A wear-resistant wafer cleaning device

Abstract

The present invention belongs to the technical field of chip processing, and specifically discloses an abrasion-resistant wafer cleaning device, which includes a base for supporting the wafer, brackets, cleaning brushes, and a mounting plate. Symmetrically arranged brackets are provided on both sides of the base, a mounting plate is arranged between the symmetrically arranged brackets, two symmetrically arranged driving wheels are provided on both sides of the top of the mounting plate, a driven wheel is arranged below the driving wheel, and a cleaning brush is arranged on the top of the bracket. By adopting the above-mentioned abrasion-resistant wafer cleaning device, the present invention has a simple structure. By changing the structural design of the driven wheel, the wafer can always be kept in a vertical state during cleaning, and the cleaning brush can always contact the surface of the wafer to clean the wafer, avoiding wafer scrapping. By changing the tooth angle of the driving wheel, the abrasion resistance of the driving wheel is enhanced, the service life is prolonged, and the maintenance cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of chip processing, and more particularly to an abrasion-resistant wafer cleaning device. Background Art

[0002] A wafer is a basic material in the semiconductor manufacturing process, usually made of high-purity single-crystalline silicon, or can also be made of other semiconductor materials such as gallium arsenide (GaAs) or silicon carbide (SiC). The surface of the wafer is very flat, and its thickness and diameter vary according to different applications and process requirements. A single-crystalline silicon rod is cut into thin slices to form wafers, and the sliced wafers are ground and polished to make their surfaces reach the required flatness and smoothness. The surface of the wafer is thoroughly cleaned by chemical and physical methods to remove impurities and contaminants.

[0003] During the grinding process of the wafer, after each grinding, the surface of the wafer needs to be cleaned once. Because the particles and impurities adhered to the wafer surface during grinding always adhere to the wafer and are difficult to remove from the wafer surface by the cleaning liquid, a cleaning device is needed to clean the wafer. Generally, the particles and impurities on the wafer surface can be cleaned off by a brush and pure water. In the cleaning device, the accessories that directly contact the wafer are the driven wheel, the driving wheel, and the cleaning brush. In the traditional design, the driven wheel and the driving wheel generally need to be replaced once every two months. Due to the continuous operation of the production line, the card slot of the driven wheel continuously rubs against the wafer, resulting in the widening of the card slot gap, which easily causes the wafer to be not erected straight, making the wafer tilt to one side, and the cleaning brush on the corresponding side does not contact the wafer and the cleaning is not thorough, resulting in the wafer being unclean and causing the wafer to be scrapped, which seriously hinders the improvement of the quality and efficiency of chip processing and directly causes economic losses due to wafer scrapping in the chip factory. Summary of the Invention

[0004] The purpose of the present invention is to provide an abrasion-resistant wafer cleaning device with a simple structure. By changing the structural design of the driven wheel, the wafer can always be kept in a vertical state during cleaning, and the cleaning brush can always contact the wafer surface to clean the wafer and avoid wafer scrapping; by changing the tooth angle of the driving wheel, the wear resistance of the driving wheel is enhanced, the service life is extended, and the maintenance cost is reduced.

[0005] To achieve the above object, the present invention provides an abrasion-resistant wafer cleaning device, which includes a base for supporting the wafer, brackets, cleaning brushes, and a mounting plate. Symmetrically arranged brackets are provided on both sides of the base, a mounting plate is provided between the symmetrically arranged brackets, two symmetrically arranged driving wheels are provided on both sides of the top of the mounting plate, a driven wheel is provided below the driving wheel, and cleaning brushes are provided on the top of the brackets.

[0006] Preferably, two parallel rotating shafts are provided at the top of the bracket, and cleaning brushes are circumferentially arranged on the outer surfaces of the two rotating shafts respectively, and the length of the cleaning brushes is greater than the diameter of the wafer.

[0007] Preferably, both ends of the rotating shaft are rotatably connected to the bracket.

[0008] Preferably, the connecting lines between the two driving wheels and the driven wheel form an isosceles triangle, the two driving wheels and the driven wheel are respectively rotatably connected to the mounting plate, and the driving wheels and the driven wheel are respectively in contact with the edge of the wafer.

[0009] Preferably, a wafer card slot is circumferentially arranged on the outer surface of the driven wheel, a liquid discharge groove is arranged at the bottom of the card slot, the card slot includes a vertical portion and a V-shaped portion, the vertical portion is located above the V-shaped portion and is communicated with the V-shaped portion, the V-shaped portion is communicated with the liquid discharge groove, and the thickness of the side wall of the card slot is 2.9±0.1 mm.

[0010] Preferably, a plurality of uniformly distributed teeth are circumferentially arranged on the outer surface of the driving wheel, a tooth groove is arranged between adjacent teeth, and the included angle between the edge of the tooth and the edge of the tooth groove is designed as a rounded corner.

[0011] Preferably, the materials of the driving wheel and the driven wheel are both ternary peroxyfluororubber.

[0012] The advantages and beneficial effects of the present invention adopting the above-mentioned wear-resistant wafer cleaning device are as follows:

[0013] The structure of the present invention is simple and easy to operate. By changing the structure design of the driven wheel, the wafer can always be cleaned in a vertical state, and the cleaning brush can always contact the surface of the wafer to clean the wafer, avoiding the scrapping of the wafer due to insufficient cleaning; by changing the tooth angle of the driving wheel, the wear-resistant performance of the driving wheel is enhanced, the service life is prolonged, and the maintenance cost is reduced; by setting an appropriate wall thickness of the card slot, it can not only ensure that the downward pressure of the wafer self-weight does not cause deformation of the side wall of the V-shaped groove of the driven wheel, but also will not jam the wafer and prevent it from rotating; by adding a liquid discharge groove below the card slot, the cleaning water is discharged, so that the cleaning reaches the best state.

[0014] The technical solution of the present invention will be further described in detail below with reference to the drawings and embodiments. Description of the Drawings

[0015] Figure 1 is the overall structural schematic diagram of a wear-resistant wafer cleaning device of the present invention;

[0016] Figure 2 is the cross-sectional schematic diagram of the driven wheel in a wear-resistant wafer cleaning device of the present invention;

[0017] Figure 3 is the schematic diagram of the wafer being clamped with the card slot in a wear-resistant wafer cleaning device of the present invention;

[0018] Figure 4 It is a schematic diagram of the driven wheel card slot in the prior art;

[0019] Figure 5 It is a schematic diagram of the driven wheel in a wear-resistant wafer cleaning device of the present invention;

[0020] Figure 6 It is a schematic diagram of the driving wheel in a wear-resistant wafer cleaning device of the present invention;

[0021] Figure 7 It is a schematic diagram of the driving wheel teeth in the prior art;

[0022] Figure 8 It is a schematic diagram of the driving wheel teeth in a wear-resistant wafer cleaning device of the present invention. Brief Description of the Drawings

[0024] 1. Wafer; 2. Cleaning brush; 3. Mounting plate; 4. Driven wheel; 5. Driving wheel; 6. Base; 7. Bracket; 8. Rotating shaft; 9. Card slot; 10. Drainage groove; 11. Rounded corner. Detailed Embodiment

[0025] The technical solutions of the present invention will be further described below with reference to the drawings and embodiments.

[0026] Unless otherwise defined, the technical terms or scientific terms used in the present invention should have the ordinary meaning as understood by those of ordinary skill in the field to which the present invention belongs. The "first", "second" and similar terms used in the present invention do not denote any order, quantity or importance, but are only used to distinguish different components. The terms such as "comprising" or "including" mean that the elements or objects appearing before the term cover the elements or objects listed after the term and their equivalents, without excluding other elements or objects. The terms such as "connected" or "coupled" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The terms such as "upper", "lower", "left", "right" are only used to represent relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0027] Embodiment 1

[0028] As Figure 1As shown in the figure, a wear-resistant wafer cleaning device includes a base 6 for supporting the wafer 1, a bracket 7, a cleaning brush 2, and a mounting plate 3. Symmetrically arranged brackets 7 are provided on both sides of the base 6. A mounting plate 3 is provided between the symmetrically arranged brackets 7. Two symmetrically arranged driving wheels 5 are provided on both sides of the top of the mounting plate 3. A driven wheel 4 is provided below the driving wheels 5. The connecting lines between the two driving wheels 5 and the driven wheel 4 form an isosceles triangle. The two driving wheels 5 and the driven wheel 4 are respectively rotatably connected to the mounting plate 3, and the driving wheels 5 and the driven wheel 4 are respectively in contact with the edge of the wafer 1. As Figure 5 shown, a wafer slot 9 is provided along the circumferential direction on the outer surface of the driven wheel 4. A liquid discharge groove 10 is provided at the bottom of the slot 9 (as Figure 2 shown). The slot 9 includes a vertical portion and a V-shaped portion. The vertical portion is located above the V-shaped portion and is communicated with the V-shaped portion. The V-shaped portion is communicated with the liquid discharge groove 10. The thickness of the side wall of the slot 9 is 2.9 ± 0.1 mm.

[0029] As Figure 6 shown, a plurality of uniformly distributed teeth are provided along the circumferential direction on the outer surface of the driving wheel 5. A tooth groove is provided between adjacent teeth. The included angle between the edge of the tooth and the edge of the tooth groove is a fillet 11 design. The materials of the driving wheel 5 and the driven wheel 4 are both ternary peroxyfluororubber.

[0030] A cleaning brush 2 is provided at the top of the bracket 7. Two parallel rotating shafts 8 are provided at the top of the bracket 7. Both ends of the rotating shaft 8 are respectively rotatably connected to the bracket 7. The cleaning brush 2 is respectively circumferentially provided on the outer surfaces of the two rotating shafts 8, and the length of the cleaning brush 2 is greater than the diameter of the wafer 1.

[0031] The driving mechanism and the driving principle of the device of the present invention are both prior arts. When in use, the wafer 1 is placed between the two rotating shafts 8. The bottom edge of the wafer 1 is located in the slot 9 of the driven wheel 4. The width of the slot 9 is adapted to the edge thickness of the wafer 1. The two driving wheels 5 are in contact with the edge of the wafer 1. The rotating shafts 8 rotate under the action of the driving mechanism. The cleaning brush 2 is provided on both sides of the wafer 1. The cleaning brush 2 rotates when the rotating shaft 8 rotates, and can clean both sides of the wafer 1. The two driving wheels 5 hold the wafer 1. The driving wheels 5 rotate under the action of the driving mechanism. The wafer 1 rotates following the driving wheels 5. The driven wheel 4 rotates as the wafer 1 rotates. The wafer 1 rotates and the cleaning brush 2 also rotates, so that the two sides of the wafer 1 can be cleaned as a whole.

[0032] As Figure 7 and Figure 8As shown, when the wafer 1 rotates, the edge of the wafer 1 rubs against the teeth on the driving wheel 5, and the teeth are extruded by the wafer 1 under the action of the gravity of the wafer 1. In the prior art, the connection between the edge of the tooth of the driving wheel 5 and the tooth groove is designed as a right angle. Since the right angle directly contacts the wafer 1 and is extruded, a mark will be worn out after a long time. In the present invention, the design here is changed from a right angle to a rounded corner 11 (R corner) design, which greatly reduces the frictional resistance, improves the wear resistance of the driving wheel 5, and prolongs the service life of the driving wheel 5.

[0033] As Figure 3 and Figure 4 shown, in the prior art, the card slot 9 of the driven wheel 4 is a traditional right-angle U-shaped groove. The driven wheel 4 of the present invention adopts a brand-new structure, which is optimized from the traditional right-angle U-shaped groove to a V-shaped groove design. This structure can efficiently and evenly disperse the pressure exerted by the wafer 1 downward. The edge of the wafer 1 is completely fitted with the V-shaped and newly designed structure of the driven wheel 4, ensuring that the wafer 1 does not tilt unilaterally. After repeated tests and optimizations, the most suitable structural form is determined to ensure that the wafer 1 can maintain a vertical state during the cleaning process, so that both sides of the wafer 1 can be fully contacted by the cleaning brush.

[0034] Through precise calculation and experimental verification, the most suitable thickness parameter of the side wall of the card slot 9 is determined to be 2.9±0.1 mm. This thickness can ensure that the downward pressure of the self-weight of the wafer 1 will not cause the side wall of the V-shaped groove of the driven wheel 4 to deform, nor will it jam the wafer 1 and prevent it from rotating.

[0035] In order to further enhance the reliability of the driving wheel 5, the present invention also makes an innovative design for the bottom of the V-shaped groove and adds a drain groove 10. The cleaning water flowing through the surface of the wafer 1 is discharged from the inside of the driven wheel 4 through the drain groove 10 in time, significantly improving the cleaning effect of the wafer 1.

[0036] During use, the wafer 1 is inserted between the two rotating shafts 8 and rotated for cleaning. During the removal process, the wafer 1 always maintains a vertical state, enabling it to still work stably in a fast cleaning operation environment, not easily causing damage to the driving wheel 5, and ensuring the continuity and reliability of chip processing.

[0037] Therefore, the present invention adopts the above-mentioned wear-resistant wafer cleaning device, which has a simple structure. By changing the structural design of the driven wheel, the wafer can always be maintained in a vertical state during cleaning, the cleaning brush can always contact the surface of the wafer to clean the wafer and avoid wafer scrapping; by changing the tooth angle of the driving wheel, the wear resistance of the driving wheel is enhanced, the service life is prolonged, and the maintenance cost is reduced.

[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions of the present invention or make equivalent replacements, and these modifications or equivalent replacements cannot make the modified technical solutions deviate from the spirit and scope of the technical solutions of the present invention.

Claims

1. A wear-resistant wafer cleaning device, characterized in that: It includes a base, a bracket, a cleaning brush and a mounting plate for supporting the wafer. The base is provided with symmetrical brackets on both sides, a mounting plate is provided between the symmetrical brackets, two symmetrical driving wheels are provided on both sides of the top of the mounting plate, a driven wheel is provided under the driving wheel, and a cleaning brush is provided on the top of the bracket; Two parallel rotating shafts are arranged on the top of the bracket, and cleaning brushes are circumferentially arranged on the outer surfaces of the two rotating shafts, and the length of the cleaning brushes is greater than the diameter of the wafer; Both ends of the rotating shaft are rotatably connected to the bracket respectively; The connecting line between the two driving wheels and the driven wheels is an isosceles triangle, the two driving wheels and the driven wheels are respectively rotatably connected to the mounting plate, and the driving wheels and the driven wheels are respectively in contact with the edge of the wafer; The driven wheel outer surface is provided with a wafer slot along the circumferential direction, the bottom of the slot is provided with a liquid drainage groove, the slot includes a vertical portion and a V-shaped portion, the vertical portion is located above the V-shaped portion and is connected to the V-shaped portion, the V-shaped portion is connected to the liquid drainage groove, and the side wall thickness of the slot is 2.9±0.1mm; The outer surface of the driving wheel is provided with a plurality of evenly distributed gear teeth along the circumferential direction, gear tooth grooves are provided between adjacent gear teeth, and the angle between the edge of the gear tooth and the edge of the gear tooth groove is a rounded angle design; The materials of the driving wheel and the driven wheel are both ternary peroxide fluororubber.

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