High-integration double-frequency composite three-dimensional interconnection transceiver assembly

Abstract

The invention provides a high-integration double-frequency composite three-dimensional interconnection transceiving assembly. A primary power supply control circuit board in a first cavity is in communication connection with a W / Ka transceiving frequency conversion circuit in a third cavity through a radio frequency connector; the W / Ka receiving frequency conversion circuit in the second cavity is provided with a plurality of external radio frequency interfaces and a W / Ka signal waveguide port, the plurality of external radio frequency interfaces penetrate through the first cavity and the first cavity cover plate to be interconnected with the outside, and the W / Ka signal waveguide port is connected with an external first antenna waveguide port; the third cavity is internally provided with a W / Ka receiving and transmitting frequency conversion circuit, the W / Ka receiving and transmitting frequency conversion circuit is provided with a W / Ka signal waveguide port, and the W / Ka signal waveguide port penetrates through the fourth cavity and a cover plate of the fourth cavity to be connected with an external second antenna waveguide port. And three-dimensional interconnection integration of radio frequency circuits of different frequency bands is realized in a smaller space.

Description

Technical Field

[0001] The present application relates to the field of microwave and millimeter wave technology, and in particular to a highly integrated dual-frequency composite three-dimensional interconnected transceiver component. Background Art

[0002] At present, compared with traditional radar antennas, active phased array radars have been widely used in the field of communications due to their excellent performance. However, with the continuous development of communication technology, the electromagnetic environment of radar service has become increasingly complex, which puts higher requirements on the performance indicators of radar. The transceiver component is the core component of the active phased array radar, and its performance directly affects the performance indicators of the entire radar. In order to meet the needs of future communication development, it has become an inevitable trend to design transceiver components with multi-band working capabilities. According to relevant technical information, there are currently many dual-frequency composite antennas, but dual-frequency composite transceiver components are rarely reported, and the working frequency bands of most composite components are concentrated below the Ka band. The limitation of the working frequency band restricts the improvement of radar performance in application fields such as precision imaging and precision guidance; in addition, most of the existing dual-frequency composite transceiver components are brick-type structures with large sizes, which do not conform to the development trend of miniaturization of radar antennas. Summary of the invention

[0003] The main purpose of this application is to provide a highly integrated dual-frequency composite three-dimensional interconnected transceiver component, aiming to realize multi-band, multi-channel, high-power, and highly integrated phased array radar applications.

[0004] To achieve the above-mentioned purpose, the present application provides a highly integrated dual-frequency composite three-dimensional interconnected transceiver component, comprising: a first cavity cover plate, a first double-sided cavity plate, a third cavity cover plate, a second double-sided cavity plate and a fourth cavity cover plate stacked in sequence; the first double-sided cavity plate has a first cavity and a second cavity back to back, the second double-sided cavity plate has a third cavity and a fourth cavity back to back, the first cavity cover plate is arranged on the surface of the first cavity, and the fourth cavity cover plate is arranged on the surface of the fourth cavity; a first-level power supply control circuit board is arranged in the first cavity, a W / Ka transceiver frequency conversion circuit is carried inside the third cavity, and the first-level power supply control circuit board is communicatively connected to the W / Ka transceiver frequency conversion circuit through a radio frequency connector; an external W / Ka intermediate frequency transmission signal is transmitted to the W / Ka transceiver frequency conversion circuit through the first-level power supply control circuit board to excite the W / Ka transceiver frequency conversion circuit; the second cavity is equipped with a W / Ka receiving frequency conversion circuit, The W / Ka receiving frequency conversion circuit has multiple external RF interfaces and W / Ka signal waveguide ports, and the multiple external RF interfaces pass through the first cavity and the first cavity cover to be interconnected with the outside, and the W / Ka signal waveguide port passes through the third cavity cover, the third cavity, the fourth cavity and the fourth cavity cover to be connected with the external first antenna waveguide port; the W / Ka receiving frequency conversion circuit is used to receive W / Ka signals, transmit Ka intermediate frequency signals, receive W / ka composite intermediate frequency signals and receive W intermediate frequency signals through the W / Ka signal waveguide port and the external RF interface; the third cavity is equipped with a W / Ka transceiver frequency conversion circuit, and the W / Ka transceiver frequency conversion circuit has a W / Ka signal waveguide port, and the W / Ka signal waveguide port passes through the fourth cavity, the fourth cavity cover and is connected with the external second antenna waveguide port; the W / Ka transceiver frequency conversion circuit is used to up-convert the W / Ka intermediate frequency signal and the W / Ka radio frequency signal.

[0005] Optionally, a primary power control circuit board is provided in the first cavity, and a secondary power control circuit board is provided in the fourth cavity; the secondary power control circuit board and the primary power control circuit board are internally plugged in; wherein, external power supply and control signals are transmitted to the secondary power control circuit board through the primary power control circuit board to control the power supply of the secondary power control circuit board.

[0006] Optionally, the primary power control circuit board is communicatively connected to an internal low-frequency socket, an external low-frequency socket and multiple SMP RF connectors, the secondary power control circuit board is communicatively connected to an internal low-frequency plug, and the internal low-frequency plug passes through the third cavity, the third cavity cover plate and is plugged into the internal low-frequency socket in sequence; the external low-frequency socket is communicatively connected to the W / Ka receiving frequency conversion circuit; at least one of the multiple SMP RF connectors passes through the second cavity and the third cavity cover plate through the KK connector and is communicatively connected to the internal surface-mounted SMP connector in the third cavity; wherein the external low-frequency socket is used to supply power and provide power supply control signals to the W / Ka receiving frequency conversion circuit and the primary power control circuit board; the internal low-frequency socket is used to supply power and provide power supply control signals to the secondary power control circuit board; and the SMP RF connector is used to provide an excitation signal to the W / Ka transceiver frequency conversion circuit.

[0007] Optionally, the W / Ka receiving frequency conversion circuit is communicatively connected to multiple external SMP connectors and multiple internal surface-mount SMP connectors respectively; at least one of the multiple external SMP connectors passes through the first cavity and the first cavity cover to be plugged into an external RF connector; at least one of the multiple internal surface-mount SMP connectors passes through the third cavity cover and the third cavity through a KK connector to be plugged into the RF interface of the W / Ka receiving frequency conversion circuit.

[0008] Optionally, the second cavity is also equipped with a first local oscillator distribution circuit, which has a first common distribution link and multiple first distribution branches that are communicatively connected; the first common distribution link is communicatively connected to a single frequency doubling multifunctional chip; multiple first distribution branches are communicatively connected to the W / Ka receiving frequency conversion circuit and the local oscillator signal transmitting waveguide port, and the local oscillator signal transmitting waveguide port passes through the third cavity cover and is communicatively connected to the local oscillator signal receiving waveguide port of the third cavity.

[0009] Optionally, the W / Ka receiving frequency conversion circuit includes two W-band microwave receiving circuits and two Ka-band microwave receiving circuits, and the W / Ka signal waveguide port includes two W-band waveguide ports and two Ka signal waveguide ports; the two W-band microwave receiving circuits are respectively communicatively connected to the two W-band waveguide ports, respectively communicatively connected to the two distribution branches, and respectively communicatively connected to two W-band frequency doubling and mixing multifunctional chips; the two Ka-band microwave receiving circuits are respectively communicatively connected to the two Ka signal waveguide ports, respectively communicatively connected to the two distribution branches, and respectively communicatively connected to the two first mixers.

[0010] Optionally, the W / Ka transceiver frequency conversion circuit is respectively communicatively connected to the plurality of the inner surface mount SMP connectors; at least one of the plurality of the inner surface mount SMP connectors passes through the third cavity cover plate via a KK plug, and the second cavity is vertically interconnected with the SMP RF connector.

[0011] Optionally, the third cavity is equipped with a second local oscillator distribution circuit, which has a second common distribution link and multiple second distribution branches that are communicatively connected; the second common distribution link is communicatively connected to a single frequency doubling multifunctional chip; multiple second distribution branches are communicatively connected to the W / Ka transceiver frequency conversion circuit and the local oscillator signal receiving waveguide port, and the local oscillator signal receiving waveguide port passes through the third cavity cover plate and is communicatively connected to the local oscillator signal transmitting waveguide port.

[0012] Optionally, the W / Ka transceiver frequency conversion circuit has two communication-connected branches, each branch including one Ka-band microwave transceiver circuit and two W-band microwave transceiver circuits;

[0013] The W / Ka signal waveguide port includes a first W / Ka signal waveguide port and a second W / Ka signal waveguide port, and the first W / Ka signal waveguide port and the second W / Ka signal waveguide port each include a Ka signal waveguide port and two W-band waveguide ports; each of the Ka-band microwave transceiver circuits is communicatively connected to the second mixer and the Ka signal waveguide port respectively; each of the W-band microwave transceiver circuits includes a first 3dB waveguide electrobridge, a W-band bidirectional amplifier, a second 3dB waveguide electrobridge and a W-band waveguide port that are communicatively connected in sequence.

[0014] Optionally, the adjacent first cavity cover plate, first double-sided cavity plate, third cavity cover plate, second double-sided cavity plate and fourth cavity cover plate are all connected by screws.

[0015] The embodiment of the present application proposes a highly integrated dual-frequency composite three-dimensional interconnected transceiver component, in which a first-level power control circuit board is arranged in the first cavity, a W / Ka transceiver frequency conversion circuit is carried in the third cavity, and the first-level power control circuit board is communicatively connected with the W / Ka transceiver frequency conversion circuit through a radio frequency connector; the second cavity is equipped with a W / Ka receiving frequency conversion circuit, and the W / Ka receiving frequency conversion circuit has multiple external radio frequency interfaces and W / Ka signal waveguide ports, and the multiple external radio frequency interfaces pass through the first cavity and the first cavity cover plate to be interconnected with the outside, and the W / Ka signal waveguide port passes through the third cavity cover plate, the third cavity, and the fourth cavity. The cavity and the fourth cavity cover are connected to the external first antenna waveguide port; the third cavity is equipped with a W / Ka transceiver frequency conversion circuit, and the W / Ka transceiver frequency conversion circuit has a W / Ka signal waveguide port, and the W / Ka signal waveguide port passes through the fourth cavity and the fourth cavity cover and is connected to the external second antenna waveguide port. The present invention integrates the W / Ka frequency band and its frequency conversion circuit structure into the main body, realizes the three-dimensional interconnection integration of radio frequency circuits of different frequency bands in a smaller space, and can realize the full array combination of high and low frequency band signals to meet the future application requirements of multi-band, multi-channel, high-power and high-integration phased array radars. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the side view structure of a dual-frequency composite three-dimensional interconnected transceiver component;

[0017] Figure 2 A schematic diagram of the waveguide port arrangement at the front end of a dual-frequency composite three-dimensional interconnected transceiver component;

[0018] Figure 3 A schematic diagram of the connector arrangement at the rear end of a dual-frequency composite three-dimensional interconnect transceiver assembly;

[0019] Figure 4 A schematic diagram of a primary power control circuit board disposed in a first cavity;

[0020] Figure 5 A schematic diagram of arranging a radio frequency circuit in the second cavity;

[0021] Figure 6 A schematic diagram of a radio frequency circuit disposed in the third cavity;

[0022] Figure 7 A schematic diagram of a secondary power supply control circuit board disposed in the fourth cavity;

[0023] Figure 8 This is a schematic diagram of the three-dimensional interconnection layout of the circuits inside the dual-frequency composite three-dimensional interconnection transceiver component.

[0024] In the above drawings, the meanings of the marks are as follows: 1. the first cavity cover plate; 2. the first double-sided cavity plate; 3. the second cavity cover plate; 4. the second double-sided cavity plate; 5. the fourth cavity cover plate; 6. the Ka-band waveguide port; 7. the W-band waveguide port; 8. the external low-frequency socket; 9. the external SMP connector; 10. the internal low-frequency socket; 11. the primary power supply control circuit board; 12. the internal vertical transmission SMP connector; 13. the internal surface mount SMP connector; 14. the first frequency doubling multifunctional chip; 15. the local oscillator waveguide port; 16. the W-band frequency doubling mixing multifunctional chip; 17. the 3dB waveguide bridge; 18. the W-band bidirectional amplifier; 19. the secondary power supply control circuit board; 20. the internal low-frequency plug; 21. the SSMA to SMP connector. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0026] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0027] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0028] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0029] Reference Figure 1 The first embodiment of the highly integrated dual-frequency composite three-dimensional interconnected transceiver component of the present application provides a highly integrated dual-frequency composite three-dimensional interconnected transceiver component, and the highly integrated dual-frequency composite three-dimensional interconnected transceiver component includes: a first cavity cover plate 1, a first double-sided cavity plate 2, a third cavity cover plate 3, a second double-sided cavity plate 4 and a fourth cavity cover plate 5 stacked in sequence; the first double-sided cavity plate 2 has a first cavity and a second cavity back to back, and the second double-sided cavity plate has a third cavity and a fourth cavity back to back, the first cavity cover plate 1 is arranged on the surface of the first cavity, and the fourth cavity cover plate 5 is covered on the surface of the fourth cavity; a first-level power control circuit board 11 is arranged in the first cavity, and a W / Ka transceiver frequency conversion circuit is carried in the third cavity, and the first-level power control circuit board 11 is connected to the W / Ka transceiver frequency conversion circuit through a radio frequency connector; an external W / Ka intermediate frequency transmission signal is transmitted to the W / Ka transceiver frequency conversion circuit through the first-level power control circuit board 11 to excite the W / Ka transceiver frequency conversion circuit Excitation; the second cavity is equipped with a W / Ka receiving frequency conversion circuit, which has multiple external RF interfaces and a first W / Ka signal waveguide port, and the multiple external RF interfaces pass through the first cavity and the first cavity cover 1 to be interconnected with the outside, and the first W / Ka signal waveguide port passes through the third cavity cover 3, the fourth cavity, the fourth cavity and the fourth cavity cover 5 to be connected to the external first antenna waveguide port; the W / Ka receiving frequency conversion circuit is used to receive W / Ka signals, transmit Ka intermediate frequency signals, receive W / ka composite intermediate frequency signals and receive W intermediate frequency signals through the first W / Ka signal waveguide port and the external RF interface; the third cavity is equipped with a W / Ka transceiver frequency conversion circuit, which has a second W / Ka signal waveguide port, and the second W / Ka signal waveguide port passes through the fourth cavity and the fourth cavity cover 5 to be connected to the external second antenna waveguide port; the W / Ka transceiver frequency conversion circuit is used to up-convert the W / Ka intermediate frequency signal and the W / Ka radio frequency signal.

[0030] Specifically, the W / Ka dual-frequency composite three-dimensional interconnected transceiver component has five layers of cavities from bottom to top, namely the first cavity cover plate 1, the first double-sided cavity plate 2, the third cavity cover plate 3, the second double-sided cavity plate 4 and the fourth cavity cover plate 5. The first double-sided cavity plate 2 has a first cavity on one side, and the first cavity is equipped with a primary power supply control circuit board 11; the first double-sided cavity plate 2 has a second cavity on the other side, and the second cavity is equipped with a W / Ka receiving frequency conversion circuit. The second double-sided cavity plate 4 has a third cavity on one side and a fourth cavity on the other side, and the third cavity cover plate 3 is a partition wall. The third cavity is equipped with a W / Ka transceiver frequency conversion circuit. The primary power supply control circuit board 11 is connected to the W / Ka transceiver frequency conversion circuit through a radio frequency connector; the external W / ka intermediate frequency transmission signal is transmitted to the W / Ka transceiver frequency conversion circuit through the primary power supply control circuit board 11 to excite the W / Ka transceiver frequency conversion circuit; the second cavity is equipped with a W / Ka receiving frequency conversion circuit, and the W / Ka receiving frequency conversion circuit has multiple external radio frequency interfaces and a first W / Ka signal waveguide port, and the multiple external radio frequency interfaces pass through the first cavity and the first cavity cover 1 to interconnect with the outside, and the first W / Ka signal waveguide port passes through the third cavity cover 3, the third cavity, the fourth cavity and the fourth cavity cover 5 to connect with the external first antenna waveguide port. The W / Ka receiving frequency conversion circuit is used to receive W / Ka signals, transmit Ka intermediate frequency signals, receive W / ka composite intermediate frequency signals and receive W intermediate frequency signals through the first W / Ka signal waveguide port and the external radio frequency interface. The third cavity is equipped with a W / Ka transceiver frequency conversion circuit, which has a second W / Ka signal waveguide port, and the W / Ka signal waveguide port passes through the fourth cavity and the fourth cavity cover 5 and is connected to the external second antenna waveguide port. The W / Ka transceiver frequency conversion circuit is used to up-convert the W / Ka intermediate frequency signal and the W / Ka radio frequency signal.

[0031] In an embodiment of the present invention, a primary power control circuit board 11 is provided in the first cavity, and a secondary power control circuit board 19 is provided in the fourth cavity; the secondary power control circuit board 19 is internally plugged into the primary power control circuit board 11; wherein, external power and control signals are transmitted to the secondary power control circuit board 19 through the primary power control circuit board 11 to control the power supply of the secondary power control circuit board 19.

[0032] In an embodiment of the present invention, the primary power control circuit board 11 is communicatively connected to the internal low-frequency socket 10, the external low-frequency socket 8 and multiple SMP RF connectors 12, the secondary power control circuit board 19 is communicatively connected to the internal low-frequency plug 20, and the internal low-frequency plug 20 passes through the third cavity, the third cavity cover 3 in sequence and is plugged into the internal low-frequency socket 10; the external low-frequency socket 8 is communicatively connected to the W / Ka receiving frequency conversion circuit; at least one of the multiple SMP RF connectors 12 passes through the second cavity and the third cavity cover 3 through a KK connector and is communicatively connected to the internal surface-mounted SMP connector 13 in the third cavity; wherein the external low-frequency socket 8 is used to supply power and provide power supply control signals to the W / Ka receiving frequency conversion circuit and the primary power control circuit board 11; the internal low-frequency socket 10 is used to supply power and provide power supply control signals to the secondary power control circuit board 19; and the SMP RF connector 12 is used to provide an excitation signal to the W / Ka transceiver frequency conversion circuit.

[0033] In this embodiment, a primary power control circuit board 11 is provided in the first cavity to supply power to the radio frequency circuit in the second cavity. A secondary power control circuit board 19 is provided in the fourth cavity to supply power to the radio frequency circuit in the third cavity. The interconnection between the power control circuit and the radio frequency circuit can be achieved through a variety of schemes, which are not limited to the only one. Here, an optimization is made and one of the feasible options is given: the second cavity and the third cavity respectively have a powered insulator for supplying power to each active chip in the radio frequency circuit. When this scheme is adopted, the powered insulator is arranged near the power-on end of the corresponding radio frequency chip, fixed to the cavity by sintering connection, and respectively passes through the partition wall between the first double-sided cavity plate 2 and the second double-sided cavity plate 4, and is respectively connected to the primary power control circuit board and the secondary power control circuit board.

[0034] Furthermore, in order to facilitate the overall low-frequency signal processing, the present invention sets up an internal low-frequency control signal transmission structure, and its setting method is not unique. Here, it is optimized and one of the feasible options is given: a pair of internal low-frequency sockets 10 are installed on the primary power control circuit board 11, and another internal low-frequency plug 20 is installed on the secondary power control circuit board 19. They pass through the second cavity, the third cavity cover, and the third cavity, and are connected by plugging. When this solution is adopted, the external total power supply and control signal are transmitted to the secondary power control circuit board 19 through the primary power control circuit board 11, which is convenient for the overall power supply control of the transceiver component.

[0035] Furthermore, the primary power control circuit board 11 in the first cavity includes two low-frequency signal rectangular connector sockets and two SMP RF connectors. One of the sockets is an external low-frequency socket 8, which is connected to the external power supply and control signal, and provides power and control signals for the circuits in the first cavity and the second cavity; the other socket is an internal low-frequency socket 10, which is connected to the internal low-frequency plug 20 on the secondary power control circuit board 19 in the fourth cavity. The external power passes through the socket through the first cavity, the second cavity and the third cavity to the secondary power control circuit board 19 in the fourth cavity, and provides power and control signals for the circuit in the second double-sided cavity board 4; the two SMP RF connectors 12 are both internal connectors, which are vertically interconnected with the two internal surface-mounted SMP connectors 13 in the third cavity through the KK connector through the second cavity and the third cavity cover plate 3, and provide W / ka intermediate frequency transmission signal excitation for the circuit in the third cavity.

[0036] In an embodiment of the present invention, the W / Ka receiving frequency conversion circuit communicates and connects multiple external SMP connectors 9 and multiple internal surface-mounted SMP connectors 13 respectively; at least one of the multiple external SMP connectors 9 passes through the first cavity and the first cavity cover 1 to be plugged into the external RF connector; at least one of the multiple internal surface-mounted SMP connectors 13 passes through the third cavity cover 3 through a KK connector to be plugged into the RF interface of the W / Ka receiving frequency conversion circuit.

[0037] Exemplarily, the circuit in the second cavity has 7 external SMP connectors 9, two internal surface-mounted SMP connectors, a local oscillator signal transmitting waveguide port, two W signal receiving waveguide ports, and two Ka signal receiving waveguide ports. The 7 external SMP connectors 9 are external RF interfaces, which are vertically interconnected with the external RF connector after passing through the first cavity, and input one local oscillator signal, transmit one W intermediate frequency signal, transmit one Ka intermediate frequency signal, receive 3 W / ka composite intermediate frequency signals, and receive one W intermediate frequency signal through the 7 RF connectors. The two internal surface-mounted SMP connectors 13 are internal interfaces, which pass through the third cavity cover plate 3 through the KK connector and are vertically interconnected with the RF interface in the second cavity;

[0038] In an embodiment of the present invention, the second cavity is also equipped with a first local oscillator distribution circuit, which has a first common distribution link and multiple first distribution branches that are communicatively connected; the first common distribution link is communicatively connected to a single frequency doubling multifunctional chip 14; multiple first distribution branches are communicatively connected to a W / Ka receiving frequency conversion circuit and a local oscillator signal transmitting waveguide port, and the local oscillator signal transmitting waveguide port passes through the third cavity cover plate 3 and is communicatively connected to the local oscillator signal receiving waveguide port of the third cavity.

[0039] In an exemplary embodiment, the local oscillator distribution circuit includes a first local oscillator distribution circuit, which is responsible for providing local oscillator excitation for a total of ten transceiver channels in the W / Ka frequency band. The first local oscillator distribution circuit is provided with a first frequency multi-function chip 14 on its common distribution link, and each first distribution branch is also provided with a driving amplifier and an attenuator, and the local oscillator excitation of each channel can be adjusted by adjusting the attenuation of the attenuator. When this scheme is adopted, the local oscillator signal flows as follows: the local oscillator signal excitation enters the microstrip circuit in the second cavity through the external SMP connector 9, first passes through the first frequency multi-function chip 14, and is divided into two first frequency multiplication signals; then, one of the signals passes through the driving amplifier, attenuator, and power divider, and is distributed to one W / Ka receiving frequency conversion circuit. The other signal is divided into two paths through the power divider, one path is directly distributed to the W / Ka receiving frequency conversion circuit, and the other path is transmitted to the microstrip circuit in the third cavity through the local oscillator signal transmitting waveguide port; finally, the signal transmitted to the third cavity passes through the power divider, driver amplifier, and attenuator in sequence, and the local oscillator first frequency multiplication signal is distributed to each W / Ka receiving and transmitting frequency conversion circuit in the third cavity. The local oscillator signal transmitting waveguide port is an internal interface, which passes through the third cavity cover plate 3 and is interconnected with the local oscillator signal receiving waveguide port in the third cavity.

[0040] In an embodiment of the present invention, the W / Ka receiving frequency conversion circuit includes two W-band microwave receiving circuits and two Ka-band microwave receiving circuits, and the W / Ka signal waveguide port includes two W-band waveguide ports 7 and two Ka signal waveguide ports; the two W-band microwave receiving circuits are respectively communicated with the two W-band waveguide ports 7, respectively communicated with the two distribution branches, and respectively communicated with the two W-band frequency doubling and mixing multifunctional chips 16; the two Ka-band microwave receiving circuits are respectively communicated with the two Ka-band waveguide ports 6, respectively communicated with the two distribution branches, and respectively communicated with the two first mixers.

[0041] In an embodiment of the present invention, the W / Ka transceiver frequency conversion circuit has two communication-connected branches, each branch includes a Ka-band microwave transceiver circuit and two W-band microwave transceiver circuits; the W / Ka signal waveguide port includes a first sub-W / Ka signal waveguide port and a second sub-W / Ka signal waveguide port, and the first sub-W / Ka signal waveguide port and the second sub-W / Ka signal waveguide port each include a Ka signal waveguide port and two W-band waveguide ports 7; each Ka-band microwave transceiver circuit is respectively communication-connected to the second mixer and the Ka signal waveguide port; each W-band microwave transceiver circuit includes a first 3dB waveguide bridge 17, a W-band bidirectional amplifier 18, a second 3dB waveguide bridge and a W-band waveguide port 7 that are communication-connected in sequence.

[0042] In an embodiment of the present invention, the W / Ka transceiver frequency conversion circuit communicates and connects multiple internal surface-mounted SMP connectors 13 respectively; at least one of the multiple internal surface-mounted SMP connectors 13 passes through the third cavity cover 3 through a KK plug, and the second cavity is vertically interconnected with the SMP RF connector 12.

[0043] Exemplarily, the W-band transceiver circuit is a two-transmit and four-receive architecture, in which two transceiver circuits are arranged in the third cavity, and the other two receiving circuits are arranged in the second cavity. The W / Ka signal waveguide port is an external interface, which passes through the third cavity cover 3, the third and fourth cavities, and is interconnected with the external antenna waveguide port. The final stage of the W-band transmitting circuit is set as a W-band bidirectional amplifier 18, and a 3dB waveguide bridge 17 is used for power synthesis and distribution. In addition, each transceiver branch is also provided with a W-band frequency multiplication and mixing multifunctional chip 16, which can perform a second frequency multiplication on the first frequency multiplication signal of the local oscillator, and then perform up and down conversion on the intermediate frequency and radio frequency signals. When this scheme is adopted, the W-band signal flows as follows: when transmitting, first, the intermediate frequency excitation signal is input from the external SMP connector 9 in the second cavity, passes through the KK connector and the SMP RF socket 9 in the third cavity, and is vertically transmitted to the secondary power supply control circuit board 19 in the fourth cavity; then, in the fourth cavity, the intermediate frequency signal is divided into two intermediate frequency signals by the power divider, and passes through the phase shifter, the driver amplifier, and the RF glass insulator in turn, and is vertically transmitted to the two W-band transmission branches in the third cavity; then, in the third cavity, the intermediate frequency signal and the first-time frequency multiplication signal of the local oscillator are up-converted through the W-band frequency multiplication mixing multifunctional chip 16 to obtain the W-band excitation signal. After the excitation signal is divided into two paths by the first 3dB waveguide bridge 17, the signal is amplified by the W-band bidirectional amplifier, and then the power is synthesized by the second 3dB waveguide bridge 17; finally, the signal passes through the fourth cavity through the W-band waveguide port and is transmitted to the antenna. During reception, the receiving signal is input through the antenna and the W waveguide port. Among them, two receiving signals are in the third cavity, and are successively passed through the 3dB waveguide bridge 17, the W-band bidirectional amplifier 18, the 3dB waveguide bridge 17, and the W-band frequency doubling and mixing multifunctional chip 16, and are down-converted into intermediate frequency signals, and are vertically transmitted to the external SMP connector 9 in the second cavity through the internal surface-mounted SMP connector 13 and the KK connector for output; the other two receiving signals are directly transmitted to the second cavity through the W-band waveguide port 7, and are successively passed through the low-noise amplifier, the W-band frequency doubling and mixing multifunctional chip, the phase shifter, and the switch, and are output through the external SMP connector 9.

[0044] Furthermore, the present application optimizes and improves the Ka-band microwave transceiver circuit. The Ka-band transceiver circuit is a one-transmitter and three-receiver architecture, in which one transceiver circuit is arranged in the third cavity, and the other two receiving circuits are arranged in the second cavity. Each circuit is provided with a mixer to perform up and down conversion on the Ka-band signal. When this scheme is adopted, the Ka-band signal flows as follows: when transmitting, first, the intermediate frequency excitation signal is input by the external SMP connector 9 in the second cavity, and is vertically transmitted to the microstrip circuit in the third cavity through the KK connector; secondly, in the third cavity, the intermediate frequency signal is up-converted through the driver and the mixer to obtain the Ka-band excitation signal; finally, after two stages of power amplification, the signal passes through the circulator, passes through the Ka-band waveguide port 6, and passes through the fourth cavity to transmit the signal to the antenna. During reception, the received signal is input through the antenna and the Ka-band waveguide port 6, two of which are in the second cavity and the other in the third cavity. They pass through the low-noise amplifier, mixer, phase shifter, and switch in turn and are output through the external SMP connector 9.

[0045] In an embodiment of the present invention, the third cavity is equipped with a second local oscillator distribution circuit, and the second local oscillator distribution circuit has a second common distribution link and multiple second distribution branches that are communicatively connected; the second common distribution link is communicatively connected to the single frequency doubling multifunctional chip 14; multiple second distribution branches are communicatively connected to the W / Ka transceiver frequency conversion circuit and the local oscillator signal receiving waveguide port, and the local oscillator signal receiving waveguide port passes through the third cavity cover plate 3 and is communicatively connected to the local oscillator signal transmitting waveguide port.

[0046] In the embodiment of the present invention, the adjacent first cavity cover plate 1 , first double-sided cavity plate 2 , third cavity cover plate 3 , second double-sided cavity plate 4 and fourth cavity cover plate 5 are all connected by screws.

[0047] The above are only preferred embodiments of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A highly integrated dual-frequency composite three-dimensional interconnected transceiver component, characterized in that: include: A first cavity cover plate, a first double-sided cavity plate, a third cavity cover plate, a second double-sided cavity plate and a fourth cavity cover plate stacked in sequence; The first double-sided cavity plate has a first cavity and a second cavity back to back, the second double-sided cavity plate has a third cavity and a fourth cavity back to back, the first cavity cover plate is covered on the surface of the first cavity, and the fourth cavity cover plate is covered on the surface of the fourth cavity; A primary power control circuit board is provided in the first cavity, a W / Ka transceiver frequency conversion circuit is provided in the third cavity, and the primary power control circuit board is communicatively connected with the W / Ka transceiver frequency conversion circuit via a radio frequency connector; The external W / ka intermediate frequency transmission signal is transmitted to the W / Ka transceiver frequency conversion circuit through the primary power control circuit board to stimulate the W / Ka transceiver frequency conversion circuit; The second cavity is equipped with a W / Ka receiving frequency conversion circuit, and the W / Ka receiving frequency conversion circuit has multiple external RF interfaces and a first W / Ka signal waveguide port. The multiple external RF interfaces pass through the first cavity and the first cavity cover plate to be interconnected with the outside, and the first W / Ka signal waveguide port passes through the third cavity cover plate, the third cavity, the fourth cavity and the fourth cavity cover plate to be connected to the external first antenna waveguide port; The W / Ka receiving frequency conversion circuit is used to receive W / Ka signals, transmit Ka intermediate frequency signals, receive W / ka composite intermediate frequency signals and receive W intermediate frequency signals through the first W / Ka signal waveguide port and the external radio frequency interface; The W / Ka transceiver frequency conversion circuit has a second W / Ka signal waveguide port, and the second W / Ka signal waveguide port passes through the fourth cavity, the fourth cavity cover plate and is connected to the external second antenna waveguide port; The W / Ka transceiver frequency conversion circuit is used to perform up / down conversion on the W / Ka intermediate frequency signal and the W / Ka radio frequency signal.

2. The highly integrated dual-frequency composite three-dimensional interconnected transceiver assembly as claimed in claim 1, characterized in that: The fourth cavity is provided with a secondary power supply control circuit board; The secondary power supply control circuit board is internally plugged into the primary power supply control circuit board; The external power supply and control signal are transmitted to the secondary power control circuit board through the primary power control circuit board to control the power supply of the secondary power control circuit board.

3. The highly integrated dual-frequency composite three-dimensional interconnected transceiver assembly as claimed in claim 2, characterized in that: The primary power control circuit board is communicatively connected to the internal low-frequency socket, the external low-frequency socket and a plurality of SMP radio frequency connectors, the secondary power control circuit board is communicatively connected to the internal low-frequency plug, and the internal low-frequency plug sequentially passes through the third cavity, the third cavity cover plate and is plugged into the internal low-frequency socket; The external low-frequency socket is communicatively connected to the W / Ka receiving frequency conversion circuit; At least one of the plurality of SMP RF connectors is communicatively connected with the inner surface-mounted SMP connector in the third cavity through a KK connector passing through the second cavity and the third cavity cover plate; Wherein, the external low-frequency socket is used to supply power and provide power supply control signals to the W / Ka receiving frequency conversion circuit and the primary power supply control circuit board; The internal low-frequency socket is used to supply power to the secondary power control circuit board and provide a power supply control signal; The SMP radio frequency connector is used to provide an excitation signal to the W / Ka transceiver frequency conversion circuit.

4. The highly integrated dual-frequency composite three-dimensional interconnected transceiver assembly as claimed in claim 1, characterized in that: The W / Ka receiving frequency conversion circuit is respectively connected to multiple external SMP connectors and multiple internal surface mount SMP connectors for communication; At least one of the plurality of external SMP connectors passes through the first cavity and the first cavity cover plate and is plugged into an external RF connector; At least one of the plurality of inwardly mounted SMP connectors passes through the third cavity cover plate via a KK connector and is plugged into the radio frequency interface of the W / Ka receiving frequency conversion circuit.

5. The highly integrated dual-frequency composite three-dimensional interconnected transceiver assembly as claimed in claim 4, characterized in that: The second cavity is also equipped with a first local oscillator distribution circuit, which has a first common distribution link and a plurality of first distribution branches in communication connection; The first public distribution link is communicatively connected to a primary frequency multi-function chip; The plurality of first distribution branches are communicatively connected to the W / Ka receiving frequency conversion circuit and the local oscillator signal transmitting waveguide port, and the local oscillator signal transmitting waveguide port passes through the third cavity cover plate and is communicatively connected to the local oscillator signal receiving waveguide port of the third cavity.

6. The highly integrated dual-frequency composite three-dimensional interconnected transceiver assembly as claimed in claim 5, characterized in that: The W / Ka receiving frequency conversion circuit includes two W-band microwave receiving circuits and two Ka-band microwave receiving circuits, and the first W / Ka signal waveguide port includes two W-band waveguide ports and two Ka signal waveguide ports; The two W-band microwave receiving circuits are respectively connected to the two W-band waveguide ports for communication, respectively connected to the two distribution branches for communication, and respectively connected to the two W-band frequency doubling and mixing multifunctional chips for communication; The two Ka-band microwave receiving circuits are respectively connected to the two Ka signal waveguide ports for communication, respectively connected to the two distribution branches for communication, and respectively connected to the two first mixers for communication.

7. The highly integrated dual-frequency composite three-dimensional interconnected transceiver assembly as claimed in claim 4, characterized in that: The W / Ka transceiver frequency conversion circuit is respectively connected to the plurality of internal surface mount SMP connectors for communication; At least one of the plurality of inwardly mounted SMP connectors passes through the third cavity cover plate via a KK plug, and the second cavity is vertically interconnected with the SMP RF connector.

8. The highly integrated dual-frequency composite three-dimensional interconnected transceiver assembly as claimed in claim 5, characterized in that: The third cavity carries a second local oscillator distribution circuit, wherein the second local oscillator distribution circuit has a second common distribution link and a plurality of second distribution branches in communication connection; The second public distribution link is communicatively connected to the primary frequency multi-function chip; A plurality of second distribution branches are communicatively connected to the W / Ka transceiver frequency conversion circuit and the local oscillator signal receiving waveguide port, and the local oscillator signal receiving waveguide port passes through the third cavity cover plate and is communicatively connected to the local oscillator signal transmitting waveguide port.

9. The highly integrated dual-frequency composite three-dimensional interconnected transceiver assembly as claimed in claim 8, characterized in that: The W / Ka transceiver frequency conversion circuit has two communication-connected branches, each branch including one Ka-band microwave transceiver circuit and two W-band microwave transceiver circuits; The second W / Ka signal waveguide port includes a first sub-W / Ka signal waveguide port and a second sub-W / Ka signal waveguide port, and the first sub-W / Ka signal waveguide port and the second sub-W / Ka signal waveguide port each include a Ka signal waveguide port and two W-band waveguide ports; Each of the Ka-band microwave transceiver circuits is respectively communicatively connected to the second mixer and the Ka signal waveguide port; Each of the W-band microwave transceiver circuits comprises a first 3dB waveguide bridge, a W-band bidirectional amplifier, a second 3dB waveguide bridge and a W-band waveguide port which are communicatively connected in sequence.

10. The highly integrated dual-frequency composite three-dimensional interconnected transceiver assembly according to claim 1, characterized in that: The adjacent first cavity cover plate, the first double-sided cavity plate, the third cavity cover plate, the second double-sided cavity plate and the fourth cavity cover plate are all connected by screws.

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