Source bottle constant temperature device for atomic layer deposition

Abstract

The invention discloses a source bottle constant temperature device for atomic layer deposition, relates to the technical field of thin film deposition, and aims to solve the problem that the time for constant temperature adjustment of a cooling-water machine to reach stable temperature is relatively long. The heat conduction cylinder is provided with a containing cavity used for containing a source bottle and heat conduction liquid; the semiconductor chilling plate is provided with a first face and a second face which are opposite. The first face covers the outer wall of the heat conduction cylinder. The heat dissipation part covers the second surface and is used for dissipating heat of the refrigeration sheet; the temperature sensing component is attached to the heat conduction cylinder and used for detecting temperature information of the heat conduction cylinder. The semiconductor chilling plate, the heat dissipation part and the temperature sensing part are all electrically connected with the control circuit, and the control circuit is used for controlling temperature adjustment of the semiconductor chilling plate according to the temperature information. The heat conduction liquid is injected into the containing cavity and covers the source bottle, the control circuit controls the direction of current introduced into the refrigeration sheet so as to change the cold and hot state of the refrigeration sheet, the first face of the refrigeration sheet adjusts the temperature of the heat conduction cylinder, the second face dissipates heat in time through the heat dissipation component, and temperature adjustment of the source bottle is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of thin film deposition, and in particular to a source bottle constant temperature device for atomic layer deposition. Background Art

[0002] Atomic layer deposition (ALD) is an advanced thin film deposition technology that is widely used in semiconductor, optics, energy and other fields. In the ALD process, the saturated vapor pressure of the precursor directly affects the growth rate and quality of the film. Therefore, the source bottle storing the precursor needs to be kept at a constant temperature to ensure that the precursor is transported to the ALD reaction chamber at an appropriate rate to achieve uniform and high-quality thin film deposition.

[0003] At present, the existing source bottle constant temperature means usually adopts an aluminum sleeve combined with a chiller, and uses the water cooling cycle of the chiller to take away the temperature of the source bottle, so as to achieve a stable temperature. However, this method has the problem that when the temperature changes, the chiller needs a long time to respond and stabilize the temperature of the source bottle, and when it is necessary to maintain a lower temperature, it will consume a lot of electricity and the cooling effect is poor. Summary of the invention

[0004] The object of the present invention is to provide a source bottle constant temperature device for atomic layer deposition, which is used to ensure rapid and accurate regulation of the source bottle temperature.

[0005] In order to achieve the above object, the present invention provides the following technical solution: a source bottle constant temperature device for atomic layer deposition, comprising:

[0006] The heat-conducting cylinder has a receiving cavity, and the receiving cavity is used to place the source bottle and the heat-conducting liquid;

[0007] The semiconductor cooling sheet has a first surface and a second surface opposite to each other, and the first surface covers the outer wall of the heat-conducting tube;

[0008] A heat dissipation component, covering the second surface of the semiconductor refrigeration sheet, and used for dissipating heat from the semiconductor refrigeration sheet;

[0009] The temperature sensing component is mounted on the heat conducting tube and is used to detect the temperature information of the heat conducting tube;

[0010] The control circuit, the semiconductor refrigeration piece, the heat dissipation component and the temperature sensing component are all electrically connected to the control circuit, and the control circuit is used to control the temperature adjustment of the semiconductor refrigeration piece according to the temperature information.

[0011] Optionally, in the above-mentioned source bottle constant temperature device for atomic layer deposition, the control circuit includes:

[0012] A power source electrically connected to the semiconductor cooling sheet;

[0013] The controller is respectively connected to the semiconductor refrigeration plate, the heat dissipation component, the temperature sensing component and the power supply control. The controller is used to control the power supply to apply forward or reverse current to the semiconductor refrigeration plate according to the temperature information, and control the start and stop of the heat dissipation component to achieve heat dissipation of the semiconductor refrigeration plate.

[0014] Optionally, in the above-mentioned source bottle constant temperature device for atomic layer deposition, the connection between the second surface of the semiconductor refrigeration plate and the heat dissipation component has a grid structure.

[0015] Optionally, in the above-mentioned source bottle constant temperature device for atomic layer deposition, the heat dissipation component includes:

[0016] a fan, electrically connected to the control circuit;

[0017] The heat sink is wrapped around the outside of the fan, and the heat conducted by the heat sink is cooled by the fan;

[0018] The heat dissipation pipe has two ends respectively connected to the second surface of the semiconductor refrigeration plate and the heat dissipation plate, and the heat dissipation pipe is used to transfer the heat of the semiconductor refrigeration plate to the heat dissipation plate.

[0019] Optionally, in the above-mentioned source bottle constant temperature device for atomic layer deposition, there is a thermal conductive coating between the heat sink and the heat pipe.

[0020] Optionally, in the above-mentioned source bottle constant temperature device for atomic layer deposition, the thermal conductive coating includes a silicone grease coating.

[0021] Optionally, in the above-mentioned source bottle constant temperature device for atomic layer deposition, a plurality of heat sinks are provided, and the plurality of heat sinks are arranged at intervals along the normal direction of the heat sink, each heat sink is connected to a heat pipe, and the blowing direction of the fan is perpendicular to the normal direction of the heat sink.

[0022] Optionally, in the above-mentioned source bottle constant temperature device for atomic layer deposition, the temperature sensing component includes a thermistor or a thermocouple.

[0023] Optionally, in the above-mentioned source bottle constant temperature device for atomic layer deposition, the material of the heat conductive tube includes metal or semiconductor.

[0024] Optionally, the above-mentioned source bottle constant temperature device for atomic layer deposition further includes: a heat-insulating component, which is coated on the outer wall of the heat-conducting cylinder.

[0025] Compared with the prior art, when the above technical solution is adopted, the operator first places the source bottle into the accommodating cavity, injects heat-conducting liquid into the accommodating cavity and makes the heat-conducting liquid completely cover the source bottle, and then starts the control circuit so that the control circuit controls the direction of the current passed into the semiconductor refrigeration plate to achieve the change of the hot and cold state of the semiconductor refrigeration plate. Due to the influence of the Peltier effect, when the temperature sensing component detects that the temperature information of the heat-conducting tube is high, the heat-conducting tube needs to be cooled. The control circuit controls the forward current passed into the semiconductor refrigeration plate according to the detected temperature information, so that the temperature of the first surface of the semiconductor refrigeration plate is reduced and transferred to the heat-conducting tube, and the heat of the heat-conducting tube is continuously absorbed. In this process, the second surface of the semiconductor refrigeration plate conducts the heat and the heat is dissipated by the heat dissipation component; when the temperature sensing component detects that the temperature information of the heat-conducting tube is low, the heat-conducting tube needs to be cooled. The heat tube is heated up, and the control circuit controls the reverse current passed into the semiconductor refrigeration film according to the detected temperature information, so that the temperature of the first surface of the semiconductor refrigeration film rises and is transferred to the heat-conducting tube, and the heat is continuously released to the heat-conducting tube. In this process, the second surface of the semiconductor refrigeration film conducts away the excess heat and the heat dissipation component dissipates it, until the temperature information of the heat-conducting tube detected by the temperature-sensing component is stabilized to the target value. Compared with the traditional way of controlling the working environment temperature of the source bottle by water circulation in the traditional chiller, the present application only needs to monitor the temperature information of the heat-conducting tube in real time through the temperature-sensing component in the control circuit, and timely control the direction of the current passed into the semiconductor refrigeration film through the detected temperature information, so as to realize accurate regulation of the heating and cooling of the heat-conducting tube, so as to ensure the accurate and rapid adjustment of the temperature of the source bottle in the heat-conducting tube, facilitate operation, and improve the flexibility and controllability of the constant temperature device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0027] Figure 1 This is a schematic diagram of the overall structure of a source bottle constant temperature device for atomic layer deposition provided in an embodiment of the present invention;

[0028] Figure 2 for Figure 1 A top view of

[0029] Figure 3 for Figure 2 Middle AA section view;

[0030] Figure 4 for Figure 1 Right view of .

[0031] Reference numerals:

[0032] 1-heat-conducting tube; 11-accommodating cavity; 2-semiconductor refrigeration plate; 3-heat dissipation component; 31-fan; 32-heat dissipation fin; 33-heat dissipation pipe. DETAILED DESCRIPTION

[0033] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0034] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. The meaning of "several" is one or more, unless otherwise clearly and specifically defined.

[0036] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "front", "back", "left", "right", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] like Figure 1-Figure 4 As shown, an embodiment of the present invention provides a source bottle constant temperature device for atomic layer deposition, hereinafter referred to as a constant temperature device, which includes: a heat conductive tube 1, a semiconductor cooling plate 2, a heat dissipation component 3, a temperature sensing component and a control circuit.

[0039] Among them, the heat-conducting tube 1 has a accommodating cavity 11, which is used to place the source bottle and the heat-conducting liquid; the semiconductor refrigeration sheet 2 has a first surface and a second surface relative to each other, and the first surface covers the outer wall of the heat-conducting tube 1; the heat dissipation component 3 covers the second surface of the semiconductor refrigeration sheet 2, and the heat dissipation component 3 is used to dissipate heat from the semiconductor refrigeration sheet 2; the temperature sensing component is mounted on the heat-conducting tube 1, and the temperature sensing component is used to detect the temperature information of the heat-conducting tube 1; the semiconductor refrigeration sheet 2, the heat dissipation component 3 and the temperature sensing component are all electrically connected to the control circuit, and the control circuit is used to control the temperature adjustment of the semiconductor refrigeration sheet 2 according to the temperature information.

[0040] When implementing it, Figure 1 As shown, the operator first puts the source bottle into the accommodating chamber 11, injects heat-conducting liquid into the accommodating chamber 11 and makes the heat-conducting liquid completely cover the source bottle, and then starts the control circuit, so that the control circuit controls the direction of the current passed into the semiconductor refrigeration sheet 2 to achieve the change of the hot and cold state of the semiconductor refrigeration sheet 2. Due to the influence of the Peltier effect, when the temperature sensing component detects that the temperature information of the heat-conducting tube 1 is high, the heat-conducting tube 1 needs to be cooled. The control circuit controls the forward current passed into the semiconductor refrigeration sheet 2 according to the detected temperature information, so that the temperature of the first surface of the semiconductor refrigeration sheet 2 is reduced and transferred to the heat-conducting tube 1, and the heat of the heat-conducting tube 1 is continuously absorbed. In this process, the second surface of the semiconductor refrigeration sheet 2 conducts the heat and the heat dissipation component 3 dissipates it; when the temperature sensing component detects that the temperature information of the heat-conducting tube 1 is low, the heat-conducting tube 1 needs to be raised. Temperature, the control circuit controls the reverse current passed into the semiconductor refrigeration film 2 according to the detected temperature information, so that the temperature of the first surface of the semiconductor refrigeration film 2 increases and is transferred to the heat-conducting tube 1, and continuously releases heat to the heat-conducting tube 1. In this process, the second surface of the semiconductor refrigeration film 2 conducts away the excess heat and is dissipated by the heat dissipation component 3, until the temperature information of the heat-conducting tube 1 detected by the temperature-sensing component is stabilized to the target value. Compared with the traditional way of controlling the working environment temperature of the source bottle by water circulation in the chiller, the present application only needs to monitor the temperature information of the heat-conducting tube 1 in real time through the temperature-sensing component in the control circuit, and timely control the direction of the current passed into the semiconductor refrigeration film 2 through the detected temperature information, so as to realize accurate regulation of the heating and cooling of the heat-conducting tube 1, so as to ensure the accurate and rapid adjustment of the temperature of the source bottle in the heat-conducting tube 1, facilitate operation, and improve the flexibility and controllability of the constant temperature device.

[0041] Specifically, in this embodiment, the control circuit includes: a power supply and a controller, the power supply is electrically connected to the semiconductor refrigeration chip 2; the controller is respectively connected to the semiconductor refrigeration chip 2, the heat dissipation component 3, the temperature sensing component and the power supply control, and the controller is used to control the power supply to apply forward or reverse current to the semiconductor refrigeration chip 2 according to temperature information, and control the start and stop of the heat dissipation component 3 to achieve heat dissipation of the semiconductor refrigeration chip 2.

[0042] When working, the power is turned on, and the temperature sensing component will feed back the temperature information of the heat-conducting tube 1 to the controller in real time. The controller controls the power to flow forward or reverse according to the received temperature information. When the detected temperature information is higher than the target value, the heat-conducting tube 1 needs to be cooled. At this time, the controller controls the semiconductor refrigeration sheet 2 to pass a forward current according to the detected temperature information, so that the temperature of the first surface of the semiconductor refrigeration sheet 2 is reduced and transferred to the heat-conducting tube 1, and the heat of the heat-conducting tube 1 is continuously absorbed. In this process, the second surface of the semiconductor refrigeration sheet 2 removes the heat generated by the cooling of the first surface, and the heat is removed by the heat dissipation component 3. The second side of the semiconductor refrigeration sheet 2 is heat-dissipated; when the detected temperature information is lower than the target value, the heat-conducting tube 1 needs to be heated. At this time, the controller controls the reverse current to be passed into the semiconductor refrigeration sheet 2 according to the detected temperature information, so that the temperature of the first side of the semiconductor refrigeration sheet 2 is increased and transferred to the heat-conducting tube 1, and the heat is continuously released to the heat-conducting tube 1. In this process, the second side of the semiconductor refrigeration sheet 2 conducts away the excess heat and the heat dissipation component 3 dissipates the heat until the temperature information of the heat-conducting tube 1 detected by the temperature-sensing component is stabilized to the target value, thereby realizing real-time monitoring of the source bottle temperature and accurate temperature regulation.

[0043] It should be noted that the heat-conducting liquid in the accommodating chamber 11 can be water or other media. There is no specific limitation on the heat-conducting liquid in the accommodating chamber 11. As long as the heat-conducting liquid can cover the source bottle and has a high specific heat capacity, the temperature of the heat-conducting tube 1 can be evenly and stably transferred to the source bottle through a water bath using water as the heat-conducting liquid, thereby ensuring the temperature consistency of the source bottle and avoiding the problems of local overheating and uneven temperature.

[0044] Specifically, in this embodiment, a grille structure is provided at the connection between the second surface of the semiconductor cooling sheet 2 and the heat dissipation component 3. The grille structure can increase the ventilation area at the second surface of the semiconductor cooling sheet 2, so that the heat dissipation component 3 can achieve a good heat dissipation effect at the connection through the grille structure, thereby improving the heat dissipation efficiency.

[0045] like Figure 1 and Figure 3 As shown, specifically, in this embodiment, the heat dissipation component 3 includes: a fan 31, a heat sink 32 and a heat dissipation pipe 33, the fan 31 is electrically connected to the control circuit; the heat sink 32 is covered on the outside of the fan 31, and the heat dissipated by the heat sink 32 is cooled by the fan 31; the two ends of the heat dissipation pipe 33 are respectively connected to the second surface of the semiconductor refrigeration plate 2 and the heat sink 32, and the heat dissipation pipe 33 is used to transfer the heat of the semiconductor refrigeration plate 2 to the heat sink 32.

[0046] During operation, the heat generated by the second surface of the semiconductor refrigeration plate 2 during operation is transferred to the heat sink 32 through the heat dissipation pipe 33. At this time, the fan 31 rotates and blows from one side of the heat sink 32 to the other side. The airflow generated by the continuous blowing takes away the heat absorbed by the heat sink 32 to achieve heat dissipation of the semiconductor refrigeration plate 2.

[0047] Specifically, in this embodiment, the heat dissipation pipe 33 includes a metal pipe, wherein the heat dissipation pipe 33 may be a copper pipe or other metal pipes, and the heat dissipation pipe 33 is not specifically limited here, as long as the heat dissipation pipe 33 has good thermal conductivity.

[0048] Specifically, in this embodiment, there is a thermal conductive coating between the heat sink 32 and the heat pipe 33. The operator applies the thermal conductive coating between the heat sink 32 and the heat pipe 33, thereby improving the heat conduction efficiency between the heat sink 32 and the heat pipe 33, reducing the operating temperature at the second surface of the semiconductor refrigeration sheet 2, and extending the service life of the thermostat.

[0049] Specifically, in this embodiment, the thermal conductive coating includes a silicone grease coating. Silicone grease has excellent thermal conductivity. By applying the silicone grease coating, the thermal conductivity between the heat sink 32 and the heat pipe 33 is improved. Of course, the thermal conductive coating can also be applied between the heat sink 32 and the heat pipe 33 using other materials. The thermal conductive coating is not specifically limited here, as long as the thermal conductive coating has good thermal conductivity, it can effectively prevent the heat generated by the work from accumulating on the second surface of the semiconductor refrigeration sheet 2.

[0050] Specifically, in this embodiment, a plurality of heat sinks 32 are provided, and the plurality of heat sinks 32 are arranged at intervals along the normal direction of the heat sink, each heat sink 32 is connected to the heat pipe 33, and the blowing direction of the fan 31 is perpendicular to the normal direction of the heat sink 32. The plurality of heat sinks 32 are arranged at intervals along the normal direction of the heat sink, which increases the heat dissipation area during the blowing process of the fan 31, and the gap between two adjacent heat sinks 32 ensures the circulation of air, reduces the generation of thermal resistance, and improves the heat dissipation efficiency of the heat dissipation component 3.

[0051] Specifically, in this embodiment, the temperature sensing component includes a thermistor or a thermocouple. Both the thermocouple and thermistor have high measurement accuracy, simple structure and high efficiency, and can sense temperature changes more accurately. When the thermocouple is arranged on the outer wall of the heat-conducting tube 1, it can quickly detect whether the heating temperature of the heat-conducting tube 1 by the semiconductor refrigeration sheet 2 in the working state meets the working requirements, thereby improving the safety, reliability and sensitivity of the thermostat. At the same time, the thermocouple has the advantages of good stability, not easy to deform, and a large measurable temperature range, which prolongs the service life of the thermostat.

[0052] Specifically, in this embodiment, the material of the heat-conducting tube 1 includes metal or semiconductor. The material of the heat-conducting tube 1 can be aluminum, silicon or other materials. The material of the heat-conducting tube 1 is not specifically limited here, as long as the material of the heat-conducting tube 1 can produce a Peltier effect with the semiconductor cooling sheet 2. Preferably, the heat-conducting tube 1 is an aluminum sleeve. Since the material of the heat-conducting tube 1 has good thermal conductivity, the temperature change of the semiconductor cooling sheet 2 can be timely adjusted to the temperature of the source bottle in the accommodating cavity 11 through the heat-conducting tube 1, thereby improving the reliability of the constant temperature device.

[0053] Specifically, in this embodiment, the thermostat further includes: a heat-insulating component, which is coated on the outer wall of the heat-conducting tube 1. The heat-insulating component covers the outer wall of the heat-conducting tube 1, wherein the heat-insulating component may be sponge, foam or other materials with heat-insulating function, and the heat-insulating component is not specifically limited here. By coating the heat-insulating component on the outer wall of the heat-conducting tube 1, the influence of the external environment temperature on the temperature of the heat-conducting tube 1 can be reduced, so that the heat-conducting tube 1 is kept at a relatively constant temperature, and the energy consumption of the thermostat is reduced.

[0054] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0055] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A source bottle constant temperature device for atomic layer deposition, characterized in that: include: The heat-conducting cylinder has a containing cavity, and the containing cavity is used to place the source bottle and the heat-conducting liquid; A semiconductor cooling sheet having a first surface and a second surface opposite to each other, wherein the first surface covers the outer wall of the heat-conducting tube; A heat dissipation component, covering the second surface of the semiconductor refrigeration sheet, and the heat dissipation component is used to dissipate heat from the semiconductor refrigeration sheet; A temperature sensing component, the temperature sensing component is mounted on the heat-conducting tube, and the temperature sensing component is used to detect the temperature information of the heat-conducting tube; A control circuit, the semiconductor refrigeration plate, the heat dissipation component and the temperature sensing component are all electrically connected to the control circuit, and the control circuit is used to control the temperature adjustment of the semiconductor refrigeration plate according to the temperature information.

2. The source bottle constant temperature device for atomic layer deposition according to claim 1, characterized in that: The control circuit comprises: A power source electrically connected to the semiconductor refrigeration sheet; The controller is respectively connected to the semiconductor refrigeration chip, the heat dissipation component, the temperature sensing component and the power supply control, and the controller is used to control the power supply to apply forward or reverse current to the semiconductor refrigeration chip according to the temperature information, and control the start and stop of the heat dissipation component to achieve heat dissipation of the semiconductor refrigeration chip.

3. The source bottle constant temperature device for atomic layer deposition according to claim 1, characterized in that: The connection between the second surface of the semiconductor refrigeration plate and the heat dissipation component has a grid structure.

4. The source bottle constant temperature device for atomic layer deposition according to claim 1, characterized in that: The heat dissipation component comprises: a fan, electrically connected to the control circuit; A heat sink is coated on the outside of the fan, and the heat conducted by the heat sink is cooled by the fan; The heat dissipation pipe has two ends respectively connected to the second surface of the semiconductor refrigeration plate and the heat dissipation plate, and the heat dissipation pipe is used to transfer the heat of the semiconductor refrigeration plate to the heat dissipation plate.

5. The source bottle constant temperature device for atomic layer deposition according to claim 4, characterized in that: A heat-conducting coating is provided between the heat sink and the heat pipe.

6. The source bottle constant temperature device for atomic layer deposition according to claim 4, characterized in that: The thermal conductive coating comprises a silicone grease coating.

7. The source bottle constant temperature device for atomic layer deposition according to claim 4, characterized in that: A plurality of heat sinks are provided, and the plurality of heat sinks are arranged at intervals along the normal direction of the heat sinks. Each heat sink is connected to the heat pipe, and the blowing direction of the fan is perpendicular to the normal direction of the heat sinks.

8. The source bottle constant temperature device for atomic layer deposition according to claim 1, characterized in that: The temperature sensing component includes a thermistor or a thermocouple.

9. The source bottle constant temperature device for atomic layer deposition according to claim 1, characterized in that: The material of the heat-conducting tube includes metal or semiconductor.

10. The source bottle constant temperature device for atomic layer deposition according to claim 1, characterized in that: Also includes: A heat-insulating component is coated on the outer wall of the heat-conducting tube.

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