Electronic device supporting signal radiation of antenna structure

Abstract

An electronic device includes: a housing including a first plate facing a first direction, a second plate facing a second direction, and a side member surrounding a space between the first plate and the second plate; a support member interposed between the first plate and the second plate and including a metal structure; an antenna structure mounted on the support member and including a first surface facing a third direction toward the side member; and a polymer structure disposed in a space surrounded by the first plate, the support member, the side member, and the first surface of the antenna structure, and coupled to the metal structure. The interconnected metal structure and polymer structure include a recess defined by a first surface, a second surface of the polymer structure forming an acute angle with the first surface, and a third surface substantially perpendicular to the second surface.

Description

Technical Field

[0001] One or more embodiments of the present disclosure are generally directed to electronic devices including antenna structures. Background Art

[0002] Description of Related Technology

[0003] Advances have been made in wireless protocols to more efficiently transmit and receive information related to functions or services of electronic devices. For example, recently, the implementation of next-generation mobile communication technology has begun using signals in ultra-high frequency bands known as fifth generation (5G). Under the 5G protocol, high-speed and high-capacity data transmission is possible due to the use of millimeter wave (mmWave) frequency bands. The 5G protocol is promulgated by the Third Generation Partnership Project (3GPP).

[0004] The 5G-enabled electronic device may include an antenna structure disposed within the 5G-enabled electronic device. For example, the antenna structure may use a metal structure corresponding to (or coupled to) at least a portion of the housing as a radiator, and may be disposed in an area adjacent to the housing to ensure that signals are effectively transmitted / received according to the signal characteristics (e.g., directivity) of the millimeter wave frequency band.

[0005] The above information is presented as background information only to assist with an understanding of the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above might be applicable as prior art with respect to the present disclosure. Summary of the invention

[0006] When setting the structure of the antenna structure, a non-conductive structure may be provided between the antenna structure and the shell to physically support the shell and / or prevent moisture from being introduced onto the antenna structure. The non-conductive structure may be designed to have a shape corresponding to the shape of the shell in one region thereof (e.g., a region facing the shell) and to have a shape for avoiding the antenna structure in another region thereof (e.g., a region opposite to the shell). Due to its possibly irregular shape, the dielectric properties of the non-conductive structure may not be constant. Therefore, when a signal radiated from the antenna structure is applied to the non-conductive structure, the radiated signal is affected by the variable dielectric properties of the non-conductive structure, and the signal performance may be reduced.

[0007] Aspects of the present disclosure address at least the above-mentioned problems and / or disadvantages and provide at least the advantages described below.

[0008] According to one aspect of the present invention, an electronic device may include a shell, which includes a first plate having an outer surface facing a first direction, a second plate having an outer surface facing a second direction opposite to the first direction, and a side member, which surrounds a first space between the first plate and the second plate and is connected to the second plate or integrated with the second plate; a support member, which is connected to the side member or integrated with the side member, is arranged between the first plate and the second plate, and includes a metal structure; an antenna structure, which is arranged between the first plate and the support member, is mounted on the support member, and includes a first surface facing a third direction toward the side member, and includes at least one antenna pattern configured to output a directional beam facing the third direction; a polymer structure, which is arranged in a second space surrounded by the first plate, the support member, the side member and the first surface of the antenna structure, and is connected to the metal structure; and a wireless communication circuit, which is electrically connected to the antenna pattern to send and / or receive signals with frequencies between 3 GHz and 100 GHz.

[0009] According to another aspect of the present disclosure, the interconnected metal structure and polymer structure may include at least one groove, which is defined by a first surface, a second surface of the polymer structure forming an acute angle with the first surface, and a third surface substantially perpendicular to the second surface.

[0010] Other aspects, advantages, and salient features of the disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:

[0012] Figure 1 is a diagram showing a rear surface of an electronic device according to an embodiment;

[0013] Figure 2A is a perspective view showing an arrangement space of an antenna structure of an electronic device according to a first embodiment;

[0014] Figure 2B According to the first embodiment, Figure 2A A cross-sectional view of the electronic device taken along line AA' in FIG.

[0015] Figure 3 is a cross-sectional view of an electronic device according to a second embodiment;

[0016] Figure 4 is a cross-sectional view of an electronic device according to a third embodiment;

[0017] Figure 5A is a diagram showing a rear surface of an electronic device according to another embodiment;

[0018] Figure 5B According to the fourth embodiment Figure 5A A cross-sectional view of the electronic device taken along line AA';

[0019] Figure 5C is a diagram showing application of a processing tool to an electronic device according to a fourth embodiment;

[0020] Fig. 6A According to the fifth embodiment, Figure 1 A cross-sectional view of the electronic device taken along line AA';

[0021] Figure 6B is a diagram showing a process of manufacturing an electronic device according to a fifth embodiment;

[0022] Fig. 7A is a diagram showing an arrangement space of an antenna structure of an electronic device according to a sixth embodiment;

[0023] Figure 7B According to the sixth embodiment, Fig. 7A A cross-sectional view of the electronic device taken along line AA';

[0024] Figure 8 is a diagram showing a rear surface of an electronic device according to still another embodiment;

[0025] Fig. 9 is a diagram showing an antenna structure according to an embodiment;

[0026] Fig.10 is a diagram showing a rear surface of an electronic device according to still another embodiment;

[0027] Fig.11 is a diagram showing an arrangement space of an antenna structure of an electronic device according to a seventh embodiment;

[0028] Fig.12 According to the seventh embodiment, Fig.10 A cross-sectional view of the electronic device taken along line AA';

[0029] Fig.13 is a front perspective view of an electronic device according to an embodiment;

[0030] Fig.14 is a rear perspective view of an electronic device according to an embodiment;

[0031] Fig.15 is an exploded perspective view of an electronic device according to an embodiment;

[0032] Fig.16 is a block diagram illustrating an electronic device in a network environment according to an embodiment;

[0033] Fig.17 is a block diagram of an electronic device supporting traditional network communication and 5G network communication according to an embodiment;

[0034] Fig.18 is a diagram showing a reference according to an embodiment Fig.17 A diagram of the structure of the third antenna module described; and

[0035] Fig.19 It is along Fig.18 A cross-sectional view of the third antenna module taken along line BB'.

[0036] Regarding the description of the drawings, the same reference numerals will be assigned to the same components or corresponding components. DETAILED DESCRIPTION

[0037] Therefore, one aspect of the present disclosure is to provide an electronic device in which the influence exerted on the signal radiated from the antenna structure is minimized. This can be achieved by modifying the electronic device structure adjacent to the antenna structure.

[0038] Hereinafter, various embodiments of the present disclosure may be described with reference to the accompanying drawings. However, it will be understood by those skilled in the art that the present disclosure is not limited to specific embodiments, and that various modifications, equivalents and / or substitutions may be made to the various embodiments described herein without departing from the scope and spirit of the present disclosure.

[0039] Figure 1 is a diagram illustrating a rear surface of an electronic device according to an embodiment.

[0040] Reference Figure 1, the electronic device 100 may include a housing that defines a body of the electronic device 100 or defines at least a portion of an appearance of the electronic device 100. According to one embodiment, the housing may include a first plate 111 (or a rear plate) facing a first direction, a second plate 112 (or a front plate or a cover glass) facing a second direction opposite to the first direction, and a side member 113 disposed in at least a portion between an edge of the first plate 111 and an edge of the second plate 112 to surround a space between the first plate 111 and the second plate 112. The first plate 111, the second plate 112, and the side member 113 are connected to each other in at least one region of the first plate 111, the second plate 112, and the side member 113 to form a housing. The internal space of the electronic device 100 is encapsulated by the first plate 111, the second plate 112, and the side member 113. In this regard, an area of ​​the edge of the first plate 111 is bent with a specific curvature to extend in the second direction. Corresponding to the first plate 111, a region of the edge of the second plate 112 is bent with a curvature that is the same as or similar to the specific curvature of the first plate 111 to extend in the first direction. In one embodiment, the side member 113 may be integrated with the second plate 112 and serve as a part of the second plate 112. In this case, the housing of the electronic device 100 may be formed by coupling the first plate 111 and the second plate 112.

[0041] In one embodiment, at least one component of the electronic device 100 may be disposed in the internal space of the housing of the electronic device 100. For example, a battery 120 that supplies power to the various components of the electronic device 100 may be installed in the internal space of the housing. In addition, depending on the structure of the electronic device, an antenna structure that supports 5G mobile communication of the electronic device 100 may be installed in a cavity area 130 formed adjacent to the mounting area of ​​the battery 120. For example, when the electronic device 100 is viewed in the second direction with the first plate 111 removed, the cavity area 130 may be located at the lower portion of the right edge of the electronic device 100. According to various other embodiments, the above-mentioned mounting area of ​​the antenna structure is provided according to one embodiment, and the electronic device 100 may also include at least one other antenna structure in various other areas.

[0042] According to an embodiment, the structure of the electronic device 100 having the cavity region 130 may be modified to support the operation of the antenna structure installed in the cavity region 130 (e.g., radiating a signal in a specific frequency band). For example, a structure of at least a portion of the electronic device 100 facing the antenna structure may be used as a medium for the signal radiated from the antenna structure. Therefore, the shape of the structure of the electronic device 100 may be modified to have relatively constant dielectric properties so as to minimize the influence exerted on the radiated signal. Hereinafter, the structure of the electronic device 100 for supporting the signal radiation of the antenna structure will be described with reference to the accompanying drawings.

[0043] Figure 2A is a perspective view showing an arrangement space of an antenna structure of an electronic device according to a first embodiment, and Figure 2B is a cross-sectional view of the electronic device taken along line AA' according to the first embodiment. Figure 2A , the first plate 111 is removed for illustration purposes.

[0044] refer to Figure 2A and Figure 2B , a cavity area 130 corresponding to the arrangement space of the antenna structure 140 is formed in the inner space of the housing of the electronic device 100. The support member 150 and the polymer structure 160 may be disposed in the inner space of the housing to define at least some surfaces or edges of the cavity area 130. According to an embodiment, the support member 150 and the polymer structure 160 may replace some portions of the side member 113, or may be coupled to the side member 113 or integrated with the side member 113 to form a portion of the side member 113.

[0045] According to various embodiments, the support member 150 may be connected to a region of the side member 113, or may be integrally formed with the side member 113. The support member 150 may extend inwardly into the interior space of the housing, and may have a step 152 formed in a portion of the extension. In addition, one end of the support member 150 extending from the step 152 may be at a specific angle (e.g., as shown in FIG. 1 ). Figure 2B The step 152 and the rib 151 are bent toward the first plate 111 at a substantially right angle as shown to form the rib 151. According to various different embodiments, the step 152 and the rib 151 may be formed by various processes. For example, the step 152 and the rib 151 may be connected to the support member 150 by welding. During the welding process of the step 152 and the rib 151, the gap between the step 152 and the rib 151 may be determined based on the width or thickness of the antenna structure 140. According to one embodiment, the rib 151 may define the edge of the space in which the battery 120 is disposed in one direction, and the edge of the cavity area 130 in which the antenna structure 140 is disposed in the opposite direction. In other words, the rib 151 corresponding to one end of the support member 150 may separate the space in which the battery 120 is disposed from the space in which the antenna structure 140 is disposed.

[0046] In one embodiment, the antenna structure 140 may be inserted into the space between the support member 150 and the first plate 111. For example, in the antenna structure 140, at least a portion of the first surface 10 associated with forming a directional beam contacts the step 152 and faces the side member 113 (or Figure 1Meanwhile, at least a portion of the second surface 20 opposite to the first surface 10 may be mounted on the support member 150 to contact the rib 151. Therefore, a portion of the first surface 10 of the antenna structure 140 is supported or fixed by the step 152 of the support member 150, and at least a portion of the second surface 20 may be supported or fixed to the rib 151 of the support member 150.

[0047] In one embodiment, the antenna structure 140 mounted on the support member 150 may include at least one antenna element. The at least one antenna element may include, for example, a shielding member 141 (e.g., a shielding cover) and a printed circuit board 143 having at least one dipole antenna pattern and at least one patch antenna pattern. In one embodiment, a power management integrated circuit (PMIC) and a radio frequency integrated circuit (RFIC) may be disposed within the shielding member 141. The antenna structure 140 may be provided by using at least one antenna element in a direction corresponding to the side member 113 (e.g., Figure 1 A third direction) and / or a direction corresponding to the first plate 111 (eg, Figure 1 The support member 150 may include a structure for supporting the beamforming of the antenna structure 140. For example, the support member 150 may include a metal structure in at least a portion thereof to serve as a radiator of the antenna structure 140. In addition, the first plate 111 may include a metal structure in at least a portion thereof to serve as a radiator of the antenna structure 140.

[0048] In one embodiment, the polymer structure 160 may be disposed in a space formed by the side member 113, the support member 150, the antenna structure 140, and the first plate 111. For example, on a specific portion of the side member 113 corresponding to the cavity region 130, a portion of the polymer structure 160 is coupled to the side member 113, and another portion of the polymer structure 160 may be disposed to be coupled to the support member 150 (or to a metal structure included in the support member 150). According to an embodiment, one region of the polymer structure 160 is implemented in a shape corresponding to the shape of the edge of the first plate 111 bent at a specific curvature to contact the edge of the first plate 111. In addition, another region of the polymer structure 160 may contact the edge of the first surface 10 of the antenna structure 140 mounted on the support member 150. Therefore, the polymer structure 160 may support at least the first plate 111 and the antenna structure 140. In addition, the polymer structure 160 may prevent moisture from being introduced to the antenna structure 140 from the outside of the device. According to an embodiment, at least one metal pattern may be disposed on a portion of polymer structure 160 , and antenna structure 140 may use the at least one metal pattern on polymer structure 160 as a radiator.

[0049] According to an embodiment, after the support member 150 and the polymer structure 160 are coupled to each other, some parts of the support member 150 and the polymer structure 160 may be removed. This may be achieved by partially removing (or cutting off) the support member 150 and the polymer structure 160 using a processing tool having a specific inclination. The removal may be performed before the first board 111, the battery 120, and the antenna structure 140 are placed in the electronic device 100. According to an embodiment, the specific inclination of the processing tool may be designed so that when some parts of the support member 150 and the polymer structure 160 are removed, the third surface 30 formed in the polymer structure 160 forms an acute angle with respect to the first surface 10 of the antenna structure 140. In addition, the processing tool may be designed, for example, to be applied at a specific depth by the head end of the processing tool so that when the support member 150 and the polymer structure 160 are coupled to each other, the fourth surface 40 is formed on the support member 150 and the polymer structure 160. The proportion of the portion of the fourth surface 40 disposed on the support member 150 and the polymer structure 160 depends on the position where the fourth surface 40 meets the boundary between the support member 150 and the polymer structure 160 .

[0050] According to an embodiment, by a process of partially removing the support member 150 and the polymer structure 160 when the support member 150 and the polymer structure 160 are coupled to each other, at least one groove 170 may be formed in the support member 150 and the polymer structure 160. The groove 170 may be defined by at least the third surface 30 and a fourth surface 40 substantially perpendicular to the third surface 30. According to an embodiment, the at least one groove 170 may be referred to as an air gap because it means a space where nothing is disposed.

[0051] In an embodiment, by creating the gap, the width or thickness of the polymer structure 160 from the third surface 30 to the edge of the polymer structure 160 in contact with the edge of the first plate 111 may be relatively uniform. In this regard, when the width or thickness in this portion of the polymer structure 160 is uniform, the dielectric properties of the polymer structure 160 may be relatively constant, which may minimize the effect exerted on the signal radiated from the adjacent antenna structure 140. In addition, the air contained in the at least one groove 170 may also minimize the effect exerted on the signal radiated from the adjacent antenna structure 140.

[0052] According to an embodiment, the display 180 may be disposed in the inner space of the housing of the electronic device 100 below the battery 120 and the support member 150. According to an embodiment, the display 180 may be at least partially flexible such that the shape of the display 180 corresponds to the curved shape of the second plate 112.

[0053] Figure 3 is a cross-sectional view of an electronic device according to a second embodiment, Figure 4 is a cross-sectional view of an electronic device according to a third embodiment. Figure 3 and Figure 4 It can be shown that the first plate 111 (see Figure 1 ), the second plate 112 (see Figure 1 ) and side members 113 (see Figure 1 ) are electronic devices connected to each other. The cross section can be along Figure 1 The direction shown is taken along AA'. Figures 1 to 4 The corresponding components of the electronic device 100 in FIG. 1 share the same element reference numerals, and their repeated descriptions will be omitted below. Figure 3 and Figure 4 , it can be understood that the distribution has Figures 1 to 2B Components with the same reference numerals have the same Figures 1 to 2B components have the same structural or functional features unless otherwise stated.

[0054] Reference Figure 3 , when the support member 150 and the polymer structure 160 are connected to each other, at least one groove 171 formed in the support member 150 and the polymer structure 160 may have various shapes, depending on how some portions of the support member 150 and the polymer structure 160 are removed by the air gap forming process. That is, the processing tool used to form the at least one groove 171 may include heads of various shapes. For example, the head of the processing tool may have a conical shape in which the end is inclined at a specific inclination. In this case, the shape of the at least one groove 171 may be defined by the third surface 30 of the polymer structure 160 forming an acute angle relative to the first surface 10 of the antenna structure 140, and the fifth surface 50 and the sixth surface 60 formed corresponding to the conical shape of the end of the processing tool. In an embodiment, in Figure 3 In the cross section shown, the fifth surface 50 may form an obtuse angle with respect to the third surface 30, and the sixth surface 60 may form an acute angle with respect to the third surface 30. According to an embodiment, the processing tool may be designed to have a specific depth so that the fifth surface 50 is disposed on some portions of the support member 150 and the polymer structure 160.

[0055] According to an embodiment, the shape of at least one groove 171 as described above may be changed according to how the at least one groove 171 is tested to affect the signal radiated from the antenna structure 140. For example, using a processing tool having a head of various shapes, grooves having various shapes may be formed in the support member 150 and the polymer structure 160, and the signal radiation performance of the antenna structure 140 may be measured relative to the grooves of various shapes. A groove having the best performance may be selected. Through this operation, the mechanical stiffness of a specific surface (e.g., a surface including the boundary of the support member 150 and the polymer structure 160) formed by the at least one groove is also considered, so that the optimal shape of the at least one groove may be determined.

[0056] Reference Figure 4 In another embodiment, at least one groove 172 may be formed in the support member 150 and the polymer structure 160, which is in at least one direction (eg, with Figure 1 A third party in the opposite direction and / or Figure 1 This type of groove 174 can be formed by opening in a direction facing the second plate 112 (e.g., Figure 1 The processing tool is applied in the second direction of the antenna structure 140 so that the portion of the polymer structure 160 and the support member 150 that contacts the first surface 10 of the antenna structure 140 is removed (or cut off) by a specific width or a specific thickness. Figure 4 As shown, in one embodiment, all portions of the polymer structure 160 in contact with the first surface 10 are removed, while only a step cut is formed in the support member 150, so that a portion of the support member 150 is still in contact with the first surface 10. Therefore, the polymer structure 160 may include a seventh surface 70 formed by removing the above-mentioned portion of the polymer structure 160 in contact with the first surface 10 of the antenna structure 140. The seventh surface 70 may be spaced apart from the first surface 10 of the antenna structure 140 by a distance corresponding to the removed width or thickness.

[0057] According to an embodiment, there may be a battery support member 190 in the housing of the electronic device 100 for supporting the battery 120 disposed near the antenna structure 140 when the rib 151 is located between the antenna structure 140 and the battery 120. For example, the battery support member 190 may be coupled (e.g., welded) to a region of the support member 150 extending into the housing between the first plate 111 and the second plate 112. Alternatively, the battery support member 190 may be integrally formed with the support member 150 as a single component to support the battery 120.

[0058] Figure 5A is a diagram showing a rear surface of an electronic device according to another embodiment, Figure 5B is along the fourth embodiment Figure 5AA cross-sectional view of the electronic device taken along line AA', and Figure 5C is a diagram showing application of a processing tool to an electronic device according to a fourth embodiment. Figure 5A For illustration purposes, the first plate 111 is removed (see Figure 1 ).exist Figure 5B In the embodiment, the first plate 111 and the second plate 112 (see Figure 1 ) and side members 113 (see Figure 1 ) is connected. Figures 1 to 5B The corresponding components of the electronic device 100 in FIG. 1 share the same reference numerals, and their repeated descriptions will be omitted below. Figure 5A and Figure 5B , it is understandable that Figure 5A and Figure 5B in Figures 1 to 4 Parts with the same reference numerals have the same Figures 1 to 4 components have the same structural or functional features unless otherwise stated.

[0059] refer to Figure 5A and Figure 5B According to one embodiment, the polymer structure 160 may include a shape coupled to the support member 150 and having a certain length protruding toward the second plate 112 (eg, Figure 1 For example, the polymer structure 160 may include a flat first region 161 coupled to a boundary region between the side member 113 and the support member 150, and a second region 162 extending from the first region 161 toward the inside of the housing of the electronic device 100. The second region 162 may have a shape that protrudes at a certain inclination toward the second plate 112. In this case, the support member 150 connected to the polymer structure 160 may have a shape corresponding to the flat shape and the protruding shape of the polymer structure 160. Due to the protrusion of the polymer structure 160, the previously shown step 152 of the support member 150 may have its height reduced or completely removed.

[0060] According to an embodiment, the polymer structure 160 having the above-described shape may include at least one first groove 173 and at least one second groove 174 to support beamforming performed by the antenna structure 140 mounted on the support member 150. In other words, according to the reference Figure 5A and Figure 5B In the described embodiment, at least one first groove 173 or at least one second groove 174 may be formed only in the polymer structure 160, but not in the support member 150. In one embodiment, the second plate 112 may be provided with a plurality of grooves 173 and 174 in a direction facing the second plate 112 (eg, Figure 1The processing tool is applied in the second direction of the antenna structure 140 to realize at least one groove 173, so that at least a portion of the surface of the polymer structure 160 that contacts the first surface 10 of the antenna structure 140 and has a specific width or a specific thickness is removed (or cut away). This can be similar to the above reference Figure 4 The at least one groove 172 described. Therefore, the polymer structure 160 may include the eighth surface 71 formed by this operation. In one embodiment, the at least one second groove 174 may be formed by removing a portion of the polymer structure 160 by a processing tool applied to the polymer structure 160 at a specific inclination.

[0061] Reference above Figure 5B In the described embodiment, the Figure 5A The cross section of the electronic device 100 is shown along the line AA' in FIG. Figure 5B Although not shown in the figure, a cross section in which the at least one first groove 173 does not exist may be formed along a line parallel to AA′. In such a cross section, the polymer structure 160 is in contact with the first surface 10 of the antenna structure 140 .

[0062] refer to Figure 5B and Figure 5C , when the processing tool 200 is applied to form at least one second groove 174, the inclination of the processing tool 200 may be changed. Therefore, the at least one second groove 174 may include a ninth surface 72 formed when the processing tool 200 is applied at a first inclination and a tenth surface 73 formed when the processing tool 200 is applied at a second inclination.

[0063] According to the embodiment, the change in the inclination when the processing tool 200 is applied causes the eighth surface 71 , the ninth surface 72 , and the tenth surface 73 to form a relatively gentle curve.

[0064] According to an embodiment, for example, the rib 151 may extend from the support member 150 , and the height of the rib 151 may be substantially similar to the thickness (or height) of the battery 120 adjacent to the rib 151 to stably support or fix the battery 120 adjacent to the rib 151 .

[0065] In an embodiment, the processing tool 200 can be applied to the polymer structure 160 by fixing the electronic device 100 on the mold 300 using at least one clamp 310. The inclination of the mold 300 is adjustable, and the processing tool 200 is vertically moved from above the mold 300 to be applied to the polymer structure 160. In this operation, the inclination of the mold 300 can avoid the locking between the processing tool 200 and the rib 151. For example, when the inclination of the mold 300 is 40 degrees, the locking between the processing tool 200 and the rib 151 can be avoided, but at the same time, at least one groove 174 can be formed by the processing tool 200 when the processing tool 200 is introduced into the polymer structure 160. On the other hand, if the inclination of the mold 300 is 50 degrees, the locking between the processing tool 200 and the rib 151 may occur, so that a part of the rib 151 may be accidentally removed by the processing tool. In this case, the height of the rib 151 is reduced, and the rib 151 cannot support the battery 120. Therefore, when the processing tool 200 is applied, the inclination of the mold 300 can be determined within a range of 40 to 50 degrees. Figure 5B As explained, when forming the at least one second groove 174, the inclination of the mold 300 may be changed. Figure 5C The embodiment shown in is only an example, and the present disclosure is not limited to the range of 40-50 degrees. For example, the range may vary depending on the height of the rib 151 or the distance between the rib 151 and the polymer structure 160.

[0066] Fig. 6A According to the fifth embodiment Figure 1 A cross-sectional view of the electronic device along line AA', Figure 6B 2 is a diagram showing a process of manufacturing an electronic device according to the fifth embodiment. Fig. 6A It is shown that when the first plate 111 (see Figure 1 ), the second plate 112 (see Figure 1 ) and side members 113 (see Figure 1 ) are electronic devices connected to each other. Figures 1 to 6B The corresponding components of the electronic device 100 in FIG. 1 share the same reference numerals, and their repeated descriptions will be omitted below. Fig. 6A and 6B , it is understandable that Fig. 6A and Figure 6B in Figures 1 to 5B Parts with the same reference numerals have the same Figures 1 to 5B components have the same structural or functional features unless otherwise stated.

[0067] refer to Fig. 6A and Figure 6BWhen one surface of the polymer structure 160 in contact with the first surface 10 of the antenna structure 140 is removed (or cut away), at least one groove 175 may be formed in the polymer structure 160 in a space formed by the side member 113, the support member 150, the antenna structure 140, and the first plate 111. The groove 175 may be referred to as a recessed portion sunken into a portion of the polymer structure 160.

[0068] Regarding the process of forming at least one groove 175, as part of a first process, a processing tool 200 including a body having a specific width W1 (e.g., 1.2 mm) and a head having a specific width W2 (e.g., 2.4 mm) is introduced between the rib 151 and the polymer structure 160 and moved downwardly while the processing tool 200 is spaced apart from the rib 151 by a specific distance (e.g., 0.15 mm) so that a portion (not shown) of the polymer structure 160 aligned with the step 152 of the support member 150 can be removed. After moving downwardly, as part of a second process, the processing tool 200 is subsequently moved upwardly and moved toward the side member 113 by a specific distance (e.g., 0.5 mm). Thereafter, as part of a third process, the processing tool 200 is moved downwardly to the boundary between the support member 150 and the polymer structure 160 to remove (cut away) a portion of the eleventh surface 80 of the polymer structure 160. Thus, a recessed portion or groove 175 can be generated in the polymer structure 160 toward the side member 113. According to an embodiment, the width W3 from the rib 151 of the support member 150 to the newly recessed eleventh surface 80 can be the sum of the distance between the rib 151 and the step 152 (e.g., 2.7 mm), the thickness of the removed portion of the polymer structure 160 in the first process, and the moving distance of the processing tool 200 toward the side member 113 in the second process.

[0069] Fig. 7A is a diagram showing an arrangement space of an antenna structure of an electronic device according to a sixth embodiment, and Figure 7B According to the sixth embodiment Fig. 7A A cross-sectional view of the electronic device taken along line AA' in FIG. Fig. 7A , remove the first plate 111 (see Figure 1 ).exist Figure 7B In the embodiment, the first plate 111 and the second plate 112 (see Figure 1 ) and side members 113 (see Figure 1 ) are connected. Figures 1 to 7B The corresponding components of the electronic device 100 in FIG. 1 share the same reference numerals, and repeated descriptions thereof will be omitted below. Fig. 7A and Figure 7B , it is understandable, Fig. 7A and Figure 7Bin Figures 1 to 6B Parts with the same reference numerals have the same Figures 1 to 6B components have the same structural or functional features unless otherwise stated.

[0070] refer to Fig. 7A and Figure 7B , when the support member 150 and the polymer structure 160 are coupled to each other, the head of the processing tool 200 applied to the support member 150 and the polymer structure 160 may have a curved shape. In this case, at least one groove 177 formed in the support member 150 and the polymer structure 160 may include a twelfth surface 90 recessed in at least a portion of the support member 150 and the polymer structure 160 corresponding to the head of the processing tool 200. In an embodiment, the processing tool 200 may be applied to a specific depth or height so that the twelfth surface 90 is formed (or disposed) on some portions of the support member 150 and the polymer structure 160.

[0071] In an embodiment, the rib 151 formed on the support member 150 may be partially removed, thereby reducing its height, compared to the previous embodiment. This is to ensure that the processing tool can be properly applied to the support member 150 and the polymer structure 160. Therefore, the rib 151 of the support member 150 may include at least one opening 153, and the area of ​​the opening 153 corresponds to at least one groove 177. According to an embodiment, instead of using a head with a curved surface, the twelfth surface 90 may be formed by a processing tool with a platform head. In an embodiment, the inclination of applying the processing tool may be gradually changed to form the curved surface of the groove 177.

[0072] Figure 8 is a diagram illustrating a rear surface of an electronic device according to still another embodiment.

[0073] Reference Figure 8 , the polymer structure 160 constituting a portion of the side member 113 may be separated from the side member 113 and may be included in an area of ​​the first plate 111 (e.g., the rear plate). For example, when the first plate 111 is coupled to the side member 113, the polymer structure 160 may be configured to match the support member 150 at a specific portion of the side member 113. The polymer structure 160 may be inserted into an inner area of ​​an edge of the first plate 111 that is curved with a specific curvature. According to an embodiment, the polymer structure 160 included in the inner area of ​​the edge of the first plate 111 may be coupled to the first plate 111 or may be integrally formed with the first plate 111. In an embodiment, the polymer structure 160 included in the first plate 111 may include at least one first surface relative to the antenna structure 140 (e.g., Figure 2BThe polymer structure 160 may be formed with a groove having a specific slope, or may include at least one groove parallel to the first surface 10. In addition, due to the presence of the groove, the polymer structure 160 may support the signal radiation of the antenna structure 140.

[0074] Fig. 9 is a diagram showing an antenna structure according to an embodiment.

[0075] Reference Fig. 9 According to the embodiment, the antenna structure 140 may include the above-mentioned shielding member 141 (e.g., shielding cover) and a printed circuit board 143 having at least one antenna pattern (e.g., dipole antenna pattern and patch antenna pattern), and may further include a heat dissipation member 145 and a flexible printed circuit board 147. According to one embodiment, the heat dissipation member 145 may be formed to surround at least a portion of the shielding member 141 and the printed circuit board 143 coupled to each other. Therefore, the second surface 20 (see FIG. 20 ) of the above-mentioned antenna structure 140 Figure 2B ) may be understood as one surface of the heat dissipation member 145. For example, one surface of the heat dissipation member 145 contacts the shielding member 141, and another surface bent and extended from the surface may contact the bottom surface of each of the shielding member 141 and the printed circuit board 143. Alternatively, one surface of the heat dissipation member 145 contacts the shielding member 141, and another surface of the heat dissipation member 145 (which is bent and extended from the one surface) may contact the top surface of each of the shielding member 141 and the printed circuit board 143. In an embodiment, the heat dissipation member 145 may include at least one hole 146 for accommodating a screw that couples the antenna structure to the support member 150, such as Figure 2B As shown. In an embodiment, the heat dissipation member 145 may be made of a material having excellent thermal conductivity (e.g., copper) to conduct heat generated from the shielding member 141 or the printed circuit board 143 away from the shielding member 141 or the printed circuit board 143. In one embodiment, the flexible printed circuit board 147 may be electrically connected to a communication circuit included in the electronic device 100. A portion of the flexible printed circuit board 147 may be disposed between the heat dissipation member 145 and the shielding member 141 so that the flexible printed circuit board 147 may be electrically connected to the printed circuit board 143. The flexible printed circuit board 147 may send signals or data from at least one dipole antenna pattern and at least one patch antenna pattern included in the printed circuit board 143 to the communication circuit, and vice versa, thereby supporting the use of the antenna structure 140 to send or receive signals having a specific frequency band (e.g., a frequency band in the range of 3 GHz and 100 GHz).

[0076] Fig.10 is a diagram showing a rear surface of an electronic device according to still another embodiment, Fig.11is a diagram showing an arrangement space of an antenna structure of an electronic device according to a seventh embodiment, and Fig.12 is along the seventh embodiment Fig.10 A cross-sectional view of the electronic device taken along line AA'. Fig.10 and Fig.11 For the purpose of illustration, the first plate 111 is removed (see Figure 1 ).exist Fig.12 In the embodiment, the first plate 111 and the second plate 112 (see Figure 1 ) and side members 113 (see Figure 1 ) is connected. Figures 1 to 12 The corresponding components of the electronic device 100 in FIG. 1 share the same reference numerals, and their repeated descriptions will be omitted below. Figures 10 to 12 , it is understandable that Figures 10 to 12 in Figures 1 to 9 Parts with the same reference numerals have the same Figures 1 to 9 components have the same structural or functional features unless otherwise stated.

[0077] refer to Fig.10 , Fig.11 and Fig.12 According to one embodiment, in addition to the lower end of the right edge of the electronic device 100, Figure 1 In addition to the cavity area 130 (hereinafter referred to as the "first cavity area") of the electronic device 100, the antenna structure 140 may also be disposed in the cavity area 130 (hereinafter referred to as the second cavity area) formed at the upper end of the left edge of the electronic device 100. According to an embodiment, at least one camera module 400 may be disposed in an area adjacent to the second cavity area 130. In this regard, the rib 151 bent from one area of ​​the support member 150 toward the first plate 111 at a specific angle (e.g., substantially vertically) may separate the second cavity area 130 from the area 410 for arranging at least one camera module 400, and may support or fix at least a portion of each of the antenna structure 140 and the at least one camera module 400. Alternatively, the rib 151 may prevent heat generated from the antenna structure 140 from being conducted to a space adjacent to the at least one camera module. At least one groove formed without removing the rib 151 may be disposed in the polymer structure 160 facing the antenna structure 140.

[0078] In an embodiment, the polymer structure 160 coupled to the support member 150 may include at least one groove 178 formed by removing at least a portion of the polymer structure 160. According to an embodiment, the process of forming the at least one groove 178 may be similar to the process of bonding. Figure 5A and Figure 5B For example, at least one groove 178 may be formed by firstly forming a groove in a direction facing the second plate 112 (eg, Figure 1 The processing tool may be applied in a second direction (in a direction of the second direction) to remove (or cut off) a portion of the surface of the polymer structure 160 that contacts the first surface 10 of the antenna structure 140. Then, the processing tool may be applied at a specific inclination relative to the removed surface of the polymer structure 160. Alternatively, according to various embodiments, the process of forming at least one groove 178 may be similar to combining Figure 2B , Figure 3 , Figure 4 , Fig. 6A and / or Figure 7B Process described.

[0079] As described above, according to an embodiment, the electronic device 100 may include a housing including: a first plate 111 having an outer surface facing a first direction; a second plate 112 having an outer surface facing a second direction opposite to the first direction; and a side member 113 surrounding a first space between the first plate and the second plate and coupled to the second plate or integrated with the second plate; a support member 150 coupled to the side member or integrated with the side member, disposed between the first plate and the second plate, and including a metal structure; an antenna structure 140 disposed between the first plate and the support member and mounted on the support member, including a first surface facing a third direction toward the side member (e.g., Figure 2B 10), and includes at least one antenna pattern configured to output a directional beam facing a third direction; a polymer structure 160, which is arranged in a second space surrounded by the first plate, the supporting member, the side member and the first surface of the antenna structure, and is connected to the metal structure; and a wireless communication circuit, which is electrically connected to the antenna pattern and configured to transmit and / or receive signals with a frequency between 3 GHz and 100 GHz.

[0080] According to an embodiment, the interconnected metal structure and the polymer structure may include at least one groove formed by a first surface, a second surface 30 of the polymer structure forming an acute angle with the first surface (eg, Figure 2B ), and a third surface 40 substantially perpendicular to the second surface (e.g., Figure 2B )limited.

[0081] According to an embodiment, when the electronic device is viewed in the second direction, the antenna structure may be disposed at a lower region of a right edge of the electronic device.

[0082] According to an embodiment, the support member and the polymer structure may be disposed at a lower region of the right edge of the electronic device.

[0083] According to an embodiment, the support member may include a step formed at a region extending away from the side member.

[0084] According to an embodiment, the support member may include a rib 151 formed at an end of the support member farther from the side member than the step, the rib 151 extending from the end in the first direction.

[0085] According to an embodiment, the electronic device may further include a battery 120 disposed in a third space surrounded by the first plate, the second plate, and the support member, wherein the battery and the antenna structure are disposed on opposite sides of the rib.

[0086] According to an embodiment, the antenna structure may be mounted on the support member such that at least a portion of the first surface contacts the step of the support member and such that at least a portion of the fourth surface opposite to the first surface contacts the rib of the support member.

[0087] According to an embodiment, the polymer structure may include one region coupled to the metal structure and another region coupled to the side member.

[0088] According to an embodiment, the first plate may include an edge region bent with a certain curvature, and may extend in the second direction.

[0089] According to an embodiment, the polymer structure may include a region having a shape corresponding to and in contact with an edge region of the first plate, and other regions in contact with the first surface of the antenna structure.

[0090] According to an embodiment, the third surface may be disposed on at least a portion of the metal structure and on at least a portion of the polymer structure.

[0091] According to an embodiment, the at least one groove may be an air gap.

[0092] According to an embodiment, the antenna structure may include a patch antenna, a printed circuit board coupled to at least one antenna pattern, a heat dissipation member surrounding the printed circuit board and at least a portion of the patch antenna, and a flexible printed circuit board electrically connecting the patch antenna with a wireless communication circuit.

[0093] As described above, according to an embodiment, an electronic device may include a shell including a first plate having an outer surface facing a first direction, a second plate having an outer surface facing a second direction opposite to the first direction, and a side member surrounding a first space between the first plate and the second plate; a support member, connected to or integrated into the side member, disposed between the first plate and the second plate, and including a metal structure; an antenna structure, disposed between the first plate and the support member, mounted on the support member, including a first surface facing a third direction toward the side member, and including at least one antenna pattern configured to output a directional beam facing the third direction; a polymer structure, connected to or integrated with the first plate, when the first plate and the side member are connected to each other, the polymer structure is disposed in a second space surrounded by the first plate, the support member, the side member and the first surface of the antenna structure, and the polymer structure is connected to the metal structure; and a wireless communication circuit, electrically connected to the antenna pattern, and configured to transmit and / or receive signals with a frequency between 3 GHz and 100 GHz.

[0094] According to an embodiment, when the first plate and the side member are coupled to each other, the polymer structure may include at least one groove forming a specific inclination with the first surface of the antenna structure.

[0095] According to one embodiment, when the first plate and the side member are coupled to each other, the polymer structure may include at least one groove having a surface inclined with respect to the first surface of the antenna structure.

[0096] As described above, according to an embodiment, an electronic device may include a shell, which includes a first plate having an outer surface facing a first direction, a second plate having an outer surface facing a second direction opposite to the first direction, and a side member, the side member surrounding a first space between the first plate and the second plate and connected to the second plate or integrated with the second plate; a support member, connected to the side member or integrated with the side member, arranged between the first plate and the second plate, and including a metal structure; an antenna structure, arranged between the first plate and the support member, mounted on the support member, the antenna structure including a first surface facing a third direction toward the side member, and including at least one antenna pattern configured to output a directional beam facing the third direction; a polymer structure, arranged in a second space surrounded by the first plate, the support member, the side member and the first surface of the antenna structure, and connected to the metal structure; and a wireless communication circuit, electrically connected to the antenna pattern and configured to transmit and / or receive signals with a frequency between 3 GHz and 100 GHz.

[0097] According to an embodiment, the interconnected metal structure and polymer structure may include at least one groove, which is defined by a first surface, a second surface of the polymer structure forming an acute angle with the first surface, a third surface forming an obtuse angle with the second surface, and a fourth surface forming an acute angle with the second surface.

[0098] According to an embodiment, the support member may include a step formed at a region extending away from the side member, and a rib formed at an end of the support member farther from the side member than the step, the rib extending from the end in the first direction.

[0099] According to an embodiment, the electronic device may further include a battery disposed in a third space surrounded by the first board, the second board, and the support member, wherein the battery and the antenna structure are disposed on opposite sides of the rib.

[0100] According to an embodiment, the antenna structure may be mounted on the support member such that at least a portion of the first surface contacts the step of the support member and such that at least a portion of the fifth surface opposite to the first surface contacts the rib of the support member.

[0101] Fig.13 is a front perspective view of an electronic device according to an embodiment, Fig.14 is a rear perspective view of an electronic device according to an embodiment, and Fig.15 is an exploded perspective view of an electronic device according to an embodiment.

[0102] refer to Fig.13 and Fig.14 According to an embodiment, the electronic device 1300 may include a housing 1310, the housing 1310 including a first surface 1310A (or front surface), a second surface 1310B (or rear surface), and a side surface 1310C surrounding a space between the first surface 1310A and the second surface 1310B. In another embodiment (not shown), the structure of the housing includes Fig.13Some of the first surface 1310A, the second surface 1310B and the side surface 1310C. According to an embodiment, the first surface 1310A may include a front plate 1302 (e.g., a glass plate or a polymer plate including various coatings) that is substantially transparent in at least a portion thereof. The second surface 1310B may include a substantially opaque rear plate 1311. The rear plate 1311 may include, for example, coated or colored glass, ceramics, polymers, metals (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of the above materials. The side surface 1310C may include a side frame structure (or "side member") 1318, which is coupled to the front plate 1302 and the rear plate 1311 and includes metal and / or polymer. In an embodiment, the rear plate 1311 and the side frame structure 1318 may be formed integrally with each other and may include the same material (e.g., a metal material such as aluminum).

[0103] In the illustrated embodiment, the front plate 1302 may include two first regions 1310D that are bent and seamlessly extend from the first surface 1310A toward the rear plate 1311 at opposite long edge ends of the front plate 1302. Fig.14 ), the rear plate 1311 may include two second areas 1310E, which are bent and seamlessly extended from the second surface 1310B toward the front plate 1302 at the relatively long edge ends of the rear plate 1311. In an embodiment, the front plate 1302 (or the rear plate 1311) may include only one first area 1310D (or one second area 1310E). In another embodiment, the first area 1310D and / or the second area 1310E may not be included. In an embodiment, when observed from the side surface of the electronic device 1300, in the case where the first area 1310D or the second area 1310E is not included, the side frame structure 1318 may have a first thickness (or width) at the side surface, and in the case where the first area 1310D or the second area 1310E is included, the side frame structure 1318 may have a second thickness thinner than the first thickness at the side surface.

[0104] According to an embodiment, the electronic device 1300 includes at least one of the display 1301, audio modules 1303, 1307, and 1314, sensor modules 1304, 1316, and 1319, camera modules 1305, 1312, and 1313, a key input device 1317, a light emitting device 1306, or connector holes 1308 and 1309. In an embodiment, the electronic device 1300 may omit at least one of the above components (e.g., the key input device 1317 or the light emitting device 1306), or may include other components.

[0105] The display 1301 may be exposed, for example, through a substantial portion of the front plate 1302. In an embodiment, at least a portion of the display 1301 may be exposed through the front plate 1302 including the first surface 1310A and the first area 1310D. In an embodiment, the edge shape of the display 1301 may be formed to be substantially the same as the adjacent outer shape of the front plate 1302. According to another embodiment (not shown), in order to expand the area for exposing the display 1301, the distance between the outer portion of the display 1301 and the outer portion of the front plate 1302 may be formed to be substantially consistent.

[0106] In another embodiment (not shown), a recess or opening is formed in a portion of the screen display area of ​​the display 1301. In addition, at least one of the audio module 1314, the sensor module 1304, the camera module 1305, or the light emitting device 1306 aligned with the recess or opening may be included in a portion of the screen display area of ​​the display 1301. In another embodiment (not shown), at least one of the audio module 1314, the sensor module 1304, the camera module 1305, the fingerprint sensor 1316, or the light emitting device 1306 may be included in the rear surface of the screen display area of ​​the display 1301. In another embodiment (not shown), the display 1301 may be connected to or adjacent to a touch sensing circuit, a pressure sensor (for measuring the intensity (pressure) of a touch), and / or a digitizer (for detecting a stylus based on an electromagnetic scheme). In an embodiment, at least some of the sensor modules 1304 and 1319 and / or at least a portion of the key input device 1317 may be provided in the first area 1310D and / or the second area 1310E.

[0107] The audio modules 1303, 1307, and 1314 may include a microphone hole 1303 and speaker holes 1307 and 1314. The microphone hole 1303 may have a microphone disposed therein to obtain external sound. In an embodiment, the microphone hole 1303 may have a plurality of microphones disposed therein to sense the direction of the sound. The speaker holes 1307 and 1314 may include an external speaker hole 1307 and a receiver hole 1314 for conversation. In an embodiment, the speaker holes 1307 and 1314 and the microphone hole 1303 may be implemented as one hole, or may include a speaker (e.g., a piezoelectric speaker) without including the speaker holes 1307 and 1314.

[0108] In an embodiment, the sensor modules 1304, 1316, and 1319 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 1300. The sensor modules 1304, 1316, and 1319 may, for example, include a first sensor module 1304 (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface 1310A of the housing 1310, and / or a third sensor module 1319 (e.g., an HRM sensor) and / or a fourth sensor module 1316 (e.g., a fingerprint sensor) disposed on a second surface 1310B of the housing 1310. The fingerprint sensor may also be disposed on the second surface 1310B of the housing 1310 as well as the first surface 1310A (e.g., the display 1301). The electronic device 1300 may further include a sensor module (not shown), such as at least one of a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor 1304.

[0109] The camera modules 1305, 1312, and 1313 may include a first camera device 1305 disposed on a first surface 1310A of the electronic device 1300 and a second camera device 1312 and / or a flash 1313 disposed on a second surface 1310B. The camera devices 1305 and 1312 may include one or more lenses, image sensors, and / or image signal processors. The flash 1313 may include, for example, a light emitting diode or a xenon lamp. In an embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 1300.

[0110] The key input device 1317 may be provided on the side surface 1310C of the housing 1310. In another embodiment, the electronic device 1300 may not include some or all of the key input devices 1317, and the key input devices 1317 not included may be implemented in another form such as soft keys on the display 1301. In another embodiment, the key input device may include a sensor module 1316 provided on the second surface 1310B of the housing 1310.

[0111] The light emitting device 1306 may be disposed, for example, on the first surface 1310A of the housing 1310. The light emitting device 1306 may provide, for example, status information of the electronic device 1300 in an optical form. In another embodiment, the light emitting device 1306 may provide, for example, a light source that operates together with the operation of the camera module 1305. The light emitting device 1306 may include, for example, an LED, an IR LED, and a Zenon lamp.

[0112] Connector holes 1308 and 1309 may include a first connector hole 1308 for receiving a connector (e.g., a USB connector) to transmit and receive power and / or data with an external electronic device, and / or a second connector hole (e.g., a headphone jack) 1309 for receiving a connector to transmit and receive audio signals with an external electronic device.

[0113] Reference Fig.15 , the electronic device 1300 may include a side frame structure 1318, a first support member 1311 (e.g., a bracket), a front panel 1320, a display 1330, a printed circuit board 1340, a battery 1350, a second support member 1360 (e.g., a rear case), an antenna 1370, and a rear panel 1380. In an embodiment, the electronic device 1300 may omit at least one of the above components (e.g., the first support member 1311 or the second support member 1360), or may additionally include other components. At least one component of the electronic device 1300 may be identical to the first support member 1311 or the second support member 1360. Fig.13 or Fig.14 At least one component of the electronic device 1300 is the same or similar, and repeated description thereof will be omitted herein.

[0114] The first support member 1311 is provided in the electronic device 1300 to be coupled to the side frame structure 1318 or integrated with the side frame structure 1318. The first support member 1311 may include, for example, a metal material and / or a non-metal material (e.g., a polymer). The first support member 1311 may have one surface coupled to the display 1330 and an opposite surface coupled to the printed circuit board 1340. The processor, memory, and / or interface may be mounted on the printed circuit board 1340. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0115] The memory may include, for example, volatile memory and / or non-volatile memory.

[0116] The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device 1300 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0117] The battery 1350 may include a device that supplies power to at least one component of the electronic device 1300, for example, a non-rechargeable primary battery, or a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 1350 may be, for example, substantially aligned with the printed circuit board 1340. The battery 1350 may be integrally provided with the electronic device 1300 within the electronic device 1300, and may be detachably provided with the electronic device 1300.

[0118] The antenna 1370 may be placed between the back plate 1380 and the battery 1350. The antenna 1370 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna 1370 may communicate with an external device over a local area network, or may wirelessly transmit / receive the power necessary for charging. In another embodiment, the antenna structure may be formed by a portion of the side frame structure 1318 and / or the first support member 1311, or a combination of the side frame structure 1318 and the first support member 1311.

[0119] Fig.16 1 is a block diagram illustrating an electronic device 1601 in a network environment 1600 according to various embodiments. Fig.16 , the electronic device 1601 in the network environment 1600 may communicate with the electronic device 1602 via the first network 1698 (e.g., a short-range wireless communication network), or communicate with the electronic device 1604 or the server 1608 via the second network 1699 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 1601 may communicate with the electronic device 1604 via the server 1608. According to an embodiment, the electronic device 1601 may include a processor 1620, a memory 1630, an input device 1650, a sound output device 1655, a display device 1660, an audio module 1670, a sensor module 1676, an interface 1677, a haptic module 1679, a camera module 1680, a power management module 1688, a battery 1689, a communication module 1690, a user identification module (SIM) 1696, or an antenna module 1697. In some embodiments, at least one of the components (e.g., display device 1660 or camera module 1680) may be omitted from electronic device 1601, or one or more other components may be added to electronic device 1601. In some embodiments, some of the components may be implemented as a single integrated circuit. For example, sensor module 1676 (e.g., fingerprint sensor, iris sensor, or illumination sensor) may be implemented to be embedded in display device 1660 (e.g., display).

[0120] The processor 1620 may run, for example, software (e.g., program 1640) to control at least one other component (e.g., hardware component or software component) of the electronic device 1601 connected to the processor 1620, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, the processor 1620 may load a command or data received from another component (e.g., sensor module 1676 or communication module 1690) into the volatile memory 1632, process the command or data stored in the volatile memory 1632, and store the resultant data in the non-volatile memory 1634. According to an embodiment, the processor 1620 may include a main processor 1621 (e.g., a central processing unit (CPU) or an application processor (AP)) and an auxiliary processor 1623 (e.g., a graphics processing unit (GPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 1621 in operation. Additionally or alternatively, the auxiliary processor 1623 may be adapted to consume less power than the main processor 1621, or adapted to be specifically used for a specified function. The auxiliary processor 1623 may be implemented separately from the main processor 1621, or as part of the main processor 1621.

[0121] When the main processor 1621 is in an inactive (e.g., sleep) state, the auxiliary processor 1623 may control at least some of the functions or states related to at least one component (e.g., display device 1660, sensor module 1676, or communication module 1690) among the components of the electronic device 1601 (not the main processor 1621), or when the main processor 1621 is in an active state (e.g., running an application), the auxiliary processor 1623 may control at least some of the functions or states related to at least one component (e.g., display device 1660, sensor module 1676, or communication module 1690) among the components of the electronic device 1601 together with the main processor 1621. According to an embodiment, the auxiliary processor 1623 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 1680 or communication module 1690) that is functionally related to the auxiliary processor 1623.

[0122] The memory 1630 may store various data used by at least one component of the electronic device 1601 (e.g., the processor 1620 or the sensor module 1676). The various data may include, for example, software (e.g., program 1640) and input data or output data for commands related thereto. The memory 1630 may include a volatile memory 1632 or a non-volatile memory 1634.

[0123] The program 1640 may be stored as software in the memory 1630 , and the program 1640 may include, for example, an operating system (OS) 1642 , middleware 1644 , or an application 1646 .

[0124] The input device 1650 may receive commands or data to be used by other components (e.g., processor 1620) of the electronic device 1601 from outside the electronic device 1601 (e.g., user). The input device 1650 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (e.g., a stylus).

[0125] The sound output device 1655 can output a sound signal to the outside of the electronic device 1601. The sound output device 1655 may include, for example, a speaker or a receiver. The speaker may be used for general purposes such as playing multimedia or playing records, and the receiver may be used for incoming calls. Depending on the embodiment, the receiver may be implemented as a separate part from the speaker, or as part of the speaker.

[0126] The display device 1660 may visually provide information to the outside of the electronic device 1601 (e.g., a user). The display device 1660 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display device 1660 may include a touch circuit adapted to detect a touch or a sensor circuit (e.g., a pressure sensor) adapted to measure the strength of a force caused by a touch.

[0127] The audio module 1670 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 1670 may obtain sound via the input device 1650, or output sound via a sound output device 1655 or an earphone of an external electronic device (e.g., electronic device 1602) directly (e.g., wired) or wirelessly connected to the electronic device 1601.

[0128] The sensor module 1676 may detect an operating state (e.g., power or temperature) of the electronic device 1601 or an environmental state (e.g., a user's state) outside the electronic device 1601, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 1676 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0129] The interface 1677 may support one or more specific protocols to be used to connect the electronic device 1601 directly (e.g., wired) or wirelessly to an external electronic device (e.g., electronic device 1602). According to an embodiment, the interface 1677 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0130] The connection end 1678 may include a connector, wherein the electronic device 1601 can be physically connected to an external electronic device (e.g., the electronic device 1602) via the connector. According to an embodiment, the connection end 1678 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0131] The haptic module 1679 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 1679 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0132] The camera module 1680 may capture still images or moving images. According to embodiments, the camera module 1680 may include one or more lenses, image sensors, image signal processors, or flashes.

[0133] The power management module 1688 may manage power supply to the electronic device 1601. According to an embodiment, the power management module 1688 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0134] The battery 1689 may power at least one component of the electronic device 1601. According to an embodiment, the battery 1689 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0135] The communication module 1690 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 1601 and an external electronic device (e.g., electronic device 1602, electronic device 1604, or server 1608), and perform communication via the established communication channel. The communication module 1690 may include one or more communication processors capable of operating independently from the processor 1620 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 1690 may include a wireless communication module 1692 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1694 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 1698 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 1699 (e.g., a long-range communication network such as a cellular network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 1692 can identify and authenticate the electronic device 1601 in a communication network (such as the first network 1698 or the second network 1699) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 1696.

[0136] The antenna module 1697 may transmit a signal or power to the outside of the electronic device 1601 (e.g., an external electronic device) or receive a signal or power from the outside of the electronic device 1601 (e.g., an external electronic device). According to an embodiment, the antenna module 1697 may include an antenna including a radiating element, the radiating element being composed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a PCB). According to an embodiment, the antenna module 1697 may include a plurality of antennas. In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 1698 or the second network 1699) may be selected from the plurality of antennas by, for example, the communication module 1690 (e.g., the wireless communication module 1692). A signal or power may then be transmitted or received between the communication module 1690 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 1697.

[0137] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0138] According to an embodiment, a command or data may be sent or received between the electronic device 1601 and the external electronic device 1604 via the server 1608 connected to the second network 1699. Each of the electronic device 1602 and the electronic device 1604 may be a device of the same type as the electronic device 1601, or a device of a different type from the electronic device 1601. According to an embodiment, all or some operations to be executed in the electronic device 1601 may be executed in one or more of the external electronic device 1602, the external electronic device 1604, or the server 1608. For example, if the electronic device 1601 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 1601 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 1601 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices that receive the request may execute the requested at least part of the function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 1601. The electronic device 1601 may provide the result as at least a partial reply to the request, with or without further processing the result. To this end, for example, cloud computing technology, distributed computing technology, or client-server computing technology may be used.

[0139] Fig.17 1700 is a block diagram of an electronic device 1601 for supporting traditional network communications and 5G network communications according to various embodiments. Fig.17 , the electronic device 1601 may include a first communication processor 1712, a second communication processor 1714, a first radio frequency integrated circuit (RFIC) 1722, a second RFIC 1724, a third RFIC 1726, a fourth RFIC 1728, a first radio frequency front end (RFFE) 1732, a second RFFE 1734, a first antenna module 1742, a second antenna module 1744, and an antenna 1748. The electronic device 1601 may also include a processor 1620 and a memory 1630. The network 1699 may include a first network 1792 and a second network 1794. According to another embodiment, the electronic device 1601 may also include Figure 1 The network 1699 may further include at least one of the components shown in the figure, and at least another network. According to an embodiment, the first communication processor 1712, the second communication processor 1714, the first RFIC 1722, the second RFIC 1724, the fourth RFIC 1728, the first RFFE 1732, and the second RFFE 1734 may form at least part of the wireless communication module 1692. According to another embodiment, the fourth RFIC 1728 may be omitted, or may be included as part of the third RFIC 1726.

[0140] The first communication processor 1712 may establish a communication channel for a frequency band to be used for wireless communication with the first network 1792, and may support traditional network communication through the established communication channel. According to various embodiments, the first network may be a traditional network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor 1714 may support the establishment of a communication channel corresponding to a designated frequency band (e.g., about 6 GHz to about 60 GHz) among the frequency bands to be used for wireless communication with the second network 1794, and may support 5G network communication via the established communication channel. According to various embodiments, the second network 1794 may be a 5G network defined in 3GPP. In addition, according to an embodiment, the first communication processor 1712 or the second communication processor 1714 may establish a communication channel corresponding to another designated frequency band (e.g., about 6 GHz or lower) among the frequency bands to be used for wireless communication with the second network 1794, and may support 5G network communication through the established communication channel. According to an embodiment, the first communication processor 1712 and the second communication processor 1714 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 1712 or the second communication processor 1714 may be implemented in a single chip or a single package together with the processor 1620 , the auxiliary processor 1623 , or the communication module 1690 .

[0141] In the case of transmitting a signal, the first RFIC 1722 may convert a baseband signal generated by the first communication processor 1712 into a radio frequency (RF) signal of about 700 MHz to about 3 GHz used in the first network 1792. In the case of receiving a signal, an RF signal may be obtained from the first network 1792 (e.g., a legacy network) through an antenna (e.g., the first antenna module 1742), and the RF signal may be pre-processed by an RFFE (e.g., the first RFFE 1732). The first RFIC 1722 may convert the pre-processed RF signal into a baseband signal so that it is processed by the first communication processor 1712.

[0142] In the case of transmitting a signal, the second RFIC 1724 may convert a baseband signal generated by the first communication processor 1712 or the second communication processor 1714 into an RF signal in a Sub6 frequency band (e.g., about 6 GHz or lower) used in a second network 1794 (e.g., a 5G network) (hereinafter referred to as a "5G Sub6 RF signal"). In the case of receiving a signal, a 5G Sub6 RF signal may be obtained from a second network 1794 (e.g., a 5G network) through an antenna (e.g., a second antenna module 1744), and the 5G Sub6 RF signal may be preprocessed through an RFFE (e.g., a second RFFE 1734). The second RFIC 1724 may convert the preprocessed 5G Sub6 RF signal into a baseband signal, so that it is processed by a communication processor corresponding to the 5G Sub6 RF signal among the first communication processor 1712 or the second communication processor 1714.

[0143] The third RFIC 1726 may convert a baseband signal generated by the second communication processor 1714 into an RF signal (hereinafter referred to as a "5G Above 6 RF signal") in a 5G Above 6 frequency band (e.g., about 6 GHz to about 60 GHz) to be used in a second network 1794 (e.g., a 5G network). In the case of receiving a signal, the 5G Above 6 RF signal may be obtained from the second network 1794 (e.g., a 5G network) through an antenna (e.g., antenna 1748), and the 5G Above 6 RF signal may be pre-processed by the third RFFE 1736. The third RFIC 1726 may convert the pre-processed 5G Above 6 RF signal into a baseband signal so as to be processed by the second communication processor 1714. According to an embodiment, the third RFFE 1736 may be formed as part of the third RFIC 1726.

[0144] According to an embodiment, the electronic device 1601 may include a fourth RFIC 1728 that is independent of the third RFIC 1726 or as at least part of the third RFIC 1726. In this case, the fourth RFIC 1728 may convert the baseband signal generated by the second communication processor 1714 into an RF signal (hereinafter referred to as an "IF signal") in an intermediate frequency band (e.g., a range from about 9 GHz to about 11 GHz), and the IF signal may be provided to the third RFIC 1726. The third RFIC 1726 may convert the IF signal into a 5G Above 6 RF signal. In the case of receiving a signal, a 5G Above 6 RF signal may be received from a second network 1794 (e.g., a 5G network) through an antenna (e.g., antenna 1748), and the 5G Above 6 RF signal may be converted into an IF signal through the third RFIC. The fourth RFIC 1728 may convert the IF signal into a baseband signal so that the second communication processor 1714 can process the baseband signal.

[0145] According to an embodiment, the first RFIC 1722 and the second RFIC 1724 may be implemented with a single chip or a portion of a single package. According to an embodiment, the first RFFE 1732 and the second RFFE 1734 may be implemented as at least a portion of a single chip or a single package. According to an embodiment, at least one of the first antenna module 1742 or the second antenna module 1744 may be omitted or may be connected to another antenna module, and then RF signals of a plurality of corresponding frequency bands may be processed.

[0146] According to an embodiment, the third RFIC 1726 and the antenna 1748 may be disposed on the same substrate to form a third antenna module 1746. For example, the wireless communication module 1692 or the processor 1620 may be disposed on a first substrate (e.g., a main PCB). In this case, the third RFIC 1726 may be disposed in a local area (e.g., a bottom surface) of a second substrate (e.g., a sub-PCB) separated from the first substrate; the antenna 1748 may be disposed in another local area (e.g., an upper surface), thereby forming a third antenna module 1746. According to an embodiment, for example, the antenna 1748 may include an antenna array capable of beamforming. By positioning the third RFIC 1726 and the antenna 1748 on the same substrate, the length of the transmission line between the third RFIC 1726 and the antenna 1748 may be reduced. The reduction in the length of the transmission line may make it possible to reduce the loss (or attenuation) of the signal in the high frequency band (e.g., about 6 GHz to about 60 GHz) for 5G network communication attributed to the transmission line. As such, the electronic device 1601 may improve the quality or speed of communication with the second network 1794 (eg, a 5G network).

[0147] The second network 1794 (e.g., a 5G network) can be used independently of the first network 1792 (e.g., a traditional network) (e.g., independent networking (SA)), or can be used in combination with the first network 1792 (e.g., non-independent networking (NSA)). For example, in the 5G network, only an access network (e.g., a 5G radio access network (RAN) or a next-generation RAN (NG RAN)) may exist, and a core network (e.g., a next-generation core (NGC)) may not exist in the 5G network. In this case, the electronic device 1601 can access the access network of the 5G network, and then can access an external network (e.g., the Internet) under the control of the core network (e.g., an evolved packet core (EPC)) of the traditional network. Protocol information for communicating with a traditional network (e.g., LTE protocol information) or protocol information for communicating with a 5G network (e.g., new radio NR protocol information) can be stored in the memory 1630, so as to be accessed by another component (e.g., the processor 1620, the first communication processor 1712, or the second communication processor 1714).

[0148] Fig.18 is a diagram showing a reference according to an embodiment Fig.17 A diagram of the structure of a third antenna module 1746 is described. Fig.18 Reference numeral 1800a shows a perspective view of the third antenna module 1746 when viewed from one side. Fig.18 Reference numeral 1800b shows a perspective view when the third antenna module 1746 is viewed from the other side. Fig.18 Reference numeral 1800C is a cross-sectional view of the third antenna module 1746 taken along line AA′.

[0149] Reference Fig.18 In an embodiment, the third antenna module 1746 may include a printed circuit board 1810, an antenna array 1830, a radio frequency integrated circuit (RFIC) 1852, a power management integrated circuit (PMIC) 1854, and a module interface (not shown). Alternatively, the third antenna module 1746 may further include a shielding member 1890. According to another embodiment, at least one of the above components may be omitted, or at least two of the components may be formed integrally with each other.

[0150] The printed circuit board 1810 may include a plurality of conductive layers and a plurality of non-conductive layers alternately stacked with the conductive layers. The printed circuit board 1810 may provide electrical connections between various components of the printed circuit board 1810 and / or various electronic components disposed outside through conductive lines and conductive paths formed in the conductive layers.

[0151] Antenna array 1830 (eg, Fig.17The antenna element 1748 in the figure may include multiple antenna elements 1832, 1834, 1836 or 1838 configured to form a directional beam. Fig.18 As shown, the antenna element may be formed on a first surface of the printed circuit board 1810. According to another embodiment, the antenna array 1830 may be formed within the printed circuit board 1810. According to an embodiment, the antenna array 1830 may include a plurality of antenna arrays (e.g., dipole antenna arrays and / or patch antenna arrays) having the same or different shapes or types.

[0152] RFIC 1852 (e.g. Fig.17 The third RFIC 1726 of the printed circuit board 1810 may be provided in another area (e.g., a second surface opposite to the first surface) of the printed circuit board 1810 that is separated from the antenna array 1830. The RFIC 1852 may be configured to process a signal of a selected frequency band transmitted / received through the antenna array 1830. According to an embodiment, the RFIC 1852 may convert a baseband signal obtained from a communication processor (not shown) into an RF signal having a specific frequency band in transmission. The RFIC 1852 may convert an RF signal received through the antenna array 1830 into a baseband signal and transmit the converted baseband signal to the communication processor.

[0153] According to another embodiment, during transmission, RFIC 1852 can transmit the intermediate frequency integrated circuit (IFIC) ( Fig.17 The IF signal (e.g., having a frequency band of about 9 GHz to about 11 GHz) obtained by the fourth RFIC 1728 of the antenna array 1852 is up-converted to an RF signal having a selected frequency band. When receiving, the RFIC 1852 can down-convert the RF signal obtained by the antenna array 1830 to an IF signal to be sent to the IFIC.

[0154] The PMIC 1854 may be disposed in another partial area (e.g., a second surface) of the printed circuit board 1810 that is separated from the antenna array. The PMIC 1854 may receive voltage from the main PCB (not shown) and may provide necessary power to various components (e.g., RFIC 1852) on the antenna module.

[0155] The shielding member 1890 may be disposed on a portion (eg, the second surface) of the printed circuit board 1810 to electromagnetically shield at least one of the RFIC 1852 or the PMIC 1854. According to one embodiment, the shielding member 1890 may include a shield case.

[0156] Although not shown, in an embodiment, the third antenna module 1746 can be electrically connected to another printed circuit board (e.g., a main circuit board) through a module interface. The module interface may include a connection component, such as a coaxial cable connector, a board-to-board connector, an interposer, or a flexible printed circuit board (FPCB). The RFIC 1852 and / or PMIC 1854 of the third antenna module 1746 can be electrically connected to the printed circuit board through a connecting member.

[0157] Fig.19 The third antenna module 1746 is Fig.18 According to the illustrated embodiment, the printed circuit board 1810 may include an antenna layer 1911 and a network layer 1913 .

[0158] The antenna layer 1911 may include at least one dielectric layer 1937 - 1 and the antenna element 1836 and / or a feeding unit 1925 formed on an outer surface of the dielectric layer or in an interior of the dielectric layer. The feeding unit 1925 may include a feeding point 1927 and / or a feeding line 1929 .

[0159] The network layer 1913 may include at least one dielectric layer 1937-2 and at least one ground layer 1933, at least one conductive via 1935, a transmission line 1923, and / or a signal line 1929 formed on an outer surface of the dielectric layer or in an interior of the dielectric layer.

[0160] In addition, in the illustrated embodiment, the third RFIC 1726 can be electrically connected to the network layer 1913, for example, via first and second solder bumps (first and second connectors) 1940-1 and 1940-2. According to other embodiments, various connection structures (e.g., solder or ball grid array (BGA)) can be used instead of solder bumps. The third RFIC 1726 can be electrically connected to the antenna element 1836 via the first connector 1940-1, the transmission line 1923, and the feed unit 1925. The third RFIC 1726 can also be electrically connected to the ground layer 1933 via the second connector 1940-2 and the conductive via 1935. Although not shown, the third RFIC 1726 can also be electrically connected to the above-mentioned module interface via a signal line 1929.

[0161] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0162] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “combined with another element (e.g., the second element)”, “combined to another element (e.g., the second element)”, “connected with another element (e.g., the second element)”, or “connected to another element (e.g., the second element)” when the terms “operably” or “communicatively” are used or when the terms “operably” or “communicatively” are not used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0163] As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0164] Some embodiments described herein may be implemented as software (e.g., program 1640) including one or more instructions stored in a storage medium (e.g., internal memory 1636 or external memory 1638) that can be read by a machine (e.g., electronic device 1601). For example, under the control of a processor, a processor (e.g., processor 1620) of the machine (e.g., electronic device 1601) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include a signal (e.g., an electromagnetic wave), but the term does not distinguish between data being semi-permanently stored in a storage medium and data being temporarily stored in a storage medium.

[0165] According to an embodiment, the method according to some embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be published in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be published online (e.g., downloaded or uploaded) via an application store (e.g., Play StoreTM), or may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a manufacturer's server, an application store's server, or a memory of a forwarding server).

[0166] According to some embodiments, each component (e.g., module or program) in the above-mentioned components may include a single entity or multiple entities. According to some embodiments, one or more components in the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, according to some embodiments, the integrated component may still perform the one or more functions of each component in the multiple components in the same or similar manner as a corresponding component in the multiple components before integration. According to some embodiments, the operations performed by a module, program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more operations in the operations may be run or omitted in different orders, or one or more other operations may be added.

[0167] According to certain embodiments, degradation in performance of a signal radiated from an antenna structure may be prevented based on modifications in the structure of the electronic device, thereby supporting improved operation of the electronic device including the antenna structure for 5G mobile communications.

[0168] Furthermore, by providing the present disclosure, various effects can be understood directly or indirectly.

[0169] While the present disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.

[0170] Some of the above embodiments of the present disclosure may be implemented in hardware, firmware, or by executing software or computer code, which may be stored in a recording medium, such as a CD ROM, a digital versatile disk (DVD), a magnetic tape, a RAM, a floppy disk, a hard disk, or a magneto-optical disk, or by executing a computer code originally stored on a remote recording medium or a non-transitory machine-readable medium, downloaded via a network, and stored in a local recording medium, so that the methods described herein may be implemented by executing the software stored on the recording medium using a general-purpose computer, or a dedicated processor, or programmable or dedicated hardware (e.g., an ASIC or FPGA). As is understood in the art, a computer, a processor, a microprocessor controller, or programmable hardware includes a memory component, such as a RAM, a ROM, a flash memory, etc., which may store or receive software or computer code, and when the software or computer code is accessed and executed by a computer, a processor, or hardware, the processing methods described herein are implemented.

Claims

1. An electronic device, comprising: A housing, comprising a first plate (111), a second plate (112) and a side member (113), wherein the first plate (111) comprises a first outer surface facing a first direction, the second plate (112) comprises a second outer surface facing a second direction opposite to the first direction, and the side member (113) is disposed between the first plate (111) and the second plate (112) and forms a part of a surface of the electronic device; a polymer structure (160) coupled to the side member (113), wherein the polymer structure (160) has a groove formed therein; an antenna structure (140) inserted in a space between the first plate (111) and a support member (150), the support member (150) being inserted between the first plate (111) and the second plate (112), the antenna structure (140) comprising a first surface (10) and at least one antenna element, the first surface (10) facing the groove opening toward the first surface (10), the at least one antenna element being configured to output a directional beam toward the groove of the polymer structure (160); and The wireless communication circuit is electrically connected to the antenna element and is configured to transmit and / or receive signals with a frequency between 3 GHz and 100 GHz.

2. The electronic device according to claim 1, wherein: The support member (150) includes a metal structure comprising a metallic material and at least partially coupled to the polymer structure (160).

3. The electronic device according to claim 1, wherein: The polymer structure (160) includes a first region and a second region in contact with the first surface of the antenna structure (140), and Wherein, the groove is formed between the first area and the second area.

4. The electronic device according to claim 3, wherein: The first surface of the antenna structure (140) is perpendicular to the first outer surface and the second outer surface.

5. The electronic device according to claim 1, wherein: The groove forms an air gap between the first surface of the antenna structure (140) and the polymer structure (160).

6. The electronic device according to claim 1, wherein: The polymer structure (160) and the side member (113) form a portion of a surface of the electronic device.

7. The electronic device according to claim 1, wherein: The second plate (112) includes a curved region extending from an edge of the second outer surface toward the side member (113), and Wherein, the bent region at least partially contacts the polymer structure.

8. The electronic device according to claim 7, wherein: The antenna structure (140) is at least partially located between the first plate (111) and the curved region of the second plate (112).

9. The electronic device according to claim 1, wherein: The antenna structure (140) includes a second surface opposite to the first surface, and Wherein, the support member (150) includes a rib at least partially facing the second surface of the antenna structure (140).

10. The electronic device according to claim 9, further comprising a battery, and in, The rib extends into the space between the battery and the antenna structure (140).

11. The electronic device according to claim 1, wherein: The antenna structure (140) comprises: a printed circuit board (143) forming a first surface of the antenna structure (140) and comprising the at least one antenna element, a shielding member (141) coupled to the printed circuit board (143), and A flexible circuit board (147) electrically connects the printed circuit board (143) and the wireless communication circuit.

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