Alloy creep test device and method

Abstract

The invention discloses a testing device and method for an alloy creep test, and relates to the field of metal creep testing, the testing device comprises a digital image correlation system, an electric heating system, a vacuum chamber, a loading device, a control end and a cooling system; the control end controls the loading device to load stress to the alloy sample according to a set loading condition, controls the electric heating system to heat the alloy sample to enable the alloy sample to reach a set temperature, and controls the digital image related system to collect a surface image of the alloy sample under the set loading condition and the set temperature; the digital image correlation system determines strain field data of the alloy sample according to the surface image; when the set test time is up or the alloy sample is broken, the control end controls the electric heating system to be disconnected, and the cooling system introduces inert gas into the vacuum chamber so as to cool the alloy sample; and the cooled alloy sample is used for dislocation configuration analysis. According to the invention, synchronous measurement of real dislocation configuration of the alloy local strain field and the high-temperature creep can be realized.

Description

Technical Field

[0001] The present application relates to the field of metal creep testing, and in particular to an alloy creep test device and method. Background Art

[0002] The level of advancement in the development of aircraft engines and gas turbines is an important indicator of a country's industrial level. Nickel-based single-crystal high-temperature alloys have become key materials for single-crystal turbine blades of aircraft engines due to their excellent high-temperature strength and oxidation resistance. Turbine blades, as core hot-end components, not only have to withstand extremely high temperatures during actual service, but the rotor blades also have to withstand huge centrifugal loads. Therefore, nickel-based single-crystal alloys will experience high-temperature creep and fatigue damage during service. Effective evaluation of high-temperature creep and fatigue damage is of great reference value for the reliability and service life of turbine blades.

[0003] The complex structure of turbine blades (such as air film holes, impact holes, ribs, spoiler columns, etc.) is prone to local stress concentration, which is a weak link in the service failure of single-crystal turbine blades. Research on the stress field distribution, dislocation structure evolution and related high-temperature mechanical behavior of nickel-based single-crystal high-temperature alloys in stress concentration areas during service can better explain the failure mechanism of complex structure single-crystal turbine blades under stress concentration conditions, which is of great significance for improving the fatigue life and creep resistance of turbine blades, and is an important link in improving the service safety of blades. Through the refined design of the complex cooling structure of turbine blades, the stress concentration level can be effectively reduced, the risk of blade failure can be reduced, the service life of the blades can be increased, and their service safety can be improved.

[0004] When conducting high temperature creep tests on nickel-based single crystal high temperature alloys, the specimens are tested at constant temperature and stress to observe the deformation behavior of the alloy under long-term loading conditions. Dislocation analysis and creep strain analysis are important means of analyzing the mechanism of plastic deformation. However, the samples currently obtained by researchers using traditional creep methods have the following shortcomings.

[0005] (1) Dislocation analysis lacks sufficient authenticity. When the high-temperature testing machine stops heating, the sample will gradually cool to room temperature. This process usually lasts for several hours or even ten hours. During the cooling process, the stress remains unchanged, which means that the dislocations still have enough time to diffuse and recover, resulting in the dislocation movement behavior of the sample being no longer consistent with the dislocation behavior tested at high temperature. This situation may affect the accuracy of the test results when evaluating the long-term high-temperature and low-stress service of the material. Because under high-temperature loading conditions, the movement behavior of dislocations will be affected by temperature and stress. When the sample cools, the temperature drops, which causes the sample to shrink, resulting in a sudden increase in stress, generating new dislocation movement behavior, and causing dislocations to be redistributed within the alloy. The original dislocation configuration at high temperature may not be replicated and retained after cooling, affecting the subsequent dislocation analysis of the alloy.

[0006] (2) Creep strain analysis is limited. In the creep test of nickel-based high-temperature single crystal alloy using conventional creep test methods, the strain test results obtained are usually the average value of the entire specimen gauge section, and the overall plastic deformation behavior is usually characterized by a local specimen transmission electron microscope image. This may be effective in the evaluation of homogeneous materials, but for specimens with special cooling structures such as air film holes, impact holes, ribs, and spoiler columns, this average value may not accurately reflect the true plastic strain behavior of the local area. Stress concentration will occur in the material near the air film holes, impact holes, ribs, and spoiler columns, which will cause more active dislocation activity in these areas. Some areas may have more dislocation slip due to high stress, while other areas may be relatively stable. In materials with defects or irregular structures, microstructural changes (such as dislocation aggregation or recrystallization) will occur in different ways in different areas. Under creep or other long-term load conditions, local areas may be the starting point of failure. When the local stress exceeds the bearing capacity of the material in this area, it may cause early failure, and this premature failure cannot be reflected by the overall strain value. If we only focus on the overall situation, we may ignore the behavior of these high-stress areas. The resulting creep strain data may not truly reflect the performance of the material under actual working conditions. It is difficult to accurately predict the life and failure mode of the material in a high-temperature environment, which may lead to early failure or safety hazards.

[0007] In summary, conventional creep test cannot replicate and retain the real dislocation configuration of nickel-based single crystal high-temperature alloy under high-temperature creep conditions. It is difficult to accurately measure the creep strain of local areas of specimens with special structures such as air film holes, impact holes, ribs, spoiler columns, etc., and cannot truly reflect the performance of single crystal blades under actual working conditions. Summary of the invention

[0008] The purpose of the present application is to provide an alloy creep test device and method, which can realize the synchronous measurement of the alloy local strain field and the real dislocation configuration of high-temperature creep.

[0009] To achieve the above objectives, this application provides the following solutions:

[0010] In a first aspect, the present application provides an alloy creep test device, comprising: a digital image correlation system, an electric heating system, a vacuum chamber, a loading device, a control terminal and a cooling system;

[0011] The loading device and the alloy sample are arranged in the vacuum chamber; the digital image correlation system, the loading device and the electric heating system are all connected to the control end; the electric heating system is connected to the vacuum chamber;

[0012] The control end is used to control the loading device to load stress to the alloy sample according to the set loading conditions, control the electric heating system to heat the alloy sample so that the alloy sample reaches the set temperature, and control the digital image correlation system to collect the surface image of the alloy sample under the set loading conditions and the set temperature;

[0013] The digital image correlation system is used to collect the surface image of the alloy sample under the set loading conditions and the set temperature, and determine the strain field data of the alloy sample according to the surface image; the strain field data is used to characterize the creep behavior of the alloy sample;

[0014] The control end is also used to control the electric heating system to disconnect when the set test time is reached or the alloy sample is broken;

[0015] The cooling system is used to introduce inert gas into the vacuum chamber to cool the alloy sample after the electric heating system is disconnected; the cooled alloy sample is used for dislocation configuration analysis.

[0016] Optionally, the alloy creep test device further comprises: a temperature measuring device; the temperature measuring device is used to monitor the temperature change of the alloy sample in real time.

[0017] Optionally, the cooling system includes: an air pump and a vacuum pump; the air pump is connected to the inlet of the vacuum chamber; the vacuum pump is connected to the outlet of the vacuum chamber; the air pump is used to introduce inert gas into the vacuum chamber after the electric heating system is disconnected; the vacuum pump is used to extract the inert gas in the vacuum chamber after the alloy sample is cooled.

[0018] Optionally, the digital image correlation system includes: a microscope imaging system and an image acquisition end; the microscope imaging system is connected to the image acquisition end; the microscope imaging system is used to acquire a surface image of the alloy sample under set loading conditions and set temperature; the image acquisition end is used to determine the strain field data of the alloy sample based on the surface image.

[0019] Optionally, the electric heating system is a current-controlled heating system based on the resistance heating principle.

[0020] Optionally, the loading conditions include: loading stress value, loading duration and loading rate.

[0021] Optionally, the temperature measuring device includes: an infrared thermometer.

[0022] Optionally, the inert gas is argon.

[0023] In a second aspect, the present application provides an alloy creep test method, which is used in the above alloy creep test device, and the alloy creep test method includes:

[0024] Controlling the loading device to apply stress to the alloy sample according to the set loading conditions;

[0025] Controlling the electric heating system to heat the alloy sample so that the alloy sample reaches a set temperature;

[0026] Controlling a digital image correlation system to collect a surface image of the alloy sample under a set loading condition and a set temperature; the surface image is used to determine strain field data of the alloy sample; the strain field data is used to characterize the creep behavior of the alloy sample;

[0027] When the set test time is reached or the alloy sample is broken, the electric heating system is controlled to be disconnected;

[0028] After the electric heating system is disconnected, the cooling system is controlled to introduce an inert gas into the vacuum chamber to cool the alloy sample; the cooled alloy sample is used for dislocation configuration analysis.

[0029] Optionally, the alloy creep test method further includes:

[0030] The temperature change of the alloy sample is obtained in real time.

[0031] According to the specific embodiments provided in this application, this application has the following technical effects:

[0032] The present application provides an alloy creep test device and method, which collects the surface image of the alloy sample under the set loading conditions and set temperature through the Digital Image Correlation (DIC) system, and determines the strain field data of the alloy sample based on the surface image, which can capture the local plastic deformation of the alloy in real time under high temperature environment and obtain high-resolution local area strain field data; through the electric heating system and the cooling system, the temperature is quickly cooled down, and compared with the natural cooling method, the distortion caused by the re-movement of dislocations during the cooling process can be reduced, thereby better retaining the real dislocation configuration of high temperature creep. The present application realizes the synchronous measurement of the local strain field of the alloy and the real dislocation configuration of high temperature creep. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 A structural diagram of an alloy creep test device provided in one embodiment of the present application;

[0035] Figure 2 This is a schematic diagram of the creep test results of an embodiment of the present application;

[0036] Figure 3 Schematic diagram of the test results of traditional creep test.

[0037] Figure numerals: electric heating system—1, vacuum chamber—2, control end—3, temperature measuring device—4, air pump—5, vacuum pump—6, microscope imaging system—7, image acquisition end—8. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0040] In view of the problems existing in conventional creep tests, there is an urgent need for a new type of nickel-based single crystal high-temperature alloy creep test device that can fully retain the true dislocation configuration under high-temperature creep conditions and realize the creep strain characterization of local special structures, thereby more clearly explaining the dislocation deformation mechanism and improving the authenticity of service safety evaluation.

[0041] This application combines digital image correlation (DIC) technology, resistance heating technology and inert gas (such as argon) rapid air cooling technology to build a new creep test platform to solve the above problems. DIC technology can capture the local plastic deformation of single crystal alloys in real time under high temperature environment and obtain high-resolution local area strain field data. Resistance heating technology and inert gas rapid air cooling technology achieve rapid cooling and retain the real dislocation configuration of high temperature creep. The test scheme designed by this application can simultaneously realize local strain field measurement and fully retain the high temperature creep dislocation configuration. The local strain field measurement is realized by DIC technology in the creep test; after the creep test machine test is completed, the resistance heating technology is powered off and coupled with the inert gas rapid air cooling technology to make the sample quickly cool to room temperature to retain the real dislocation configuration under high temperature creep loading conditions. This application plays an important role in optimizing alloy design, clarifying alloy failure mechanism, promoting the development of new alloys, and refining structural design.

[0042] In an exemplary embodiment, Figure 1 As shown, an alloy creep test device is provided, comprising: a digital image correlation system, an electric heating system 1, a vacuum chamber 2, a loading device, a control terminal 3 and a cooling system.

[0043] The loading device and the alloy sample are arranged in the vacuum chamber 2 ; the digital image correlation system, the loading device and the electric heating system 1 are all connected to the control end 3 ; the electric heating system 1 is connected to the vacuum chamber 2 .

[0044] The control terminal 3 is used to control the loading device to load stress to the alloy sample according to the set loading conditions, control the electric heating system 1 to heat the alloy sample so that the alloy sample reaches the set temperature, and control the digital image correlation system to collect the surface image of the alloy sample under the set loading conditions and the set temperature. The loading conditions include: loading stress value, loading duration and loading rate.

[0045] The digital image correlation system is used to collect the surface image of the alloy sample under set loading conditions and set temperature, and determine the strain field data of the alloy sample based on the surface image; the strain field data is used to characterize the creep behavior of the alloy sample.

[0046] The control terminal 3 is also used to control the electric heating system 1 to disconnect when the set test time is reached or the alloy sample is broken.

[0047] The cooling system is used to introduce an inert gas into the vacuum chamber 2 to cool the alloy sample after the electric heating system 1 is disconnected; the cooled alloy sample is used for dislocation configuration analysis. The inert gas may be argon.

[0048] In another exemplary embodiment of the present application, please refer to Figure 1 The alloy creep test device further comprises: a temperature measuring device 4; the temperature measuring device 4 is used to monitor the temperature change of the alloy sample in real time. The temperature measuring device 4 comprises: an infrared thermometer.

[0049] In another exemplary embodiment of the present application, please refer to Figure 1 The cooling system includes: an air pump 5 and a vacuum pump 6; the air pump 5 is connected to the inlet of the vacuum chamber 2; the vacuum pump 6 is connected to the outlet of the vacuum chamber 2; the air pump 5 is used to introduce inert gas into the vacuum chamber 2 after the electric heating system 1 is disconnected; the vacuum pump 6 is used to extract the inert gas in the vacuum chamber 2 after the alloy sample is cooled.

[0050] In another exemplary embodiment of the present application, please refer to Figure 1 The digital image correlation system includes: a microscope imaging system 7 and an image acquisition terminal 8; the microscope imaging system 7 is connected to the image acquisition terminal 8; the microscope imaging system 7 is used to acquire the surface image of the alloy sample under the set loading conditions and the set temperature; the image acquisition terminal 8 is used to determine the strain field data of the alloy sample according to the surface image. The microscope imaging system 7 can be a microscope CCD.

[0051] In another exemplary embodiment of the present application, the electric heating system 1 is a current-controlled heating system based on the principle of resistance heating. In practical applications, the heating current of the electric heating system 1 is usually controlled between a few amperes and tens of amperes, depending on the size of the sample and the stability of the test. For example, for small samples or tests at lower temperatures, the heating current of the electric heating system 1 can be around 5 to 20 amperes; for large samples or tests at higher temperatures (such as more than 1000°C), the heating current of the electric heating system 1 needs to be around 20 to 100 amperes.

[0052] Taking a nickel-based single crystal alloy sample as an example, a test process of the above alloy creep test device is further described in detail below, and the effectiveness of this embodiment is illustrated.

[0053] This embodiment can simultaneously realize the measurement of the local strain field and the complete retention of the high-temperature creep dislocation configuration, and the specific steps are as follows:

[0054] Step 1: Prepare a nickel-based single crystal alloy sample using the Bridgman method, perform solution treatment and aging treatment on the sample, and use sandpaper for surface treatment to make its surface have features suitable for digital image correlation (DIC) system photography.

[0055] Step 2: Configure high-temperature creep test equipment, place the treated nickel-based single crystal alloy sample in the vacuum chamber 2, and install the digital image correlation system, electric heating system 1, air pump 5, vacuum pump 6, loading device and control terminal 3 to monitor the images required by the DIC system in real time and realize ventilation and rapid cooling.

[0056] Step 3: The control terminal 3 sets the loading conditions, determines the loading stress, temperature and duration of the creep experiment, and sets the loading rate and the desired creep conditions.

[0057] Step 4: Start the creep test and DIC system, and take real-time images of the sample surface. Use DIC technology to analyze the displacement and strain of the sample, obtain strain field data under high temperature and loading conditions, and record the creep behavior of the sample in real time. In this embodiment, DIC technology is applied to a creep tester to obtain strain field data.

[0058] Step 5: When the specimen reaches the set test time or ruptures, stop loading and end the creep test.

[0059] Step 6: Quickly disconnect the power supply (i.e. disconnect the electric heating system 1) to achieve rapid cooling. The electric heating system 1 is implemented using the resistance heating principle, which ensures rapid disconnection of the power supply.

[0060] Step 7: Introduce an inert gas (such as argon) into the vacuum chamber 2 to further achieve rapid cooling.

[0061] Step 8: Use an infrared thermometer to monitor the temperature changes of the sample to ensure that thermal stress problems caused by sudden temperature drops are avoided during the cooling process.

[0062] Step 9: After the sample cools down to ambient temperature, open the vacuum chamber 2 and take out the sample.

[0063] Step 10: Perform subsequent analysis and dislocation configuration observations on the cooled specimens. Summarize the data and observations recorded by the DIC technique and analyze the relationship between creep behavior and microstructural changes.

[0064] The rapid cooling technology adopted in this embodiment effectively avoids the dislocation redistribution that may occur during natural cooling after high-temperature creep of nickel-based single crystal high-temperature alloy, thereby better retaining the actual dislocation movement behavior and dislocation configuration at high temperature, and effectively avoiding dislocation distortion; the DIC technology, inert gas rapid cooling technology and resistance heating technology are combined and applied to creep tests to form a new test method that is multi-purpose, high-fidelity in dislocations and meets local testing needs.

[0065] The creep test results of the present invention are as follows: Figure 2As shown, the dislocation motion in the γ channel is still clearly visible (shown in the red circle), and the dislocation network arrangement in the channel is clearly visible (shown in the blue circle). The complete replication retains the real dislocation motion behavior and dislocation configuration.

[0066] The test results of traditional creep test are as follows Figure 3 As shown in the figure, the sample shrinks during the cooling process, resulting in increased stress. The dislocations interact significantly under high stress and cut into the γ′ strengthening phase in large quantities (shown by the blue circles). The dislocation network in the channel is distorted under stress (shown by the red circles).

[0067] At present, nickel-based single crystal high-temperature alloys are widely used in aircraft engines and gas turbine blades. Retaining the high-temperature dislocation configuration of nickel-based single crystal high-temperature alloys, in-depth analysis of the creep plastic deformation behavior and dislocation movement behavior of nickel-based single crystal alloys, it is convenient to optimize the alloy composition design and improve the refined structure design to improve its creep resistance and service safety at high temperatures. This application can also be used for the research and development and analysis of other metal materials, increase the application potential of metal structural materials in various industries, and provide a test method for evaluating the performance retention rate and failure mode during long-term high-temperature use. With the increase in the thrust-to-weight ratio requirements of aircraft engines, the new generation of aircraft engines has higher and higher requirements for the performance of nickel-based single crystal alloy materials for single crystal turbine blades. The performance optimization of nickel-based single crystal high-temperature alloys will provide important theoretical guidance and practical data for the design and manufacture of these high-performance engines, thereby promoting the development of advanced aircraft engines.

[0068] Based on the same inventive concept, the embodiment of the present application also provides an alloy creep test method implemented by using the alloy creep test device mentioned above. The implementation scheme for solving the problem provided by the method is similar to the implementation scheme recorded in the above device, so the specific limitations in one or more alloy creep test method embodiments provided below can refer to the limitations of the alloy creep test device above, and will not be repeated here.

[0069] In an exemplary embodiment, an alloy creep test method is provided, the alloy creep test method is used for the above alloy creep test device, and the alloy creep test method comprises:

[0070] (1) Controlling the loading device to load stress to the alloy sample according to the set loading conditions; controlling the electric heating system 1 to heat the alloy sample so that the alloy sample reaches a set temperature; controlling the digital image correlation system to collect the surface image of the alloy sample under the set loading conditions and the set temperature; the surface image is used to determine the strain field data of the alloy sample; the strain field data is used to characterize the creep behavior of the alloy sample.

[0071] (2) When the set test time is reached or the alloy sample is cracked, the electric heating system 1 is controlled to be disconnected; after the electric heating system 1 is disconnected, the cooling system is controlled to introduce inert gas into the vacuum chamber 2 to cool the alloy sample; the cooled alloy sample is used for dislocation configuration analysis.

[0072] As an optional implementation, the alloy creep test method further includes: acquiring the temperature change of the alloy sample in real time.

[0073] The alloy creep test device and method of the present application have significant progress in observing the behavior of alloys (such as nickel-based single crystal high-temperature alloys) at high temperatures compared to the prior art. Through DIC technology and rapid cooling technology, the limitations of traditional creep testers in high-temperature testing are overcome. The DIC technology is used to accurately measure the continuous data of real-time local strain and displacement distribution of single crystal alloys at high temperatures. This non-contact measurement method can reveal the local effects of special structure specimens under complex loading conditions and provide more accurate stress-strain information. After the test machine is powered off, the sample is quickly cooled by passing an inert gas (such as argon) to the vacuum chamber 2, which helps to retain the true dislocation configuration under high-temperature creep. Compared with the traditional natural cooling method, such a technology can reduce the distortion caused by the re-movement of dislocations during the cooling process, thereby better retaining the creep dislocation configuration under high temperature. The present application plays an important role in clarifying the creep failure mechanism related to dislocations, optimizing alloy design, and refining structural design.

[0074] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0075] This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and core ideas of this application. At the same time, for those skilled in the art, according to the ideas of this application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as limiting this application.

Claims

1. An alloy creep test device, characterized in that: The alloy creep test device comprises: a digital image correlation system, an electric heating system, a vacuum chamber, a loading device, a control terminal and a cooling system; The loading device and the alloy sample are arranged in the vacuum chamber; the digital image correlation system, the loading device and the electric heating system are all connected to the control end; the electric heating system is connected to the vacuum chamber; The control end is used to control the loading device to load stress to the alloy sample according to the set loading conditions, control the electric heating system to heat the alloy sample so that the alloy sample reaches the set temperature, and control the digital image correlation system to collect the surface image of the alloy sample under the set loading conditions and the set temperature; The digital image correlation system is used to collect the surface image of the alloy sample under the set loading conditions and the set temperature, and determine the strain field data of the alloy sample according to the surface image; the strain field data is used to characterize the creep behavior of the alloy sample; The control end is also used to control the electric heating system to disconnect when the set test time is reached or the alloy sample is broken; The cooling system is used to introduce inert gas into the vacuum chamber to cool the alloy sample after the electric heating system is disconnected; the cooled alloy sample is used for dislocation configuration analysis.

2. The alloy creep test device according to claim 1, characterized in that: The alloy creep test device also includes: a temperature measuring device; the temperature measuring device is used to monitor the temperature change of the alloy sample in real time.

3. The alloy creep test device according to claim 1, characterized in that: The cooling system includes: an air pump and a vacuum pump; the air pump is connected to the inlet of the vacuum chamber; the vacuum pump is connected to the outlet of the vacuum chamber; the air pump is used to introduce inert gas into the vacuum chamber after the electric heating system is disconnected; the vacuum pump is used to extract the inert gas in the vacuum chamber after the alloy sample is cooled.

4. The alloy creep test device according to claim 1, characterized in that: The digital image correlation system includes: a microscope imaging system and an image acquisition end; the microscope imaging system is connected to the image acquisition end; the microscope imaging system is used to acquire the surface image of the alloy sample under set loading conditions and set temperature; the image acquisition end is used to determine the strain field data of the alloy sample based on the surface image.

5. The alloy creep test device according to claim 1, characterized in that: The electric heating system is a current-controlled heating system based on the resistance heating principle.

6. The alloy creep test device according to claim 1, characterized in that: The loading conditions include: loading stress value, loading duration and loading rate.

7. The alloy creep test device according to claim 2, characterized in that: The temperature measuring device comprises: an infrared thermometer.

8. The alloy creep test device according to claim 1, characterized in that: The inert gas is argon.

9. A method for testing alloy creep test, characterized in that: The alloy creep test method is used for the alloy creep test device according to any one of claims 1 to 8, and the alloy creep test method comprises: Controlling the loading device to apply stress to the alloy sample according to the set loading conditions; Controlling the electric heating system to heat the alloy sample so that the alloy sample reaches a set temperature; Controlling a digital image correlation system to collect a surface image of the alloy sample under a set loading condition and a set temperature; the surface image is used to determine strain field data of the alloy sample; the strain field data is used to characterize the creep behavior of the alloy sample; When the set test time is reached or the alloy sample is broken, the electric heating system is controlled to be disconnected; After the electric heating system is disconnected, the cooling system is controlled to introduce an inert gas into the vacuum chamber to cool the alloy sample; the cooled alloy sample is used for dislocation configuration analysis.

10. The alloy creep test method according to claim 9, characterized in that: The alloy creep test method also includes: The temperature change of the alloy sample is obtained in real time.

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