A refrigeration system

Abstract

The application provides a refrigeration system, which belongs to the technical field of household appliances and comprises a shell, a semiconductor sheet and a first heat exchange component. A cold storage agent is arranged in the shell. The semiconductor sheet is connected with the shell, wherein the semiconductor sheet comprises a cold end and a hot end, the cold end is suitable for refrigerating the cold storage agent, and the hot end is arranged away from the shell. The first heat exchange component extends into the shell and exchanges heat with the cold storage agent. The application uses the semiconductor sheet to refrigerate, wherein the refrigeration process is carried out in a standby state of a refrigeration device, the cold energy generated by the semiconductor sheet is stored in the cold storage agent, and the cold energy in the cold storage agent is provided to a user through the first heat exchange component when the cold energy is needed. Because the cold storage is carried out in the idle time, there is enough time for the cold storage work, so the semiconductor sheet with low power can be adapted to the household appliance of the refrigeration system, and the semiconductor sheet does not have a great influence on the basic cost of the household appliance.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of household appliances, in particular to a refrigeration system. BACKGROUND

[0002] Air conditioning system is a commonly used household appliance, and air conditioners generally cover the living room and bedroom, but cannot cover the kitchen and bathroom space. However, the kitchen and bathroom space also has the use demand of air conditioner. If the air conditioner is introduced into the kitchen and bathroom, a hole position needs to be reserved on the wall of the kitchen and bathroom for the refrigerant pipe of the air conditioner to enter, and a corresponding indoor unit needs to be adapted and used respectively. If the air conditioner is connected to the kitchen and bathroom space, it is necessary to reserve in advance by a professional construction team before decoration, preferably during the development period of the developer. However, some customers do not have this demand, and it is difficult to unify the standard. In addition, the cost of adding an indoor unit is relatively high, and the air conditioning equipment needs to adapt to more indoor units, which requires a larger power and higher performance compressor, which also increases the cost of the air conditioner.

[0003] A low-power refrigeration system is needed, which can be adapted to kitchen air conditioners, range hoods, cold fans, tower fans, refrigerators and other household appliances that require refrigeration systems, and will not have a great impact on the basic cost of household appliances. SUMMARY

[0004] Therefore, the technical problem to be solved by the present application is to overcome the defects of the prior art that there is no low-power refrigeration household appliance, so as to provide a refrigeration system.

[0005] The present application provides a refrigeration system, comprising:

[0006] A housing is internally provided with a cold storage agent;

[0007] A semiconductor sheet is connected with the housing, the semiconductor sheet comprises a cold end and a hot end, the cold end is adapted to refrigerate the cold storage agent, and the hot end is arranged away from the housing

[0008] A first heat exchange assembly extends into the interior of the housing, and the first heat exchange assembly exchanges heat with the cold storage agent.

[0009] As a preferred scheme, the first heat exchange assembly comprises:

[0010] A first heat exchange pipeline extends into the interior of the housing;

[0011] A first heat exchanger is arranged on the first heat exchange pipeline, and the first heat exchange pipeline is adapted to transfer the cold energy of the cold storage agent to the first heat exchanger;

[0012] A fan is arranged on one side of the first heat exchanger, and the fan is adapted to blow air towards the first heat exchanger.

[0013] As a preferred scheme, the refrigeration system further comprises:

[0014] A second heat exchange component is connected to the hot end of the semiconductor piece; the second heat exchange component exchanges heat with the hot end.

[0015] As a preferred solution, the second heat exchange component comprises:

[0016] A heat dissipation fin is arranged at the hot end of the semiconductor piece;

[0017] A second heat exchange structure is connected to the heat dissipation fin; the second heat exchange structure exchanges heat with the heat dissipation fin.

[0018] As a preferred solution, the second heat exchange structure comprises:

[0019] A second heat exchange pipeline is arranged corresponding to the heat dissipation fin;

[0020] A second heat exchanger is arranged on the second heat exchange pipeline; the second heat exchange pipeline is adapted to transfer heat of the heat dissipation fin to the second heat exchanger.

[0021] A cooling structure is arranged corresponding to the second heat exchanger; the cooling structure cools the second heat exchanger.

[0022] As a preferred solution, the refrigeration system further comprises:

[0023] A heat conduction fin is arranged inside the shell; the cold end of the semiconductor is adapted to transfer cold to the cold storage agent through the heat conduction fin.

[0024] As a preferred solution, the heat conduction fin comprises a connecting portion and an extending portion; a first side of the connecting portion is attached to an inner wall of the shell; a first end of the extending portion is connected to a second side of the connecting portion; and a second end of the extending portion extends towards the inside of the shell.

[0025] As a preferred solution, the extending portion has a plurality of extending portions which are arranged at intervals along the extending direction of the connecting portion.

[0026] As a preferred solution, the refrigeration system further comprises:

[0027] A heat preservation layer is wrapped outside the shell.

[0028] As a preferred solution, the cold storage agent is water.

[0029] The technical solution of the present application has the following advantages:

[0030] 1. The present invention provides a refrigeration system in which a semiconductor chip cools the interior of a housing, allowing a refrigerant within the housing to store cold energy. A first heat exchange component extends into the housing to exchange heat with the refrigerant, transferring the stored cold energy to the household appliances requiring cooling, thereby fulfilling the cooling needs of the appliances. Furthermore, the present invention uses a semiconductor chip for refrigeration, wherein the refrigeration process is carried out in the standby state of the household appliances, typically at night or during idle time. The cold energy generated by the semiconductor chip is stored in the refrigerant. When needed, the first heat exchange component provides the cold energy from the refrigerant to the household appliances, meeting the user's usage requirements. Because cold energy storage occurs during idle time, there is sufficient time for the storage process. Therefore, using a low-power semiconductor chip allows for compatibility with household appliances requiring refrigeration systems, such as kitchen air conditioners, range hoods, evaporative coolers, tower fans, and refrigerators, without significantly impacting the basic cost of the appliances.

[0031] 2. The present invention provides a refrigeration system, wherein the first heat exchange component includes a first heat exchange pipeline, a first heat exchanger, and a fan. The first heat exchange pipeline is used in conjunction with the first heat exchanger to transfer the cold energy stored in the refrigerant to the first heat exchanger. Then, the airflow blown out by the fan delivers the cold energy stored in the first heat exchanger to the household appliances that need to be refrigerated. The first heat exchange component has the advantages of simple structure and low cost.

[0032] 3. The present invention provides a refrigeration system, wherein the refrigeration system further includes a second heat exchange component, the second heat exchange component cools the hot end of the semiconductor chip, and the second heat exchange component has the advantage of preventing the overall refrigeration effect from deteriorating due to the hot end of the semiconductor chip being too hot.

[0033] 4. This invention provides a refrigeration system, wherein the second heat exchange component includes a heat sink and a second heat exchange structure; wherein the heat sink is disposed at the hot end of the semiconductor plate, and the material of the heat sink is a metal with low specific heat. When the heat sink is in contact with the hot end, the heat sink absorbs heat quickly and dissipates heat relatively quickly at the same time, thus achieving a rapid heat dissipation effect through heat transfer. The second heat exchange component further dissipates heat from the heat sink, improving the heat dissipation effect of the heat sink.

[0034] 5. The present invention provides a refrigeration system in which a heat-conducting plate is disposed inside the housing. The heat-conducting plate contacts the cold end of the semiconductor plate and transfers the cold energy of the cold end of the semiconductor plate to the cold storage agent. The heat-conducting plate indirectly increases the contact area between the cold end and the cold storage agent, thereby increasing the efficiency of cold energy transfer.

[0035] 6. The present invention provides a refrigeration system, wherein an insulation layer is wrapped around the outer shell. The insulation layer can isolate the heat exchange between the inside and outside of the shell, and has the advantage of reducing the loss of cold energy inside the shell. Attached Figure Description

[0036] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0037] Figure 1 This invention provides a schematic diagram of the overall structure of a refrigeration system.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1. Housing; 2. Semiconductor chip; 3. First heat exchange assembly; 31. First heat exchange pipeline; 32. First heat exchanger; 33. Fan; 4. Second heat exchange assembly; 41. Heat sink; 42. Second heat exchange structure; 421. Second heat exchange pipeline; 422. Second heat exchanger; 423. Cooling structure; 5. Heat-conducting plate; 51. Connecting part; 52. Extension part; 6. Insulation layer. Detailed Implementation

[0040] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] In the description of this invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0042] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0043] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0044] In related technologies, when a user starts the cooling system, the cooling system immediately begins to work, operating on an on-demand basis. The cooling structure consists of a high-power compressor or a high-power semiconductor chip, which has high power and high cost.

[0045] like Figure 1 As shown, this embodiment provides a refrigeration system, including a housing 1, a semiconductor chip 2, and a first heat exchange assembly 3. A refrigerant is disposed inside the housing 1. The semiconductor chip 2 is connected to the housing 1, and includes a cold end and a hot end. The cold end is adapted to cool the refrigerant, and the hot end is disposed away from the housing 1. The first heat exchange assembly 3 extends into the housing 1 and exchanges heat with the refrigerant.

[0046] This embodiment uses a semiconductor chip 2 to cool the interior of the housing 1, allowing a refrigerant within the housing 1 to store cold energy. A first heat exchange component 3 extends into the housing 1 to exchange heat with the refrigerant, and then transfers the stored cold energy to the appliance requiring cooling. This method of storing cold energy before using it fulfills the cooling needs of the appliance. The semiconductor chip 2 is used for cooling, and the cooling process occurs during the standby state of the appliance, typically at night or during idle time. The cold energy generated by the semiconductor chip 2 is stored in the refrigerant. When needed, the first heat exchange component 3 provides the cold energy to the user. Because cold energy is stored during idle time, there is sufficient time for this process, allowing the use of a low-power semiconductor chip 2. This cooling system is compatible with kitchen air conditioners, range hoods, evaporative coolers 33, tower fans, refrigerators, and other appliances requiring cooling, without significantly impacting the basic cost of the appliances.

[0047] It should be noted that in this embodiment, the cold end of the semiconductor chip 2 is the end closest to the housing 1, and the hot end is the other end opposite to the cold end. In this embodiment, the semiconductor chip 2 is only the size of a palm. The small size of the semiconductor chip 2 and its significantly lower cost compared to compressor refrigeration ensure that the cost of the home appliance will not be significantly affected.

[0048] like Figure 1 As shown, in this embodiment, three semiconductor wafers 2 are arranged side by side.

[0049] It should be noted that the coolant is a material with a high specific heat capacity. In this embodiment, water is selected as the coolant considering factors such as cost. However, if cost is not a factor, a chemically synthesized coolant with a higher specific heat capacity than water can also be used as the coolant.

[0050] It should be noted that the cooling capacity stored in the shell 1, which uses water as the cooling agent, can be used continuously for 1.5 to 3 hours, which is sufficient to meet the general needs of users.

[0051] It should be noted that the shape of housing 1 is not limited to a cuboid. The shape of housing 1 can be changed according to the installation space of different electrical appliances when adapting to them.

[0052] Furthermore, such as Figure 1 As shown, the first heat exchange assembly 3 includes a first heat exchange pipe 31, a second heat exchanger 422, and a fan 33. The first heat exchange pipe 31 extends into the housing 1 and exchanges heat with the refrigerant. The first heat exchanger 32 is disposed on the first heat exchange pipe 31, and the first heat exchange pipe 31 is adapted to transfer the cooling capacity of the refrigerant to the first heat exchanger 32. The fan 33 is disposed on one side of the first heat exchanger 32 and is adapted to blow air toward the first heat exchanger 32.

[0053] The first heat exchanger 32, used in conjunction with the first heat exchange pipe 31, transfers the cold energy stored in the refrigerant to the first heat exchanger 32. The cold energy is then carried away by the airflow blown out by the fan 33, thus delivering the cold energy stored in the first heat exchanger 32 to the household appliances that require cooling. This configuration of the first heat exchange component 3 has the advantages of simple structure and low cost.

[0054] It should be noted that a heat exchange medium flows in the first heat exchange pipe 31, and the heat exchange medium plays a role in heat transfer.

[0055] It should be noted that, as Figure 1 As shown, in this embodiment, a first on / off valve is also provided on the first heat exchange pipeline 31. By controlling the opening and closing of the first on / off valve, the start and stop of the first heat exchange component 3 can be controlled. A first power pump is also provided on the first heat exchange pipeline 31, which can provide power to the heat exchange medium in the first heat exchange pipeline 31. Other common pipeline structures, such as alarm structures, can also be provided on the first heat exchange pipeline 31.

[0056] Furthermore, such as Figure 1 As shown, the refrigeration system also includes a second heat exchange component 4. The second heat exchange component 4 is connected to the hot end of the semiconductor chip 2 and exchanges heat with the hot end. By exchanging heat with the hot end of the semiconductor chip 2 through the second heat exchange component 4, the temperature of the hot end is reduced. The second heat exchange component 4 has the advantage of preventing the overall cooling effect from deteriorating due to excessively high temperature of the hot end of the semiconductor chip 2.

[0057] Specifically, such as Figure 1As shown, the second heat exchange component 4 includes a heat sink 41 and a second heat exchange structure 42. The heat sink 41 is disposed at and in contact with the hot end of the semiconductor wafer 2. In this embodiment, to enhance the heat dissipation effect of the heat sink 41, it covers the three semiconductor wafers 2, and a thermally conductive medium is applied between the heat sink 41 and the semiconductor wafers 2. The second heat exchange structure 42 is connected to the heat sink 41 and exchanges heat with it, thereby cooling the heat sink 41. The second heat exchange structure 42 further enhances the heat dissipation effect of the heat sink 41.

[0058] It should be noted that the heat sink 41 is made of a metal with a low specific heat; in this embodiment, the heat sink 41 is made of aluminum. When the heat sink 41 is in contact with the hot end, it absorbs heat quickly and dissipates heat relatively quickly as well. In this way, by transferring the heat from the hot end to the heat sink 41, some of the heat is quickly dissipated into the air through the heat sink 41, and some of the heat is dissipated through the second heat exchange structure 42, thereby achieving a rapid heat dissipation effect.

[0059] Specifically, such as Figure 1 As shown, the second heat exchange structure 42 includes a second heat exchange pipe 421, a second heat exchanger 422, and a cooling structure 423. The second heat exchange pipe 421 extends into the heat sink 41 and exchanges heat with the heat sink 41. The second heat exchanger 422 is disposed on the second heat exchange pipe 421, and the second heat exchange pipe 421 is adapted to transfer the heat from the heat sink 41 to the second heat exchanger 422. The cooling structure 423 is disposed corresponding to the second heat exchanger 422, and the cooling structure 423 can cool the second heat exchanger 422. The second heat exchange pipe 421 transfers the heat from the heat sink 41 to the second heat exchanger 422, and then the cooling structure 423 removes the heat from the second heat exchanger 422.

[0060] It should be noted that, in this embodiment, the cooling structure 423 is disposed on one side of the second heat exchanger 422 and the second heat exchanger 422 is cooled by air cooling; the cooling structure 423 can also be water-cooled or other cooling methods.

[0061] It should be noted that a heat exchange medium flows in the second heat exchange pipe 421, and the heat exchange medium plays a role in heat transfer.

[0062] It should be noted that, in this embodiment, a second on / off valve is also provided on the second heat exchange pipeline 421. The start and stop of the second heat exchange component 4 can be controlled by controlling the opening and closing of the second on / off valve. A second power pump is also provided on the second heat exchange pipeline 421, which provides power to the heat exchange medium within the second heat exchange pipeline 421. Other common pipeline structures, such as alarm structures, can also be provided on the second heat exchange pipeline 421.

[0063] It should be noted that the cooling structure 423 in this embodiment is a blowing structure. The blowing structure cools the second heat exchanger 422 by means of airflow. The cooling structure 423 can also be water cooling or other cooling structures.

[0064] It should be noted that, in order to increase the heat exchange effect between the second heat exchange pipe 421 and the heat sink 41, the second heat exchange pipe 421 is bent inside the heat sink 41. The bending arrangement can increase the contact area between the second heat exchange pipe 421 and the heat sink 41.

[0065] Furthermore, such as Figure 1 As shown, the refrigeration system also includes a heat-conducting plate 5. The heat-conducting plate 5 is disposed inside the housing 1, and the cold end of the semiconductor is adapted to transfer cold energy to the refrigerant through the heat-conducting plate 5. If the heat-conducting plate 5 is not provided, and the cold energy of the semiconductor 2 is directly transferred to the refrigerant, the contact area between the semiconductor 2 and the refrigerant is small, causing rapid accumulation of cold energy in some areas of the refrigerant. This leads to icing near the cold end of the refrigerant, which hinders the transfer of cold energy from the cold end to the refrigerant itself, resulting in poor cold storage performance. By providing the heat-conducting plate 5, the contact area between the cold end and the refrigerant is increased, allowing the cold energy at the cold end to be evenly transferred to the refrigerant, preventing localized icing, and ensuring the effective cold storage performance of the refrigerant.

[0066] Specifically, such as Figure 1 As shown, the heat-conducting sheet 5 includes a connecting portion 51 and an extension portion 52; wherein the first side of the connecting portion 51 is in contact with the inner wall of the housing 1. The first end of the extension portion 52 is connected to the second side of the connecting portion 51, and the second end of the extension portion 52 extends toward the interior of the housing 1.

[0067] Specifically, such as Figure 1 As shown, there are several extensions 52, and the several extensions 52 are spaced apart along the extension direction of the connecting portion 51.

[0068] It should be noted that the connecting part 51 and the extension part 52 can be connected by welding, bonding or integral molding. The function of the extension part 52 is to increase the contact area with the cold storage agent. In this solution, the extension part 52 is long and narrow. In order to further increase the contact area between the extension part 52 and the cold storage agent, the extension part 52 can also be wavy or the like.

[0069] Furthermore, the refrigeration system also includes an insulation layer 6. The insulation layer 6 is wrapped around the shell 1 and can isolate the heat exchange between the inside and outside of the shell 1, thus reducing the loss of cold energy inside the shell 1.

[0070] When the home appliance is in standby mode, the semiconductor chip 2 starts working, and the cold end of the semiconductor chip 2 allows the refrigerant to store cold energy. At the same time, the second heat exchange component 4 works to cool the hot end of the semiconductor chip 2. When the home appliance is started, the first heat exchange component 3 works, and through cooperation, it transfers the cold energy stored in the refrigerant to the first heat exchanger 32. The cold energy is then carried away by the airflow blown out by the fan 33, thereby delivering the cold energy stored in the first heat exchanger 32 to the home appliance that needs cooling.

[0071] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A refrigeration system, characterized in that, include: The casing (1) contains a coolant; A semiconductor chip (2) is connected to the housing (1). The semiconductor chip (2) includes a cold end and a hot end. The cold end is adapted to cool the refrigerant, and the hot end is disposed away from the housing (1). The first heat exchange component (3) extends into the interior of the housing (1) and exchanges heat with the cold storage agent; The first heat exchange component (3) includes: The first heat exchange pipe (31) extends into the interior of the shell (1); A first heat exchanger (32) is disposed on a first heat exchange pipeline (31), and the first heat exchange pipeline (31) is adapted to transfer the cold energy of the refrigerant to the first heat exchanger (32). A fan (33) is disposed on one side of the first heat exchanger (32), and the fan (33) is adapted to blow air toward the first heat exchanger (32); The refrigeration system also includes: The second heat exchange component (4) is connected to the hot end of the semiconductor chip (2); the second heat exchange component (4) exchanges heat with the hot end; The refrigeration system further includes: a heat-conducting plate (5) disposed inside the housing (1), wherein the cold end of the semiconductor is adapted to transfer the cold energy to the cold storage agent through the heat-conducting plate (5); The heat-conducting sheet (5) includes a connecting part (51) and an extension part (52). The first side of the connecting part (51) is attached to the inner wall of the housing (1). The first end of the extension part (52) is connected to the second side of the connecting part (51). The second end of the extension part (52) extends toward the interior of the housing (1).

2. The refrigeration system according to claim 1, characterized in that, The second heat exchange assembly (4) includes: A heat sink (41) is disposed at the hot end of the semiconductor plate (2); The second heat exchange structure (42) is connected to the heat sink (41), and the second heat exchange structure (42) exchanges heat with the heat sink (41).

3. The refrigeration system according to claim 2, characterized in that, The second heat exchange structure (42) includes: The second heat exchange pipe (421) is provided corresponding to the heat sink (41); The second heat exchanger (422) is disposed on the second heat exchange pipeline (421); the second heat exchange pipeline (421) is adapted to transfer the heat of the heat sink (41) to the second heat exchanger (422). A cooling structure (423) is provided corresponding to the second heat exchanger (422); the cooling structure (423) cools the second heat exchanger (422).

4. The refrigeration system according to claim 3, characterized in that, The extension (52) has a plurality of extensions, which are spaced apart along the extension direction of the connecting portion (51).

5. The refrigeration system according to claim 1, characterized in that, The refrigeration system also includes: The insulation layer (6) is wrapped around the shell (1).

6. The refrigeration system according to claim 1, characterized in that, The cold storage agent is water.

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