TEC enhanced air-cooled radiator and its design method and design device

Abstract

The present disclosure relates to a TEC-enhanced air-cooled heat sink and its design method and device. The TEC-enhanced air-cooled heat sink includes: a heat spreader having a first contact surface and a second contact surface disposed opposite each other, the first contact surface being attached to a heat source; a first heat sink attached to the second contact surface; a TEC unit having a cold surface attached to the second contact surface; and a second heat sink attached to the hot surface of the TEC unit. In a cooling air supply path, the first heat sink is located upwind of the second heat sink and the TEC unit. The present disclosure helps improve the efficiency of heat transfer from the heat sink to the air, helps improve the heat dissipation capacity in a space-constrained area where the heat sink is located, helps reduce the heat dissipation space required for a high-power heat source, helps increase space utilization, and helps improve the cost-effectiveness between heat dissipation effect and energy consumption.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation equipment, and in particular to a TEC enhanced air-cooled heat sink and a design method and a design device thereof. Background Art

[0002] In order to avoid various problems that may be caused by excessively high chip operating temperatures, the heat generated by the chip during operation needs to be discharged in a timely manner to ensure that the chip operates in an ideal temperature range.

[0003] The mainstream cooling methods for chips mainly include air cooling and water cooling. Among them, the air cooling method uses the combination of a radiator and a fan. The radiator is mounted on the chip, and the heat generated by the chip enters the radiator by heat conduction. When the cooling air sent by the fan passes through the radiator, the heat of the radiator is taken away by the cooling air. The water cooling method mainly changes the wind medium to a water medium or other liquid medium, and removes the heat of the chip through water circulation. Although the upper limit of the heat dissipation effect of the water cooling method may be higher, compared with the air cooling method, the equipment structure of the water cooling method is more complex, the cost is higher, and it is necessary to prevent the leakage of the coolant. Therefore, the air cooling method is still a mainstream heat dissipation method. However, since the equipment to which the chip belongs is affected by environmental factors, it will be difficult to further improve the upper limit of the heat dissipation efficiency of the air cooling method. Summary of the Invention

[0004] In view of this, the present disclosure provides a TEC enhanced air-cooled heat sink and a design method and a design device thereof to help improve the heat dissipation efficiency of the air-cooled heat dissipation method.

[0005] The technical solution of the present disclosure is achieved as follows:

[0006] According to one aspect of an embodiment of the present disclosure, a TEC enhanced air-cooled heat sink is provided, comprising:

[0007] The heat spreader has a first contact surface and a second contact surface opposite to each other, wherein the first contact surface is attached to the heat source;

[0008] a first heat sink, the first heat sink being attached to the second contact surface;

[0009] a TEC unit, wherein the cold surface of the TEC unit is mounted on the second contact surface;

[0010] a second heat sink, the second heat sink being attached to the hot surface of the TEC unit;

[0011] Wherein, on the air supply path of the cooling air, the first heat sink is located on the upwind side of the second heat sink and the TEC unit.

[0012] In one possible implementation, the first heat sink and the second heat sink both include:

[0013] A plurality of heat dissipation fins are provided, and the plurality of heat dissipation fins extend along an air supply path of the cooling air.

[0014] In one possible implementation manner, the first heat sink and the second heat sink are independent of each other.

[0015] In one possible implementation manner, the mounting area of the second heat sink is equal to the area of the TEC unit.

[0016] In one possible implementation, the TEC enhanced air-cooled heat sink further includes:

[0017] A TEC control module is coupled to the TEC unit and is used to control heat conduction of the TEC unit according to preset configuration parameters.

[0018] According to another aspect of the present disclosure, a design method for a TEC-enhanced air-cooled heat sink is provided, comprising:

[0019] Establishing a simulation model of the TEC enhanced air-cooled heat sink as described in any of the above items;

[0020] According to the simulation model, the auxiliary heat dissipation power of the TEC unit and the average temperature of the vapor chamber are obtained when the TEC unit is turned on;

[0021] Acquiring a target temperature difference parameter of the TEC unit and characteristic curve data associated with the TEC unit;

[0022] Obtaining configuration parameters of the TEC unit according to the auxiliary heat dissipation power, the average temperature of the vapor chamber, the target temperature difference parameter, and the characteristic curve data;

[0023] The configuration parameters are evaluated, and if the evaluation is passed, the design of the TEC enhanced air-cooled heat sink is completed.

[0024] In one possible implementation, obtaining, based on the simulation model, the auxiliary heat dissipation power of the TEC unit and the average temperature of the vapor chamber when the TEC unit is turned on includes:

[0025] Simulating the simulation model to obtain the natural heat dissipation power of the TEC enhanced air-cooled radiator when the TEC unit is turned off;

[0026] Obtaining, according to a preset maximum heat dissipation power and the natural heat dissipation power, an auxiliary heat dissipation power of the TEC unit when the TEC unit is turned on;

[0027] The simulation model is simulated to obtain the average temperature of the vapor chamber when the TEC unit is turned on.

[0028] In one possible implementation, the configuration parameters include an operating current of the TEC unit, an operating voltage of the TEC unit, and a COP;

[0029] The characteristic curve data includes heat current curve data, voltage current curve data, and COP current curve data of the TEC unit;

[0030] The configuration parameters of the TEC unit are obtained according to the auxiliary heat dissipation power, the average temperature of the vapor chamber, the target temperature difference parameter, and the characteristic curve data, including:

[0031] Obtaining an operating current of the TEC unit according to the auxiliary heat dissipation power, the average temperature of the vapor chamber, the target temperature difference parameter, and the thermal current curve data;

[0032] Obtaining an operating voltage of the TEC unit according to the operating current of the TEC unit, the target temperature difference parameter, and the voltage-current curve data;

[0033] The COP of the TEC unit is obtained according to the operating current of the TEC unit, the target temperature difference parameter and the COP current curve data.

[0034] In one possible implementation, evaluating the configuration parameters includes:

[0035] Get the preset evaluation target range parameters;

[0036] determining, based on the configuration parameter and the evaluation target range parameter, whether the configuration parameter is within a range specified by the evaluation target range parameter;

[0037] The evaluation passes if the configuration parameter is within the range specified by the evaluation target range parameter.

[0038] In one possible implementation, the design method of the TEC enhanced air-cooled heat sink further includes:

[0039] If the evaluation fails, obtaining updated design parameters, wherein the updated design parameters include at least one of updated dimension data of the simulation model, updated target temperature difference parameters, and updated characteristic curve data of the TEC unit;

[0040] Based on the updated design parameters, obtaining updated configuration parameters of the TEC unit;

[0041] The updated configuration parameters are evaluated, and if the evaluation passes, the design of the TEC enhanced air-cooled radiator is completed.

[0042] According to another aspect of the present disclosure, a design device for a TEC-enhanced air-cooled heat sink is provided, comprising:

[0043] A model building module configured to execute building a simulation model of the TEC enhanced air-cooled heat sink as described in any one of the above items, wherein the size of the TEC unit is configured according to preset size parameters;

[0044] a simulation calculation module configured to execute, according to the simulation model, obtaining the auxiliary heat dissipation power of the TEC unit and the average temperature of the vapor chamber when the TEC unit is turned on;

[0045] a condition data acquisition module configured to acquire a target temperature difference parameter of the TEC unit and characteristic curve data associated with the TEC unit;

[0046] a configuration parameter acquisition module configured to obtain configuration parameters of the TEC unit according to the auxiliary heat dissipation power, the average temperature of the vapor chamber, the target temperature difference parameter, and the characteristic curve data;

[0047] The evaluation module is configured to evaluate the configuration parameters and complete the design of the TEC enhanced air-cooled heat sink if the evaluation passes.

[0048] According to another aspect of the present disclosure, an electronic device is provided, including:

[0049] processor;

[0050] a memory for storing executable instructions for the processor;

[0051] The processor is configured to execute the executable instructions to implement the design method of the TEC enhanced air-cooled heat sink as described in any one of the above items.

[0052] According to another aspect of an embodiment of the present disclosure, a computer-readable storage medium is provided. When at least one instruction in the computer-readable storage medium is executed by a processor of an electronic device, the electronic device is enabled to implement the design method of a TEC enhanced air-cooled heat sink as described in any one of the above items.

[0053] As can be seen from the above scheme, in the disclosed TEC-enhanced air-cooled heat sink, heat generated by the heat source is transferred to the first heat sink and the TEC unit through the vapor chamber. Because the TEC unit enhances thermal conductivity during operation, the second heat sink is able to absorb more heat from the vapor chamber per unit area than the first heat sink, thereby forming a heat gradient between the second and first heat sinks, causing the temperature of the second heat sink to be higher than that of the first heat sink. Therefore, in the cooling air supply path, the first heat sink is located upwind of the second heat sink, allowing the cooling air to continue to exchange heat with the second heat sink after heat exchange with the first heat sink, removing heat from the second heat sink, thereby improving the heat dissipation efficiency of the air-cooled heat sink. Because the TEC unit only occupies a portion of the area within the heat sink formed by the first and second heat sinks, it is more conducive to reducing the power consumption of the TEC unit compared to related technologies, thereby improving the economic efficiency of the TEC-enhanced air-cooled heat sink. Finally, through the control of the TEC control module, the TEC unit can be turned on and off at the right time, thereby achieving effective control of economic efficiency. In the TEC-enhanced air-cooled heat sink disclosed herein, the cold surface of the TEC unit can effectively lower the temperature of the vapor chamber, thereby improving the efficiency of heat transfer from the heat source to the outside. The hot surface of the TEC unit increases the temperature gradient between the local temperature of the heat sink and the air, which helps further improve the efficiency of heat transfer from the heat sink to the air. This helps to improve the heat dissipation capacity in the spatially confined area where the TEC-enhanced air-cooled heat sink is located, helping to increase the heat dissipation limit of high-power boards (such as 600W-100W PCIE cards), and helps to reduce the heat dissipation space required for high-power heat sources, thereby improving space utilization. Furthermore, the TEC-enhanced air-cooled heat sink designed using the design method disclosed herein not only has the effects of the aforementioned TEC-enhanced air-cooled heat sink, but also further optimizes the TEC unit. While maintaining the good heat dissipation capacity of the designed TEC-enhanced air-cooled heat sink, it can achieve a good price-performance ratio between heat dissipation effect and energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] Figure 1 It is a structural diagram of the air cooling heat dissipation method in the related art;

[0055] Figure 2 It is a structural diagram of an air-cooling heat dissipation method with TEC in the related art;

[0056] Figure 3 1 is a schematic side structural diagram of a TEC enhanced air-cooled radiator according to an exemplary embodiment;

[0057] Figure 4is a schematic diagram of a system for implementing a design method for a TEC enhanced air-cooled heat sink according to an exemplary embodiment;

[0058] Figure 5 is a flow chart illustrating a design method of a TEC enhanced air-cooled heat sink according to an exemplary embodiment;

[0059] Figure 6 is a flow chart showing steps for obtaining the auxiliary heat dissipation power of the TEC unit and the average temperature of the vapor chamber when the TEC unit is turned on, according to an exemplary embodiment;

[0060] Figure 7 is a flow chart showing steps for obtaining configuration parameters of a TEC unit according to an exemplary embodiment;

[0061] Figure 8A is a schematic diagram of a thermal current curve according to an exemplary embodiment;

[0062] Figure 8B is a schematic diagram of a voltage and current curve according to an exemplary embodiment;

[0063] Figure 8C is a schematic diagram of a COP current curve according to an exemplary embodiment;

[0064] Figure 9 is a flow chart showing steps for evaluating configuration parameters according to an exemplary embodiment;

[0065] Figure 10 is a flowchart showing steps of re-simulation and re-evaluation according to an exemplary embodiment;

[0066] Figure 11 1 is a schematic diagram of the logical structure of a design device for a TEC enhanced air-cooled heat sink according to an exemplary embodiment;

[0067] Figure 12 It is a structural diagram of an electronic device provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0068] In order to make the objectives, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below with reference to the accompanying drawings and examples.

[0069] It should be noted that the terms "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0070] Figure 1 It is a structural diagram of the air cooling method in the related technology, such as Figure 1As shown, the structure includes a heat source 10 and a heat sink 20, wherein the heat source 10 can be, for example, a chip, and the heat sink 20 is mounted on the heat source 10, wherein the heat sink 20 can be mounted on the surface of the heat source 10 by welding, or can be pressed to the surface of the heat source 10 by pressing. In order to enhance the heat conduction effect between the heat source 10 and the heat sink 20, a thermal conductive adhesive can be further included between the heat source 10 and the heat sink 20. Before installing the heat sink 20, the thermal conductive adhesive is first applied to the surface of the heat source 10, and then the heat sink 20 is installed on the surface of the heat source 10.

[0071] Figure 1 The air cooling method is a relatively passive heat dissipation method. Even if the heat on the surface of the radiator 20 is removed by an air supply device (such as a fan), the heat dissipation effect is still not ideal due to the limitations of the space and ambient temperature of the radiator 20. Especially in a relatively compact space, the temperature difference between the air temperature and the radiator 20 is relatively small, and the heat dissipation capacity is further limited.

[0072] In order to improve the heat dissipation capability of this relatively passive heat dissipation method, TEC (ThermoElectric Cooler) was introduced into the related technology for auxiliary heat dissipation.

[0073] A TEC is a solid-state cooling device based on the Peltier effect in semiconductor materials. The Peltier effect describes a phenomenon in which, when a direct current passes through a galvanic couple composed of two semiconductor materials, one end absorbs heat and the other releases it. The smallest unit of a TEC consists of a pair of N-type and P-type semiconductors and connecting electrodes, forming the cold and hot ends. Based on the Peltier effect, under the influence of an external electric field, the current in the TEC transfers heat from one end to the other, creating a hot side (hot surface) and a cold side (cold surface) on the TEC. Furthermore, by changing the direction of the current, a TEC can be used for both cooling and heating, achieving precise temperature control. TECs are characterized by being silent, vibration-free, refrigerant-free, compact, and lightweight. They are reliable, easy to operate, provide fast cooling and heating, are easily adjustable, and offer precise temperature control.

[0074] Figure 2 This is a schematic diagram of the structure of the air-cooling heat dissipation method with TEC in the related art, such as Figure 2As shown, the structure includes a heat source 10, a TEC 30, and a heat sink 20, wherein the cold surface of the TEC 30 is mounted on the heat source 10, and the heat sink 20 is mounted on the hot surface of the TEC 30. The cold surface of the TEC 30 can be mounted on the surface of the heat source 10 by welding or pressing, and the heat sink 20 can be mounted on the hot surface of the TEC 30 by welding or pressing. When the TEC 30 is powered on, the heat generated by the heat source 10 is transferred from the cold surface of the TEC 30 to the hot surface. Between the heat sink 20 and the heat source 10, the TEC 30 accelerates the heat conduction. Compared with Figure 1 Compared with the air cooling method shown in the figure, the air cooling method with TEC 30 has higher heat dissipation efficiency.

[0075] However, the cooling coefficient of TEC is relatively small and the power consumption is relatively large. Figure 1 As for the air-cooling method, the heat dissipation efficiency of the air-cooling method with TEC is improved, but it is also subject to the limitations of the space where the radiator is located and the ambient temperature, which leads to the heat dissipation efficiency not being able to be further improved. In addition, because the TEC itself also consumes power during operation, the air-cooling method of TEC also has certain challenges in terms of power consumption economy.

[0076] In view of this, the embodiments of the present disclosure provide a TEC enhanced air-cooled heat sink and its design method and design device to help improve the heat dissipation efficiency of the air-cooled heat dissipation method, realize flexible heat dissipation method control, and help improve the economy of the air-cooled heat dissipation method with TEC.

[0077] Figure 3 FIG. 1 is a side structural diagram of a TEC enhanced air-cooled radiator according to an exemplary embodiment. Figure 3 As shown, the TEC enhanced air cooling radiator mainly includes a heat spreader 301, a first heat sink 302, a TEC unit 303 and a second heat sink 304. The heat spreader 301 has a first contact surface and a second contact surface that are opposite to each other, for example Figure 3 In the figure, the first contact surface is the contact surface of the heat spreader 301 facing downward (hereinafter referred to as the lower contact surface), and the second contact surface is the contact surface of the heat spreader 301 facing upward (hereinafter referred to as the upper contact surface). The first contact surface is attached to the heat source 10, for example Figure 3 As shown, the lower contact surface of the heat spreader 301 is attached to the heat source 10. In the exemplary embodiment, the heat source 10 can be a device that needs to dissipate heat or control temperature, such as a chip, a small electronic product, a circuit board, etc. The first heat sink 302 is attached to the second contact surface, for example Figure 3 As shown, the first heat sink 302 is mounted on the upper contact surface of the heat spreader 301. The cold surface of the TEC unit 303 is mounted on the second contact surface, for example Figure 3As shown, the cold surface of the TEC unit 303 is mounted on the upper contact surface of the heat spreader 301, wherein the cold surface of the TEC unit 303 is Figure 3 The second heat sink 304 is mounted on the hot side of the TEC unit 303, wherein the hot side of the TEC unit 303 is Figure 3 The TEC unit 303 is shown facing upward.

[0078] In the exemplary embodiment, the first heat sink 302, the TEC unit 303 and the second heat sink 304 are all located on one side of the second contact surface of the heat spreader 301. The relative position relationship between the first heat sink 302 and the second heat sink 304 is that, in the air supply path of the cooling air, the first heat sink 302 is located on the upwind side of the second heat sink 304 and the TEC unit 303, or in other words, the second heat sink 304 and the TEC unit 303 are located on the downwind side of the first heat sink 302.

[0079] In the TEC-enhanced air-cooled heat sink of the disclosed embodiment, heat generated by heat source 10 is transferred to vapor chamber 301. Vapor chamber 301 evenly distributes the heat transferred from heat source 10 throughout its body, ensuring a substantially uniform temperature across vapor chamber 301. This facilitates further heat transfer to first heat sink 302 and TEC unit 303. Because TEC unit 303 enhances thermal conductivity during operation, second heat sink 304 is able to absorb more heat from vapor chamber 301 per unit area than first heat sink 302, creating a thermal gradient between the second heat sink 304 and the first heat sink 302. This allows the temperature of the second heat sink 304 to be higher than that of the first heat sink 302. Therefore, on the air supply path of the cooling air, the first heat sink 302 is located on the upwind side of the second heat sink 304 and the TEC unit 303. After the cooling air exchanges heat with the first heat sink 302, the temperature of the cooling air will increase. However, because the temperature of the second heat sink 304 is higher than that of the first heat sink 302, the cooling air can still exchange heat with the second heat sink 304 and take away the heat of the second heat sink 304.

[0080] and Figure 1 Compared with the related art shown in FIG, because the TEC unit 303 is added, Figure 1 Under the same structural dimensions as shown, the TEC enhanced air-cooled radiator of the embodiment of the present disclosure has stronger heat dissipation capacity, higher heat dissipation efficiency, and better heat dissipation effect.

[0081] and Figure 2 Compared with the related art shown in Figure 2Under the same structural dimensions as shown, because the TEC unit 303 in the embodiment of the present disclosure only occupies a portion of the area of the radiator composed of the first heat sink 302 and the second heat sink 304, the size of the TEC unit 303 can be designed to be smaller, which is more conducive to reducing the power consumption of the TEC unit 303 and improving the economy of the TEC enhanced air-cooled radiator. In addition, because a heat gradient is formed between the second heat sink 304 and the first heat sink 302, the cooling air can be further heated when passing through the second heat sink 304 after being heated by the first heat sink 302, which is more conducive to increasing the heat carried by the cooling air. Therefore, compared to Figure 2 As shown in the related art, the TEC enhanced air-cooled heat sink of the embodiment of the present disclosure also helps to improve the heat dissipation capacity and economy.

[0082] It should be noted that, as an illustration, the cooling wind direction is, for example, Figure 3 The arrow direction from right to left indicates that the wind is blowing from Figure 3 The right side shown passes through the first heat sink 302 and the second heat sink 304 in sequence from left to right. Figure 3 The side structure is only presented to more clearly illustrate the key structure of the TEC enhanced air-cooled radiator. Figure 3 The TEC enhanced air-cooled heat sink shown and in the embodiment of the present disclosure may further include the related structures described in the following embodiments.

[0083] In the exemplary embodiment, both the first heat sink 302 and the second heat sink 304 include a plurality of heat fins extending along the cooling air supply path, thereby allowing the cooling air to pass through the gaps between the heat fins in the first heat sink 302 and the second heat sink 304. Because the heat fins increase the heat dissipation area of the first heat sink 302 and the second heat sink 304, when the cooling air can pass through the gaps between the heat fins in the first heat sink 302 and the second heat sink 304, the area for heat exchange between the cooling air and the first heat sink 302 and the second heat sink 304 is larger, further facilitating heat dissipation from the radiator.

[0084] Because a heat gradient needs to be formed between the first heat sink 302 and the second heat sink 304, in the exemplary embodiment, the first heat sink 302 and the second heat sink 304 are independent of each other. The independence of the first heat sink 302 and the second heat sink 304 means that the first heat sink 302 and the second heat sink 304 are physically separated from each other. Since the first heat sink 302 and the second heat sink 304 are not integral, direct heat conduction does not occur between the first heat sink 302 and the second heat sink 304. This ensures a temperature difference between the first heat sink 302 and the second heat sink 304. Under the action of the TEC unit 303, the temperature of the second heat sink 304 can be kept higher than that of the first heat sink 302. However, if the first heat sink 302 and the second heat sink 304 were integrally designed or not physically separated, the temperature of the second heat sink 304 and the first heat sink 302 would converge due to heat conduction, potentially weakening their heat dissipation capabilities.

[0085] In the exemplary embodiment, the mounting area of the second heat sink 304 is equal to the area of the TEC unit 303. This helps maximize the ability of the TEC unit 303 to transfer heat from the vapor chamber 301 to the second heat sink 304, thereby improving the heat dissipation effect of the second heat sink 304.

[0086] In order to improve the heat dissipation capability of the vapor chamber 301 and help transfer heat from the heat source 10 to the cold surface of the first heat sink 302 and the TEC unit 303 with maximum efficiency, in the exemplary embodiment, the vapor chamber 301 can adopt a VC (Vapor Chamber, vacuum chamber heat dissipation technology) plate, a vapor chamber with an embedded heat pipe structure, a vapor chamber with a high thermal conductivity material such as graphene, etc.

[0087] remove Figure 3 In addition to the structure shown, in the exemplary embodiment, the TEC enhanced air-cooled radiator of the embodiment of the present disclosure may further include a TEC control module. The TEC control module is coupled to the TEC unit 303, and is used to control the heat conduction of the TEC unit 303 according to preset configuration parameters. In the exemplary embodiment, the TEC control module is used to control the opening and closing of the TEC unit 303, so that the operation of the TEC unit 303 is started when auxiliary heat dissipation of the TEC unit 303 is required, and the operation of the TEC unit 303 is stopped when auxiliary heat dissipation of the TEC unit 303 is not required. When the operation of the TEC unit 303 is stopped, the TEC unit 303 only serves as an intermediate medium for passive heat conduction, and conducts the heat of the heat spreader 301 to the second heat sink 304, so that the TEC enhanced air-cooled radiator of the embodiment of the present disclosure can be equivalent to a whole. Figure 1The heat dissipation method of the related art shown in FIG. Therefore, the TEC unit 303 can be turned on or off as needed to achieve effective control of economic efficiency. For example, when the heat source 10 is at a low temperature, the TEC unit 303 can be turned off to save power consumption of the TEC unit 303. When the heat source 10 is at a high temperature, the TEC unit 303 can be turned on to improve heat dissipation efficiency.

[0088] In the exemplary embodiment, the TEC control module can also be used to control the power of the TEC unit 303, thereby achieving a desired auxiliary heat dissipation effect by adjusting the power of the TEC unit 303. For example, when the TEC unit 303 is already turned on and performing auxiliary heat dissipation at a preset power, if it is necessary to accelerate the heat dissipation of the heat source 10 for a period of time, the TEC control module can appropriately increase the power of the TEC unit 303 during this period to enhance the auxiliary heat dissipation capability of the TEC unit 303, and then restore the power of the TEC unit 303 to the preset power. For another example, when the TEC unit 303 is already turned on and performing auxiliary heat dissipation at a preset power, if it is necessary to slow down the heat dissipation of the heat source 10 for a period of time, the TEC control module can appropriately reduce the power of the TEC unit 303 during this period to weaken the auxiliary heat dissipation capability of the TEC unit 303, and then restore the power of the TEC unit 303 to the preset power.

[0089] In the exemplary embodiment, the size of the TEC unit 303 together with the size of the second heat sink 304 mounted thereon can be designed as needed, or the relevant configuration parameters of the TEC unit 303 can be set according to the size of the provided TEC unit 303 and the overall design size and heat dissipation efficiency of the TEC enhanced air-cooled radiator.

[0090] In the exemplary embodiment, appropriate mounting methods can be selected as needed between the heat spreader 301 and the heat source 10, between the first heat sink 302 and the heat spreader 301, between the TEC unit 303 and the heat spreader 301, and between the second heat sink 304 and the TEC unit 303, such as welding or mounting by coating a thermally conductive material (such as thermally conductive silicone) and pressing. In order to achieve an ideal thermal conductivity effect, welding is preferably used.

[0091] In the TEC-enhanced air-cooled heat sink of the disclosed embodiment, heat generated by a heat source is transferred to the first heat sink and the TEC unit through a vapor chamber. Because the TEC unit enhances thermal conductivity during operation, the second heat sink is able to absorb more heat from the vapor chamber per unit area than the first heat sink, thereby forming a heat gradient between the second and first heat sinks, causing the temperature of the second heat sink to be higher than that of the first. Therefore, in the cooling air supply path, the first heat sink is located upwind of the second heat sink. This allows the cooling air to continue to exchange heat with the second heat sink after heat exchange with the first heat sink, removing heat from the second heat sink, thereby improving the heat dissipation efficiency of the air-cooled heat sink. Because the TEC unit only occupies a portion of the area within the heat sink formed by the first and second heat sinks, it is more conducive to reducing the power consumption of the TEC unit than in related art, thereby improving the economic efficiency of the TEC-enhanced air-cooled heat sink. Finally, through the control of the TEC control module, the TEC unit can be turned on and off at the right time, thereby achieving effective control of economic efficiency. In the TEC enhanced air-cooled heat sink of the disclosed embodiment, the cold surface of the TEC unit can effectively reduce the temperature of the heat spreader, thereby improving the efficiency of heat transfer from the heat source to the outside. The hot surface of the TEC unit increases the temperature gradient between the local temperature of the heat sink and the air, which helps to further improve the efficiency of heat transfer from the heat sink to the air, helps to improve the heat dissipation capacity in the space-constrained area where the TEC enhanced air-cooled heat sink is located, helps to increase the heat dissipation upper limit of high-power boards (such as 600W~100W PCIE cards), and helps to reduce the heat dissipation space required for high-power heat sources, thereby helping to increase space utilization.

[0092] To further optimize the heat dissipation efficiency and economic efficiency of the TEC-enhanced air-cooled heat sink of the disclosed embodiment, the TEC-enhanced air-cooled heat sink can be designed within the overall size constraints of the TEC-enhanced air-cooled heat sink, taking into account existing conditions (such as the size and configuration parameters of the TEC unit 303). Based on this, the disclosed embodiment also provides a design method for a TEC-enhanced air-cooled heat sink.

[0093] Figure 4 FIG. 1 is a schematic diagram of a system for implementing a design method for a TEC enhanced air-cooled heat sink according to an exemplary embodiment. Figure 4As shown, the system 400 for executing the TEC-enhanced air-cooled heat sink design method includes a first processor 410 and a storage device 420. The storage device 420 is coupled to the first processor 410. In an exemplary embodiment, the system may be, for example, a server system, with the storage device 420 and the first processor 410 coupled via a bus system within the server system. In the exemplary embodiment, the storage device 420 is used to store programs, scripts, files, data, etc. In the exemplary embodiment, the first processor 410 can execute programs and scripts to perform the TEC-enhanced air-cooled heat sink design process. The files and data may include files and data related to the TEC-enhanced air-cooled heat sink design process.

[0094] In this exemplary embodiment, first processor 410 can obtain corresponding results by accessing content (at least one of a program, script, file, or data) stored in storage device 420 and executing corresponding processing. For example, first processor 410 can establish a simulation model of a TEC-enhanced air-cooled heat sink by accessing simulation model parameters stored in storage device 420, and obtain desired results by running the simulation model and performing corresponding calculations. All intermediate data, files, final results, and data involved can be stored in storage device 420.

[0095] In the exemplary embodiment, the first processor 410 may be a central processing unit (CPU), other programmable general-purpose or special-purpose microprocessor, a digital signal processor (DSP), a programmable controller, an application-specific integrated circuit (ASIC), a programmable logic device (PLD), other similar processing devices, or a combination of these devices. In the exemplary embodiment, the storage device 420 may be a computer-readable storage medium having computer-readable instructions stored thereon. When the computer-readable instructions are executed by the first processor 410, the steps of the design method of the TEC-enhanced air-cooled heat sink according to the embodiment of the present disclosure may be executed. In the exemplary embodiment, the computer-readable storage medium may be, for example, volatile memory or non-volatile memory, or may include both volatile and non-volatile memory. The non-volatile memory may be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. The volatile memory may be random access memory (RAM), which functions as an external cache. By way of example and not limitation, various forms of RAM may be employed, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous dynamic random access memory (SDRAM), double data rate synchronous dynamic random access memory (DDR SDRAM), enhanced synchronous dynamic random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), direct memory bus random access memory (DR RAM), etc. The storage device 420 may store the data, scripts, programs, software, algorithms, etc. required to implement the various steps of the design method for a TEC-enhanced air-cooled heat sink according to the disclosed embodiment, and provide execution by the first processor 410.

[0096] Figure 5 FIG. 1 is a flow chart of a design method for a TEC enhanced air-cooled heat sink according to an exemplary embodiment. Figure 5 As shown, the design method mainly includes the following steps 501 to 505.

[0097] Step 501: Establish a simulation model of a TEC enhanced air-cooled radiator.

[0098] Among them, the TEC enhanced air-cooled radiator is the TEC enhanced air-cooled radiator in the above-mentioned embodiments. In the exemplary embodiment, the size of the TEC unit is configured according to preset size parameters. The size parameters can be the size parameters of an existing TEC unit product or the size parameters of a TEC unit product to be designed and produced. In the exemplary embodiment, the relevant parameters for establishing the simulation model can further include the size and related parameters of each component, such as the heat parameters of the heat source, the size of the heat spreader and its thermal conductivity, the shape and size of the first heat sink and its thermal conductivity, the shape and size of the second heat sink and its thermal conductivity, wind direction parameters, wind force parameters, etc. In the exemplary embodiment, the simulation model in step 501 can be established based on the initial design parameters. If the subsequent evaluation fails, some of the parameters in the initial design parameters can be updated and the subsequent simulation process of steps 502 to 504 can be performed again.

[0099] Step 502: Obtain the auxiliary heat dissipation power of the TEC unit and the average temperature of the vapor chamber when the TEC unit is turned on according to the simulation model.

[0100] In an exemplary embodiment, the auxiliary heat dissipation power of the TEC unit and the average temperature of the vapor chamber can be obtained by running a simulation model. Figure 6 FIG. 1 is a flow chart showing steps for obtaining the auxiliary heat dissipation power of the TEC unit and the average temperature of the vapor chamber when the TEC unit is turned on, according to an exemplary embodiment. Figure 6 As shown, step 502 may include the following steps 601 to 603.

[0101] Step 601: Simulate the simulation model to obtain the natural heat dissipation power of the TEC enhanced air-cooled radiator when the TEC unit is turned off.

[0102] In this exemplary embodiment, during the simulation, the heat source temperature can be set to a preset maximum temperature, representing the highest temperature the heat source can reach during operation. To ensure that the designed TEC-enhanced air-cooled heat sink can maximize its heat dissipation, the maximum temperature set for the heat source during the simulation can be slightly higher than the actual temperature of the heat source (e.g., a chip). This also allows for more reliable natural heat dissipation power from the TEC-enhanced air-cooled heat sink.

[0103] Step 602: Obtain the auxiliary heat dissipation power of the TEC unit when the TEC unit is turned on according to the preset maximum heat dissipation power and the natural heat dissipation power.

[0104] In an exemplary embodiment, the auxiliary heat dissipation power of the TEC unit when the TEC unit is turned on can be calculated by the following formula:

[0105] ΔP=P0-P1

[0106] Wherein, ΔP is the auxiliary heat dissipation power of the TEC unit when the TEC unit is turned on, P0 is the preset maximum heat dissipation power, and P1 is the natural heat dissipation power of the TEC enhanced air-cooled radiator when the TEC unit is turned off.

[0107] The maximum heat dissipation power can be set based on the environment in which the designed TEC-enhanced air-cooled heat sink will ultimately be used. The maximum heat dissipation power is an expected value, representing the maximum heat dissipation capacity of the TEC-enhanced air-cooled heat sink. The maximum heat dissipation power can be set based on factors such as the maximum operating temperature of the heat source, the ambient temperature of the space in which the TEC-enhanced air-cooled heat sink is located, and the cooling air volume. The maximum heat dissipation power can be a manually set parameter or a parameter obtained through relevant evaluation methods. For example, the maximum heat dissipation power can be determined based on experimental measurement data, such as the relationship between the maximum heat source temperature, ambient temperature, cooling air volume, and other parameters and the maximum heat dissipation power.

[0108] Step 603: Simulate the simulation model to obtain the average temperature of the vapor chamber when the TEC unit is turned on.

[0109] Among them, because the cold surface of the TEC unit is mounted on the second contact surface of the heat sink, in step 603, when the TEC unit is turned on, the average temperature of the heat sink when the TEC unit is turned on is equivalent to the cold surface temperature of the TEC unit when the TEC unit is turned on.

[0110] Step 503: Obtain target temperature difference parameters of the TEC unit and characteristic curve data associated with the TEC unit.

[0111] In the exemplary embodiment, the target temperature difference parameter of the TEC unit is the target temperature difference parameter between the cold side and the hot side of the TEC unit. For a TEC, the temperature difference parameter between the cold side and the hot side is one of its configuration parameters. For TEC products, the temperature difference parameter is recorded in the TEC's instruction manual or technical manual.

[0112] According to the heat transfer formula:

[0113] q=-k·A·dT / dx

[0114] It can be seen that, with k and A constant, a larger dT / dx results in a larger q. In the disclosed embodiment, dT / dx represents the temperature gradient (temperature difference) between the second heat sink and the cooling air, q represents the amount of heat dissipated by the second heat sink to the passing air (cooling air). It can also be considered that q represents the heat transferred from the cold surface to the hot surface of the TEC unit plus the heat generated by the TEC unit itself during operation. k represents the heat transfer coefficient between the second heat sink surface and the air, and A represents the surface area of the second heat sink in the air. A larger dT / dx results in a larger q, meaning that a larger temperature gradient (temperature difference) between the second heat sink and the cooling air results in a larger amount of heat dissipated by the second heat sink. In the disclosed embodiment, given a constant TEC unit cold surface temperature (i.e., the average vapor chamber temperature), a larger target temperature difference parameter indicates a higher second heat sink temperature (i.e., the TEC unit hot surface temperature). Consequently, a larger temperature gradient (temperature difference) between the second heat sink and the cooling air, i.e., dT / dx, results in a larger amount of heat dissipated by the second heat sink to the passing air (cooling air). Therefore, setting a larger target temperature difference parameter helps improve the heat dissipation efficiency of the second heat sink. However, because q includes the heat generated by the TEC unit itself during operation, the setting of the target temperature difference parameter also needs to consider the operating energy consumption of the TEC unit. Excessive operating energy consumption will reduce energy efficiency.

[0115] Generally speaking, the temperature difference parameter of a TEC includes multiple configurable values. A higher temperature difference parameter generally means a greater cooling capacity of the TEC, but also means a higher power consumption when the TEC itself is cooling. In an exemplary embodiment, the target temperature difference parameter of the TEC unit can be one of the temperature difference parameters of the TEC unit selected based on the application requirements of the TEC enhanced air-cooled heat sink. Because there may be multiple target temperature difference parameters that meet the application requirements of the TEC enhanced air-cooled heat sink among all the temperature difference parameters of the TEC unit, a smaller temperature difference parameter can be selected as the target temperature difference parameter for subsequent design steps. If the evaluation fails, other target temperature difference parameters can be selected to perform subsequent design steps and re-evaluate. If the evaluation passes, the corresponding target temperature difference parameter can be used as the final configuration parameter set for the TEC unit in the TEC enhanced air-cooled heat sink. It should be noted that, in the present disclosure, for the purpose of distinction, "TEC" may generally refer to a semiconductor refrigerator (a solid-state refrigeration device made based on the Peltier effect of semiconductor materials). In the description, "TEC" is used to limit the subsequent description objects. For example, "TEC enhanced air-cooled radiator" may refer to a radiator containing a TEC heat dissipation structure and heat dissipation method. "TEC unit" refers to an object having the TEC structure itself and realizing the TEC function. It can be considered that "TEC unit" refers to the solid-state refrigeration device itself made based on the Peltier effect of semiconductor materials, and "TEC control module" refers to the control module used to control the "TEC unit".

[0116] In the exemplary embodiment, a characteristic curve is a graph depicting the relationship between key parameters describing TEC performance. For TEC products, the characteristic curve is documented in the TEC's specification sheet or technical manual. TEC characteristic curves typically include a thermal current curve, a voltage-current curve, a COP (Coefficient of Performance) current curve, and a total thermal voltage curve. The thermal current curve represents the relationship between the maximum heat load (Qc) that the TEC can absorb and the operating current of the TEC unit at a specific hot end (hot surface) temperature. The thermal current curve can be used to determine the operating current of the TEC unit at a given temperature difference (e.g., a target temperature difference parameter). The operating current of the TEC unit is one of the TEC configuration parameters. The voltage-current curve represents the relationship between the operating voltage of the TEC unit and the operating current of the TEC unit at a specific temperature difference (e.g., a target temperature difference parameter). The voltage-current curve can be used to determine the operating voltage of the TEC unit at a given operating current. The operating voltage of the TEC unit is one of the TEC configuration parameters. The COP current curve represents the cooling efficiency of the TEC, that is, the ratio of cooling power to input power. The COP current curve shows the COP value of the TEC under different operating currents of the TEC unit, which can be used to evaluate the cooling efficiency of the TEC. Among them, COP is also one of the TEC configuration parameters.

[0117] In an exemplary embodiment, the target temperature difference parameter of the TEC unit and the characteristic curve data associated with the TEC unit may be stored in a storage device for use by the processor.

[0118] Step 504 : Obtain configuration parameters of the TEC unit according to the auxiliary heat dissipation power, the average temperature of the vapor chamber, the target temperature difference parameter, and the characteristic curve data.

[0119] Figure 7 This is a flowchart showing the steps for obtaining the configuration parameters of a TEC unit according to an exemplary embodiment. In the exemplary embodiment, the configuration parameters include the operating current of the TEC unit, the operating voltage of the TEC unit, and the COP (Cooling Performance Rate). The characteristic curve data includes the heat current curve data, the voltage current curve data, and the COP current curve data of the TEC unit. Based on this, as Figure 7 As shown, step 504 may specifically include the following steps 701 to 703.

[0120] Step 701: Obtain the operating current of the TEC unit according to the auxiliary heat dissipation power, the average temperature of the heat sink, the target temperature difference parameter, and the thermal current curve data.

[0121] Figure 8A is a schematic diagram of a thermal current curve according to an exemplary embodiment. Figure 8A The thermal current curve when the TEC unit hot surface temperature is c (a certain temperature value) is shown as follows: Figure 8A As shown, the horizontal axis represents the operating current of the TEC unit, and the unit can be A (ampere), and the vertical axis represents the auxiliary heat dissipation power, which can usually be represented by Qc, and the unit can be W (watt). Different curves represent the relationship between the operating current and auxiliary heat dissipation power of the TEC unit under different temperature difference parameters (such as different target temperature difference parameters).

[0122] like Figure 8A As shown, assuming that the target temperature difference parameter is Δt1 and the average temperature of the vapor chamber is T1 (i.e., the cold surface temperature of the TEC unit is T1), it can be known that the hot surface temperature of the TEC unit c=T1+Δt1. In this way, in step 701, the temperature used when the hot surface temperature of the TEC unit is c can be determined. Figure 8A The thermal current curve is shown. Figure 8A In the figure, the auxiliary heat dissipation power ΔP, the target temperature difference parameter Δt1, and the TEC unit hot surface temperature c obtained by the target temperature difference parameter Δt1 and the average temperature of the heat plate T1 have all been determined, so it can be obtained by Figure 8A The heat current curve is used to obtain the working current I of the TEC unit corresponding to the auxiliary heat dissipation power ΔP in the curve with the target temperature difference parameter Δt1.

[0123] Step 702: Obtain the operating voltage of the TEC unit according to the operating current of the TEC unit, the target temperature difference parameter, and the voltage-current curve data.

[0124] Figure 8B is a schematic diagram of a voltage-current curve according to an exemplary embodiment. Figure 8B The thermal current curve when the TEC unit hot surface temperature is c is shown in the figure. Figure 8B As shown, the horizontal axis represents the operating current of the TEC unit, and the vertical axis represents the operating voltage of the TEC unit, and the unit can be V (volt). Different curves represent the relationship between the operating current of the TEC unit and the operating voltage of the TEC unit under different temperature difference parameters (such as different target temperature difference parameters).

[0125] like Figure 8B As shown in the figure, when the operating current I of the TEC unit, the target temperature difference parameter Δt1, and the TEC unit hot surface temperature c obtained by the target temperature difference parameter Δt1 and the average temperature T1 of the heat plate are all determined, the TEC unit hot surface temperature c can be obtained by Figure 8B Among the curves with the target temperature difference parameter Δt1 obtained from the voltage-current curve, the operating voltage U of the TEC unit corresponds to the operating current I of the TEC unit.

[0126] Step 703: Obtain the COP of the TEC unit according to the operating current of the TEC unit, the target temperature difference parameter, and the COP current curve data.

[0127] Figure 8C is a schematic diagram of a COP current curve according to an exemplary embodiment. Figure 8C The COP current curve when the TEC unit hot surface temperature is c is shown in the figure. Figure 8C As shown, the horizontal axis represents the operating current of the TEC unit, the vertical axis represents the COP of the TEC unit, and different curves represent the relationship between the operating current and COP of the TEC unit under different temperature difference parameters (such as different target temperature difference parameters).

[0128] like Figure 8C As shown in the figure, when the operating current I of the TEC unit, the target temperature difference parameter Δt1, and the TEC unit hot surface temperature c obtained by the target temperature difference parameter Δt1 and the average temperature T1 of the heat plate are all determined, the TEC unit hot surface temperature c can be obtained by Figure 8C Among the curves with the target temperature difference parameter Δt1, the COP value C corresponding to the operating current I of the TEC unit is obtained.

[0129] The configuration parameters of the TEC unit can be obtained through the above steps 701 to 703, and the operation of the TEC unit can be controlled based on the configuration parameters.

[0130] Step 505: Evaluate the configuration parameters, and if the evaluation passes, complete the design of the TEC enhanced air-cooled heat sink.

[0131] Because TEC units also consume power during operation, for example, a large temperature difference between the hot and cold surfaces of a TEC unit, a high operating current, a high operating voltage, or a low COP may all indicate high TEC unit power consumption. Therefore, the configuration parameters of the TEC unit can be optimized. Based on this, the design method for a TEC-enhanced air-cooled heat sink in the disclosed embodiment also includes an evaluation process in step 505. The purpose of this evaluation is to obtain optimal configuration parameters for the TEC unit, so that the designed TEC-enhanced air-cooled heat sink achieves a good price-performance ratio between heat dissipation and energy consumption.

[0132] Figure 9 is a flowchart showing the steps of evaluating configuration parameters according to an exemplary embodiment, such as Figure 9 As shown, in the exemplary embodiment, step 505 may specifically include the following process from step 901 to step 903.

[0133] Step 901: Obtain preset evaluation target range parameters.

[0134] Among them, the evaluation target range parameter represents the range of configuration parameters of the TEC unit that can achieve a good cost-effectiveness between heat dissipation effect and energy consumption. The evaluation target range parameter can be determined according to demand, for example, the evaluation target range parameter can be determined according to the expected energy consumption of the designed TEC enhanced air-cooled radiator.

[0135] Step 902: Determine, based on the configuration parameters and the evaluation target range parameters, whether the configuration parameters are within the range specified by the evaluation target range parameters.

[0136] In an exemplary embodiment, the configuration parameter may be compared with the evaluation target range parameter to determine whether the configuration parameter falls within the range specified by the evaluation target range parameter.

[0137] Step 903: If the configuration parameter is within the range specified by the evaluation target range parameter, the evaluation passes.

[0138] In the exemplary embodiment, the configuration parameters being within the range specified by the evaluation target range parameters means that when the TEC unit operates based on the configuration parameters, the designed TEC enhanced air-cooled radiator can achieve the expected cost-effectiveness target between heat dissipation effect and energy consumption, and meet the expected design requirements.

[0139] In an exemplary embodiment, in step 903 , the processor may prompt that the evaluation is passed by issuing information regarding the evaluation being passed.

[0140] In the exemplary embodiment, the evaluation may fail, i.e., the configuration parameters are outside the range specified by the evaluation target range parameters. This means that the designed TEC-enhanced air-cooled heat sink fails to achieve the expected cost-effectiveness between heat dissipation and energy consumption, and fails to meet the expected design requirements. In this case, it may be necessary to perform simulation design again based on new design parameters. In the exemplary embodiment, step 505 may further include: if the configuration parameters are outside the range specified by the evaluation target range parameters, the evaluation fails. In the exemplary embodiment, the processor may issue a message indicating the evaluation failure to indicate the evaluation failure.

[0141] In an exemplary embodiment, when the evaluation fails, the design method of the TEC enhanced air-cooled heat sink of the embodiment of the present disclosure may further include a process of re-simulating and evaluating the TEC enhanced air-cooled heat sink. Figure 10 is a flowchart of the steps of re-simulation and re-evaluation according to an exemplary embodiment, as shown in FIG. Figure 10 As shown, in the exemplary embodiment, the design method of the TEC enhanced air-cooled heat sink of the embodiment of the present disclosure may further include the following steps 1001 to 1003.

[0142] Step 1001: If the evaluation fails, obtain updated design parameters, where the updated design parameters include at least one of updated dimensional data of the simulation model, updated target temperature difference parameters, and updated characteristic curve data of the TEC unit.

[0143] Step 1002: Obtain updated configuration parameters of the TEC unit based on the updated design parameters;

[0144] Step 1003: Evaluate the updated configuration parameters, and if the evaluation passes, complete the design of the TEC enhanced air-cooled heat sink.

[0145] In the exemplary embodiment, because the overall size of the designed TEC enhanced air-cooled radiator needs to adapt to the space where the TEC enhanced air-cooled radiator is located, the overall size of the TEC enhanced air-cooled radiator may not change, and the TEC unit therein may be replaceable. Based on this, the design size of the TEC unit together with the design size of the second heat sink mounted thereon and the design size of the first heat sink can be updated.

[0146] In the exemplary embodiment, there may be a situation where the size of the TEC enhanced air-cooled radiator is appropriate but only the configuration parameters of the TEC unit are inappropriate. Based on this, the size of the TEC enhanced air-cooled radiator may not be updated but only the configuration parameters of the TEC unit may be updated. Figure 8A 、 Figure 8B 、 Figure 8C As shown in the curve, the TEC unit has different configuration parameters under different temperature difference parameters (e.g., different target temperature difference parameters). Based on this, it is possible to update only the target temperature difference parameter without updating the size of the TEC enhanced air-cooled heat sink, thereby obtaining new configuration parameters of the TEC unit by only updating the parameters of the target temperature difference parameter and performing another evaluation.

[0147] In an exemplary embodiment, the specific execution process of step 1002 may include the processes in steps 502 to 504 in the above embodiments, except that the parameters involved are updated. In an exemplary embodiment, the specific execution process of step 1003 may include the process in step 505 in the above implementation.

[0148] The TEC enhanced air-cooled radiator designed by the design method of the TEC enhanced air-cooled radiator of the embodiment of the present disclosure, in addition to having the advantages of the TEC enhanced air-cooled radiator of the above-mentioned embodiments, further realizes the optimization of the TEC unit. On the basis of ensuring the good heat dissipation capability of the designed TEC enhanced air-cooled radiator, a better cost-effectiveness can be achieved between the heat dissipation effect and energy consumption.

[0149] Figure 11 FIG. 1 is a schematic diagram showing the logical structure of a design device for a TEC enhanced air-cooled heat sink according to an exemplary embodiment. Figure 11 As shown, the design device for a TEC-enhanced air-cooled heat sink primarily includes a model building module 1101, a simulation calculation module 1102, a conditional data acquisition module 1103, a configuration parameter acquisition module 1104, and an evaluation module 1105. The model building module 1101 is configured to establish a simulation model of a TEC-enhanced air-cooled heat sink as described in any of the above embodiments, wherein the dimensions of the TEC unit are configured according to preset dimension parameters. The simulation calculation module 1102 is configured to obtain, based on the simulation model, the auxiliary heat dissipation power of the TEC unit and the average temperature of the vapor chamber when the TEC unit is turned on. The conditional data acquisition module 1103 is configured to obtain a target temperature difference parameter for the TEC unit and characteristic curve data associated with the TEC unit. The configuration parameter acquisition module 1104 is configured to obtain the configuration parameters of the TEC unit based on the auxiliary heat dissipation power, the average temperature of the vapor chamber, the target temperature difference parameter, and the characteristic curve data. The evaluation module 1105 is configured to evaluate the configuration parameters and, if the evaluation passes, complete the design of the TEC-enhanced air-cooled heat sink.

[0150] In an exemplary embodiment, the simulation calculation module 1102 may be further configured to perform:

[0151] The simulation model is simulated to obtain the natural heat dissipation power of the TEC enhanced air-cooled radiator when the TEC unit is turned off; based on the preset maximum heat dissipation power and natural heat dissipation power, the auxiliary heat dissipation power of the TEC unit when the TEC unit is turned on is obtained; the simulation model is simulated to obtain the average temperature of the heat sink when the TEC unit is turned on.

[0152] In the exemplary embodiment, the configuration parameters include the operating current of the TEC unit, the operating voltage of the TEC unit, and the COP; and the characteristic curve data includes the thermal current curve data, the voltage-current curve data, and the COP-current curve data of the TEC unit. Based on this, the configuration parameter acquisition module 1104 can be further configured to: obtain the operating current of the TEC unit based on the auxiliary heat dissipation power, the average temperature of the vapor chamber, the target temperature difference parameter, and the thermal current curve data; obtain the operating voltage of the TEC unit based on the operating current of the TEC unit, the target temperature difference parameter, and the voltage-current curve data; and obtain the COP of the TEC unit based on the operating current of the TEC unit, the target temperature difference parameter, and the COP-current curve data.

[0153] In an illustrative embodiment, the evaluation module 1105 can be further configured to perform: obtaining a preset evaluation target range parameter; determining whether the configuration parameter is within the range specified by the evaluation target range parameter based on the configuration parameter and the evaluation target range parameter; and if the configuration parameter is within the range specified by the evaluation target range parameter, the evaluation passes.

[0154] In an exemplary embodiment, the design method of the TEC enhanced air-cooled heat sink may further include:

[0155] A design parameter acquisition module is configured to acquire updated design parameters when the evaluation fails, the updated design parameters including at least one of updated dimensional data of the simulation model, updated target temperature difference parameters, and updated characteristic curve data of the TEC unit;

[0156] The configuration parameter updating module is configured to obtain updated configuration parameters of the TEC unit based on the updated design parameters.

[0157] The evaluation module 1105 may be further configured to evaluate the updated configuration parameters, and complete the design of the TEC enhanced air-cooled heat sink if the evaluation passes.

[0158] In an exemplary embodiment, the configuration parameter updating module may obtain updated configuration parameters of the TEC unit 303 based on the updated design parameters by calling the simulation calculation module 1102 , the condition data acquisition module 1103 and the configuration parameter acquisition module 1104 .

[0159] All the above optional technical solutions can be arbitrarily combined to form optional embodiments of the present disclosure, and will not be described in detail here.

[0160] Regarding the design device of the TEC enhanced air-cooled radiator in the above embodiment, the specific manner in which each unit performs the operation has been described in detail in the embodiment of the design method of the TEC enhanced air-cooled radiator, and will not be elaborated here.

[0161] It should be noted that the above embodiments are only illustrative of the division of the above functional modules. In actual applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above.

[0162] Figure 12: is a structural diagram of an electronic device provided in an embodiment of the present disclosure. In some embodiments, the electronic device is a server. The electronic device 1200 may have relatively large differences due to different configurations or performances, and may include one or more processors (Central Processing Units, CPU) 1201 and one or more memories 1202, wherein the memory 1202 stores at least one program code, and the at least one program code is loaded and executed by the processor 1201 to implement the design method of the TEC enhanced air-cooled radiator provided in each of the above embodiments. Of course, the electronic device 1200 may also have components such as a wired or wireless network interface, a keyboard, and an input and output interface for input and output. The electronic device 1200 may also include other components for realizing the functions of the device, which will not be described in detail here.

[0163] In an exemplary embodiment, a computer-readable storage medium including at least one instruction is also provided, such as a memory including at least one instruction. The at least one instruction can be executed by a processor in a computer device to complete the design method of the TEC enhanced air-cooled radiator in the above embodiment.

[0164] Optionally, the above-mentioned computer-readable storage medium may be a non-temporary computer-readable storage medium, for example, the non-temporary computer-readable storage medium may include ROM (Read-Only Memory), RAM (Random-Access Memory), CD-ROM (Compact Disc Read-Only Memory), magnetic tape, floppy disk and optical data storage device, etc.

[0165] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present disclosure should be included in the scope of protection of the present disclosure.

Claims

1. A design method for a TEC enhanced air-cooled heat sink, comprising: A simulation model of a TEC-enhanced air-cooled radiator is established, wherein the TEC-enhanced air-cooled radiator comprises: a vapor chamber having a first contact surface and a second contact surface opposite to each other, the first contact surface being attached to a heat source; a first heat sink, the first heat sink being attached to the second contact surface; a TEC unit, the cold surface of the TEC unit being attached to the second contact surface; and a second heat sink, the second heat sink being attached to the hot surface of the TEC unit; wherein, in a supply path of cooling air, the first heat sink is located upwind of the second heat sink and the TEC unit, wherein the temperatures at various locations in a vapor chamber model object in the simulation model are set to be consistent and the temperatures at various locations in the vapor chamber model object are set to rise and fall simultaneously; Obtaining, according to the simulation model, the auxiliary heat dissipation power of the TEC unit and the average temperature of the vapor chamber when the TEC unit is turned on, including: simulating the simulation model to obtain the natural heat dissipation power of the TEC enhanced air-cooled radiator when the TEC unit is turned off; obtaining the auxiliary heat dissipation power of the TEC unit when the TEC unit is turned on based on a preset maximum heat dissipation power and the natural heat dissipation power; and simulating the simulation model to obtain the average temperature of the vapor chamber when the TEC unit is turned on; Obtaining a target temperature difference parameter of the TEC unit and characteristic curve data associated with the TEC unit, wherein, if there are multiple target temperature difference parameters that meet the application requirements of the TEC enhanced air-cooled radiator, selecting a smaller target temperature difference parameter among the multiple target temperature difference parameters; Obtaining configuration parameters of the TEC unit according to the auxiliary heat dissipation power, the average temperature of the vapor chamber, the target temperature difference parameter, and the characteristic curve data, wherein the characteristic curve data includes heat current curve data, voltage current curve data, and COP current curve data of the TEC unit, and the configuration parameters include an operating current, an operating voltage, and a COP of the TEC unit; Evaluate the configuration parameters and, if the evaluation is passed, complete the design of the TEC enhanced air-cooled radiator; The configuration parameters of the TEC unit are obtained according to the auxiliary heat dissipation power, the average temperature of the vapor chamber, the target temperature difference parameter, and the characteristic curve data, including: Obtaining the operating current of the TEC unit according to the auxiliary heat dissipation power, the average temperature of the vapor chamber, the target temperature difference parameter, and the thermal current curve data, including: obtaining the hot surface temperature of the TEC unit according to the target temperature difference parameter and the average temperature of the vapor chamber, and obtaining the operating current of the TEC unit corresponding to the auxiliary heat dissipation power from a curve corresponding to the target temperature difference parameter in the thermal current curve corresponding to the hot surface temperature of the TEC unit, wherein different curves in the thermal current curve represent the relationship between the operating current of the TEC unit and the auxiliary heat dissipation power under different target temperature difference parameters; Obtaining the operating voltage of the TEC unit according to the operating current of the TEC unit, the target temperature difference parameter, and the voltage-current curve data, comprising: obtaining the operating voltage of the TEC unit corresponding to the operating current of the TEC unit from a curve corresponding to the target temperature difference parameter in the voltage-current curve, wherein different curves in the voltage-current curve represent the relationship between the operating current of the TEC unit and the operating voltage of the TEC unit under different target temperature difference parameters; The COP of the TEC unit is obtained according to the operating current of the TEC unit, the target temperature difference parameter and the COP current curve data, including: obtaining the COP of the TEC unit corresponding to the operating current of the TEC unit from the curve corresponding to the target temperature difference parameter in the COP current curve, wherein different curves in the COP current curve represent the relationship between the operating current of the TEC unit and the COP of the TEC unit under different target temperature difference parameters.

2. The design method of the TEC enhanced air-cooled radiator according to claim 1, characterized in that: The first heat sink and the second heat sink each include: A plurality of heat dissipation fins are provided, and the plurality of heat dissipation fins extend along an air supply path of the cooling air.

3. The design method of the TEC enhanced air-cooled heat sink according to claim 1, characterized in that: The first heat sink and the second heat sink are independent of each other.

4. The design method of the TEC enhanced air-cooled heat sink according to claim 1, characterized in that: The mounting area of the second heat sink is equal to the area of the TEC unit.

5. The design method of the TEC enhanced air-cooled heat sink according to claim 1, characterized in that: The evaluating the configuration parameters includes: Get the preset evaluation target range parameters; determining, based on the configuration parameter and the evaluation target range parameter, whether the configuration parameter is within a range specified by the evaluation target range parameter; When the configuration parameter is within the range specified by the evaluation target range parameter, the evaluation passes.

6. The design method of the TEC enhanced air-cooled heat sink according to claim 1, characterized in that: The design method of the TEC enhanced air-cooled heat sink further includes: If the evaluation fails, obtaining updated design parameters, wherein the updated design parameters include at least one of updated dimension data of the simulation model, updated target temperature difference parameters, and updated characteristic curve data of the TEC unit; Based on the updated design parameters, obtaining updated configuration parameters of the TEC unit; The updated configuration parameters are evaluated, and if the evaluation passes, the design of the TEC enhanced air-cooled radiator is completed.

7. A design device for a TEC enhanced air-cooled radiator, characterized in that: include: A model building module is configured to execute the establishment of a simulation model of a TEC enhanced air-cooled radiator, wherein the TEC enhanced air-cooled radiator includes: a heat sink having a first contact surface and a second contact surface arranged opposite to each other, the first contact surface being attached to a heat source; a first heat sink, the first heat sink being attached to the second contact surface; a TEC unit, the cold surface of the TEC unit being attached to the second contact surface; and a second heat sink, the second heat sink being attached to the hot surface of the TEC unit; wherein, in the air supply path of the cooling air, the first heat sink is located on the upwind side of the second heat sink and the TEC unit; wherein the size of the TEC unit is configured according to preset size parameters; wherein the temperature of each location in the heat sink model object in the simulation model is set to be consistent and the temperature of each location in the heat sink model object is set to rise and fall in the same manner; The simulation calculation module is configured to execute, based on the simulation model, obtaining the auxiliary heat dissipation power of the TEC unit and the average temperature of the vapor chamber when the TEC unit is turned on, including: simulating the simulation model to obtain the natural heat dissipation power of the TEC enhanced air-cooled radiator when the TEC unit is turned off; obtaining the auxiliary heat dissipation power of the TEC unit when the TEC unit is turned on based on a preset maximum heat dissipation power and the natural heat dissipation power; and simulating the simulation model to obtain the average temperature of the vapor chamber when the TEC unit is turned on. a conditional data acquisition module configured to acquire a target temperature difference parameter of the TEC unit and characteristic curve data associated with the TEC unit, wherein, if there are multiple target temperature difference parameters that meet the application requirements of the TEC enhanced air-cooled radiator, a smaller target temperature difference parameter is selected from the multiple target temperature difference parameters; A configuration parameter acquisition module is configured to execute, based on the auxiliary heat dissipation power, the average temperature of the heat spreader, the target temperature difference parameter and the characteristic curve data, to obtain the configuration parameters of the TEC unit, wherein the characteristic curve data includes the thermal current curve data, the voltage-current curve data and the COP current curve data of the TEC unit, and the configuration parameters include the operating current, the operating voltage and the COP of the TEC unit; the configuration parameter acquisition module is further configured to: obtain the operating current of the TEC unit based on the auxiliary heat dissipation power, the average temperature of the heat spreader, the target temperature difference parameter and the thermal current curve data, including: obtaining the hot surface temperature of the TEC unit based on the target temperature difference parameter and the average temperature of the heat spreader, and obtaining the operating current of the TEC unit corresponding to the auxiliary heat dissipation power from the curve corresponding to the target temperature difference parameter in the thermal current curve corresponding to the hot surface temperature of the TEC unit, wherein different curves in the thermal current curve represent different target temperature difference parameters under different target temperature difference parameters. a relationship between the operating current of the TEC unit and the auxiliary heat dissipation power; obtaining the operating voltage of the TEC unit according to the operating current of the TEC unit, the target temperature difference parameter and the voltage-current curve data, including: obtaining the operating voltage of the TEC unit corresponding to the operating current of the TEC unit from the curve corresponding to the target temperature difference parameter in the voltage-current curve, wherein different curves in the voltage-current curve represent the relationship between the operating current of the TEC unit and the operating voltage of the TEC unit under different target temperature difference parameters; obtaining the COP of the TEC unit according to the operating current of the TEC unit, the target temperature difference parameter and the COP current curve data, including: obtaining the COP of the TEC unit corresponding to the operating current of the TEC unit from the curve corresponding to the target temperature difference parameter in the COP current curve, wherein different curves in the COP current curve represent the relationship between the operating current of the TEC unit and the COP of the TEC unit under different target temperature difference parameters; The evaluation module is configured to evaluate the configuration parameters and complete the design of the TEC enhanced air-cooled heat sink if the evaluation passes.

8. An electronic device, characterized in that: include: processor; a memory for storing executable instructions for the processor; The processor is configured to execute the executable instructions to implement the design method of the TEC enhanced air-cooled heat sink according to any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that When at least one instruction in the computer-readable storage medium is executed by a processor of an electronic device, the electronic device is enabled to implement the design method of a TEC enhanced air-cooled heat sink according to any one of claims 1 to 6.

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