Mold for chemical plating of grinding material, metal bonding agent agglomerated grinding material and preparation method of metal bonding agent agglomerated grinding material

Abstract

The invention provides a mold for chemical plating of an abrasive material, a metallic bond agglomerated abrasive material and a preparation method of the metallic bond agglomerated abrasive material, and belongs to the technical field of grinding, and the preparation method of the metallic bond agglomerated abrasive material comprises the following steps: sequentially carrying out acid pickling, sensitization and activation treatment on the abrasive material, then the treated abrasive is loaded into the mold for chemical plating of the abrasive to be subjected to chemical plating; and finally, the grinding material subjected to chemical plating treatment is subjected to heat treatment, and the metallic bond agglomerated grinding material is obtained. The mold for abrasive chemical plating comprises a mold body and cover plates, the cover plates are an upper cover plate and a lower cover plate which are arranged at the two ends of the mold body, a plurality of through holes penetrating through the upper cover plate and the lower cover plate are distributed in the mold body, the two ends of each through hole are sealed by the upper cover plate and the lower cover plate to form a containing cavity, and the containing cavity is used for storing abrasive; the upper cover plate, the lower cover plate and the die body are microwell plates, the diameter of micropores in the microwell plates is smaller than the size of grinding materials, and plating liquid can penetrate through the microwell plates. The prepared grinding pad is high in self-sharpening performance, the removal rate is increased, and the surface roughness of a machined workpiece is low.

Description

Technical Field

[0001] The present invention relates to the field of grinding technology, and in particular to an abrasive and a preparation method thereof. Background Art

[0002] With the development of grinding technology, more and more hard and brittle materials such as silicon carbide, sapphire, quartz, microcrystalline glass, etc. are ground with the help of grinding pads. Compared with traditional mortar grinding, grinding with grinding pads is not only clean and hygienic, but also has high grinding efficiency. Of course, the processing of grinding pads is not perfect, because these materials are extremely hard and the removal thickness is large. The single crystal or polycrystalline diamond abrasive used is relatively coarse. During the processing of grinding pads, the grinding efficiency is attenuated to a certain extent. The main reason for the attenuation is the poor self-sharpening of the abrasive. The blunted abrasive particles cannot fall off in time to expose new cutting edges. Therefore, it is necessary to develop a new type of abrasive with strong self-sharpening properties to improve the attenuation problem in the grinding process of hard and brittle materials.

[0003] Patent CN 110295361 A discloses a method for preparing multi-edge diamond abrasive grains; diamond micropowder is placed in a mixed solution of stannous chloride and hydrochloric acid for surface sensitization; then the diamond micropowder is placed in a mixed solution of palladium chloride and hydrochloric acid for activation; the diamond micropowder is placed in a plating solution for plating to obtain surface-plated diamond micropowder; then the diamond micropowder is subjected to high-temperature rapid treatment, rapid cooling and then heat preservation, and then the diamond micropowder is subjected to hydrochloric acid and perchloric acid for impurity removal to obtain multi-edge diamond abrasive grains. The multi-edge diamond abrasive grains prepared by this method have a rough surface and a large specific surface area, and can be embedded in a binder to greatly enhance the holding force, thereby improving the service life of diamond products and the grinding and cutting efficiency. However, the cutting edge of the multi-blade diamond abrasive produced by this method only exists on the surface of the abrasive, and it is difficult to maintain a stable rate during the grinding process. The grinding rate is fast at the beginning. After grinding for a period of time, the cutting edge on the surface of the multi-blade diamond is blunted. Since the core of the multi-blade diamond is still a single crystal, no new cutting edge appears, showing the grinding state of single crystal diamond, and the grinding rate is reduced. Summary of the invention

[0004] In view of the above technical problems, the present invention provides a mold for abrasive chemical plating, a metal binder agglomerated abrasive and a preparation method thereof, so as to improve the self-sharpening property of the grinding pad, thereby increasing the removal rate and reducing the roughness.

[0005] In order to achieve the above object, the technical solution of the present invention is achieved as follows: A mold for chemical plating of abrasives, the mold comprising a mold body and a cover plate, the cover plate being an upper cover plate and a lower cover plate arranged at both ends of the mold body, the mold body being provided with a plurality of through holes penetrating the upper cover plate and the lower cover plate, the two ends of the through holes being closed by the upper cover plate and the lower cover plate to form a receiving cavity, the receiving cavity being used to store abrasives; the upper cover plate, the lower cover plate and the mold body being microporous plates, the diameter of the micropores in the microporous plates being smaller than the size of the abrasives, and the plating solution being able to pass through the microporous plates.

[0006] Preferably, the upper cover plate, the lower cover plate and the mold body are made of polytetrafluoroethylene or polyvinylidene fluoride; the pore size of the microporous plate is 10-90 μm, and the micropores on the plate are achieved by laser drilling.

[0007] Preferably, the three-dimensional dimensions of the accommodating cavity are 100-400 μm in length, width and height respectively.

[0008] A method for preparing a metal bond agglomerated abrasive comprises the following steps: sequentially subjecting the abrasive to pickling, sensitization and activation treatments, then placing the treated abrasive into a mold for chemical plating of the abrasive for chemical plating; and finally heat treating the chemically plated abrasive to obtain the metal bond agglomerated abrasive.

[0009] During the chemical plating process, the entire mold is immersed in a plating solution, and the shaft on the mold is connected to a motor and rotates at a certain speed. The plating solution enters the cavity through the micropores on the mold and undergoes an oxidation-reduction reaction with the abrasive.

[0010] Preferably, the abrasive is diamond or cubic boron nitride, and the particle size is 20-100 μm.

[0011] Preferably, the pickling is to add the superhard abrasive to dilute hydrochloric acid and boil it, the concentration of the dilute hydrochloric acid is 10-30wt%; the pickling time is 15min-10h; the sensitization step is to add the superhard abrasive to the sensitizing agent and stir to react; the sensitizer is a mixed solution of stannous chloride, hydrochloric acid and a small amount of tin particles; the concentration of stannous chloride in the sensitizing agent is 05-15g / L, the concentration of hydrochloric acid is 0.040-0.055g / L, and the amount of tin particles is 0.2-0.5g / L; the sensitizing agent and the abrasive are stirred and reacted at room temperature, and the stirring reaction time is 5-30min; the tin particles are a reducing agent, which is mainly used to prevent the generation of Sn 4+ .

[0012] Preferably, the activation treatment step is to add the abrasive into the activation solution, stir and boil, and then cool and rinse; the activation solution is a mixed solution of palladium chloride and hydrochloric acid, the concentration of palladium chloride in the activation solution is 0.5-1g / L, the concentration of hydrochloric acid is 0.20-0.40 g / L, and the boiling time is 5-30min.

[0013] Preferably, the chemical plating solution used in the chemical plating is a nickel-phosphorus alloy plating solution; the nickel-phosphorus alloy plating solution includes 20-30 g / L nickel chloride, 20-25 g / L sodium hypophosphite, and 20-25 g / L sodium succinate; the pH value of the nickel-phosphorus alloy plating solution is 4-6; the temperature of the chemical plating solution is 80-90°C, and the plating time is 1.5-6 h; the rate of abrasive chemical plating is 10-20 μm / h, the self-rotation rate of the mold for abrasive chemical plating is 150-250 r / min, and a peristaltic pump is used to add liquid after the plating solution is consumed.

[0014] Preferably, the heat treatment temperature is 750-900° C. and the time is 1-3 h.

[0015] Preferably, the method prepares metal bond agglomerated abrasive.

[0016] The particle size of the metal bond agglomerated abrasive is 100-400 μm.

[0017] The present invention has the following beneficial effects: 1. The present invention adopts a special mold. In the process of chemical plating, chemical plating can not only plate the abrasive, but also play the role of a binder, bonding the abrasive into agglomerates to prepare metal binder agglomerated abrasives. The nickel-phosphorus alloy layer plated using nickel chloride as a raw material has greater brittleness. It is used as a binder for superhard abrasives and applied in grinding pads to give the grinding pads better self-sharpening properties, stable removal rate, no attenuation, higher grinding efficiency, and lower roughness of the workpiece being processed; compared with the metal binder agglomerates produced by sintering, the advantages are obvious.

[0018] 2. The mold structure used in the present invention is reasonably designed. The micropores are etched on the plate with a laser to facilitate the passage of the plating solution. At the same time, the special accommodating cavity provides space for abrasive plating and agglomeration. The mold can be used repeatedly and has a better effect on processing agglomerated abrasives. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 Schematic diagram of the mold for abrasive chemical plating of the present invention, (a) is an exploded view of the mold; (b) is a state where the upper and lower cover plates are combined with the mold body; In the figure, 1 is the upper cover plate; 2 is the lower cover plate; 3 is the mold body. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0022] Example 1 This embodiment provides a mold for abrasive chemical plating, the mold comprising a mold body and a cover plate, the cover plate is an upper cover plate and a lower cover plate arranged at both ends of the mold body, the mold body is provided with a plurality of through holes penetrating the upper cover plate and the lower cover plate, the two ends of the through holes are closed by the upper cover plate and the lower cover plate to form a receiving cavity, and the receiving cavity is used to store abrasive; The upper cover plate, the lower cover plate and the mold body are microporous plates, the diameter of the micropores in the microporous plates is smaller than the size of the abrasive, and the plating solution can pass through the microporous plates; the material of the upper cover plate, the lower cover plate and the mold body is polytetrafluoroethylene; the pore diameter of the microporous plate is 10μm, and the micropores on the plate are achieved by laser drilling; the three-dimensional dimensions of the accommodating cavity are 100μm in length, width and height respectively.

[0023] Example 2 This embodiment provides a mold for abrasive chemical plating, the mold comprising a mold body and a cover plate, the cover plate is an upper cover plate and a lower cover plate arranged at both ends of the mold body, the mold body is provided with a plurality of through holes penetrating the upper cover plate and the lower cover plate, the two ends of the through holes are closed by the upper cover plate and the lower cover plate to form a receiving cavity, and the receiving cavity is used to store abrasive; The upper cover plate, the lower cover plate and the mold body are microporous plates, the diameter of the micropores in the microporous plates is smaller than the size of the abrasive, and the plating solution can pass through the microporous plates; the material of the upper cover plate, the lower cover plate and the mold body is polyvinylidene fluoride; the pore diameter of the microporous plate is 90μm, and the micropores on the plate are realized by laser drilling; the three-dimensional dimensions of the accommodating cavity are 400μm in length, width and height respectively.

[0024] Example 3 This embodiment provides a mold for abrasive chemical plating, the mold comprising a mold body and a cover plate, the cover plate is an upper cover plate and a lower cover plate arranged at both ends of the mold body, the mold body is provided with a plurality of through holes penetrating the upper cover plate and the lower cover plate, the two ends of the through holes are closed by the upper cover plate and the lower cover plate to form a receiving cavity, and the receiving cavity is used to store abrasive; The upper cover plate, the lower cover plate and the mold body are microporous plates, the diameter of the micropores in the microporous plates is smaller than the size of the abrasive, and the plating solution can pass through the microporous plates; the material of the upper cover plate, the lower cover plate and the mold body is polyvinylidene fluoride; the pore diameter of the microporous plate is 50μm, and the micropores on the plate are achieved by laser drilling; the three-dimensional dimensions of the accommodating cavity are 200μm *300μm *400μm in length, width and height.

[0025] Example 4 This embodiment provides a mold for abrasive chemical plating, the mold comprising a mold body and a cover plate, the cover plate is an upper cover plate and a lower cover plate arranged at both ends of the mold body, the mold body is provided with a plurality of through holes penetrating the upper cover plate and the lower cover plate, the two ends of the through holes are closed by the upper cover plate and the lower cover plate to form a receiving cavity, and the receiving cavity is used to store abrasive; The upper cover plate, the lower cover plate and the mold body are microporous plates, the diameter of the micropores in the microporous plates is smaller than the size of the abrasive, and the plating solution can pass through the microporous plates; the material of the upper cover plate, the lower cover plate and the mold body is polytetrafluoroethylene; the pore diameter of the microporous plate is 70μm, and the micropores on the plate are achieved by laser drilling; the three-dimensional dimensions of the accommodating cavity are 300μm in length, width and height respectively.

[0026] Example 5 A method for preparing a metal bond agglomerated abrasive, the preparation method comprising the following steps: Take 10g of 20μm single crystal diamond powder, boil it with 5wt% diluted hydrochloric acid for 6h, rinse the boiled diamond powder with pure water for several times and set aside.

[0027] Take 20g of sensitizing solution, mix it with 10g / L stannous chloride, 0.048g / L hydrochloric acid, and 0.2g / L tin particles, put the hydrophilized diamond powder into the sensitizing solution, and keep stirring at room temperature for 5 minutes.

[0028] Put the sensitized diamond into 20g activation solution. The concentration of each component in the activation solution is: palladium chloride 1g / L, hydrochloric acid 0.30g / L. Boil the activation solution and diamond for 2 minutes. Keep stirring during the boiling process, then cool, rinse and set aside.

[0029] Prepare chemical nickel-phosphorus alloy plating solution according to the following ratio: nickel chloride 25 g / L, sodium hypophosphite 23 g / L, sodium succinate 23 g / L, and adjust the pH value to 5.0. Take the activated diamond powder and put it into a special mold with a grid size of 200μm*200μm*200μm. The mold is made of polytetrafluoroethylene with 10μm micropores to facilitate the entry of the plating solution. Cover the mold lid and seal it. Put the mold into the plating tank, add 1500ml of plating solution, heat the plating solution, and keep the plating solution temperature at 85℃. The plating tank motor drives the mold to rotate, the rotation rate is 10min / revolution, and the reaction time is 1.5h. Keep the plating solution circulating and filtering during use, and replenish the plating solution in time after a period of use. Heat the plated abrasive to 750℃ and keep it warm for 2h.

[0030] Example 6 A method for preparing a metal bond agglomerated abrasive, the preparation method comprising the following steps: Take 10g of 40μm single crystal diamond powder, boil it with 5wt% diluted hydrochloric acid for 10h, rinse the boiled diamond powder with pure water for several times and set aside.

[0031] Take 20g of sensitizing solution, mix 5g / L stannous chloride, 0.040g / L hydrochloric acid, and 0.2g / L tin particles, put the hydrophilized diamond powder into the sensitizing solution, and keep stirring at room temperature for 5min.

[0032] The sensitized diamond is placed in 20g of activation solution, which consists of 1g / L palladium chloride and 0.20g / L hydrochloric acid. The activation solution and diamond are boiled for 2 minutes while stirring during the boiling process. Then the mixture is cooled, rinsed and set aside.

[0033] Prepare chemical nickel-phosphorus alloy plating solution according to the following ratio: nickel chloride 30 g / L, sodium hypophosphite 25 g / L, sodium succinate 25 g / L, and adjust the pH value to 4.0. Take the activated diamond powder and put it into a special mold with a grid size of 300μm*300μm*300μm. The mold is made of polytetrafluoroethylene with 10μm micropores to facilitate the entry of the plating solution. Cover the mold lid and seal it. Put the mold into the plating tank, add the plating solution, heat the plating solution, and keep the plating solution temperature at 80℃. The plating tank motor drives the mold to rotate, the rotation rate is 10min / revolution, the reaction time is 2h, and the plating solution is kept circulating and filtered during use. The plating solution is replenished in time after a period of use. Heat the plated abrasive to 800℃ and keep it warm for 2h.

[0034] Example 7 A method for preparing a metal bond agglomerated abrasive, the preparation method comprising the following steps: Take 10g of 60μm single crystal diamond powder, boil it with 10wt% dilute hydrochloric acid for 15min, rinse the boiled diamond powder with pure water for several times and set aside.

[0035] The solute ratio in the sensitizing solution is: 10g / L stannous chloride, 0.055g / L hydrochloric acid, and 0.3g / L tin particles. The hydrophilized diamond powder is placed in 20g of the sensitizing solution and stirred at room temperature for 30 minutes.

[0036] The sensitized diamond is placed in an activation solution containing 1 g / L palladium chloride and 0.30 g / L hydrochloric acid. The activation solution and diamond are boiled for 2 minutes while stirring the solution during the boiling process. The solution is then cooled, rinsed, and set aside.

[0037] Prepare chemical nickel-phosphorus alloy plating solution according to the following ratio: nickel chloride 20 g / L, sodium hypophosphite 23 g / L, sodium succinate 20 g / L, and adjust the pH value to 5.0. Take the activated diamond powder and put it into a special mold with a grid size of 300μm*300μm*300μm. The mold is made of polytetrafluoroethylene with 30μm micropores to facilitate the entry of the plating solution. Cover the mold lid and seal it. Put the mold into the plating tank, add 1500ml of plating solution, heat the plating solution, and keep the plating solution temperature at 90℃. The plating tank motor drives the mold to rotate, the rotation rate is 10min / revolution, and the reaction time is 2.5h. Keep circulating and filtering the plating solution during use, and replenish the plating solution in time after a period of use. Heat the plated abrasive to 900℃ and keep it warm for 1h.

[0038] Example 8 A method for preparing a metal bond agglomerated abrasive, the preparation method comprising the following steps: Take 10g of 80μm single crystal diamond powder, boil it with 15wt% diluted hydrochloric acid for 30min, rinse the boiled diamond powder with pure water for several times and set aside.

[0039] The concentration of stannous chloride in the sensitizing solution is 15 g / L, the concentration of hydrochloric acid is 0.055 g / L, and the concentration of tin particles is 0.5 g / L. The hydrophilized diamond powder is placed in 20 g of the sensitizing solution and stirred for 5 minutes at room temperature.

[0040] The sensitized diamond was placed in an activation solution consisting of 1 g / L palladium chloride and 0.40 g / L hydrochloric acid. The activation solution and diamond were boiled for 30 min while stirring during the boiling process. The diamond was then cooled, rinsed, and set aside.

[0041] Prepare chemical nickel-phosphorus alloy plating solution according to the following ratio: nickel chloride 25 g / L, sodium hypophosphite 23 g / L, sodium succinate 23 g / L, and adjust the pH value to 4.0-6.0. Take the activated diamond powder and put it into a special mold with a grid size of 300μm*300μm*300μm. The mold is made of polytetrafluoroethylene with 40μm micropores to facilitate the entry of the plating solution. Cover the mold lid and seal it. Put the mold into the plating tank, add 1500ml of plating solution, heat the plating solution, and keep the plating solution temperature at 80℃. The plating tank motor drives the mold to rotate, the rotation rate is 10min / revolution, the reaction time is 4 hours, and the plating solution is kept circulating and filtered during use. The plating solution is replenished in time after a period of use. Heat the plated abrasive to 750℃ and keep it warm for 3 hours.

[0042] Comparative Example 1 This comparative example provides a method for preparing an abrasive, which differs from Example 5 in that a mold is not used for chemical plating. The specific preparation steps are as follows: A method for preparing a nickel-plated abrasive comprises the following steps: taking 10 g of 20 μm single crystal diamond micropowder, boiling it with 5 wt % diluted hydrochloric acid for 6 hours, and rinsing the acid-boiled diamond micropowder with pure water for multiple times before use.

[0043] Take 20g of sensitizing solution, mix it with 10g / L stannous chloride, 0.048g / L hydrochloric acid, and 0.2g / L tin particles, put the hydrophilized diamond powder into the sensitizing solution, and keep stirring at room temperature for 5 minutes.

[0044] Put the sensitized diamond into 20g activation solution. The concentration of each component in the activation solution is: palladium chloride 1g / L, hydrochloric acid 0.30g / L. Boil the activation solution and diamond for 2 minutes. Keep stirring during the boiling process, then cool, rinse and set aside.

[0045] Prepare chemical nickel-phosphorus alloy plating solution according to the following ratio: nickel chloride 25 g / L, sodium hypophosphite 23 g / L, sodium succinate 23 g / L, and adjust the pH value to 5.0. Put the activated diamond powder into the plating solution, add 1500 ml of plating solution, heat the plating solution, keep the plating solution temperature at 85°C, and the reaction time is 1.5 hours. Keep circulating and filtering the plating solution during use, and replenish the plating solution in time after using it for a period of time. Heat the plated abrasive to 750°C and keep it warm for 2 hours.

[0046] Comparative Example 2 This comparative example provides a method for preparing an abrasive, which differs from Example 6 in that a mold is not used for chemical plating. The specific preparation steps are as follows: A method for preparing a nickel-plated abrasive comprises the following steps: taking 10 g of 40 μm single crystal diamond micropowder, boiling it with 5 wt % dilute hydrochloric acid for 10 h, and rinsing the acid-boiled diamond micropowder with pure water for multiple times before use.

[0047] Take 20g of sensitizing solution, mix 5g / L stannous chloride, 0.040g / L hydrochloric acid, and 0.2g / L tin particles, put the hydrophilized diamond powder into the sensitizing solution, and keep stirring at room temperature for 5min.

[0048] The sensitized diamond is placed in an activation solution consisting of 1 g / L palladium chloride and 0.20 g / L hydrochloric acid. The activation solution and diamond are boiled for 2 minutes while stirring during the boiling process. The diamond is then cooled, rinsed, and set aside.

[0049] Prepare chemical nickel-phosphorus alloy plating solution according to the following ratio: 30g / L nickel chloride, 25g / L sodium hypophosphite, 25g / L sodium succinate, and adjust the pH value to 4.0. Put the activated diamond powder into the plating tank, add the plating solution, heat the plating solution, keep the plating solution temperature at 80℃, and the reaction time is 2h. Keep the plating solution circulating and filtering during use, and replenish the plating solution in time after a period of use. Heat the plated abrasive to 800℃ and keep it warm for 2h.

[0050] Comparative Example 3 This comparative example provides a method for preparing an abrasive, which differs from Example 7 in that a mold is not used for chemical plating. The specific preparation steps are as follows: A method for preparing a nickel-plated abrasive comprises the following steps: taking 10 g of 60 μm single crystal diamond micropowder, boiling it with 10 wt % diluted hydrochloric acid for 15 minutes, and rinsing the acid-boiled diamond micropowder with pure water for multiple times before use.

[0051] The solute ratio in the sensitizing solution is: 10g / L stannous chloride, 0.055g / L hydrochloric acid, and 0.3g / L tin particles. The hydrophilized diamond powder is placed in 20g of the sensitizing solution and stirred at room temperature for 30 minutes.

[0052] The sensitized diamond is placed in an activation solution containing 1 g / L palladium chloride and 0.3 g / L hydrochloric acid. The activation solution and diamond are boiled for 2 minutes while stirring the solution during the boiling process. The solution is then cooled, rinsed, and set aside.

[0053] Prepare chemical nickel-phosphorus alloy plating solution according to the following ratio: nickel chloride 20 g / L, sodium hypophosphite 23 g / L, sodium succinate 20 g / L, and adjust the pH value to 5.0. Put the activated diamond powder into the plating tank, add the plating solution, heat the plating solution, keep the plating solution temperature at 90°C, and the reaction time is 2.5 hours. Keep circulating and filtering the plating solution during use, and replenish the plating solution in time after using it for a period of time. Heat the plated abrasive to 900°C and keep it warm for 1 hour.

[0054] Comparative Example 4 This comparative example provides a method for preparing an abrasive, which differs from Example 8 in that a mold is not used for chemical plating. The specific preparation steps are as follows: A method for preparing a coated abrasive comprises the following steps: taking 10 g of 80 μm single crystal diamond micropowder, boiling it with 15 wt % diluted hydrochloric acid for 30 minutes, and rinsing the acid-boiled diamond micropowder with pure water for multiple times before use.

[0055] The concentration of stannous chloride in the sensitizing solution is 15 g / L, the concentration of hydrochloric acid is 0.055 g / L, and the concentration of tin particles is 0.5 g / L. The hydrophilized diamond powder is placed in 20 g of the sensitizing solution and stirred for 5 minutes at room temperature.

[0056] The sensitized diamond is placed in an activation solution consisting of a 1g / L palladium chloride solution and a 0.40g / L hydrochloric acid solution. The activation solution and the diamond are boiled for 30 minutes while stirring during the boiling process. The diamond is then cooled, rinsed, and set aside.

[0057] Prepare chemical nickel-phosphorus alloy plating solution according to the following ratio: nickel chloride 25 g / L, sodium hypophosphite 23 g / L, sodium succinate 23 g / L, and adjust the pH value to 4.0-6.0. Put the activated diamond powder into the plating tank, add 1500 ml of plating solution, heat the plating solution, keep the plating solution temperature at 80°C, and the reaction time is 4 hours. Keep circulating and filtering the plating solution during use, and replenish the plating solution in time after using it for a period of time. Heat the plated abrasive to 750°C and keep it warm for 3 hours.

[0058] Abrasive Properties Comparison The prepared metal bond abrasive is used to make a grinding pad. The preparation process of the grinding pad is: the abrasive and the resin are mixed evenly, coated on a silicone mold, put into a drying oven for curing and molding, and then demolded. The formula of the grinding pad is: 10-20wt% abrasive; 80-90wt% epoxy resin. The grinding pad is prepared using the abrasive prepared in Examples 5-8 and Comparative Examples 1-4. Except for the different abrasives, the other processes are the same.

[0059] The grinding experiment was carried out on the single-sided grinding machine Kizi, processing quartz glass on one side. The size of the quartz glass was 100mm*70mm, the pressure was 21Kg, and the pressure per unit area was 300g / cm 2 The grinding machine speed was 100 rpm, and the cutting fluid was used for the grinding experiment. Each grinding lasted for 3 minutes. The thickness change of the quartz glass before and after the experiment was recorded and converted into the removal rate.

[0060] Comparative Examples 1-4 are abrasives with nickel-phosphorus alloy plated on the surface, that is, a layer of alloy is plated on the abrasive, but the properties of the abrasive itself do not change, and it is still a single crystal abrasive. Examples 5-8 of the present invention prepare stacked abrasives using nickel-phosphorus alloy as a binder, that is, agglomerated abrasives.

[0061] It can be clearly seen from the above data that the metal bond agglomerated abrasives of Examples 5-8 of the present invention have higher removal rates, lower roughness, and higher removal stability than the coated diamonds of the same particle size (Comparative Examples 1-4). Specifically, compared with Comparative Example 1, Example 5 is a metal bond agglomerated diamond, and Comparative Example 1 is a coated diamond of the same particle size. Because the cutting edge of Example 5 is agglomerated diamond during grinding, it will gradually update during the grinding process, while the cutting edge of the coated diamond is limited, and the blunt cutting edge will not be updated in time (unless the diamond is broken), resulting in a reduction in the grinding rate.

[0062] Compared with the coated diamond of the same particle size, the finished product of metal bond agglomerated diamond has coarser particle size and more cutting edges. The cutting edges can be updated and exposed in time, so the grinding rate is higher.

[0063] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A mold for abrasive chemical plating, characterized in that: The mold includes a mold body and a cover plate, wherein the cover plate is an upper cover plate and a lower cover plate arranged at both ends of the mold body, and the mold body is provided with a plurality of through holes penetrating the upper cover plate and the lower cover plate, and both ends of the through holes are closed by the upper cover plate and the lower cover plate to form a receiving cavity, and the receiving cavity is used to store abrasives; The upper cover plate, the lower cover plate and the mold body are microporous plates, the diameter of the micropores in the microporous plates is smaller than the size of the abrasive, and the plating solution can pass through the microporous plates.

2. The mold for abrasive chemical plating according to claim 1, characterized in that: The material of the microporous plate is polytetrafluoroethylene or polyvinylidene fluoride; the pore size of the microporous plate is 10-90 μm.

3. The mold for abrasive chemical plating according to claim 1, characterized in that: The three-dimensional size of the accommodating cavity is 100-400 μm.

4. A method for preparing a metal bond agglomerated abrasive, characterized in that: The method comprises the following steps: sequentially subjecting the abrasive to pickling, sensitization and activation treatments, and then placing the treated abrasive into the mold for chemical plating of abrasives according to any one of claims 1 to 3 for chemical plating; and finally heat treating the chemically plated abrasive to obtain metal binder agglomerated abrasives.

5. The method for preparing the metal bond agglomerated abrasive according to claim 4, characterized in that: The abrasive is diamond or cubic boron nitride, and the particle size is 20-100 μm.

6. The method for preparing the metal bond agglomerated abrasive according to claim 4, characterized in that: The pickling process is to add the abrasive into dilute hydrochloric acid and boil it, the concentration of the dilute hydrochloric acid is 10-30wt%; the pickling time is 15min-10h; the sensitization process is to add the abrasive into the sensitizing agent and stir to react; the sensitizer is a mixed solution of stannous chloride, hydrochloric acid and tin particles; the concentration of stannous chloride in the sensitizing agent is 5-15g / L, the concentration of hydrochloric acid is 0.040-0.055g / L, and the amount of tin particles is 0.2-0.5g / L; the temperature of the stirring reaction is room temperature, and the time is 5-30min.

7. The method for preparing the metal bond agglomerated abrasive according to claim 4, characterized in that: The activation treatment steps are as follows: adding the abrasive into the activation solution, stirring and boiling, and then cooling and rinsing; the activation solution is a mixed solution of palladium chloride and hydrochloric acid, the concentration of palladium chloride in the activation solution is 0.5-1g / L, the concentration of hydrochloric acid is 0.20-0.40 g / L, and the boiling time is 5-30min.

8. The method for preparing the metal bond agglomerated abrasive according to claim 4, characterized in that: The chemical plating solution used in the chemical plating is a nickel-phosphorus alloy plating solution; the nickel-phosphorus alloy plating solution includes 20-30 g / L of nickel chloride, 20-25 g / L of sodium hypophosphite, and 20-25 g / L of sodium succinate; the pH value of the nickel-phosphorus alloy plating solution is 4-6; the temperature of the chemical plating solution is 80-90° C., and the plating time is 1.5-6 h; and the rotation speed of the mold during the chemical plating is 150-250 r / min.

9. The method for preparing the metal bond agglomerated abrasive according to claim 4, characterized in that: The heat treatment temperature is 750-900°C and the time is 1-3h.

10. The metal bond agglomerated abrasive prepared by the method according to any one of claims 4 to 9.

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