Optical chip, photoelectric conversion module, photoelectric sealing chip and optical communication equipment

Abstract

The invention discloses an optical chip, a photoelectric conversion module, a photoelectric sealing chip and optical communication equipment, which are used for reducing the coupling insertion loss of the optical chip and improving the mechanical strength of the optical chip. The optical chip comprises a substrate, a filling layer, a modulation optical waveguide, an electrode, a transmission optical waveguide and at least one optical port optical waveguide, the filling layer is arranged on the surface of the substrate, and the distance between the modulation optical waveguide and the surface of the substrate is smaller than the distance between the optical port optical waveguide and the surface of the substrate in the direction perpendicular to the surface of the substrate. The distance between the transmission optical waveguide and the surface of the substrate is smaller than the distance between the optical port optical waveguide and the surface of the substrate. The electrode is used for forming an electric field, the electric field is used for modulating an optical signal in the modulation optical waveguide to obtain a modulation optical signal, the modulation optical waveguide is used for coupling the modulation optical signal to the transmission optical waveguide, and the transmission optical waveguide is used for coupling the modulation optical signal to the at least one optical port optical waveguide; the transmission optical waveguide and the at least one optical port optical waveguide are used for emitting modulated optical signals.

Description

Technical Field

[0001] The present application relates to the field of optical communication technology, and in particular to an optical chip, an optoelectronic conversion module, an optoelectronic package chip, and an optical communication device. Background Art

[0002] In the application of silicon photonics technology, optical port coupling is an important component of the optical interconnection structure, and its main purpose is to achieve optical transmission between optical chips and optical fibers.

[0003] Figure 1 This is a diagram showing an example of the structure of an existing optical chip. The optical chip 100 includes a substrate 101 and a filling layer 102 located on the surface of the substrate 101. The filling layer 102 includes a modulator 110 and a transmission optical waveguide 111. The modulator 110 is used to modulate an optical signal to emit a modulated optical signal, and couple the modulated optical signal to the transmission optical waveguide 111. The transmission optical waveguide 111 is connected to an external optical fiber 112, and the transmission optical waveguide 111 couples the modulated optical signal to the external optical fiber 112. In order to reduce the coupling insertion loss of the optical chip 100 coupling the modulated optical signal to the external optical fiber 112, a portion of the substrate 101 is hollowed out to form a cantilever beam structure 120. The cantilever beam structure 120 is located at the bottom of the transmission optical waveguide 111. Since the cantilever beam structure 120 reduces the magnitude of the optical power of the modulated optical signal leaking to the substrate 101, the coupling insertion loss of the optical chip 100 coupling the modulated optical signal to the external optical fiber 112 is reduced.

[0004] However, because a portion of the substrate 101 is hollowed out to form the cantilever beam structure 120, the mechanical strength of the optical chip is reduced. In addition, during the process of packaging the optical chip, impurities (such as glue, etc.) will penetrate into the cantilever beam structure 120, and the penetrated impurities will increase the coupling insertion loss of the optical chip. Summary of the invention

[0005] The embodiments of the present application provide an optical chip, an optoelectronic conversion module, an optoelectronic package chip, and an optical communication device, which are used to reduce the coupling insertion loss of the optical chip while improving the mechanical strength of the optical chip.

[0006] In a first aspect, an embodiment of the present application provides an optical chip, including a substrate, a filling layer, a modulated optical waveguide, an electrode, a transmission optical waveguide, and at least one optical port optical waveguide, wherein the filling layer is arranged on the surface of the substrate, the modulated optical waveguide, the electrode, the transmission optical waveguide, and the at least one optical port optical waveguide are all located in the filling layer, the electrode connects the modulated optical waveguide, and any two optical waveguides among the modulated optical waveguide, the transmission optical waveguide, and the at least one optical port optical waveguide are separated from each other in the filling layer, and the modulated optical waveguide and the at least one optical port optical waveguide are separated from each other in the direction perpendicular to the surface of the substrate. The distance between the optical waveguide and the substrate surface is smaller than the distance between the optical port optical waveguide and the substrate surface, and the distance between the transmission optical waveguide and the substrate surface is smaller than the distance between the optical port optical waveguide and the substrate surface; the electrode is used to form an electric field, the electric field is used to modulate the optical signal in the modulated optical waveguide to obtain a modulated optical signal, the modulated optical waveguide is used to couple the modulated optical signal to the transmission optical waveguide, the transmission optical waveguide is used to couple the modulated optical signal to the at least one optical port optical waveguide, and the transmission optical waveguide and the at least one optical port optical waveguide are used to emit the modulated optical signal.

[0007] According to the present invention, the substrate does not need to adopt a cantilever beam structure, so the strength of the mechanical structure of the optical chip is effectively improved, and in the process of packaging the optical chip, impurities (such as glue, etc.) will not penetrate into the substrate structure, effectively reducing the coupling insertion loss of the optical chip optical port to the external optical fiber coupling modulated optical signal, and improving the product yield and reliability of the optical chip. In addition, at least one optical port optical waveguide effectively increases the mode spot diameter of the modulated optical signal and improves the coupling efficiency of the modulated optical signal to the external optical fiber.

[0008] Based on the first aspect, in an optional implementation, the at least one optical port optical waveguide includes a target optical port optical waveguide, the target optical port optical waveguide has a first orthographic projection on the substrate surface, and the transmission optical waveguide has a second orthographic projection on the substrate surface, and the second orthographic projection and the first orthographic projection at least partially overlap.

[0009] As shown in this implementation, when the first orthographic projection and the second orthographic projection at least partially overlap, it is effectively ensured that the optical chip successfully couples the modulated optical signal to the external optical fiber, thereby improving the success rate of coupling the modulated optical signal to the external optical fiber.

[0010] Based on the first aspect, in an optional implementation manner, the surface of the substrate includes a buried oxide layer BOX, the BOX is located between the substrate and the filling layer, and the modulated optical waveguide is arranged on the surface of the BOX away from the substrate.

[0011] By adopting this implementation, the size of each optical port optical waveguide and the distance between two adjacent optical port optical waveguides are not limited by the size of the modulation optical waveguide, the transmission optical waveguide and the electrode.

[0012] Based on the first aspect, in an optional implementation, the optical chip includes a plurality of the optical port optical waveguides, and along a direction perpendicular to the substrate surface, the plurality of optical port optical waveguides are arranged in an ascending order of distance from the substrate surface.

[0013] As shown in the present implementation, when the multiple optical port waveguides are arranged in order of distance from the substrate surface from small to large, the mode spot diameter of the modulated optical signal is effectively improved, the coupling efficiency of the modulated optical signal to the external optical fiber is improved, and the coupling insertion loss is reduced.

[0014] Based on the first aspect, in an optional implementation, the optical chip includes a plurality of the optical port optical waveguides, and along a direction parallel to the substrate surface, two optical port optical waveguides among the plurality of optical port optical waveguides are separated from each other in the filling layer.

[0015] As shown in the present implementation, two of the multiple optical port optical waveguides are separated from each other in the filling layer along a direction parallel to the surface of the substrate, which effectively improves the mode spot diameter of the modulated optical signal, improves the coupling efficiency of the modulated optical signal to the external optical fiber, and reduces the coupling insertion loss.

[0016] Based on the first aspect, in an optional implementation manner, along a direction perpendicular to the substrate surface, a distance between the modulation optical waveguide and the substrate surface is smaller than a distance between the transmission optical waveguide and the substrate surface.

[0017] As shown in this implementation, along the direction perpendicular to the substrate surface, the distance between the modulated optical waveguide and the substrate surface is smaller than the distance between the transmission optical waveguide and the substrate surface, which effectively ensures that the modulated optical waveguide successfully couples the modulated optical signal to the optical port of the optical chip.

[0018] Based on the first aspect, in an optional implementation, the mode spot of the modulated optical signal transmitted by the transmission optical waveguide and the at least one optical port optical waveguide has a first axial center, the external optical fiber has a second axial center, and the first axial center is aligned with the second axial center.

[0019] According to the implementation, when the first axial center is aligned with the second axial center, the success rate of coupling the modulated optical signal from the optical chip to the external optical fiber is improved.

[0020] Based on the first aspect, in an optional implementation manner, a refractive index of any one of the modulation optical waveguide, the transmission optical waveguide and the at least one optical port optical waveguide is greater than a refractive index of the filling layer.

[0021] As shown in the present implementation, when the refractive index of any one of the modulated optical waveguide, the transmission optical waveguide and the at least one optical port optical waveguide is greater than the refractive index of the filling layer, it is effectively ensured that the modulated optical signal emitted by the modulated optical waveguide can be successfully coupled to the optical port of the optical chip, and the optical port can successfully couple the modulated optical signal to the external optical fiber.

[0022] Based on the first aspect, in an optional implementation manner, the optical port optical waveguide has a rectangular structure, a diamond structure or a gradient structure.

[0023] As shown in this implementation, the diameter and / or shape of the mode spot of the modulated optical signal can be changed by changing the shape of the optical waveguide at the optical port.

[0024] In a second aspect, an embodiment of the present application provides a photoelectric conversion module, comprising an electronic integrated circuit EIC and an optical chip as described in any one of the first aspects above, wherein the EIC is connected to the optical chip.

[0025] In a third aspect, an embodiment of the present application provides an optoelectronic package chip, including a substrate, a logic processing chip, and a photoelectric conversion module as shown in the second aspect.

[0026] In a fourth aspect, an embodiment of the present application provides an optical communication device, comprising an outer shell, a circuit board, a processing chip, a connector, and a photoelectric conversion module as described in the second aspect, wherein the circuit board is fixed inside the outer shell, the processing chip is connected to the circuit board, and the connector is respectively connected to the processing chip and the photoelectric conversion module; the processing chip is used to send a first electrical signal to the photoelectric conversion module through the connector, the photoelectric conversion module is used to modulate the first electrical signal on a first optical signal to obtain the modulated optical signal, and the photoelectric conversion module is used to emit the modulated optical signal; or, the photoelectric conversion module is used to receive a second optical signal, convert the second optical signal into a second electrical signal, and send the second electrical signal to the processing chip through the connector.

[0027] In a fifth aspect, an embodiment of the present application provides an optical network, which includes a plurality of optical communication devices as shown in the fourth aspect above. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 This is a diagram showing an example of the structure of an existing optical chip;

[0029] Figure 2A structural example diagram of an optical network provided in this application;

[0030] Figure 3 A structural example diagram of an optical communication device provided in this application;

[0031] Figure 4 This is a diagram showing a first structural example of a photoelectric conversion module provided in this application;

[0032] Figure 5 This is a side structural example diagram of an embodiment of the optical chip provided in this application;

[0033] Figure 6 This is an example diagram of the cross-sectional structure of the first embodiment of the optical chip optical port provided in the present application;

[0034] Figure 7a This is a top view of the structure of the second embodiment of the optical chip optical port provided in the present application;

[0035] Figure 7b This is a top view of the structure of the third embodiment of the optical chip optical port provided in the present application;

[0036] Figure 7c This is a top view of the structure of the fourth embodiment of the optical chip optical port provided in the present application;

[0037] Figure 8a This is an example diagram of the cross-sectional structure of the second embodiment of the optical chip optical port provided in the present application;

[0038] Figure 8b This is an example diagram of the cross-sectional structure of the second embodiment of the optical chip optical port provided in the present application;

[0039] Figure 8c This is an example diagram of the cross-sectional structure of the third embodiment of the optical chip optical port provided in the present application;

[0040] Figure 8d This is an example diagram of the cross-sectional structure of the fourth embodiment of the optical chip optical port provided in the present application;

[0041] Figure 8e This is an example diagram of the cross-sectional structure of the fifth embodiment of the optical chip optical port provided in the present application;

[0042] Figure 8f This is an example diagram of the cross-sectional structure of the sixth embodiment of the optical chip optical port provided in the present application;

[0043] Figure 9a This is a cross-sectional structural example diagram of the seventh embodiment of the optical chip optical port provided in the present application;

[0044] Figure 9bThis is an example diagram of the cross-sectional structure of the eighth embodiment of the optical chip optical port provided in the present application;

[0045] Fig.10 Another side view structure example diagram of an optical chip provided in the present application;

[0046] Fig.11a A second structural example diagram of the photoelectric conversion module provided in this application;

[0047] Fig.11b This is a third structural example diagram of the photoelectric conversion module provided in this application;

[0048] Fig.12 This is an example diagram of the structure of the optoelectronic package chip provided in this application;

[0049] Fig.13 This is an example diagram of the structure of an embodiment of the optical communication equipment provided in this application. DETAILED DESCRIPTION

[0050] The embodiment of the present application provides an optical chip, which is used to reduce the coupling insertion loss of the optical chip and improve the mechanical strength of the optical chip. The coupling insertion loss refers to the loss in the process of transmitting optical signals between the optical chip and the external optical fiber.

[0051] The optical chip provided in the embodiment of the present application is packaged in an optical communication device, and the optical communication device is applied to an optical network. Figure 2A structural example diagram of an optical network provided in the present application. The optical network 200 includes a first optical communication device 201 and a second optical communication device 202. The first optical communication device 201 and the second optical communication device 202 are connected via an external optical fiber. This example does not limit the number of optical communication devices included in the optical network 200. For example, the first optical communication device 201 can be connected to multiple second optical communication devices 202 via an optical splitter. This example does not limit the networking type of the optical network. For example, the optical network can adopt a ring network or a star network. This example does not limit the type of network to which the optical network 200 is applied. For example, if the optical network 200 shown in this example is applied to a passive optical network (PON), one of the first optical communication device 201 and the second optical communication device 202 may be an optical network unit (ONU) or an optical network terminal (ONT), and the other optical communication device in the first optical communication device 201 and the second optical communication device 202 may be an optical line terminal (OLT). If the optical network 200 is applied to an optical transport network (OTN), the first optical communication device 201 and the second optical communication device 202 may both be OTN devices. The optical network 200 shown in this example may also be applied to a data center network (DCN) or a metropolitan area network, etc., without specific limitation. Taking the first optical communication device 201 as an example, this example does not limit the device type of the first optical communication device 201. For example, the first optical communication device 201 can be an optical transmission device, an optical access device, a router, a switch, a wireless base station, a wireless remote access device, a wireless baseband signal processing device, etc. It can also be a computing server (usually referred to as a server), a high performance computer (HPC), a storage server, or a memory resource pool, etc. This example does not limit the type of the first optical communication device 201, as long as the first optical communication device 201 has an electrical-optical conversion function and an optical interface that can be connected to an optical fiber. For the description of the type of the second optical communication device 202, please refer to the description of the first optical communication device 201, and the specific details will not be repeated.

[0052] Figure 3 This is a structural example diagram of the optical communication equipment provided in this application. Figure 3 The optical communication device shown is Figure 2The first optical communication device 201 shown in the figure is taken as an example. The first optical communication device 201 includes a device single board 301 and one or more photoelectric conversion modules 302. Among them, the photoelectric conversion module 302 can also be called an optical transceiver module or an optical module. This example does not limit the number of device single boards 301 included in the first optical communication device 201. The device single board 301 and the first optical communication device 201 are integrated devices, or the device single board 301 is an independent pluggable single board. This example does not limit the number of photoelectric conversion modules 302 included in the first optical communication device 201. The photoelectric conversion module 302 can be integrated with the device single board 301 or can be plugged in the single board of the device single board 301, etc., and there is no specific limitation. Specifically, the device single board 301 includes a circuit board and a processing chip 312 packaged on the circuit board. This embodiment takes the circuit board as a printed circuit board (PCB) as an example, and the type of the circuit board is not specifically limited. The connector 311 is connected to the processing chip 312 and the photoelectric conversion module 302 respectively. The connector 311 and the processing chip 312 shown in this embodiment can be connected through the conductive traces of the circuit board, or the connector 311 and the processing chip 312 can be connected through a conductive cable, which is not limited in this embodiment. This embodiment does not limit the packaging form of the optoelectronic conversion module 302. For example, the packaging form of the optoelectronic conversion module 302 can be an optical transceiver board (OTB), a near package optical module (NPO), an on board optical module (OBO) based on the optical input & output interface (OIO) technology, or a co-package optical module (CPO).

[0053] The processing chip 312 may be one or more chips, or one or more integrated circuits. For example, the processing chip 312 may be one or more optical digital signal processors (oDSP), field-programmable gate arrays (FPGA), application-specific integrated circuits (ASIC), system on chip (SoC), central processor unit (CPU), network processor (NP), microcontroller unit (MCU), programmable logic device (PLD), network card chip, storage interface chip or other integrated chip, or any combination of the above chips, or processing modules, etc., which will not be described in detail. The processing chip 312 has a transmission (transport, TX) interface 313 and a reception (receive, RX) interface 314, and the TX interface 313 and the RX interface 314 are respectively connected to the connector 311. The connector 311 is used to provide an electrical interface, which realizes a pluggable electrical connection with the photoelectric conversion module 302.

[0054] Figure 4 This is a diagram showing the first structural example of the photoelectric conversion module provided in this application. Figure 4 The photoelectric conversion module 302 shown includes an optical chip 400 and an electronic integrated circuit (EIC) 401. The EIC 401 shown in this embodiment is welded on the surface of the optical chip 400. There is an underfill 402 between the optical chip 400 and the EIC 401, and the solder balls extending from the optical chip 400 pass through the underfill 402 and are welded to the EIC 401. The solder balls shown in this embodiment may also be referred to as solder balls or solder bumps, etc., which are not specifically limited. This embodiment takes the optical chip 400 connecting to one EIC 401 as an example. In other examples, the optical chip 400 may be connected to more than one EIC. This embodiment does not limit the number of EICs connected to the optical chip 400.

[0055] Figure 5 The optical chip 400 shown in this embodiment includes a substrate 501, a filling layer 502, a modulation optical waveguide 503, an electrode 504, a transmission optical waveguide 505 and at least one optical port optical waveguide. Figure 5The diagram shows an example of the structure of the optical chip 400 in the XY plane, wherein the XY plane includes the direction X and the direction Y, the direction X is the transmission direction of the optical signal in the optical chip, the direction Y is the direction perpendicular to the surface of the substrate 501, and the direction X is perpendicular to the direction Y. The surface of the substrate 501 is located in the plane XZ, and the XZ plane includes the direction X and the direction Z, and the direction Z is perpendicular to the direction X and the direction Y, respectively. It can be understood that the structure of the optical chip 400 in the XY plane is the side view structure of the optical chip 400. The structure of the optical chip 400 in the XZ plane is the top view structure of the optical chip 400.

[0056] The type of the substrate 501 shown in this embodiment may be a silicon handle (Si handle) or a ceramic substrate, etc. This embodiment does not limit the type of the substrate 501, as long as the substrate 501 can serve as a mechanical support structure, withstand different working environments, and have sufficient thermal conductivity to quickly transfer the heat generated by the optical chip. The surface of the substrate 501 may include a buried oxide layer (BOX) 505. The BOX 505 is located between the substrate 501 and the filling layer 502, and the silicon on insulator (SOI) crystal of the BOX 505 facing away from the surface of the substrate 501 is used as a modulated optical waveguide 503. The material of the modulated optical waveguide 503 may be single crystal silicon (silicon, Si), silicon nitride (silicon nitride, SiN), lithium niobate (lithium niobate, LiNbO3) or silicon oxide (silica, SiO2), etc. This embodiment takes the modulated optical waveguide 503 as a Si waveguide as an example. The surface of the BOX505 away from the substrate 501 includes the filling layer 502, and the filling layer 502 may be an oxide or a fluoride, etc. Among them, the oxide may be silicon dioxide, magnesium oxide or aluminum oxide, etc. The filling layer 502 shown in this embodiment may include one or more layers of plates, and conductive traces are arranged on one side or both sides of each plate. Through silicon vias (TSV) are provided through the filling layer 502 along the direction Y. The EIC encapsulated on the surface of the optical chip is connected to the TSV. The TSV is also connected to the conductive traces in the filling layer 502, and the electrode 504 in the filling layer 502 is connected to the conductive traces. It can be understood that the electrode 504 is connected to the EIC through the conductive traces and the TSV. The modulated optical waveguide 503 in the filling layer 502 is connected to the conductive traces in the filling layer 502, so the modulated optical waveguide 503 is connected to the electrode 504 through the conductive traces. The electrode 504 is used to generate an electric field under the drive of the EIC, and the electric field generated by the electrode 504 is used to modulate the optical signal transmitted by the modulated optical waveguide 503 to obtain a modulated optical signal. The modulated optical waveguide 503 is used to couple the modulated optical signal to the transmission optical waveguide 505. For the description of the material of the transmission optical waveguide 505, please refer to the description of the material of the modulated optical waveguide 503. The details are not repeated here. In this embodiment, the transmission optical waveguide 505 is an SiN waveguide as an example. In this embodiment, along the direction Y, there is a first distance between the modulated optical waveguide 503 and the surface of the substrate 501, and there is a second distance between the transmission optical waveguide 505 and the surface of the substrate 501. Figure 5 As shown, the first distance is smaller than the second distance. The modulated optical waveguide 503 couples the modulated optical signal to the transmission optical waveguide 505 through evanescent wave coupling.

[0057] The optical port of the optical chip shown in this embodiment includes a transmission optical waveguide 505 and at least one optical port optical waveguide. This embodiment does not limit the number of optical port optical waveguides included in the optical port of the optical chip. This embodiment takes the optical port of the optical chip as an example, including three optical port optical waveguides, namely, the first optical port optical waveguide 521, the second optical port optical waveguide 522, and the third optical port optical waveguide 523. For the description of the material of the optical port optical waveguide shown in this embodiment, please refer to the description of the material of the modulation optical waveguide 503. This embodiment takes the modulation optical waveguide 503 as an SiN waveguide as an example. The first optical port optical waveguide 521, the second optical port optical waveguide 522, and the third optical port optical waveguide 523 are arranged in order from small to large according to the distance between them and the surface of the substrate 501. Specifically, the first optical port optical waveguide 521 has a third distance from the surface of the substrate 501, the second optical port optical waveguide 522 has a fourth distance from the surface of the substrate 501, and the third optical port optical waveguide 523 has a fifth distance from the surface of the substrate 501. The first distance, the second distance, the third distance, the fourth distance, and the fifth distance increase in sequence. In this embodiment, the modulated optical waveguide 503 couples the modulated optical signal to the transmission optical waveguide 505 through evanescent wave coupling, the transmission optical waveguide 505 couples the modulated optical signal to the first optical port optical waveguide 521 through evanescent wave coupling, the first optical port optical waveguide 521 couples the modulated optical signal to the second optical port optical waveguide 522 through evanescent wave coupling, and the second optical port optical waveguide 522 couples the modulated optical signal to the third optical port optical waveguide 523 through evanescent wave coupling.

[0058] Optionally, in order to ensure that the modulated optical signal transmitted by the transmission optical waveguide 505 is successfully coupled to the first optical port optical waveguide 521, the first orthographic projection and the second orthographic projection of the optical chip along the direction Y shown in this embodiment at least partially overlap. Among them, the first orthographic projection is the orthographic projection of the target optical port optical waveguide on the surface of the substrate 501. In this embodiment, the target optical port optical waveguide is the first optical port optical waveguide 521 as an example. The second orthographic projection is the orthographic projection of the transmission optical waveguide 505 on the surface of the substrate 501, and the second orthographic projection and the first orthographic projection at least partially overlap. The first orthographic projection refers to the orthographic projection formed on the surface of the substrate 501 by irradiating the first optical port optical waveguide 521 with multiple projection lines parallel to each other, and each projection line is parallel to the surface of the substrate 501. For the description of the second orthographic projection, please refer to the description of the first orthographic projection, and the details will not be repeated. In this embodiment, when the first orthographic projection and the second orthographic projection at least partially overlap, it means that along the direction Y, the transmission optical waveguide 505 and the first optical port optical waveguide 521 at least partially overlap, which effectively ensures that the modulated optical signal transmitted by the transmission optical waveguide 505 can be successfully evanescently coupled to the first optical port optical waveguide 521. In this embodiment, the first orthographic projection is taken as an orthographic projection of the first optical port optical waveguide 521 as an example, without limitation, and the first orthographic projection can be an orthographic projection corresponding to any optical port optical waveguide included in the optical chip.

[0059] In this embodiment, the optical port of the optical chip 400 is connected to the external optical fiber 530. To achieve the purpose of coupling the modulated optical signal from the optical chip 400 to the external optical fiber 530, the refractive index of any one of the modulated optical waveguide 503, the transmission optical waveguide 505, the first optical port optical waveguide 521, the second optical port optical waveguide 522, and the third optical port optical waveguide 523 is greater than the refractive index of the filling layer 502, so as to ensure that the modulated optical signal emitted by the modulated optical waveguide 503 can be successfully coupled to the optical port of the optical chip 400, and the optical port can successfully couple the modulated optical signal to the external optical fiber 530. Specifically, the modulated optical waveguide 503 couples the modulated optical signal to the transmission optical waveguide 505. The transmission optical waveguide 505 couples part of the modulated optical signal transmitted by itself to the first optical port optical waveguide 521. Similarly, the first optical port optical waveguide 521 couples part of the modulated optical signal transmitted by itself to the second optical port optical waveguide 522. The second optical port optical waveguide 522 couples part of the modulated optical signal transmitted by itself to the third optical port optical waveguide 523. It can be understood that the optical port of the optical chip specifically includes the transmission optical waveguide 505, the first optical port optical waveguide 521, the second optical port optical waveguide 522 and the third optical port optical waveguide 523, which are used to transmit the modulated optical signal. In order to achieve the purpose of coupling the modulated optical signal to the external optical fiber 530, the optical port of the optical chip needs to be coupled to the external optical fiber 530. Specifically, the modulated optical signal pattern spot transmitted by the optical port of the optical chip has a first axial center, wherein the first axial center refers to the pattern spot of the modulated optical signal transmitted by the optical port of the optical chip, and the center along the direction X. The external optical fiber 530 has a second axial center, and the second axial center refers to the center of the external optical fiber 530 along the direction X. In order to achieve the purpose of successfully coupling the modulated optical signal from the optical port of the optical chip to the external optical fiber 530, the first axial center and the second axial center shown in this embodiment are aligned. It should be clear that this embodiment takes the alignment of the first axial center and the second axial center as an example. In other examples, the first axial center and the second axial center can be staggered by a certain distance, as long as the optical port of the optical chip can successfully couple the modulated optical signal to the external optical fiber.

[0060] Combination Figure 5 as well as Figure 6 As shown, Figure 6 This is a cross-sectional structure diagram of the first embodiment of the optical chip optical port provided in this application. Figure 5 The cut section 540 shown cuts the optical port of the optical chip to obtain Figure 6As shown in the cross section, it can be understood that the cross section 540 is parallel to the plane YZ. The optical port shown in this embodiment includes a first optical port optical waveguide 521, a second optical port optical waveguide 522 and a third optical port optical waveguide 523. The first optical port optical waveguide 521, the second optical port optical waveguide 522 and the third optical port optical waveguide 523 shown in this example are separated from each other along the direction Y. The optical port optical waveguide included in the optical chip 400 shown in this embodiment can improve the mode spot diameter (mode spot diameter) of the modulated optical signal transmitted by the optical port. Among them, the mode spot diameter can also be referred to as the mode field diameter (mode field diameter). The mode spot diameter of the modulated optical signal transmitted by the optical port refers to a physical quantity of the light energy distribution of the modulated optical signal transmitted by the optical port of the optical chip 400 on the cross section of the optical chip, and the cross section of the optical chip is parallel to the plane YZ (that is, the plane including the direction Y and the direction Z). In the case where the optical port of the optical chip 400 shown in the present embodiment includes a plurality of optical port waveguides separated at positions along the Y direction, the mode spot diameter of the modulated optical signal transmitted by the optical port is improved, the coupling efficiency of the optical port of the optical chip to couple the modulated optical signal to the external optical fiber 530 is effectively improved, and the coupling insertion loss is effectively reduced. Among them, the coupling efficiency refers to the ratio of the optical power of the modulated optical signal coupled to the external optical fiber by the optical port of the optical chip to the optical power of the modulated optical signal transmitted by the optical port of the optical chip. With the optical chip shown in the present embodiment, the substrate does not need to adopt a cantilever beam structure, so the strength of the mechanical structure of the optical chip is effectively improved, and in the process of packaging the optical chip, impurities (such as glue, etc.) will not penetrate into the substrate structure, which effectively reduces the coupling insertion loss of the modulated optical signal coupled from the optical port of the optical chip to the external optical fiber, ensuring that the optical chip shown in the present embodiment is compatible with various types of packaging processes, and improving the product yield and reliability of the optical chip.

[0061] Continue to see Figure 5As shown, along the direction X, the modulated optical waveguide 503 and the optical ports of the optical chip (i.e., including the transmission optical waveguide 505, the first optical port optical waveguide 521, the second optical port optical waveguide 522, and the third optical port optical waveguide 523) are located on both sides of the filling layer 502, so the length of each optical port optical waveguide along the X direction is not limited by the position of the modulated optical waveguide 503. The distance between the modulated optical waveguide 503 and the surface of the substrate 501 is smaller than the distance between each optical port optical waveguide and the surface of the substrate 501, and the distance between the transmission optical waveguide 505 and the surface of the substrate 501 is smaller than the distance between each optical port optical waveguide and the surface of the substrate 501. Along the direction Y, the position where the modulated optical waveguide 503 is deposited and the position where the transmission optical waveguide 505 is deposited are different from the position where each optical port optical waveguide is deposited, so the height of each optical port optical waveguide along the direction Y is not limited by the height of the modulated optical waveguide 503 along the direction Y, nor is it limited by the height of the transmission optical waveguide 505 along the direction Y. Moreover, the height of each optical port optical waveguide along the direction Y will not be limited by the height of the electrode 504 along the direction Y. Similarly, the width of each optical port optical waveguide along the X direction and the width along the Z direction are not limited by the size of the modulation optical waveguide 503, the transmission optical waveguide 505 and the electrode 504. The spacing between two adjacent optical port optical waveguides along the direction Y, the spacing along the Z direction and the spacing along the X direction are not limited by the size of the modulation optical waveguide 503, the transmission optical waveguide 505 and the electrode 504. In this embodiment, the height of each optical port optical waveguide along the direction Y, the length along the X direction, the length along the Z direction, the spacing between two adjacent optical port optical waveguides along the direction Y, the spacing along the Z direction and the spacing along the X direction can all be freely adjusted according to process requirements. Among them, at least one of the height of each optical port optical waveguide along direction Y, the length along direction X, the length along direction Z, the spacing between two adjacent optical port optical waveguides along direction Y, the spacing along direction Z, and the spacing along direction X is related to the diameter and shape of the mode spot of the modulated optical signal transmitted by the optical port. That is, by changing at least one of the height of each optical port optical waveguide along direction Y, the length along direction X, the length along direction Z, the spacing between two adjacent optical port optical waveguides along direction Y, the spacing along direction Z, and the spacing along direction X, the diameter and shape of the mode spot of the modulated optical signal transmitted by the optical port can be changed.

[0062] This embodiment does not limit the shape of each optical waveguide included in the optical port of the optical chip. For example, Figure 7a This is a top view structural example diagram of the second embodiment of the optical chip optical port provided in the present application. Figure 7a The structure of the optical port of the optical chip in the XZ plane is shown, and the structure of the optical port of the optical chip in the XZ plane is the top view structure of the optical port of the optical chip. Figure 7aIn the example shown, the first orthographic projection of the first optical port optical waveguide 521 is located between the third orthographic projection of the second optical port optical waveguide 522 and the fourth orthographic projection of the third optical port optical waveguide 523. The second orthographic projection of the transmission optical waveguide 505 at least partially overlaps with the first orthographic projection. The transmission optical waveguide 505 shown in this example is divided into a first end 701 and a second end 702 along the direction X, the second end 702 faces the first optical port optical waveguide 521, and the first end 701 faces away from the first optical port optical waveguide 521. The first end 701 is a rectangular structure in the XZ plane, and the second end 702 is a gradual structure, for example, the width of the second end 702 along the Z direction gradually narrows (taper). The width of the end of each optical port optical waveguide facing away from the transmission optical waveguide 505 in the Z direction gradually narrows in the direction away from the transmission optical waveguide 505. When the second end portion 702 is in a gradual structure, the coupling efficiency of the transmission optical waveguide 505 to couple the modulated optical signal to the optical port optical waveguide is improved.

[0063] Figure 7b This is a top view structural example diagram of the third embodiment of the optical chip optical port provided in the present application. Figure 7b The structure of the optical port of the optical chip in the XZ plane is shown, and the structure of the optical port of the optical chip in the XZ plane is a top-down structure of the optical port of the optical chip. Figure 7b For a description of the positions of the transmission optical waveguide 505, the first optical port optical waveguide 521, the second optical port optical waveguide 522 and the third optical port optical waveguide 523, see Figure 7a For the structure of the transmission optical waveguide 505 shown in this example, please refer to Figure 7a As shown, the details are not repeated here. Taking the first optical port optical waveguide 521 as an example, the first optical port optical waveguide 521 includes a third end and a fourth end, the third end is the end of the first optical port optical waveguide 521 facing the transmission optical waveguide 505, and the fourth end is the end of the first optical port optical waveguide 521 facing away from the transmission optical waveguide 505. The third end and the fourth end shown in this example are both in a gradual structure, that is, the width of the third end in the Z direction gradually narrows in the direction away from the fourth end, and similarly, the width of the fourth end in the Z direction gradually narrows in the direction away from the third end. For the description of the structures of the second optical port optical waveguide 522 and the third optical port optical waveguide 523, please refer to the description of the structure of the first optical port optical waveguide 521, and the details are not repeated here.

[0064] Figure 7c This is a top view structural example diagram of the fourth embodiment of the optical chip optical port provided in the present application. Figure 7c The structure of the optical port of the optical chip in the XZ plane is shown, and the structure of the optical port of the optical chip in the XZ plane is the top view structure of the optical port of the optical chip. Figure 7cFor a description of the positions of the transmission optical waveguide 505, the first optical port optical waveguide 521, the second optical port optical waveguide 522 and the third optical port optical waveguide 523, see Figure 7a For the structure of the transmission optical waveguide 505 shown in this example, please refer to Figure 7a As shown, the details are not repeated. The first optical port optical waveguide 521, the second optical port optical waveguide 522 and the third optical port optical waveguide 523 are all rectangular structures. It should be clear that the above example of the structure of the optical port optical waveguide in the XZ plane is an optional example and is not limited. For example, the structure of the optical port optical waveguide in the XZ plane may also be a square structure or a diamond structure, etc., which is not specifically limited. The above example takes the example that different optical port optical waveguides have the same structure in the XZ plane. In other examples, the shapes of different optical port optical waveguides may also be different. The shape of the transmission optical waveguide 505 and each optical port optical waveguide shown in this embodiment is related to the shape and / or size of the mode spot of the modulated optical signal coupled from the optical port to the external optical fiber, that is, the shape and / or size of the mode spot of the modulated optical signal coupled from the optical port to the external optical fiber can be changed by changing the shape of the transmission optical waveguide 505 and each optical port optical waveguide.

[0065] This embodiment does not limit the number of optical port optical waveguides included in the optical port of the optical chip. For example Figure 8a As shown, Figure 8a The cross-sectional structure of the second embodiment of the optical port of the optical chip provided in this application is shown in FIG. Figure 8a For an explanation of the cross-sectional structural example diagrams shown, see Figure 6 The description of the cross-sectional structure example diagram is not repeated in detail. The optical chip shown in this embodiment includes multiple optical port optical waveguides, which are arranged in three regions along the direction Z, namely region 801, region 802 and region 803. Region 801, region 802 and region 803 are arranged along the direction Z. Figure 8a In the example shown, one optical port optical waveguide is arranged in region 801, three optical port optical waveguides are arranged in region 802, and one optical port optical waveguide is arranged in region 803. Figure 8b This is an example diagram of the cross-sectional structure of the second embodiment of the optical chip optical port provided in the present application. Figure 8b For descriptions of included areas 801, 802, and 803, see Figure 8a As shown, the details are not repeated here. Figure 8b In the example shown, one optical port optical waveguide is arranged in region 801, two optical port optical waveguides are arranged in region 802, and one optical port optical waveguide is arranged in region 803. Figure 8c This is an example diagram of the cross-sectional structure of the third embodiment of the optical chip optical port provided in the present application. Figure 8cFor descriptions of included areas 801, 802, and 803, see Figure 8a As shown, the details are not repeated here. Figure 8c In the example shown, three optical port waveguides are arranged in region 801, three optical port waveguides are arranged in region 802, and one optical port waveguide is arranged in region 803. Figure 8d This is an example diagram of the cross-sectional structure of the fourth embodiment of the optical chip optical port provided in the present application.

[0066] Figure 8d For descriptions of included areas 801, 802, and 803, see Figure 8a As shown, the details are not repeated here. Figure 8d In the example shown, two optical port waveguides are arranged in region 801, one optical port waveguide is arranged in region 802, and one optical port waveguide is arranged in region 803. Figure 8e This is an example diagram of the cross-sectional structure of the fifth embodiment of the optical chip optical port provided in the present application. Figure 8e For descriptions of included areas 801, 802, and 803, see Figure 8a As shown, the details are not repeated here. Figure 8e In the example shown, three optical port waveguides are arranged in region 801, one optical port waveguide is arranged in region 802, and one optical port waveguide is arranged in region 803. Figure 8f This is an example diagram of the cross-sectional structure of the sixth embodiment of the optical chip optical port provided in the present application. Figure 8f For descriptions of included areas 801, 802, and 803, see Figure 8a As shown, the details are not repeated here. Figure 8f In the example shown, two optical port waveguides are arranged in region 801, two optical port waveguides are arranged in region 802, and one optical port waveguide is arranged in region 803. It should be noted that the above embodiment does not limit the number of optical port waveguides arranged in each region 801, region 802, and region 803.

[0067] Figures 8a to 8f Take the optical chip optical port as an example, which includes three areas along the direction Z. Figure 9a In the example shown, the optical chip optical port may include two regions along the direction Z. Figure 9a The seventh embodiment of the cross-sectional structure of the optical port of the optical chip provided in this application is shown in FIG. Figure 9a For an explanation of the cross-sectional structural example diagrams shown, see Figure 8aThe description of the cross-sectional structure example diagram is omitted. The optical chip shown in this embodiment includes multiple optical port optical waveguides arranged along the direction Z in two regions, namely region 901 and region 902. Region 901 and region 902 are arranged along the direction Z. Figure 9a In the example shown, three optical port waveguides are arranged in region 901 , and one optical port waveguide is arranged in region 902 . Figure 9b This is an example diagram of the cross-sectional structure of the eighth embodiment of the optical chip optical port provided in the present application. Figure 9b For a description of the included area 901 and area 902, see Figure 9a As shown, the details are not repeated here. Figure 9b In the example shown, three optical waveguides with optical ports are arranged in region 901, and one optical waveguide with optical port is arranged in region 902. It should be noted that the number of regions where optical ports of the optical chip are arranged along direction Z is not limited in this embodiment.

[0068] In the above embodiments, the optical chip is used to couple the modulated optical signal to the external optical fiber as an example. In other examples, the optical chip can also receive the optical signal from the external optical fiber. In this example, the filling layer of the optical chip includes a detector, which can be a photodiode (positive intrinsic-negative, PIN) or an avalanche photodiode (APD). The detector is connected to the conductive traces of the filling layer. It can be understood that the detector is connected to the EIC through the conductive traces and TSV. The optical port optical waveguide receives the optical signal from the external optical fiber and couples the optical signal to the transmission optical waveguide. The transmission optical waveguide couples the optical signal to the detector. The detector is used to perform photoelectric conversion on the optical signal to obtain an electrical signal, and send the electrical signal to the EIC through the conductive traces and TSV. For the description of the optical chip structure shown in this example, please refer to the above embodiment, and the details will not be repeated.

[0069] Fig.10 A side view structure example diagram of another embodiment of the optical chip provided in the present application. Fig.10 The optical chip 1000 shown is an example diagram of the structure of the optical chip in the XY plane. It can be understood that Fig.10 The optical chip 1000 is shown in a side view. For a description of the substrate, filling layer, modulated optical waveguide and electrodes included in the optical chip shown in this embodiment, please refer to Figure 5The corresponding description is not repeated in detail. The optical chip 1000 shown in this embodiment includes N optical ports, namely optical port 1001, optical port 1002 to optical port 100N, and N shown in this embodiment is an arbitrary integer greater than 1. Each optical port included in the optical chip 1000 is connected to an external optical fiber. For the description of each optical port structure shown in this embodiment, please refer to the above embodiment, and the details are not repeated here. When the optical chip shown in this embodiment includes multiple optical ports, each optical port can independently couple a modulated optical signal to an external optical fiber. While ensuring the mechanical strength of the optical chip, the coupling insertion loss of the modulated optical signals coupled by the N optical ports can also be reduced.

[0070] The present application also provides a photoelectric conversion module. For a description of the structure of the photoelectric conversion module, see Figure 4 The corresponding description is not repeated here. The photoelectric conversion module provided in the embodiment of the present application can also be found in Fig.11a As shown, Fig.11a This is a second structural example diagram of the photoelectric conversion module provided in this application.

[0071] The photoelectric conversion module 1100 shown in this example adopts a three-dimensional (3D) packaging mode. The photoelectric conversion module 1100 shown in this example includes an optical chip 1101 and two EICs, namely EIC1101 and EIC1102 as examples. This example does not limit the number of EICs included in the photoelectric conversion module. Each EIC included in the photoelectric conversion module is flip-chip soldered to the optical chip 1101, that is, the solder balls led out from the EIC are soldered to the optical chip 1101. The optical chip 1101 is flip-chip soldered to the exchange substrate 1103. The exchange substrate 1103 shown in this embodiment may include one or more layers of plates, and each plate has a single-sided or double-sided layout of conductive traces. This embodiment does not limit the type of plate. For example, the plate may be a paper base, a glass fiber cloth base, a composite base, a ceramic base, a metal core base, etc. Based on the conductive traces of the exchange substrate 1103, the connection between any two optical devices packaged on the exchange substrate 1103 is realized. The EIC shown in this embodiment is flip-chip soldered to the side of the optical chip facing away from the switching substrate 1103. The package of the optical chip 1101 shown in this embodiment also includes TSV1111, based on which the connection between the EIC and the switching substrate is realized. For the description of the optical chip shown in this embodiment, please refer to the above embodiment, and the details are not repeated here. It should be clear that the description of the packaging form of the optoelectronic conversion module in this embodiment is an optional example and is not limited. For example Fig.11b The packaging form of the photoelectric conversion module shown adopts 2.5D packaging form. Fig.11bThis is a third structural example diagram of the photoelectric conversion module provided in this application. The photoelectric conversion module 1120 shown in this embodiment includes an optical chip 1121 and an EIC 1123. This embodiment does not limit the number of EICs included in the photoelectric conversion module 1120. The photoelectric chip 1121 and the EIC 1123 included in the photoelectric conversion module are both flip-chip soldered to the exchange substrate 1122. For a description of the photoelectric chip 1121, the EIC 1123 and the exchange substrate 1122, see Fig.11a As shown, the details are not repeated here.

[0072] The present application also provides a co-packaged-optics (CPO) chip. Fig.12 This is an example diagram of the structure of the optoelectronic packaged chip provided in the present application. The CPO chip includes a switching substrate 1200, a logic processing chip 1202 packaged on the surface of the switching substrate 1200, and a plurality of optoelectronic conversion modules. Among them, the CPO chip refers to the logic processing chip 1202 and the optoelectronic conversion module packaged together. The optoelectronic package shortens the distance between the logic processing chip 1202 and the optoelectronic conversion module, so that the electrical signal can be transmitted faster between the logic processing chip and the optoelectronic conversion module. This embodiment does not limit the number of optoelectronic conversion modules included in the CPO chip. The logic processing chip 1202 and each optoelectronic conversion module are packaged on the same switching substrate 1200 to achieve optoelectronic package of the logic processing chip 1202 and each optoelectronic conversion module, thereby shortening the distance between the logic processing chip 1202 and each optoelectronic conversion module, reducing the power consumption of the logic processing chip 1202 and each optoelectronic conversion module for transmitting electrical signals, and reducing the bit error probability (bit error ratio, BER) of the optical communication device. For a description of the type of logic processing chip 1202 shown in this embodiment, please refer to Figure 3 The description of the corresponding processing chip 312 type is not repeated here. For the description of the photoelectric conversion module shown in this embodiment, please refer to Figure 2 , Fig.11a or Fig.11b As shown, the details are not repeated here.

[0073] The present application also provides an optical communication device. The structure of the optical communication device shown in this embodiment can be seen in Figure 3 The corresponding description is not specifically limited. For example, in other examples, the structure of the optical communication device can also be referred to. Fig.13 As shown, Fig.13This is an example diagram of the structure of an embodiment of the optical communication device provided in the present application. The optical communication device includes an outer shell 1300, a circuit board 1301, a driver 1304, a laser 1303 and a CPO chip 1302. The outer shell 1300 shown in this embodiment is used to fix the circuit board 1301. This embodiment takes the circuit board 1301 as a printed circuit board (PCB) as an example, and the specific type of the circuit board is not limited. The driver 1304, the laser 1303 and the CPO chip 1302 are all packaged on the surface of the PCB1901. For example, at least one of the driver 1304, the laser 1303 and the CPO chip 1302 can be packaged on the surface of the circuit board 1301 by means of a socket. For another example, at least one of the driver 1304, the laser 1303 and the CPO chip 1302 can be packaged on the surface of the circuit board 1301 by means of flip-chip welding, which is not limited in this embodiment. For a description of the CPO chip shown in this embodiment, please refer to Fig.12 The corresponding instructions are not elaborated in detail.

[0074] If the CPO chip 1302 is used to send a first service to another optical communication device, the logic processing chip of the CPO chip 1302 sends a first electrical signal that carries the first service to the optoelectronic conversion module, and the driver 1304 drives the laser 1303 to send a first optical signal to the CPO chip 1302. The optoelectronic conversion module of the CPO chip 1302 receives the first optical signal from the laser 1303, and the optoelectronic conversion module is also used to modulate the first electrical signal on the first optical signal to obtain a modulated optical signal, and the CPO chip 1302 couples the modulated optical signal to an external optical fiber connected to another optical communication device. For another example, the CPO chip 1302 is used to receive a second optical signal from another optical communication device, convert the second optical signal into a second electrical signal, and send the second electrical signal to the processing chip of the optical communication device through a connector.

[0075] The present application also provides an optical network, which includes at least two optical communication devices connected by an external optical fiber. For a description of the optical communication device, see Fig.13 As shown, the details are not repeated here.

[0076] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical chip, characterized in that: The invention comprises a substrate, a filling layer, a modulated optical waveguide, an electrode, a transmission optical waveguide and at least one optical port optical waveguide, wherein the filling layer is arranged on the surface of the substrate, the modulated optical waveguide, the electrode, the transmission optical waveguide and the at least one optical port optical waveguide are all located in the filling layer, the electrode is connected to the modulated optical waveguide, any two optical waveguides among the modulated optical waveguide, the transmission optical waveguide and the at least one optical port optical waveguide are separated from each other in the filling layer, and along the direction perpendicular to the surface of the substrate, the distance between the modulated optical waveguide and the surface of the substrate is smaller than the distance between the optical port optical waveguide and the surface of the substrate, and the distance between the transmission optical waveguide and the surface of the substrate is smaller than the distance between the optical port optical waveguide and the surface of the substrate; The electrode is used to form an electric field, and the electric field is used to modulate the optical signal in the modulated optical waveguide to obtain a modulated optical signal. The modulated optical waveguide is used to couple the modulated optical signal to the transmission optical waveguide, and the transmission optical waveguide is used to couple the modulated optical signal to the at least one optical port optical waveguide. The transmission optical waveguide and the at least one optical port optical waveguide are used to emit the modulated optical signal.

2. The optical chip according to claim 1, characterized in that: The at least one optical port optical waveguide includes a target optical port optical waveguide, the target optical port optical waveguide has a first orthographic projection on the substrate surface, and the transmission optical waveguide has a second orthographic projection on the substrate surface, and the second orthographic projection and the first orthographic projection at least partially overlap.

3. The optical chip according to claim 1 or 2, characterized in that: The surface of the substrate includes a buried oxide layer BOX, the BOX is located between the substrate and the filling layer, and the modulated optical waveguide is arranged on the surface of the BOX facing away from the substrate.

4. The optical chip according to any one of claims 1 to 3, characterized in that: The optical chip comprises a plurality of the optical port optical waveguides, and along a direction perpendicular to the substrate surface, the plurality of optical port optical waveguides are arranged in order of distance from the substrate surface from small to large.

5. The optical chip according to any one of claims 1 to 4, characterized in that: The optical chip comprises a plurality of the optical port optical waveguides, and along a direction parallel to the surface of the substrate, two of the plurality of optical port optical waveguides are separated from each other in the filling layer.

6. The optical chip according to any one of claims 1 to 5, characterized in that: Along a direction perpendicular to the substrate surface, a distance between the modulation optical waveguide and the substrate surface is smaller than a distance between the transmission optical waveguide and the substrate surface.

7. The optical chip according to any one of claims 1 to 6, characterized in that: The mode spot of the modulated optical signal transmitted by the transmission optical waveguide and the at least one optical port optical waveguide has a first axial center, the external optical fiber has a second axial center, and the first axial center is aligned with the second axial center.

8. The optical chip according to any one of claims 1 to 7, characterized in that: The refractive index of any one of the modulation optical waveguide, the transmission optical waveguide and the at least one optical port optical waveguide is greater than the refractive index of the filling layer.

9. The optical chip according to any one of claims 1 to 8, characterized in that: The optical waveguide of the optical port has a rectangular structure, a diamond structure or a gradient structure.

10. A photoelectric conversion module, characterized in that: It comprises an electronic integrated circuit EIC and the optical chip according to any one of claims 1 to 9, wherein the EIC is connected to the optical chip.

11. An optoelectronic package chip, characterized in that: The invention comprises a substrate, a logic processing chip and the photoelectric conversion module according to claim 10, wherein the logic processing chip and the photoelectric conversion module are both connected to the substrate.

12. An optical communication device, characterized in that: It comprises an outer shell, a circuit board, a processing chip, a connector and the photoelectric conversion module according to claim 10, wherein the circuit board is fixed inside the outer shell, the processing chip is connected to the circuit board, and the connector is connected to the processing chip and the photoelectric conversion module respectively; The processing chip is used to send a first electrical signal to the photoelectric conversion module through the connector, the photoelectric conversion module is used to modulate the first electrical signal on the first optical signal to obtain the modulated optical signal, and the photoelectric conversion module is used to emit the modulated optical signal; Alternatively, the photoelectric conversion module is used to receive a second optical signal, convert the second optical signal into a second electrical signal, and send the second electrical signal to the processing chip through the connector.

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