram of the wire rod of the application;
[0045] Figure 8 The processing schematic diagram of the six-stage procedure of the application;
[0046] Figure 9 The processing schematic diagram of the wire rod by the upper and lower laser heads of the application;
[0047] The drawing mark: 1, laser shaping mechanism; 11, first beam expander; 12, curved surface shaping lens group; 121, first transverse curved surface shaping lens; 122, second transverse curved surface shaping lens; 123, first vertical curved surface shaping lens; 124, second vertical curved surface shaping lens; 13, grating lens; 14, water-cooled laser; 15, first reflector; 16, second reflector; 2, intermediate transmission mechanism; 21, second beam expander; 22, third reflector; 23, fourth reflector; 24, switching motor reflector; 3, laser cutting mechanism; 31, upper laser light path part; 311, fifth reflector; 312, sixth reflector; 313, seventh reflector; 314, upper light path focusing mirror; 315, upper light path protection mirror; 316, upper focusing head; 32, lower laser light path part; 321, eighth reflector; 322, ninth reflector; 323, lower light path focusing mirror; 324, lower light path protection mirror; 325, lower focusing head; 4, horizontal moving mechanism; 41, Y-axis moving platform; 42, X-axis moving platform; 43, carrier platform; 5, wire rod; 51, central line core layer; 52, insulation layer inner coating; 53, metal shielding layer; 54, insulation layer outer coating; 6, rack; 61, first fixed plate; 62, second fixed plate; 7, wire arranging base. DETAILED DESCRIPTION
[0048] In order to further understand the content, characteristics and effects of the application, the following examples are given, and the attached drawings are combined Figures 1-9 The detailed description is as follows.
[0049] As Figure 3 and 4 shown, the embodiment provides a laser cutting system for halogen-free insulation cladding layer, which comprises a laser shaping mechanism 1, an intermediate transmission mechanism 2, a laser cutting mechanism 3 and a horizontal moving mechanism 4;
[0050] The laser shaping mechanism 1 is used for adjusting the shape and peak power of the light spot emitted by the water-cooled laser 14.
[0051] The intermediate transmission mechanism 2 is used for switching and transmitting the circular light spot emitted by the laser shaping mechanism 1 to the upper laser light path part 31 or the lower laser light path part 32.
[0052] The laser cutting mechanism 3 comprises the upper laser light path part 31 and the lower laser light path part 32 arranged oppositely.
[0053] The horizontal moving mechanism 4 is loaded with a plurality of wires 5, and the wires 5 are moved horizontally to cooperate with the upper laser light path part 31 and the lower laser light path part 32, and the light switched out by the upper and lower two paths is used for circular cutting of the wires 5.
[0054] The present application adjusts the peak of the laser by the external light path shaping of the laser shaping mechanism, improves the quality and roundness of the light spot, transmits the light spot to the laser cutting mechanism through the intermediate transmission mechanism, then the laser cutting mechanism switches out the light by the upper and lower two paths, simultaneously cooperates with the horizontal moving mechanism to perform multiple circular cutting, and adjusts the focal point of the upper and lower focusing heads in advance to ensure that the halogen-free insulation cladding of the wire is always at the focal point, so as to complete the cutting of the halogen-free insulation cladding and ensure that there is no mushroom head and material melting into the center core layer.
[0055] In the embodiment, as shown in Figure 1 and 2 The laser shaping mechanism 1 comprises a first expansion mirror 11, a curved surface shaping lens group 12, a grating lens 13 and a water-cooled laser 14, wherein the first expansion mirror 11, the curved surface shaping lens group 12 and the grating lens 13 are coaxially arranged. The first expansion mirror 11 is a three times expansion mirror composed of two concave-convex mirrors, has a 3 times collimation expansion, and is made of zinc selenide, with an incident diameter of 12 mm, a center thickness of 3 mm, an outgoing mirror diameter of 18 mm and a center thickness of 3 mm. The grating lens 13 is a double-sided 9300 nanometer wavelength anti-reflection film, a double-sided grating mirror with a 9300 nanometer wavelength anti-reflection film, made of zinc selenide, with a diameter of 20 mm and a thickness of 5 mm.
[0056] The first expansion mirror 11 is used for amplifying and collimating the output of the light spot, while reducing the center energy density of the light spot; the curved surface shaping lens group 12 is used for shaping the light spot into a circular shape and outputting the light spot with uniform distributed energy; and the grating lens 13 is used for reducing the light spot and converting the wave-shaped distributed energy into uniformly distributed energy output.
[0057] In the embodiment, as shown in Figure 1 and 2As shown, the curved surface shaping lens group 12 includes a first transverse curved surface shaping lens 121, a second transverse curved surface shaping lens 122, a first vertical curved surface shaping lens 123 and a second vertical curved surface shaping lens 124 arranged in sequence, the positions of which can be exchanged with each other, wherein the first transverse curved surface shaping lens 121 and the second transverse curved surface shaping lens 122 are convex lenses, and the first vertical curved surface shaping lens 123 and the second vertical curved surface shaping lens 124 are concave lenses. When passing through the first transverse curved surface shaping lens 121, the height of the light spot in the longitudinal direction is unchanged, and the left and right halves are stretched in the transverse negative direction, wherein the transverse and vertical directions are the projection planes from the direction of laser travel, and the transverse and vertical directions correspond to the X-axis and Y-axis. When passing through the second transverse curved surface shaping lens 122, the left and right halves are stretched in the transverse positive direction. By adjusting the distance between the lenses, the length of the final stretching is adjusted. The principle of the vertical curved surface shaping lens is similar, and will not be described here. The two transverse curved surface shaping lenses are the same, made of zinc selenide, shaped as a square curved mirror, 25mm in length, 15mm in width, 7mm in central height, and a curved surface shaping lens with a special X-direction curvature, and double-side 9300nm wavelength anti-reflection film. The two vertical curved surface shaping lenses are the same, made of zinc selenide, shaped as a square curved mirror, 25mm in length, 15mm in width, 7mm in central height, and a curved surface shaping lens with a special Y-direction curvature.
[0058] The first transverse curved surface shaping lens 121 and the second transverse curved surface shaping lens 122 are respectively used to stretch the transverse negative and positive light spots by 1.7 times, or other values between 1.5 and 3.0 times, so that the central energy density is further dispersed to the transverse direction.
[0059] The first vertical curved surface shaping lens 123 and the second vertical curved surface shaping lens 124 are respectively used to stretch the vertical negative and positive light spots by 1.7 times, or other values between 1.5 and 3.0 times, so that the central energy density is further dispersed to the vertical direction.
[0060] The present application stretches the laser light spot in the positive and negative directions along the transverse and vertical directions by arranging two groups of transverse and vertical curved surface shaping lenses, which can make the output laser light spot size the same, and the final energy distribution more uniform and more concentrated, and the light spot roundness higher.
[0061] The laser shaping mechanism 1 is installed and debugged, the laser is fixed on the base plate, the first mirror 15, the second mirror 16, the first beam expander 11, two pieces of transverse curved surface shaping lens, two pieces of vertical curved surface shaping lens, the grating lens 13 are installed, the laser spot is reflected to the center of the second mirror 16 through the first mirror 15, enters the first beam expander 11, and then enters the first transverse curved surface shaping lens 121, then enters the second transverse curved surface shaping lens 122, then enters the first vertical curved surface shaping lens 123, then enters the second vertical curved surface shaping lens 124, and then enters the grating lens 13 and is output, the laser spot is irradiated on the center of the first mirror 15 by adjusting the installation position of the laser, the laser spot is input at an angle of 45 degrees, the laser spot output by the laser is an ellipse with a diameter of about 1.5-2 mm, the transverse and vertical angles of the first mirror 15 and the second mirror 16 are adjusted to ensure that the laser spot output from the second mirror 16 passes through the center of the first beam expander 11, the laser spot is input from the center of the first beam expander 11, the above-mentioned mirrors are coaxial and output from the center, the two pieces of transverse curved surface shaping lens, the two pieces of vertical curved surface shaping lens and the grating lens 13 are installed at the coaxial position through the mechanical part, the first mirror 15 is installed 30 mm away from the laser spot outlet, the second mirror 16 is installed 70 mm away from the first mirror 15, the first beam expander 11 is installed 50 mm to the right of the second mirror 16, the shaping system of the laser is adjusted through calculation, the distance between the first transverse curved surface shaping lens 121 and the first beam expander 11 is 150 mm, the distance between the first transverse curved surface shaping lens and the second transverse curved surface shaping lens is 75 mm, the distance between the first vertical curved surface shaping lens 121 and the second transverse curved surface shaping lens 122 is 157 mm, the distance between the second vertical curved surface shaping lens and the first vertical curved surface shaping lens 123 is 63 mm, the distance between the grating lens 13 and the second vertical curved surface shaping lens 124 is 163 mm, after the laser spot of the first beam expander 121 passes through the beam expander, the spot is enlarged and collimated in the transverse and vertical directions by 3 times, and the central energy density of the spot is changed, the spot output from the beam expander passes through the two pieces of transverse curved surface shaping lens, the transverse spot is enlarged by 2.3 times, the curvature tends to be a circular spot output, the central energy density is further dispersed in the transverse direction, enters the two pieces of vertical curved surface shaping lens, the vertical spot is shaped to be consistent with the size of the transverse spot, the size error is within 0.5%, the spot is circularly output, the central energy density is further dispersed in the vertical direction, and an output spot with a diameter of 11.82 mm is output to the center of the grating lens 13, the grating is adjusted to the grating lens 13, the last spot output is a circular spot with a diameter of 4.7 mm through the two layers of grating of the grating lens 13, the average energy is 43 W, and the energy is uniformly distributed.
[0062] In the embodiment, as Figure 1As shown, the laser shaping mechanism 1 further comprises a first mirror 15 and a second mirror 16. The laser beam emitted by the water-cooled laser 14 is transmitted via the first mirror 15 and the second mirror 16, and the transmission direction is changed by 180°, and then transmitted to the first beam expander 11. The laser parameter of the water-cooled laser 14 is a wavelength of 9300 nanoseconds, which is smaller than the thermal influence area of the thermal effect of the focused CO2 laser with a wavelength of 10600 nanometers. The maximum average power is between 100-120W, the beam quality M2 factor is less than or equal to 1.2, the laser is a continuous laser, the laser is cooled by a laser water cooler to ensure the power stability, the power fluctuation range is less than 3%, the frequency is set to 0.5-100KHz, the laser output spot size is between 1.9-2.3, the beam ellipticity is greater than 80%, and the beam divergence angle is less than 0.6 milliradians. The first mirror 15 and the second mirror 16 can reduce the length of the overall device. The material is single crystal silicon with a diameter of 12.7mm and a thickness of 5mm. The single-side reflection film reflects the laser beam with a wavelength of 9300 nanoseconds. The reflectivity of the reflection film is greater than 99.9%.
[0063] As shown in Figure 4 and 5 The intermediate transmission mechanism 2 comprises a second beam expander 21, a third mirror 22, a fourth mirror 23, and a switching motor mirror 24. The second beam expander 21 is used to amplify and collimate the output of the spot. The third mirror 22 and the fourth mirror 23 change the transmission direction of the laser beam transmitted by the second beam expander 21 by 180°. The switching motor mirror 24 is provided on the switching motor. The base of the switching motor is fixed on the rack 6. The switching motor mirror 24 is controlled by the extension and retraction of the switching motor, so that the laser beam is transmitted into the upper laser light path part 31 and the lower laser light path part 32.
[0064] As shown in Figure 4 and 5 The upper laser light path part 31 comprises a fifth mirror 311, a sixth mirror 312, a seventh mirror 313, an upper light path focusing mirror 314, an upper light path protection mirror 315, and an upper focusing head 316. The laser beam is output vertically downward after passing through the fifth mirror 311, the sixth mirror 312, and the seventh mirror 313. The upper light path focusing mirror 314 focuses the amplified large spot to a very fine spot to cut the wire; the upper light path protection mirror 315 protects the focusing mirror from smoke pollution; the lower laser light path part 32 comprises an eighth mirror 321, a ninth mirror 322, a lower light path focusing mirror 323, a lower light path protection mirror 324, and a lower focusing head 325. The laser beam is output vertically upward after passing through the eighth mirror 321 and the ninth mirror 322. Finally, the laser beams emitted by the upper laser light path part 31 and the lower laser light path part 32 are collinear.
[0065] As shown in Figure 4 and5 As shown, the horizontal moving mechanism 4 comprises an X-axis moving platform 42 and a Y-axis moving platform 41, the X-axis moving platform 42 has a stroke of 300 mm, and the Y-axis moving platform 41 has a stroke of 150 mm. The cutting focal spot of the laser wire stripping device has a diameter less than 0.1 mm and a focal depth less than 0.5 mm. The Y-axis moving platform 41 is fixed with a carrier platform 43 for placing wires 5 with different diameters, and the wire arranging base 7 is arranged on the carrier platform 43. The X-axis moving platform 42 is fixed on a first fixed plate 61, and the upper focusing head 316 and the lower focusing head 325 are fixed on a second fixed plate 62. The first fixed plate 61 is horizontally fixed on the rack 6, and the second fixed plate 62 is vertically fixed on the rack 6. The first fixed plate 61 and the second fixed plate 62 are arranged perpendicularly to each other.
[0066] The insulation layer outer cover 54 and the insulation layer inner cover 52 in the application are made of a mixture of thermoplastic and thermosetting materials, preferably high-density polyethylene (HDPE) and ethylene-vinyl acetate copolymer (EVA). The material has the characteristics of being extremely easy to melt, not easy to volatilize, not generating toxic gas, low smoke emission, and poor heat resistance.
[0067] The embodiment also provides a laser cutting method for halogen-free insulation materials, as shown in the drawing. Figures 4-9 As shown, taking the extremely thin coaxial signal wire of a computer mainboard signal wire as an example, the wire has 8 extremely thin coaxial signal wires 5 with a diameter of 40, which comprises a center wire core layer 51, an insulation layer inner cover 52, a metal shielding layer 53, and an insulation layer outer cover 54. The insulation layer outer cover 54 has a diameter of 0.33 mm and a thickness of 0.04 mm. The metal shielding layer 53 has an outer diameter of 0.25 mm and a thickness of 0.05 mm. The insulation layer inner cover 52 has an outer diameter of 0.15 mm and a thickness of 0.03 mm. The center wire core layer 51 is a circular multi-strand wire with a diameter of 0.09 mm. The method comprises the following steps:
[0068] S1, arranging a plurality of wires 5 to be stripped side by side on the carrier platform 43, wherein the wires 5 are fixed on the wire arranging base 7, the wires 5 are fixed by the cover plate on the carrier platform 43, and the insulation layer outer cover 54 of the wire to be stripped is exposed, and the insulation layer inner cover 52 can also be cut;
[0069] S2, setting the parameters of the laser wire stripping device, adjusting the upper laser head to ensure that the focal point is at the center position of the upper half of the wire 5, and adjusting the lower laser head to ensure that the focal point is at the center position of the lower half of the wire 5;
[0070] S3, through setting Y axis moving platform 41 carries out three cycle movements along Y axis direction, wherein cycle times more 10 times or so are needed for thicker insulation layer, and only 3 times are needed for very thin one in the embodiment, and the laser wire stripping equipment parameters of each movement are adjusted, so that the to-be-cut position of the to-be-stripped insulation layer outer cover 54 is at the focal points of the upper and lower laser heads.
[0071] The application adjusts the phase and amplitude of light waves through a shaping system, adjusts the shape and peak power of the light spot, improves the beam quality, and increases the laser peak power by 2 times for a 9300 laser with an average power of 100-120W, increases the light spot roundness by 20% for a circularly shaped laser with an average power of 40-50W, a light spot diameter of 4.8-5.2mm, and a flat field energy distribution with a circularity of more than 99%, and the light spot energy distribution is more concentrated, the energy is concentrated, the power is low, the cut is fine, the heat affected zone is small, the heat affected zone width is less than 0.02mm, the insulation layer cutting position edge is cut before the temperature starts to rise, the laser peak power is increased, and the energy required to achieve the same vaporization effect is smaller.
[0072] The laser wire stripping equipment parameters include the movement speed of the Y axis moving platform 41, the laser wire stripping equipment power, the laser wire stripping equipment average power, and the laser wire stripping equipment working frequency, the values of the laser wire stripping equipment parameters remain unchanged in the single cycle movement, the laser wire stripping equipment parameters include the movement speed of the Y axis moving platform 41, the laser wire stripping equipment power, and the laser wire stripping equipment average power, which decrease in turn with the increase of the cycle movement times, the first laser wire stripping equipment working frequency corresponding to the first and last cycle movements has the same value, the second laser wire stripping equipment working frequency corresponding to the intermediate cycle movements has the same value, and the value of the first laser wire stripping equipment working frequency is greater than that of the second laser wire stripping equipment working frequency.
[0073] In the embodiment, the above three cycle movements include six movement paths, wherein the first and second movement paths are the first cycle, the third and fourth movement paths are the second cycle, and the fifth and sixth movement paths are the third cycle.
[0074] The first section of the movement path, the mirror 24 is set to the upper light output by switching the motor, the Y-axis moving platform 41 moves in the positive direction of the Y-axis for a set distance, the movement speed of the Y-axis moving platform 41 is set to 200 mm / s, other values between 180-220 mm / s can also be used, the power of the laser wire stripping device is set to 30% of the rated power, the average power of the laser wire stripping device is 15W, other values between 14-16W can also be used, and the working frequency of the laser wire stripping device is 4KHz, wherein the idle movement speed of the Y-axis moving platform 41 and the X-axis moving platform 43 is set to 200 mm / s;
[0075] The second section of the movement path, the mirror 24 is set to the lower light output by switching the motor, the Y-axis moving platform 41 moves in the negative direction of the Y-axis for the same distance as the first section of the movement path, the movement speed of the Y-axis moving platform 41 is set to 180-220 mm / s, the power of the laser wire stripping device is set to 30% of the rated power, the average power of the laser wire stripping device is 14-16W, and the working frequency of the laser wire stripping device is 4KHz, which is the same as the first section of the parameter setting;
[0076] The third section of the movement path, the mirror 24 is set to the upper light output by switching the motor, the Y-axis moving platform 41 moves in the positive direction of the Y-axis for the same distance as the first section of the movement path, the movement speed of the Y-axis moving platform 41 is set to 100 mm / s, other values between 80-120 mm / s can also be used, the power of the laser wire stripping device is set to 15% of the rated power, the average power of the laser wire stripping device is 8W, other values between 7-9 can also be used, and the working frequency of the laser wire stripping device is 2KHz;
[0077] The fourth section of the movement path, the mirror 24 is set to the lower light output by switching the motor, the Y-axis moving platform 41 moves in the negative direction of the Y-axis for the same distance as the first section of the movement path, the movement speed of the Y-axis moving platform 41 is set to 80-120 mm / s, the power of the laser wire stripping device is set to 15% of the rated power, the average power of the laser wire stripping device is 7-9W, and the working frequency of the laser wire stripping device is 2KHz, which is the same as the third section of the parameter setting;
[0078] The fifth section of the movement path, the mirror 24 is set to the upper light output by switching the motor, the Y-axis moving platform 41 moves in the positive direction of the Y-axis for the same distance as the first section of the movement path, the movement speed of the Y-axis moving platform 41 is set to 50 mm / s, other values between 30-70 mm / s can also be used, the power of the laser wire stripping device is set to 5% of the rated power, the average power of the laser wire stripping device is 3W, other values between 2.5-3.5W can also be used, and the working frequency of the laser wire stripping device is 4KHz;
[0079] The sixth segment movement path is set to the lower light output by switching the motor mirror 24, the Y-axis movement platform 41 moves along the Y-axis negative direction at the same distance as the first segment movement path, the movement speed of the Y-axis movement platform 41 is set to 30-70 mm / s, the power of the laser wire stripping device is set to 5% of the rated power, the average power of the laser wire stripping device is 2.5-3.5 W, and the working frequency of the laser wire stripping device is 4 KHz, which is the same as the fifth segment, as shown in Figure 8 As shown, after the six segments of processing, the insulation layer outer covering 54 is completely cut off.
[0080] The laser cutting method of the present application cuts by at least three cycles, and uses up and down laser switching for cutting work, wherein the first cycle uses relatively large power, relatively high speed, and relatively fast melting and vaporization of the material surface layer to form a small incision, the incision has a certain slope, the second cycle removes the slope material by appropriate speed and power without expanding the incision width, and the third cycle uses very small power and speed to remove the remaining material on the core, ensuring that the core is clean and free of residues.
[0081] The above-described application only expresses the implementation of the embodiments of the present application, and cannot be understood as limiting the scope of the patent application, nor does it limit the structure of the embodiments of the present application in any form. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the embodiments of the present application, a number of changes and improvements can be made, which are within the scope of protection of the embodiments of the present application.
Claims
1. A laser cutting system for halogen-free insulation cladding, characterized by: It comprises a laser shaping mechanism (1), an intermediate transmission mechanism (2), a laser cutting mechanism (3) and a horizontal moving mechanism (4); The laser shaping mechanism (1) is used for adjusting the shape and peak power of the light spot emitted by the water-cooled laser (14); the laser shaping mechanism (1) comprises a first beam expander (11), a curved shaping lens group (12) and a grating lens (13), and the first beam expander (11), the curved shaping lens group (12) and the grating lens (13) are coaxially arranged; The first beam expander (11) is used for amplifying and collimating the output of the light spot, while reducing the central energy density of the light spot; The curved shaping lens group (12) is used for shaping the light spot into a circular shape and outputting a light spot with uniformly distributed energy; The grating lens (13) reduces the light spot and converts the wave-shaped distributed energy into uniformly distributed energy output; The curved shaping lens group (12) comprises a first transverse curved shaping lens (121), a second transverse curved shaping lens (122), a first vertical curved shaping lens (123) and a second vertical curved shaping lens (124), the first transverse curved shaping lens (121) and the second transverse curved shaping lens (122) are convex lenses, and the first vertical curved shaping lens (123) and the second vertical curved shaping lens (124) are concave lenses; The intermediate transmission mechanism (2) is used for switching and transmitting the circular light spot emitted by the laser shaping mechanism (1) to the upper laser light path part (31) or the lower laser light path part (32); The intermediate transmission mechanism (2) comprises a second beam expander (21), a third reflector (22), a fourth reflector (23) and a switching motor reflector (24), the switching motor reflector (24) is arranged on the switching motor, the switching motor reflector (24) is controlled by the extension and retraction of the switching motor, so that the laser beam is transmitted into the upper laser light path part (31) and the lower laser light path part (32); The laser cutting mechanism (3) comprises the upper laser light path part (31) and the lower laser light path part (32) arranged oppositely; The horizontal moving mechanism (4) is loaded with a plurality of wires (5), and the horizontal moving mechanism (4) cooperates with the upper laser light path part (31) and the lower laser light path part (32) by moving the wires (5) horizontally, and the light switched by the upper and lower two paths is used for circular cutting of the wires (5).
2. The laser cutting system for halogen-free insulation cladding according to claim 1, wherein: The first transverse curved shaping lens (121) and the second transverse curved shaping lens (122) are respectively used for stretching the transverse negative and positive light spots by 1.5-3.0 times, so that the central energy density is further dispersed to the transverse direction; The first vertical curved shaping lens (123) and the second vertical curved shaping lens (124) are respectively used for stretching the vertical negative and positive light spots by 1.5-3.0 times, so that the central energy density is further dispersed to the vertical direction.
3. A laser cutting system for halogen-free insulation cladding according to claim 1, characterized in that: The laser shaping mechanism (1) further comprises a first mirror (15) and a second mirror (16), the laser beam emitted by the water-cooled laser (14) changes the delivery direction by 180° after passing through the first mirror (15) and the second mirror (16) and is then delivered to the first beam expander (11).
4. A laser cutting system for halogen-free insulation cladding according to any one of claims 1 to 3, characterized in that: The second beam expander (21) is used for amplifying and collimating the light spot, and the third mirror (22) and the fourth mirror (23) change the delivery direction of the laser beam transmitted by the second beam expander (21) by 180°.
5. A laser cutting system for halogen-free insulation cladding according to any one of claims 1 to 3, characterized in that: The upper laser light path part (31) comprises a fifth mirror (311), a sixth mirror (312), a seventh mirror (313), an upper light path focusing mirror (314), an upper light path protection mirror (315) and an upper focusing head (316), and the laser beam is output vertically downward after passing through the fifth mirror (311), the sixth mirror (312) and the seventh mirror (313), and the lower laser light path part (32) comprises an eighth mirror (321), a ninth mirror (322), a lower light path focusing mirror (323), a lower light path protection mirror (324) and a lower focusing head (325), and the laser beam is output vertically upward after passing through the eighth mirror (321) and the ninth mirror (322).
6. A laser cutting system for halogen-free insulation cladding according to claim 5, characterized in that: The horizontal moving mechanism (4) comprises an X-axis moving platform (42), the Y-axis moving platform (41) is slidably connected to the X-axis moving platform (42), the carrier platform (43) for placing wires (5) with different diameters is fixed to the Y-axis moving platform (41), the X-axis moving platform (42) is fixed to the first fixed plate (61), the upper focusing head (316) and the lower focusing head (325) are fixed to the second fixed plate (62), the first fixed plate (61) is horizontally fixed to the rack (6), the second fixed plate (62) is vertically fixed to the rack (6), and the first fixed plate (61) and the second fixed plate (62) are arranged perpendicularly to each other.
7. A laser cutting method for halogen-free insulation material based on the laser cutting system for halogen-free insulation coating according to claim 1, characterized in that, The method comprises the following steps: A plurality of wires (5) to be stripped are arranged side by side on the carrier platform (43), and the wires (5) are fixed by the cover plate on the carrier platform (43), and the insulating layer outer sheath (54) of the wire to be stripped is exposed; The laser stripping device parameters are set, the upper laser head is adjusted to ensure that the focal point is at the center position of the upper half of the wire (5), and the lower laser head is adjusted to ensure that the focal point is at the center position of the lower half of the wire (5); The Y-axis moving platform (41) is set to move along the Y-axis direction for multiple cycles, and the laser stripping device parameters for each movement are set, so that the cutting position of the insulating layer outer sheath (54) to be stripped is at the focal point of the upper and lower laser heads. The laser stripping device parameters are set, the upper laser head is adjusted to ensure that the focal point is at the center position of the upper half of the wire (5), and the lower laser head is adjusted to ensure that the focal point is at the center position of the lower half of the wire (5); The Y-axis moving platform (41) is set to move along the Y-axis direction for multiple cycles, and the laser stripping device parameters for each movement are set, so that the cutting position of the insulating layer outer sheath (54) to be stripped is at the focal point of the upper and lower laser heads.
8. A method for laser cutting of halogen-free insulation material according to claim 7, characterized in that: The laser wire stripping device parameters include the movement speed of the Y-axis moving platform (41), the laser wire stripping device power, the laser wire stripping device average power and the laser wire stripping device working frequency, the values of each of the laser wire stripping device parameters remain unchanged during a single cycle movement, the laser wire stripping device parameters include the movement speed of the Y-axis moving platform (41), the laser wire stripping device power, the laser wire stripping device average power decreases in turn with the increase of the cycle movement times, the first and last cycle movements correspond to the same first laser wire stripping device working frequency, the cycle movement in the middle corresponds to the same second laser wire stripping device working frequency, and the value of the first laser wire stripping device working frequency is greater than that of the second laser wire stripping device working frequency.
9. A method for laser cutting of halogen-free insulation material according to claim 8, characterized in that: By setting the Y-axis moving platform (41) to move along the Y-axis direction for three cycle movements, the three cycle movements include six movement paths, which are in turn: The first movement path is set by the switching motor mirror (24) to be upper light output, the Y-axis moving platform (41) moves in the positive direction of the Y-axis by a set distance, the movement speed of the Y-axis moving platform (41) is set to 180-220 mm / s, the laser wire stripping device power is set to 30% of the rated power, the laser wire stripping device average power is 14-16 W, and the laser wire stripping device working frequency is 4 KHz; The second movement path is set by the switching motor mirror (24) to be lower light output, the Y-axis moving platform (41) moves in the negative direction of the Y-axis by the same distance as the first movement path, the movement speed of the Y-axis moving platform (41) is set to 180-220 mm / s, the laser wire stripping device power is set to 30% of the rated power, the laser wire stripping device average power is 14-16 W, and the laser wire stripping device working frequency is 4 KHz; The third movement path is set by the switching motor mirror (24) to be upper light output, the Y-axis moving platform (41) moves in the positive direction of the Y-axis by the same distance as the first movement path, the movement speed of the Y-axis moving platform (41) is set to 80-120 mm / s, the laser wire stripping device power is set to 15% of the rated power, the laser wire stripping device average power is 7-9 W, and the laser wire stripping device working frequency is 2 KHz; The fourth movement path is set by the switching motor mirror (24) to be lower light output, the Y-axis moving platform (41) moves in the negative direction of the Y-axis by the same distance as the first movement path, the movement speed of the Y-axis moving platform (41) is set to 80-120 mm / s, the laser wire stripping device power is set to 15% of the rated power, the laser wire stripping device average power is 7-9 W, and the laser wire stripping device working frequency is 2 KHz; The fifth segment of the movement path is set to upper light emission by switching the motor mirror (24), the Y-axis moving platform (41) moves in the positive direction of the Y-axis by the same distance as the first segment of the movement path, the movement speed of the Y-axis moving platform (41) is set to 30-70 mm / s, the power of the laser wire stripping device is set to 5% of the rated power, the average power of the laser wire stripping device is 2.5-3.5 W, and the working frequency of the laser wire stripping device is 4 KHz. The sixth segment of the movement path is set to lower light emission by switching the motor mirror (24), the Y-axis moving platform (41) moves in the negative direction of the Y-axis by the same distance as the first segment of the movement path, the movement speed of the Y-axis moving platform (41) is set to 30-70 mm / s, the power of the laser wire stripping device is set to 5% of the rated power, the average power of the laser wire stripping device is 2.5-3.5 W, and the working frequency of the laser wire stripping device is 4 KHz.
Citation Information
Patent Citations
Hybrid wavelength laser wire-stripping method and wire-stripping apparatus of wire sheaths
CN105186391A
Method for obtaining high-repetition-frequency large-energy tunable laser
CN105390919A