Printed circuit board temperature monitoring method, control method, controller and medium

Abstract

The invention provides a printed circuit board temperature monitoring method, a printed circuit board temperature control method, a battery management system controller and a readable storage medium, and the monitoring method comprises the steps: obtaining an actual environment temperature when the controller is powered on and awakened, and obtaining a first temperature model according to the actual environment temperature, the cooling characteristic information of a printed circuit board and the first temperature model; calculating the initial working temperature of the printed circuit board; in the working process of the controller, if balance is not started, the current working temperature of the printed circuit board is calculated according to the heat release amount, the heat dissipation amount and the initial working temperature of the printed circuit board and a second temperature model; and if the equalization is started, calculating the current working temperature of the printed circuit board according to the working temperature of the printed circuit board when the equalization is started, the heat release amount of the equalization resistor, the heat dissipation amount of the printed circuit board and a third temperature model. According to the invention, the working temperature of the printed circuit board is estimated by using the temperature model, so that the hardware cost of the controller can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of new energy vehicles, and in particular to a printed circuit board temperature monitoring method, a printed circuit board temperature control method, a battery management system controller and a readable storage medium. Background Art

[0002] In response to global energy shortages and environmental problems caused by the use of large amounts of fossil fuels, new energy vehicles and power battery technologies have been vigorously developed in recent years. Lithium batteries have been widely used in new energy vehicles as energy storage devices. The power battery of new energy vehicles is a battery pack that connects multiple lithium batteries in series and parallel to meet the needs of high voltage. The battery needs to be monitored by the BMS (Battery Management System) battery management system controller to monitor the battery status, including battery voltage, battery SOC (state of charge), module temperature, balancing, etc., to achieve normal control and use of the battery charging and discharging process.

[0003] At present, the mainstream battery management system controller mainly integrates micro battery management system controller, resistors, capacitors and other hardware on PCB. Among them, PCB (Printed Circuit Board) is a circuit board with conductive patterns used to connect various components. It uses insulating copper clad laminate as the substrate, and after printing, etching, drilling and post-processing, the connection relationship of the components in the circuit is made on the copper clad laminate with a set of conductive patterns and holes, and finally cut into boards of a certain size.

[0004] During the working process of the battery management system controller (BMS controller), the current flowing through the PCB, the heat generated by the components themselves, and the changes in the ambient temperature will cause the PCB temperature to change significantly. Excessive temperature will cause changes in the electrical and mechanical properties of the PCB, affecting the function, performance, quality and life of the PCB, accelerating product aging and shortening product service life.

[0005] The PCB of the BMS controller is integrated with balancing circuits and balancing resistors, which are used to improve the consistency of each battery cell. The balancing strategy refers to closing the balancing loop on the PCB of high-capacity battery cells to dissipate the battery cell power in the form of heat energy, thereby improving the consistency of the battery. The heat generated by balancing will accumulate on the PCB. In the narrow battery management system controller, multiple balancing loops turned on at the same time will cause the temperature of the PCB to rise rapidly, and may exceed the upper temperature limit of the PCB design. Therefore, an NTC (Negative Temperature Coefficient) thermistor is installed on the PCB of the BMS controller to monitor the PCB temperature in real time. When the temperature of the PCB exceeds a certain value (taking 110°C as an example), the BMS controller will turn off all balancing circuits to reduce the PCB temperature. When the temperature drops to a certain level, the balancing loop can be reopened. At this time, the temperature of the PCB is as follows: Figure 1 As shown ( Figure 1 Figure 1 is a diagram showing the temperature performance of the printed circuit board when it is balanced open and closed. By monitoring the actual temperature of the PCB, overheating can be avoided, thereby ensuring the function, performance and service life of the battery management system controller. However, the use of NTC thermistors will increase the hardware cost of the battery management system controller.

[0006] It should be noted that the information disclosed in the background technology section of the invention is only intended to deepen the understanding of the general background technology of the invention, and should not be regarded as an admission or suggestion in any form that the information constitutes prior art already known to those skilled in the art. Summary of the invention

[0007] The object of the present invention is to provide a printed circuit board temperature monitoring method, a printed circuit board temperature control method, a battery management system controller and a readable storage medium. By using a temperature model to estimate the operating temperature of the printed circuit board, while realizing printed circuit board temperature monitoring, the use of NTC thermistors can be reduced, thereby reducing the hardware cost of the battery management system controller.

[0008] To achieve the above object, the present invention provides a printed circuit board temperature monitoring method, comprising:

[0009] When the battery management system controller is powered on and awakened, the actual ambient temperature is obtained, and the initial operating temperature of the printed circuit board is calculated according to the actual ambient temperature, the cooling characteristic information of the printed circuit board in the battery management system controller, and the pre-built first temperature model;

[0010] During the operation of the battery management system controller, if balancing is not turned on, the current operating temperature of the printed circuit board is calculated according to the heat release and heat dissipation of the printed circuit board, the initial operating temperature of the printed circuit board and the pre-constructed second temperature model;

[0011] During the operation of the battery management system controller, if balancing is turned on, the current operating temperature of the printed circuit board is calculated based on the operating temperature of the printed circuit board when balancing is turned on, the heat released by the balancing resistor installed on the printed circuit board during the balancing process, the heat dissipation of the printed circuit board, and a pre-constructed third temperature model.

[0012] Optionally, the temperature reduction characteristic information of the printed circuit board includes the mass of the printed circuit board, the specific heat capacity of the printed circuit board, the surface area of ​​the printed circuit board, and the convection heat transfer coefficient of the printed circuit board.

[0013] Optionally, calculating the initial operating temperature of the printed circuit board according to the actual ambient temperature, the cooling characteristic information of the printed circuit board in the battery management system controller, and a pre-built first temperature model includes:

[0014] According to the actual ambient temperature and the mapping relationship between the ambient temperature and the convective heat transfer correction coefficient obtained in advance, obtaining the corresponding convective heat transfer correction coefficient;

[0015] Correcting the convective heat transfer coefficient of the printed circuit board according to the convective heat transfer correction coefficient to obtain a convective heat transfer coefficient correction value;

[0016] Calculate the temperature drop of the printed circuit board according to the actual ambient temperature, the mass of the printed circuit board, the specific heat capacity of the printed circuit board, the surface area of ​​the printed circuit board, the correction value of the convection heat transfer coefficient, and the temperature of the printed circuit board before the battery management system controller is electrically awakened;

[0017] The initial operating temperature of the printed circuit board is calculated according to the temperature of the printed circuit board when the battery management system controller is electrically awakened and the temperature drop of the printed circuit board.

[0018] Optionally, the heat release of the printed circuit board is calculated based on the resistance of the printed circuit board, the operating current on the printed circuit board, and the operating time of the battery management system controller.

[0019] Optionally, the heat dissipation of the printed circuit board is calculated based on the convection heat transfer coefficient of the printed circuit board, the surface area of ​​the printed circuit board, the operating temperature of the printed circuit board at the previous moment, the actual ambient temperature and the operating time of the battery management system controller.

[0020] Optionally, calculating the current operating temperature of the printed circuit board according to the heat release and heat dissipation of the printed circuit board, the initial operating temperature of the printed circuit board, and a pre-constructed second temperature model includes:

[0021] According to the actual ambient temperature and the mapping relationship between the ambient temperature and the heat release correction coefficient obtained in advance, the corresponding heat release correction coefficient is obtained;

[0022] Correcting the heat release of the printed circuit board according to the heat release correction coefficient to obtain a corrected heat release of the printed circuit board;

[0023] Calculating the actual heat generation of the printed circuit board according to the corrected heat generation and heat dissipation of the printed circuit board;

[0024] Calculating the temperature rise of the printed circuit board according to the actual heat generation of the printed circuit board and the specific heat capacity and mass of the printed circuit board;

[0025] The current operating temperature of the printed circuit board is calculated according to the initial operating temperature of the printed circuit board and the temperature rise of the printed circuit board.

[0026] Optionally, the amount of heat released by the balancing resistor during the balancing process is calculated according to the resistance of the balancing resistor, the balancing current of each balancing cell, and the balancing time of the balancing cell.

[0027] Optionally, calculating the current operating temperature of the printed circuit board according to the operating temperature of the printed circuit board when balancing is turned on, the heat released by the balancing resistor installed on the printed circuit board during the balancing process, the heat dissipation of the printed circuit board, and a pre-constructed third temperature model includes:

[0028] Calculating the actual heat generated by the printed circuit board according to the heat released by the balancing resistor during the balancing process and the heat dissipated by the printed circuit board;

[0029] Calculating the temperature rise of the printed circuit board according to the actual heat generation of the printed circuit board and the specific heat capacity and mass of the printed circuit board;

[0030] Obtaining a corresponding temperature rise correction coefficient according to the actual ambient temperature and a mapping relationship between the ambient temperature and the temperature rise correction coefficient obtained in advance;

[0031] Correcting the calculated temperature rise according to the temperature rise correction coefficient;

[0032] The current operating temperature of the printed circuit board is calculated according to the operating temperature of the printed circuit board when the printed circuit board is balanced and the corrected temperature rise.

[0033] In order to achieve the above object, the present invention also provides a printed circuit board temperature control method, the control method comprising:

[0034] Using any of the printed circuit board temperature monitoring methods described above to obtain the current operating temperature of the printed circuit board;

[0035] Determining whether the current operating temperature of the printed circuit board is greater than or equal to a preset fault alarm temperature threshold;

[0036] If not, determine whether to enable balancing;

[0037] If balancing is turned on, determining whether the current operating temperature of the printed circuit board is greater than or equal to a preset balancing stop temperature threshold;

[0038] If so, close all balancing loops.

[0039] To achieve the above-mentioned purpose, the present invention also provides a battery management system controller, including a processor and a memory, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the printed circuit board temperature monitoring method or the printed circuit board temperature control method described above is implemented.

[0040] To achieve the above objectives, the present invention also provides a readable storage medium, in which a computer program is stored. When the computer program is executed by a processor, the printed circuit board temperature monitoring method or the printed circuit board temperature control method described above is implemented.

[0041] Compared with the prior art, the printed circuit board temperature monitoring method, printed circuit board temperature control method, battery management system controller and readable storage medium provided by the present invention have the following beneficial effects:

[0042] The printed circuit board temperature monitoring method provided by the present invention obtains the actual ambient temperature when the battery management system controller is electrically awakened, and calculates the initial operating temperature of the printed circuit board according to the actual ambient temperature, the cooling characteristic information of the printed circuit board in the battery management system controller, and the pre-constructed first temperature model; during the operation of the battery management system controller, if the balancing is not turned on, the current operating temperature of the printed circuit board is calculated according to the heat release and heat dissipation of the printed circuit board, the initial operating temperature of the printed circuit board, and the pre-constructed second temperature model; during the operation of the battery management system controller, if the balancing is turned on, the current operating temperature of the printed circuit board is calculated according to the operating temperature of the printed circuit board when the balancing is turned on, the heat release of the balancing resistor installed on the printed circuit board during the balancing process, the heat dissipation of the printed circuit board, and the pre-constructed third temperature model. Therefore, the printed circuit board temperature monitoring method provided by the present invention estimates the operating temperature of the printed circuit board by adopting the first temperature model, the second temperature model, and the third temperature model, so that the use of NTC thermistors can be reduced while realizing the temperature monitoring of the printed circuit board, thereby reducing the hardware cost of the battery management system controller.

[0043] The printed circuit board temperature control method provided by the present invention first adopts the printed circuit board temperature monitoring method provided by the present invention to obtain the current working temperature of the printed circuit board; then judge whether the current working temperature of the printed circuit board is greater than or equal to the preset fault reporting temperature threshold; if it is determined that the current working temperature of the printed circuit board is less than or equal to the preset fault reporting temperature threshold, further judge whether to start balancing; if balancing is started, further judge whether the current working temperature of the printed circuit board is greater than or equal to the preset balancing stop temperature threshold, and if it is determined that the current working temperature of the printed circuit board is greater than or equal to the preset balancing stop temperature threshold, then close all balancing loops. Therefore, the printed circuit board control method provided by the present invention estimates the working temperature of the printed circuit board by adopting the first temperature model, the second temperature model and the third temperature model, and closes all balancing loops when the current working temperature of the printed circuit board is greater than or equal to the preset balancing stop temperature threshold, so that not only can the use of NTC thermistors be reduced while realizing the temperature control of the printed circuit board, thereby reducing the hardware cost of the battery management system controller, but also can avoid the printed circuit board from being damaged due to overheating, thereby ensuring the function, performance and service life of the battery management system controller.

[0044] Since the battery management system controller and the readable storage medium provided by the present invention belong to the same inventive concept as the printed circuit board temperature monitoring method or the printed circuit board temperature control method provided by the present invention, the battery management system controller and the readable storage medium provided by the present invention also have at least all the beneficial effects of the printed circuit board temperature monitoring method or the printed circuit board temperature control method provided by the present invention. Therefore, the relevant content about the beneficial effects of the battery management system controller and the readable storage medium provided by the present invention can refer to the relevant description of the beneficial effects of the printed circuit board temperature monitoring method or the printed circuit board temperature control method provided by the present invention in the above text, and will not be repeated here one by one. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 It is a schematic diagram of the temperature performance of the printed circuit board when it is balanced open and closed;

[0046] Figure 2 A flow chart of a printed circuit board temperature monitoring method provided by one embodiment of the present invention;

[0047] Figure 3 A flow chart of a printed circuit board temperature control method provided by one embodiment of the present invention;

[0048] Figure 4 The overall flow chart of the printed circuit board temperature control method;

[0049] Figure 5 A structural block diagram of a battery management system controller provided in one embodiment of the present invention. DETAILED DESCRIPTION

[0050] The following is a further detailed description of the printed circuit board temperature monitoring method, printed circuit board temperature control method and battery management system controller proposed in the present invention in combination with the accompanying drawings and specific embodiments. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose provided by the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Any structural modification, change in proportional relationship or adjustment of size, in the case of the same or similar effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical content disclosed by the present invention.

[0051] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements. The singular forms "a", "an" and "the" include plural objects, the term "or" is generally used in a sense including "and / or", the term "several" is generally used in a sense including "at least one", and the term "at least two" is generally used in a sense including "two or more". In addition, the terms "first", "second" and "third" are used for descriptive purposes only and are not to be understood as indicating or suggesting relative importance or implicitly indicating the number of the indicated technical features.

[0052] In addition, in the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0053] For ease of understanding, the research background of the present invention is briefly described first. Since the battery management system controller is installed inside the battery pack, its working scene is relatively simple, and the temperature of its printed circuit board is mainly affected by factors such as ambient temperature, current during operation, and heat generation of the balancing circuit, so the temperature model can be used to estimate the temperature of the printed circuit board.

[0054] The core idea of ​​the present invention is to provide a printed circuit board temperature monitoring method, a printed circuit board temperature control method and a battery management system controller. By using a temperature model to estimate the temperature of the printed circuit board, while realizing printed circuit board temperature monitoring, the use of NTC thermistors can be reduced, thereby reducing the hardware cost of the battery management system controller.

[0055] It should be noted that the printed circuit board temperature monitoring method and the printed circuit board temperature control method provided by the present invention can be applied to the battery management system controller provided by the present invention, and the battery management system controller can be configured on new energy vehicles, wherein the battery management system controller can be a hardware device with various operating systems, and the new energy vehicles can include but are not limited to passenger vehicles including pure electric or hybrid sedans, sport utility vehicles (SUVs), buses, trucks, and various commercial vehicles.

[0056] To realize the above idea, the present invention provides a printed circuit board temperature monitoring method, please refer to Figure 2 , which is a flow chart of a printed circuit board temperature monitoring method provided in one embodiment of the present invention.

[0057] like Figure 2 As shown, the printed circuit board temperature monitoring method provided by the present invention comprises the following steps:

[0058] Step S110: When the battery management system controller is powered on and awakened, the actual ambient temperature is obtained, and the initial operating temperature of the printed circuit board is calculated based on the actual ambient temperature, the cooling characteristic information of the printed circuit board in the battery management system controller, and the pre-built first temperature model.

[0059] Step S120: During the operation of the battery management system controller, if balancing is not turned on, the current operating temperature of the printed circuit board is calculated according to the heat release and heat dissipation of the printed circuit board, the initial operating temperature of the printed circuit board, and the pre-constructed second temperature model.

[0060] Step S130: During the operation of the battery management system controller, if balancing is turned on, the current operating temperature of the printed circuit board is calculated according to the operating temperature of the printed circuit board when balancing is turned on, the heat released by the balancing resistor installed on the printed circuit board during the balancing process, the heat dissipation of the printed circuit board, and a pre-constructed third temperature model.

[0061] Therefore, the printed circuit board temperature monitoring method provided by the present invention estimates the operating temperature of the printed circuit board by adopting the first temperature model, the second temperature model and the third temperature model, so that the use of NTC thermistors can be reduced while realizing the printed circuit board temperature monitoring, thereby reducing the hardware cost of the battery management system controller.

[0062] In some exemplary embodiments, the temperature reduction characteristic information of the printed circuit board includes the mass of the printed circuit board, the specific heat capacity of the printed circuit board, the surface area of ​​the printed circuit board, and the convection heat transfer coefficient of the printed circuit board. Specifically, the specific heat capacity and the convection heat transfer coefficient of the printed circuit board are related to the material of the printed circuit board.

[0063] In some exemplary embodiments, the calculating the initial operating temperature of the printed circuit board according to the actual ambient temperature, the cooling characteristic information of the printed circuit board in the battery management system controller, and the pre-built first temperature model includes:

[0064] According to the actual ambient temperature and the mapping relationship between the ambient temperature and the convective heat transfer correction coefficient obtained in advance, obtaining the corresponding convective heat transfer correction coefficient;

[0065] Correcting the convective heat transfer coefficient of the printed circuit board according to the convective heat transfer correction coefficient to obtain a convective heat transfer coefficient correction value;

[0066] Calculate the temperature drop of the printed circuit board according to the actual ambient temperature, the mass of the printed circuit board, the specific heat capacity of the printed circuit board, the surface area of ​​the printed circuit board, the correction value of the convection heat transfer coefficient, and the temperature of the printed circuit board before the battery management system controller is electrically awakened;

[0067] The initial operating temperature of the printed circuit board is calculated according to the temperature of the printed circuit board when the battery management system controller is electrically awakened and the temperature drop of the printed circuit board.

[0068] After the battery management system controller goes into sleep mode, the temperature of the printed circuit board gradually decreases to approach the ambient temperature, and its heat is mainly dissipated to the surrounding environment through convection heat transfer, and the environment will have a certain impact on the convection heat transfer coefficient of the material. Therefore, by obtaining the corresponding convection heat transfer correction coefficient based on the actual ambient temperature and the mapping relationship between the pre-acquired ambient temperature and the convection heat transfer correction coefficient, and correcting the convection heat transfer coefficient of the printed circuit board based on the convection heat transfer correction coefficient, the accuracy of the calculated initial operating temperature of the printed circuit board can be effectively guaranteed.

[0069] Specifically, after the battery management system controller goes into sleep mode, the temperature of the printed circuit board may be calculated according to the first temperature model shown in the following formula (1).

[0070]

[0071] In the formula, is the temperature of the printed circuit board at time t+1; is the temperature of the printed circuit board at time t; is the temperature of the printed circuit board at time t-1; T air is the actual ambient temperature; C pcb is the specific heat capacity of the printed circuit board; m pcb is the mass of the printed circuit board; α is the convection heat transfer coefficient of the printed circuit board (unit: W / (m 2 ·℃)); F is the surface area of ​​the printed circuit board (in m 2 );A is the convective heat transfer correction coefficient.

[0072] When the battery management system controller wakes up (t=t0), it can As the initial operating temperature T of the printed circuit board ini :

[0073]

[0074] In the formula, is the temperature of the printed circuit board when it is electrically awakened on the battery management system controller; is the temperature of the printed circuit board at a moment before the battery management system controller is electrically awakened.

[0075] It should be noted that, as can be understood by those skilled in the art, It should also be noted that, as those skilled in the art can understand, the initial operating temperature of the printed circuit board when the battery management system controller is first powered on and awakened is the ambient temperature when the battery management system controller is first powered on and awakened.

[0076] Furthermore, in the laboratory, the printed circuit board can be heated to a preset temperature (e.g., 100°C), and then allowed to stand at different ambient temperatures (e.g., -20°C, 0°C, 20°C, 40°C), and the temperature of the printed circuit board during the standing process can be collected in real time until the temperature of the printed circuit board is consistent with the ambient temperature. For each ambient temperature, the convective heat transfer correction coefficient A at the ambient temperature can be obtained based on the temperature data of the printed circuit board during the standing process and substituted into the above formula (1). By fitting the convective heat transfer correction coefficients at different ambient temperatures, the mapping relationship between the ambient temperature and the convective heat transfer correction coefficient can be obtained.

[0077] Please refer to Table 1, which shows the convective heat transfer correction coefficients at different ambient temperatures.

[0078] Table 1 Convective heat transfer correction coefficients at different ambient temperatures

[0079]

[0080] In some exemplary embodiments, the heat release of the printed circuit board is calculated based on the resistance of the printed circuit board, the operating current on the printed circuit board, and the operating time of the battery management system controller.

[0081] Specifically, the heat (heat release) Q generated by the printed circuit board itself when the battery management system controller is working can be calculated according to the following formula (3): pcb :

[0082]

[0083] In the formula, I pcb is the operating current on the printed circuit board; R pcb is the resistance of the printed circuit board, and Δt is the working time of the battery management system controller.

[0084] It should be noted that, as those skilled in the art can understand, for the battery management system controller, the design style of its printed circuit board, the selection of microcontroller, capacitors, resistors and other hardware have been determined. When each battery management system controller is working, the operating current on its printed circuit board is basically close. Therefore, the temperature characteristics of this model of battery management system controller can be characterized by testing the current and temperature performance of a single battery management system controller when it is working.

[0085] In some exemplary embodiments, the heat dissipation of the printed circuit board is calculated based on the convection heat transfer coefficient of the printed circuit board, the surface area of ​​the printed circuit board, the operating temperature of the printed circuit board at the previous moment, the actual ambient temperature, and the operating time of the battery management system controller.

[0086] Specifically, since the printed circuit board is in contact with the air, when the temperature of the printed circuit board rises, part of the heat will be dissipated into the air, thereby reducing the temperature rise effect of the printed circuit board. The heat dissipation Q air The calculation formula is shown in the following formula (4):

[0087]

[0088] Wherein, α is the convection heat transfer coefficient of the printed circuit board (unit: W / (m 2 ·℃)); F is the surface area of ​​the printed circuit board (in m 2 ); is the operating temperature of the printed circuit board at the last moment; T air is the actual ambient temperature; Δt is the working time of the battery management system controller.

[0089] It should be noted that, as can be understood by those skilled in the art, if the balancing has not been turned on since the battery management system controller was awakened to the current moment, then the Δt in the above formulas (3) and (4) represents the time difference between the battery management system controller awakening moment and the current moment, that is, Δt represents the unbalanced continuous working time of the battery management system controller since awakening; if the battery management system controller has experienced at least one balancing on and off since awakening to the current moment, then the working time Δt of the battery management system controller in the above formula (4) represents the time difference between the most recent balancing off moment from the current moment and the current moment, that is, Δt represents the unbalanced continuous working time of the battery management system controller since the most recent balancing off moment.

[0090] In some exemplary embodiments, calculating the current operating temperature of the printed circuit board according to the heat release and heat dissipation of the printed circuit board, the initial operating temperature of the printed circuit board, and a pre-constructed second temperature model includes:

[0091] According to the actual ambient temperature and the mapping relationship between the ambient temperature and the heat release correction coefficient obtained in advance, the corresponding heat release correction coefficient is obtained;

[0092] Correcting the heat release of the printed circuit board according to the heat release correction coefficient to obtain a corrected heat release of the printed circuit board;

[0093] Calculating the actual heat generation of the printed circuit board according to the corrected heat generation and heat dissipation of the printed circuit board;

[0094] Calculating the temperature rise of the printed circuit board according to the actual heat generation of the printed circuit board and the specific heat capacity and mass of the printed circuit board;

[0095] The current operating temperature of the printed circuit board is calculated according to the initial operating temperature of the printed circuit board and the temperature rise of the printed circuit board.

[0096] Since the ambient temperature will have a certain influence on the resistance or working current of the printed circuit board, the corresponding heat release correction coefficient is obtained according to the actual ambient temperature and the mapping relationship between the ambient temperature and the heat release correction coefficient obtained in advance, and the heat release of the printed circuit board is corrected according to the heat release correction coefficient, thereby effectively ensuring the accuracy of the calculated current working temperature of the printed circuit board.

[0097] Specifically, when the battery management system controller is in working state and balancing is not turned on, the current working temperature of the printed circuit board can be calculated according to the second temperature model shown in the following formula (5):

[0098]

[0099] Where, T ini is the initial operating temperature T of the printed circuit board ini ; B is the heat release correction coefficient; Q pcb is the heat release of the printed circuit board, Q air is the heat dissipation of the printed circuit board; C pcb is the specific heat capacity of the printed circuit board; m pcb is the mass of the printed circuit board.

[0100] It should be noted that, as can be understood by those skilled in the art, B·Q pcb Correction of the printed circuit board to release heat; is the temperature rise of the printed circuit board. It should also be noted that the inventors have found through research that when balancing is not turned on, the temperature of the printed circuit board is only related to its own heat generation. Based on this, the inventors have constructed a second temperature model as shown in formula (5). It should also be noted that, as can be understood by those skilled in the art, if the battery management system controller has experienced at least one balancing on and off since it was awakened to the current moment, then T in the above formula (5) iniis the operating temperature of the printed circuit board at the time of the most recent balanced closing time. Specifically, after each balanced closing, the initial operating temperature of the printed circuit board is updated according to the operating temperature of the printed circuit board when balanced closing, that is, the operating temperature of the printed circuit board when balanced closing is updated to the new initial operating temperature, and substituted into the above formula (5) to calculate the operating temperature of the printed circuit board when balanced opening in real time.

[0101] Furthermore, the mapping relationship between the ambient temperature and the heat release correction coefficient can be obtained by testing the characteristics of the battery management system controller when it is working in a laboratory environment. Specifically, the battery management system controller can be left to stand at different ambient temperatures (e.g., -20°C, 0°C, 20°C, 40°C), and after the actual temperature of the printed circuit board is consistent with the ambient temperature, the battery management system controller is powered to make the battery management system controller work. During the operation of the battery management system controller, the actual temperature of the printed circuit board is monitored in real time, and the experiment is terminated after the temperature of the printed circuit board is stable (the temperature no longer changes or exceeds the preset temperature threshold). For each ambient temperature, the heat release correction coefficient B at the ambient temperature can be obtained by substituting the temperature data of the printed circuit board when it is working at the ambient temperature into the above formula (5). By fitting the heat release correction coefficients at different ambient temperatures, the mapping relationship between the ambient temperature and the heat release correction coefficient can be obtained.

[0102] Please refer to Table 2, which shows the heat release correction factor at different ambient temperatures.

[0103] Table 2 Heat release correction coefficient at different ambient temperatures

[0104] Ambient temperature -20℃ 0℃ 20℃ 40℃ Heat release correction factor B b1 b2 b3 b4

[0105] In some exemplary implementations, the amount of heat released by the balancing resistor during the balancing process is calculated according to the resistance of the balancing resistor, the balancing current of each balancing cell, and the balancing time of the balancing cell.

[0106] Specifically, passive balancing is to dissipate power in the form of heat release through balancing resistors for high-capacity cells (balancing cells), thereby improving the consistency of the entire battery pack. The main control strategy for passive balancing is: when the operating temperature of the printed circuit board is greater than T thermal (e.g. 110°C), close all the balancing circuits, and the temperature of the printed circuit board will drop. <T thermal After -10 (e.g. 100°C), restart the equalization.

[0107] Furthermore, the working scenario of the battery management system controller is relatively simple. According to Joule's law, the heat released by the balancing resistor during the balancing process can be calculated, thereby estimating the temperature of the printed circuit board. Specifically, the heat released by the balancing resistor during the balancing process Q balance The calculation formula is shown in the following formula (6):

[0108]

[0109] In the formula, I n is the balancing current of the ith balancing cell, Δt n is the balancing time of the ith balancing cell, R d is the resistance of the balancing resistor, and N is the number of balancing cells (that is, the number of opened balancing loops).

[0110] Specifically, for each balancing cell, the balancing current I of the balancing cell can be calculated according to the following formula (7): n :

[0111]

[0112] Where U n is the single cell voltage of the i-th balanced cell.

[0113] In some exemplary embodiments, the calculating the current operating temperature of the printed circuit board according to the operating temperature of the printed circuit board when the balancing is turned on, the heat released by the balancing resistor installed on the printed circuit board during the balancing process, the heat dissipation of the printed circuit board, and a pre-constructed third temperature model includes:

[0114] Calculating the actual heat generated by the printed circuit board according to the heat released by the balancing resistor during the balancing process and the heat dissipated by the printed circuit board;

[0115] Calculating the temperature rise of the printed circuit board according to the actual heat generation of the printed circuit board and the specific heat capacity and mass of the printed circuit board;

[0116] Obtaining a corresponding temperature rise correction coefficient according to the actual ambient temperature and a mapping relationship between the ambient temperature and the temperature rise correction coefficient obtained in advance;

[0117] Correcting the calculated temperature rise according to the temperature rise correction coefficient;

[0118] The current operating temperature of the printed circuit board is calculated according to the operating temperature of the printed circuit board when the printed circuit board is balanced and the corrected temperature rise.

[0119] Since the ambient temperature will have a certain influence on the temperature rise of the printed circuit board during the equalization process, the corresponding temperature rise correction coefficient is obtained according to the actual ambient temperature and the mapping relationship between the pre-acquired ambient temperature and the temperature rise correction coefficient, and the calculated temperature rise is corrected according to the temperature rise correction coefficient, thereby effectively ensuring the accuracy of the calculated current operating temperature of the printed circuit board.

[0120] Specifically, when the battery management system controller is in working state and balancing is not turned on, the current working temperature of the printed circuit board can be calculated according to the third temperature model shown in the following formula (8):

[0121]

[0122] In the formula, is the operating temperature of the printed circuit board when it is balanced and turned on; C is the temperature rise correction coefficient; Q balance Q is the heat released by the balancing resistor during the balancing process; air is the heat dissipation of the printed circuit board; C pcb is the specific heat capacity of the printed circuit board; m pcb is the mass of the printed circuit board.

[0123] It should be noted that, since the printed circuit board is integrated with a balancing resistor, a large amount of heat will be generated after the balancing is turned on, causing the temperature of the printed circuit board to rise rapidly. Based on this, the inventors constructed a third temperature model as shown in the above formula (8). In addition, it should be noted that, as can be understood by those skilled in the art, the heat dissipation Q of the printed circuit board when the balancing is turned on is air The calculation formula is the same as the calculation formula for the heat dissipation of the printed circuit board when balancing is not turned on. For details, please refer to the above formula (4). It should be noted that when calculating the heat dissipation of the printed circuit board during the process of turning on balancing, Δt in the above formula (4) represents the time difference between the start time of this balancing and the current time, that is, Δt in the above formula (4) represents the duration of the balancing continuous working time of the battery management system controller since the balancing is turned on.

[0124] It should also be noted that, as can be understood by those skilled in the art, represents the temperature rise of the printed circuit board during the equalization process, It represents the corrected temperature rise of the printed circuit board during the equalization process.

[0125] Furthermore, in a laboratory environment, the mapping relationship between the ambient temperature and the temperature rise correction coefficient can be obtained by testing the printed circuit board at different ambient temperatures and turning on the temperature rise correction coefficient C after equalization. Specifically, the battery management system controller can be left to stand at different ambient temperatures (e.g., -20°C, 0°C, 20°C, 40°C), and after the actual temperature of the printed circuit board is consistent with the ambient temperature, the battery management system controller is powered to make the battery management system controller work, and different numbers of equalization loops (e.g., 2, 4, 6, 8, 10, 12...) are turned on, the actual temperature of the printed circuit board is recorded, and the experiment is terminated after the temperature of the printed circuit board is stable (the temperature no longer changes or exceeds the preset temperature threshold). For each ambient temperature, the temperature rise correction coefficient C at the ambient temperature can be obtained by substituting the temperature data of the printed circuit board when working at the ambient temperature into the above formula (8). By fitting the temperature rise correction coefficient C at different ambient temperatures, the mapping relationship between the ambient temperature and the heat release correction coefficient can be obtained.

[0126] Please refer to Table 3, which shows the heat release correction factor at different ambient temperatures.

[0127] Table 3 Temperature rise correction coefficients at different ambient temperatures

[0128] temperature -20℃ 0℃ 20℃ 40℃ Temperature rise correction factor C c1 c2 c3 c4

[0129] Based on the same inventive concept, the present invention also provides a printed circuit board temperature control method, please refer to Figure 3 , which is a flow chart of a printed circuit board temperature control method provided by one embodiment of the present invention. Figure 3 As shown, the printed circuit board temperature control method provided by the present invention comprises the following steps:

[0130] Step S210: using any of the printed circuit board temperature monitoring methods described above to obtain the current operating temperature of the printed circuit board.

[0131] Step S220: determine whether the current operating temperature of the printed circuit board is greater than or equal to a preset fault alarm temperature threshold.

[0132] If the current operating temperature of the printed circuit board is lower than the preset fault alarm temperature threshold, step S230 is executed to determine whether to start balancing.

[0133] If balancing is turned on, step S240 is executed to determine whether the current operating temperature of the printed circuit board is greater than or equal to a preset balancing stop temperature threshold.

[0134] If the current operating temperature of the printed circuit board is greater than or equal to the preset balancing stop temperature threshold, step S250 is executed to close all balancing loops.

[0135] Therefore, the printed circuit board control method provided by the present invention estimates the operating temperature of the printed circuit board by adopting the first temperature model, the second temperature model and the third temperature model, and closes all the balancing loops when the current operating temperature of the printed circuit board is greater than or equal to the preset balancing stop temperature threshold, thereby not only reducing the use of NTC thermistors while achieving printed circuit board temperature control, thereby reducing the hardware cost of the battery management system controller, but also avoiding damage to the printed circuit board due to overheating, thereby ensuring the function, performance and service life of the battery management system controller.

[0136] It should be noted that, as those skilled in the art can understand, if the current operating temperature of the printed circuit board is greater than or equal to the preset fault alarm temperature threshold T error , a fault is reported and the battery management system controller is shut down. If the current operating temperature of the printed circuit board is less than the preset equalization stop temperature threshold T thermal , then continue to turn on balancing.

[0137] Please continue to refer to Figure 4 , which is an overall flow chart of a printed circuit board temperature control method provided by one embodiment of the present invention. Figure 4 As shown, the overall process of the printed circuit board temperature control method provided by the present invention can be briefly described as follows: 1. After the battery management system controller is powered on and awakened, based on the current ambient temperature (actual ambient temperature) and the cooling characteristic information of the printed circuit board, the initial operating temperature T of the printed circuit board is obtained. ini ; 2. After the battery management system controller starts working, the operating temperature T of the printed circuit board is calculated based on the second temperature model without equilibrium. normal ; 3. If T normal ≥T error (preset fault temperature threshold, such as 120°C), then a fault is reported and the temperature model calculation ends; 4. If T normal <T error , it is determined whether a balancing circuit is turned on: a) if no balancing circuit is turned on, the operating temperature of the printed circuit board is continuously updated according to the ambient temperature, the operating time of the battery management system controller and the second temperature model; b) if a balancing circuit is turned on, the operating temperature of the printed circuit board is calculated according to the heat generated by the balancing opening (the heat released by the balancing resistor) and the third temperature model: i. If T normal ≥T thermal(preset equalization stop temperature threshold, such as 110°C), indicating that the current operating temperature of the printed circuit board is already very high, and all equalization loops need to be closed at this time to reduce the operating temperature of the printed circuit board. Subsequently, the operating temperature of the printed circuit board is continuously monitored according to the second temperature model; ii. If T normal <T rhermal , the operating temperature of the printed circuit board is continuously calculated according to the balanced heat release (the heat release of the balanced resistor during the balanced process) and the third temperature model.

[0138] Based on the same inventive concept, the present invention also provides a battery management system controller, please refer to Figure 5 , which is a structural block diagram of a battery management system controller provided by one embodiment of the present invention. Figure 5 As shown, the battery management system controller provided by the present invention includes a processor 101 and a memory 103, and a computer program is stored on the memory 103. When the computer program is executed by the processor 101, the printed circuit board temperature monitoring method described above is implemented. Since the battery management system controller provided by the present invention and the printed circuit board temperature monitoring method or printed circuit board temperature control method provided by the present invention belong to the same inventive concept, the battery management system controller provided by the present invention also has at least all the beneficial effects of the printed circuit board temperature monitoring method or printed circuit board temperature control method provided by the present invention. Therefore, the relevant content about the beneficial effects of the battery management system controller provided by the present invention can refer to the relevant description of the beneficial effects of the printed circuit board temperature monitoring method or printed circuit board temperature control method provided by the present invention in the above text, and will not be repeated here one by one.

[0139] Please continue to refer to Figure 5 ,like Figure 5As shown, the battery management system controller also includes a communication interface 102 and a communication bus 104, wherein the processor 101, the communication interface 102, and the memory 103 communicate with each other through the communication bus 104. The communication bus 104 includes but is not limited to a CAN bus, etc. For ease of representation, only one thick line is used in the figure, but it does not mean that there is only one bus or one type of bus. The communication interface 102 is used for communication between the above-mentioned battery management system controller and other vehicle controllers (such as a vehicle controller, a motor controller, etc., not shown in the figure). The communication bus 104 connects the above-mentioned battery management system controller and other vehicle controllers (such as a vehicle controller, a motor controller, etc., not shown in the figure) and other dispersed nodes into a closed-loop system, so that each vehicle controller can communicate and transmit data in multiple working states (parking state, charging state, starting state, running state, vehicle forward and backward state, feedback braking state, mechanical braking state, general fault state, major fault state), thereby realizing the control function of the vehicle.

[0140] Furthermore, the processor 101 referred to in the present invention may be a central processing unit (CPU), or other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. A general-purpose processor may be a microprocessor or any conventional processor, etc. The processor 101 is the control center of the battery management system controller, and various interfaces and lines are used to connect various parts of the entire battery management system controller.

[0141] Further, the memory 103 can be used to store the computer program, and the processor 101 implements various functions of the battery management system controller by running or executing the computer program stored in the memory 103 and calling the data stored in the memory 103. The memory 103 may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable memory (PROM), electrically programmable memory (EPROM), electrically erasable programmable memory (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, random access memory is available in a variety of forms, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous random access memory (SDRAM), double data rate synchronous random access memory (DDRSDRAM), enhanced synchronous random access memory (ESDRAM), synchronous link (Synchlink) dynamic random access memory (SLDRAM), memory bus (Rambus) direct random access memory (RDRAM), direct memory bus dynamic random access memory (DRDRAM), and memory bus dynamic random access memory (RDRAM), etc.

[0142] The present invention also provides a readable storage medium, wherein a computer program is stored in the readable storage medium, and when the computer program is executed by a processor, the printed circuit board temperature monitoring method or the printed circuit board temperature control method described above can be implemented. Since the readable storage medium provided by the present invention and the printed circuit board temperature monitoring method or the printed circuit board temperature control method provided by the present invention belong to the same inventive concept, the readable storage medium provided by the present invention also has at least all the beneficial effects of the printed circuit board temperature monitoring method or the printed circuit board temperature control method provided by the present invention. Therefore, the relevant content of the beneficial effects of the readable storage medium provided by the present invention can refer to the relevant description of the beneficial effects of the printed circuit board temperature monitoring method or the printed circuit board temperature control method provided by the present invention in the above text, and will not be repeated here one by one.

[0143] It should be noted that the readable storage medium provided by the present invention can adopt any combination of one or more computer-readable media. The readable medium can be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium can be, for example, but not limited to, a system, device or component of electricity, magnetism, light, electromagnetic, infrared or semiconductor, or any combination of the above. More specific examples (non-exhaustive enumeration) of computer-readable storage media include: an electrical connection with one or more wires, a portable computer hard disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this article, a computer-readable storage medium can be any tangible medium containing or storing a program, which can be used by an instruction execution system, a device or a device or used in combination with it.

[0144] It should also be noted that a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, which carries a computer-readable program code. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium, which may send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, device, or device. The program code contained on the computer-readable medium may be transmitted using any suitable medium, including but not limited to wireless, wire, optical cable, RF, etc., or any suitable combination of the above.

[0145] In summary, compared with the prior art, the printed circuit board temperature monitoring method, printed circuit board temperature control method, battery management system controller and readable storage medium provided by the present invention have the following advantages:

[0146] Beneficial effects:

[0147] (1) The present invention estimates the operating temperature of the printed circuit board by adopting the first temperature model, the second temperature model and the third temperature model, thereby reducing the use of NTC thermistors while realizing the temperature monitoring of the printed circuit board, thereby reducing the hardware cost of the battery management system controller.

[0148] (2) The present invention estimates the operating temperature of the printed circuit board by adopting the first temperature model, the second temperature model and the third temperature model, and closes all the balancing loops when the current operating temperature of the printed circuit board is greater than or equal to the preset balancing stop temperature threshold. This can not only reduce the use of NTC thermistors while achieving the temperature control of the printed circuit board, thereby reducing the hardware cost of the battery management system controller, but also avoid damage to the printed circuit board due to overheating, thereby ensuring the function, performance and service life of the battery management system controller.

[0149] It should be noted that the computer program code for performing the operation of the present invention can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages-such as Java, Smalltalk, C++, and also conventional procedural programming languages-such as "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as an independent software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer can be connected to the user's computer through any type of network-including a local area network (LAN) or a wide area network (WAN), or can be connected to an external computer (for example, using an Internet service provider to connect through the Internet).

[0150] It should be noted that the devices and methods disclosed in the embodiments of this article can also be implemented in other ways. The device implementation described above is only schematic. For example, the flowcharts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the devices, methods and computer program products according to multiple embodiments of this article. In this regard, each box in the flowchart or block diagram can represent a part of a module, program or code, and the module, program segment or part of the code contains one or more executable instructions for implementing the specified logical function, and the module, program segment or part of the code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flowchart, and the combination of boxes in the block diagram and / or flowchart can be implemented by a dedicated hardware-based system for performing a specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions. In addition, the functional modules in the various embodiments of this document may be integrated together to form an independent part, or each module may exist independently, or two or more modules may be integrated to form an independent part.

[0151] It should also be noted that the above description is only a description of the preferred embodiment of the present invention, and is not any limitation on the scope of the present invention. Any changes and modifications made by a person skilled in the art in the field of the present invention based on the above disclosure are within the scope of protection of the present invention. Obviously, a person skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations fall within the scope of the present invention and its equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for monitoring the temperature of a printed circuit board, characterized in that: include: When the battery management system controller is powered on and awakened, the actual ambient temperature is obtained, and the initial operating temperature of the printed circuit board is calculated according to the actual ambient temperature, the cooling characteristic information of the printed circuit board in the battery management system controller, and the pre-built first temperature model; During the operation of the battery management system controller, if balancing is not turned on, the current operating temperature of the printed circuit board is calculated according to the heat release and heat dissipation of the printed circuit board, the initial operating temperature of the printed circuit board and the pre-constructed second temperature model; During the operation of the battery management system controller, if balancing is turned on, the current operating temperature of the printed circuit board is calculated based on the operating temperature of the printed circuit board when balancing is turned on, the heat released by the balancing resistor installed on the printed circuit board during the balancing process, the heat dissipation of the printed circuit board, and a pre-constructed third temperature model.

2. The printed circuit board temperature monitoring method according to claim 1, characterized in that: The temperature reduction characteristic information of the printed circuit board includes the mass of the printed circuit board, the specific heat capacity of the printed circuit board, the surface area of ​​the printed circuit board, and the convection heat transfer coefficient of the printed circuit board.

3. The printed circuit board temperature monitoring method according to claim 2, characterized in that: The calculating the initial operating temperature of the printed circuit board according to the actual ambient temperature, the cooling characteristic information of the printed circuit board in the battery management system controller, and the pre-built first temperature model includes: According to the actual ambient temperature and the mapping relationship between the ambient temperature and the convective heat transfer correction coefficient obtained in advance, obtaining the corresponding convective heat transfer correction coefficient; Correcting the convective heat transfer coefficient of the printed circuit board according to the convective heat transfer correction coefficient to obtain a convective heat transfer coefficient correction value; Calculate the temperature drop of the printed circuit board according to the actual ambient temperature, the mass of the printed circuit board, the specific heat capacity of the printed circuit board, the surface area of ​​the printed circuit board, the correction value of the convection heat transfer coefficient, and the temperature of the printed circuit board before the battery management system controller is electrically awakened; The initial operating temperature of the printed circuit board is calculated according to the temperature of the printed circuit board when the battery management system controller is electrically awakened and the temperature drop of the printed circuit board.

4. The printed circuit board temperature monitoring method according to claim 1, characterized in that: The heat release of the printed circuit board is calculated according to the resistance of the printed circuit board, the operating current on the printed circuit board, and the operating time of the battery management system controller.

5. The printed circuit board temperature monitoring method according to claim 1, characterized in that: The heat dissipation of the printed circuit board is calculated according to the convection heat transfer coefficient of the printed circuit board, the surface area of ​​the printed circuit board, the operating temperature of the printed circuit board at the previous moment, the actual ambient temperature and the operating time of the battery management system controller.

6. The printed circuit board temperature monitoring method according to claim 1, characterized in that: The calculating the current operating temperature of the printed circuit board according to the heat release and heat dissipation of the printed circuit board, the initial operating temperature of the printed circuit board and the pre-constructed second temperature model includes: According to the actual ambient temperature and the mapping relationship between the ambient temperature and the heat release correction coefficient obtained in advance, the corresponding heat release correction coefficient is obtained; Correcting the heat release of the printed circuit board according to the heat release correction coefficient to obtain a corrected heat release of the printed circuit board; Calculating the actual heat generation of the printed circuit board according to the corrected heat generation and heat dissipation of the printed circuit board; Calculating the temperature rise of the printed circuit board according to the actual heat generation of the printed circuit board and the specific heat capacity and mass of the printed circuit board; The current operating temperature of the printed circuit board is calculated according to the initial operating temperature of the printed circuit board and the temperature rise of the printed circuit board.

7. The printed circuit board temperature monitoring method according to claim 1, characterized in that: The heat released by the balancing resistor during the balancing process is calculated according to the resistance of the balancing resistor, the balancing current of each balancing cell, and the balancing time of the balancing cell.

8. The printed circuit board temperature monitoring method according to claim 1, characterized in that: The calculating the current operating temperature of the printed circuit board according to the operating temperature of the printed circuit board when the balancing is turned on, the heat released by the balancing resistor installed on the printed circuit board during the balancing process, the heat dissipation of the printed circuit board and the pre-constructed third temperature model includes: Calculating the actual heat generated by the printed circuit board according to the heat released by the balancing resistor during the balancing process and the heat dissipated by the printed circuit board; Calculating the temperature rise of the printed circuit board according to the actual heat generation of the printed circuit board and the specific heat capacity and mass of the printed circuit board; Obtaining a corresponding temperature rise correction coefficient according to the actual ambient temperature and a mapping relationship between the ambient temperature and the temperature rise correction coefficient obtained in advance; Correcting the calculated temperature rise according to the temperature rise correction coefficient; The current operating temperature of the printed circuit board is calculated according to the operating temperature of the printed circuit board when the printed circuit board is balanced and the corrected temperature rise.

9. A method for controlling the temperature of a printed circuit board, characterized in that: include: Using the printed circuit board temperature monitoring method according to any one of claims 1 to 8 to obtain the current operating temperature of the printed circuit board; Determining whether the current operating temperature of the printed circuit board is greater than or equal to a preset fault alarm temperature threshold; If not, determine whether to enable balancing; If balancing is turned on, determining whether the current operating temperature of the printed circuit board is greater than or equal to a preset balancing stop temperature threshold; If so, close all balancing loops.

10. A battery management system controller, characterized in that: The method comprises a processor and a memory, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, the printed circuit board temperature monitoring method according to any one of claims 1 to 8 or the printed circuit board temperature control method according to claim 9 is implemented.

11. A readable storage medium, characterized in that: The readable storage medium stores a computer program, and when the computer program is executed by a processor, the printed circuit board temperature monitoring method according to any one of claims 1 to 8 or the printed circuit board temperature control method according to claim 9 is implemented.

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