A double-cone multi-port dynamic gas lock device

Abstract

The application discloses a double-cone multi-gas-port dynamic gas lock device, which is characterized by a double-cone pipeline configuration, wherein the cross section shape of a central light hole passage of the pipeline is double-cone, and the double-cone pipeline is divided into a convection section and a suppression section and is communicated between a projection objective lens chamber and a wafer table chamber; the large opening end of the convection section is directed to the projection objective lens chamber; the small opening end of the convection section is connected with the small opening end of the suppression section to form a narrow throat; the large opening end of the suppression section is directed to the wafer table chamber; and a plurality of gas inlets and gas suction ports are arranged on the pipeline wall along the axial direction, so that the continuously contracted extreme ultraviolet light can be transmitted in the light hole passage, the clean gas introduced through the gas inlets can be quickly flowed into the projection objective lens chamber and the wafer table chamber, the transmittance of the extreme ultraviolet light and the suppression efficiency of the pollutants can be effectively improved, the clean gas with the pollutants in the light hole passage can be quickly discharged through the gas suction ports arranged on the pipeline wall of the light hole passage, and the transmittance of the extreme ultraviolet light and the suppression efficiency of the pollutants can be further improved.

Description

Technical Field

[0001] This invention belongs to the field of extreme ultraviolet lithography technology, and in particular relates to a dual-cone multi-port dynamic gas lock device. Background Technology

[0002] Extreme ultraviolet (EUV) lithography machines use extreme ultraviolet light sources with a wavelength of 13.5 nm and are mainly used for chip manufacturing at nodes of 7 nm and below. Since almost all substances, including air, strongly absorb EUV light and affect reflectivity, the optical system, projection lens chamber, and silicon wafer stage chamber of EUV lithography machines must be set up as a vacuum environment.

[0003] Different components or systems within an extreme ultraviolet (EUV) lithography machine have varying requirements for cleanliness and vacuum levels. The silicon wafer stage chamber, which does not contain optical elements, is allowed to contain a certain amount of contaminants. These contaminants consist of hydrocarbons and water vapor produced by the photochemical reaction of the photoresist on the silicon wafer surface under EUV radiation. Therefore, the cleanliness and vacuum requirements are relatively low.

[0004] For projection lens chambers, since they contain reflective optical systems, it is necessary not only to ensure the transmittance of extreme ultraviolet radiation, but also to prevent contaminants that enter through free diffusion from causing carbon deposition and oxidation reactions on the surface of optical elements. Carbon deposition and oxidation reactions will lead to a decrease in the reflectivity of optical elements and a shortened lifespan. Therefore, projection lens chambers must maintain an ultra-clean vacuum environment.

[0005] To ensure near-lossless transmission of extreme ultraviolet radiation between the projection lens chamber and the silicon wafer stage chamber, and to prevent contaminants from diffusing from the silicon wafer stage chamber into the projection lens chamber, a dynamic gas lock device is usually installed between the projection lens chamber and the silicon wafer stage chamber.

[0006] During the operation of the dynamic gas lock device, clean gas with low extreme ultraviolet light absorption is introduced into the optical aperture channel of the device through the inlet. It then flows along the optical aperture channel to the projection lens chamber and the silicon wafer stage chamber, respectively. Finally, a vacuum pump unit connected to the chamber extracts the clean gas carrying contaminants from the chamber. The clean gas entering the silicon wafer stage chamber collides with contaminants released from the silicon wafer surface. These contaminants, which would normally diffuse towards the projection lens chamber, are partially redirected back into the silicon wafer stage chamber after the collision with the clean gas and extracted by the vacuum pump unit, thus isolating and controlling the contaminants. The clean gas entering the projection lens chamber cleans the optical elements within, preventing contaminant deposition on their surfaces and further inhibiting contaminant buildup.

[0007] However, existing dynamic gas lock devices typically employ a single-cone pipe configuration. To increase the effectiveness of pollutant suppression, they often increase the number of air inlets or the flow rate of clean gas. However, as the flow rate of clean gas increases, the pressure inside the aperture channel of the dynamic gas lock device rises, which in turn reduces the transmittance of extreme ultraviolet light within the aperture channel and affects the exposure quality. Summary of the Invention

[0008] To address the problems of existing technologies, this invention provides a dual-cone multi-port dynamic gas lock device. It introduces for the first time a dual-cone pipe configuration, where the cross-sectional shape of the optical aperture channel is dual-cone, divided into a convection section and a suppression section. The larger end of the convection section faces the projection lens chamber, and the smaller end of the convection section connects with the smaller end of the suppression section to form a narrow throat. The larger end of the suppression section faces the silicon wafer stage chamber. This design ensures the transmission of continuously contracting extreme ultraviolet (EUV) light within the optical aperture channel while simultaneously ensuring the rapid flow of clean gas introduced through the inlet into both the projection lens chamber and the silicon wafer stage chamber, effectively improving the transmittance of EUV light and the suppression efficiency of contaminants. Furthermore, by setting multiple air intakes on the pipe wall of the optical aperture channel, clean gas carrying contaminants can be rapidly discharged from the channel, further enhancing the transmittance of EUV light and the suppression efficiency of contaminants.

[0009] To achieve the above objectives, the present invention adopts the following technical solution: a double-cone multi-port dynamic gas lock device, which adopts a double-cone pipe configuration. The cross-sectional shape of the optical aperture channel at the center of the pipe is double-cone, divided into a convection section and a suppression section. The large end of the convection section faces and communicates with the projection lens chamber, and the small end of the convection section connects with the small end of the suppression section to form a narrow throat. The large end of the suppression section faces and communicates with the silicon wafer stage chamber. Multiple rows of air inlets and at least one row of air intakes are arranged along the axial direction on the pipe wall of the convection section. Multiple rows of air intakes and at least one row of air inlets are arranged along the axial direction on the pipe wall of the suppression section.

[0010] The central axes of the air inlets and air outlets on the convection section pipe wall form an acute angle or are perpendicular to the central axis of the optical aperture channel. When the central axes of the air inlets and air outlets on the convection section pipe wall form an acute angle with the central axis of the optical aperture channel, the tip of the acute angle points towards the narrow throat. The central axes of the air inlets and air outlets on the suppression section pipe wall form an acute angle or are perpendicular to the central axis of the optical aperture channel. When the central axes of the air inlets and air outlets on the suppression section pipe wall form an acute angle with the central axis of the optical aperture channel, the tip of the acute angle points towards the silicon wafer cavity.

[0011] The air inlets and outlets on the convection section pipe wall must meet the following conditions: In the axial direction of the optical aperture channel, the angle between the central axis of the air inlet or outlet near the projection lens chamber and the central axis of the optical aperture channel must not be greater than the angle between the central axis of the air inlet or outlet near the narrow throat and the central axis of the optical aperture channel. The air inlets and outlets on the suppression section pipe wall must meet the following conditions: In the axial direction of the optical aperture channel, the angle between the central axis of the air inlet or outlet near the narrow throat and the central axis of the optical aperture channel must not be less than the angle between the central axis of the air inlet or outlet near the silicon wafer stage chamber and the central axis of the optical aperture channel.

[0012] The number of air inlets in the same row on the pipe wall of the convection section and the suppression section is multiple, and the multiple air inlets are evenly distributed along the circumference of the pipe wall; the number of air intakes in the same row on the pipe wall of the convection section and the suppression section is multiple, and the multiple air intakes are evenly distributed along the circumference of the pipe wall.

[0013] The number and spacing of the air inlets and air intakes on the pipe walls of the convection section and the suppression section in the circumferential direction are determined according to the suppression effectiveness of the pollutants.

[0014] The air inlets on the pipe walls of the convection section and the suppression section are each independently equipped with a mass flow controller. The flow rate of the clean gas entering the air inlet is adjusted by the mass flow controller. The clean gas can be a single gas or a mixture of gases.

[0015] The air intake ports on the convection and suppression sections, the exhaust ports of the projection lens chamber, and the exhaust ports of the silicon wafer stage chamber are all independently connected to vacuum pump sets, which are used to adjust the pumping speed of the clean gas.

[0016] The cross-sectional shape of the optical aperture channel is circular or rectangular, and the transition between the inner wall of the optical aperture channel and the air inlet and air outlet is set with rounded or straight chamfers.

[0017] The pipe wall at the narrow throat is either a closed structure or has an air inlet or an air intake. When the pipe wall at the narrow throat has an air inlet or an air intake, the air inlet or air intake is a single-row structure with multiple air inlets or air intakes in the single row. These multiple air inlets or air intakes are evenly distributed along the circumference of the pipe wall. The number and spacing of the air inlets or air intakes in the circumference are determined based on the pollutant suppression efficiency.

[0018] When the pipe wall at the narrow throat is provided with an air inlet, the air inlet is independently equipped with a mass flow controller, and the flow rate of the clean gas in the air inlet is adjusted by the mass flow controller. The clean gas can be a single gas or a mixed gas. When the pipe wall at the narrow throat is provided with an air suction port, the air suction port is independently connected to a vacuum pump group, and the pumping speed of the clean gas is adjusted by the vacuum pump group.

[0019] The beneficial effects of this invention are:

[0020] This invention presents a novel dual-cone multi-port dynamic gas lock device, which for the first time introduces a dual-cone pipe configuration. The cross-sectional shape of the optical aperture channel is dual-cone, divided into a convection section and a suppression section. The larger end of the convection section faces the projection lens chamber, while the smaller end of the convection section connects with the smaller end of the suppression section to form a narrow throat. The larger end of the suppression section faces the silicon wafer stage chamber. This design ensures the transmission of continuously contracting extreme ultraviolet (EUV) light within the optical aperture channel while simultaneously ensuring the rapid flow of clean gas introduced through the inlet into both the projection lens chamber and the silicon wafer stage chamber, effectively improving the transmittance of EUV light and the suppression efficiency of contaminants. Furthermore, by providing multiple air intakes on the wall of the optical aperture channel, clean gas carrying contaminants can be rapidly discharged from the channel, further enhancing the transmittance of EUV light and the suppression efficiency of contaminants. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a double-cone multi-port dynamic gas lock device according to the present invention (Embodiment 1);

[0022] Figure 2 This is a schematic diagram of the structure of a double-cone multi-port dynamic gas lock device of the present invention (Embodiment 2);

[0023] Figure 3 This is a schematic diagram of the structure of a double-cone multi-port dynamic gas lock device according to the present invention (Embodiment 3);

[0024] Figure 4 This is a schematic diagram of the cross-section of the air inlet of the light aperture channel (the cross-section is circular and there are 6 air inlets);

[0025] Figure 5 This is a schematic diagram of the cross-section of the air inlet of the light aperture channel (the cross-section is rectangular and there are 6 air inlets);

[0026] Figure 6 This is a schematic diagram of the cross-section of the air intake of the optical aperture channel (the cross-section is circular and there are 6 air intakes);

[0027] Figure 7 This is a schematic diagram of the cross-section of the air intake of the light aperture channel (the cross-section is rectangular and there are 6 air intakes);

[0028] In the diagram, 1—convection section, 2—suppression section, 3—projection lens chamber, 4—silicon wafer stage chamber, 5—air inlet, 6—inhalation port, and 7—narrow throat. Detailed Implementation

[0029] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0030] Example 1

[0031] like Figure 1 As shown, a double-cone multi-port dynamic gas lock device adopts a double-cone pipe configuration. The cross-sectional shape of the optical aperture channel at the center of the pipe is double-cone, divided into a convection section 1 and a suppression section 2. The large end of the convection section 1 faces and communicates with the projection lens chamber 3, and the small end of the convection section 1 connects with the small end of the suppression section 2 to form a narrow throat 7. The pipe wall at the narrow throat 7 adopts a closed structure. The large end of the suppression section 2 faces and communicates with the silicon wafer stage chamber 4. Two rows of air inlets 5 and one row of air intakes 6 are arranged along the axial direction on the pipe wall of the convection section 1. The two rows of air inlets 5 are close to the projection lens chamber 3, and the row of air intakes 6 is close to the narrow throat 7. Two rows of air intakes 6 and one row of air inlets 5 are arranged along the axial direction on the pipe wall of the suppression section 2. The row of air inlets 5 is located in the middle of the two rows of air intakes 6.

[0032] The central axis of the air inlet 5 on the convection section 1 pipe wall forms an acute angle with the central axis of the light hole channel, and the tip of the acute angle faces the narrow throat 7. The central axes of the two rows of air inlets 5 are parallel, and the central axis of the air intake 6 on the convection section 1 pipe wall is perpendicular to the central axis of the light hole channel.

[0033] The central axis of the air inlet 5 on the wall of the suppression section 2 forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle faces the silicon wafer stage chamber 4. The central axes of the two rows of air intakes 6 are perpendicular to the central axis of the optical aperture channel.

[0034] like Figure 4 , Figure 6 As shown, the cross-sectional shape of the optical aperture channel is circular, and the transition between the inner wall of the optical aperture channel and the air inlet 5 and the air intake 6 is set with rounded chamfers. There are 6 air inlets 5 in the same row on the pipe wall of the convection section 1 and the suppression section 2, and the 6 air inlets 5 are evenly distributed along the circumference of the pipe wall. There are 6 air intakes 6 in the same row on the pipe wall of the convection section 1 and the suppression section 2, and the multiple air intakes 6 are evenly distributed along the circumference of the pipe wall.

[0035] The air inlets 5 on the pipe walls of the convection section 1 and the suppression section 2 are each independently equipped with a mass flow controller. The flow rate of the clean gas entering through the air inlet 5 is adjusted by the mass flow controller, and a single gas is used for cleaning.

[0036] The air intake 6 on the pipe wall of the convection section 1 and the suppression section 2, the exhaust port of the projection lens chamber 3, and the exhaust port of the silicon wafer stage chamber 4 are all independently connected to a vacuum pump group, which adjusts the pumping speed of the clean gas.

[0037] Example 2

[0038] like Figure 2As shown, a double-cone multi-port dynamic gas lock device adopts a double-cone pipe configuration. The cross-sectional shape of the optical aperture channel at the center of the pipe is double-cone, divided into a convection section 1 and a suppression section 2. The large end of the convection section 1 faces and communicates with the projection lens chamber 3. The small end of the convection section 1 connects with the small end of the suppression section 2 to form a narrow throat 7. An air inlet 5 is provided on the pipe wall at the narrow throat 7. The central axis of the air inlet 5 is perpendicular to the central axis of the optical aperture channel. The large end of the suppression section 2 faces and communicates with the silicon wafer stage chamber 4. Two rows of air inlets 5 and one row of air intakes 6 are arranged along the axial direction on the pipe wall of the convection section 1. The two rows of air inlets 5 are close to the projection lens chamber 3, and the row of air intakes 6 is close to the narrow throat 7. Two rows of air intakes 6 and one row of air inlets 5 are arranged along the axial direction on the pipe wall of the suppression section 2. The row of air inlets 5 is located in the middle of the two rows of air intakes 6.

[0039] The central axis of the air inlet 5 on the convection section 1 pipe wall forms an acute angle with the central axis of the light hole channel, and the tip of the acute angle faces the narrow throat 7. The central axes of the two rows of air inlets 5 are parallel, and the central axis of the air intake 6 on the convection section 1 pipe wall is perpendicular to the central axis of the light hole channel.

[0040] The central axis of the air inlet 5 on the wall of the suppression section 2 forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle faces the silicon wafer stage chamber 4. The central axes of the two rows of air intakes 6 are perpendicular to the central axis of the optical aperture channel.

[0041] like Figure 4 , Figure 6 As shown, the cross-sectional shape of the optical aperture channel is circular, and the transition between the inner wall of the optical aperture channel and the air inlet 5 and the air intake 6 is rounded. There are 6 air inlets 5 in the same row on the pipe wall of the convection section 1 and the suppression section 2, and the 6 air inlets 5 are evenly distributed along the circumference of the pipe wall. There are also 6 air intakes 6 in the same row on the pipe wall of the convection section 1 and the suppression section 2, and the multiple air intakes 6 are evenly distributed along the circumference of the pipe wall. The air inlets 5 in a single row on the pipe wall of the narrow throat 7 are evenly distributed along the circumference of the pipe wall.

[0042] Each of the air inlets 5 on the pipe wall at the convection section 1, the suppression section 2, and the narrow throat 7 is independently equipped with a mass flow controller. The flow rate of the clean gas entering through the air inlet 5 is adjusted by the mass flow controller, and a single gas is used for cleaning.

[0043] The air intake 6 on the pipe wall of the convection section 1 and the suppression section 2, the exhaust port of the projection lens chamber 3, and the exhaust port of the silicon wafer stage chamber 4 are all independently connected to a vacuum pump group, which adjusts the pumping speed of the clean gas.

[0044] Example 3

[0045] like Figure 3As shown, a double-cone multi-port dynamic gas lock device adopts a double-cone pipe configuration. The cross-sectional shape of the optical aperture channel at the center of the pipe is double-cone, divided into a convection section 1 and a suppression section 2. The larger end of the convection section 1 faces and communicates with the projection lens chamber 3. The smaller end of the convection section 1 connects with the smaller end of the suppression section 2 to form a narrow throat 7. An air intake 6 is provided on the pipe wall at the narrow throat 7, and the central axis of the air intake 6 is perpendicular to the central axis of the optical aperture channel. The larger end of the suppression section 2 faces the silicon... The stage chamber 4 is connected to it; three rows of air inlets 5 and one row of air inlets 6 are arranged along the axial direction on the pipe wall of the convection section 1, two rows of air inlets 5 are close to the projection lens chamber 3, one row of air inlets 5 is close to the narrow throat 7, and one row of air inlets 6 is between the two rows of air inlets 5 close to the projection lens chamber 3 and the one row of air inlets 5 close to the narrow throat 7; two rows of air inlets 5 and one row of air inlets 6 are arranged along the axial direction on the pipe wall of the suppression section 2, and one row of air inlets 6 is located in the middle of the two rows of air inlets 5.

[0046] The central axis of the air inlet 5 on the convection section 1 pipe wall forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle faces the narrow throat 7. The central axes of the two rows of air inlets 5 near the projection lens chamber 3 intersect on the central axis of the optical aperture channel, and the central axis of the row of air inlets 5 near the narrow throat 7 is perpendicular to the central axis of the optical aperture channel. The central axis of the air intake 6 on the convection section 1 pipe wall is perpendicular to the central axis of the optical aperture channel.

[0047] The central axis of the air inlet 5 near the narrow throat 7 on the pipe wall of the suppression section 2 forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle faces the silicon wafer stage chamber 4. The central axis of the air inlet 5 near the silicon wafer stage chamber 4 is perpendicular to the central axis of the optical aperture channel, and the central axis of the air intake 6 is perpendicular to the central axis of the optical aperture channel.

[0048] like Figure 5 , Figure 7 As shown, the cross-sectional shape of the optical aperture channel is rectangular. The transition between the inner wall of the optical aperture channel and the air inlet 5 and the air intake 6 is set as a straight chamfer. There are 6 air inlets 5 in the same row on the pipe wall of the convection section 1 and the suppression section 2, and the 6 air inlets 5 are evenly distributed along the circumference of the pipe wall. There are 6 air intakes 6 in the same row on the pipe wall of the convection section 1 and the suppression section 2, and the multiple air intakes 6 are evenly distributed along the circumference of the pipe wall. The air intakes 6 in a single row on the pipe wall of the narrow throat 7 are evenly distributed along the circumference of the pipe wall.

[0049] The air inlets 5 on the pipe walls of the convection section 1 and the suppression section 2 are each independently equipped with a mass flow controller. The flow rate of the clean gas entering through the air inlet 5 is adjusted by the mass flow controller, and the clean gas is a mixed gas.

[0050] The air intake 6 on the pipe wall of the convection section 1, the suppression section 2 and the narrow throat 7, the exhaust port of the projection lens chamber 3 and the exhaust port of the silicon wafer stage chamber 4 are all independently connected to a vacuum pump group, and the pumping speed of the clean gas is adjusted by the vacuum pump group.

[0051] When the dynamic gas lock device adopts the technical solution of this invention, the optical aperture channel, being biconical, exhibits a contraction-expansion shape from top to bottom. This ensures the transmission of continuously contracting extreme ultraviolet light within the optical aperture channel. Furthermore, the multiple rows of air inlets 5 on the channel wall ensure that each inlet 5 prevents contaminants from diffusing into the projection lens chamber 3, achieving multiple barriers and improving contaminant suppression efficiency. Additionally, the multiple rows of suction ports 6 on the channel wall effectively and rapidly expel clean gas carrying contaminants from the optical aperture channel. This not only prevents a large amount of clean gas from accumulating and forming a high-pressure zone within the channel but also reduces the density of contaminants diffusing into the projection lens chamber 3, thereby further improving the transmittance of extreme ultraviolet light and the contaminant suppression efficiency.

[0052] The solutions in the embodiments are not intended to limit the scope of protection of the present invention. All equivalent implementations or modifications that do not depart from the present invention are included in the scope of protection of the present invention.

Claims

1. A dual-cone multi-port dynamic gas lock device, characterized by: The double-cone pipeline configuration is adopted, the cross-sectional shape of the light hole channel in the center of the pipeline is double-cone, and is divided into a convection section and a suppression section; the large opening end of the convection section faces and communicates with the projection objective lens chamber, the small opening end of the convection section is connected with the small opening end of the suppression section to form a narrow throat, and the large opening end of the suppression section faces and communicates with the silicon wafer table chamber; a plurality of rows of air inlets and at least one row of air outlets are arranged on the pipeline wall of the convection section in the axial direction; a plurality of rows of air outlets and at least one row of air inlets are arranged on the pipeline wall of the suppression section in the axial direction.

2. A dual-cone multi-port dynamic gas lock apparatus as defined in claim 1, wherein: The central axes of the air inlets and air outlets on the pipeline wall of the convection section and the central axis of the light hole channel form an acute angle or are perpendicular, and when the central axes of the air inlets and air outlets on the pipeline wall of the convection section and the central axis of the light hole channel form an acute angle, the acute angle is directed towards the narrow throat; the central axes of the air inlets and air outlets on the pipeline wall of the suppression section and the central axis of the light hole channel form an acute angle or are perpendicular, and when the central axes of the air inlets and air outlets on the pipeline wall of the suppression section and the central axis of the light hole channel form an acute angle, the acute angle is directed towards the silicon wafer table chamber.

3. A dual-cone multi-port dynamic gas lock apparatus as defined in claim 2, wherein: The air inlets and air outlets on the pipeline wall of the convection section need to meet the following condition: in the axial direction of the light hole channel, the included angle between the central axis of the air inlet or air outlet close to the projection objective lens chamber side and the central axis of the light hole channel needs to be not greater than the included angle between the central axis of the air inlet or air outlet close to the narrow throat side and the central axis of the light hole channel; the air inlets and air outlets on the pipeline wall of the suppression section need to meet the following condition: in the axial direction of the light hole channel, the included angle between the central axis of the air inlet or air outlet close to the narrow throat side and the central axis of the light hole channel needs to be not less than the included angle between the central axis of the air inlet or air outlet close to the silicon wafer table chamber side and the central axis of the light hole channel.

4. The dual-cone multi-port dynamic gas lock apparatus of claim 1, wherein: The number of air inlets in the same row on the pipeline wall of the convection section and the suppression section is multiple, and the multiple air inlets are uniformly distributed in the circumferential direction of the pipeline wall; the number of air outlets in the same row on the pipeline wall of the convection section and the suppression section is multiple, and the multiple air outlets are uniformly distributed in the circumferential direction of the pipeline wall.

5. A dual-cone multi-port dynamic gas lock apparatus as defined in claim 4, wherein: The number and spacing of the air inlets and air outlets on the pipeline wall of the convection section and the suppression section in the circumferential direction are determined according to the suppression efficiency of the pollutants.

6. A dual-cone multi-port dynamic gas lock apparatus as defined in claim 1, wherein: The air inlets on the pipeline wall of the convection section and the suppression section are each independently provided with a mass flow controller, the flow rate of the clean gas into the air inlets is adjusted by the mass flow controller, and the clean gas is single gas or mixed gas.

7. A dual-cone multi-port dynamic gas lock apparatus as defined in claim 1, wherein: The air outlets on the pipeline wall of the convection section and the suppression section, the exhaust port of the projection objective lens chamber and the exhaust port of the silicon wafer table chamber are each independently connected with a vacuum pump set, and the pumping speed of the clean gas is adjusted by the vacuum pump set.

8. A dual-cone multi-port dynamic gas lock apparatus as defined in claim 1, wherein: The cross-sectional shape of the light hole channel is circular or rectangular, and the transition connection between the inner wall of the light hole channel and the air inlets and air outlets is provided with a round chamfer or a straight chamfer.

9. The dual-cone multi-port dynamic gas lock apparatus of claim 1, wherein: The pipe wall at the narrow throat is provided with an enclosed structure or an air inlet or air suction port, and when the pipe wall at the narrow throat is provided with the air inlet or air suction port, the air inlet or air suction port is in a single-row structure, the number of the air inlets or air suction ports in the single row is multiple, and the multiple air inlets or air suction ports are uniformly distributed along the circumference of the pipe wall, and the number and spacing of the air inlets or air suction ports in the circumferential direction are determined according to the inhibition effect of the pollutants.

10. A dual-cone multi-port dynamic gas lock apparatus as defined in claim 9, wherein: When the pipe wall at the narrow throat is provided with the air inlet, the air inlet is independently provided with a mass flow controller, the flow rate of the clean gas of the air inlet is adjusted by the mass flow controller, and the clean gas is a single gas or a mixed gas; when the pipe wall at the narrow throat is provided with the air suction port, the air suction port is independently connected with a vacuum pump set, and the pumping speed of the clean gas is adjusted by the vacuum pump set.

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